CN114112311B - Debugging method, device and storage medium of laser processing equipment - Google Patents
Debugging method, device and storage medium of laser processing equipment Download PDFInfo
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- CN114112311B CN114112311B CN202111362111.3A CN202111362111A CN114112311B CN 114112311 B CN114112311 B CN 114112311B CN 202111362111 A CN202111362111 A CN 202111362111A CN 114112311 B CN114112311 B CN 114112311B
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000003860 storage Methods 0.000 title claims abstract description 26
- 238000012360 testing method Methods 0.000 claims abstract description 237
- 238000005520 cutting process Methods 0.000 claims abstract description 174
- 230000003287 optical effect Effects 0.000 claims abstract description 48
- 230000002159 abnormal effect Effects 0.000 claims abstract description 44
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- 238000004590 computer program Methods 0.000 claims description 10
- 230000003247 decreasing effect Effects 0.000 claims description 8
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- 238000010586 diagram Methods 0.000 description 7
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- 230000005856 abnormality Effects 0.000 description 5
- 238000003698 laser cutting Methods 0.000 description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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Abstract
本申请涉及激光加工设备的调试方法、装置及存储介质，所述方法包括：获取测试文件，所述测试文件包括预设数目的至少一个图层，每一图层中设有针对预设测试板材的至少一个测试区域以及对应于测试区域的测试图案，每一图层对应所述激光加工设备的一组控制参数；根据测试图案和控制参数，控制激光加工设备在所述预设测试板材的对应测试区域进行切割加工；获取所述预设测试板材切割加工后的检测结果数据；根据所述检测结果数据，确定所述激光加工设备的光路是否存在异常缺陷，若存在异常缺陷，则进行提示，以供用户重新调整所述激光加工设备的光路，若不存在异常缺陷，则将所述控制参数与所述预设测试板材切割加工后的切割深度的对应关系进行存储。
The present application relates to a debugging method, device and storage medium for laser processing equipment, the method comprising: obtaining a test file, the test file comprising at least one layer of a preset number, each layer being provided with at least one test area for a preset test plate and a test pattern corresponding to the test area, each layer corresponding to a set of control parameters for the laser processing equipment; controlling the laser processing equipment to perform cutting processing on the corresponding test area of the preset test plate according to the test pattern and the control parameters; obtaining detection result data after the preset test plate is cut; determining whether there is an abnormal defect in the optical path of the laser processing equipment according to the detection result data, if there is an abnormal defect, giving a prompt for the user to readjust the optical path of the laser processing equipment, if there is no abnormal defect, storing the corresponding relationship between the control parameter and the cutting depth after the preset test plate is cut.
Description
Technical Field
The present invention relates to the field of laser processing technologies, and in particular, to a method and apparatus for debugging a laser processing device, and a storage medium.
Background
With the development of automation technology, laser processing equipment is also becoming more and more widely used. For example, laser processing equipment may be used to punch or cut a sheet material such as a PCB. The principle is that the high-power laser beam irradiates the sheet material to heat and evaporate the irradiated part of the sheet material, so as to form holes or slits.
Before using the laser processing equipment to process the panel, the laser processing equipment is usually required to be debugged or detected, and the laser processing equipment is mainly used for adjusting the light path of the laser processing equipment in the prior art, for example, whether the light path is abnormal or not can be determined by punching and observing the errors of the aperture of the hole in a plurality of directions. However, the inventors realized that during the laser cutting process, the cutting process and the control parameters of different boards are different, for example, the control parameters corresponding to different boards are different for the same cutting depth, and the relationship between the control parameters of specific boards and the cutting depth is tested little by little, so that the debugging efficiency of the prior art is lower.
Disclosure of Invention
The embodiment of the invention provides a debugging method, a device and a storage medium of laser processing equipment, which can detect the laser processing equipment before the laser processing equipment processes a preset plate, detect whether an optical path of the laser processing equipment is abnormal or not, and can efficiently acquire the corresponding relation between the cutting depth of the preset plate and control parameters, thereby improving the detection efficiency of the laser processing equipment.
