CN103929883B - Method for manufacturing monocrystal COB packaging aluminum substrate of bowl hole shape - Google Patents

Abstract

The invention relates to a manufacturing method of a single-crystal COB packaged cup-shaped aluminum substrate. Wire pad surface treatment → (4) Drill reference holes → (5) Drill bowl and cup holes → (6) Ultrasonic cleaning and lamination of protective film → (7) CNC drilling and milling shape → (8) Inspection and shipment. The processed product of the present invention has good light efficiency, the bottom of the bowl and cup hole is bright and smooth, without processing knife lines, and the processing depth error is small, thereby ensuring the consistency of the light emitting angle of the LED chip. The method is reasonable in technology, strong in practicability, and has great advantages Strong market application prospects.

Description

A method for manufacturing a single-crystal COB package bowl-cup hole-shaped aluminum substrate

technical field

The invention relates to a method for manufacturing a single-crystal COB packaged bowl-cup hole-shaped aluminum substrate.

Background technique

COB (chip on board package) is one of the bare chip mounting technologies. In the field of semiconductor packaging, the semiconductor chip is usually handed over and mounted on the circuit substrate. The electrical connection between the chip and the substrate is realized by wire bonding. Resin covers to ensure reliability, but the packaging of LED light source chips has its own particularity, mainly based on the establishment of physical connections between chips and chip substrates, and the need to maintain the reflectivity of LED chips. The existing packaging Technology, the insulation layer is made of epoxy resin prepreg, the epoxy resin layer is generally light yellow, the reflection is not good, and its Tg is only about 140 ° C, the temperature of the center point of the LED light source is about 100 ° C during the use of the LED light source. Long-term use, the insulating layer will easily turn yellow, and the color will deepen, which will seriously affect the light efficiency of the light source. Moreover, the processing of the bowl-cup hole-shaped crystal-bonding area on the surface of the existing aluminum base is to directly fix the aluminum substrate on the workbench for drilling. This operation not only wastes a lot of time when fixing the aluminum substrate, but also presses the aluminum substrate. Around the substrate, in the middle of the board or other places that are not under pressure, there is still a phenomenon that it is not tightly attached to the work surface. Therefore, the processed products often have uneven bottoms of bowls and cup holes, and there are processing knife lines. In 200*300 In the area, the processing depth error is greater than +/-0.05mm, etc., so the consistency of the light emitting angle of the LED chip cannot be guaranteed.

Contents of the invention

The purpose of the present invention is to overcome the defects existing in the prior art, and provide a method for manufacturing a single-crystal COB packaged cup hole-shaped aluminum substrate.

The technical solution for realizing the object of the present invention is: a method for manufacturing a single-crystal COB packaged cup-shaped aluminum substrate, comprising the following steps:

(1) Aluminum-based copper clad laminate preparation;

(2) Production of aluminum substrate circuit graphics and solder mask;

(3) Surface treatment of bonding pads;

(4) Drill the reference hole;

(5) Drill bowl and cup holes;

(6) Ultrasonic cleaning and lamination of protective film;

(7) CNC drilling and milling shape;

(8) Inspection and shipment.

As an optimization, the steps are as follows:

(1) Aluminum base copper clad laminate preparation:

(a) One-time cutting: use electric shears to cut the entire aluminum material into the size specifications required for production, and select 5052H34 aluminum material from Southwest Aluminum;

(b) One-time brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the aluminum material, and the mesh number of the brush roller is 320 mesh;

(c) Surface degreasing: Soak the aluminum material with 10% to 30% NaOH aqueous solution for 10 to 20 minutes at a temperature of 20 to 30°C to remove oxidation and grease impurities on the surface of the aluminum material;

(d) Anodizing: Put the degreased aluminum material in 20% to 30% _H2SO4 aqueous solution for ₂₀ to 40 minutes of anodic oxidation at a temperature of 20 to 25°C and a current density of 2 to 5A/dm ² ;

(e) Cleaning and drying: wash the anodized aluminum material with clean water, and then dry it on a dryer at a drying temperature of 80-100°C;

(f) Coupling agent: coated on one side of the aluminum material with epoxy-based coupling agent KH-560;

(g) Drying: put the aluminum coated with the coupling agent in an oven and bake for 10 minutes at a temperature of 170°C;

