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CN114111196A - Control method of refrigeration appliance and refrigeration appliance - Google Patents

Control method of refrigeration appliance and refrigeration appliance Download PDF

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Publication number
CN114111196A
CN114111196A CN202010886228.0A CN202010886228A CN114111196A CN 114111196 A CN114111196 A CN 114111196A CN 202010886228 A CN202010886228 A CN 202010886228A CN 114111196 A CN114111196 A CN 114111196A
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CN
China
Prior art keywords
semiconductor refrigeration
refrigeration module
fan
control method
temperature
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202010886228.0A
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Chinese (zh)
Inventor
郑皓宇
李大伟
成俊亮
张书锋
廉锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Special Refrigerator Co Ltd
Haier Smart Home Co Ltd
Original Assignee
Qingdao Haier Special Refrigerator Co Ltd
Haier Smart Home Co Ltd
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Application filed by Qingdao Haier Special Refrigerator Co Ltd, Haier Smart Home Co Ltd filed Critical Qingdao Haier Special Refrigerator Co Ltd
Priority to CN202010886228.0A priority Critical patent/CN114111196A/en
Publication of CN114111196A publication Critical patent/CN114111196A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00General constructional features
    • F25D23/006General constructional features for mounting refrigerating machinery components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • F25D29/008Alarm devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00Other cooling or freezing apparatus
    • F25D31/002Liquid coolers, e.g. beverage cooler
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2600/00Control issues
    • F25D2600/02Timing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2600/00Control issues
    • F25D2600/06Controlling according to a predetermined profile

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

本发明提供一种制冷电器的控制方法与制冷电器,所述控制方法主要包括在半导体制冷模块工作时;判断风机是否出现故障;确认风机出现故障时,将半导体制冷模块的冷端温度T与第一阈值温度T1对比,若T≥T1,根据制冷电器内部实际温度Ta与设定温度Ts的对比结果确定半导体制冷模块的工作电压;若T<T1,控制降低所述半导体制冷模块的工作电压。所述制冷电器包括上述半导体制冷模块,所述半导体制冷模块的冷端配设有风机,通过上述控制方法设计,能够判断风机是否出现故障,并在风机出现故障时,有效控制半导体制冷模块继续工作,更好地保证制冷电器内部温度稳定,提高用户体验。

Figure 202010886228

The invention provides a control method for a refrigeration appliance and a refrigeration appliance. The control method mainly includes: when a semiconductor refrigeration module is working; judging whether a fan is faulty; A comparison of the threshold temperature T1, if T≥T1, the working voltage of the semiconductor refrigeration module is determined according to the comparison result between the actual temperature Ta inside the refrigeration appliance and the set temperature Ts; if T<T1, the control reduces the working voltage of the semiconductor refrigeration module. The refrigeration appliance includes the above-mentioned semiconductor refrigeration module, and the cold end of the semiconductor refrigeration module is equipped with a fan. Through the design of the above control method, it can be determined whether the fan is faulty, and when the fan fails, the semiconductor refrigeration module can be effectively controlled to continue to work. , to better ensure the stability of the internal temperature of the refrigeration appliance and improve the user experience.

Figure 202010886228

Description

Control method of refrigeration appliance and refrigeration appliance
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to a control method of a refrigeration appliance and the refrigeration appliance.
Background
With the improvement of living standard, the sales volume of the wine is also increased year by year, the wine has higher requirement on the storage environment, the common refrigerator can not meet the storage requirement of the wine, and a special wine cabinet is generally adopted for storing the wine. The existing wine cabinet mostly adopts a compressor refrigeration cycle system to control the temperature, the working process of the compressor inevitably generates vibration and noise, and the quality and the user experience of the stored wine are seriously influenced.
The industry also discloses a solid-state refrigeration wine cabinet, which uses a semiconductor refrigeration module as a cold source to cool the interior of the wine cabinet. The semiconductor refrigeration module has the advantages that the refrigeration capacity is concentrated when the semiconductor refrigeration module works, the refrigeration capacity is transmitted to each region in the compartment by the aid of the fans matched with the temperature equalizing plates or the metal fins and the like, ice blockage and stalling of the fans can be caused in the transmission process of the refrigeration capacity, and mechanical faults occur to the fans after the fans are operated for a long time at a certain probability. When the fan stops operating, be difficult to the fan and whether go wrong discernment judgement, and the cold volume of semiconductor refrigeration module is difficult to in time conduct to the incasement, leads to the incasement temperature unstable, influences storing of article such as grape wine.
