CN103681952B - Preparation process of molybdenum/platinum/silver layered metal matrix composites for space vehicles - Google Patents
Preparation process of molybdenum/platinum/silver layered metal matrix composites for space vehicles Download PDFInfo
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 229
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title claims abstract description 119
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 111
- 229910052750 molybdenum Inorganic materials 0.000 title claims abstract description 108
- 239000011733 molybdenum Substances 0.000 title claims abstract description 108
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 80
- 239000004332 silver Substances 0.000 title claims abstract description 80
- 239000011156 metal matrix composite Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000000137 annealing Methods 0.000 claims abstract description 36
- 238000007747 plating Methods 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 21
- 238000005516 engineering process Methods 0.000 claims abstract description 12
- 238000002203 pretreatment Methods 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 75
- 238000009713 electroplating Methods 0.000 claims description 40
- 239000002131 composite material Substances 0.000 claims description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000388 diammonium phosphate Inorganic materials 0.000 claims description 5
- 235000019838 diammonium phosphate Nutrition 0.000 claims description 5
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 5
- RWPGFSMJFRPDDP-UHFFFAOYSA-L potassium metabisulfite Chemical compound [K+].[K+].[O-]S(=O)S([O-])(=O)=O RWPGFSMJFRPDDP-UHFFFAOYSA-L 0.000 claims description 5
- 229940043349 potassium metabisulfite Drugs 0.000 claims description 5
- 235000010263 potassium metabisulphite Nutrition 0.000 claims description 5
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 5
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005695 Ammonium acetate Substances 0.000 claims description 3
- 229940043376 ammonium acetate Drugs 0.000 claims description 3
- 235000019257 ammonium acetate Nutrition 0.000 claims description 3
- BRWIZMBXBAOCCF-UHFFFAOYSA-N hydrazinecarbothioamide Chemical compound NNC(N)=S BRWIZMBXBAOCCF-UHFFFAOYSA-N 0.000 claims description 3
- ZMCCBULBRKMZTH-UHFFFAOYSA-N molybdenum platinum Chemical compound [Mo].[Pt] ZMCCBULBRKMZTH-UHFFFAOYSA-N 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000009413 insulation Methods 0.000 claims 4
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims 1
- 229910000397 disodium phosphate Inorganic materials 0.000 claims 1
- 235000019800 disodium phosphate Nutrition 0.000 claims 1
- 239000010946 fine silver Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 11
- 238000000682 scanning probe acoustic microscopy Methods 0.000 abstract description 6
- 238000004458 analytical method Methods 0.000 abstract description 3
- 238000012876 topography Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 239000008367 deionised water Substances 0.000 description 15
- 229910021641 deionized water Inorganic materials 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 9
- 239000011888 foil Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- -1 silver ions Chemical class 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- GNLCAVBZUNZENF-UHFFFAOYSA-N platinum silver Chemical compound [Ag].[Ag].[Ag].[Pt] GNLCAVBZUNZENF-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910015797 MoPt Inorganic materials 0.000 description 1
- 101100077717 Mus musculus Morn2 gene Proteins 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 229940117975 chromium trioxide Drugs 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- WBZKQQHYRPRKNJ-UHFFFAOYSA-L disulfite Chemical compound [O-]S(=O)S([O-])(=O)=O WBZKQQHYRPRKNJ-UHFFFAOYSA-L 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- FSVVWABMXMMPEE-UHFFFAOYSA-N molybdenum silver Chemical compound [Mo][Ag][Mo] FSVVWABMXMMPEE-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- ONVGIJBNBDUBCM-UHFFFAOYSA-N silver;silver Chemical compound [Ag].[Ag+] ONVGIJBNBDUBCM-UHFFFAOYSA-N 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
技术领域 technical field
本发明涉及到一种空间飞行器太阳电池阵互连片用钼/铂/银层状金属基复合材料的制备工艺。 The invention relates to a preparation process of a molybdenum/platinum/silver layered metal-based composite material for a space vehicle solar battery array interconnection sheet.
背景技术 Background technique
空间飞行器(包括卫星、宇宙飞船和空间站等)的电源系统是由以太阳能电池阵作为发电装置、蓄电池组作为储能装置和与配电系统所需的电源控制装置构成的。太阳能电池阵在地球轨道的光照期间发电,为航天器的用电负载提供电能,同时为蓄电池组充电。 The power supply system of space vehicles (including satellites, spacecraft and space stations, etc.) is composed of solar arrays as power generation devices, battery packs as energy storage devices, and power control devices required for power distribution systems. The solar array generates electricity during bright periods in Earth orbit, powering the spacecraft's electrical loads and charging the battery pack.
