CN103586985A - Brittle material processing method and system - Google Patents
Brittle material processing method and system Download PDFInfo
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- CN103586985A CN103586985A CN201210295955.5A CN201210295955A CN103586985A CN 103586985 A CN103586985 A CN 103586985A CN 201210295955 A CN201210295955 A CN 201210295955A CN 103586985 A CN103586985 A CN 103586985A
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Abstract
The invention provides a method and a system for processing a brittle material, which provides a substrate consisting of a brittle material, wherein a damage profile is formed on the surface or in the substrate, then the substrate with the damage profile is placed on a platform, then a jig with a convex part structure is used for enabling the convex part structure of the jig to be abutted against the surface of the substrate corresponding to the damage profile, and finally an impact tool impacts the jig to enable the brittle material corresponding to the damage profile to be separated from the substrate. The method and the system can save the time and the cost for processing the brittle material with a specific profile.
Description
Technical field
The present invention relates to a kind of processing method and system, refer in particular to a kind of fragile material processing method and system.
Background technology
Fragile material has been widely used in electronic industry field, no matter be at semi-conductor industry or 3C electronic product, can see the application of fragile material.
Generally speaking, the processing mode of fragile material can be divided into contact processing or contactless processing substantially.In the method for contact processing, general most is to utilize diamond or diamond cutter in brittle material surface, to depict depredation, and then applies strength and fracture along this vestige.Mode as for noncontact procession, can utilize and there is high-octane light beam, for example: laser, directly focus on the surface of fragile material, mode by high temperature is carried out upgrading processing (for example: fusing or vaporization) to fragile material, again by mobile beam, make path that light beam moves form the profile of processed finished products.
Although aforementioned, utilize diamond or diamond cutter to process fragile material, not for example, during the profile more complicated of excessive required converted products: during the profile that is combined to form by curve or curve and straight line, have the problem that is difficult to cutting.Therefore, utilize diamond or diamond cutter to add man-hour to fragile material, common is the indentation of straight line.
In addition, if adopt untouchable laser to add man-hour to fragile material, although can form the fragile material finished product with complicated shape, the long processing time that the mode of but processing due to laser upgrading needs, especially when material thickness increases, can increase process time, the invisible central efficiency that can have influence on production.Moreover, because Laser Processing is that mode by high temperature melting or vaporization forms processed goods, thus the quality at processed goods edge can because high temperature so be difficult to control, the size due to high-energy light beam also can have influence on the precision of processing in addition.
In prior art, for example TaiWan, China publication number is instructed a kind of method and device of work brittleness material for No. 201100191, it immerses fragile material in one liquid, then guide a radiation beam and through this liquid, along a predetermined machining path, impact the surface of this fragile material, with the surface at this fragile material, form at least trace at a moment, finally again this fragile material is applied to a horizontal force so that this fragile material is split along this indentation, wherein this horizontal force is parallel to the surface of this fragile material.So, this horizontal force is used for induced defect diffusion, and then reaches this fragile material of splitting.
Summary of the invention
The invention provides a kind of fragile material processing method and system, rely on and on brittle base material, form in advance the destruction profile of given configuration, and then the corresponding fragile material destroying in profile in the surface of impacting this base material, rely on the strength of impacting to make this destruction profile break to extend and produce the plane of disruption to substrate surface at the thickness direction of brittle base material, and then make the fragile material with this destruction profile depart from this brittle base material.
For achieving the above object, the technical solution used in the present invention is:
A processing method, is characterized in that, comprising:
The base material consisting of a fragile material is provided, and this substrate surface or inside are formed with a destruction profile;
The base material with this destruction profile is positioned on a platform;
One tool is provided, and it has a protuberance structure;
The protuberance structure of this tool is resisted against destroying on the substrate surface of profile; And
Make a percussion tool impact this tool so that the surface of this base material or this inner destruction profile extend to this substrate surface, and then make to depart from this base material to destroying the fragile material of profile.
This destruction profile is processed at this substrate surface or inside by a preprocessing device, and this preprocessing device is laser or cutter.
This base material has two surfaces of correspondence mutually, and this one of them surface forms this destruction profile or this two surfaces form this destruction profile simultaneously.
When one of them surface of this base material forms this destruction profile, this tool is resisted against on another surface without this destruction profile.
For achieving the above object, the technical solution used in the present invention also comprises:
A system of processing, is characterized in that, comprising:
One power source;
One platform, it provides to take advantage of and carries the base material consisting of a fragile material, and the surface of this base material or inside are formed with a destruction profile;
One tool, it has one first protuberance structure, and this first protuberance structure is resisted against destroying on the substrate surface of profile; And
One percussion tool, itself and this power source couples, to receive the power mobile that this power source produced, impact this tool so that the surface of this base material or inner this destructions profile, to this substrate surface extension, and then make to depart from this base material to destroying the fragile material of profile.