In view of the above, it is desirable to provide a control method for a refrigeration appliance and a refrigeration appliance.
Disclosure of Invention
The invention aims to provide a control method of a refrigerating appliance and the refrigerating appliance, which can reasonably control a semiconductor refrigerating module to work when a fan is judged to be in fault, improve the temperature stability in the refrigerating appliance and improve the user experience.
In order to achieve the above object, the present invention provides a control method for a refrigeration appliance, which mainly comprises:
starting a semiconductor refrigeration module to work, wherein a fan is arranged at the cold end of the semiconductor refrigeration module;
judging whether the fan fails or not;
when the fan is confirmed to be in fault, comparing the cold end temperature T of the semiconductor refrigeration module with a first threshold temperature T1;
if T is larger than or equal to T1, detecting the actual temperature Ta inside the refrigerating appliance, comparing the actual temperature Ta with the set temperature Ts, and determining the working voltage of the semiconductor refrigerating module according to the comparison result;
and if T is less than T1, controlling to reduce the working voltage of the semiconductor refrigeration module.
As a further improvement of the present invention, the step of "determining the operating voltage of the semiconductor refrigeration module according to the comparison result" includes:
if Ta is greater than Ts + d1, controlling to increase the working voltage of the semiconductor refrigeration module, wherein d1 is a first temperature difference value;
if Ta is less than Ts-d2, controlling to reduce the working voltage of the semiconductor refrigeration module, wherein d2 is a second temperature difference value;
and if the Ts-d2 is more than or equal to Ta and less than or equal to Ts + d1, keeping the working voltage of the semiconductor refrigeration module unchanged.
As a further improvement of the invention, the step of judging whether the fan has a fault comprises detecting the running state of the fan;
if the fan is abnormal in operation, detecting the cold end temperature T of the semiconductor refrigeration module, and comparing the cold end temperature T with a second threshold temperature T2, wherein T2 is more than T1;
if T is larger than or equal to T2, judging that the fan has a fault, and sending a fault signal;
and if T is less than T2, heating the cold end of the semiconductor refrigeration module.
As a further improvement of the present invention, the heating step includes stopping the semiconductor cooling module from cooling; and controlling to supply a set reverse voltage to the semiconductor refrigeration module and maintaining the set heating time.
As a further improvement of the present invention, the heating step further includes detecting a cold end temperature T of the semiconductor refrigeration module after the heating for the predetermined heating duration is completed; and if the cold end temperature T is less than the preset heating temperature, keeping the preset reverse voltage to be introduced into the semiconductor refrigeration module, and then maintaining the preset heating time.
As a further improvement of the present invention, after the heating step is completed, the operating state of the fan is detected;
and if the fan still runs abnormally, judging that the fan breaks down, and sending a fault signal.
As a further improvement of the invention, the control method further comprises stopping the power supply of the fan when the abnormal operation of the fan is detected;
and when the heating step is completed, the power supply of the fan is recovered.
As a further improvement of the present invention, the control method further includes stopping the cooling of the semiconductor cooling module if the detected cold end temperature T of the semiconductor cooling module is less than a third threshold temperature T3 when the fan fault is confirmed, where T3 < T1.
As a further improvement of the present invention, the step of controlling to decrease the operating voltage of the semiconductor refrigeration module refers to decreasing the operating voltage of the semiconductor refrigeration module by a predetermined percentage value or a predetermined voltage difference value;
the control method further comprises the step of controlling the semiconductor refrigeration module to work for a set time t according to the reduced working voltage after the working voltage of the semiconductor refrigeration module is reduced.
The invention also provides a refrigerating appliance which comprises the storage compartment and the semiconductor refrigerating module used for providing cold energy for the storage compartment, wherein the cold end of the semiconductor refrigerating module is provided with the fan, and the refrigerating appliance works by adopting the control method.