太阳能电池阵由大量太阳能电池片组成,这些电池片有序装贴在太阳电池板上,利用太阳能电池的光电效应,将入射太阳光辐射转换成电能。虽然每片电池贡献很小的电流与电压,但大量的电池片进行适当的串联和并联则可提供航天器负载所需要的电流和电压,而这些串联、并联以及电流的引出都是采用金属互连片进行。 The solar cell array is composed of a large number of solar cells, which are mounted on the solar panel in an orderly manner, and use the photoelectric effect of the solar cell to convert the incident sunlight radiation into electrical energy. Although each cell contributes a small current and voltage, a large number of cells can be properly connected in series and parallel to provide the current and voltage required by the spacecraft load. Continuously.
空间飞行器有相当一部分是在低地球轨道(LowEarthOrbit-LEO,轨道高度处于200Km到1000Km之间)上运行。所用互连片在此轨道上将经受原子氧、热循环、微陨石与空间碎片和紫外辐射的影响,其中又尤其以原子氧和热循环的影响最为严重。在这种空间环境中,互连片往往出现裂纹、氧化剥蚀和变形脱落,轻则太阳能电池阵输出功率下降,重则电池阵彻底破坏,从而导致空间飞行器失效。而要提高LEO空间飞行器的在轨可靠性和寿命,互连片采用具有高抗原子氧侵蚀能力、低热膨胀量和导电性优良的新型钼/铂/银层状复合材料将是关键之一。 A considerable part of the spacecraft is operating in low earth orbit (LowEarthOrbit-LEO, the orbital altitude is between 200Km and 1000Km). The interconnection sheet used will be subjected to the influence of atomic oxygen, thermal cycle, micrometeorite and space debris and ultraviolet radiation in this orbit, among which the impact of atomic oxygen and thermal cycle is the most serious. In this kind of space environment, the interconnection sheet often has cracks, oxidative erosion, and deformation and shedding. In the slightest, the output power of the solar cell array decreases, and in severe cases, the battery array is completely destroyed, resulting in the failure of the space vehicle. To improve the on-orbit reliability and lifespan of LEO spacecraft, the use of new molybdenum/platinum/silver layered composite materials with high resistance to atomic oxygen erosion, low thermal expansion and excellent electrical conductivity will be one of the keys.
中国专利CN201110008862.5公开了太阳能电池互连片用钼/银层状金属基复合材料与制备工艺,主要是采用离子注入法,将银离子注入钼金属箔试片中,然后电镀银得到钼/银层状金属基复合材料。需要指出钼/银层状金属基复合材料虽解决了互连片高界面结合强度、耐热疲劳、优良的焊接性和导电性等问题,但实践证明还必须解决好互连片具备优异的抗氧化性来承担LEO原子氧侵蚀的问题,在钼-银之间加入铂金属层来制备钼/铂/银层状复合材料即可满足。 Chinese patent CN201110008862.5 discloses a molybdenum/silver layered metal matrix composite material and preparation process for solar cell interconnect sheets, mainly using ion implantation method, injecting silver ions into molybdenum metal foil test pieces, and then electroplating silver to obtain molybdenum/silver Silver layered metal matrix composites. It should be pointed out that although the molybdenum/silver layered metal matrix composite material solves the problems of high interfacial bonding strength, thermal fatigue resistance, excellent solderability and electrical conductivity of the interconnection sheet, it has been proved that the interconnection sheet has excellent resistance to corrosion. Oxidation to bear the problem of LEO atomic oxygen erosion can be satisfied by adding a platinum metal layer between molybdenum-silver to prepare a molybdenum/platinum/silver layered composite material.
钼/铂/银层状复合材料的制备技术有几个难点:钼-铂虽为固溶系统,但存在着五个金属中间相(相Mo6Pt、相Mo3Pt、相Mo3Pt、相MoPt、相Mo6Pt2),加上钼箔表面活性极低,获得结合强度高、塑韧性良好的钼/铂结合界面难度较大;铂-银体系虽为固溶系统,但迄今为止学术界对铂-银二元合金相图存在着较大争议,这使得合理显微结构的确认、退火工艺的制订存在着难度;钼、铂和银金属的热膨胀系数差异较大(钼的热膨胀系数约为5.210-6/K-1、铂的热膨胀系数约为9.010-6/K-1、银的热膨胀系数约为19.210-6/K-1),热应力较难控制。 There are several difficulties in the preparation technology of molybdenum/platinum/silver layered composites: Although molybdenum-platinum is a solid solution system, there are five metal intermediate phases ( Phase Mo 6 Pt, Phase Mo 3 Pt, Phase Mo 3 Pt, Phase MoPt, phase Mo 6 Pt 2 ), coupled with the extremely low surface activity of molybdenum foil, it is difficult to obtain a molybdenum/platinum bonding interface with high bonding strength and good ductility; Although the platinum-silver system is a solid solution system, so far there has been considerable controversy over the phase diagram of platinum-silver binary alloys in the academic circles, which makes it difficult to confirm the reasonable microstructure and formulate the annealing process; The thermal expansion coefficients of molybdenum, platinum and silver metals are quite different (the thermal expansion coefficient of molybdenum is about 5.2 10 -6 /K -1 , the thermal expansion coefficient of platinum is about 9.0 10 -6 /K -1 , the thermal expansion coefficient of silver is about 19.2 10 -6 /K -1 ), the thermal stress is difficult to control.
