CN103956435A - Adhesive tape encapsulating structure of organic light emitting diode - Google Patents

Abstract

The invention relates to a tape encapsulation structure of an organic light emitting diode, which is to encapsulate an organic light emitting diode (OLED) with an adhesive tape, which is composed of a front electrode, an organic layer, a rear electrode and a protective layer on a substrate, and there is a layer on the OLED A self-adhesive layer and a tape composed of a flexible film tape that blocks the passage of water vapor and oxygen seal the OLED. On or below the flexible film tape there is a gas barrier layer composed of multiple layers of films of different materials. In the flexible film There can also be a layer of filter film under the belt, and there is a sealant ring on the periphery of the sealant tape to cover the tape and the substrate so that the gas cannot penetrate into the OLED device from the periphery. There can also be a thin glass or metal sheet on the sealant ring. Block gas from entering from above. The main encapsulation process of the present invention is the process of sticking tapes, so its technological process is much simpler than the previous method, which can not only increase the production speed, but also reduce the production cost, and is especially suitable for large-area and large-volume production.

Description

Tape packaging structure of an organic light emitting diode

technical field

The invention relates to a tape packaging structure of an organic light emitting diode, which belongs to the field of flat-panel device packaging.

Background technique

At present, the organic light emitting diode (OLED) has developed rapidly and has been widely used in the fields of flat panel display and lighting. But because it is very sensitive to moisture and oxygen, in order to obtain a long enough life, it must be encapsulated to isolate it from the atmosphere and environment. The current main packaging methods are: thin film packaging, which is to prepare colorful organic and inorganic thin films on OLED devices to block the entry of moisture and oxygen. Its patents are such as CN201210057243; airtight packaging, such as using metal back cover or glass back After adding some getters, dehumidifiers and coating ultraviolet sensitive glue (UV glue) on the convex edge around it, in the glove box of high-purity inert gas, after packaging and pressing with the OLED screen, the ultraviolet Irradiate the light source to cure the UV glue to complete the packaging. Related patents such as CN201010116683, CN200720106620, CN201210118435, CN201210118435, CN201110305187; laser packaging, is to put the low-temperature glass paste between the glass back cover and the glass substrate of the OLED, and then use laser to quickly Melting, bonding and sealing the glass back cover and the glass substrate of the OLED to prevent the entry of moisture and oxygen, related patents such as CN201310464410, CN201310464675, CN201310463979, etc. Although these methods have been widely used in industry, their disadvantages are that the process is complicated, and the packaging equipment and related materials are quite expensive, which makes the cost of the device high.

Contents of the invention

The purpose of the present invention is to provide a tape packaging structure for organic light-emitting diodes to address the defects of the prior art, and to prevent the entry of harmful gases by affixing an air-tight tape on the OLED device. Not only can the cost be reduced, but the productivity can be improved, and it is especially suitable for the mass production technology of large-area devices.

To achieve the above object, the present invention adopts the following technical solutions:

An organic light-emitting diode tape packaging structure, including an organic light-emitting diode (OLED) composed of a front electrode, an organic layer, a rear electrode and a protective layer on a substrate. The OLED has a layer of self-adhesive layer and has a moisture-proof and The tape composed of the flexible film tape through which the oxygen passes seals the OLED, and there is a gas barrier layer composed of multiple layers of different material films on or below the flexible film tape. Above the edge, the other side is glued to the substrate to cover the gap between the tape and the substrate, so that the gas cannot penetrate into the OLED device from the periphery. The entire packaging process is carried out in a vacuum or under a high-purity inert gas atmosphere.

At least one of the front and back electrodes is transparent.

The substrate is a rigid glass substrate or a flexible substrate, which is transparent or opaque.

The self-adhesive layer is a material with continuous viscosity and no volatile gas, which is very dense and not easy to breathe. It is an organic or inorganic material, and its thickness is between 1 micron and 50 microns. The self-adhesive layer is doped with a small amount of organic or inorganic liquid hygroscopic agent, and the hygroscopic agent is uniformly mixed with the self-adhesive or forms a compound with the self-adhesive to absorb internal and external water vapor.