The invention has the beneficial effects that: by adopting the control method of the refrigeration appliance and the refrigeration appliance, whether the fan fails or not can be judged, and when the fan fails, the semiconductor refrigeration module is effectively controlled to continue working, so that the internal temperature of the refrigeration appliance is better ensured to be stable, and the user experience is improved.
Drawings
FIG. 1 is a schematic diagram of the refrigeration appliance of the present invention;
FIG. 2 is a schematic diagram of the internal structure of the refrigeration appliance of the present invention;
FIG. 3 is a rear view of the refrigeration appliance of the present invention;
fig. 4 is a schematic main flow chart of the control method of the refrigeration appliance according to the present invention.
100-a refrigeration appliance; 101-a storage compartment; 11-a heat-insulating layer; 12-a housing; 13-air inlet; 14-air outlet; 15-a separator; 2-a semiconductor refrigeration module; 3, a fan; 4-cold end heat exchanger; 5-hot end fan; 6-hot end radiator.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The present invention is not limited to the embodiment, and structural, methodological, or functional changes made by one of ordinary skill in the art according to the embodiment are included in the scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a refrigerator 100 having a storage compartment 101 formed therein, the storage compartment having a heat insulating layer 11 and a case 12 disposed outside the heat insulating layer 11. The refrigeration appliance 100 comprises a semiconductor refrigeration module 2 for providing refrigeration for the storage compartment and a fan 3 arranged at the cold end of the semiconductor refrigeration module 2.
The semiconductor refrigeration module 2 is arranged in the heat insulation layer 11 on the rear side of the storage compartment 101, and the fan 3 is arranged on the rear wall of the storage compartment 101 and adjacent to the cold end of the semiconductor refrigeration module 2. Refrigeration electric appliance 100 still include with the cold junction of semiconductor refrigeration module 2 meets and presses close to cold junction heat exchanger 4 that storage room 101 rear wall set up, cold junction heat exchanger 4 can adopt the temperature-uniforming plate or set up to be fin formula heat transfer structure.
Here, the refrigeration appliance 100 further includes a hot-side fan 5 and a hot-side heat sink 6 disposed between the heat insulating layer 11 on the rear side of the storage compartment 101 and the housing 12, of course, an air inlet 13 and an air outlet 14 communicated with the outside are disposed on the housing 12, and a heat dissipation channel communicating the air inlet 13 and the air outlet 14 is formed between the heat insulating layer 11 and the housing 12. Specifically, the air inlet 13 is arranged corresponding to the hot-end fan 5, and the hot-end fan 5 is preferably arranged at the corresponding air inlet 13; the outlet vents 14 are disposed adjacent the top and/or bottom of the housing 12.
In this embodiment, the storage compartment 101 has a plurality of storage areas arranged vertically adjacent to each other, a partition 15 is disposed between the adjacent storage areas, and a corresponding semiconductor refrigeration module 2 is disposed at the rear side of each storage area. Of course, a plurality of semiconductor refrigeration modules 2 may be disposed in part or all of the storage areas of the storage compartment 101 according to actual needs, and the storage compartment 101 may also be integrally disposed, which is not described herein again.
Referring to fig. 4, the present invention further provides a method for controlling the refrigeration apparatus 100, including:
starting the semiconductor refrigeration module 2 to work;
judging whether the fan 3 has a fault;
when the fan 3 is confirmed to be in fault, comparing the cold end temperature T of the semiconductor refrigeration module 2 with a first threshold temperature T1;
if T is larger than or equal to T1, detecting the actual temperature Ta inside the refrigerating appliance 100, comparing the actual temperature Ta with the set temperature Ts, and determining the working voltage of the semiconductor refrigerating module 2 according to the comparison result;
and if T is less than T1, controlling to reduce the working voltage of the semiconductor refrigeration module 2.
Specifically, the "starting the semiconductor refrigeration module 2 to operate" means controlling the semiconductor refrigeration module 2 to start to operate according to a predetermined voltage when the refrigeration appliance 100 is started to operate, or when the actual internal temperature Ta of the refrigeration appliance 100 is detected to exceed a set temperature. Here, the operation of the fan 3 and the operation of the hot side fan 5 are simultaneously started while the semiconductor refrigeration module 2 is started.