发明内容 Contents of the invention
本发明的目的在于提供一种空间飞行器太阳电池阵互连片用钼/铂/银层状金属基复合材料的制备工艺,以提高LEO空间飞行器的在轨寿命和可靠性。采用无氰电镀+多次退火技术来实现钼/铂/银之间界面的冶金结合,最终制备出了钼/铂/银层状金属基复合材料,达到了性能要求。所制备的钼/铂/银层状金属基复合材料能与空间砷化镓太阳电池电阻点焊的强度达到了国家军标GJB2602-1996的要求。 The purpose of the present invention is to provide a preparation process of a molybdenum/platinum/silver layered metal matrix composite material for solar cell array interconnection sheets of space vehicles, so as to improve the life and reliability of LEO space vehicles on orbit. Cyanide-free electroplating + multiple annealing techniques were used to realize the metallurgical bonding of the interface between molybdenum/platinum/silver, and finally a molybdenum/platinum/silver layered metal matrix composite material was prepared, which met the performance requirements. The prepared molybdenum/platinum/silver layered metal matrix composite material can meet the requirements of the national military standard GJB2602-1996 with the resistance spot welding strength of the space gallium arsenide solar cell.
本发明提供的太阳电池阵互连片用钼/铂/银层状金属基复合材料的制备工艺主要包括以下步骤: The preparation process of the molybdenum/platinum/silver layered metal matrix composite material for solar cell array interconnect sheet provided by the present invention mainly includes the following steps:
1)钼金属箔的前处理。钼箔的前处理对于获得高强度的钼/铂/银界面结合非常重要。前处理包括了钼箔去油、清洗、刻蚀、超声波清洗等步骤,其过程为:将用酒精清洗过的钼箔浸入去油液中浸泡,取出浸入去离子水中浸泡清洗,去油清洗完的钼箔浸入刻蚀液中刻蚀,刻蚀结束后浸入去离子水中浸泡,然后放入去离子水中进行超声波清洗,超声清洗结束后晾干待用。 1) Pretreatment of molybdenum metal foil. The pretreatment of molybdenum foil is very important to obtain high-strength molybdenum/platinum/silver interfacial bonding. The pre-treatment includes the steps of molybdenum foil degreasing, cleaning, etching, and ultrasonic cleaning. The molybdenum foil is immersed in the etching solution for etching, and then immersed in deionized water after etching, then placed in deionized water for ultrasonic cleaning, and dried after ultrasonic cleaning.
2)钼金属表面电镀铂。该步骤采用直流电镀装置电镀铂,电镀液温度为80-85℃,电镀完获得钼/铂电镀试样。 2) The surface of molybdenum metal is electroplated with platinum. In this step, a direct current electroplating device is used to electroplate platinum, the temperature of the electroplating solution is 80-85°C, and a molybdenum/platinum electroplating sample is obtained after electroplating.
电镀铂溶液成分和工艺参数如下: Platinum electroplating solution composition and process parameters are as follows:
磷酸氢二钠140g/LpH值7-7.5 Disodium hydrogen phosphate 140g/LpH 7-7.5
磷酸氢二铵40g/L电流密度4-4.5A·dm-2 Diammonium hydrogen phosphate 40g/L Current density 4-4.5A·dm -2
氯铂酸0.5308g/L电镀时间3.5-4h Chloroplatinic acid 0.5308g/L electroplating time 3.5-4h
十二烷基磺酸钠0.01g/L电镀温度80-85 Sodium dodecyl sulfonate 0.01g/L electroplating temperature 80-85
3)钼/铂电镀试样退火(第一次气氛保护退火)。该步骤主要为将上一步骤所获钼电镀铂试样在氩气保护下900-950进行退火3.5~4小时,退火后获得了钼/铂层状退火试样。 3) Annealing of molybdenum/platinum plating samples (the first atmosphere protection annealing). This step is mainly to place the molybdenum electroplated platinum sample obtained in the previous step under argon protection for 900-950 Annealing was performed for 3.5-4 hours, and a molybdenum/platinum layered annealed sample was obtained after annealing.
