CN103745972A

CN103745972A - One-way conductive plate and manufacturing method thereof

Info

Publication number: CN103745972A
Application number: CN201310737666.0A
Authority: CN
Inventors: 申宇慈
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-12-27
Filing date: 2013-12-27
Publication date: 2014-04-23
Also published as: WO2015096589A1

Abstract

The present invention discloses a one-way conductive plate based on a wire which conducts along the thickness direction and a manufacturing method thereof. The method includes the following steps of: making a wire integration body consisting of one-way arranged wires and basis materials; dividing the wire integration body into pieces, thereby making a plurality of the one-way conductive plates. One embodiment of the present invention adopts a thin wire with a thin outer layer, thus the one-way conductive plate is made and electrically conductive along the thickness direction at any place of the one-way conductive plate. Further, the other embodiment of the present invention adopts a thick wire with the outer layer of certain thickness, thus the one-way conductive plate is made to electric conduct according to a preset distance. The one-way conductive plate of the present invention can contain various structures on the surface of the one-way conductive plate, such as a bare wire core, a bonding pad or a circuit, a bonding pad, a step-shaped groove and a welding material head attached on an end part, wherein the bare wire core is a wire or a plurality of the wires having any required length. The one-way conductive plate of the present invention is used for interconnecting and packaging a microelectronic device.

Description

A kind of unidirectional electroplax and manufacture method thereof

Technical field

Relate generally to IC semiconductor encapsulation technology of the present invention, relate to especially between electronic device (as IC semiconductor chip or its encapsulation) interconnect or for the interconnective unidirectional electroplax between electronic device and electronic circuit substrate (comprising printed substrate).

Background technology

The substrate of band through hole (TSV:Through Silicon Via, TSV:Through Substrate Via and TGV:Through Glass Via) has a wide range of applications in IC semiconductor encapsulation technology.The substrate that contains through hole is generally used in IC semiconductor encapsulation technology, is the element of integrating electronic product function.The substrate that contains through hole comprises the silicon substrate that contains through hole, glass substrate and machine material substrate.At present, manufacture the method for substrate that contains through hole and can be divided into two classes: a class is the method based on substrate, another kind of is method based on through hole.Method based on substrate consists essentially of: 1) on substrate, first open some required holes, 2) then with electric conducting material, fill these holes, thus form a substrate that contains conductive through hole.Method based on through hole consists essentially of: 1) first on a carrier, make the little metal column of some point-like, 2) then with a baseplate material, cover the little metal column of these point-like, remove again described carrier the upper and lower surface of polishing to expose the little metal column of point-like, thereby form a substrate that contains conductive through hole.At present, the use of the substrate that contains through hole is that circuit and the pad by being made in substrate surface is further made into the substrate that contains through hole the circuit substrate that contains through hole, thereby being positioned at the electronic device of upper surface of base plate, be connected with other electronic device or printed circuit board (PCB) below substrate in IC semiconductor encapsulation, the circuit that is positioned at upper surface of base plate also can make the multiple electronic devices that are located thereon first directly carry out communication, and then is connected with other electronic device or the circuit board of substrate below.

The interconnection layer of flip-chip and circuit substrate is the unilateal conduction structure of a kind of conductive projection via wherein at thickness direction, wherein the manufacturing process of copper column-like projection block (Copper Pillar Bump) comprising: perforate in a layer of carrier material (as photoresist layer), and then fill these holes with copper, to make, be about the copper post (Copper Pillar) of 20 to 100 microns.

Conductive adhesive film (Conductive Adhesive Film), it can be used for the corresponding input and output end points of bonding two electronic components conductively under certain temperature and pressure.Conductive adhesive film is comprised of an adhesive film and the conduction granule being dispersed in wherein.

At the above substrate with through hole of the prior art, copper column-like projection block interconnection layer and conductive adhesive film are all a kind of unilateal conduction structures of thickness direction, but they have different manufacture methods and application target.It should be noted that, these substrate and copper column-like projection block interconnection layers with through hole of the prior art have many limitation in manufacture and use, some of them limitation comprises: 1) it is that the technique of then filling by perforate is manufactured one by one, very time-consuming and expensive, 2) wherein said metal pillar or through hole do not comprise insulating outer layer, 3) owing to being by etching or laser beam drilling, the side of through hole is not very smooth 4) diameter of through hole can not be very thin, prior art is manufactured diameter, and to be less than through hole or the copper post of approximately 10 microns be very difficult, 5) spacing of through hole or copper post can not be very little, 6) height of through hole or copper post can not be very large, generally approximately 100 microns of left and right, 7) substrate that contains through hole or the thickness of making the layer of carrier material of copper post are subject to the restriction of the technique that then perforate fill, through hole is thinner, substrate or layer of carrier material must be thinner.And conductive adhesive film is not fine in the conductivity of thickness direction, be not easy for having the interconnection between the pad of unusual fine pitch yet.

