CN114156088B - Heat dissipation type anti-seismic aluminum electrolytic capacitor - Google Patents
Heat dissipation type anti-seismic aluminum electrolytic capacitor Download PDFInfo
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- CN114156088B CN114156088B CN202111621277.2A CN202111621277A CN114156088B CN 114156088 B CN114156088 B CN 114156088B CN 202111621277 A CN202111621277 A CN 202111621277A CN 114156088 B CN114156088 B CN 114156088B
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- cover plate
- wall part
- lead
- electrolytic capacitor
- heat dissipation
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- 239000003990 capacitor Substances 0.000 title claims abstract description 41
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 230000035939 shock Effects 0.000 claims abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 10
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 210000003484 anatomy Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0003—Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
The invention relates to a heat dissipation type anti-vibration aluminum electrolytic capacitor, which comprises: cover plate, shell, element and lead wire; the cover plate is characterized in that the upper end surface of the cover plate is symmetrically provided with bulges at the center of the cover plate, and the circumferential direction of the lower end surface of the cover plate is provided with a wall part; the diameter of the inner periphery of the wall part is matched with the diameter of the outer periphery of the element; the outer peripheral surface of the wall part is in contact with the inner peripheral surface of the shell; the joint of the wall part and the cover plate is positioned below the girdle; the end, connected with the lead, of the element is sleeved and fixed in the wall part to form a whole; one end of the element, which is far away from the cover plate, is sleeved with an annular piece; the height of the bulge is larger than that of the element waist, and when the bulge is arranged on the circuit board, a gap is formed between the element waist and the circuit board. The capacitor is firmly installed and rapidly dissipates heat through the cover plate structure, so that the heat dissipation performance and the shock resistance of the aluminum electrolytic capacitor are improved, and the purpose of high temperature resistance and stability is achieved.
Description
Technical Field
The invention belongs to the field of capacitors, and particularly relates to a heat-dissipation type anti-vibration aluminum electrolytic capacitor.
Background
Capacitors are one of the electronic components used in large numbers in electronic devices, and are an indispensable component in circuits. Due to the development of electronic science and technology, electronic products are developed towards high frequency, miniaturization and high reliability, and requirements on the anti-seismic performance, particularly the heat dissipation performance, of capacitors are improved. The capacitor is especially applied to new energy automobiles in the market at present, and lacks anti-vibration and heat dissipation structures, so that the problem that the heat generated when the automobile shakes or breaks pins and the capacitor works easily occurs in the moving process and cannot be dissipated in time is solved, the damage to elements inside the capacitor is easily caused, the damage to the outside of the capacitor is easily caused, and the whole service life of the capacitor is influenced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the heat-dissipation type anti-vibration aluminum electrolytic capacitor, which is firm in installation and rapid in heat dissipation through the arrangement of the cover plate structure, and the heat dissipation performance and the anti-vibration capability of the aluminum electrolytic capacitor are improved, so that the aims of high temperature resistance and stability are fulfilled.
The invention solves the technical problems by adopting the following technical scheme:
A heat-dissipating, shock-resistant aluminum electrolytic capacitor comprising: cover plate, shell, element and lead wire; the cover plate is characterized in that the upper end surface of the cover plate is symmetrically provided with bulges at the center of the cover plate, and the circumferential direction of the lower end surface of the cover plate is provided with a wall part; the diameter of the inner periphery of the wall part is matched with the diameter of the outer periphery of the element; the outer peripheral surface of the wall part is in contact with the inner peripheral surface of the shell; the joint of the wall part and the cover plate is positioned below the girdle;
The end, connected with the lead, of the element is sleeved and fixed in the wall part to form a whole;
One end of the element, which is far away from the cover plate, is sleeved with an annular piece;
The height of the bulge is larger than that of the element waist, and when the bulge is arranged on the circuit board, a gap is formed between the element waist and the circuit board.
Further, the element is arranged in the shell; the cover plate is fixed at the opening of the shell, one end of the lead is connected with the element, and the other end of the lead is exposed out through the cover plate.
Further, the protrusions are uniformly distributed along the circumferential direction of the upper end face of the cover plate, and the number of the protrusions is at least two.
Further, the cross section of the bulge is round or polygonal.
Further, two lead holes are symmetrically formed in the cover plate; the lead holes are respectively penetrated with leads.
Further, the wall portion is greater than the thickness of the cover plate.
Further, the height of the protrusions is 1nm-4nm.
