CN103602947A - Method for plating copper on flexible substrate - Google Patents
Method for plating copper on flexible substrate Download PDFInfo
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- CN103602947A CN103602947A CN201310553813.9A CN201310553813A CN103602947A CN 103602947 A CN103602947 A CN 103602947A CN 201310553813 A CN201310553813 A CN 201310553813A CN 103602947 A CN103602947 A CN 103602947A
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- CN
- China
- Prior art keywords
- flexible substrate
- copper
- cleaning
- copper plate
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 81
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 62
- 239000010949 copper Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 title claims abstract description 15
- 239000002082 metal nanoparticle Substances 0.000 claims abstract description 9
- 238000007788 roughening Methods 0.000 claims abstract description 9
- 239000002105 nanoparticle Substances 0.000 claims description 22
- 150000004767 nitrides Chemical class 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 230000004913 activation Effects 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 4
- 238000007605 air drying Methods 0.000 claims description 4
- 239000010974 bronze Substances 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000005121 nitriding Methods 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- JGRGMDZIEXDEQT-UHFFFAOYSA-N [Cl].[Xe] Chemical compound [Cl].[Xe] JGRGMDZIEXDEQT-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000007420 reactivation Effects 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for plating copper on a flexible substrate. The method sequentially comprises the following steps of (1) providing the flexible substrate, and roughening the surface of the flexible substrate, (2) depositing a nitriding metal nano-particle layer on the roughened flexible substrate, irradiating nitriding metal nano-particles with ultraviolet laser so as to activate the nitriding metal nano-particles; and (3) plating copper on the surface of the activated flexible substrate so as to form a copper plating layer.
Description
Technical field
The invention belongs to field of circuit boards, relate in particular to a kind of copper electroplating method that can strengthen copper plate and flexible substrate bonding force.
Background technology
At present, on flexible substrate, the formed flexible PCB of copper facing is widely used in various electronic.Flexible PCB has outstanding bent performance.But in prior art, flexible PCB is mainly to adopt tackiness agent that flexible substrate and metal copper foil are bonded.But the flexible PCB that this mode makes, because the bonding properties between Copper Foil and flexible substrate is poor, therefore, in the process that flexible PCB is bent, is easy to occur the perk of copper foil circuit, thereby causes the disabler of flexible PCB.After this, develop on flexible substrate and form conductive copper layer by methods such as laminatings in the industry, but conductive copper layer on the flexible PCB that the method makes still comes off or perk than being easier to, thereby cause the inefficacy of electronics.
Summary of the invention:
The present invention is directed in prior art, flexible substrate is combined hypodynamic defect with conductive copper layer, proposed a kind of method that improves conductive copper layer and flexible substrate bonding force, and described method in turn includes the following steps:
(1) provide flexible substrate, flexible substrate is carried out to surface treatment, make its surface roughening;
(2) complete cvd nitride metal nano-particle layer on the flexible substrate of surface roughening, adopting Ultra-Violet Laser to irradiate this metal nitride nano particle, thereby metal nitride nano particle is carried out to activation treatment;
(3) at the flexible substrate copper coating that completes activation treatment to form copper plate.
Wherein, between step (1) and (2), flexible substrate is cleaned for the first time, for example, by deionized water rinsing or cleaned by ultrasonic vibration, the pollutent on flexible substrate surface is cleaned, natural air drying after cleaning;
Wherein, between step (2) and (3), flexible substrate is cleaned for the second time, purging method with clean for the first time identical;
Wherein, flexible substrate can be the flexible substrate of polyimide (PI) material, can be also the flexible substrate of polyethylene terephthalate (PET) material;
Wherein, metal nitride nano particle, after Ultra-Violet Laser irradiates, will leave atoms metal on the surface of flexible base, board, and for example aluminum nitride nanometer particle is after Ultra-Violet Laser irradiates, and nitrogen will disengage, and on flexible substrate, leaves aluminium atom.For other metal nitride nano particles, its reactivation process is identical with it; Metal nitride nano particle can be aluminium nitride, titanium nitride; Or, also can adopt oxidized metal nano particle to replace metal nitride nano particle, nano particles such as titanium oxide, zinc oxide, aluminum oxide, stannic oxide, chromic oxide; For the particle diameter of nano particle, the preferred particle size range of the present invention is 100 nanometer to 300 nanometers, and preferred scope is 160 nanometer to 250 nanometers;
Wherein, Ultra-Violet Laser is: the fluorine krypton laser that wavelength is 248nm, its irradiation energy is 180mJ/cm
2, or the wavelength xenon chlorine laser that is 308nm, its irradiation energy is 210mJ/cm
2, or the wavelength nitrogen laser that is 337nm, irradiation energy is 240mJ/cm
2;
Wherein, can pass through the mode of sputter at flexible substrate surface jet-plating metallization copper, thereby form copper plate; Concrete technological process is: flexible substrate is placed in vacuum splashing and plating chamber, and described vacuum sputtering apparatus comprises negative electrode and the anode being oppositely arranged; Described flexible substrate is placed on to anode, and copper target is placed on to negative electrode, between described negative electrode and anode, apply voltage, thereby on flexible substrate, form copper plate; Wherein, the vacuum tightness of described vacuum chamber is 1 * 10
-5torr, institute's thickness of coated copper layer is in the scope of 3-10 micron; In actual applications, can select different thickness of coated copper layer for different situations, for example 5 microns, 6 microns, 8 microns;
Also can on flexible substrate surface, form copper plate by the method for electroless copper, the technique of described electroless copper method is: the flexible substrate after activation is placed in to chemical bronze plating liquid, electroless copper 2-3 hour under the environment of 40～75 ℃, thus copper plate on flexible substrate, formed.