The flexible film belt is made of an organic thin film material with low air permeability or an air-impermeable metal foil belt or a thin film of an inorganic material. The organic thin film material with low gas permeability is PE, BOPP, multi-layer composite film, polysulfone, polyimide, and its thickness is between 10 microns and 100 microns. The air-tight metal foil strip is such as aluminum foil, copper foil, stainless steel foil, and its thickness is between 10 microns and 50 microns. The thin film of the inorganic material is an ultra-thin flexible glass ribbon or an ultra-thin flexible quartz film ribbon, and its thickness is between 5 microns and 50 microns.

The gas barrier layer is composed of various inorganic oxide films, metal films or organic films and can be stacked repeatedly, and its thickness is between 1 nanometer and 10 microns.

The width of the sealing rubber ring is between 0.3 and 2 mm, and the thickness is between 0.3 and 2 mm. The sealing rubber ring is made of epoxy resin, silica gel or heat-sealing glue.

There is also a layer of filter film under the flexible film strip, and the filter film is monochromatic or composed of an array of color blocks of different colors.

There is also a cover plate on the sealant ring to prevent gas from entering from above, and the cover plate is a thin glass sheet or metal sheet.

Compared with the prior art, the present invention has the following obvious outstanding substantive features and significant advantages:

The main encapsulation process of the present invention is the process of sticking tapes, so its technological process is much simpler than the previous method, which can not only increase the production speed, but also reduce the production cost, and is especially suitable for large-area and large-volume production. The present invention can be used for OLED hard screen and is more suitable for OLED soft screen technology, and for the latter, it can be completed through the rolling process of OLED soft screen and sealing tape.

Compared with the thin film encapsulation technology of OLED, the present invention transfers the process of multilayer thin film on OLED to adhesive tape, and is especially suitable for industrial production. Because the latter can be achieved by roller-type vacuum deposition on the substrate of the tape in a vacuum system. The tape not only has the function of sealing but also the function of color filter film.

Description of drawings

FIG. 1 is a schematic structural view of the packaging of an organic light-emitting diode, an adhesive tape and a multi-layer film according to the present invention.

FIG. 2 is a schematic structural view of the package of the organic light emitting diode, adhesive tape and multi-layer film of the present invention.

FIG. 3 is a schematic structural view of the package of the organic light emitting diode and the aluminum foil tape of the present invention.

FIG. 4 is a schematic structural view of the packaging of an organic light emitting diode, adhesive tape, multi-layer film and filter film according to the present invention.

FIG. 5 is a schematic structural view of the package of the organic light emitting diode, adhesive tape and glass sheet of the present invention.

Detailed ways

Preferred embodiments of the present invention are described in detail as follows in conjunction with the accompanying drawings:

Example 1

As shown in Figure 1, a kind of adhesive tape encapsulation structure of organic light-emitting diode, to the front electrode 2 that has ITO on glass substrate 1, and comprises organic hole injection layer, organic hole transport layer, organic light-emitting layer, organic electronics The organic layer 3 of the transport layer and the organic electron injection layer, the metal aluminum rear electrode 4 and the protective layer 5 of the organic material are used for tape encapsulation of the bottom-emitting organic light-emitting diode OLED of the glass substrate 1, and the tape used for the tape encapsulation of this OLED 6 is a kind of adhesive tape, which is composed of polyimide flexible film tape 6-2 which can better block the passage of water vapor and oxygen, and is coated with a layer of self-adhesive layer 6-1, and there are multiple layers of film on the adhesive tape The gas barrier layer 7 is composed of a multi-layer thin film consisting of a silicon nitride layer, an aluminum oxide layer, a silicon nitride layer, an aluminum oxide layer, and the like. The silicon nitride layer was prepared by plasma enhanced vapor deposition and the aluminum oxide by molecular layer deposition. The adhesive tape 6 with the gas barrier layer 7 is pasted densely on the OLED device by rolling method under the high-purity inert gas atmosphere, and the area of the adhesive tape 6 just covers the entire OLED device to emit light. The area of the layer is 1-2 mm larger. Use a dispenser to coat a circle of UV epoxy sealant ring 8 with a width of about 1-2 mm on the periphery of the seal tape, half of which sticks to the tape and the other half sticks to the substrate and is cured by ultraviolet light irradiation A sealing ring 8 is then formed to prevent gas from penetrating into the OLED device from the periphery.