In a first aspect, the present application provides a method for debugging a laser processing apparatus, the method comprising:
Obtaining a test file, wherein the test file comprises at least one layer with a preset number, at least one test area aiming at a preset test board and a test pattern corresponding to the test area are arranged in each layer, and each layer corresponds to a group of control parameters of the laser processing equipment;
controlling the laser processing equipment to cut and process in a corresponding test area of the preset test board according to the test pattern and the control parameter;
Acquiring detection result data of the preset test board after cutting processing;
And determining whether the optical path of the laser processing equipment has an abnormal defect according to the detection result data, prompting if the optical path of the laser processing equipment has the abnormal defect, readjusting the optical path of the laser processing equipment by a user, and storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing if the optical path of the laser processing equipment does not have the abnormal defect.
With reference to the first aspect, in a possible implementation manner, the control parameters corresponding to each layer include a fixed control parameter and a gradual change control parameter, and the fixed control parameters corresponding to all the layers are kept unchanged, and the gradual change control parameter is increased or decreased according to a preset rule and the sequence of the layers.
With reference to the first aspect, in a possible implementation manner, the gradual change control parameter is increased or decreased according to a preset fixed step size according to the sequence of the layers.
With reference to the first aspect, in a possible implementation manner, the laser light adding device includes an XY two-dimensional galvanometer, and two test areas for a preset test board are disposed in each layer, where one of the test areas corresponds to a first test pattern having a cutting direction in the same direction as an X axis of the XY two-dimensional galvanometer, and the other test area corresponds to a second test pattern having a cutting direction in the same direction as an Y axis of the XY two-dimensional galvanometer.
With reference to the first aspect, in a possible implementation manner, the first test pattern and the second test pattern are a plurality of parallel cutting lines.
With reference to the first aspect, in a possible implementation manner, the step of obtaining the detection result data of the preset test board after cutting includes:
cutting and slicing the preset test board after cutting, enabling the cutting trace of each test pattern to be located on a cutting surface, and acquiring size data of the cutting trace through a microscope.
With reference to the first aspect, in a possible implementation manner, the step of storing the correspondence between the control parameter and the cutting depth of the preset test board after cutting includes:
And fitting the control parameters and the cutting depth into a preset functional relation, and storing.
In a second aspect, the present application provides a debugging device for a laser processing apparatus, which is characterized in that the device includes:
the first acquisition unit is used for acquiring a test file, wherein the test file comprises at least one layer with a preset number, at least one test area aiming at a preset test plate and a test pattern corresponding to the test area are arranged in each layer, and each layer corresponds to one group of control parameters of the laser processing equipment;
The driving control unit is used for controlling the laser processing equipment to cut and process in a corresponding test area of the preset test board according to the test pattern and the control parameter;
The second acquisition unit is used for acquiring the detection result data of the preset test board after cutting processing;
An analysis processing unit for determining whether the optical path of the laser processing equipment has abnormal defects according to the detection result data, and
And the storage unit is used for storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing when no abnormal defect exists.
With reference to the second aspect, in a possible implementation manner, the control parameters corresponding to each layer include a fixed control parameter and a gradual change control parameter, and the fixed control parameters corresponding to all the layers are kept unchanged, and the gradual change control parameter is increased or decreased according to a preset rule and the sequence of the layers;
The laser light adding equipment comprises an XY two-dimensional vibrating mirror, two test areas aiming at a preset test board are arranged in each image layer, one test area corresponds to a first test pattern with the cutting direction being in the same direction as the X axis of the XY two-dimensional vibrating mirror, and the other test area corresponds to a second test pattern with the cutting direction being in the same direction as the Y axis of the XY two-dimensional vibrating mirror;
and the storage unit is used for fitting the control parameters and the cutting depth into a preset functional relation and storing the functional relation.
