CN103794711B - Be applicable to the LED of laser weld - Google Patents
Be applicable to the LED of laser weld Download PDFInfo
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- CN103794711B CN103794711B CN201410042417.4A CN201410042417A CN103794711B CN 103794711 B CN103794711 B CN 103794711B CN 201410042417 A CN201410042417 A CN 201410042417A CN 103794711 B CN103794711 B CN 103794711B
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- 238000003466 welding Methods 0.000 claims abstract description 49
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 19
- 239000010935 stainless steel Substances 0.000 claims abstract description 19
- 230000007704 transition Effects 0.000 claims abstract description 9
- 230000006698 induction Effects 0.000 claims description 7
- 239000003302 ferromagnetic material Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 36
- 238000005476 soldering Methods 0.000 abstract description 6
- 230000035939 shock Effects 0.000 abstract description 5
- 230000002411 adverse Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 230000005291 magnetic effect Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/011—Groups of the periodic table
- H01L2924/01103—Transition metals
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
适合激光焊接的LED，包括LED芯片和与外界的连接界面，其特征是LED的两端各制作一块以上带波纹状过渡段的不锈钢薄板叠焊平片。本发明适合激光焊接的LED提供一种适合工业化生产的玻璃热管LED灯具的LED。激光焊接克服了锡焊焊接时间长、焊接强度可能不够的缺陷；不锈钢薄板叠焊平片强度高、激光叠焊不锈钢薄板焊接牢固，可以在常温下实现焊接、速度快，焊接过程对玻璃热管管壁的热冲击小。采用带波纹状过渡段的叠焊平片可以减缓LED与LED电路板之间可能存在的有害应力产生的负面影响、可以减缓对玻璃热管的不利机械作用力、热冲击和传热。
LEDs suitable for laser welding, including LED chips and the connection interface with the outside world, are characterized in that more than one stainless steel sheet with a corrugated transition section is made at each of the two ends of the LED. The LED suitable for laser welding provided by the invention provides an LED suitable for industrial production of glass heat pipe LED lamps. Laser welding overcomes the defects of long soldering time and insufficient welding strength; the flat plate of stainless steel sheet welding has high strength, laser welding of stainless steel sheet is firm, and welding can be realized at room temperature with fast speed. The thermal shock to the wall is small. The use of a lap-welded flat sheet with a corrugated transition section can slow down the negative impact of harmful stress that may exist between the LED and the LED circuit board, and can slow down the adverse mechanical force, thermal shock and heat transfer on the glass heat pipe.
Description
技术领域technical field
本发明涉及适合激光焊接的LED。LED是激光发光两极管的英语简称，可以看作是本技术领域公认的专业术语。The present invention relates to LEDs suitable for laser welding. LED is the English abbreviation of laser light-emitting diode, which can be regarded as a professional term recognized in the technical field.
背景技术Background technique
现有的电子线路板多采用波峰焊，对于贴置与玻璃热管表面要求传热连接的LED，因为LED表面会受到液态锡的冲击，不适用波峰焊。为了降低热阻，对LED往往需要在玻璃热管表面点胶后再行焊接。这时如采用锡焊，则为了防止在锡冷却结晶过程中的LED位移，需要复杂的工位器具；并且所述锡焊过程也过长。Most of the existing electronic circuit boards use wave soldering. For LEDs that require heat transfer connection to the surface of the glass heat pipe, because the surface of the LED will be impacted by liquid tin, wave soldering is not suitable. In order to reduce thermal resistance, LEDs often need to be soldered after dispensing glue on the surface of the glass heat pipe. At this time, if soldering is adopted, in order to prevent the displacement of the LED during the tin cooling and crystallization process, complicated station equipment is required; and the soldering process is also too long.
发明内容Contents of the invention
本发明的目的是要提供适合激光焊接的LED。The object of the present invention is to provide LEDs suitable for laser welding.
本发明解决其技术问题的技术方案：制造一个适合激光焊接的LED，包括LED芯片和与外界的连接界面。LED的两端各制作一块以上带波纹状过渡段的不锈钢薄板叠焊平片。The technical solution of the present invention to solve the technical problem: manufacture an LED suitable for laser welding, including the LED chip and the connection interface with the outside world. Each of the two ends of the LED is made of more than one stainless steel sheet with a corrugated transition section.