4)钼/铂层状退火试样表面电镀银。该步骤采用直流电镀装置电镀银,电镀完获得钼/铂/银电镀试样。 4) The molybdenum/platinum layered annealed sample surface was electroplated with silver. In this step, a direct current electroplating device is used to electroplate silver, and a molybdenum/platinum/silver electroplating sample is obtained after electroplating.
电镀银溶液成分和工艺参数为: The composition and process parameters of the electroplating silver solution are:
硫代硫酸钠250g/LpH值6.5~8 Sodium thiosulfate 250g/LpH 6.5~8
焦亚硫酸钾45g/L电流密度0.40-0.45A·dm-2 Potassium metabisulfite 45g/L Current density 0.40-0.45A·dm -2
乙酸铵150g/L电镀时间20-25min Ammonium acetate 150g/L electroplating time 20-25min
硝酸银45g/L电镀温度18~35 Silver nitrate 45g/L electroplating temperature 18~35
硫代氨基脲0.8g/L Thiosemicarbazide 0.8g/L
5)钼/铂/银电镀试样的退火(第二次气氛保护退火)。 5) Annealing of molybdenum/platinum/silver plating samples (the second atmosphere protection annealing).
该步骤主要为将上一步骤所获钼/铂/银电镀试样在氩气保护下700~750进行退火4~4.5小时,退火后最终获得了钼/铂/银层状金属基复合材料。 This step is mainly to place the molybdenum/platinum/silver plating sample obtained in the previous step under argon protection at 700~750 Annealing is carried out for 4-4.5 hours, and the molybdenum/platinum/silver layered metal matrix composite material is finally obtained after annealing.
本发明进行以下测试: The present invention carries out following test:
1)钼表面电镀铂后获钼/铂电镀试样的表面形貌扫描电子显微镜(SEM)观察; 1) Scanning electron microscope (SEM) observation of the surface morphology of the molybdenum/platinum plating sample obtained after platinum plating on the molybdenum surface;
2)钼表面电镀铂后在第一次气氛保护退火后所获钼/铂层状退火试样的表面形貌SEM观察; 2) SEM observation of the surface morphology of the molybdenum/platinum layered annealed sample obtained after the first atmosphere protection annealing after platinum plating on the molybdenum surface;
3)钼/铂/银层状金属基复合材料的表面形貌SEM观察; 3) SEM observation of the surface morphology of molybdenum/platinum/silver layered metal matrix composites;
4)钼/铂/银层状金属基复合材料沿深度的成分俄歇能谱(AES)分析; 4) Compositional Auger spectroscopy (AES) analysis of molybdenum/platinum/silver layered metal matrix composites along the depth;
5)钼/铂/银层状金属基复合材料与空间砷化镓太阳电池片的电阻点焊焊接拉伸强度测试。 5) Resistance spot welding tensile strength test of molybdenum/platinum/silver layered metal matrix composites and space gallium arsenide solar cells.
本发明的钼/铂/银层状复合材料是以钼金属为基体、银金属为表层、铂金属为中间层、三者在界面上实现冶金结合而制备的层状结构先进复合材料。其中,钼金属耐高温,在高温下能保持较高的强度。同时,低的热膨胀系数使钼具有良好的耐热冲击性能,导电性和耐磨性也良好;银金属具有良好的焊接性(钼的可焊性相对较差)和导电性;而铂金属则除了可以作为中间层实现对互不固溶钼、银金属的层状复合之外,同时还可利用其优异的抗氧化性来承担原子氧侵蚀。因此,钼/铂/银层状复合材料同时具备了耐热冲击、良好的导电性和焊接性能等特点,且抗原子氧侵蚀,不具有铁磁性,非常适合于承受交变热载荷和原子氧侵蚀的LEO空间飞行器。 The molybdenum/platinum/silver layered composite material of the present invention is an advanced layered structure composite material prepared by using molybdenum metal as the matrix, silver metal as the surface layer, platinum metal as the middle layer, and the metallurgical combination of the three on the interface. Among them, molybdenum metal is resistant to high temperature and can maintain high strength at high temperature. At the same time, the low thermal expansion coefficient makes molybdenum have good thermal shock resistance, good electrical conductivity and wear resistance; silver metal has good weldability (molybdenum has relatively poor weldability) and electrical conductivity; while platinum metal In addition to being used as an intermediate layer to achieve layered composites of mutually insoluble molybdenum and silver metals, it can also take advantage of its excellent oxidation resistance to bear atomic oxygen erosion. Therefore, the molybdenum/platinum/silver layered composite material has the characteristics of thermal shock resistance, good electrical conductivity and welding performance, and is resistant to atomic oxygen corrosion, non-ferromagnetic, and is very suitable for bearing alternating thermal loads and atomic oxygen. Eroded LEO spacecraft.