(h) Lamination pressing: the order of lamination is copper foil, insulating layer, aluminum material, the pressing conditions are pressure 6-12Kg/cm ² , temperature 180-190°C, and time 120 minutes;

(i) Edge trimming: according to the size of the product, use an electric shear to remove the edge of the pressed plate after pressing;

(j) Paste the aluminum surface protective film: on the aluminum material on the back of the laminated aluminum-based copper clad laminate, use a film laminating machine to paste a layer of protective film to prevent damage to the aluminum material during subsequent processing;

(2) Production of aluminum substrate circuit graphics and solder mask:

(a) Secondary cutting: Use an electric shear to cut the entire aluminum-based copper-clad laminate into the size specifications required for production;

(b) Secondary brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the copper clad laminate, and the mesh number of the brush roller is 500 mesh;

(c) Printing wet film: use the method of screen printing to evenly coat a layer of photosensitive wet film on the copper foil on the surface of the copper clad laminate after the second printing;

(d) One-time pre-baking: place the copper-clad laminate with printed wet film in an oven and bake at a temperature of 70-80°C for 20-30 minutes;

(e) One-time exposure: Cover the pre-baked copper-clad board with the pre-painted circuit film, and expose it with an 8KW ultraviolet exposure machine, so that the circuit pattern on the film is transferred to the copper-clad board, and the energy setting value is 350 mm coke;

(f) One-time development: The copper-clad laminate after one exposure is developed by a developing machine, the developer solution is 1%-3% anhydrous sodium carbonate, the temperature is 28-32°C, the time is 1-2 minutes, and the spray pressure is 1-2 minutes. 5Kg/cm ² ;

(g) Inspection: check the integrity of the circuit graphics;

(h) Etching: Use acidic copper chloride etching solution to corrode the copper layer not covered by the wet film, and keep the required copper foil. The conditions of the etching solution: the copper content is 140 ~ 180g/l, and the acid content is 2 ~ 3N, the oxidation-reduction potential is 450-550mv, and the temperature is 49-54°C;

(i) film removal: use 3% to 5% sodium hydroxide solution to remove the wet film on the etched circuit surface;

(j) Three times of brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the circuit substrate, and the mesh number of the brush roller is 500 mesh;

(k) Printing solder resist white oil: use screen printing method to evenly coat a layer on the surface of the circuit substrate after the third brushing, and evenly coat a layer on the surface of the circuit substrate after the second brushing. The model is Sun PSR2000CE800W Photosensitive solder resist white oil;

(l) Secondary pre-baking: place the circuit substrate printed with solder resist white oil in an oven and bake at a temperature of 70-80°C for 20-30 minutes;

(m) Secondary exposure: Cover the pre-painted solder resist film on the circuit substrate after the second pre-baking, and expose it with an 8KW ultraviolet exposure machine, so that the solder resist pattern on the film is transferred to the copper clad board, and the energy The set value is 950 mJ;

(n) Secondary development: the circuit substrate after secondary exposure is developed by a developing machine, the developer solution is 1% to 3% anhydrous sodium carbonate, the temperature is 28 to 32°C, the time is 1 to 2 minutes, and the spray pressure is 1～5Kg/cm ² ;

(o) Post-curing: place the circuit substrate after the second development in an oven and bake, and completely cure the solder resist white oil at a baking temperature of 150°C for 60 minutes;

(3) Surface treatment of wire bonding pads: Atotech Universal ASF II chemical nickel-palladium-gold system is adopted, and a layer of alloy coating is plated on the surface of the wire bonding pads;

(4) Drill the reference hole: use the automatic image punching machine to first identify the pattern of the line positioning hole, and then drill the positioning hole with a diameter of 2.0mm;

(5) Bowl and cup hole drilling: After joint positioning with positioning pins and vacuum suction cups, use high-speed precision machine tool SZX5540-Ⅱ and natural diamond single-edged milling cutters to drill and mill bowl-shaped holes. 2° included angle;

(6) Ultrasonic cleaning and lamination of protective film: Use cleaning solution RS-1609 to clean the substrate with drilled cup holes in an ultrasonic cleaning machine. It is equal to 6Kg/cm ² first-level high-pressure water washing, then passes through cold air, and then dries with hot air at 80-90°C, and then sticks a medium-viscosity protective film on the circuit surface with a hot pressing roller;

(7) CNC drilling and milling shape;

(8) Inspection and shipment.

