CN103571274A - Printing ink with high adhesive force and excellent conductivity - Google Patents
Printing ink with high adhesive force and excellent conductivity Download PDFInfo
- Publication number
- CN103571274A CN103571274A CN201210253633.4A CN201210253633A CN103571274A CN 103571274 A CN103571274 A CN 103571274A CN 201210253633 A CN201210253633 A CN 201210253633A CN 103571274 A CN103571274 A CN 103571274A
- Authority
- CN
- China
- Prior art keywords
- resin
- ink
- strong adhesion
- good conductivity
- adhesion good
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title abstract description 8
- 239000000853 adhesive Substances 0.000 title abstract description 5
- 230000001070 adhesive effect Effects 0.000 title abstract description 5
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 20
- 230000008719 thickening Effects 0.000 claims description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000008096 xylene Substances 0.000 claims description 2
- 239000002562 thickening agent Substances 0.000 abstract description 2
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000002994 raw material Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009775 high-speed stirring Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001197 polyacetylene Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- -1 Acryl Chemical group 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention relates to a printing ink with high adhesive force and excellent conductivity. The printing ink comprises following ingredients, by weight, 30 to 55 parts of a base resin, 5 to 15 parts of a conductive resin, 0.5 to 2.0 parts of a promoter, 0.5 to 2.0 parts of a thickening agent, and 26 to 44 parts of an organic solvent. Compared with existing products, conductivity of the printing ink is excellent, and reliability is high.
Description
Technical field
The present invention relates to a kind of ink, especially relating to a kind of and metallic surface has high adhesive force, has electroconductibility, by being made into different shapes, forms the ink of various electronic circuits (components and parts) with metal parts.
Background technology
The development of electronic product is now maked rapid progress, function from strength to strength, and product is more and more less, more and more thinner, antenna is as one of important original paper of electronic product, the size of its performance and size is directly connected to the quality of electronic product, along with the miniaturization development built-in aerial of wireless communications products replaces external antenna gradually, become the main flow of Antenna Design.
For example, existing antenna for mobile phone is preparation by the following method conventionally: an utilizes flexible print wiring board (Flexible Printed Circuit Board) technique, be called for short FPCB or FPC, it is a kind of printed circuit board (PCB) with figure that utilizes flexible parent metal to make, by insulating substrate and conductive layer, formed, between insulating substrate and conductive layer, can there is binding agent, be pasted on the position that antenna need to be set.The 2nd .LDS (laser-direct-structuring) technique, is the product electroless copper again under the activation of laser machine that adopts special plastic particles injection moulding, after copper plating, then carries out nickel plating again.Three, double-shot moulding, is the fixedly pattern according to antenna, adopts bi-material: the material that can be plated and the material that can not be plated, by the laggard electroplating of dijection forming mould moulding, in the material that can be plated, by copper, plate and nickel plating formation antenna.The plastic cement material of general mobile phone is to use PC (Polycabonate), because PC material can not be by the reason of electroless plating, use can, by the ABS material of electroless plating according to the pattern of antenna, be carried out injection moulding, in ABS material, press the plating of antenna pattern copper and nickel plating, manufacture antenna.The 4th .PDS (Printing Direct Structuring) technique, is the ink that printing can be plated on the fixing pattern of antenna, by glue head pad printer, prints, and the part being printed is carried out copper plating and nickel plating again.The 5th .SPA (Silver Paste Antena) technique according to the pattern of antenna, is used conductive ink to pass through glue head pad printer and is printed on plastic casing surface, manufactures antenna.Yet electronic product is more and more thinner now, function is more and more, and the usually unfairness of place of antenna can be set, occupy a narrow space, be difficult to adopt three kinds of methods above, and existing typography exist antenna and metallic surface bonding insecure, drop to and on pcb board, cause the defects such as short circuit.
Summary of the invention
Object of the present invention is exactly in order to overcome the defect of above-mentioned prior art existence, to provide a kind of to have high adhesive force with metallic surface, there is electroconductibility, by being made into different shapes, form the ink of the strong adhesion good conductivity of various electronic circuits (components and parts) with metal parts.
Object of the present invention can be achieved through the following technical solutions: a kind of mobile phone printed antenna ink, it is characterized in that, and this ink comprises the component of following weight part content: basic resin 30～55; Conductivity resin 5～15; Promotor 0.5～2.0; Thickening material 0.5～2.0; Organic solvent 26～44.
Described ink comprises the component of following weight part content: basic resin 35～45; Conductivity resin 8～10; Promotor 1～1.5; Thickening material 1～1.5; Organic solvent 30～40.
Described basic resin comprises epoxy resin, acrylic resin or Synolac.
Described conductivity resin comprises polyaniline resin, polyacrylic resin or polypyrrole resin.
Described promotor is commercially available promotor, can select Hangzhou Jesse to block promotor that Chemical Co., Ltd. produces etc.
Described thickening material is commercially available thickening material, can select water-based thickener of Guangzhou Si Huote Chemical Co., Ltd. production etc.
Described organic solvent comprises aromatic hydrocarbon solvent, ether or ketone.