Also wrapped a preprocessing device, this preprocessing device is laser or cutter, to form this destruction profile at this substrate surface or inside.
This platform has a second protuberance structure or a recess structure to destroying on the position of profile.
The profile of this destruction profile is by curve, straight line or the aforementioned sealing profile that both constitute or nonocclusive profile.
This base material has two surfaces of correspondence mutually, and this one of them surface forms this destruction profile or this two surfaces form this destruction profile simultaneously.
When one of them surface of this base material forms this destruction profile, this tool is resisted against on another surface without this destruction profile.
This power source is Pneumatic pressure power source, and it provides malleation or negative pressure to control the movement of this percussion tool.
This percussion tool is the structure of column structure, sphere structure, oval ball or column and curved body combination, the contact-making surface that makes percussion tool impact this tool is curved surface or plane, and make that this percussion tool and this tool form that some contact, line contact or face contact.
Compared with prior art, the beneficial effect that the present invention has is: rely on fragile material processing mode of the present invention, owing to only needing to form destruction profile, no matter be therefore, with cutter or high-energy light beam, can produce and destroy profile with the extremely short time, moreover utilize impulsive force to allow the fragile material disengaging base material of destruction profile also can complete in the extremely short time, therefore processing mode of the present invention, can save process time.In addition,, because the present invention only forms and destroys profile on fragile material, therefore do not worry that high-energy light beam can, to material production continuous high temperature, cause the upgrading of material to destroy yet.In addition, the processed finished products that utilizes method and system of the present invention to produce, its plane of disruption smooth smooth, without burr and without cracked bits, therefore the invention provides a low cost, fast, stability is high and can produce the processing mode of high-quality fragile material processed goods.
Accompanying drawing explanation
Figure 1A is fragile material system of processing embodiment schematic diagram of the present invention;
Figure 1B forms this destruction profile schematic diagram;
Fig. 2 A to Fig. 2 C is the platform structure schematic diagram of supporting substrate in fragile material system of processing of the present invention;
Fig. 3 A to Fig. 3 D is the different embodiment schematic diagrames of destruction profile of the present invention;
Fig. 4 A to Fig. 4 F is that destruction profile of the present invention forms position view;
Fig. 4 G to Fig. 4 H is that inner formation of base material on surface with reinforced structure layer of the present invention destroyed profile embodiment schematic diagram;
Fig. 5 is another embodiment schematic diagram of protuberance structure of tool of the present invention;
Fig. 6 is the rear plane of disruption schematic diagram that substrate of brittle material of the present invention is hit.
Description of reference numerals: 2-fragile material system of processing; 20-platform; 200,201-the second protuberance structure; 202-recess; 203-groove; 21-tool; 210,210a-the first protuberance structure; 22-percussion tool; 23-power source; 24-guide element; 3-preprocessing device; 30-LASER Light Source; 31-set of lenses; 32-laser beam; 5-plummer; 9-base material; 90,91,92,93-destroys profile; 94-first surface; 95-second surface; The 96-plane of disruption; 97-reinforced structure layer.
The specific embodiment
Refer to shown in Figure 1A, this figure is fragile material system of processing embodiment schematic diagram of the present invention.This fragility system of processing 2 includes a platform 20, a tool 21, a percussion tool 22 and a power source 23.These platform 20 its base materials 9 that provide carrying to consist of a fragile material, the surface of this base material 9 or inside are formed with a destruction profile 90.This fragile material can be chosen as glass, pottery, crystalline material etc. but not as restriction.Wherein crystalline material can be jewel or silicon substrate.In addition, be noted that the surface of this base material more can have reinforced structure layer, for example: metal-coated membrane the or directly mode by material processed forms reinforced structure layer to reach wear-resisting scratch resistance and to be difficult for the texts that breaks by this substrate surface specific thicknesses.This reinforced structure layer can be formed on the single surface or corresponding two surfaces of this base material.The mode of this platform 20 these base materials of carrying can be as shown in Figure 1A for the structure of complete plane be carried this base material 9, or the structure as shown in Fig. 2 A to Fig. 2 C.Wherein, in Fig. 2 A, this platform 20 has and between the second protuberance structure 200 and 201, the second protuberance structures 200 and 201, has 202 pairs of recesses and should destroy profile 90.And in Fig. 2 B, this platform 20 with a groove 203 completely to destroying the position of profile 90.In Fig. 2 C, this platform 20 offers groove 204 on the position of correspondence destruction profile 90 again.