The step of judging whether the fan 3 breaks down includes:
detecting the running state of the fan 3;
if the fan 3 runs abnormally, detecting the cold end temperature T of the semiconductor refrigeration module 2, and comparing the cold end temperature T with a second threshold temperature T2, wherein T2 is more than T1;
if T is larger than or equal to T2, judging that the fan 3 has a fault, and sending a fault signal;
if T is less than T2, heating the cold end of the semiconductor refrigeration module 2; and detecting the running state of the fan 3 after the heating step is finished;
and if the fan 3 still runs abnormally, judging that the fan 3 breaks down, and sending a fault signal.
The abnormal operation of the fan 3 means that the fan 3 stops operating or has abnormal rotating speed, and generally means that the fan 3 stops operating or has rotating speed much lower than a set rotating speed, so that the cold end heat exchanger 4 is difficult to conduct cold to the inside of the storage compartment 101 in time. The second threshold temperature T2 is usually set to be the freezing point temperature, that is, when the cold end temperature T is lower than the second threshold temperature T2, it is determined that the abnormal operation of the fan 3 may be caused by ice blockage, and the cold end of the semiconductor refrigeration module 2 is heated, so as to further confirm the reason for the abnormal operation of the fan 3 and timely solve the abnormal operation of the fan 3 caused by the ice blockage.
The heating step comprises stopping the semiconductor refrigeration module 2 from refrigerating; and then, a predetermined reverse voltage is applied to the semiconductor refrigeration module 2 and a predetermined heating duration is maintained. As an example, a reverse voltage of 13V may be applied to the semiconductor refrigeration module 2, and the heating may be continued for 1 min. That is to say, the semiconductor refrigeration module 2 is heated reversely so as to raise the temperature T of the cold end of the semiconductor refrigeration module 2, so that the possibly existing frost on the fan 3 and part of the cold end heat exchanger 4 near the cold end of the semiconductor refrigeration module 2 is melted.
Particularly, after the semiconductor refrigeration module 2 is heated for a predetermined heating time, the cold end temperature of the semiconductor refrigeration module 2 is detected, and if the cold end temperature T does not reach the preset heating temperature, at this time, a predetermined reverse voltage needs to be kept applied to the semiconductor refrigeration module 2, and then the predetermined heating time is maintained. It should be further noted that, considering that a certain time is also required for defrosting the fan 3 and/or the cold-end heat exchanger 4, the control method may further include controlling to re-detect the operating state of the fan 3 after a preset delay time period after stopping the reverse heating of the semiconductor refrigeration module 2.
The control method further comprises the steps of stopping power supply of the fan 3 when the fan 3 is detected to be abnormally operated; and when the heating step is completed, the power supply of the fan 3 is restored. The fault signal may be displayed on a display interface of the refrigeration appliance 100 itself, or transmitted to a corresponding intelligent terminal through a wireless network, so as to be processed by a user or a maintenance person.
The step of determining the working voltage of the semiconductor refrigeration module 2 according to the comparison result comprises the following steps:
if Ta is greater than Ts + d1, controlling to increase the working voltage of the semiconductor refrigeration module 2, wherein d1 is a first temperature difference value;
if Ta is less than Ts-d2, controlling to reduce the working voltage of the semiconductor refrigeration module 2, wherein d2 is a second temperature difference value;
and if the Ts-d2 is more than or equal to Ta and less than or equal to Ts + d1, keeping the working voltage of the semiconductor refrigeration module unchanged.
Here, since the cold end temperature T is greater than the second threshold temperature T2, it can be understood that the cold energy of the semiconductor refrigeration module 2 can be smoothly conducted into the storage compartment 101. The first temperature difference d1 and the second temperature difference d2 may be set to be the same or different, and both are preferably set to be 1 ℃.
The step of controlling to reduce the operating voltage of the semiconductor refrigeration module 2 refers to reducing the operating voltage of the semiconductor refrigeration module 2 according to a predetermined percentage value or a predetermined voltage difference value. That is, the adjustment of the operating voltage of the semiconductor refrigeration module 2 can be performed in two different ways, and the adjustment of the operating voltage can be reduced by a predetermined percentage value (e.g., 10%) based on the original operating voltage. The control method also comprises the steps of controlling the semiconductor refrigeration module 2 to work for a set time t (such as 3min) according to the reduced working voltage after the working voltage of the semiconductor refrigeration module 2 is reduced; the cold end temperature T of the semiconductor refrigeration module 2 is detected again.
