CN103592785B - A kind of COG binding method and Temperature-controlled appliance - Google Patents
A kind of COG binding method and Temperature-controlled appliance Download PDFInfo
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- CN103592785B CN103592785B CN201210287712.7A CN201210287712A CN103592785B CN 103592785 B CN103592785 B CN 103592785B CN 201210287712 A CN201210287712 A CN 201210287712A CN 103592785 B CN103592785 B CN 103592785B
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- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000011521 glass Substances 0.000 claims abstract description 120
- 230000008569 process Effects 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000035484 reaction time Effects 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 6
- 230000008602 contraction Effects 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000011218 segmentation Effects 0.000 abstract 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 238000004049 embossing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Joining Of Glass To Other Materials (AREA)
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Abstract
Disclosure one COG binding method, including: clean on polarizer sheet sticking to described face glass after face glass, and ACF is fixed on described face glass；Carry out COG and bind the precompressed process of technique, IC is fixed on described ACF；Carry out COG and bind this pressure of segmentation process of technique, described IC and described face glass are fully cured；The present invention also provides for a kind of Temperature-controlled appliance.Technical scheme utilizes this compression technology of segmentation to complete COG and binds technical process, IC and face glass can be made to have identical swell increment, and then avoid bad problem.
Description
Technical Field
The invention relates to a manufacturing process of a liquid crystal display device, in particular to a Chip On Glass (COG) binding method and temperature control equipment.
Background
Fig. 1 is a schematic cross-sectional view of a liquid crystal display panel in the prior art, and as shown in fig. 1, the liquid crystal display panel mainly includes a glass panel 10, a PCB (printed circuit board) 11, an IC (integrated circuit) 12, etc., the glass panel 10 and the IC12 are connected by an ACF (anisotropic conductive film) 13, generally using a COG binding (binding) method, and the PCB11 and the glass panel 10 are connected by an FPC (flexible printed circuit) 14.
With the demands of the user on the quality of the product, the designer's fastidious requirements on the edge area of the glass panel 10, and the control of the cost by the manufacturer, the IC12 is moving toward multi-pin count and narrow-to-long, and the thickness of the glass panel 10 is also reduced from 0.7mm to 0.5mm or 0.3 mm. The traditional COG binding process mainly comprises the following steps: the glass panel 10 is cleaned, the polarizer is attached, the ACF13 is attached, the COG is pre-pressed, the COG is originally pressed, the FPC14 is attached, the PCB11 is attached and the like. Wherein, what play the main effect is COG originally presses, and COG originally presses the effect does: the particles in the ACF13 are pressed between the electrodes of the IC12 and the glass panel 10 while the ACF13 is cured, connecting the IC12 and the glass panel 10 together.
Due to the different expansion coefficients of the IC12 and the glass panel 10, the edge glass of the glass panel 10 may be bent (warped) during the COG bonding process; internal stresses may be present within IC12 after the bonding is complete, a problem that is generally undetectable during early product life. With the progress of time, problems such as cracking of IC12, breakage of IC12, corrosion of metal wires, display abnormality, and the like are easily caused due to the presence of stress, and at this time, the liquid crystal display device is already located at a customer, causing a serious quality problem, thereby affecting company reputation. Meanwhile, the glass panel 10 is bent to deform, which causes the change of the internal orientation of the liquid crystal, resulting in the uneven brightness (Mura), which causes poor image quality and reduces the product quality. If various defects due to such difference in expansion coefficient are eliminated, the expansion amounts of the IC12 and the glass panel 10 must be adjusted to be the same.
Generally, the expansion amount Δ L of IC12IC＝αIC*(TIC-T2)*LICThe amount of expansion Δ L of the glass panel 10glass＝αglass*(Tglass-T4)*LglassWherein αIC、αglassThe expansion coefficients of IC12 and glass panel 10, respectively; Δ LIC、ΔLglassRespectively, the deformation amounts, L, of the IC12 and the glass panel 10IC、LglassInitial lengths of IC12 and glass panel 10, respectively; t isICTemperature, T, of IC12 contact surface for COG binding of IC122Initial temperature, T, of IC12 at the beginning of COG bindingglassIs the temperature, T, of the contact surface of the glass panel 104Is the initial temperature of the glass panel 10, wherein αICTypically 3 ppm/deg.C, αglassTypically 4 ppm/deg.C.