The mode that forms destruction profile 90 in surface or the inside of this base material 9 has a variety of, refers to shown in Figure 1B, and this figure is the embodiment schematic diagram that forms this destruction profile.In the embodiment of Figure 1B, this preprocessing device 3 is for can produce high-energy light beam laser processing device, and it includes a LASER Light Source 30 and a set of lenses 31.It is upper or inner that the high energy laser light beam 32 that this set of lenses 31 produces this LASER Light Source 30 focuses on base material 9 surface being arranged on plummer 5, and the mode by high temperature melting or vaporization forms destruction indentation.This preprocessing device 3 or plummer 5 can rely on the control of mobile device according to a predetermined stroke, move and then indentation is joined, and form destruction profile 90 that should predetermined stroke.In addition, this preprocessing device also can adopt diamond cutter or diamond cutter, processes to form this destruction profile on the surface of base material.
The profile that is noted that this destruction profile 90 is by curve, straight line or the aforementioned sealing that both constitute or nonocclusive profile.As shown in Figure 3A, the circular contour of formed destruction profile 90 for being formed by Curves on this base material 9, or the star profile 91 being formed by straight line shown in Fig. 3 B, even as shown in Figure 3 C by appearance profile 92 linear and that Curves forms.Although be noted that this destruction profile shown in Fig. 3 A to Fig. 3 C is for the profile of sealing, in another embodiment as shown in Figure 3 D, on this base material 9, formed destruction profile is nonocclusive profile 93.
Refer to shown in Fig. 4 A to Fig. 4 D, this figure is respectively the position view of curved profile.With the base material 9 shown in Fig. 3 A and the section that destroys profile 90, explain, in the embodiment of Fig. 4 A, this curved profile 90 is formed on the inside of this base material 9.In the present embodiment, be mainly by Laser Focusing different position on the thickness direction of base material 9 inside, base material is carried out to upgrading, make the material of the inner different depth of base material destroyed, and then be connected to and destroy profile 90.Be noted that, although in the present embodiment, in base material thickness direction, there are a plurality of different depth position to be subject to the processing of laser upgrading, but on actual enforcement, to determine according to demand in several different depth position processing, for example, in one embodiment, if base material thickness is thinner, that only has a depth location to be subject to upgrading processing is also to implement.
In addition, in the embodiment shown in Fig. 4 B, the position of this curved profile 90 is formed on a first surface 94 of this base material.In the present embodiment, can utilize high-energy light beam, for example: laser focuses on and carries out material destruction on this first surface 94, and form this destruction profile 90, also or utilize diamond cutter or diamond cutter directly on this first surface 94, to depict and destroy profile 90.Again as shown in Figure 4 C, the present embodiment, for Fig. 4 A is combined with the destruction outline position of Fig. 4 B, namely can destroy profile 90 surperficial and inner formation simultaneously.In another embodiment, as shown in Figure 4 D, this destroys profile 90 and can on the first surface 94 of this base material 9 and the second surface 95 corresponding with this first surface 94, form simultaneously and destroy profile 90 example.As for the mode forming, can use high-energy light beam equally, as: laser, or cutter is processed.In addition, again as shown in Figure 4 E, this figure has formation destruction profile 90 schematic diagrames on the base material 9 of reinforced structure layer 97.Wherein, this reinforced structure layer 97 can form through modifying process for the fragile material of base material itself, or additionally on substrate surface plated film form this reinforced structure layer 97.In addition, be noted that this destruction profile 90 in the present embodiment, be formed on the surface 94 without reinforced structure layer.In addition, the base material of Fig. 4 E, its this destruction profile 90 also can as shown in Figure 4 A, be formed on the aspect of these base material 90 inside.In addition,, as shown in Fig. 4 F, this figure is formed with on the base material 9 of reinforced structure layer 97 to form and destroy profile 90 schematic diagrames on upper and lower two surfaces.In the present embodiment, destroy that profile 90 is formed on this reinforced structure layer 97 and the degree of depth of destroying profile 90 through this reinforced structure layer 97 and and in the surface of this base material 9.In addition,, as shown in Fig. 4 G and Fig. 4 H, in another embodiment, for a surface, there is the base material 9 that reinforced structure layer 97 or upper and lower two surfaces have reinforced structure layer 97 and also can utilize laser to destroy profiles 90 inner formation of base material 9.
