Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the disclosure provides a display substrate, a preparation method thereof, a display device and an improved packaging effect.
The embodiment of the disclosure provides a display substrate, the display substrate includes a substrate, the substrate includes a display area and a peripheral area surrounding the display area, the display substrate includes a water absorption structure layer disposed in the peripheral area, the water absorption structure layer includes a plurality of water absorption units disposed at intervals along a direction from the display area to a direction close to the display area, and the display substrate further includes a water blocking structure layer covering the water absorption structure layer.
In an exemplary embodiment, the peripheral region includes a gate driving circuit region provided with a signal trace and a gate driving circuit, and the water absorbing structure layer includes a plurality of first water absorbing cells disposed between the gate driving circuit region and the display region.
In an exemplary embodiment, at least two adjacent first water absorbing units have a distance between the front projections of the first water absorbing units on the substrate, which is 2 to 3 times the distance between the front projections of the remaining adjacent first water absorbing units on the substrate.
In an exemplary embodiment, the water absorbing structure layer further includes a second water absorbing unit disposed outside the gate driving circuit region at a side remote from the display region.
In an exemplary embodiment, the water absorbing structure layer further includes a third water absorbing unit disposed on a side of the gate driving circuit away from the substrate, where the orthographic projection of the third water absorbing unit on the substrate overlaps with the orthographic projection of the gate driving circuit on the substrate.
In an exemplary embodiment, the display substrate further includes a pixel defining layer disposed in the display area defining a pixel opening area, and the water absorbing unit is disposed in the same layer as the pixel defining layer.
In an exemplary embodiment, the water blocking structure layer includes an encapsulation layer, and the orthographic projection of the display area and the first water absorbing unit on the substrate is located in the orthographic projection of the encapsulation layer on the substrate.
In an exemplary embodiment, the water blocking structure layer includes a frame sealing glue layer, and the orthographic projection of the second water absorbing unit on the substrate is located in the orthographic projection of the frame sealing glue layer on the substrate.
An embodiment of the present disclosure provides a display device, including the display substrate according to any one of the embodiments.
An embodiment of the present disclosure provides a method for preparing a display substrate, the display substrate including a base including a display region and a peripheral region surrounding the display region, the method including:
forming a water absorption structure layer in the peripheral area of the substrate, wherein the water absorption structure layer comprises a plurality of water absorption units which are arranged at intervals along the direction from the display area to the direction close to the display area;
And forming a water blocking structure layer covering the water absorbing structure layer on one side of the water absorbing structure layer away from the substrate.
The embodiment of the disclosure comprises a display substrate, a preparation method thereof and a display device, wherein the display substrate comprises a substrate, the substrate comprises a display area and a peripheral area surrounding the display area, the display substrate comprises a water absorption structure layer arranged in the peripheral area, the water absorption structure layer comprises a plurality of water absorption units arranged at intervals along the direction from the display area to the direction from the display area, and the display substrate further comprises a water blocking structure layer covering the water absorption structure layer. According to the scheme provided by the embodiment, from the outermost side far away from the display area, water vapor entering the display substrate is absorbed by the water absorption units, the water vapor entering the display substrate is blocked by the water blocking structural layer after water absorption, the water vapor entering the display substrate continuously is absorbed by the next water absorption unit, the water vapor is blocked by the water blocking structural layer after water absorption, and the water vapor can be well isolated through the blocking of the water absorption units and the water blocking structural layer, so that the packaging effect is improved, and the service life of a product is prolonged.
Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the disclosure. The objectives and other advantages of the disclosure may be realized and attained by the structure particularly pointed out in the written description and drawings.
Other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments of the present disclosure and features in the embodiments may be arbitrarily combined with each other without collision.
The steps illustrated in the flowchart of the figures may be performed in a computer system, such as a set of computer-executable instructions. Also, while a logical order is depicted in the flowchart, in some cases, the steps depicted or described may be performed in a different order than presented herein.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs.
In the drawings, the size of each constituent element, the thickness of a layer, or a region may be exaggerated for clarity. Accordingly, embodiments of the present disclosure are not necessarily limited to this size, and the shapes and sizes of the various components in the drawings do not reflect actual proportions. Furthermore, the drawings schematically show ideal examples, and the embodiments of the present disclosure are not limited to the shapes or the numerical values shown in the drawings.