As an optimization, the coupling agent used in the step (f) of the step (1) to apply the coupling agent is an absolute ethanol solution of 2% to 4% epoxy coupling agent KH-560, and the KH-560 ring The oxygen-based coupling agent is coated on the surface of the aluminum substrate, and acts as a modifying agent on the surface of the aluminum substrate to enhance the bonding force between the aluminum substrate and the insulating layer.

As an optimization, the copper foil in step (h) laminated lamination in the step (1) is an electrolytic copper foil with a thickness of 35 μm, and the insulating layer is selected from BT (Bismaleimide Triazine, bismaleimide triazine resin) resin prepreg , The color of BT resin is pure white. After the chip is packaged, it emits light well, and it will not affect the color temperature of the light source. The Tg of BT resin is high, and it will not turn yellow and change color when used at a temperature of 100 degrees for a long time.

As an optimization, the etching solution used in the step (h) of the step (2) has a copper content of 160g/l, an acid content of 2.5N, an oxidation-reduction potential of 475mv, and a temperature of 51.6°C.

As an optimization, the electroless nickel-palladium-gold plating process used in the step (3) surface treatment of the bonding pad, the coating thickness Ni is 5-8 μm for Ni, 2-8 μ" for Pd, and 2-6 μ" for Au.

As an optimization, when drilling the cup hole in the step (5), first position the aluminum base plate on the vacuum suction table with positioning pins, and then use adhesive tape to seal the air around the aluminum base plate and the suction holes not covered by the aluminum base plate on the vacuum suction table. Paste the cover, turn on the vacuum pump, and drill the bowl and cup holes when the aluminum substrate and the work surface are fully fitted and fixed.

The invention has positive effects: the BT resin is pure white and has a high Tg, its glass transition temperature can reach 230°C, and it can be used at a temperature of 100°C for a long time, without yellowing and discoloration, which will affect the color temperature and light efficiency of the light source. Bowl and cup holes are drilled with a natural diamond single-edged milling cutter with a Mohs hardness of 10 and a high-speed precision machine tool SZX5540-Ⅱ for chip processing, which ensures that the processed surface of the aluminum substrate is smooth and bright without knife lines, and the chip edge and the horizontal plane have a 2° clip The chip can be removed during the chip cutting process, which avoids the uneven phenomenon in the solid crystal area. The product to be processed is positioned with the positioning pin and the vacuum suction cup, and it fits and fixes more closely with the work surface. The depth of the bowl and cup hole when drilling and milling The consistency is well controlled, and the depth error can be controlled between +/-0.015mm. The method of the invention is reasonable in technology, strong in practicability, and has a strong market application prospect.

detailed description

Realize the manufacture method of a kind of monocrystalline COB packaging cup-shaped aluminum base plate of the present invention, COB (chip on board board package) is one of bare chip placement technology, and manufacture method is as follows:

(1) Aluminum base copper clad laminate preparation:

(a) One-time cutting: use electric shears to cut the entire aluminum material into the size specifications required for production, and select 5052H34 aluminum material from Southwest Aluminum;

(b) One-time brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the aluminum material, and the mesh number of the brush roller is 320 mesh;

(c) Surface degreasing: Soak the aluminum material with 10% to 30% NaOH aqueous solution for 10 to 20 minutes at a temperature of 20 to 30°C to remove oxidation and grease impurities on the surface of the aluminum material;

(d) Anodizing: Put the degreased aluminum material in 20% to 30% _H2SO4 aqueous solution for ₂₀ to 40 minutes of anodic oxidation at a temperature of 20 to 25°C and a current density of 2 to 5A/dm ² ;

(e) Cleaning and drying: wash the anodized aluminum material with clean water, and then dry it on a dryer at a drying temperature of 80-100°C;

(f) Apply coupling agent: Coat one side of the aluminum material with epoxy-based coupling agent KH-560, and the coupling agent is an absolute ethanol solution of 2% to 4% epoxy-based coupling agent KH-560 , KH-560 epoxy-based coupling agent coated on the surface of the aluminum substrate, as a modifier of the surface of the aluminum substrate, enhances the bonding force between the aluminum substrate and the insulating layer. ;