Summary of the invention

Inspiration of the present invention comes from the observation of the composite material immanent structure that traditional unidirectional fibre is strengthened and further develops.The cross section of the composite material that unidirectional fibre is strengthened seems similar to the substrate that contains through hole roughly.Therefore, one closely got together by unidirectional conductor and solidify the composite material cylinder forming and cut apart in flakes seemingly a method of cheaply and efficiently manufacturing unilateal conduction structure or unidirectional electroplax.But it is infeasible directly adopting the manufacture method of the composite material of unidirectional fibre reinforcement.Reason is that the manufacture method of the composite material of unidirectional fibre reinforcement normally uses a basis material (as resin material) fiber of a branch of unidirectional array is bonded together and be solidified into a solid, and wherein interfibrous spacing can not accurately be controlled on demand; But the unidirectional electroplax that can apply in IC semiconductor encapsulation technology need to have conductivity in the position of arranging by desired spacing.Compared with unidirectional electroplax of the prior art and manufacture method thereof, unidirectional electroplax provided by the invention can have all functions of three class unilateal conduction structures in the above prior art by setting wire and basis material, and its manufacture method is very efficient.In addition, unidirectional electroplax provided by the invention has been eliminated the limitation of described unilateal conduction structure of the prior art, and also has many new features, more can meet the needs in IC semiconductor package application.

Unidirectional electroplax in thickness direction conduction of the present invention, comprising: the wire of unidirectional array, and wire wherein comprises wire stylet and sets the skin of thickness; Basis material, the wire of its described unidirectional array is bonding and be solidified togather; Wherein said wire stylet is characterised in that: it is the conductive channel along plate thickness direction with insulation protection skin; Wherein each root wire stylet consists of a wire or the bundle conductor or the wire rope that by multiple conducting wires, are formed form; It has from the length of approximately 20 microns to approximately 1000 millimeters, preferably, has from the length of approximately 100 microns to approximately 20 millimeters; It has from approximately 2 to approximately 2000 aspect ratio, preferably, has from approximately 5 to approximately 200 aspect ratio.

Described unidirectional electroplax, it is characterized in that, wherein said wire stylet forms one and arranges closely, have and be less than approximately 10 microns, preferably be less than the spacing from wire stylet edge to wire stylet edge of approximately 5 microns, and there is the diameter that is less than approximately 30 microns, be preferably less than the diameter of approximately 20 microns; It is characterized in that, wherein said wire stylet forms one and has the regularly arranged of setting spacing, have from approximately 10 microns to approximately 500 microns, preferably from the wire stylet edge of approximately 20 microns to approximately 150 microns to the spacing at wire stylet edge, and have from approximately 10 microns to approximately 100 microns, preferably from the diameter of approximately 20 microns to approximately 60 microns; It is characterized in that, the wire stylet of the wherein said bundle conductor being formed by multiple conducting wires or wire rope form is not limited to comprise identical wire, also comprises some other wire or non-wire; It is characterized in that, the skin of described wire has sandwich construction, and wherein outermost layer can be solidified togather under certain temperature or pressure, replaces described basis material bonding described wire and be solidified togather; It is characterized in that, the basis material in described unidirectional electroplax becomes and has cementability or wire stylet is low-melting-point metal at the temperature of setting, thereby described unidirectional electroplax is a unidirectional electroplax at the temperature of setting with adhesive property; It is characterized in that, described basis material is the multilayer material of through-thickness; It is characterized in that, be electric conducting material, thereby the matrix of described unidirectional electroplax is the conduction region of a UNICOM, and each root wire stylet is an independently conductive channel for through-thickness basis material bonding described wire stylet and that be solidified togather; It is characterized in that, described unidirectional electroplax has length from approximately 20 microns to approximately 1000 millimeters in the part or all of region on a surface or each surface, preferably from the exposed wire stylet of approximately 100 microns to approximately 20 millimeters; It is characterized in that, a surface of described unidirectional electroplax has pad or circuit and the pad of setting, and on another surface, has length from approximately 20 microns to approximately 1000 millimeters, preferably from the exposed wire stylet of approximately 100 microns to approximately 20 millimeters; It is characterized in that, a surface of described unidirectional electroplax or each surface have pad or circuit and the pad of setting; For the unidirectional electroplax that comprises nuditing wire core, it is characterized in that, described exposed wire stylet has different length, forms groove or step groove; It is characterized in that, the end of described exposed wire stylet is attached with welding material head.