Embodiment:
Below by embodiment, the present invention is described in detail.
Embodiment 1
Introduce the first embodiment of the present invention below; The copper coating on flexible substrate that the present invention proposes in turn includes the following steps:
(1) provide flexible substrate, flexible substrate is carried out to surface treatment, make its surface roughening;
(2) complete cvd nitride metal nano-particle layer on the flexible substrate of surface roughening, adopting Ultra-Violet Laser to irradiate this metal nitride nano particle, thereby metal nitride nano particle is carried out to activation treatment;
(3) at the flexible substrate copper coating that completes activation treatment to form copper plate.
Wherein, between step (1) and (2), flexible substrate is cleaned for the first time, for example, by deionized water rinsing or cleaned by ultrasonic vibration, the pollutent on flexible substrate surface is cleaned, natural air drying after cleaning;
Wherein, between step (2) and (3), flexible substrate is cleaned for the second time, purging method with clean for the first time identical;
Wherein, flexible substrate can be the flexible substrate of polyimide (PI) material, can be also the flexible substrate of polyethylene terephthalate (PET) material;
Wherein, metal nitride nano particle, after Ultra-Violet Laser irradiates, will leave atoms metal on the surface of flexible base, board, and for example aluminum nitride nanometer particle is after Ultra-Violet Laser irradiates, and nitrogen will disengage, and on flexible substrate, leaves aluminium atom.For other metal nitride nano particles, its reactivation process is identical with it; Metal nitride nano particle can be aluminium nitride, titanium nitride; Or, also can adopt oxidized metal nano particle to replace metal nitride nano particle, nano particles such as titanium oxide, zinc oxide, aluminum oxide, stannic oxide, chromic oxide; For the particle diameter of nano particle, the preferred particle size range of the present invention is 100 nanometer to 300 nanometers, and preferred scope is 160 nanometer to 250 nanometers;
Wherein, Ultra-Violet Laser is: the fluorine krypton laser that wavelength is 248nm, its irradiation energy is 180mJ/cm
2, or the wavelength xenon chlorine laser that is 308nm, its irradiation energy is 210mJ/cm
2, or the wavelength nitrogen laser that is 337nm, irradiation energy is 240mJ/cm
2;
Wherein, can pass through the mode of sputter at flexible substrate surface jet-plating metallization copper, thereby form copper plate; Concrete technological process is: flexible substrate is placed in vacuum splashing and plating chamber, and described vacuum sputtering apparatus comprises negative electrode and the anode being oppositely arranged; Described flexible substrate is placed on to anode, and copper target is placed on to negative electrode, between described negative electrode and anode, apply voltage, thereby on flexible substrate, form copper plate; Wherein, the vacuum tightness of described vacuum chamber is 1 * 10
-5torr, institute's thickness of coated copper layer is in the scope of 3-10 micron; In actual applications, can select different thickness of coated copper layer for different situations, for example 5 microns, 6 microns, 8 microns;
Also can on flexible substrate surface, form copper plate by the method for electroless copper, the technique of described electroless copper method is: the flexible substrate after activation is placed in to chemical bronze plating liquid, electroless copper 2-3 hour under the environment of 40～75 ℃, thus copper plate on flexible substrate, formed.
Embodiment 2
Provide in a second embodiment optimum embodiment of the present invention below, the copper coating on flexible substrate that the present invention proposes in turn includes the following steps:
(1) provide flexible substrate, flexible substrate is carried out to surface treatment, make its surface roughening;
(1-1) flexible substrate is cleaned for the first time, for example, by deionized water rinsing or cleaned by ultrasonic vibration, the pollutent on flexible substrate surface is cleaned, natural air drying after cleaning;
(2) complete cvd nitride metal nano-particle layer on the flexible substrate of surface roughening, adopting Ultra-Violet Laser to irradiate this metal nitride nano particle, thereby metal nitride nano particle is carried out to activation treatment;
(2-2) flexible substrate is cleaned for the second time, purging method with clean for the first time identical
(3) at the flexible substrate copper coating that completes activation treatment to form copper plate.