The control method further comprises the step of stopping the refrigeration of the semiconductor refrigeration module 2 when the cold end temperature T of the semiconductor refrigeration module 2 is detected to be less than a third threshold temperature T3, wherein T3 is less than T1, and T3 can be set to be slightly greater than T2, so that the cold end and cold end heat exchangers 4 of the semiconductor refrigeration module 2 are prevented from frosting more effectively.
Besides, in the case that the fan 3 operates normally, the control method includes continuously detecting the actual internal temperature Ta of the refrigeration appliance 100; when the actual temperature Ta rises, the working voltage of the semiconductor refrigeration module 2 is controlled to be increased; when the actual temperature Ta decreases, the control decreases the operating voltage of the semiconductor refrigeration module 2.
In summary, according to the control method of the refrigeration appliance 100 and the refrigeration appliance 100 of the present invention, when the abnormal operation of the fan 3 is detected, the abnormal risk of ice blockage of the fan 3 is timely determined and eliminated, the error reporting frequency and the maintenance cost are reduced, and the normal operation of the refrigeration appliance 100 is better ensured. And, when judging that fan 3 breaks down, control semiconductor refrigeration module 2 and get into "controllable cooling" mode, the at utmost keeps this refrigeration electrical apparatus 100 internal temperature environment's stability, is suitable for the storage of red wine etc. avoids the wine quality impaired, improves user experience.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1.一种制冷电器的控制方法,其特征在于:1. a control method of a refrigeration appliance, is characterized in that: 启动半导体制冷模块工作,所述半导体制冷模块的冷端配设有风机;Start the semiconductor refrigeration module to work, and the cold end of the semiconductor refrigeration module is equipped with a fan; 判断风机是否出现故障;Determine whether the fan is faulty; 确认风机出现故障时,将半导体制冷模块的冷端温度T与第一阈值温度T1对比;When confirming that the fan is faulty, compare the cold end temperature T of the semiconductor refrigeration module with the first threshold temperature T1; 若T≥T1,检测制冷电器内部实际温度Ta,并将实际温度Ta与设定温度Ts对比,再根据对比结果确定半导体制冷模块的工作电压;If T≥T1, detect the actual temperature Ta inside the refrigeration appliance, compare the actual temperature Ta with the set temperature Ts, and then determine the working voltage of the semiconductor refrigeration module according to the comparison result; 若T<T1,控制降低所述半导体制冷模块的工作电压。If T<T1, the control reduces the working voltage of the semiconductor refrigeration module. 2.根据权利要求1所述的控制方法,其特征在于:所述“根据对比结果确定半导体制冷模块的工作电压”步骤包括:2. The control method according to claim 1, wherein the step of "determining the operating voltage of the semiconductor refrigeration module according to the comparison result" comprises: 若Ta>Ts+d1,控制增大所述半导体制冷模块的工作电压,d1为第一温度差值;If Ta>Ts+d1, control to increase the working voltage of the semiconductor refrigeration module, and d1 is the first temperature difference; 若Ta<Ts-d2,控制降低所述半导体制冷模块的工作电压,d2为第二温度差值;If Ta<Ts-d2, control to reduce the working voltage of the semiconductor refrigeration module, and d2 is the second temperature difference; 若Ts-d2≤Ta≤Ts+d1,保持所述半导体制冷模块的工作电压不变。If Ts-d2≤Ta≤Ts+d1, keep the working voltage of the semiconductor refrigeration module unchanged. 3.根据权利要求1所述的控制方法,其特征在于:所述“判断风机是否出现故障”步骤包括检测风机的运行状态;3. The control method according to claim 1, wherein the step of "judging whether the fan is faulty" comprises detecting the running state of the fan; 若所述风机运行异常,检测所述半导体制冷模块的冷端温度T,并将冷端温度T与第二阈值温度T2对比,T2<T1;If the fan operates abnormally, detect the cold end temperature T of the semiconductor refrigeration module, and compare the cold end temperature T with the second threshold temperature T2, where T2 < T1; 若T≥T2,判断风机出现故障,并发出故障信号;If T≥T2, judge that the fan is faulty and send a fault signal; 若T<T2,对所述半导体制冷模块的冷端进行加热。