The method of the described unidirectional electroplax of manufacture of the present invention, the method comprises: provide with outer field wire; Being closely aligned and being solidified into an entirety by a basis material with outer field wire being unidirectional, thereby make a line set adult that comprises unidirectional array wire; Described line set adult is cut apart in flakes by desired thickness, thereby made multiple unidirectional electroplaxs in thickness direction conduction.Described manufacture method, is characterized in that, when arranging wire, the spacing setting between wire for being less than approximately 10 microns, preferably be less than approximately 5 microns, thereby described wire forms a unidirectional arrangement closely, wherein wire stylet is mainly set by the outer field thickness of wire from the spacing of edge-to-edge; It is characterized in that, the skin of described wire has sandwich construction, and wherein outermost material is mutually solidified togather under certain temperature or pressure, thereby remove from, uses other basis material to go bonding described wire and be solidified into an entirety; The method further comprises following steps: on a surface of described unidirectional electroplax or the part or all of region on each surface remove the skin of certain thickness basis material and wire, thereby the part or all of region that is formed in described surface has the unidirectional electroplax of exposed wire stylet; The method further comprises following steps: pad or circuit and the pad set are manufactured in a surface at described unidirectional electroplax, and at the skin of the certain thickness basis material of another surface removal and wire, to be formed in a surface, there is pad or circuit and the pad of setting, and on another surface, there is the unidirectional electroplax of exposed wire stylet; The method further comprises following steps: on a surface, by removing the skin of certain thickness basis material and wire, make after exposed wire stylet, between exposed wire stylet, fill again another basis material and form another base material layer, thereby making the unidirectional electroplax with substrates multilayer material; The method further comprises following steps: when manufacturing exposed wire stylet, remove the wire stylet of certain length in subregion, thereby in exposed wire stylet is arranged, make the groove of groove or step.Described manufacture method, the method further comprises following steps: on a surface, by removing certain thickness basis material, make after exposed wire stylet, between exposed wire stylet, fill again another basis material and form another base material layer, thereby make the unidirectional electroplax with substrates multilayer material, further comprise following steps: on the surface of described newly-generated base material layer, manufacture required pad or circuit and pad, and remove original base material layer, thereby in described unidirectional electroplax, realize a replacement of base material layer.Described manufacture method, the method further comprises following steps: at the additional welding material in the end of nuditing wire core, thereby make the unidirectional electroplax that comprises the nuditing wire core with weldability end.

In the present invention, crucial inventive concept is to utilize to manufacture unidirectional electroplax with outer field wire.Advantages more of the present invention comprise: 1) described unidirectional electroplax is not the technique manufacture of then filling by perforate one by one as prior art, but manufactures in bulk by wire, very cheap and quick; 2) described unidirectional electroplax can have optional thickness; 3) diameter of wire and its outer field thickness and material be all can come as required optional, as can be easily manufactured the through hole that is less than 10 micron diameters, be less than the through-hole spacing of 50 microns and be greater than 100 micron thickness or larger thickness as the unidirectional electroplax of 1 meter of thickness; 4) bonding basis material also can be selected as required; 5) because the thickness of unidirectional electroplax of the present invention is unrestricted, wire can be very thin, thereby can manufacture on its surface the nuditing wire core of very large aspect ratio, such as being greater than 5,20 or 1000.Some other advantage in the present invention, feature and relevant inventive concepts can be described in detail with reference to accompanying drawing explanation below in the specific embodiment of the present invention.

Accompanying drawing explanation

Fig. 1 comprises the compact arranged schematic diagram of manufacturing the method for unidirectional electroplax with the line set adult of outer field wire by one in one embodiment of the invention, comprising the close-packed arrays mode in line set adult or unidirectional electroplax with outer field wire;

Fig. 2 is the schematic diagram of the unidirectional electroplax in one embodiment of the invention, comprising the enlarged diagram of the close-packed arrays mode of the outer field thin wire with very thin;

Fig. 2 A is the surface texture schematic diagram of the unidirectional electroplax shown in Fig. 2, is the schematic diagram of exposed example comprising the wire stylet of described wire in the part or all of region on one or two surface of described unidirectional electroplax;

Fig. 3 is the schematic diagram of the unidirectional electroplax in one embodiment of the invention, comprises the enlarged diagram with the close-packed arrays mode of certain thickness outer field wire, and wire stylet is wherein a wire;

Fig. 3 A is the surface texture schematic diagram of the unidirectional electroplax shown in Fig. 3, is the schematic diagram of exposed example comprising the wire stylet of described wire in the part or all of region on one or two surface of described unidirectional electroplax;

Fig. 4 is the schematic diagram of the unidirectional electroplax in one embodiment of the invention, comprise the enlarged diagram with the close-packed arrays mode of certain thickness outer field wire, wire stylet is wherein a bundle conductor being comprised of multiple conducting wires or the wire rope that twisted into by multiple conducting wires;