The ordinal numbers of "first", "second", "third", etc. in the present disclosure are provided to avoid intermixing of constituent elements, and do not denote any order, quantity, or importance.
In the present disclosure, for convenience, terms such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to describe positional relationships of the constituent elements with reference to the drawings, only for convenience in describing the present specification and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction in which the respective constituent elements are described. Therefore, the present invention is not limited to the words described in the disclosure, and may be replaced as appropriate.
In this disclosure, the terms "mounted," "connected," and "connected" are to be construed broadly, unless otherwise specifically indicated and defined. For example, they may be fixedly connected or detachably connected or integrally connected, they may be mechanically connected or electrically connected, they may be directly connected or indirectly connected through an intermediate member, or they may be in communication with the inside of two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.
In this disclosure, a transistor refers to an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between a drain electrode (a drain electrode terminal, a drain region, or a drain electrode) and a source electrode (a source electrode terminal, a source region, or a source electrode), and a current can flow through the drain electrode, the channel region, and the source electrode. In the present disclosure, a channel region refers to a region through which current mainly flows.
In this disclosure, "electrically connected" includes a case where constituent elements are connected together by an element having some electric action. The "element having a certain electric action" is not particularly limited as long as it can transmit and receive an electric signal between the constituent elements connected. Examples of the "element having some electric action" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.
In the present disclosure, "parallel" refers to a state in which two straight lines form an angle of-10 ° or more and 10 ° or less, and thus, a state in which the angle is-5 ° or more and 5 ° or less is also included. The term "perpendicular" refers to a state in which the angle formed by two straight lines is 80 ° or more and 100 ° or less, and thus includes a state in which the angle is 85 ° or more and 95 ° or less.
In this disclosure, "film" and "layer" may be interchanged. For example, the "conductive layer" may be sometimes replaced with a "conductive film". In the same manner, the "insulating film" may be replaced with the "insulating layer" in some cases.
The phrase "a and B are co-layer disposed" in this disclosure means that a and B are formed simultaneously by the same patterning process.
Fig. 1 is a schematic cross-sectional view of a display substrate according to an exemplary embodiment. As shown in fig. 1, the display substrate includes a base 1, the base 1 includes a display area 100 and a peripheral area 200 surrounding the display area, the display substrate includes a water-absorbing structure layer disposed in the peripheral area 200, the water-absorbing structure layer includes a plurality of water-absorbing units disposed at intervals along a direction from the display area to a direction close to the display area, and the display substrate further includes a water-blocking structure layer covering the water-absorbing structure layer.
According to the scheme provided by the embodiment, from the outermost side far away from the display area, water vapor entering the display substrate is absorbed by the water absorption units, the water vapor entering the display substrate is blocked by the water blocking structural layer after water absorption, the water vapor entering the display substrate continuously is absorbed by the next water absorption unit, the water vapor is blocked by the water blocking structural layer after water absorption, and the water vapor can be well isolated through the blocking of the water absorption units and the water blocking structural layer, so that the packaging effect is improved, and the service life of a product is prolonged.
In an exemplary embodiment, the peripheral region 200 may include a gate driving circuit region 201 provided with a gate driving circuit and a signal trace, and the water absorbing structure layer may include a plurality of first water absorbing cells 5 disposed between the gate driving circuit region 201 and the display region 100. I.e. the first suction unit 5 is arranged in the area 202. The display area 100 may include a plurality of sub-pixels including a pixel driving circuit, and the gate driving circuit supplies a gate driving signal to the pixel driving circuit. The signal traces may include various signal traces, such as power lines, clock signal lines, etc., that provide the desired signals for the gate drive circuitry. The signal trace is disposed on a side of the gate driving circuit away from the display area 100.