In a third aspect, the present application provides a computer readable storage medium, where a computer program is stored, where the computer program controls, when running, a device where the computer readable storage medium is located to execute the method for debugging a laser processing device according to the first aspect
According to the debugging method, the device and the storage medium of the laser processing equipment, the test file is firstly obtained, the test file comprises a plurality of layers, each layer corresponds to a control parameter, each layer further comprises a test area and a test pattern for a preset test board, cutting processing is carried out on the preset test board according to the control parameters and the test patterns, detection result data after cutting processing are obtained, whether an optical path of the laser processing equipment is abnormal or not is firstly determined according to the detection result data, and when the optical path of the laser processing equipment is abnormal or not, the corresponding relation between the control parameters and the cutting depth can be stored, so that whether the optical path of the laser processing equipment is abnormal or not is detected, and the corresponding relation between the cutting depth of the preset board and the control parameters can be obtained efficiently, and therefore the detection efficiency of the laser processing equipment is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1 is a schematic view of an application environment provided by an embodiment of the present application;
Fig. 2 is a schematic flow chart of a debugging method of a laser processing device according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a processed shape of a test file according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a cutting trace when an optical path abnormality exists in a laser processing apparatus according to an embodiment of the present application;
FIG. 5 is a schematic view of a cutting trace when no optical path abnormality exists in the laser processing apparatus in the embodiment of the present application;
FIG. 6 is a schematic view of the cutting depth of each cutting trace on the cut surface of a predetermined test sheet in accordance with an embodiment of the present application;
FIG. 7 is a functional block diagram of a debugging device of a laser processing apparatus in an embodiment of the present application;
fig. 8 is a schematic structural diagram of a computer device in an embodiment of the present application.
Detailed Description
For a better understanding of the technical solution of the present invention, the following detailed description of the embodiments of the present invention refers to the accompanying drawings.
It should be understood that the described embodiments are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely an association relationship describing the associated object, and means that there may be three relationships, e.g., a and/or B, and that there may be three cases where a exists alone, while a and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe the terminals in the embodiments of the present invention, these terminals should not be limited to these terms. These terms are only used to distinguish terminals from one another. For example, a first terminal may also be referred to as a second terminal, and similarly, a second terminal may also be referred to as a first terminal, without departing from the scope of embodiments of the present invention.
The term "if" as used herein may be interpreted as "at" or "when" depending on the context "or" in response to a determination "or" in response to a detection. Similarly, the phrase "if determined" or "if detected (stated condition or event)" may be interpreted as "when determined" or "in response to determination" or "when detected (stated condition or event)" or "in response to detection (stated condition or event), depending on the context.
Referring to fig. 1, a schematic view of an application environment according to an embodiment of the present application is shown.
The application environment of the embodiment of the application comprises a working platform 1, a preset test board 2 and laser processing equipment 3.
The laser processing device 3 has the function of realizing operations such as laser drilling, laser cutting and the like aiming at a preset test board. The laser processing apparatus 3 includes a necessary laser and an optical path component. The laser is used for generating laser light, the optical path component can include a plurality of reflecting components, and the reflecting components are arranged on the optical path of the laser light output by the laser. Generally, the laser processing apparatus 3 mainly performs processing on a two-dimensional board, for example, the laser processing apparatus 3 may perform operations such as windowing on a PCB board. In order to process a two-dimensional plate, a two-dimensional vibrating mirror and a focusing mirror are generally included in laser processing equipment, so that planning of a two-dimensional cutting path can be achieved.
Before the laser processing device 3 of the present application processes an actual board to be processed (such as a PCB board), a preset test board 2 may be tested and processed, where the preset test board 2 and the actual board to be processed are made of the same material. In the application environment of the application, the laser processing equipment 3 carries out processing test on the preset test board 2, is mainly used for detecting whether the laser processing equipment 3 has abnormal light path, and simultaneously obtains the corresponding relation between the control parameter and the cutting depth under the condition of the material of the current preset test board, so that when the actual board to be processed is processed in the follow-up process, the control parameter of the laser processing equipment 3 can be quickly adjusted according to the required cutting depth.
Before the laser processing device 3 in the application environment of the application performs test processing on the preset test board 2 to realize the debugging of the laser processing device, the following processing procedures are required to be completed:
First, it is necessary to preliminarily adjust the optical path inside the laser processing apparatus 3. Then, it is necessary to mount the two-dimensional galvanometer and the focusing mirror and adjust the optical paths of the focusing mirror and the two-dimensional galvanometer portion. At this time, the laser processing apparatus 3 is reset.