还可以采用“X”形状的叠焊焊缝。Stitch welds in the shape of an "X" are also available.
还可以采用设置于正反两面的两个发光面。It is also possible to use two light-emitting surfaces arranged on the front and back sides.
还可以令所述叠焊平片为铁磁材料。It is also possible to make the lap welding flat sheet be a ferromagnetic material.
本发明的有益效果：本发明适合激光焊接的LED提供一种适合工业化生产的玻璃热管LED灯具的LED，克服了锡焊焊接时间长、焊接强度可能不够的缺陷；不锈钢薄板叠焊平片强度高、激光叠焊不锈钢薄板焊接牢固，可以在常温下实现焊接、速度快，焊接过程对玻璃热管管壁的热冲击小。采用带波纹状过渡段的叠焊平片可以减缓LED与LED电路板之间可能存在的有害应力产生的负面影响、可以减缓对玻璃热管的不利机械作用力、热冲击和传热。Beneficial effects of the present invention: the LED suitable for laser welding provided by the present invention provides an LED suitable for industrial production of glass heat pipe LED lamps, which overcomes the defects of long soldering time and insufficient welding strength; stainless steel thin plate lap welding flat plate has high strength ,Laser stitch welding stainless steel thin plate welding is firm, can realize welding at room temperature, the speed is fast, and the thermal impact of the welding process on the glass heat pipe wall is small. The use of a lap-welded flat sheet with a corrugated transition section can slow down the negative impact of harmful stress that may exist between the LED and the LED circuit board, and can slow down the adverse mechanical force, thermal shock and heat transfer on the glass heat pipe.
附图说明Description of drawings
下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
图1是一个采用单支玻璃热管的玻璃热管LED灯具结构示意图。Fig. 1 is a schematic structural diagram of a glass heat pipe LED lamp using a single glass heat pipe.
图2是一个玻璃热管LED灯具的LED电路板结构示意图，是对图1LED电路板的正面描述。FIG. 2 is a schematic structural diagram of an LED circuit board of a glass heat pipe LED lamp, which is a frontal description of the LED circuit board in FIG. 1 .
图3是一个具有圆台状冷端的玻璃热管结构示意图，是对图1玻璃热管的专门描述。FIG. 3 is a structural schematic diagram of a glass heat pipe with a frustum-shaped cold end, which is a special description of the glass heat pipe in FIG. 1 .
图4是一个玻璃热管LED灯具采用激光叠焊LED叠焊平片的正视结构示意图。Fig. 4 is a front view structural diagram of a glass heat pipe LED lamp adopting laser stitch welding of LED stitch welding flat sheets.
图5是一个玻璃热管LED灯具采用激光叠焊LED叠焊平片的上视结构示意图。Fig. 5 is a top structural schematic diagram of a glass heat pipe LED lamp adopting laser stitch welding of LED stitch welding flat sheets.
图6是一个LED的正视结构示意图。Fig. 6 is a schematic diagram of the front view structure of an LED.
图7是一台LED激光焊接设备进行焊接的工作原理和正视结构示意图。Fig. 7 is a schematic diagram of the working principle and front view structure of an LED laser welding equipment for welding.
图中1.玻璃热管；2.LED；3.驱动电源；5.与外界的电气连接界面；6.匀光片；7.排气管；11.LED电路板；12.导电线路；13.控制系统；15.LED连接界面；19.LED孔；20.“X”形状的叠焊焊缝；21.磁性连接件；22.透明导热粘结材料；23.波纹状过渡段；24.叠焊平片；25.人机界面；26.线路板上不锈钢薄板；27.LED拾取机械手；28.激光焊接器件发射端；29.高频感应发射线圈；30.吸爪。In the figure 1. glass heat pipe; 2. LED; 3. drive power supply; 5. electrical connection interface with the outside world; 6. uniform light sheet; 7. exhaust pipe; 11. LED circuit board; 12. conductive circuit; 13. Control system; 15. LED connection interface; 19. LED hole; 20. "X" shaped lap welding seam; 21. Magnetic connector; 22. Transparent heat-conducting adhesive material; 23. Corrugated transition section; 24. Lamination Welding flat sheet; 25. Man-machine interface; 26. Stainless steel sheet on circuit board; 27. LED pick-up manipulator; 28. Laser welding device transmitting end; 29. High-frequency induction transmitting coil; 30. Suction claw.