本发明提供了一种空间飞行器太阳电池阵互连片用钼/铂/银层状金属基复合材料的制备工艺。采用钼金属表面电镀铂+气氛保护退火、钼/铂表面电镀银+气氛保护退火等技术分别使得钼/铂、铂/银界面发生扩散渗入,从而在钼/铂、铂/银界面上实现冶金结合,获得了具有高界面结合强度、高焊接拉伸强度的钼/铂/银层状金属基复合材料,其与太阳能电池片单点电阻点焊时的焊接拉伸强度为324克力(gf),超过了国家军用标准GJB2602-1996规定的150gf焊接强度指标。 The invention provides a preparation process of a molybdenum/platinum/silver layered metal-based composite material for a space vehicle solar cell array interconnection sheet. Platinum plating on the surface of molybdenum metal + atmosphere protection annealing, molybdenum/platinum surface silver plating + atmosphere protection annealing and other technologies make the interface of molybdenum/platinum and platinum/silver diffuse and infiltrate, so as to realize metallurgy on the interface of molybdenum/platinum and platinum/silver Combined, a molybdenum/platinum/silver layered metal matrix composite material with high interfacial bonding strength and high welding tensile strength was obtained, and the welding tensile strength when it was single-point resistance spot welded with solar cells was 324 grams of force (gf ), exceeding the 150gf welding strength index stipulated in the national military standard GJB2602-1996.
附图说明 Description of drawings
图1:本发明中钼/铂/银层状金属基复合材料结构的示意图。 Figure 1: Schematic diagram of the structure of the molybdenum/platinum/silver layered metal matrix composite material in the present invention.
图2:本发明中电镀铂装置的示意图。 Fig. 2: The schematic diagram of electroplating platinum device in the present invention.
图3:本发明中电镀银装置的示意图。 Fig. 3: The schematic diagram of electroplating silver device in the present invention.
图4:本发明中钼表面电镀铂后所获钼/铂电镀试样的表面形貌观察SEM图。 Figure 4: SEM image of surface morphology observation of molybdenum/platinum electroplating sample obtained after electroplating platinum on the surface of molybdenum in the present invention.
图5:本发明中钼表面电镀铂后在第一次气氛保护退火后所获钼/铂层状退火试样的表面形貌观察SEM图。 Fig. 5: SEM image of the surface morphology observation of the molybdenum/platinum layered annealed sample obtained after the first atmosphere protection annealing after the molybdenum surface is electroplated with platinum in the present invention.
图6:本发明中钼/铂/银层状金属基复合材料的表面形貌观察SEM图。 Fig. 6: SEM image of surface morphology observation of molybdenum/platinum/silver layered metal matrix composite material in the present invention.
图7:钼/铂/银层状金属基复合材料沿深度的成分AES谱图。 Figure 7: Compositional AES spectra of molybdenum/platinum/silver layered metal matrix composites along depth.
图8:本发明中钼/铂/银层状金属基复合材料焊接强度测试示意图。 Fig. 8: Schematic diagram of testing the welding strength of molybdenum/platinum/silver layered metal matrix composites in the present invention.
图9:本发明中钼/铂/银层状金属基复合材料与空间砷化镓太阳电池电阻点焊焊接拉伸强度的测试曲线。 Fig. 9: Test curve of tensile strength of molybdenum/platinum/silver layered metal matrix composite material and space gallium arsenide solar cell resistance spot welding in the present invention.
具体实施方式 detailed description
本发明结合实施例和附图对作详细描述。 The present invention is described in detail in conjunction with the embodiments and accompanying drawings.
图1为钼/铂/银层状金属基复合材料结构的示意图,其中,1-基体金属,为钼金属,厚度为12;2-中间层金属,为铂金属,厚度为0.5;3-表层金属,为银,厚度为5。 Fig. 1 is a schematic diagram of the structure of molybdenum/platinum/silver layered metal matrix composites, in which, 1-matrix metal is molybdenum metal with a thickness of 12 ; 2 - middle layer metal, platinum metal, thickness 0.5 ;3-Surface metal, silver, thickness 5 .
具体实施步骤如下: The specific implementation steps are as follows:
1、钼金属表面去油、清洗 1. Degreasing and cleaning the molybdenum metal surface
将用酒精清洗过的长180mm宽120mm厚15μm的钼金属箔完全浸入1L去油液(37%浓盐酸50mL+98%浓硫酸50mL+蒸馏水)中浸泡3分钟后,取出浸入去离子水中浸泡5分钟进行清洗,清洗进行3次。 Will be cleaned with alcohol 180mm long Width 120mm The molybdenum metal foil with a thickness of 15 μm is completely immersed in 1L degreasing solution (50mL of 37% concentrated hydrochloric acid+50mL of 98% concentrated sulfuric acid+distilled water) for 3 minutes, then taken out and immersed in deionized water for 5 minutes for cleaning, and the cleaning is carried out 3 times.