The invention has the advantages and positive effects that:
The invention relates to a heat-dissipation type anti-vibration aluminum electrolytic capacitor, which solves the technical problems of improving the heat dissipation performance and the anti-vibration capability of the aluminum electrolytic capacitor and achieving the purpose of high temperature resistance and stability, and has the following advantages compared with the prior art:
1. According to the invention, the protrusions, the wall parts and the related structures of the annular part are combined with each other, the elements are effectively fixed by the wall parts and the annular part, and shaking is avoided, so that a certain anti-seismic effect can be achieved, and protection measures can be carried out on related elements in the capacitor, so that the problem of shaking can be effectively avoided in the use process, the whole use operation of the capacitor is safer, and the whole service life is prolonged.
2. Set up the arch in the apron, because the arch supports the capacitor and fixes in the circuit board for capacitor apron and circuit board form the clearance, and some heat of condenser can be distributed through the clearance between apron and the circuit board, has improved the heat dispersion of condenser, makes stability higher.
Drawings
Fig. 1 is a schematic perspective view of the present invention.
Fig. 2 is a schematic view of a three-dimensional anatomy of the present invention.
Fig. 3 is a schematic cross-sectional view of the present invention.
Fig. 4 is a schematic view of a top end perspective structure of a cover plate according to a first embodiment of the invention.
Fig. 5 is a schematic diagram of a top perspective structure of a cover plate according to a second embodiment of the invention.
Fig. 6 is a schematic view of the bottom end of the cover plate of the present invention.
Fig. 7 is a schematic cross-sectional view of a cover plate of the present invention.
Fig. 8 is an enlarged view of part a of fig. 3 in accordance with the present invention.
Reference numerals illustrate: 1. a cover plate; 2. a housing; 3. a prime; 4. a lead wire; 5. a ring member; 101. a protrusion; 102. a lead hole; 103. a wall portion; 104. a plain waist; 105. 106, a circuit board; binding waist grooves; h1, bump height; h2, plain waist height.
Detailed Description
Embodiments of the present invention will be described in further detail with reference to the accompanying drawings: the following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "top", "bottom", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or component to be referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the term "comprising" and any variations thereof are meant to be "at least inclusive".
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between the two components. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
As shown in fig. 1 to 8, the heat dissipation type anti-vibration aluminum electrolytic capacitor of the present invention comprises: cover plate 1, shell 2, element 3 and lead 4; the cover plate is characterized in that the upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle;
The end of the element 3 connected with the lead 4 is sleeved and fixed in the wall part 103 to form a whole;
One end of the element 3, which is far away from the cover plate 1, is sleeved with an annular piece 5;
The height of the protrusion 101 is larger than that of the element waist 104, and when the protrusion is mounted on the circuit board 106, a gap is formed between the element waist 104 and the circuit board 106.
The protrusions 101 are uniformly distributed along the circumferential direction of the upper end face of the cover plate 1, and the number of the protrusions 101 is at least two. Preferably two, are arranged symmetrically with respect to the center of the cover plate 1. The height of the protrusion 101 is H1, the height of the element waist 104 is H2, the height of the protrusion 101 is larger than the height of the element waist 104, and when the protrusion is mounted on the circuit board 106, a gap is formed between the element waist 104 and the circuit board 106.
Two lead holes 102 are symmetrically formed in the cover plate 1; the lead holes 102 are respectively penetrated with leads 4.
The cross section of the protrusion 101 is circular or polygonal. When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the protrusion 101 is in contact with the circuit board 106, and the protrusion 101 supports and fixes the capacitor in the circuit board 106, thereby effectively protecting the lead 4 and breaking off during vibration. The anti-seismic effect is achieved. Since the protrusions 101 have a certain height, a gap is formed between the capacitor cover plate 1 and the circuit board 106. Part of heat of the capacitor is transferred outwards through the cover plate 1, and because a gap is formed between the cover plate 1 and the circuit board 106, air convection is formed to facilitate heat transfer, and the effect of rapid heat dissipation is achieved.
The height of the wall 103 is greater than the thickness of the cover plate 1. The end of the element 3 connected with the lead 4 is sleeved and fixed in the wall part 103 to form a whole. The upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle. The element 3 is sleeved with an annular piece 5 at one end far away from the cover plate 1. The element 3 is connected, namely one end with the lead wire 4 is wrapped in the shell 2 by the wall 103, one end, far away from the cover plate 1, of the element 3 is sleeved with the annular piece 5, the element 3 is fixed in the shell 2 by the annular piece 5, and therefore two ends of the element 3 are fixed in the shell 2, the element 3 cannot shake when the circuit board 106 shakes, and the anti-vibration effect is achieved.
Example 1
In this embodiment, the protrusions 101 are uniformly distributed along the circumferential direction of the upper end surface of the cover plate 1, and the number of the protrusions 101 is two. The height of the protrusions 101 is 3nm. The cross section of the protrusion 101 is circular. The upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle. The end of the element 3 connected with the lead 4 is sleeved and fixed in the wall part 103 to form a whole. The element 3 is sleeved with an annular piece 5 at one end far away from the cover plate 1. The height of the protrusion 101 is larger than that of the element waist 104, and when the protrusion is mounted on the circuit board 106, a gap is formed between the element waist 104 and the circuit board 106.