具体实施方式detailed description
图1至3共同给出本发明第一个实施例。1 to 3 collectively show a first embodiment of the invention.
图1至3中，玻璃热管LED灯具包括玻璃热管1、LED2、驱动电源3、与外界的电气连接界面5、匀光片6和控制系统13。玻璃热管1包括玻璃管壳、排气管7和工质；控制系统13包括人机界面25；人机界面25与控制系统主控电路之间可以作有线或者无线信号连接。In FIGS. 1 to 3 , the glass heat pipe LED lamp includes a glass heat pipe 1 , LED 2 , a driving power supply 3 , an electrical connection interface 5 with the outside world, a dodging sheet 6 and a control system 13 . The glass heat pipe 1 includes a glass shell, an exhaust pipe 7 and a working medium; the control system 13 includes a man-machine interface 25; the man-machine interface 25 and the main control circuit of the control system can be connected with wired or wireless signals.
根据需要还可以在玻璃热管1内部设置吸液芯网。工质包括水和乙醇。如果产品使用场合以及储运过程中可能结冰的话，可选择乙醇作为工质。与外界的电气连接界面5采用可以使用螺口灯座的灯泡螺口和电线。LED2与玻璃热管1热端传热连接。图1至3中，并排向里的箭头表示热管热端，热管热端吸收热能；并排向外的箭头表示热管冷端，热管冷端释放热能。A liquid-absorbing wick net can also be arranged inside the glass heat pipe 1 as required. Working fluids include water and ethanol. Ethanol can be selected as the working medium if the product may freeze in the application occasion and during storage and transportation. The electric connection interface 5 with the outside adopts the bulb screw socket and electric wire that can use screw socket lamp holder. The LED2 is connected to the hot end of the glass heat pipe 1 for heat transfer. In Figures 1 to 3, arrows aligned inward indicate the hot end of the heat pipe, which absorbs heat energy; arrows aligned outward indicate the cold end of the heat pipe, which releases heat energy.
玻璃热管1热端外侧含有LED电路板11。LED电路板11包括绝缘基板以及制作于绝缘基板上的导电线路12、LED连接界面15和加强层。加强层采用多孔钢板埋置于绝缘基板内部。多孔钢板加强层重量轻、强度有保证、其空洞部分不影响导体穿越LED电路板11。至少两处以上导电线路12相互之间不直接电气连接。LED电路板11的内侧表面与玻璃热管1热端的外表面相吻合。The outside of the hot end of the glass heat pipe 1 contains an LED circuit board 11 . The LED circuit board 11 includes an insulating substrate, a conductive circuit 12 fabricated on the insulating substrate, an LED connection interface 15 and a strengthening layer. The reinforcement layer is embedded in the insulating substrate with porous steel plates. The reinforced layer of the porous steel plate is light in weight and guaranteed in strength, and its hollow part does not affect the conductor passing through the LED circuit board 11 . At least two conductive lines 12 are not directly electrically connected to each other. The inner surface of the LED circuit board 11 coincides with the outer surface of the hot end of the glass heat pipe 1 .
LED电路板11含有若干LED孔19，LED孔19内放置LED2。各LED孔19的边缘含有两处LED连接界面15。LED连接界面15与玻璃热管1之间采用隔热设计。LED2布置于LED孔19内并通过弹性导热膜或者透明导热粘结材料与玻璃热管1热端传热连接。The LED circuit board 11 contains several LED holes 19, and the LED 2 is placed in the LED holes 19. The edge of each LED hole 19 contains two LED connection interfaces 15 . A heat insulation design is adopted between the LED connection interface 15 and the glass heat pipe 1 . The LED 2 is arranged in the LED hole 19 and is thermally connected to the hot end of the glass heat pipe 1 through an elastic heat-conducting film or a transparent heat-conducting adhesive material.
匀光片6通过设置于匀光片6上的永磁磁性连接件21与设置于玻璃热管1上的永磁磁性连接件21相互磁吸实现与玻璃热管1的连接。所述设置包括注塑件的预埋和粘结。The dodging sheet 6 is connected to the glass heat pipe 1 through mutual magnetic attraction between the permanent magnet magnetic connector 21 arranged on the dodging sheet 6 and the permanent magnet magnetic connector 21 arranged on the glass heat pipe 1 . The setting includes embedding and bonding of injection molded parts.