In an exemplary embodiment, the display substrate may further include a pixel defining layer disposed at the display area 100 to define a pixel opening area, and the water absorbing unit may be disposed at the same layer as the pixel defining layer. For example, the display substrate may include a driving structure layer disposed on the substrate, and a light emitting structure layer disposed on a side of the driving structure layer away from the substrate 1, where the light emitting structure layer may include, for example, a first electrode, a pixel defining layer, an organic light emitting layer, and a second electrode sequentially disposed from a direction close to the substrate to a direction far from the substrate. The embodiments of the present disclosure are not limited thereto and the water absorbing unit may be disposed at a different layer from the pixel defining layer.
In an exemplary embodiment, the water absorbing unit may be prepared using polyimide, acryl, polyethylene terephthalate, or the like.
In an exemplary embodiment, the water blocking structure layer may include an encapsulation layer 9, and the front projection of the display area 100 and the first water absorbing unit 5 on the substrate 1 is located within the front projection of the encapsulation layer 9 on the substrate 1. Namely, in the present embodiment, the encapsulation layer 9 covers the display area 100 and the encapsulation layer 9 of the first water absorbing unit 5. After the first water absorbing unit 5 absorbs water vapor, the first water absorbing unit is blocked by the packaging layer 9, and the water vapor finally entering the display area 100 is greatly reduced by absorbing the water vapor and blocking the water vapor for multiple times, so that a good packaging effect is achieved.
In an exemplary embodiment, the encapsulation layer 9 may include a first inorganic encapsulation layer and a second inorganic encapsulation layer sequentially disposed from the direction close to the substrate 1 to the direction away from the substrate 1, or a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer sequentially disposed from the direction close to the substrate 1 to the direction away from the substrate 1.
In an exemplary embodiment, in a plane parallel to the substrate, at least two adjacent first water absorbing units 5 have a distance d1 between orthographic projections of 2 to 3 times as large as a distance d2 between orthographic projections of other adjacent first water absorbing units 5. According to the scheme provided by the embodiment, when a larger distance exists between the first water absorption units 5, the packaging layer 9 can be attached to the substrate 1 well, gaps exist between the packaging layer 9 and the substrate 1, water vapor continuously enters the side, close to the display area 100, of the display substrate from the gaps, and the water vapor entering the display substrate from the side, far away from the display area, can be well blocked, and the packaging effect is improved. The embodiments of the present disclosure are not limited thereto, and the distances d1 and d2 may be other relationships, for example, d1 may be greater than 3 times d2, or d1 may be equal to d2.
Take 5 first water absorbing units as an example. As shown in fig. 2, from the distance from the display area 100 to the near display area 100, the first water absorbing units 51 to 55 are sequentially disposed, wherein the distance between the first water absorbing units 51 and 52, the distance between the first water absorbing units 53 and 54, and the distance between the first water absorbing units 54 and 55 may be the same, d2, and the distance d1 between the first water absorbing units 52 and 53 may be 2 to 3 times d 2. However, the embodiment of the present disclosure is not limited thereto, and the first water absorbing units 51 and 52 may have a larger pitch than the rest of the adjacent first water absorbing units, or the first water absorbing units 53 and 54 may have a larger pitch than the rest of the adjacent first water absorbing units.
In an exemplary embodiment, as shown in fig. 2, the widths d3 of the first water absorbing units 51 to 54 in the front projection of the substrate 1 along the first direction x may be the same among the plurality of first water absorbing units 5 except for the other first water absorbing units 55 closest to the display area 100. The first direction x and the second direction y are perpendicular, and the second direction y may be an extending direction of the first water absorbing unit 5. Due to etching limitation, the width of the orthographic projection of the first water absorbing unit 55 closest to the display area 100 on the substrate 1 along the first direction x may be slightly larger than the width of the orthographic projections of other first water absorbing units on the substrate 1 along the first direction x. However, the embodiments of the present disclosure are not limited thereto, and the width of the first water absorbing unit 5 in the first direction x may be different in the front projection of the substrate. When the widths are the same, the preparation is simpler and more convenient.
In an exemplary embodiment, the absorbent structure layer may include 4 to 5 first absorbent units 5. Considering the width of the first water absorbing units 5 and the distance between the gate driving circuit area 201 and the display area 100, the water vapor absorption and blocking can be better performed by setting 4 to 5 first water absorbing units 5.