And then adjusting the working platform 1 to be flush with the plane of the two-dimensional vibrating mirror, wherein the X, Y direction of the working platform 1 is respectively consistent with the X, Y direction of the two-dimensional vibrating mirror.
And finally, placing the preset test board 2 on the working platform 1, wherein the surface of the preset test board 2 is flush with the surface of the working platform 1, namely, the preset test board 2 is uniformly adsorbed on the surface of the working platform 1. And the distance between the focusing mirror and the working platform 1 should be set to the theoretical focal length of the focusing mirror.
The laser processing device 3 in the application comprises a memory and a processor, wherein the memory stores computer program instructions, and the processor realizes the following steps when executing the computer program to realize the debugging of the laser processing device, including the detection of the light path abnormality and the acquisition of the control depth relation:
S1, acquiring a test file, wherein the test file comprises at least one layer with a preset number, at least one test area aiming at a preset test board and a test pattern corresponding to the test area are arranged in each layer, and each layer corresponds to one group of control parameters of the laser processing equipment;
s2, controlling the laser processing equipment to cut and process in a corresponding test area of the preset test board according to the test pattern and the control parameter;
S3, obtaining detection result data of the preset test board after cutting processing;
And S4, determining whether the optical path of the laser processing equipment has an abnormal defect according to the detection result data, prompting if the optical path of the laser processing equipment has the abnormal defect, readjusting the optical path of the laser processing equipment by a user, and storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing if the optical path of the laser processing equipment has no abnormal defect.
The following is a further detailed description of S1 to S4.
S1, acquiring a test file.
Specifically, the laser processing apparatus 3 in the embodiment of the present application may, but is not limited to, control the cutting head to perform the cutting operation on the preset test board 2 in the form of laser cutting control software. The function of the test file is to read by the laser processing device 3 so as to identify the control parameters and the process of the laser processing device 3 for cutting the set path of the plate.
In one embodiment of the present application, the test file includes at least one layer of a preset number, wherein each layer is provided with at least one test area for a preset test board and a test pattern corresponding to the test area, and each layer corresponds to a set of control parameters of the laser processing device.
Specifically, the control parameters are the same for the test patterns in each test area in the same layer, and the control parameters may be, but are not limited to, parameters such as power, laser pulse time, frequency, cutting head moving speed, etc. of the laser processing apparatus 3. For the relation of control parameters of a plurality of layers, in particular to investigate the relation of certain control parameters to the final cutting depth, it is possible to keep the other predetermined number of control parameters unchanged, while the control parameters to be investigated are set to vary with the layers. The fixed parameters are called fixed control parameters, the changed control parameters are called gradual change control parameters, that is, the control parameters corresponding to each layer include fixed control parameters and gradual change control parameters, the fixed control parameters corresponding to all layers remain unchanged, and gradual change control parameters are increased or decreased according to a preset rule according to the sequence of the layers, for example, but not limited to, the gradual change control parameters are increased or decreased according to a preset fixed step size.
The test pattern designates the cutting path of the laser processing apparatus, that is, the shape of the cutting trace after the final cutting of the preset test board 2. The test pattern may be a closed pattern or a non-closed pattern. For the laser processing device 3 with the two-dimensional vibrating mirror, in order to facilitate the detection of the light path abnormality, two test areas for a preset test board may be provided in each layer, wherein one test area corresponds to a first test pattern with the cutting direction being in the same direction as the X axis of the XY two-dimensional vibrating mirror, and the other test area corresponds to a second test pattern with the cutting direction being in the same direction as the Y axis of the XY two-dimensional vibrating mirror. Further, the first test pattern and the second test pattern may each be a plurality of parallel dicing lines.