2、钼金属表面刻蚀 2. Molybdenum metal surface etching
将上述经过去油处理并用去离子水清洗的钼箔浸泡在1L刻蚀液(37%浓盐酸150mL+98%浓硫酸150mL+蒸馏水+80g三氧化铬)中刻蚀10分钟,取出浸入去离子水中浸泡15分钟,然后取出浸泡在去离子水中超声波清洗25分钟(超声频率50Hz,温度为30),超声波清洗后取出晾干待用。 Soak the molybdenum foil that has been degreased and cleaned with deionized water in 1L of etching solution (150mL of 37% concentrated hydrochloric acid + 150mL of 98% concentrated sulfuric acid + distilled water + 80g of chromium trioxide) and etch for 10 minutes, take it out and immerse it in deionized water Soak for 15 minutes, then take out and soak in deionized water for ultrasonic cleaning for 25 minutes (ultrasonic frequency 50Hz, temperature 30 ), after ultrasonic cleaning, take it out and dry it for later use.
3、电镀铂溶液的配制 3. Preparation of electroplating platinum solution
首先将140g磷酸氢二钠溶于200mL的去离子水中,搅拌使其全部溶解成磷酸氢二钠溶液;然后将40g磷酸氢二铵用500mL的去离子水溶解成磷酸氢二铵溶液;将0.5308g氯铂酸(共含铂0.2g)用100mL去离子水溶解成氯铂酸溶液。 First, dissolve 140g of disodium hydrogen phosphate in 200mL of deionized water, stir to make it all dissolve into a disodium hydrogen phosphate solution; then dissolve 40g of diammonium hydrogen phosphate with 500mL of deionized water into a diammonium hydrogen phosphate solution; Dissolve 1 g of chloroplatinic acid (containing 0.2 g of platinum in total) with 100 mL of deionized water to form a chloroplatinic acid solution.
将配制好的磷酸氢二钠溶液和磷酸氢二铵溶液进行混合,将氯铂酸溶液加入搅拌使其混合均匀;然后加入0.01g十二烷基磺酸钠,使其全部溶解最后加去离子水至1L。 Mix the prepared disodium hydrogen phosphate solution and diammonium hydrogen phosphate solution, add the chloroplatinic acid solution and stir to mix evenly; then add 0.01g sodium dodecylsulfonate to dissolve them all, and finally add deionized water to 1L.
4、钼金属表面电镀铂 4. Platinum plating on the surface of molybdenum metal
采用图2所示的直流电镀装置进行电镀。图中,4-直流电源,5-毫安表,6-铂金属板阳极,7-钼金属试片,8-镀槽(由透明无机玻璃制成),9-镀液,10-恒温水浴槽。 Electroplating was performed using the DC electroplating device shown in Figure 2. In the figure, 4-DC power supply, 5-milliampere meter, 6-platinum metal plate anode, 7-molybdenum metal test piece, 8-plating tank (made of transparent inorganic glass), 9-plating solution, 10-constant temperature water bath.
铂电极(阳极)面积为1cm1cm,与电镀试样的距离为3.5cm。电镀电流密度为4A·dm-2,电镀时间为3.5小时,电镀液温度用恒温水浴槽控制在85℃。 Platinum electrode (anode) area is 1cm 1cm, the distance from the plating sample is 3.5cm. The electroplating current density was 4A·dm -2 , the electroplating time was 3.5 hours, and the temperature of the electroplating solution was controlled at 85°C with a constant temperature water bath.
电镀结束后,获得了钼/铂电镀试样,用去离子水浸泡15分钟后用滤纸吸干,挂晾12个小时,置入真空烘箱中在60温度、10-1Pa真空度下烘干90分钟。 After the electroplating finished, the molybdenum/platinum electroplating sample was obtained, soaked in deionized water for 15 minutes, blotted dry with filter paper, hung it in the air for 12 hours, put it into a vacuum oven at 60 temperature and 10 -1 Pa vacuum for 90 minutes.