If T<T2, the cold end of the semiconductor refrigeration module is heated. 4.根据权利要求3所述的控制方法,其特征在于:所述加热步骤包括停止半导体制冷模块制冷;控制向所述半导体制冷模块通入既定的反向电压,并维持既定加热时长。4 . The control method according to claim 3 , wherein: the heating step comprises stopping the refrigeration of the semiconductor refrigeration module; controlling a predetermined reverse voltage to be supplied to the semiconductor refrigeration module and maintaining a predetermined heating time. 5 . 5.根据权利要求4所述的控制方法,其特征在于:所述加热步骤还包括完成既定加热时长的加热后,检测所述半导体制冷模块的冷端温度T;若所述冷端温度T小于预设加热温度,保持向所述半导体制冷模块通入既定的反向电压,再维持既定加热时长。5. The control method according to claim 4, wherein the heating step further comprises detecting the cold end temperature T of the semiconductor refrigeration module after completing the heating for a predetermined heating time; if the cold end temperature T is less than Presetting the heating temperature, maintaining a predetermined reverse voltage to the semiconductor refrigeration module, and maintaining a predetermined heating time. 6.根据权利要求3所述的控制方法,其特征在于:所述加热步骤完成后,再检测所述风机的运行状态;6. The control method according to claim 3, wherein: after the heating step is completed, the operation state of the fan is detected again; 若所述风机仍运行异常,判断风机出现故障,并发出故障信号。If the fan still runs abnormally, it is judged that the fan is faulty, and a fault signal is sent. 7.根据权利要求3所述的控制方法,其特征在于:所述控制方法还包括在检测到风机运行异常时,停止风机供电;7. The control method according to claim 3, wherein the control method further comprises stopping the power supply of the fan when it is detected that the fan is running abnormally; 所述加热步骤完成时,恢复风机供电。When the heating step is completed, power to the fan is restored. 8.根据权利要求1所述的控制方法,其特征在于:所述控制方法还包括在确认风机故障时,若检测到半导体制冷模块的冷端温度T小于第三阈值温度T3,停止所述半导体制冷模块制冷,T3<T1。8 . The control method according to claim 1 , wherein the control method further comprises stopping the semiconductor refrigeration module if the cold end temperature T of the semiconductor refrigeration module is detected to be less than a third threshold temperature T3 when the fan is confirmed to be faulty. 9 . Cooling module cooling, T3 < T1. 9.根据权利要求1所述的控制方法,其特征在于:所述“控制降低所述半导体制冷模块的工作电压”步骤是指按既定百分比值或既定电压差值降低所述半导体制冷模块的工作电压;9 . The control method according to claim 1 , wherein the step of “controlling to reduce the working voltage of the semiconductor refrigeration module” refers to reducing the operation of the semiconductor refrigeration module by a predetermined percentage value or a predetermined voltage difference value. 10 . Voltage; 所述控制方法还包括在降低所述半导体制冷模块的工作电压后,控制半导体制冷模块按照降低后的工作电压工作既定时长t。The control method further includes, after reducing the working voltage of the semiconductor refrigeration module, controlling the semiconductor refrigeration module to operate according to the reduced working voltage for a predetermined period of time t. 10.一种制冷电器,包括储藏间室、用以向所述储藏间室提供冷量的半导体制冷模块,所述半导体制冷模块的冷端配设有风机,其特征在于:所述制冷电器采用如权利要求1-9任一项所述的控制方法进行工作。10. A refrigeration appliance, comprising a storage compartment and a semiconductor refrigeration module for providing cooling capacity to the storage compartment, the cold end of the semiconductor refrigeration module is provided with a fan, and characterized in that: the refrigeration appliance adopts The control method according to any one of claims 1-9 works.
CN202010886228.0A 2020-08-28 2020-08-28 Control method of refrigeration appliance and refrigeration appliance Pending CN114111196A (en)

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