(g) Drying: put the aluminum coated with the coupling agent in an oven and bake for 10 minutes at a temperature of 170°C;

(h) Lamination pressing: the sequence of lamination is copper foil, insulating layer, aluminum material, the pressing conditions are pressure 6-12Kg/cm ² , temperature 180-190°C, time 120 minutes, of which the thickness of copper foil is 35μm BT (Bismaleimide Triazine, bismaleimide triazine resin) resin prepreg is used as the insulating layer. The color of BT resin is positive white. The chip emits light well after packaging and will not affect the color temperature of the light source. The Tg of BT resin High, long-term use at a temperature of 100 degrees, it will not turn yellow and change color;

(i) Edge trimming: according to the size of the product, use an electric shear to remove the edge of the pressed plate after pressing;

(j) Paste the aluminum surface protective film: on the aluminum material on the back of the laminated aluminum-based copper clad laminate, use a film laminating machine to paste a layer of protective film to prevent damage to the aluminum material during subsequent processing;

(2) Production of aluminum substrate circuit graphics and solder mask:

(a) Secondary cutting: Use an electric shear to cut the entire aluminum-based copper-clad laminate into the size specifications required for production;

(b) Secondary brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the copper clad laminate, and the mesh number of the brush roller is 500 mesh;

(c) Printing wet film: use the method of screen printing to evenly coat a layer of photosensitive wet film on the copper foil on the surface of the copper clad laminate after the second printing;

(d) One-time pre-baking: place the copper-clad laminate with printed wet film in an oven and bake at a temperature of 70-80°C for 20-30 minutes;

(e) One-time exposure: Cover the pre-baked copper-clad board with the pre-painted circuit film, and expose it with an 8KW ultraviolet exposure machine, so that the circuit pattern on the film is transferred to the copper-clad board, and the energy setting value is 350 mm coke;

(f) One-time development: The copper-clad laminate after one exposure is developed by a developing machine, the developer solution is 1%-3% anhydrous sodium carbonate, the temperature is 28-32°C, the time is 1-2 minutes, and the spray pressure is 1-2 minutes. 5Kg/cm ² ;

(g) Inspection: check the integrity of the circuit graphics;

(h) Etching: Use an acidic copper chloride etching solution to etch away the copper layer not covered by the wet film, and retain the required copper foil. The conditions of the etching solution: copper content is 160g/l, acid content is 2.5N, oxidation The reduction potential is 475mv, and the temperature is 51.6°C;

(i) film removal: use 3% to 5% sodium hydroxide solution to remove the wet film on the etched circuit surface;

(j) Three times of brushing: use a single-sided brushing machine to brush off the oxide layer on the surface of the circuit substrate, and the mesh number of the brush roller is 500 mesh;

(k) Printing solder resist white oil: use screen printing method to evenly coat a layer on the surface of the circuit substrate after the third brushing, and evenly coat a layer on the surface of the circuit substrate after the second brushing. The model is Sun PSR2000CE800W Photosensitive solder resist white oil;

(l) Secondary pre-baking: place the circuit substrate printed with solder resist white oil in an oven and bake at a temperature of 70-80°C for 20-30 minutes;

(m) Secondary exposure: Cover the pre-painted solder resist film on the circuit substrate after the second pre-baking, and expose it with an 8KW ultraviolet exposure machine, so that the solder resist pattern on the film is transferred to the copper clad board, and the energy The set value is 950 mJ;

(n) Secondary development: the circuit substrate after secondary exposure is developed by a developing machine, the developer solution is 1% to 3% anhydrous sodium carbonate, the temperature is 28 to 32°C, the time is 1 to 2 minutes, and the spray pressure is 1～5Kg/cm ² ;

(o) Post-curing: place the circuit substrate after the second development in an oven and bake, and completely cure the solder resist white oil at a baking temperature of 150°C for 60 minutes;

(3) Surface treatment of wire bonding pads: Atotech Universal ASF II chemical nickel-palladium-gold system is used, and a layer of alloy coating is plated on the surface of the gold wire pads. 8μ", Au is 2～6μ";