When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the protrusion 101 is in contact with the circuit board 106, and the protrusion 101 supports and fixes the capacitor in the circuit board 106, thereby effectively protecting the lead 4 and breaking off during vibration. The anti-seismic effect is achieved. Since the bump 101 has a certain height, the height of the bump 101 in this embodiment is 3nm, so that a 3nm gap is formed between the capacitor cover plate 1 and the circuit board 106. The whole gap of 3nm is favorable for air circulation between the cover plate 1 and the circuit board 106, heat dissipation is accelerated, a part of heat of the capacitor is transferred outwards through the cover plate 1, and because the cover plate 1 is separated from the circuit board 106 by the gap, the heat transfer is facilitated by air convection, and the heat dissipation effect is improved.
The upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle. The element 3 is sleeved with an annular piece 5 at one end far away from the cover plate 1. The element 3 is connected, namely one end with the lead wire 4 is wrapped in the shell 2 by the wall 103, one end, far away from the cover plate 1, of the element 3 is sleeved with the annular piece 5, the element 3 is fixed in the shell 2 by the annular piece 5, and therefore two ends of the element 3 are fixed in the shell 2, the element 3 cannot shake when the circuit board 106 shakes, and the anti-vibration effect is achieved.
Example two
In this embodiment, the protrusions 101 are uniformly distributed along the circumferential direction of the upper end surface of the cover plate 1, as shown in fig. 5, and the number of the protrusions 101 is four. The height of the protrusions 101 is 2nm. The cross section of the protrusion 101 is circular. The upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle. The end of the element 3 connected with the lead 4 is sleeved and fixed in the wall part 103 to form a whole. The element 3 is sleeved with an annular piece 5 at one end far away from the cover plate 1. The height of the protrusion 101 is larger than that of the element waist 104, and when the protrusion is mounted on the circuit board 106, a gap is formed between the element waist 104 and the circuit board 106.
When the capacitor is mounted on the circuit board 106 through the lead 4, the end of the protrusion 101 is in contact with the circuit board 106, and the protrusion 101 supports and fixes the capacitor in the circuit board 106, thereby effectively protecting the lead 4 and breaking off during vibration. The anti-seismic effect is achieved. Since the bump 101 has a certain height, the height of the bump 101 in this embodiment is 3nm, so that a 3nm gap is formed between the capacitor cover plate 1 and the circuit board 106. The whole gap of 3nm is favorable for air circulation between the cover plate 1 and the circuit board 106, heat dissipation is accelerated, a part of heat of the capacitor is transferred outwards through the cover plate 1, and because the cover plate 1 is separated from the circuit board 106 by the gap, the heat transfer is facilitated by air convection, and the heat dissipation effect is improved.
The upper end surface of the cover plate 1 is symmetrically provided with protrusions 101 by the center of the cover plate 1, and the circumferential direction of the lower end surface of the cover plate 1 is provided with wall parts 103; the diameter of the inner periphery of the wall part 103 is matched with the diameter of the outer periphery of the element 3; the outer peripheral surface of the wall part 103 is abutted against the inner peripheral surface of the shell 2; the joint of the wall part 103 and the cover plate 1 is positioned below the girdle. The element 3 is sleeved with an annular piece 5 at one end far away from the cover plate 1. The element 3 is connected, namely one end with the lead wire 4 is wrapped in the shell 2 by the wall 103, one end, far away from the cover plate 1, of the element 3 is sleeved with the annular piece 5, the element 3 is fixed in the shell 2 by the annular piece 5, and therefore two ends of the element 3 are fixed in the shell 2, the element 3 cannot shake when the circuit board 106 shakes, and the anti-vibration effect is achieved.
It should be emphasized that the examples described herein are illustrative rather than limiting, and therefore the invention is not limited to the examples described in the detailed description, but rather falls within the scope of the invention as defined by other embodiments derived from the technical solutions of the invention by those skilled in the art.