5、第一次气氛保护退火 5. The first atmosphere protection annealing
将上述钼/铂电镀试样在退火炉内900℃进行氩气保护退火4小时。退火过程为:以5℃每分钟的升温速率升至250℃,在250℃保温10分钟,然后以6.5℃每分钟的升温速率升至900℃,在900℃下保温4小时,保温结束后开始降温,降温方式为随炉冷却。 The molybdenum/platinum electroplated sample was subjected to argon protection annealing in an annealing furnace at 900° C. for 4 hours. The annealing process is as follows: increase the temperature at a rate of 5 °C per minute to 250 °C, hold at 250 °C for 10 minutes, then increase the rate of temperature at 6.5 °C per minute to 900 °C, and keep at 900 °C for 4 hours. Cooling, the way of cooling is to cool with the furnace.
退火结束后,获得钼/铂层状退火试样。 After annealing, a molybdenum/platinum layered annealed sample was obtained.
6、钼/铂层状退火试样表面电镀银 6. Silver plating on the surface of molybdenum/platinum layered annealed sample
(1)电镀银溶液的配制 (1) Preparation of electroplating silver solution
先将250g硫代硫酸钠溶于300mL的去离子水中,搅拌使其全部溶解成硫代硫酸钠溶液;然后将45g硝酸银和45g焦亚硫酸钾分别用250mL的去离子水溶解成硝酸银溶液和焦亚硫酸钾溶液,在搅拌的条件下将焦亚硫酸钾溶液倒入硝酸银溶液中,生成焦亚硫酸银浑浊液后,立即将溶液缓慢地加入硫代硫酸钠溶液中,使银离子与硫代硫酸钠结合,生成微黄色澄清液; First, dissolve 250g of sodium thiosulfate in 300mL of deionized water, stir to make it all dissolve into a sodium thiosulfate solution; then dissolve 45g of silver nitrate and 45g of potassium metabisulfite in 250mL of deionized water to form a silver nitrate solution and potassium metabisulfite solution, pour the potassium metabisulfite solution into the silver nitrate solution under the condition of stirring, after the cloudy solution of silver metabisulfite is generated, immediately add the solution slowly into the sodium thiosulfate solution to make the silver ions Combining with sodium thiosulfate to produce a slightly yellow clear liquid;
再将乙酸铵150g加入上述微黄澄清液中,静置后,再加入硫代氨基脲0.8g,使其全部溶解,最后用去离子水定容至1L。配制出的镀银液pH值在6.5~8之间。 Add 150 g of ammonium acetate to the above-mentioned yellowish clear liquid, and after standing still, add 0.8 g of thiosemicarbazide to dissolve it completely, and finally dilute to 1 L with deionized water. The pH value of the prepared silver plating solution is between 6.5 and 8.
(2)电镀银 (2) Silver plating
采用图3所示的直流电镀装置对钼/铂层状退火试样表面进行电镀银。图中,11-直流电源,12-毫安表,13-银金属板阳极,14-钼/铂层状退火试样,15-镀槽(由透明无机玻璃制成),16-镀液。 The surface of the molybdenum/platinum layered annealed sample was electroplated with silver using the DC electroplating device shown in Figure 3 . In the figure, 11 - DC power supply, 12 - mA meter, 13 - silver metal plate anode, 14 - molybdenum/platinum layered annealing sample, 15 - plating tank (made of transparent inorganic glass), 16 - plating solution.
银电极(阳极)的面积为10cm10cm,银电极距离试样(阴极)5.5cm。电镀电流密度为0.45A·dm-2,电镀时间为25min,电镀温度为25。 The silver electrode (anode) has an area of 10cm 10cm, the silver electrode is 5.5cm away from the sample (cathode). The electroplating current density is 0.45A·dm -2 , the electroplating time is 25min, and the electroplating temperature is 25 .
电镀结束后,获得钼/铂/银电镀试样,用去离子水浸泡15分钟后用滤纸吸干,挂晾12个小时,置入真空烘箱中在60温度、10-1Pa真空度下烘干90分钟。 After electroplating finishes, obtain molybdenum/platinum/silver electroplating sample, soak with deionized water for 15 minutes and blot dry with filter paper, hang to air for 12 hours, put into vacuum oven at 60 temperature and 10 -1 Pa vacuum for 90 minutes.
7、第二次气氛保护退火 7. The second atmosphere protection annealing
将上述钼/铂/银电镀试样在退火炉内700℃进行氩气保护退火4小时。退火过程为:以5℃每分钟的升温速率升至250℃,在250℃保温10分钟,然后以6.5℃每分钟的升温速率升至700℃,在700℃下保温4小时,保温结束后开始降温,降温方式为随炉冷却。 The above-mentioned molybdenum/platinum/silver electroplating sample was subjected to argon protection annealing in an annealing furnace at 700° C. for 4 hours. The annealing process is as follows: increase the temperature at a rate of 5 °C per minute to 250 °C, keep it at 250 °C for 10 minutes, then increase the rate of temperature at 6.5 °C per minute to 700 °C, and keep it at 700 °C for 4 hours. Cooling, the way of cooling is to cool with the furnace.