Fig. 4 A is the surface texture schematic diagram of the unidirectional electroplax shown in Fig. 4, is the schematic diagram of exposed example comprising the wire stylet of the pencil being comprised of multiple conducting wires of described wire in the part or all of region on one or two surface of described unidirectional electroplax;

Fig. 4 B is the surface texture schematic diagram of the unidirectional electroplax shown in Fig. 4, is the schematic diagram of exposed example comprising the wire stylet of the rope form being twisted into by multiple conducting wires of described wire in the part or all of region on one or two surface of described unidirectional electroplax;

Fig. 5 is unidirectional electroplax and the manufacturing step thereof that comprises some further surface texture featurs in one embodiment of the invention.

Embodiment

For clearly passing through with reference to the accompanying drawings of the specific embodiment of the present invention, first as follows to the terminological interpretation of some uses: 1) with outer field wire, its representative is by wire stylet and the outer wire forming, skin wherein and wire stylet are combined together to form an entirety tightly, forming outer field material can be as required at polymer, and pottery is selected in glass or other insulating material, it can be also electric conducting material, as low-melting-point metal; 2) wire stylet, it represents at the electric conductor with outer field wire center, it can be a wire, the bundle conductor that also can be formed by multiple conducting wires or the wire rope being twisted into by multiple conducting wires, it comprises a very thin insulation protection skin; 3) basis material, the material in the line set adult of composite material, wire stylet being solidified togather; 4) thin wire and heavy gauge wire, wherein be carefully and slightly with respect to the yardstick of a practical application, for example to connect a pair of diameter and be the pad of 100 microns, the wire that diameter is less than 25 microns, or 1/4th or 1/3rd the wire that diameter is less than application yardstick can be called thin wire roughly; 5) close-packed arrays of wire, its spacing that represents adjacent wires is very little, and wherein arrangement mode comprises equilateral triangle and square; 6) line set adult, its wire that represents a branch of unidirectional array is by certain material adhesive together and the solid column being solidified into; 7) unidirectional electroplax, it represents a flaky material of direction insulation in the face in the thickness direction conduction of plate and at plate, wherein in the thickness direction conduction of plate, do not mean that the optional position of plate all conducts electricity at the thickness direction of plate, but meaning is on a relatively large yardstick, the optional position of plate is in the thickness direction conduction of plate, or meaning is in the thickness direction conduction of plate in the position of arranging by desired spacing, and for basis material, be the situation of low melting point metal material or electric conducting material, unilateal conduction representative mutually insulated between direction wire in the face of plate.It should be noted that above terminological interpretation is only for illustrative purposes, and do not limit the scope of the invention and spirit.

Fig. 1 is by a schematic diagram 1000 that comprises the compact arranged line set adult with outer field wire and manufacture the method for unidirectional electroplax in one embodiment of the invention, wherein numerical chracter 100 represents that comprises a compact arranged line set adult with outer layer conductor, end view and the vertical view of the unidirectional electroplax that 120 and 130 representatives are manufactured by Milliken

conductor conglomerate

100, 131, 132, 133, pore and arrow representative are included in the enlarged diagram with outer field wire and close-packed arrays mode thereof in line set adult 100 or unidirectional electroplax 130.In 131, the wire of signal has very thin skin and equilateral triangle close-packed arrays, in 132 and 133, the wire of signal has certain thickness skin and square close-packed arrays, and wherein in 133, the wire stylet of the wire of signal is a bundle conductor being comprised of multiple conducting wires or a wire rope that multiple conducting wires twists into.Compared with the wire stylet of solid conductor, the wire stylet being comprised of multiple conducting wires has better pliability.

The method of manufacturing described unidirectional electroplax comprises following basic step: 1) provide with outer field wire; 2) getting together with outer field wire, form one and arrange closely, and be solidified into an entirety, thereby make a line set adult that comprises unidirectional compact arranged wire; 3) described line set adult is cut apart in flakes, thereby made multiple unidirectional electroplaxs that conduct electricity at thickness direction as required.Wire stylet in the unidirectional electroplax of making by the above step is not exposed but is embedded in conductive plate, and unidirectional electroplax is the unidirectional electroplax with embedded wire stylet.The unidirectional electroplax that comprises exposed wire stylet in order to be formed in surface, the method of the unidirectional electroplax of above-described manufacture can further comprise following steps: in the part or all of region on the required surface of described unidirectional electroplax, remove the cladding material of basis material and wire, thereby the part or all of region that is formed in described surface has the unidirectional electroplax of exposed wire stylet.The unidirectional electroplax with exposed wire stylet can be manufactured flexible interconnection between electronic device, thereby improves the reliability interconnecting between electronic device.And by selecting basis material or wire stylet, the unidirectional electroplax with embedded wire stylet can be used as conductive adhesive film or is further made into circuit substrate.Although it should be noted that line set adult 100 and the corresponding unidirectional electroplax 130 of having drawn a circle in Fig. 1, its shape needn't be only limited to circle, and can select as required.In addition, the thickness of unidirectional electroplax can determine according to the needs of application, and it can be very thin, thereby unidirectional electroplax becomes a unilateal conduction paper or unidirectional electrolemma, also can be very thick, thereby make toughness between electronic device, connect.In actual applications, described unidirectional electroplax can further be divided into many little unit, and each unit can be used for an IC semiconductor encapsulation or other application.