Claims (5)
1. A heat-dissipating, shock-resistant aluminum electrolytic capacitor comprising: the device comprises a cover plate (1), a shell (2), a prime (3) and a lead (4); the cover plate is characterized in that protrusions (101) are symmetrically arranged on the upper end face of the cover plate (1) in the center of the cover plate (1), the protrusions (101) are uniformly distributed along the circumferential direction of the upper end face of the cover plate (1), and the number of the protrusions (101) is more than two; a wall part (103) is arranged on the lower end surface of the cover plate (1) in the circumferential direction; the cover plate (1) and the wall part (103) are integrally formed; the diameter of the inner periphery of the wall part (103) is matched with the diameter of the outer periphery of the element (3); the outer peripheral surface of the wall part (103) is abutted against the inner peripheral surface of the shell (2); the joint of the wall part (103) and the cover plate (1) is positioned below the girdle; the height of the wall part (103) is larger than the thickness of the cover plate (1);
One end of the element (3) connected with the lead (4) is sleeved and fixed in the wall part (103) to form a whole;
one end of the element (3) far away from the cover plate (1) is sleeved with an annular piece (5);
The height of the bulge (101) is larger than that of the element waist (104), and when the bulge is arranged on the circuit board (106), a gap is formed between the element waist (104) and the circuit board (106).
2. The heat dissipation type anti-vibration aluminum electrolytic capacitor as recited in claim 1, wherein: the element (3) is arranged in the shell (2); the cover plate (1) is fixed at the opening of the shell (2), one end of the lead (4) is connected with the element (3), and the other end of the lead penetrates through the cover plate (1) to be exposed.
3. The heat dissipation type anti-vibration aluminum electrolytic capacitor as recited in claim 1, wherein: the cross section of the protrusion (101) is round or polygonal.
4. The heat dissipation type anti-vibration aluminum electrolytic capacitor as recited in claim 1, wherein: two lead holes (102) are symmetrically arranged in the cover plate (1); the lead holes (102) are respectively penetrated with leads (4).
5. The heat dissipation type anti-vibration aluminum electrolytic capacitor as recited in claim 1, wherein: the height of the protrusions (101) is 1nm-4nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111621277.2A CN114156088B (en) | 2021-12-28 | 2021-12-28 | Heat dissipation type anti-seismic aluminum electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111621277.2A CN114156088B (en) | 2021-12-28 | 2021-12-28 | Heat dissipation type anti-seismic aluminum electrolytic capacitor |
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| Publication Number | Publication Date |
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| CN114156088A CN114156088A (en) | 2022-03-08 |
| CN114156088B true CN114156088B (en) | 2024-09-27 |
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| CN202111621277.2A Active CN114156088B (en) | 2021-12-28 | 2021-12-28 | Heat dissipation type anti-seismic aluminum electrolytic capacitor |
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| CN119153238B (en) * | 2024-11-14 | 2025-04-04 | 丰宾电子科技股份有限公司 | Ultra-thin solid aluminum electrolytic capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103199204A (en) * | 2013-03-28 | 2013-07-10 | 凯迈嘉华（洛阳）新能源有限公司 | Assembling process of electrode insulating sealing structure |
| CN207474283U (en) * | 2017-11-09 | 2018-06-08 | 玉环县鑫庄电子有限公司 | A kind of rubber pad for capacitor |
| CN208922917U (en) * | 2018-10-30 | 2019-05-31 | 丰宾电子（深圳）有限公司 | A kind of aluminium electrolutic capacitor structure |
| CN216818106U (en) * | 2021-12-28 | 2022-06-24 | 丰宾电子（深圳）有限公司 | Heat dissipation type antidetonation aluminum electrolytic capacitor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003173942A (en) * | 2001-12-06 | 2003-06-20 | Matsushita Electric Ind Co Ltd | Aluminum electrolytic capacitor and method of manufacturing the same |
| US6620366B2 (en) * | 2001-12-21 | 2003-09-16 | Cool Options, Inc. | Method of making a capacitor post with improved thermal conductivity |
| JP2013058649A (en) * | 2011-09-09 | 2013-03-28 | Hitachi Aic Inc | Aluminum electrolytic capacitor |
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2021
- 2021-12-28 CN CN202111621277.2A patent/CN114156088B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199204A (en) * | 2013-03-28 | 2013-07-10 | 凯迈嘉华（洛阳）新能源有限公司 | Assembling process of electrode insulating sealing structure |
| CN207474283U (en) * | 2017-11-09 | 2018-06-08 | 玉环县鑫庄电子有限公司 | A kind of rubber pad for capacitor |
| CN208922917U (en) * | 2018-10-30 | 2019-05-31 | 丰宾电子（深圳）有限公司 | A kind of aluminium electrolutic capacitor structure |
| CN216818106U (en) * | 2021-12-28 | 2022-06-24 | 丰宾电子（深圳）有限公司 | Heat dissipation type antidetonation aluminum electrolytic capacitor |
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Address after: 518106 workshop A102 (No. 4132, Songbai Road), Fengbin Industrial Park, Tangwei community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Fengbin Electronic Technology Co.,Ltd. Address before: 518106 workshop A102 (No. 4132, Songbai Road), Fengbin Industrial Park, Tangwei community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant before: CAPXON ELECTRONIC (SHEN ZHEN) Co.,Ltd. |
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| GR01 | Patent grant |