Wherein, flexible substrate can be the flexible substrate of polyimide (PI) material, can be also the flexible substrate of polyethylene terephthalate (PET) material;
Wherein, metal nitride nano particle is aluminum nitride nanometer particle, and its particle diameter is 180 nanometers;
Wherein, Ultra-Violet Laser is that wavelength is the nitrogen laser of 337nm, and irradiation energy is 240mJ/cm
2;
Wherein, the method that forms copper plate by sputtering way is: flexible substrate is placed in vacuum splashing and plating chamber, and described vacuum sputtering apparatus comprises negative electrode and the anode being oppositely arranged; Described flexible substrate is placed on to anode, and copper target is placed on to negative electrode, between described negative electrode and anode, apply voltage, thereby on flexible substrate, form copper plate; Wherein, the vacuum tightness of described vacuum chamber is 1 * 10
-5torr, institute's thickness of coated copper layer is 8 microns;
The method that forms copper plate on flexible substrate surface by electroless copper mode is: the flexible substrate after activation is placed in to chemical bronze plating liquid, and under the environment of 50 ℃, electroless copper is 2.5 hours, thereby on flexible substrate, forms copper plate.
Above embodiment is described in detail the present invention, but above-mentioned embodiment is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (4)
1. a copper coating on flexible substrate, in turn includes the following steps:
(1) provide flexible substrate, flexible substrate is carried out to surface treatment, make its surface roughening;
(2) complete cvd nitride metal nano-particle layer on the flexible substrate of surface roughening, adopting Ultra-Violet Laser to irradiate this metal nitride nano particle, thereby metal nitride nano particle is carried out to activation treatment;
(3) at the flexible substrate copper coating that completes activation treatment to form copper plate.
2. the method for claim 1, is characterized in that:
Wherein, between step (1) and (2) and between step (2) and (3), cleaning for the first time respectively and cleaning for the second time; Described cleaning for the first time with cleaning for the second time for example cleaned the pollutent on flexible substrate surface by deionized water rinsing or cleaned by ultrasonic vibration, natural air drying after cleaning.
3. method as claimed in claim 2, is characterized in that:
The particle size range of metal nitride nano particle is 100 nanometer to 300 nanometers, preferably 160 nanometer to 250 nanometers; Thickness of coated copper layer is in the scope of 3-10 micron; Be preferably 5 microns, 6 microns or 8 microns.
4. method as claimed in claim 3, is characterized in that:
Thereby the mode by sputter in the technological process of flexible substrate surface jet-plating metallization copper formation copper plate is: flexible substrate is placed in vacuum splashing and plating chamber, described vacuum sputtering apparatus comprises negative electrode and the anode being oppositely arranged; Described flexible substrate is placed on to anode, and copper target is placed on to negative electrode, between described negative electrode and anode, apply voltage, thereby on flexible substrate, form copper plate; Wherein, the vacuum tightness of described vacuum chamber is 1 * 10
-5torr;
Method by electroless copper in the technique of flexible substrate surface formation copper plate is: the flexible substrate after activation is placed in to chemical bronze plating liquid, and electroless copper 2-3 hour under the environment of 40～75 ℃, thus on flexible substrate, form copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553813.9A CN103602947A (en) | 2013-11-07 | 2013-11-07 | Method for plating copper on flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553813.9A CN103602947A (en) | 2013-11-07 | 2013-11-07 | Method for plating copper on flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103602947A true CN103602947A (en) | 2014-02-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310553813.9A Pending CN103602947A (en) | 2013-11-07 | 2013-11-07 | Method for plating copper on flexible substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244159A (en) * | 2017-07-11 | 2019-01-18 | 中国科学院上海硅酸盐研究所 | A production line for atomic oxygen protective layer of flexible substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030031803A1 (en) * | 2001-03-15 | 2003-02-13 | Christian Belouet | Method of metallizing a substrate part |
| CN102071412A (en) * | 2010-04-14 | 2011-05-25 | 比亚迪股份有限公司 | Preparation method of a plastic product and a plastic product |
-
2013
- 2013-11-07 CN CN201310553813.9A patent/CN103602947A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030031803A1 (en) * | 2001-03-15 | 2003-02-13 | Christian Belouet | Method of metallizing a substrate part |
| CN102071412A (en) * | 2010-04-14 | 2011-05-25 | 比亚迪股份有限公司 | Preparation method of a plastic product and a plastic product |
Non-Patent Citations (1)
| Title |
|---|
| 孙中子等: "塑料自催化镀铜工艺的研究", 《材料工程》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244159A (en) * | 2017-07-11 | 2019-01-18 | 中国科学院上海硅酸盐研究所 | A production line for atomic oxygen protective layer of flexible substrate |
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Application publication date: 20140226 |