实施例1中LED连接界面15的有关内容还可以参考图4和图5的实施例2。实施例1的内容也有助于对实施例2的理解。For the relevant content of the LED connection interface 15 in the first embodiment, reference may also be made to the second embodiment in FIG. 4 and FIG. 5 . The content of Example 1 is also helpful for the understanding of Example 2.
图4和图5共同给出本发明第二个实施例。Figures 4 and 5 together show a second embodiment of the present invention.
图4和图5中，在玻璃热管1热端贴置一块LED电路板11。LED电路板11上设置有导电线路12和LED孔19用于安置LED2。制作于LED电路板11上的LED连接界面15采用厚度0.4毫米的线路板上不锈钢薄板26。LED连接界面15与玻璃热管1之间采用隔热设计以减轻对玻璃热管1的热冲击和传热。LED2与玻璃热管1的接触面上凃制有透明导热粘结材料22。LED2两端分别通过带波纹状过渡段23的叠焊平片24与LED连接界面15线路板上不锈钢薄板26上下相叠。两块厚度0.4毫米的相叠不锈钢板采用激光进行叠焊。叠焊平片24和连接界面15线路板上不锈钢薄板26的厚度尺寸可以调节。LED连接界面15线路板上不锈钢薄板26要经历激光焊接，因此其下方的LED电路板11所埋置的加强层应该保留钢板。In FIGS. 4 and 5 , an LED circuit board 11 is pasted on the hot end of the glass heat pipe 1 . The LED circuit board 11 is provided with a conductive circuit 12 and an LED hole 19 for arranging the LED 2 . The LED connection interface 15 fabricated on the LED circuit board 11 adopts a thin stainless steel plate 26 on the circuit board with a thickness of 0.4 mm. A thermal insulation design is adopted between the LED connection interface 15 and the glass heat pipe 1 to reduce thermal shock and heat transfer to the glass heat pipe 1 . A transparent heat-conducting adhesive material 22 is coated on the contact surface of the LED 2 and the glass heat pipe 1 . Both ends of the LED2 are stacked up and down with the stainless steel thin plate 26 on the circuit board of the LED connection interface 15 through the lap welding flat sheet 24 with the corrugated transition section 23 respectively. Two stacked stainless steel plates with a thickness of 0.4 mm are stitch welded by laser. The thickness of the thin stainless steel plate 26 on the lap welding flat sheet 24 and the connecting interface 15 circuit board can be adjusted. The thin stainless steel plate 26 on the circuit board of the LED connection interface 15 needs to undergo laser welding, so the reinforcement layer embedded in the LED circuit board 11 below it should retain the steel plate.
采用多点叠焊譬如图5中描述的叠焊平片24上的3点叠焊可以增加焊接连接的可靠性。采用带波纹状过渡段23的叠焊平片可以减缓LED2与LED电路板11之间可能存在的有害应力产生的负面影响、可以减缓对玻璃热管1的不利机械作用力、热冲击和传热。The reliability of the welded connection can be increased by using multi-point stitch welds, such as 3-point stitch welds on the stitch weld flat sheet 24 depicted in FIG. 5 . The use of the seam welded flat sheet with the corrugated transition section 23 can slow down the negative impact of harmful stress that may exist between the LED 2 and the LED circuit board 11 , and can slow down the adverse mechanical force, thermal shock and heat transfer on the glass heat pipe 1 .
还可以将叠焊焊缝设计成如两条交叉虚线所示的“X”形状20。It is also possible to design the stitch weld in an "X" shape 20 as shown by the two intersecting dashed lines.
采用设置于正反两面的两个发光面的LED可以透过玻璃热管管壁发光，实现360度照明。The LEDs on the two light-emitting surfaces arranged on the front and back sides can emit light through the wall of the glass heat pipe to realize 360-degree lighting.
图6给出本发明第三个实施例。Fig. 6 shows a third embodiment of the present invention.
图6中，制造一个激光焊接LED2，包括LED芯片和与外界连接的LED连接界面。LED2的两端各制作一块以上带波纹状过渡段23的不锈钢薄板叠焊平片24。In Fig. 6, a laser welding LED2 is manufactured, including the LED chip and the LED connection interface connected with the outside world. Each of the two ends of the LED2 is made of more than one stainless steel thin plate lap welding flat piece 24 with a corrugated transition section 23 .
