CN114152862B - Test assembly for avoiding thermal influence of linear welding spot electromigration process and manufacturing method thereof - Google Patents
Test assembly for avoiding thermal influence of linear welding spot electromigration process and manufacturing method thereof Download PDFInfo
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- CN114152862B CN114152862B CN202111400563.6A CN202111400563A CN114152862B CN 114152862 B CN114152862 B CN 114152862B CN 202111400563 A CN202111400563 A CN 202111400563A CN 114152862 B CN114152862 B CN 114152862B
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- 238000003466 welding Methods 0.000 title claims abstract description 114
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 230000008569 process Effects 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000003672 processing method Methods 0.000 title description 2
- 239000010949 copper Substances 0.000 claims abstract description 123
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 117
- 229910052802 copper Inorganic materials 0.000 claims abstract description 117
- 238000000034 method Methods 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 210000001503 joint Anatomy 0.000 abstract description 8
- 230000008646 thermal stress Effects 0.000 abstract description 7
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 244000137852 Petrea volubilis Species 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- JTJMJGYZQZDUJJ-UHFFFAOYSA-N phencyclidine Chemical compound C1CCCCN1C1(C=2C=CC=CC=2)CCCCC1 JTJMJGYZQZDUJJ-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N13/02—Investigating surface tension of liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N13/02—Investigating surface tension of liquids
- G01N2013/0225—Investigating surface tension of liquids of liquid metals or solder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Arc Welding In General (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The application discloses a test assembly for avoiding thermal influence in a linear welding spot electromigration process and a manufacturing method thereof, wherein the test assembly comprises a linear butt welding copper rod, a base plate and a structural plate; the linear butt welding copper bar comprises a linear welding spot, a first copper bar and a second copper bar; the linear welding spot is positioned between the first copper bar and the second copper bar and is welded with the first copper bar and the second copper bar; the structural plate wraps the linear butt welding copper rod, the cross section of the linear butt welding copper rod is rectangular, and only one side face of the linear butt welding copper rod is visible; the base plate is used for bearing the structural plate. The method overcomes the difficulty of uneven thermal stress generated when a one-dimensional linear welding spot is electrified by a traditional method, is favorable for expressing the evolution behavior of the intermetallic compound of the interface in the electromigration process, and can accurately evaluate the reliability of the butt joint of the linear welding spot; furthermore, experimental errors generated by thermal stress on welding are greatly reduced, and the unique variable requirement of only considering the power-on time in electromigration test is met.
Description
Technical Field
The application belongs to the technical field of material preparation and connection, and particularly relates to a testing component for avoiding thermal influence in a linear welding spot electromigration process and a manufacturing method thereof.
Background
Solder joints are an integral part of microelectronic interconnects and serve as mechanical connections and electrical signal transmission. At present, microelectronic packaging space is reduced, chip heat generation is aggravated, on one hand, the effect of current is affected, interface intermetallic compound (Intermetallic Compounds, IMCs) layer morphology, size, crystal orientation, thickness and the like generated by the reaction between brazing filler metal and a bonding pad metallization layer in the welding spot formation or electronic product use process are more serious on the reliability of the welding spot, on the other hand, the current density born by the welding spot is continuously increased, atoms are diffused from a cathode to an anode, cavities are formed in the cathode, and microcracks are further initiated. Therefore, considerable experimental work is put in studying the morphology change of the solder joint after the electrical treatment, especially the thermal defect caused by insufficient heat dissipation or uneven temperature in the electromigration process, which requires familiarity with the heat dissipation problem of the linear solder joint during the electromigration.
Studies have shown that when the current density through the solder joint reaches a threshold value (10 4 A/cm 2 ) When electromigration occurs. When electromigration is performed using a one-dimensional linear pad, current is passed through the pad, exacerbating the movement of molecules in the pad, resulting in a one-dimensional linear pad consisting of q=i 2 Rt shows that the heat generated is related to current, resistance and time. Welding processThe point is adhered to the PCB (Printed circuit boards) board, at least one surface is completely contacted with the PCB board, and when the welding point passes through a large current for a long time, the welding point can cause uneven thermal stress and possibly melt. At present, a PCB (printed Circuit Board) which is frequently used for electromigration researches of linear welding spots is used as a substrate for bearing the linear welding spots, but in the mode, the welding spots are directly adhered to the substrate, three sides of the substrate dissipate heat through air, and one side of the substrate is blocked by the PCB, so that the situation of uneven thermal stress is easy to occur. Therefore, a proper means needs to be found, so that the heat dissipation of each surface of the welding spot is uniform under the condition of electrifying the welding spot, and the influence of thermal stress on the electromigration of the one-dimensional linear welding spot is eliminated.