Described aromatic hydrocarbon solvent comprises benzene,toluene,xylene, propyl benzene or isopropyl benzene.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with in proportion raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grind and make fineness reach requirement.
Compared with prior art, ink adaptability of the present invention is good, can under different seasons, humidity, temperature condition, obtain more consistent printing effect, printing effect is also fairly good, strong adhesion, can be well bonding with metal or plastics, and have electroconductibility, can be made into difform conductive articles, as antenna etc.; Ink of the present invention is that a kind of and metallic surface have high adhesive force, has electroconductibility, by being made into different shapes, forms the ink of the strong adhesion good conductivity of various electronic circuits (components and parts) with metal parts.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
An ink for strong adhesion good conductivity, this ink comprises the component of following weight part content: basic resin epoxy resin (Epoxy resin) 30; Conductivity resin polyaniline resin (Polyaniline resin) 15; Promotor 0.5; Thickening material 0.5; Organic solvent-benzene 44.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Embodiment 2
An ink for strong adhesion good conductivity, this ink comprises the component of following weight part content: basic resin acrylic resin (Acryl resin) 55; Conductivity resin polyacrylic resin (Polyacetylene resin) 5; Promotor 2.0; Thickening material 2.0; Organic solvent toluene 26.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Embodiment 3
An ink for strong adhesion good conductivity, this ink comprises the component of following weight part content: basic resin Synolac (Alkyd resin) 35; Conductivity resin polyacrylic resin (Polyacetylene resin) 8; Promotor 1; Thickening material 1; Organic solvent ether 30.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Embodiment 4
An ink for strong adhesion good conductivity, this ink comprises the component of following weight part content: basic resin epoxy resin (Epoxy resin) 45; Conductivity resin polypyrrole resin (Polypyrrole resin) 10; Promotor 1.5; Thickening material 1.5; Organic solvent ketone 40.
Above-mentioned ink can make by conventional method.Can adopt following methods, be equipped with according to the above ratio raw material, then each raw material be mixed, after high-speed stirring is fully mixed, grinding makes fineness reach 15um and obtains below product.
Claims (8)
1. an ink for strong adhesion good conductivity, is characterized in that, this ink comprises the component of following weight part content: basic resin 30～55; Conductivity resin 5～15; Promotor 0.5～2.0; Thickening material 0.5～2.0; Organic solvent 26～44.
2. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described ink comprises the component of following weight part content: basic resin 35～45; Conductivity resin 8～10; Promotor 1～1.5; Thickening material 1～1.5; Organic solvent 30～40.
3. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described basic resin comprises epoxy resin, acrylic resin or Synolac.
4. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described conductivity resin comprises polyaniline resin, polyacrylic resin or polypyrrole resin.
5. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described promotor is commercially available promotor.
6. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described thickening material is commercially available thickening material.
7. the ink of a kind of strong adhesion good conductivity according to claim 1, is characterized in that, described organic solvent comprises aromatic hydrocarbon solvent, ether or ketone.
8. the ink of a kind of strong adhesion good conductivity according to claim 7, is characterized in that, described aromatic hydrocarbon solvent comprises benzene,toluene,xylene, propyl benzene or isopropyl benzene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210253633.4A CN103571274A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force and excellent conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210253633.4A CN103571274A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force and excellent conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103571274A true CN103571274A (en) | 2014-02-12 |
Family
ID=50044013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210253633.4A Pending CN103571274A (en) | 2012-07-20 | 2012-07-20 | Printing ink with high adhesive force and excellent conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103571274A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108047815A (en) * | 2018-01-26 | 2018-05-18 | 深圳市美丽华科技股份有限公司 | A kind of ink for screen printing and preparation method thereof |
| CN108148471A (en) * | 2016-12-05 | 2018-06-12 | 洛阳尖端技术研究院 | A kind of electrically conductive ink and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1778845A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Conductive printing ink from polyaniline |
| CN1778856A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101580659A (en) * | 2008-05-16 | 2009-11-18 | 拜尔材料科学股份公司 | Printable composition containing silver nanoparticles, method for producing conductive coatings using same and coatings produced thereby |
-
2012
- 2012-07-20 CN CN201210253633.4A patent/CN103571274A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1778845A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Conductive printing ink from polyaniline |
| CN1778856A (en) * | 2004-11-26 | 2006-05-31 | 吉林正基科技开发有限责任公司 | Polyaniline conducting adhesive |
| CN101511952A (en) * | 2006-08-07 | 2009-08-19 | 印可得株式会社 | Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same |
| CN101580659A (en) * | 2008-05-16 | 2009-11-18 | 拜尔材料科学股份公司 | Printable composition containing silver nanoparticles, method for producing conductive coatings using same and coatings produced thereby |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108148471A (en) * | 2016-12-05 | 2018-06-12 | 洛阳尖端技术研究院 | A kind of electrically conductive ink and preparation method thereof |
| CN108047815A (en) * | 2018-01-26 | 2018-05-18 | 深圳市美丽华科技股份有限公司 | A kind of ink for screen printing and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140212 |