图7给出本发明第四个实施例。Fig. 7 shows a fourth embodiment of the present invention.
图7中，制造一台LED激光焊接设备，包括LED拾取机械手27、激光发生器、激光焊接器件发射端28、高频感应发射线圈29和控制系统。LED拾取机械手27为一副两组每组一个以上与负压源连通的吸爪30，它可以吸住和释放LED2。高频感应发射线圈29可以通过如图7两个并排的长环形虚线所示的磁力线与负荷线路板上不锈钢薄板26或者叠焊平片24构成电磁回路，并在线路板上不锈钢薄板26或者叠焊平片24是产生涡流电流。图7中的激光焊接设备可以上下移动。当其往下移动到虚线图案所示位置时可以吸住LED2并将其放入LED电路板11的LED孔19中。高频感应发射线圈29和激光焊接器件发射端28的状态根据控制系统的状态变化而变化。在将LED电路板11贴装于玻璃热管1上；令LED激光焊接设备的高频感应发射线圈对线路板上不锈钢薄板26发射高频电磁波进行加热；用与负压源连通的吸爪30吸住所述LED2，在LED2下表面涂制透明导热粘结材料22，将LED2布置于LED孔19内使之与玻璃热管1粘连贴合实现与玻璃热管1的低热阻连接并使LED2两端的叠焊平片24叠压在LED孔19边缘的线路板上不锈钢薄板26上，令LED激光焊接设备的高频感应发射线圈29对所述叠焊平片24发射高频电磁波进行加热，用激光焊接器件发射端28将叠焊平片24与线路板上不锈钢薄板26叠焊在一起。In Fig. 7, an LED laser welding equipment is manufactured, including an LED pick-up manipulator 27, a laser generator, a laser welding device transmitting end 28, a high-frequency induction transmitting coil 29 and a control system. The LED pick-up manipulator 27 is a pair of two groups of suction claws 30 each with more than one connected to the negative pressure source, which can hold and release the LED2. The high-frequency induction transmitting coil 29 can form an electromagnetic circuit with the stainless steel thin plate 26 or lap welding flat sheet 24 on the load circuit board through the magnetic force lines shown in two parallel long annular dotted lines in Fig. Welding flat sheet 24 is to produce eddy current. The laser welding equipment in Fig. 7 can move up and down. When it moves down to the position shown by the dotted line pattern, it can suck the LED2 and put it into the LED hole 19 of the LED circuit board 11 . The state of the high-frequency induction transmitting coil 29 and the transmitting end 28 of the laser welding device changes according to the state of the control system. Mount the LED circuit board 11 on the glass heat pipe 1; make the high-frequency induction transmitting coil of the LED laser welding equipment heat the stainless steel sheet 26 on the circuit board to emit high-frequency electromagnetic waves; use the suction claw 30 connected with the negative pressure source to suck Hold the LED2, apply a transparent heat-conducting adhesive material 22 on the lower surface of the LED2, and arrange the LED2 in the LED hole 19 so that it adheres to the glass heat pipe 1 to achieve a low thermal resistance connection with the glass heat pipe 1 and make the two ends of the LED2 lap welded. The flat sheet 24 is laminated on the thin stainless steel plate 26 on the circuit board at the edge of the LED hole 19, and the high-frequency induction transmitting coil 29 of the LED laser welding equipment emits high-frequency electromagnetic waves for heating the laminated flat sheet 24, and the device is welded by laser The transmitting end 28 welds the flat plate 24 and the thin stainless steel plate 26 on the circuit board together.
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| US6392778B1 (en) * | 1999-03-17 | 2002-05-21 | Koninklijke Philips Electronics N.V. | Opto-electronic element |
| CN103250472A (en) * | 2010-11-05 | 2013-08-14 | 贺利氏材料工艺有限及两合公司 | Chip-integrated plated through-holes on multilayer substrates |
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| US6392778B1 (en) * | 1999-03-17 | 2002-05-21 | Koninklijke Philips Electronics N.V. | Opto-electronic element |
| CN103250472A (en) * | 2010-11-05 | 2013-08-14 | 贺利氏材料工艺有限及两合公司 | Chip-integrated plated through-holes on multilayer substrates |
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