Fig. 2 is the schematic diagram 2000 of the unidirectional electroplax in one embodiment of the invention, it is made in the close-packed arrays mode of equilateral triangle by the outer field thin wire with very thin, wherein numerical chracter 200 represents that one with very thin outer field thin wire, 201 and 202 represent wire stylet and the skin of described thin wire, end view and the vertical view of the described unidirectional electroplax of 120 and 130 signal, pore, arrow and 131 signals be included in unidirectional electroplax 130 with outer 202 wire 200 and the enlarged drawing of close-packed arrays mode thereof; Wherein 231 represent the basis material that wire 200 is closely bonded together.It should be noted that, in this embodiment, due to described with very little compared with the yardstick of very thin outer field thin wire and a practical application, so needn't be very meticulous and strict to the arrangement of thin wire, as long as a rough close-packed arrays, as indivedual wires can have some little dislocation.In this embodiment, a preferred wire stylet diameter is 5 microns to 30 microns, and outer field thickness is less than 3 microns, and between wire, basis material thickness is less than 2 microns.For example, a preferred dimension combination is that wire stylet diameter is 15 microns, and outer field thickness is 2 microns, and between wire, the thickness of basis material is less than 1 micron.For most of microelectronic component from the pad size of 50 microns to 100 microns and be greater than the solder pad space length of 50 microns, the unidirectional electroplax with described dimension combination the optional position of plate be all thickness direction conduction with face in insulate.

Fig. 2 A is the schematic diagram 3000 of the unidirectional electroplax 120 of the wire stylet that comprises various surface textures, wherein numerical chracter 301,302,303,304,305 represent the partial enlarged drawing of a zonule shown in arrow in unidirectional electroplax 120, and its demonstration is included in the example of the various surface textures of the wire stylet in unidirectional electroplax 120; Shown in 301, be wherein the unidirectional electroplax list with embedded wire stylet, shown in 302 is the unidirectional electroplax list on a surface with exposed wire stylet, shown in 303 is to have step groove at a surperficial exposed wire stylet, and on another surface, there is the unidirectional electroplax list of required pad, shown in 304 is the unidirectional electroplax list on each surface with exposed wire stylet, and shown in 305 is the unidirectional electroplax a surperficial subregion with exposed wire stylet.Numerical chracter 300 in Fig. 2 A represents the yardstick that needs a port of the electronic device connecting with unidirectional electroplax in a practical application, such as a diameter is the pad of 100 microns, because described unidirectional electroplax 120 has adopted with very thin outer field thin wire, such as diameter is the thin wire of 15 microns, described in the scale ratio of described pad, the yardstick of thin wire is much larger, so described pad in the optional position of the upper surface of unidirectional electroplax can with the pad conducting of the relevant position of the lower surface at unidirectional electroplax, described in the ratio in a practical application on the much larger yardstick of thin wire, unidirectional electroplax 120 described in Fig. 2 and Fig. 2 A all conducts electricity at the thickness direction of plate in the optional position of plate, and insulate in face.

Fig. 3 is the schematic diagram 4000 of the unidirectional electroplax in one embodiment of the invention, and it is by making in square close-packed arrays mode with certain thickness outer field wire; Wherein numerical chracter 400 represents that one with certain thickness outer field wire, 401 and 402 represent wire stylet and the skin of described thin wire, wire stylet 401 is wherein wires, end view and the vertical view of the described unidirectional electroplax of 420 and 430 signal, pore, arrow and 432 signals are included in the enlarged drawing with outer 402 wire 400 and square close-packed arrays mode thereof in unidirectional electroplax 430; Wherein 431 represent the basis material that wire 400 is closely bonded together, it can be an electric conducting material.In this embodiment, a preferred wire stylet diameter is 20 microns to 80 microns, and outer field thickness is 10 microns to 25 microns, and between wire, basis material thickness is less than 2 microns.For example, the spacing for the interconnected sizes of 80 microns and 140 microns of pad center to center, a preferred dimension combination is that wire stylet diameter is 60 microns, and outer field thickness is 40 microns, and between wire, the thickness of basis material is less than 1 micron.