Return shown in Figure 1A, the tool 21 of this fragile material system of processing, it has one first protuberance structure 210, and this first protuberance structure 210 is resisted against destroying on base material 9 surfaces of profile 90.So-called correspondence can be destroyed on profile for being in direct contact with herein, or as Figure 1A be example, though contact, but the first protuberance structure 210 is mutual corresponding with the position of this destruction profile 90.In one embodiment, this first protuberance structure 210 has the profile the same with this destruction profile 90, but not as restriction, for example: this first protuberance structure 210 can be also discontinuous structure.As shown in Figure 5, with the destruction profile of corresponding diagram 2A, the first protuberance structure 210 can be also that the protuberance structure 210a of discontinuity forms.
Return shown in Figure 1A, top and this power source 23 that this percussion tool 22 is arranged on this tool 21 couple, to receive the power that this power source 23 produced and to produce displacement movement, impact this tool 21, make the alligatoring of this base material 9 or this inner destruction profile 90 extend and break to the surface of this base material 9, and then make to depart from this base material to destroying the fragile material of profile 90.In one embodiment, impact the direction that the direction of this tool 21 is vertical these base material 9 surfaces.And this percussion tool 22 can rely on guide element 24, for example: guide rail or cylinder body are guided this direction that percussion tool 22 moves.This power source 23 can be chosen as Pneumatic pressure power source to produce the power source of malleation (gas is provided) or negative pressure (vacuum).In the embodiment of pneumatic power source, this percussion tool 22 can be slidedly arranged on a pneumatic cylinder or guide rail, and the high speed providing by pneumatic power source and the atmospheric pressure of high pressure make this percussion tool 22 on the surface perpendicular to this base material 9, produce impulsive force at a high speed to impact this tool and produce negative pressure by power source percussion tool 22 is sucked back to original position.This percussion tool 22 can be the structure of column structure, sphere structure, oval ball or column and curved body combination, the contact-making surface that makes percussion tool 22 impact these tools is curved surface or plane, and makes this percussion tool 22 and this tool 21 form that some contact, line contacts or face contacts.In addition, although be noted that Figure 1A and the specific embodiment shown in Figure 1B are two separated devices, in another embodiment, also can be integrated into single system of processing by the device shown in its Figure 1A and Figure 1B.
Refer to shown in Figure 1A and Figure 1B, next fragile material processing method flow process of the present invention is described.Can as shown in Figure 1B, first in preprocessing mode, on base material 9 surfaces that formed by fragile material or inner formation, destroy profile 90 at the beginning.Form to destroy the aspect that the profile of profile can be as shown in Fig. 3 A to Fig. 3 D, form the aspect that the position of destroying profile can be as shown in Fig. 4 A to Fig. 4 D.Then, again by have destroy profile 90 base material as on platform 20, be noted that if this destruction profile 90 is to be formed on the single surface of base material 9 as shown in Figure 1A, the protuberance structure 210 of this tool 21 is that the second surface 95 that does not have this destruction profile 90 with this base material 9 contacts.And structure on this platform 20 and this pass of destroying profile can be as shown in Figure 1A or 2A to Fig. 2 C.Then, then provide power to this percussion tool 22 by power source 23, make this percussion tool 22 carry out displacement movement and direct impact on this tool 21.The vibrational energy that impact produces on tool 21 passes to this base material 9 via the first protuberance structure 210 of this tool 21.As shown in Figure 6, owing to thering is the profile 90 of destruction on this base material 9, therefore after base material is subject to vibrational energy, meeting is extended diffusion by the destruction profile 90 on first surface 94 to this second surface 95, produces the plane of disruption 96 and then allow the fragile material that destroy in profile 90 is departed to this base material 9.
Rely on fragile material processing mode of the present invention, owing to only needing to form destruction profile, no matter be therefore, with cutter or high-energy light beam, can produce and destroy profile with the extremely short time, moreover utilize impulsive force to allow the fragile material disengaging base material of destruction profile also can complete in the extremely short time, therefore processing mode of the present invention, can save process time.In addition,, because the present invention only forms and destroys profile on fragile material, therefore do not worry that high-energy light beam can, to material production continuous high temperature, cause the upgrading of material to destroy yet.In addition, the processed finished products that utilizes method and system of the present invention to produce, its plane of disruption smooth smooth, without burr and without cracked bits, therefore the invention provides a low cost, fast, stability is high and can produce the processing mode of high-quality fragile material processed goods.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, in the situation that do not depart from the spirit and scope that claim limits; can make many modifications, variation or equivalence, but within all will falling into protection scope of the present invention.
Claims (12)
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| CN201210295955.5A CN103586985A (en) | 2012-08-17 | 2012-08-17 | Brittle material processing method and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105643819A (en) * | 2016-03-18 | 2016-06-08 | 武汉华工激光工程有限责任公司 | Sapphire wafer cracking device and method based on laser scribing process |
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Application publication date: 20140219 |