(4) Drill the reference hole: use the automatic image punching machine to first identify the pattern of the line positioning hole, and then drill the positioning hole with a diameter of 2.0mm;

(5) Bowl and cup hole drilling: After joint positioning with positioning pins and vacuum suction cups, use high-speed precision machine tool SZX5540-Ⅱ and natural diamond single-edged milling cutters to drill and mill bowl-shaped holes. It is at an included angle of 2°. When drilling bowl and cup holes, first use positioning pins to position the aluminum substrate on the vacuum suction table, and then use adhesive tape to cover the surrounding of the aluminum substrate and the suction hole on the vacuum suction table that is not covered by the aluminum substrate. Vacuum pump, when the aluminum substrate and the work surface are fully fitted and fixed, then drill the bowl and cup holes. ;

(6) Ultrasonic cleaning and lamination of protective film: Use cleaning solution RS-1609 to clean the substrate with drilled cup holes in an ultrasonic cleaning machine. It is equal to 6Kg/cm ² first-level high-pressure water washing, then passes through cold air, and then dries with hot air at 80-90°C, and then sticks a medium-viscosity protective film on the circuit surface with a hot pressing roller;

(7) CNC drilling and milling shape;

(8) Inspection and shipment.

BT resin is pure white and has a high Tg. The glass transition temperature can reach 230°C. If it is used at a temperature of 100°C for a long time, it will not turn yellow and change color and affect the color temperature and light effect of the light source. Bowl and cup holes are drilled with a natural diamond single-edged milling cutter with a Mohs hardness of 10 and a high-speed precision machine tool SZX5540-Ⅱ for chip processing, which ensures that the processed surface of the aluminum substrate is smooth and bright without knife lines, and the chip edge and the horizontal plane have a 2° clip The chip can be removed during the chip cutting process, which avoids the uneven phenomenon in the solid crystal area. The product to be processed is positioned with the positioning pin and the vacuum suction cup, and it fits and fixes more closely with the work surface. The depth of the bowl and cup hole when drilling and milling The consistency is well controlled, and the depth error can be controlled between +/-0.015mm. The method of the invention is reasonable in technology, strong in practicability, and has a strong market application prospect.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (6)

1. a kind of monocrystalline cob encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: comprise the following steps:

(1) aluminum-based copper-clad plate prepares:

(a) sawing sheet: with electronic shearing machine, whole aluminium is cut into and produce the dimensions needing；

(b) brush board: use one side brush plate machine, the oxide layer of aluminium material surface is thrown and brushes off, brush roll mesh number is 320 mesh；

(c) surface degreasing: the aqueous solution soaking aluminium of the naoh being 10%～30% with percent by volume 10～20 minutes, temperature 20～30 DEG C；

(d) anodic oxidation: the aluminium after oil removing is placed on the h that percent by volume is 20%～30%₂so₄In aqueous solution, carry out 20 The anodic oxidation of～40 minutes, 20～25 DEG C of temperature, electric current density 2～5a/dm²；

(e) cleaning, drying: with the aluminium after clean water anodic oxidation, then it is placed on and dries on dehydrator, drying temperature 80～100 ℃；

F () applies coupling agent: be coated in the one side of aluminium with epoxy radicals coupling agent kh-560；

G () dries: the aluminium having coated coupling agent is placed in baking oven and toasts 10 minutes, temperature is 170 DEG C；

H () lamination presses: lamination order is Copper Foil, insulating barrier, aluminium, and pressing condition is pressure 6～12kg/cm², temperature 180～ 190 DEG C, the time is 120 minutes；

(i) cutting edge: according to product size, with electronic shearing machine, the pressing plate material marginal portion after pressing is removed；

J () pastes aluminum surface protective film: on the aluminium at the aluminum-based copper-clad plate back side having pressed, stick layer protecting film with laminator；

(2) aluminium base line pattern and welding resistance make:

(a) secondary sawing sheet: with electronic shearing machine, whole aluminum-based copper-clad plate is cut into and produce the dimensions needing；

(b) secondary brush board: use one side brush plate machine, the oxide layer on copper-clad plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；