Fig. 3 is a schematic diagram of a specific test file. The test file in fig. 3 has 10 layers in total, and each layer includes two test areas and two corresponding test patterns. For example, the test patterns 1A, 1B, and 1A in the layer 1 are four parallel cutting lines along the X-axis cutting direction (also referred to as the transverse direction in the embodiment of the present application) of the two-dimensional galvanometer, and 1B is four parallel cutting lines along the Y-axis cutting direction (also referred to as the longitudinal direction in the embodiment of the present application) of the two-dimensional galvanometer. By analogy, there are two test patterns 10A and 10B in layer 10. The control parameters of cutting the test patterns in the same layer are consistent, and the control parameters can be power, laser pulse time, frequency, cutting head moving speed and the like. The test file in fig. 3 may be, for example, but not limited to, to examine the correspondence between the moving speed of the cutting head and the cutting depth, in different layers, the moving speed of the cutting head may be set to be changed in a gradual manner, while other control parameters remain unchanged, for example, the moving speed of the cutting head corresponding to the layer 1 is 100mm/s, and the adjacent layers are accumulated with a step length of 100, so that the corresponding speed of the layer 10 is 1000mm/s. Each test pattern is provided with a plurality of parallel cutting lines, so that the cutting results of the same test pattern on the same layer are conveniently observed, and the cutting results of different layers are conveniently observed.
S2, controlling the laser processing equipment to cut and process in a corresponding test area of a preset test plate according to the test pattern and the control parameters.
S3, obtaining detection result data of the preset test board after cutting processing.
In one embodiment of the present application, the preset test board after the cutting process may be cut into slices, and the cutting trace of each test pattern may be located on the cutting surface, and the size data of the cutting trace may be acquired through a microscope. The size data of the cutting trace can be used as the detection result data after the preset test board is processed. The detection result data can be input into a laser processing device for sorting. The size data of the cutting trace may be, but not limited to, the slit width, depth, etc. of the cutting groove.
And S4, determining whether the optical path of the laser processing equipment has an abnormal defect according to the detection result data, prompting if the optical path of the laser processing equipment has the abnormal defect, readjusting the optical path of the laser processing equipment by a user, and storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing if the optical path of the laser processing equipment has no abnormal defect.
In the embodiment of the application, whether the optical path of the laser light adding device has abnormal defects or not is determined according to the detection result data, and the judgment can be carried out according to the size of the cutting trace. The method is particularly but not limited to judging whether the slit widths of the cutting grooves of the parallel cutting lines in the same test pattern in the same layer are consistent, whether the cutting depths are consistent, and whether the cutting depths and slit widths of two different cutting directions (namely transverse and longitudinal directions) of the same layer are consistent. For example, taking fig. 4 as an example, the light spots in the transverse direction and the longitudinal direction are elliptical, and the width of the slit in the transverse direction is not completely consistent, which represents that the optical path of the laser processing device is abnormal, and further debugging is required. In the illustration of fig. 5, the light spots in the transverse direction and the longitudinal direction are close to standard circles, and the slit widths are consistent, which means that the optical path of the laser processing equipment is adjusted, and no abnormal defects exist.
When the light path of the laser processing equipment is not abnormal, the corresponding relation between the control parameter and the cutting depth can be stored for later adjustment and use in the process of processing the actual plate. In a specific embodiment, the control parameter may be fitted to the cutting depth as a preset functional relationship and stored. Taking fig. 6 as an example, for a cut surface of a preset test board 2 after cutting, 1 b-5 b is a section of a cutting groove corresponding to 5 groups of test patterns, only the moving speed of the cutting head in the control parameters corresponding to the 5 groups of test patterns keeps gradual change, that is, the moving speed corresponding to 1b can be 100mm/s, the moving speed corresponding to 2b is 200mm/s, the moving speed corresponding to 5b is 500mm/s, in this embodiment, the fitting relation between the moving speed and the cutting depth is set as a linear function relation, and if the cutting depth corresponding to 1b is 50um, the cutting depth corresponding to 2b is 45um, and the cutting depth corresponding to 3b is 40um, it is easy to infer that when the moving speed is 350mm/s, and under the condition that other control parameters keep unchanged, the corresponding cutting depth should be about 37.5 mm. The fitting relationship between the specific control parameter and the cutting depth may be other function fitting relationships, and will not be described herein.