Example 2

As shown in Fig. 2, the difference between it and Embodiment 1 is that the gas barrier layer 7 here is between the polyimide flexible film tape 6-2 and the self-adhesive layer 6-1. During the production process of the tape 6, the gas barrier layer 7 is prepared under the polyimide flexible film tape 6-2, and then the self-adhesive layer 6-1 is coated.

Example 3

As shown in Figure 3, a kind of adhesive tape encapsulation structure of organic light-emitting diode, to the front electrode 2 that has ITO on glass substrate 1, and comprises organic hole injection layer, organic hole transport layer, organic light-emitting layer, organic electronics Tape encapsulation of the organic light-emitting diode OLED of the bottom emission of the glass substrate composed of the organic layer 3 of the transport layer and the organic electron injection layer, the metal aluminum rear electrode 4 and the protective layer 5 of the organic material, and the adhesive tape 6 used for the tape encapsulation of this OLED It is a layer of self-adhesive layer 6-1 coated under the aluminum foil belt 6-2 with good resistance to the passage of water vapor and oxygen, and the adhesive tape 6 is made non-drying by rolling under a high-purity inert gas atmosphere. The adhesive layer 6-1 is densely pasted on the OLED device, and the area of the adhesive tape 6 just covers the entire area of the light-emitting layer of the OLED device and is 1-2 mm larger. Use a dispenser to coat a circle of UV epoxy sealant ring 8 with a width of about 1-2 mm on the periphery of the seal tape, half of which sticks to the tape and the other half sticks to the substrate and is cured by ultraviolet light irradiation A sealing ring 8 is then formed to prevent gas from penetrating into the OLED device from the periphery.

Example 4

As shown in Figure 4, a tape packaging structure of an organic light-emitting diode, the front electrode 2 with aluminum on the glass substrate 1, and includes an organic electron injection layer, an organic electron transport layer, an organic light-emitting layer, and an organic hole transport layer. Layer and the organic layer 3 of the organic hole injection layer, the ITO rear electrode 4 and the protective layer 5 of the organic material are used for tape encapsulation of the top-emitting organic light-emitting diode OLED of the glass substrate, and the tape 6 used for the tape encapsulation of this OLED is A kind of adhesive tape, it is by the flexible film band 6-2 that has good resistance water vapor and oxygen to pass through, and the gas barrier layer 7 that also has multi-layer film on this flexible adhesive tape, it is made of silicon nitride layer, aluminum oxide layer, nitrogen It is composed of multi-layer thin films repeated many times, such as silicon oxide layer, aluminum oxide layer, etc. The silicon nitride layer was prepared by plasma enhanced vapor deposition and the aluminum oxide by molecular layer deposition. There is also a filter film 11 on the other side of the flexible adhesive tape 6-2. The filter film is made to have an array of red, blue and green three-color blocks. The following is coated with a layer of self-adhesive layer 6-1, and the adhesive tape 6 with the gas barrier layer 7 and the filter film is used to make the self-adhesive layer 6-1 densely pasted by rolling under a high-purity inert gas atmosphere On the OLED device, the area of the adhesive tape 6 just covers the area of the entire light-emitting layer of the OLED device and is 1-2 mm larger. Use a dispenser to coat a circle of UV epoxy sealant ring 8 with a width of about 1-2 mm on the periphery of the seal tape, half of which sticks to the tape and the other half sticks to the substrate and is cured by ultraviolet light irradiation Finally, a sealant ring 8 is formed to prevent gas from penetrating into the OLED device from the periphery.