C () prints wet film: with the method for silk screen printing, on the copper-clad plate surface Copper Foil after secondary brush board, uniformly one layer of coating is photosensitive Wet film；

(d) preliminary drying: the copper-clad plate of printed wet film is placed and toasts in an oven, 70～80 DEG C of baking temperature, the time is 20 ～30 minutes；

(e) single exposure: the circuit egative film that light in advance is painted covers in pre-baked copper-clad plate, uses 8kw ultraviolet exposure machine Exposure, energy setting value is 350 MJs；

F () is once developed: the copper-clad plate after single exposure is developed through developing machine, developer solution is percent by volume is 1%- 3% natrium carbonicum calcinatum, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm²；

G () is checked: the integrity of detection line pattern；

H () etches: eroded, with acid copper chloride etching liquid, the layers of copper not covered by wet film, retain the circuit copper needing Paper tinsel, the condition of etching solution: copper content is 140～180g/l, acid is measured as 2～3n, and oxidation-reduction potential is 450～550mv, temperature For 49～54 DEG C；

(i) striping: the circuit surface wet film after etching is removed dry by the sodium hydroxide solution being 3%～5% with percent by volume Only；

(j) three brush boards: use one side brush plate machine, the oxide layer on circuit base plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；

K () prints welding resistance white oil: with the method for silk screen printing, uniformly one layer of coating is photosensitive for the circuit base plate surface after three brush boards Welding resistance white oil；

(l) secondary preliminary drying: by printed welding resistance white oil circuit base plate place toast in an oven, 70～80 DEG C of baking temperature, Time is 20～30 minutes；

(m) re-expose: the welding resistance egative film that light in advance is painted, cover on secondary pre-baked circuit base plate, use 8kw ultraviolet Exposure machine exposes, and energy setting value is 950 MJs；

(n) redevelopment: the circuit base plate after re-expose is developed through developing machine, developer solution is percent by volume is 1% ～3% natrium carbonicum calcinatum, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm²；

(o) solidify afterwards: the circuit base plate after redevelopment is positioned over baking in baking oven, 150 DEG C of baking temperature, the time is 60 points Clock；

(3) routing bond pad surface is processed: is beating the coating surface one lamination gold plate of gold thread pad；

(4) bore datum hole: first identify the figure of circuit location hole using full-automatic image puncher, then bore location hole, aperture For 2.0mm；

(5) bore bowl hole: after shop bolt plus vacuum cup co-located, with high-speed precise machine tool szx5540- and natural Diamond single-blade milling cutter bores milling bowl shape hole, and the cutting edge of rough diamond single-blade milling cutter is horizontal by 2 ° of angles；

(6) ultrasound wave cleaning and laminating protecting film: use cleanout fluid rs-1609, cleaning in ultrasonic washing unit is drilled bowl hole Substrate, cleaning 30～60 seconds after, take out wash through three-level clear water, then with pressure be more than or equal to 6kg/cm²One-level high-pressure washing, Then cross cold wind, after 80～90 DEG C of hot-air seasoning, then in circuit surface viscosity protecting film in hot-pressing roller patch；

(7) numerical control drilling-milling profile；

(8) check shipment.

2. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: The coupling agent that step (f) in described step (1) applies coupling agent employing is that the epoxy radicals that percent by volume is 2%～4% are coupled The ethanol solution of agent kh-560.

3. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: In step (h) lamination pressing in described step (1), Copper Foil is the electrolytic copper foil of 35 μ m thick, and insulating barrier selects bt (bismaleimide triazine) resin prepreg.

4. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: The etching solution of step (h) etching in described step (2) is copper content is 160g/l, and acid is measured as 2.5n, oxidation-reduction potential For 475mv, temperature is 51.6 DEG C.

5. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: The Chemical nickel and palladium plating process that described step (3) routing bond pad surface adopts when processing, thickness of coating ni is 5～8 μm, pd is 2 ～8 μ ", au be 2～6 μ ".

6. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: When described step (5) bores bowl hole, first with shop bolt, aluminium base is positioned on vacuum suction table, then with adhesive tape aluminium base four The suction hole not covered by aluminium base on week and vacuum suction table is pasted and is covered, and opens vacuum pump, treats that aluminium base is filled with work top When dividing laminating fixing, then carry out boring bowl hole.