CN114148732B - A grabbing mechanism for chip processing - Google Patents

Abstract

The present invention provides a grabbing mechanism for chip processing, which relates to the field of chip processing. The grabbing mechanism for chip processing includes two slide rails and a placement mechanism, a base is arranged between the two slide rails and the placement mechanism, four corners of the base are fixedly mounted with slide rods, the placement mechanism is slidably connected to the upper surface of the base, an air cavity A is arranged above the base on the placement mechanism, the interior of the air cavity A is a hollow structure, two vents connected to the interior of the air cavity A are installed on the air cavity A, four corners of the air cavity A are fixedly mounted with collars, four slide rods penetrate the four collars respectively and then are threadedly sleeved with nuts, and the outside of the slide rods is sleeved with a spring between the base and the collar. Compared with the prior art, the grabbing mechanism for chip processing can well protect the appearance of the chip when transferring the chip, and the pins of the chip are relatively fragile. This grabbing method can better protect the pins and avoid the pins from breaking and bending.

Description

A grabbing mechanism for chip processing

Technical Field

The invention relates to the field of chip processing, in particular to a grabbing mechanism for chip processing.

Background Art

A chip is a general term for a semiconductor component product. It is the carrier of an integrated circuit and contains a silicon wafer of the integrated circuit. Due to its small size and powerful functions, it is an important component of a computer or other electronic equipment.

In the process of chip production and manufacturing, the chip usually needs to be packaged, that is, the chip is assembled inside a chip box, and then the chip box is sealed with a box cover to complete the chip processing. The packaging process is one of the main processes in the chip manufacturing process. When the chip is transmitted, some grasping devices are needed to transfer it, but traditional grasping devices are very easy to damage the chip pins.

Summary of the invention

In view of the deficiencies of the prior art, the present invention provides a grasping mechanism for chip processing, which solves the problems raised in the above background technology.

To achieve the above objectives, the present invention is implemented through the following technical solutions: a grasping mechanism for chip processing, comprising two slide rails and a placement mechanism, a base is arranged between the two slide rails and the placement mechanism, four corners of the base are fixedly mounted with slide rods, the placement mechanism is slidably connected to the upper surface of the base, an air cavity A is arranged on the placement mechanism above the base, the interior of the air cavity A is a hollow structure, two ventilation pipes connected to the interior of the air cavity A are installed, four corners of the air cavity A are fixedly mounted with rings, four slide rods respectively penetrate the four rings and then are threadedly mounted with nuts, the outside of the slide rod is located between the base and the ring and a spring is sleeved, a rubber pad A is fixedly mounted on the bottom surface of the air cavity A, a blocking plate A is fixedly mounted on the bottom surface of the air cavity A below the rubber pad A, the blocking plate A is sealedly connected to the air cavity A and the rubber pad A, and two plugs are fixedly mounted on the front and rear sides of the air cavity A.

The placement mechanism includes an air cavity B and a blocking plate B. The air cavity B is slidably connected to the upper surface of the base. Pistons are provided on the front and rear sides of the air cavity B. The pistons are connected to the interior of the air cavity B through a pipeline. The plug can be inserted into the piston to squeeze the gas in the piston into the interior of the air cavity B. A rubber pad B is fixedly installed on the upper surface of the air cavity B. A blocking plate B is provided above the air cavity B. The blocking plate B is sealingly connected to the rubber pad B and the air cavity B. Connecting rods are fixedly installed on the left and right sides of the air cavity B. A platform is fixedly installed on the side of the connecting rod away from the air cavity B.

Preferably, two sliders are fixedly mounted on the bottom surface of the air cavity B, and two rails are mounted on the upper surface of the base, and the sliders are slidably connected to the rails.

Preferably, the rubber pad A is made of soft material, and a plurality of rubber thorns in an equidistant array are installed on the bottom surface of the rubber pad A.

Preferably, a circular hole A penetrating from top to bottom is opened at the center of the blocking plate A, and the blocking plate A is fitted with the rubber pad A.

Preferably, a circular hole B penetrating from top to bottom is opened at the center of the blocking plate B, and the blocking plate B is fitted with the rubber pad B.

Preferably, the platform and the air cavity B are on the same straight line, and the platform and the air cavity B are located in the same plane.