Fig. 3 A is the schematic diagram 5000 of the unidirectional electroplax 420 of the wire stylet that comprises various surface textures, wherein numerical chracter 501,502,503 represent the partial enlarged drawing of a zonule shown in arrow in unidirectional electroplax 420, and its demonstration is included in the example of the various surface textures of the wire stylet in unidirectional electroplax 420; Shown in 501, be wherein the unidirectional electroplax list with embedded wire stylet, shown in 502 is the unidirectional electroplax list on a surface with exposed wire stylet, and shown in 503 is the unidirectional electroplax list on each surface with exposed wire stylet.Numerical chracter 500 in Fig. 3 A represents the yardstick of a port that needs the electronic device connecting with unidirectional electroplax in a practical application, such as a diameter is the pad of 100 microns.Wire pitch in the yardstick of described pad and unidirectional electroplax 420 is more or less the same, thus described pad need to align with the wire in unidirectional electroplax just can with the pad conducting of the relevant position of the lower surface at unidirectional electroplax.So, for an actual application, need to design the outer field thickness of the wire in described unidirectional electroplax 420 and the diameter of wire stylet, to mate size and the spacing of pad in practical application.It should be noted that the nuditing wire core shown in Fig. 3 A comprises a thin insulating protection outer, it is not drawn in the drawings.

The advantage of the unidirectional electroplax 120 shown in Fig. 2 is its pads that can be applied to various sizes and spacing, and shortcoming is with the wire of exterior domain, not obtain application at pad; And the advantage of the unidirectional electroplax 420 shown in Fig. 3 is all wires, all obtained application, and shortcoming is to design for each practical application diameter and the outer field thickness of wire, to mate size and the spacing of pad in practical application.

Fig. 4 is the schematic diagram 6000 of the unidirectional electroplax in one embodiment of the invention, and it is by making in square close-packed arrays mode with certain thickness outer field wire; Wherein numerical chracter 600 represents that one with certain thickness outer field wire, 601 and 602 represent wire stylet and the skin of described thin wire, end view and the vertical view of the described unidirectional electroplax of 620 and 630 signal, pore, arrow and 633 signals are included in the enlarged drawing with outer 602 wire 600 and square close-packed arrays mode thereof in unidirectional electroplax 630; Wherein 631 represent the basis material that wire 600 is closely bonded together.The wire stylet 601 of the wire 600 in the unidirectional electroplax 620 shown in Fig. 4 is a bundle conductor being comprised of multiple conducting wires or a wire rope being twisted into by multiple conducting wires.Compared with the wire stylet of solid conductor, the wire stylet of multiple conducting wires composition can be more pliable and tougher in the situation that of equal length and width, thereby increase the reliability of tie point.In addition, the wire in the wire stylet of multiple conducting wires composition can consist of different materials, such as comprise copper cash and welding material line or; Also can comprise SI semi-insulation line, or for the polymeric material stockline of bonding object.

Fig. 4 A is the schematic diagram 7000 of the unidirectional electroplax 700 of the wire stylet that comprises various surface textures, the bundle conductor that wire stylet is wherein comprised of multiple conducting wires, numerical chracter 701,702,703 represent the partial enlarged drawing of a zonule shown in arrow in unidirectional electroplax 700, and its demonstration is included in the example of the various surface textures of the wire stylet in unidirectional electroplax 700; Shown in 701, be wherein the unidirectional electroplax list with embedded wire stylet, shown in 702 is the unidirectional electroplax on a surface with exposed wire stylet, and shown in 703 is the unidirectional electroplax list on each surface with exposed wire stylet.Similar to the unidirectional electroplax 420 shown in Fig. 3 A, for an actual application, need to design diameter and the outer field thickness of the wire in described unidirectional electroplax 700, to mate size and the spacing of pad in practical application.

Fig. 4 B is the schematic diagram 8000 of the unidirectional electroplax 800 of the wire stylet that comprises various surface textures, wire stylet is wherein the wire rope that multiple conducting wires twists into, numerical chracter 801,802,803 represent the partial enlarged drawing of a zonule shown in arrow in unidirectional electroplax 800, and its demonstration is included in the example of the various surface textures of the wire stylet in unidirectional electroplax 800; Shown in 801, be wherein the unidirectional electroplax list with embedded wire stylet, shown in 802 is the unidirectional electroplax on a surface with exposed wire stylet, and shown in 803 is the unidirectional electroplax on each surface with exposed wire stylet.Wire rope shown in Fig. 4 B is compared with the bundle conductor shown in Fig. 4 A, and the wire stylet of multiple conducting wires composition can be more pliable and tougher in the situation that of equal length and width, thereby increases the reliability of tie point.It should be noted that the nuditing wire core shown in Fig. 3 and Fig. 4 also can further have the groove of step, it is not drawn in the drawings.