From the data, the coefficient of expansion of the glass panel 10 is much greater than that of the IC 12. According to an approximation principle, T2＝T4Production line temperature (T30 ℃), LIC＝LglassIC length (L); here, to eliminate the shading unevenness in COG, Δ L is requiredIC＝ΔLglassI.e. αIC*(TIC-T2)*LIC＝αglass*(Tglass-T4)*LglassThereby obtaining TIC＝4/3*Tglass10, the coefficients may differ slightly depending on the IC12 and the glass panel 10. Due to TICDependent on the head temperature, TglassDepending on the temperature of the base, and the presence of the polarizer on the glass panel 10, therefore, the temperature of the base is generally set at 100 degrees and cannot exceed 110 degrees if T is setglass100 degrees, in order to obtain the same amount of expansion, according to the formula TIC＝4/3*Tglass-10，TIC123 degrees. False messenger Tglass110 degrees, in order to obtain the same amount of expansion, according to TIC＝4/3*Tglass-10，TIC137 degrees.According to the prior art, the curing temperature of the ACF13 located between the IC12 and the glass panel 10 is generally around 200 degrees, and therefore, the development of the low temperature ACF13 is required, while the temperature of the newly developed low temperature ACF13 is also around 150 degrees, and therefore, there is a contradiction in temperature, and the same amount of expansion cannot be obtained.
Disclosure of Invention
In view of the above, the present invention is directed to a COG bonding method and a temperature control device, which can make an IC and a glass panel have the same expansion amount, thereby avoiding the problem of failure.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a COG binding method comprises the following steps: attaching a polarizer to the glass panel, and fixing the ACF on the glass panel; pre-pressing the COG binding process, and fixing the IC on the ACF; and carrying out sectional local pressure treatment of the COG binding process to completely solidify the IC and the glass panel.
Further, the fixing the ACF on the glass panel is: and cleaning the processed pre-bonding area on the glass panel by using an organic solvent, and fixing the ACF on the pre-bonding area on the glass panel by using equipment.
Further, the fixing the IC on the ACF is: and aligning the IC with the glass panel, and fixing the IC on the ACF by certain pressure after aligning.
Further, the step of performing a segment laminating process of the COG bonding process completely cures the IC and the glass panel into: and carrying out sectional local pressure treatment of the COG binding process, heating a pressure head by using temperature control equipment, and carrying out high-temperature local pressure, low-temperature local pressure and high-temperature local pressure treatment on the glass panel, the ACF and the IC by the pressure head with a certain temperature after heating to finish the whole local pressure treatment process and realize the complete solidification of the IC and the glass panel.
Further, the processing of the glass panel, the ACF, and the IC by the high-temperature main pressing, the low-temperature main pressing, and the high-temperature main pressing includes: the first stage is the reaction time of the ACF, the temperature of the pressure head is 160-180 ℃ of the reaction temperature of the ACF, and the duration is 1-2 s; the second stage is a contraction stage of the glass panel and the IC, the temperature of the pressure head is 110-140 ℃, and the duration is 2-3 s; the third stage is the strengthening stage of the glass panel and the IC, the temperature of the pressure head is 140-160 ℃, and the duration is 1-3 s.
Further, the processing of the glass panel, the ACF, and the IC by the high-temperature main pressing, the low-temperature main pressing, and the high-temperature main pressing includes: the first stage is the reaction time of the ACF, the temperature of the pressure head is 160-180 ℃ of the reaction temperature of the ACF, and the duration is 1-2 s; the second stage is a contraction stage of the glass panel and the IC, the temperature of the pressure head is 130-140 ℃, and the duration is 1-2 s; the third stage is a shrinkage stage of the glass panel and the IC, the temperature of the pressure head is 110-130 ℃, and the duration is 1-2 s; the fourth stage is the strengthening stage of the glass panel and the IC, the temperature of the pressure head is 140-160 ℃, and the duration is 1-2 s.
The invention also provides a temperature control device, which comprises a thermal sensor and a computer loaded with control software; wherein, the computer loaded with control software is used for controlling the temperature of the thermal sensor; and the thermal sensor is used for heating the pressure head, so that the pressure head with a certain temperature after heating carries out segmented local pressure treatment on the glass panel, the ACF and the IC.