Referring to fig. 2, a flow chart of a method for debugging a laser processing apparatus according to an embodiment of the present application is shown.
Specifically, the debugging method of the laser processing equipment in the embodiment of the application comprises the following steps:
S21, acquiring a test file, wherein the test file comprises at least one layer with a preset number, at least one test area aiming at a preset test board and a test pattern corresponding to the test area are arranged in each layer, and each layer corresponds to one group of control parameters of the laser processing equipment;
S22, controlling the laser processing equipment to cut and process in a corresponding test area of the preset test board according to the test pattern and the control parameter;
s23, obtaining detection result data of the preset test board after cutting processing;
And S24, determining whether the optical path of the laser processing equipment has an abnormal defect according to the detection result data, prompting if the optical path of the laser processing equipment has the abnormal defect, readjusting the optical path of the laser processing equipment by a user, and storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing if the optical path of the laser processing equipment has no abnormal defect.
Steps S21-S24 are further described in a more detailed embodiment of the application.
And S21, acquiring a test file.
Specifically, the laser processing apparatus 3 in the embodiment of the present application may, but is not limited to, control the cutting head to perform the cutting operation on the preset test board 2 in the form of laser cutting control software. The function of the test file is to read by the laser processing device 3 so as to identify the control parameters and the process of the laser processing device 3 for cutting the set path of the plate.
In one embodiment of the present application, the test file includes a preset number of layers, each layer corresponding to a set of control parameters of the laser processing apparatus, and at least one test area for a preset test board and a test pattern corresponding to the test area are provided in each layer.
Specifically, the control parameters are the same for the test patterns in each test area in the same layer, and the control parameters may be, but are not limited to, parameters such as power, laser pulse time, frequency, cutting head moving speed, etc. in the laser processing apparatus 3. For the relation of control parameters of a plurality of layers, in particular to investigate the relation of certain control parameters to the final cutting depth, it is possible to keep the other predetermined number of parameters unchanged, while the control parameters to be investigated are set to vary with the layers. The fixed parameters are called fixed control parameters, the changed control parameters are called gradual change control parameters, that is, the control parameters corresponding to each layer include fixed control parameters and gradual change control parameters, the fixed control parameters corresponding to all layers remain unchanged, and gradual change control parameters are increased or decreased according to a preset rule according to the sequence of the layers, for example, but not limited to, the gradual change control parameters are increased or decreased according to a preset fixed step size.
The test pattern designates the cutting path of the laser processing apparatus, that is, the shape of the cutting trace after the final cutting of the preset test board 2. The test pattern may be a closed pattern or a non-closed pattern. For the laser processing device 3 with the two-dimensional vibrating mirror, in order to facilitate the detection of the light path abnormality, two test areas for a preset test board may be provided in each layer, wherein one test area corresponds to a first test pattern with the cutting direction being in the same direction as the X axis of the XY two-dimensional vibrating mirror, and the other test area corresponds to a second test pattern with the cutting direction being in the same direction as the Y axis of the XY two-dimensional vibrating mirror. Further, the first test pattern and the second test pattern may each be a plurality of parallel dicing lines. Fig. 3 is a schematic diagram of a specific test file. The test file in fig. 3 has 10 layers in total, and each layer includes two test areas and two corresponding test patterns. For example, the test patterns 1A, 1B, and 1A in the layer 1 are four parallel cutting lines along the X-axis cutting direction (also referred to as the transverse direction in the embodiment of the present application) of the two-dimensional galvanometer, and 1B is four parallel cutting lines along the Y-axis cutting direction (also referred to as the longitudinal direction in the embodiment of the present application) of the two-dimensional galvanometer. By analogy, there are two test patterns 10A and 10B in layer 10. The control parameters of cutting the test patterns in the same layer are consistent, and the control parameters can be power, laser pulse time, frequency, cutting head moving speed and the like. The test file in fig. 3 may be, for example, but not limited to, to examine the correspondence between the moving speed of the cutting head and the cutting depth, in different layers, the moving speed of the cutting head may be set to be changed in a gradual manner, while other control parameters remain unchanged, for example, the moving speed of the cutting head corresponding to the layer 1 is 100mm/s, and the adjacent layers are accumulated with a step length of 100, so that the corresponding speed of the layer 10 is 1000mm/s. Each test pattern is provided with a plurality of parallel cutting lines, so that the cutting results of the same test pattern on the same layer are conveniently observed, and the cutting results of different layers are conveniently observed.