Compared with the prior art, the present invention has the following beneficial effects:

1. The chip processing grabbing mechanism is provided with a placement mechanism. The chip is first placed on the air cavity B of the placement mechanism. Then the base is controlled to slide so that the air cavity A and the air cavity B are on the same vertical line. Then the air cavity A is controlled to move down along the slide bar to get close to the chip on the air cavity B. Then, air is inflated into the interior of the air cavity A through a vent pipe to deform the rubber pad A. The protruding part of the deformed rubber pad A can pass through the circular hole A on the blocking plate A, so that the rubber thorns on the rubber pad A are separated and then padded on the pins of the chip. When the air cavity A moves down, the plug can drive the piston, and then the interior of the air cavity B Inflate the rubber pad B to make it protrude from the round hole B to hold up the chip, and at the same time, the air cavity A is deflated. Under the joint action of the rubber pad A and the rubber pad B, the chip can be safely attached to the rubber pad A. Then, the control base is moved to the top of the platform, and the air is inflated again to drop the chip onto the platform. At this time, the process of transferring a chip can be completed. Compared with the existing technology, the grasping mechanism used for chip processing can well protect the appearance of the chip when transferring the chip. Moreover, the pins of the chip are relatively fragile. This grasping method can better protect the pins and prevent the pins from breaking and bending.

2. The chip processing grasping mechanism is provided with a connecting rod, the length of which can be changed. By changing the length of the connecting rod, the distance between the air cavity B and the platform can be changed to achieve the effect of changing the transfer chip distance. It can be used in conjunction with the existing production line, and has less limitations on usage scenarios.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of the structure of the present invention;

Fig. 2 is a front view of the structure of the present invention;

FIG3 is a top view of the structure of the present invention;

Fig. 4 is a partial structural schematic diagram of the present invention;

FIG5 is a schematic structural diagram of a placement mechanism of the present invention;

FIG6 is a schematic diagram of the structure of the air cavity B of the present invention;

FIG. 7 is an enlarged view of the structure at point A in FIG. 6 of the present invention.

Among them, 1 slide rail, 2 placement mechanism, 3 base, 4 slide rod, 5 air cavity A, 6 ventilation pipe, 7 ring, 8 nut, 9 spring, 10 rubber pad A, 11 blocking plate A, 12 plug column, 13 air cavity B, 14 blocking plate B, 15 piston, 16 rubber pad B, 17 connecting rod, 18 platform, 19 slider, 20 round hole A, 21 round hole B, 22 rail, 23 rubber thorn.

DETAILED DESCRIPTION

As shown in Fig. 1-7, a grasping mechanism for chip processing includes two slide rails 1 and a placement mechanism 2. A base 3 is provided between the two slide rails 1 and the placement mechanism 2. Slide rods 4 are fixedly installed at the four corners of the base 3. The placement mechanism 2 is slidably connected to the upper surface of the base 3. An air cavity A5 is provided on the placement mechanism 2 above the base 3. The interior of the air cavity A5 is a hollow structure. The bottom end of the air cavity A5 is open. Two ventilation pipes 6 connected to the interior of the air cavity A5 are installed on the air cavity A5. The ventilation pipes 6 are responsible for connecting the air pump and the control valve. Rings 7 are fixedly installed at the four corners of the air cavity A5. The exterior of the slide rod 4 is a smooth cylindrical structure. The upper end of the slide rod 4 is provided with threads. The four slide rods 4 are fixedly installed at the four corners of the base 3. The rod 4 passes through four collars 7 respectively and then is threadedly sleeved with a nut 8. The outside of the sliding rod 4 is sleeved with a spring 9 between the base 3 and the collar 7. A rubber pad A10 is fixedly installed on the bottom surface of the air cavity A5. A blocking plate A11 is fixedly installed on the bottom surface of the air cavity A5 below the rubber pad A10. The rubber pad A10 is made of soft material. A plurality of rubber thorns 23 in an equidistant array are installed on the bottom surface of the rubber pad A10. The blocking plate A11 is sealedly connected to the air cavity A5 and the rubber pad A10. Two plug posts 12 are fixedly installed on the front and rear sides of the air cavity A5. A circular hole A20 that passes through from top to bottom is opened at the center of the blocking plate A11, and the blocking plate A11 fits the rubber pad A10.

The placement mechanism 2 includes an air cavity B13 and a blocking plate B14. The air cavity B13 is slidably connected to the upper surface of the base 3. Pistons 15 are provided on the front and rear sides of the air cavity B13. The piston 15 is connected to the inside of the air cavity B13 through a pipeline. The plug 12 can be inserted into the piston 15 to squeeze the gas in the piston 15 into the inside of the air cavity B13. A rubber pad B16 is fixedly installed on the upper surface of the air cavity B13. A blocking plate B14 is provided above the air cavity B13. The blocking plate B14 is sealed and connected to the rubber pad B16 and the air cavity B13 to block the air cavity B13. A circular hole B21 that passes through the baffle plate B14 from top to bottom is provided at the center position of the baffle plate B14, the baffle plate B14 is fitted with the rubber pad B16, connecting rods 17 are fixedly installed on the left and right sides of the air cavity B13, a platform 18 is fixedly installed on the side of the connecting rod 17 away from the air cavity B13, the platform 18 and the air cavity B13 are on the same straight line, the platform 18 and the air cavity B13 are located in the same plane, two sliders 19 are fixedly installed on the bottom surface of the air cavity B13, two rails 22 are installed on the upper surface of the base 3, and the sliders 19 are slidably connected to the rails 22.