The COG binding method and the temperature control equipment provided by the invention have the advantages that the glass panel is cleaned firstly, the polarizer is attached to the glass panel, and the ACF is fixed on the glass panel; pre-pressing the COG binding process, and fixing the IC on the ACF; and then, carrying out sectional local pressure treatment of the COG binding process, and completely curing the IC and the glass panel, so that the COG binding process can be completed by utilizing the sectional local pressure process, and the IC and the glass panel have the same expansion amount, thereby eliminating the internal stress of the IC, reducing the poor problems of IC cracking, IC damage, metal wire corrosion, abnormal display and the like, further improving the quality of products, and bringing good user experience.
Drawings
FIG. 1 is a schematic cross-sectional view of a prior art liquid crystal display panel;
FIG. 2 is a flowchart illustrating a method for implementing COG binding according to the present invention;
FIG. 3 is a schematic of the COG bulk process of the present invention;
FIG. 4 is a schematic diagram of a first embodiment of a segment of the COG bonding process of the present invention;
fig. 5 is a schematic diagram of a second embodiment of the segment local pressure process of the COG bonding process of the present invention.
Description of reference numerals:
10: glass panel 11: PCB (printed circuit board)
12：IC13：ACF
14: FPC 15: temperature control device
16: pressure head
Detailed Description
The basic idea of the invention is: after cleaning the glass panel, attaching the polarizer to the glass panel, and fixing the ACF on the glass panel; pre-pressing the COG binding process, and fixing the IC on the ACF; and carrying out sectional local pressure treatment of the COG binding process to completely solidify the IC and the glass panel.
The invention is further described in detail below with reference to the drawings and the specific embodiments.
The invention provides a COG binding method, and fig. 2 is a flow diagram illustrating the COG binding method implemented by the invention, as shown in fig. 2, the method comprises the following steps:
step 201, after cleaning a glass panel, attaching a polarizer to the glass panel, and fixing an ACF on the glass panel;
specifically, the glass panel 10 is first cleaned to remove foreign matters on the surface of the glass panel 10; the foreign matters comprise organic matters and inorganic matters, and the inorganic matters can be cleaned by a physical cleaning mode and the organic matters can be cleaned by a chemical cleaning mode;
then, drying the cleaned glass panel 10 by using a dryer, and attaching a polarizer to the glass panel 10; then, the pre-bonding area on the glass panel 10 after the above treatment is cleaned by using an organic solvent, and the ACF13 is fixed on the pre-bonding area on the glass panel 10 by using a device, and then the COG bonding process is performed.
Step 202, performing pre-pressing treatment of a COG binding process, and fixing the IC on the ACF;
specifically, after the ACF13 is fixed in the pre-bonding area of the glass panel 10, pre-pressing processing of the COG bonding process is performed, the IC12 and the glass panel 10 are aligned, and after the alignment, the IC12 is fixed on the ACF13 by a certain pressure, so that the alignment is performed, and then the pre-pressing processing of the COG bonding process can be performed.
Step 203, carrying out sectional local pressure treatment of the COG binding process, and completely curing the IC and the glass panel;
specifically, the segmented pressure treatment of the COG bonding process is performed, as shown in fig. 3, the pressure head 16 is heated by the temperature control device 15, and the pressure head 16 having a certain temperature after heating performs high-temperature pressure treatment, low-temperature pressure treatment and high-temperature pressure treatment on the glass panel 10, the ACF13 and the IC12 formed in step 202, so that the whole pressure treatment process is completed, and the complete curing of the IC12 and the glass panel 10 is realized;
depending on the expansion coefficient of the IC12 and the expansion coefficient of the glass panel 10, the temperature of the indenter 16 and the duration of the entire embossing process are different when the high-temperature embossing, the low-temperature embossing, and the high-temperature embossing processes are performed.