In an exemplary embodiment, as shown in fig. 3, the water absorbing structure layer may further include a second water absorbing unit 6 disposed at a side of the gate driving circuit region 201 remote from the display region 100. I.e. the second absorbent unit 6, which is arranged in the area 203. In this embodiment, by providing the second water absorbing unit 6, moisture entering from the side of the display substrate is controlled to the side, and is isolated from the side of the display substrate by the water blocking structure layer. The embodiment of the present disclosure is not limited thereto, and the second water absorbing unit 6 may not be provided. Only one second water absorbing unit 6 is illustrated in fig. 3, but the embodiment of the present disclosure is not limited thereto, and a plurality of second water absorbing units 6 may be disposed at intervals.
In an exemplary embodiment, the water blocking structure layer may include a sealant layer 8, and the front projection of the second water absorbing unit 6 on the substrate 1 is located in the front projection of the sealant layer 8 on the substrate 1. The scheme provided by the embodiment uses the frame sealing adhesive layer 8 to block water, and water vapor from the side edge of the display substrate is blocked at the side edge. In this embodiment, the coverage area of the sealing glue layer is slightly enlarged compared with the sealing glue layer of the related art, so as to cover the second water absorbing unit 6.
In an exemplary embodiment, there may be overlap between the front projection of the sealant layer 8 on the substrate 1 and the front projection of the encapsulation layer 9 on the substrate 1.
In an exemplary embodiment, the sealant layer 8 may be prepared using a resin or the like.
In an exemplary embodiment, the display substrate may further include a cover plate 10 disposed on a side of the sealant layer 8 remote from the base. The cover plate 10 may be a glass cover plate. The cover plate 10 is bonded through the frame sealing adhesive layer 8. Embodiments of the present disclosure are not limited thereto and may be applied to display substrates based on other packaging schemes.
In an exemplary embodiment, the extending directions of the plurality of first water absorbing units 5 in the orthographic projection of the substrate 1 may be parallel to each other, i.e., a plurality of strips parallel to each other may be provided as the first water absorbing units 5. Embodiments of the present disclosure are not limited thereto and may not be parallel. The first absorbent element 5 may be a continuous strip or may be separate segments.
In an exemplary embodiment, as shown in fig. 4, the plurality of first and second water absorbing units 5 and 6 may be disposed at least one of first and second sides of the display substrate, which may be opposite sides. The first side and the second side may be both provided with a gate driving circuit, or one side is provided with a gate driving circuit, and the other side is not provided with a gate driving circuit. The first and second water absorbing units 5 and 6 may extend to the boundaries of the first and second sides near the third and fourth sides. The third side and the fourth side are two sides adjacent to the first side and the second side.
In an exemplary embodiment, as shown in fig. 1 and 3, the water absorbing structure layer may further include a third water absorbing unit 7 disposed at the gate driving circuit region 201.
In an exemplary embodiment, the third water absorbing unit 7 may be disposed at a side of the gate driving circuit away from the substrate 1, and an orthographic projection of the third water absorbing unit 7 on the substrate overlaps with an orthographic projection of the gate driving circuit. According to the scheme provided by the embodiment, the third water absorbing unit 7 is arranged to protect the grid driving circuit, so that the grid driving circuit is prevented from being corroded by water vapor. However, the embodiment of the present disclosure is not limited thereto, and the third water absorbing unit 7 may not be provided.
In an exemplary embodiment, the orthographic projection of the third water absorbing element 7 on the substrate 1 is located within the orthographic projection of the encapsulation layer 9 on the substrate 1.
In an exemplary embodiment, the orthographic projection of the third water absorbing unit 7 on the substrate 1 is at least partially located outside the orthographic projection of the signal trace on the substrate 1. According to the scheme provided by the embodiment, at least part of the signal wiring is not covered by the third water absorption unit 7, so that the maintenance can be facilitated.
In an exemplary embodiment, the substrate 1 may be a flexible substrate, or a glass substrate.
The display substrate shown in fig. 3 is only an example. In another exemplary embodiment, one first water absorbing unit 5 and one second water absorbing unit 6 may be included.