退火结束后最终获得钼/铂/银层状金属基复合材料。 After the annealing, the molybdenum/platinum/silver layered metal matrix composite material is finally obtained.
8、钼/铂层状退火试样表面形貌的SEM观察 8. SEM observation of the surface morphology of molybdenum/platinum layered annealed samples
图4为钼/铂电镀试样的表面形貌图,从图4可以看出在钼金属表面镀上了一层致密均匀的铂层;图5为电镀铂后在900℃退火4小时获得钼/铂层状退火试样的表面形貌图,可以看出铂层在退火后晶粒均匀长大,镀铂层表面平整致密。 Figure 4 is the surface morphology of the molybdenum/platinum electroplating sample. From Figure 4, it can be seen that a layer of dense and uniform platinum layer is coated on the surface of the molybdenum metal; /Platinum layered annealed sample surface topography, it can be seen that the platinum layer grains grow uniformly after annealing, and the surface of the platinum-coated layer is smooth and dense.
9、钼/铂/银层状金属基复合材料表面形貌的SEM观察 9. SEM observation of surface morphology of molybdenum/platinum/silver layered metal matrix composites
图6为钼/铂/银层状金属基复合材料表面形貌的SEM图,从图6可以看出表面覆盖了一层均匀致密的银层,复合材料形成了一个整体。 Figure 6 is the SEM image of the surface morphology of the molybdenum/platinum/silver layered metal matrix composite material. From Figure 6, it can be seen that the surface is covered with a uniform and dense silver layer, and the composite material forms a whole.
10、钼/铂/银层状金属基复合材料沿深度的成分AES分析 10. Composition AES analysis along the depth of molybdenum/platinum/silver layered metal matrix composites
图7为钼/铂/银层状金属基复合材料沿深度的成分AES谱图,可以钼-铂和铂-银界面均发生了扩散,形成了冶金结合。 Figure 7 is the composition AES spectrum of the molybdenum/platinum/silver layered metal matrix composite material along the depth. It can be seen that the molybdenum-platinum and platinum-silver interfaces have diffused to form a metallurgical bond.
11、钼/铂/银层状金属基复合材料焊接拉伸强度测试 11. Welding tensile strength test of molybdenum/platinum/silver layered metal matrix composites
焊接拉伸强度测试过程见附图8,具体过程为将钼/铂/银层状金属基复合材料试片采用电阻点焊单点焊接在空间砷化镓太阳能电池片上,然后拉伸至其从太阳能电池片上脱落,拉伸载荷与试样成45。 The welding tensile strength test process is shown in Figure 8. The specific process is to weld the molybdenum/platinum/silver layered metal matrix composite material test piece on the space gallium arsenide solar cell by single point resistance spot welding, and then stretch it from The solar cells fall off, and the tensile load is 45% of that of the sample. .
根据钼/铂/银层状金属基复合材料结构的特点(参见附图1),复合材料表层金属银与空间砷化镓太阳能电池片焊接在一起的拉伸测试结果不仅反映了复合材料与太阳能电池片之间的焊头强度,也反映了钼/铂/银之间的界面强度。 According to the characteristics of the structure of molybdenum/platinum/silver layered metal matrix composites (see Figure 1), the tensile test results of the welding of silver metal on the surface of the composite material and space gallium arsenide solar cells not only reflect the relationship between the composite material and solar energy. The strength of the welding head between the cells also reflects the interface strength between molybdenum/platinum/silver.
附图9为测试结果。结果表明单点电阻点焊时其焊接(界面)强度为324克力(gf),达到了国家军用标准和航天用户提出的指标要求(国家军用标准GJB2602-1996规定的指标为150gf,符合空间飞行器的要求。 Accompanying drawing 9 is test result. The results show that the welding (interface) strength of single-point resistance spot welding is 324 grams force (gf), which meets the national military standard and the index requirements put forward by aerospace users (the national military standard GJB2602-1996 stipulates that the index is 150gf, which meets the requirements of space vehicles. requirements.
Claims (10)
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| CN106711262B (en) * | 2015-11-16 | 2018-07-03 | 上海空间电源研究所 | A kind of space molybdenum/titanium/silver metal laminar composite and preparation method thereof |
| CN106024975B (en) * | 2016-06-03 | 2017-11-17 | 天津大学 | The preparation method of molybdenum/platinum based on nanoporous molybdenum foil/silver-colored laminar composite |
| CN108950615A (en) * | 2018-07-04 | 2018-12-07 | 天津大学 | A kind of molybdenum/platinum based on surface anodization nanoporous molybdenum/silver layer shape composite material and preparation method thereof |
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