The following description will be made by taking as an example an expansion coefficient of 3 for IC12 and an expansion coefficient of 4 for glass panel 10: in the high-temperature and low-temperature partial pressure treatment and the high-temperature partial pressure treatment, the low-temperature partial pressure can be further divided into two low-temperature partial pressure treatment stages, so that the whole segmented partial pressure treatment can be three stages or four stages; if there are three stages, as shown in fig. 3 and 4, the horizontal axis in fig. 4 represents time in units of s, the vertical axis represents temperature in units of ℃ (centigrade), the first stage is the reaction time of the ACF, the temperature of the indenter 16 is controlled at the reaction temperature of the ACF13, which is about 160 ℃ to 180 ℃, and the duration is 1s to 2s, and this stage is due to the short time, the ACF13 has been reflected, but the reaction is not complete; the second stage is the shrinking stage of the glass panel 10 and IC12, as shown in fig. 3 and 4, the temperature of the press head 16 is controlled at 110-140 ℃ for 2-3 s, and since the ACF13 is not completely cured, the IC12 and the glass panel 10 shrink back to their original dimensions, and the ACF13 continues to react; the third stage is a strengthening stage of the glass panel 10 and the IC12, as shown in fig. 3 and 4, the temperature of the press head 16 is controlled at 140-160 ℃ for a duration of 1S-3S; after the three stages are completed, the IC12 and the glass panel 10 are fully cured;
if there are four stages, as shown in FIGS. 3 and 5, the horizontal axis in FIG. 5 represents time in units of s, the vertical axis represents temperature in units of C, the first stage is the reaction time of ACF, the temperature of the indenter 16 is controlled at the reaction temperature of ACF13, about 160-180℃, for a duration of 1-2 s, and this stage is due to the short time, although the reaction of ACF13 is complete; the second stage is the shrinking stage of the glass panel 10 and the IC12, as shown in fig. 3 and 5, the temperature of the indenter 16 is controlled at 130 ℃ to 140 ℃ for a duration of 1s to 2 s; the third stage is also the shrinking stage of the glass panel 10 and the IC12, as shown in fig. 3 and 5, the temperature of the press head 16 is controlled at 110-130 ℃ for 1-2 s, and in the second and third stages, since the ACF13 is not completely cured, the IC12 and the glass panel 10 shrink back to the original size, and the ACF13 continues to react; the fourth stage is a strengthening stage of the glass panel 10 and the IC12, as shown in fig. 3 and 5, the temperature of the press head 16 is controlled at 140 ℃ to 160 ℃ for a duration of 1S to 2S; after the four stages are completed, the IC12 and the glass panel 10 are fully cured;
the segmented coining process of the COG binding process may be performed by heating the ram 16 using a temperature control device 15, the temperature control device 15 may include a thermal sensor and a computer loaded with control software, the temperature of the thermal sensor being controlled by the computer loaded with control software, the thermal sensor heating the ram 16 so that the ram 16 has a temperature, the ram 16 ultimately passing the temperature to the IC 12.
The invention also provides a temperature control device, which comprises a thermal sensor and a computer loaded with control software; wherein,
a computer loaded with control software for controlling the temperature of the thermal sensor;
and the thermal sensor is used for heating the pressure head, so that the pressure head with a certain temperature after heating carries out segmented local pressure treatment on the glass panel, the ACF and the IC.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents, improvements, etc. that are within the spirit and principle of the present invention should be included in the present invention.
Claims (6)
1. A COG binding method is characterized by comprising the following steps:
attaching a polarizer to a glass panel, and fixing an ACF on the glass panel;
pre-pressing the COG binding process, and fixing the IC on the ACF;
performing sectional local pressure treatment of a COG binding process, and completely curing the IC and the glass panel;
wherein, the segmented local pressure treatment of the COG binding process is carried out, and the IC and the glass panel are completely solidified into: and carrying out sectional local pressure treatment of the COG binding process, heating a pressure head by using temperature control equipment, and carrying out high-temperature local pressure, low-temperature local pressure and high-temperature local pressure treatment on the glass panel, the ACF and the IC by the pressure head with a certain temperature after heating to finish the whole local pressure treatment process and realize the complete solidification of the IC and the glass panel.
2. The method of claim 1, wherein said securing the ACF on the glass panel is:
and cleaning the processed pre-bonding area on the glass panel by using an organic solvent, and fixing the ACF on the pre-bonding area on the glass panel by using equipment.
3. The method of claim 1, wherein said securing the IC on the ACF is:
and aligning the IC with the glass panel, and fixing the IC on the ACF by certain pressure after aligning.
4. The method according to claim 1, wherein the high temperature main press, low temperature main press and high temperature main press processing of the glass panel, ACF and IC are:
the first stage is the reaction time of the ACF, the temperature of the pressure head is 160-180 ℃ of the reaction temperature of the ACF, and the duration is 1-2 s;
the second stage is a contraction stage of the glass panel and the IC, the temperature of the pressure head is 110-140 ℃, and the duration is 2-3 s;
the third stage is the strengthening stage of the glass panel and the IC, the temperature of the pressure head is 140-160 ℃, and the duration is 1-3 s.