Fig. 5 comprises the unidirectional electroplax of some further surface texture featurs and the schematic diagram 9000 of manufacturing step thereof in one embodiment of the invention, wherein being and thering is the unidirectional electroplax of nuditing wire core in one side shown in 910, numerical chracter 911 and 912 represents conductor part and the thin insulating protection skin of wire stylet, and 913 represent basis material; 920 are shown in the another kind of basis material 924 of the Surface filling with nuditing wire core shown in 910 and make the unidirectional electroplax with two-layer matrix material structure; Circuit 935 and pad 936 are manufactured in 920 surfaces that are shown in the basis material 924 shown in 920; 940 are shown in the unidirectional electroplax of the existing circuit 935 shown in 930 and pad 936 and remove original basis material 913; A welding material head is adhered in 950 and 960 ends that are shown in nuditing wire core; wherein 950 ends that are shown in nuditing wire core are first removed the outer welding end 951 that is shown in nuditing wire core to expose welding end 951,960 of the nonweldable thin insulating of sub-fraction protection and are adhered to a welding material head 961.It is to be noted, manufacturing step shown in 9000 has been realized the replacement of a basis material in described unidirectional electroplax, this replacement has certain meaning in actual applications, as a required base material layer with as described in technique for sticking make be difficult, and make on surface, be easy, in this case, the manufacture method of this replacement basis material has using value.

It should be noted that, the wire stylet in the drawings attached explanation of above institute has a thin insulation protection skin, and as the insulating outer layer of anti-environmental corrosion and oxidation, this protection skin only draws in Fig. 5.When wire stylet has a thin insulating skin, basis material beyond wire stylet can need not to be insulating material, also can be a kind of conducting base, as a kind of low-melting-point metal, thereby the matrix of described unidirectional electroplax is the conduction region of a UNICOM, and each root wire stylet is an independently conductive channel.Unidirectional electroplax so also has certain using value.

It should be noted that, the surface texture of unidirectional electroplax shown in the drawings is only signal explanation above, as the unidirectional electroplax in Fig. 3 and Fig. 4 also can be manufactured required pad or circuit and pad on its surface, and for example for the wire stylet that is not welding material, welding material is adhered in the end of wire stylet that can be exposed in unidirectional electroplax, thereby make the unidirectional electroplax that comprises the nuditing wire core with welding material head, but these expansions of the present invention do not draw in addition in all accompanying drawings, so above, with reference to embodiment and accompanying drawing, illustrate that the description of this invention is only for illustrating, rather than restriction the spirit and scope of the present invention, be familiar with this operator and obtain equivalent embodiment when modifying accordingly.

Claims

1. at a unidirectional electroplax for thickness direction conduction, comprising:

The wire of unidirectional array, wire wherein comprises wire stylet and sets the skin of thickness;

Basis material, the wire of its described unidirectional array is bonding and be solidified togather;

Wherein said wire stylet is characterised in that:

It is the conductive channel along plate thickness direction with insulation protection skin;

Wherein each root wire stylet consists of a wire or the bundle conductor or the wire rope that by multiple conducting wires, are formed form;

It has from the length of approximately 20 microns to approximately 1000 millimeters, preferably, has from the length of approximately 100 microns to approximately 20 millimeters,

It has from approximately 2 to approximately 2000 aspect ratio, preferably, has from approximately 5 to approximately 200 aspect ratio.

2. unidirectional electroplax as claimed in claim 1, it is characterized in that, wherein said wire stylet forms one and arranges closely, have and be less than approximately 10 microns, preferably be less than the spacing from wire stylet edge to wire stylet edge of approximately 5 microns, and there is the diameter that is less than approximately 30 microns, be preferably less than the diameter of approximately 20 microns.

3. unidirectional electroplax as claimed in claim 1, it is characterized in that, wherein said wire stylet forms one and has the regularly arranged of setting spacing, have from approximately 10 microns to approximately 500 microns, preferably from the wire stylet edge of 20 microns to 150 microns to the spacing at wire stylet edge, and have from approximately 10 microns to approximately 100 microns, preferably from the diameter of approximately 20 microns to approximately 60 microns.

4. unidirectional electroplax as claimed in claim 1, is characterized in that, the wire stylet of the wherein said bundle conductor being formed by multiple conducting wires or wire rope form is not limited to comprise identical wire, also comprises some other wire or non-wire.

5. unidirectional electroplax as claimed in claim 1, is characterized in that, the skin of described wire has sandwich construction, and wherein outermost layer can be solidified togather under certain temperature or pressure, replaces described basis material bonding described wire and be solidified togather.