S22, controlling the laser processing equipment to cut and process in a corresponding test area of a preset test plate according to the test pattern and the control parameters.
S23, obtaining detection result data of the preset test board after cutting processing.
In one embodiment of the present application, the preset test board after the cutting process may be cut into slices, and the cutting trace of each test pattern may be located on the cutting surface, and the size data of the cutting trace may be acquired through a microscope. The size data of the cutting trace can be used as the detection result data after the preset test board is processed. The detection result data can be input into a laser processing device for sorting. The size data of the cutting trace may be, but not limited to, the slit width, depth, etc. of the cutting groove.
And S24, determining whether the optical path of the laser processing equipment has an abnormal defect according to the detection result data, prompting if the optical path of the laser processing equipment has the abnormal defect, readjusting the optical path of the laser processing equipment by a user, and storing the corresponding relation between the control parameter and the cutting depth of the preset test board after cutting processing if the optical path of the laser processing equipment has no abnormal defect.
In the embodiment of the application, whether the optical path of the laser light adding device has abnormal defects or not is determined according to the detection result data, and the judgment can be carried out according to the size of the cutting trace. The method is particularly but not limited to judging whether the slit widths of the cutting grooves of the parallel cutting lines in the same test pattern in the same layer are consistent, whether the cutting depths are consistent, and whether the cutting depths and slit widths of two different cutting directions (namely transverse and longitudinal directions) of the same layer are consistent. For example, taking fig. 4 as an example, the light spots in the transverse direction and the longitudinal direction are elliptical, and the width of the slit in the transverse direction is not completely consistent, which represents that the optical path of the laser processing device is abnormal, and further debugging is required. In the illustration of fig. 5, the light spots in the transverse direction and the longitudinal direction are close to standard circles, and the slit widths are consistent, which means that the optical path of the laser processing equipment is adjusted, and no abnormal defects exist.
When the light path of the laser processing equipment is not abnormal, the corresponding relation between the control parameter and the cutting depth can be stored for later adjustment and use in the process of processing the actual plate. In a specific embodiment, the control parameter may be fitted to the cutting depth as a preset functional relationship and stored. Taking fig. 6 as an example, for a cut surface of a preset test board 2 after cutting, 1 b-5 b is a section of a cutting groove corresponding to 5 groups of test patterns, only the moving speed of the cutting head in the control parameters corresponding to the 5 groups of test patterns keeps gradual change, that is, the moving speed corresponding to 1b can be 100mm/s, the moving speed corresponding to 2b is 200mm/s, the moving speed corresponding to 5b is 500mm/s, in this embodiment, the fitting relation between the moving speed and the cutting depth is set as a linear function relation, and if the cutting depth corresponding to 1b is 50um, the cutting depth corresponding to 2b is 45um, and the cutting depth corresponding to 3b is 40um, it is easy to infer that when the moving speed is 350mm/s, and under the condition that other control parameters keep unchanged, the corresponding cutting depth should be about 37.5 mm. The fitting relationship between the specific control parameter and the cutting depth may be other function fitting relationships, and will not be described herein.
According to the debugging method of the laser processing equipment, the test file is firstly obtained, the test file comprises the plurality of layers, each layer corresponds to the control parameter, each layer further comprises the test area and the test pattern aiming at the preset test plate, cutting processing is carried out on the preset test plate according to the control parameters and the test patterns, then the detection result data after cutting processing are obtained, whether the optical path of the laser processing equipment is abnormal or not is firstly determined according to the detection result data, and when the optical path of the laser processing equipment is abnormal or not, the corresponding relation between the control parameters and the cutting depth can be stored, so that whether the optical path of the laser processing equipment is abnormal or not is detected, and the corresponding relation between the cutting depth of the preset plate and the control parameters can be obtained efficiently, and therefore the detection efficiency of the laser processing equipment is improved.