Example 5

As shown in Figure 5, a kind of adhesive tape encapsulation structure of organic light-emitting diode, to the front electrode 2 that has ITO on glass substrate 1 and comprises organic hole injection layer, organic hole transport layer, organic light-emitting layer, organic electron transport layer Layer and the organic layer 3 of the organic electron injection layer, the metal aluminum back electrode 4 and the protective layer 5 of the organic material, the organic light-emitting diode OLED of the bottom emission of the glass substrate is packaged with tape, and the tape 6 used for the tape package of this OLED is A high-temperature adhesive tape which is coated with a self-adhesive layer 6-1 under a polyimide flexible film tape 6-2 with good resistance to the passage of water vapor and oxygen, and the adhesive tape 6 is placed under a high-purity inert gas atmosphere The self-adhesive layer 6-1 is densely pasted on the OLED device by a rolling method, and the area of the adhesive tape 6 just covers the entire area of the light-emitting layer of the OLED device and is 1-2 mm larger. Use a dispenser to coat a circle of UV epoxy sealant ring 8 with a width of about 1-2 mm on the periphery of the seal tape, half of which sticks to the tape and the other half sticks to the substrate, and then presses a thin piece of it The glass back cover 10 makes the sealant ring 8 fill the space between the glass back cover 10 and the glass substrate 1, and after being cured by ultraviolet light irradiation, a seal with the glass back cover is formed so that gas cannot penetrate into the OLED device from the periphery and above. the

Claims (14)

1. the adhesive tape encapsulating structure of an Organic Light Emitting Diode, comprise by substrate (1) front electrode (2) above, organic layer (3), the Organic Light Emitting Diode of rear electrode (4) and protective layer (5) composition is OLED, it is characterized in that, the adhesive tape (6) that has one deck non-drying glue layer (6-1) above described OLED and have flexible membrane belt (6-2) composition that stops steam and oxygen and pass through seals OLED, on flexible membrane belt (6-2) or below also have the barrier layer for gases (7) of multiple layers of different materials film composition, there is sealed rubber ring (8) at the periphery of adhesive tape encapsulating structure, its adhere on one side adhesive tape (6) edge above, another side adheres on substrate (1), cover the gap between adhesive tape (6) and substrate (1), make gas thoroughly not enter OLED device from periphery, whole encapsulation process is carried out in a vacuum or under high purity inert gas atmosphere.

2. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, in described front electrode (2) and rear electrode (4), has at least one to be transparent.

3. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, described substrate (1) is rigid glass substrate or flexible substrate, is transparent or opaque.

4. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, described non-drying glue layer (6-1) is have lasting stickiness and there is no escaping gas and be very fine and closely not easy ventilative material, be organically a kind of or inorganic material, its thickness is between 1 micron to 50 microns.

5. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, in described non-drying glue layer (6-1), mix up the liquid hygroscopic agent that has a small amount of organic or inorganic, hygroscopic agent mixes uniformly with adhesive sticker or forms compound to adsorb inherent and external steam with adhesive sticker.

6. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, described flexible membrane belt (6-2) is that the organic film material low by air penetrability or the film of air-locked metallic foil or inorganic material are made.

7. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, the organic film material that described air penetrability is low is PE, BOPP, MULTILAYER COMPOSITE glued membrane, polysulfones, polyimide, and its thickness is between 10 microns to 100 microns.

8. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, described air-locked metallic foil is if aluminium foil, Copper Foil, its thickness of stainless steel foil are between 10 microns to 50 microns.

9. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, the film of described inorganic material is ultrathin bendable glass tape, ultrathin bendable quartz film band, and its thickness is between 5 microns to 50 microns.

10. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, described barrier layer for gases (7) is various inorganic oxide films, metallic film or organic film composition and can repeatedly repeats stack, and its thickness is between 1 nanometer to 10 micron.

The adhesive tape encapsulating structure of 11. Organic Light Emitting Diodes according to claim 1, is characterized in that, the width of described sealed rubber ring (8) is between 0.3 to 2mm, and thickness is between 0.3 to 2mm.

The adhesive tape encapsulating structure of 12. Organic Light Emitting Diodes according to claim 1, is characterized in that, described sealed rubber ring (8) is to be made up of epoxy resin, silica gel or heat-seal adhesive.

The adhesive tape encapsulating structure of 13. Organic Light Emitting Diodes according to claim 1, it is characterized in that, below flexible membrane belt (6-2), also have one deck filter coating (11), described filter coating (11) is monochromatic or is made up of the array of the color lump of different colours.

The adhesive tape encapsulating structure of 14. Organic Light Emitting Diodes according to claim 1, is characterized in that, described sealed rubber ring (8) is upper also has cover plate (10) to enter from above with barrier gas, and described cover plate (10) is thin sheet glass or sheet metal.