An embodiment of the present disclosure provides a method for preparing a display substrate, the display substrate including a base including a display region and a peripheral region surrounding the display region, the method including:
forming a water absorption structure layer in the peripheral area of the substrate, wherein the water absorption structure layer comprises a plurality of water absorption units which are arranged at intervals along the direction from the display area to the direction close to the display area;
And forming a water blocking structure layer covering the water absorbing structure layer on one side of the water absorbing structure layer away from the substrate.
According to the preparation method provided by the embodiment, through the plurality of water absorption units arranged at intervals, water vapor can be effectively prevented from entering the display area through repeated water absorption and water blocking, the packaging effect is improved, and the service life of the display substrate is prolonged.
The technical scheme of this embodiment is further described below through the preparation process of the display substrate of this embodiment. The "patterning process" in this embodiment includes processes such as film deposition, photoresist coating, mask exposure, development, etching, photoresist stripping, etc., and is a well-known preparation process in the related art. The "photolithography process" in this embodiment includes coating a film layer, mask exposure and development, and is a well-known preparation process in the related art. The deposition may be performed by known processes such as sputtering, vapor deposition, chemical vapor deposition, etc., the coating may be performed by known coating processes, and the etching may be performed by known methods, which are not particularly limited herein. In the description of the present embodiment, it is to be understood that "thin film" refers to a thin film made by depositing or coating a certain material on a substrate. The "thin film" may also be referred to as a "layer" if the "thin film" does not require a patterning process or a photolithography process throughout the fabrication process. If the "film" is also subjected to a patterning process or a photolithography process during the entire fabrication process, it is referred to as a "film" before the patterning process, and as a "layer" after the patterning process. The "layer" after the patterning process or the photolithography process contains at least one "pattern".
The embodiment provides a method for preparing a display substrate, which comprises the following steps:
Forming a driving structure layer on a substrate, wherein the driving structure layer can comprise a pixel driving circuit arranged in a display area, a signal wiring and a gate driving circuit arranged in a peripheral area, and the pixel driving circuit and the gate driving circuit comprise an active layer, a source electrode, a drain electrode and the like;
coating an insulating film, forming a first insulating layer pattern covering the driving structure layer in a display area through a photoetching process of mask exposure and development, wherein the first insulating layer is provided with a via hole, and exposing a drain electrode of the pixel driving circuit;
Depositing a transparent conductive film, patterning the transparent conductive film through a patterning process to form an anode pattern, wherein the anode is connected with the drain electrode through a via hole;
A pixel defining film is coated on the substrate on which the foregoing patterns are formed, and a pixel defining layer pattern, a first water absorbing unit 5 pattern, a second water absorbing unit 6 pattern, and a third water absorbing unit 7 pattern are formed through a photolithography process, wherein the pixel defining layer is formed in the display area 100, and the first water absorbing unit 5, the second water absorbing unit 6, and the third water absorbing unit 7 are formed in the peripheral area 200.
Sequentially evaporating an organic light-emitting material and a cathode metal on a substrate on which the patterns are formed to form an organic light-emitting layer and a cathode pattern, wherein the organic light-emitting layer and the cathode are formed in the display area 100;
depositing a first inorganic film on a substrate with the patterns to form a first packaging layer pattern, forming a second packaging layer pattern by adopting an ink-jet printing mode, depositing a second inorganic film to form a third packaging layer pattern, wherein the first packaging layer, the second packaging layer and the third packaging layer form the packaging layer 9;
and coating frame sealing glue on the substrate 1 with the patterns, bonding the cover plate 10 with the substrate 1, and curing the frame sealing glue to form the patterns of the frame sealing glue layer 8.
The preparation method of the embodiment can be realized by using the existing mature preparation equipment, has little improvement on the existing technology, and can be well compatible with the existing preparation technology, so that the preparation method has the advantages of low manufacturing cost, easy technology realization, high production efficiency, high yield and the like. The embodiment effectively solves the problem of panel failure caused by water vapor invasion of the display substrate, has practical application value in improving the packaging effect of the display substrate, and has good application prospect.
The embodiment of the disclosure also provides a display device, which comprises the display substrate of the embodiment. The display device can be any product or component with display function such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
Although the embodiments of the present invention are described above, the embodiments are only used for facilitating understanding of the present invention, and are not intended to limit the present invention. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.