Fig. 7 is a functional block diagram of a debugging device of a laser processing apparatus according to an embodiment of the present application.
The debugging device 700 includes:
A first obtaining unit 701, configured to obtain a test file, where the test file includes a preset number of at least one layer, each layer is provided with at least one test area for a preset test board and a test pattern corresponding to the test area, and each layer corresponds to a set of control parameters of the laser processing device;
A driving control unit 702, configured to control the laser processing apparatus to perform cutting processing in a corresponding test area of the preset test board according to the test pattern and the control parameter;
a second obtaining unit 703, configured to obtain detection result data of the preset test board after cutting;
An analysis processing unit 704 for determining whether the optical path of the laser processing device has abnormal defects according to the detection result data, and
And the storage unit 705 is configured to store, when no abnormal defect exists, a correspondence between the control parameter and a cutting depth of the preset test board after cutting.
The embodiment of the application also provides a computer readable storage medium, wherein the storage medium comprises a stored program, and the device where the storage medium is controlled to execute the debugging method of the laser processing device when the program runs.
The embodiment of the application also provides a computer device 800, as shown in fig. 8. The computer device 800 of this embodiment includes a processor 801, a memory 802, and a computer program 803 stored in the memory and capable of running on the processor 801, where the processor 801 implements the method of the laser light adding device of the embodiment when executing the computer program 803, and is not described herein in detail to avoid repetition. Or the computer program, when executed by the processor 801, performs the functions of the various models/units in the debugging device of the embodiment, and is not described herein in detail for avoiding repetition.
The computer device 800 may be a desktop computer, a notebook computer, a palm top computer, a cloud server, a laser processing device, or the like. Computer devices may include, but are not limited to, a processor 301, a memory 302. It will be appreciated by those skilled in the art that fig. 8 is merely an example of a computer device 800 and is not intended to limit the computer device 800, and may include more or fewer components than shown, or may combine certain components, or different components, e.g., a computer device may also include an input-output device, a network access device, a bus, etc.
The Processor 801 may be a central processing unit (Central Processing Unit, CPU), other general purpose Processor, digital signal Processor (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), field-Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 802 may be an internal storage unit of the computer device 800, such as a hard disk or a memory of the computer device 800. The memory 802 may also be an external storage device of the computer device 300, such as a plug-in hard disk provided on the computer device 800, a smart memory card (SMART MEDIA CARD, SMC), a Secure Digital (SD) card, a flash memory card (FLASH CARD), or the like. Further, the memory 802 may also include both internal storage units and external storage devices of the computer device 800. The memory 802 is used to store computer programs and other programs and data required by the computer device. The memory 802 may also be used to temporarily store data that has been output or is to be output.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.
In the several embodiments provided in the present invention, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the above elements is merely a logical functional division, and there may be additional divisions in actual implementation, e.g., multiple elements or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.
The integrated units implemented in the form of software functional units described above may be stored in a computer readable storage medium. The software functional unit is stored in a storage medium, and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a Processor (Processor) to perform part of the steps of the method according to the embodiments of the present invention. The storage medium includes a U disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, an optical disk, or other various media capable of storing program codes.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (8)
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| CN114769898B (en) * | 2022-03-11 | 2024-06-07 | 大族激光科技产业集团股份有限公司 | Laser processing control method, device and readable storage medium |
| CN116140822B (en) * | 2022-11-22 | 2025-07-04 | 广州广合科技股份有限公司 | A method for detecting energy decay of UV laser cutting machine laser |
| CN116000475B (en) * | 2023-03-23 | 2023-06-09 | 深圳欧斯普瑞智能科技有限公司 | Laser cutting head control method, device, computer equipment and storage medium |
| CN116551216B (en) * | 2023-07-07 | 2023-09-26 | 深圳市耐恩科技有限公司 | Control method and device for carrying out laser cutting on pole piece and laser cutting equipment |
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