When in use, the length of the connecting rod 17 can be changed. By changing the length of the connecting rod 17, the distance between the air cavity B13 and the platform 18 can be changed to achieve the effect of changing the transfer chip distance. The chip is first placed on the air cavity B13 of the placement mechanism 2, and then the base 3 is controlled to slide so that the air cavity A5 and the air cavity B13 are on the same vertical line, and then the air cavity A5 is controlled to move down along the sliding rod 4 to get close to the chip on the air cavity B13, and then the air is inflated into the interior of the air cavity A5 through a ventilation pipe 6 to deform the rubber pad A10. The protruding part of the deformed rubber pad A10 can pass through The circular hole A20 on the blocking plate A11 separates the rubber thorns 23 on the rubber pad A10 and then pads them on the pins of the chip. When the air cavity A5 moves down, the plug 12 can drive the piston 15, and then the interior of the air cavity B13 is inflated, so that the rubber pad B16 protrudes from the circular hole B21 to hold up the chip, and at the same time the air cavity A5 is deflated. Under the joint action of the rubber pad A10 and the rubber pad B16, the chip can be safely attached to the rubber pad A10, and then the control base 3 is moved to the top of the platform 18. Inflation again can drop the chip onto the platform, and the process of transferring a chip can be completed at this time.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims (5)

1. A chip processing grasping mechanism, comprising two slide rails (1) and a placement mechanism (2), characterized in that: a base (3) is arranged between the two slide rails (1) and the placement mechanism (2), four corners of the base (3) are fixedly mounted with slide bars (4), the placement mechanism (2) is slidably connected to the upper surface of the base (3), an air cavity A (5) is arranged above the base (3) and on the placement mechanism (2), the interior of the air cavity A (5) is a hollow structure, two ventilation pipes (6) connected to the interior of the air cavity A (5) are mounted on the air cavity A (5), and the four corners of the air cavity A (5) are fixedly mounted with slide bars (4). A collar (7) is installed, and four slide bars (4) respectively penetrate through the four collars (7) and are then threadedly sleeved with nuts (8); the outside of the slide bar (4) is sleeved with a spring (9) between the base (3) and the collar (7); a rubber pad A (10) is fixedly installed on the bottom surface of the air cavity A (5); a blocking plate A (11) is fixedly installed on the bottom surface of the air cavity A (5) below the rubber pad A (10); the blocking plate A (11) is sealedly connected to the air cavity A (5) and the rubber pad A (10); and two plug posts (12) are fixedly installed on the front and rear sides of the air cavity A (5); The placement mechanism (2) comprises an air cavity B (13) and a blocking plate B (14), the air cavity B (13) being slidably connected to the upper surface of the base (3), pistons (15) being provided on the front and rear sides of the air cavity B (13), the piston (15) being connected to the interior of the air cavity B (13) through a pipeline, the plug post (12) being insertable into the piston (15) to squeeze the gas in the piston (15) into the interior of the air cavity B (13), a rubber pad B (16) being fixedly installed on the upper surface of the air cavity B (13), a blocking plate B (14) being provided above the air cavity B (13), the blocking plate B (14) being sealingly connected to the rubber pad B (16) and the air cavity B (13), connecting rods (17) being fixedly installed on the left and right sides of the air cavity B (13), and a platform (18) being fixedly installed on the side of the connecting rod (17) away from the air cavity B (13); The rubber pad A (10) is made of a soft material. A plurality of rubber thorns (23) are installed on the bottom surface of the rubber pad A (10) in an equidistant array. The air cavity A (5) is inflated. The rubber thorns (23) on the rubber pad A (10) are separated and then placed on the pins of the chip. The air cavity A (5) is deflated. Under the joint action of the rubber pad A (10) and the rubber pad B (16), the chip can be securely attached to the rubber pad A (10). 2. A chip processing grasping mechanism according to claim 1, characterized in that: two sliders (19) are fixedly installed on the bottom surface of the air cavity B (13), and two rails (22) are installed on the upper surface of the base (3), and the sliders (19) are slidably connected to the rails (22). 3. A chip processing gripping mechanism according to claim 1, characterized in that: a circular hole A (20) penetrating vertically is opened at the center of the blocking plate A (11), and the blocking plate A (11) is fitted with the rubber pad A (10). 4. A chip processing grabbing mechanism according to claim 1, characterized in that: a circular hole B (21) penetrating vertically is opened at the center of the blocking plate B (14), and the blocking plate B (14) is fitted with the rubber pad B (16). 5. A chip processing grasping mechanism according to claim 1, characterized in that: the platform (18) and the air cavity B (13) are on the same straight line, and the platform (18) and the air cavity B (13) are located in the same plane.