5. The method according to claim 1, wherein the high temperature main press, low temperature main press and high temperature main press processing of the glass panel, ACF and IC are:
the first stage is the reaction time of the ACF, the temperature of the pressure head is 160-180 ℃ of the reaction temperature of the ACF, and the duration is 1-2 s;
the second stage is a contraction stage of the glass panel and the IC, the temperature of the pressure head is 130-140 ℃, and the duration is 1-2 s;
the third stage is a shrinkage stage of the glass panel and the IC, the temperature of the pressure head is 110-130 ℃, and the duration is 1-2 s;
the fourth stage is the strengthening stage of the glass panel and the IC, the temperature of the pressure head is 140-160 ℃, and the duration is 1-2 s.
6. A temperature control device for COF binding, characterized in that the temperature control device comprises a thermal sensor and a computer loaded with control software; wherein,
a computer loaded with control software for controlling the temperature of the thermal sensor;
the thermal sensor is used for heating the pressure head, so that the pressure head with a certain temperature after heating carries out sectional local pressure treatment on the glass panel, the ACF and the IC;
wherein, the step of carrying out the subsection local pressure treatment comprises the following steps: and carrying out sectional local pressure treatment of the COG binding process, heating a pressure head by using temperature control equipment, and carrying out high-temperature local pressure, low-temperature local pressure and high-temperature local pressure treatment on the glass panel, the ACF and the IC by the pressure head with a certain temperature after heating to finish the whole local pressure treatment process and realize the complete solidification of the IC and the glass panel.
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| CN201210287712.7A CN103592785B (en) | 2012-08-13 | 2012-08-13 | A kind of COG binding method and Temperature-controlled appliance |
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| CN201210287712.7A CN103592785B (en) | 2012-08-13 | 2012-08-13 | A kind of COG binding method and Temperature-controlled appliance |
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| CN103592785B true CN103592785B (en) | 2016-07-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104051675B (en) * | 2014-06-06 | 2016-04-13 | 昆山工研院新型平板显示技术中心有限公司 | Display device and nation thereof determine method |
| US10405436B2 (en) * | 2015-12-11 | 2019-09-03 | Shenzhen Royole Technologies Co., Ltd. | Flexible display module bonding method |
| EP3388888A4 (en) * | 2015-12-11 | 2019-07-03 | Shenzhen Royole Technologies Co., Ltd. | METHOD FOR FASTENING FLEXIBLE DISPLAY MODULE |
| CN106019657B (en) * | 2016-07-27 | 2018-12-25 | 京东方科技集团股份有限公司 | A kind of binding method and binding device |
| CN107464522B (en) * | 2017-08-01 | 2019-08-13 | 武汉华星光电半导体显示技术有限公司 | A kind of display module and display device |
| CN107479228B (en) * | 2017-09-11 | 2020-08-25 | 京东方科技集团股份有限公司 | Display module and preparation method thereof |
| CN108363225A (en) * | 2018-02-26 | 2018-08-03 | 深圳市比亚迪电子部品件有限公司 | A kind of LCD method for sticking and covering based on COG techniques |
| KR102608963B1 (en) * | 2019-03-19 | 2023-12-05 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
| CN110806649A (en) * | 2019-10-25 | 2020-02-18 | 江西力昌电子科技有限公司 | Cleaning process for IC position of liquid crystal module |
| CN111025693B (en) * | 2019-11-25 | 2022-05-10 | 深圳鼎晶科技有限公司 | COF integrated circuit packaging cleaning line body |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003121815A (en) * | 2001-10-16 | 2003-04-23 | Nec Access Technica Ltd | Lcd holding structure |
| JP2006171530A (en) * | 2004-12-17 | 2006-06-29 | Nec Access Technica Ltd | Liquid crystal display device and mobile communication equipment |
| CN201293887Y (en) * | 2008-10-31 | 2009-08-19 | 深圳市福和达电子设备有限公司 | Linear stepping motor drive type IC prepress for COG binding machine |
| CN201298121Y (en) * | 2008-10-31 | 2009-08-26 | 厦门赛特勒电子有限公司 | LCD module with improved drive chip package structure |
| JP2010192834A (en) * | 2009-02-20 | 2010-09-02 | Hitachi High-Technologies Corp | Acf thermocompression bonding apparatus |
| CN201514570U (en) * | 2009-05-06 | 2010-06-23 | 长春光华微电子设备工程中心有限公司 | Fully automatic control system of COG liquid crystal chip crimping machine |
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