6. unidirectional electroplax as claimed in claim 1, it is characterized in that, basis material in described unidirectional electroplax becomes and has cementability or wire stylet is low-melting-point metal at the temperature of setting, thereby described unidirectional electroplax is a unidirectional electroplax at the temperature of setting with adhesive property.

7. unidirectional electroplax as claimed in claim 1, is characterized in that, in described unidirectional electroplax, basis material is the multilayer material arranging along plate thickness direction.

8. unidirectional electroplax as claimed in claim 1, it is characterized in that, basis material bonding described wire stylet and that be solidified togather, it is electric conducting material, thereby the matrix of described unidirectional electroplax is the conduction region of a UNICOM, and each root wire stylet be one independently along the conductive channel of plate thickness direction.

9. unidirectional electroplax as claimed in claim 1, it is characterized in that, described unidirectional electroplax has length from approximately 20 microns to approximately 1000 millimeters in the part or all of region on a surface or each surface, preferably from the exposed wire stylet of approximately 100 microns to approximately 20 millimeters.

10. unidirectional electroplax as claimed in claim 1, it is characterized in that, a surface of described unidirectional electroplax has pad or circuit and the pad of setting, and on another surface, has length from approximately 20 microns to 1000 millimeters, preferably from the exposed wire stylet of approximately 100 microns to approximately 20 millimeters.

11. unidirectional electroplaxs as claimed in claim 1, is characterized in that, a surface of described unidirectional electroplax or each surface have pad or circuit and the pad of setting.

12. as claim 9 or unidirectional electroplax claimed in claim 10, it is characterized in that, described exposed wire stylet has different length, forms groove or step groove.

13. unidirectional electroplaxs as described in claim 9 or claim 10 or claim 12, is characterized in that, the end of described exposed wire stylet is attached with welding material head.

Manufacture the method for unidirectional electroplax for 14. 1 kinds, the method comprises:

Provide with outer field wire;

Being closely aligned and being solidified into an entirety by a basis material with outer field wire being unidirectional, thereby make a line set adult that comprises unidirectional array wire;

Described line set adult is cut apart in flakes by desired thickness, thereby made multiple unidirectional electroplaxs in thickness direction conduction.

The method of the unidirectional electroplax of 15. manufacture as claimed in claim 14, it is characterized in that, when arranging wire, the spacing setting between wire for being less than 10 microns, preferably be less than 5 microns, thereby described wire forms a unidirectional arrangement closely, and wherein the spacing of wire stylet from wire stylet edge to wire stylet edge mainly set by the outer field thickness of wire.

The method of the unidirectional electroplax of 16. manufacture as claimed in claim 14, it is characterized in that, the skin of described wire has sandwich construction, wherein outermost material is mutually solidified togather under certain temperature or pressure, thereby remove from, uses other basis material to go bonding described wire and be solidified into an entirety.

The method of the unidirectional electroplax of 17. manufacture as claimed in claim 14, the method further comprises following steps:

On a surface of described unidirectional electroplax or the part or all of region on each surface remove the skin of certain thickness basis material and wire, thereby the part or all of region that is formed in described surface has the unidirectional electroplax of exposed wire stylet.

The method of the unidirectional electroplax of 18. manufacture as claimed in claim 14, the method further comprises following steps:

Pad or circuit and the pad set are manufactured in a surface at described unidirectional electroplax, and at the skin of the certain thickness basis material of another surface removal and wire, to be formed in a surface, there is pad or circuit and the pad of setting, and on another surface, there is the unidirectional electroplax of exposed wire stylet.

The method of the unidirectional electroplax of 19. manufacture as claimed in claim 14, the method further comprises following steps:

On a surface, by removing the skin of certain thickness basis material and wire, make after exposed wire stylet, between exposed wire stylet, fill again another basis material to form another base material layer, thereby make the unidirectional electroplax with substrates multilayer material.

The method of 20. unidirectional electroplaxs of manufacture as described in claim 17 or claim 18, the method further comprises following steps:

When manufacturing exposed wire stylet, in subregion, remove the wire stylet of certain length, thereby in exposed wire stylet is arranged, make the groove of groove or step.

The method of the unidirectional electroplax of 21. manufacture as claimed in claim 19, the method further comprises following steps:

Pad or circuit and the pad set are manufactured in surface at described newly-generated base material layer.

The method of 22. unidirectional electroplaxs of manufacture as described in claim 19 or claim 21, the method further comprises following steps:

Remove original base material layer, thereby in described unidirectional electroplax, realize a replacement of base material layer.

The method of 23. unidirectional electroplaxs of manufacture as described in claim 17 or claim 18 or claim 20 or claim 22, the method further comprises following steps:

At the additional welding material in the end of described nuditing wire core, thereby on the surface of described unidirectional electroplax, make the nuditing wire core that comprises welding material head.