Disclosure of Invention
The application provides a test assembly for avoiding thermal influence of a linear welding spot electromigration process and a manufacturing method thereof, wherein after a copper body to be welded is pretreated, a specific solder paste is used, and a one-dimensional linear butt welding spot capable of avoiding the thermal influence of the electromigration is obtained through a special manufacturing procedure.
To achieve the above object, the present application provides the following solutions:
the test assembly for avoiding the thermal influence of the electromigration process of the linear welding spots comprises a linear butt welding copper rod, a base plate and a structural plate;
the linear butt welding copper bar comprises a linear welding spot, a first copper bar and a second copper bar;
the linear welding spots are positioned between the first copper bar and the second copper bar and are welded with the first copper bar and the second copper bar;
the structural plate wraps the linear butt welding copper rod, the cross section of the linear butt welding copper rod is rectangular, and only one side face of the linear butt welding copper rod is visible;
the base plate is used for bearing the structural plate.
Preferably, the geometric dimensions of the first copper bar and the second copper bar are the same, and the cross-sectional geometry of the linear welding spot is the same as the cross-sectional geometry of the first copper bar and the second copper bar.
Preferably, before the first copper bar and the second copper bar are welded and connected with the linear welding spot, organic matters and oxides attached to the surfaces of the first copper bar and the second copper bar need to be removed by using an organic solution and a decomposition solution.
Preferably, the organic solution is an acetone solution, and the decomposition solution is a mixed solution of hydrochloric acid and alcohol.
Preferably, the linear welding spots are Cu/Sn3.0Ag0.5Cu/Cu butt joint single crystal joints, and the linear welding spots are made of Sn3.0Ag0.5Cu solder paste.
Preferably, the base plate and the structural plate are both PCB boards;
the structural plates comprise a first structural plate, a second structural plate, a third structural plate and a fourth structural plate;
the first structural plate and the second structural plate are fixedly connected with one side face of the linear butt welding copper bar, the thickness of the third structural plate is larger than the cross section size of the linear butt welding copper bar, and the third structural plate and the fourth structural plate are not in contact with the linear butt welding copper bar.
Preferably, a gap is left between the first structural plate and the second structural plate, the width of the gap is larger than the height of the linear welding spot, and the linear welding spot is located above the gap.
The application also discloses a manufacturing method of the test assembly for avoiding the thermal influence of the electromigration process of the linear welding spots, which comprises the following steps:
pre-welding the two copper bars to be welded to obtain a standby copper bar;
welding the two standby copper bars by using solder paste according to a preset space position to obtain linear butt welding copper bars;
based on the linear butt welding copper bars, a base plate and a structural plate are arranged, and the test assembly is built according to a preset space structure.
The beneficial effects of this application are:
the application discloses a test assembly for avoiding thermal influence in the electromigration process of linear welding spots and a manufacturing method thereof, wherein the problem of uneven thermal stress generated by the one-dimensional linear welding spots in the traditional method is overcome by improving and assembling the one-dimensional linear welding spots, so that the sample welding spots can uniformly dissipate heat to the periphery in the electromigration process, the representation of the evolution behavior of an interface intermetallic compound in the electromigration process is facilitated, and the reliability of the butt joint of the linear welding spots can be accurately evaluated; furthermore, experimental errors generated by thermal stress on welding are greatly reduced, and the unique variable requirement of only considering the power-on time in electromigration test is met.
Drawings
For a clearer description of the technical solutions of the present application, the drawings that are required to be used in the embodiments are briefly described below, it being evident that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a test assembly for avoiding thermal effects during electromigration of linear solder joints according to an embodiment of the present application;
fig. 2 is a schematic flow chart of a method for manufacturing a test component for avoiding thermal influence in the electromigration process of a linear solder joint according to a second embodiment of the present application.
Drawings
1. A first structural panel; 2. a second structural panel; 3. a third structural panel; 4. a fourth structural panel; 5. a base plate; 11. a first copper bar; 12. a second copper bar; 21. linear welds.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
Example 1
In this example, a Cu/Sn3.0Ag0.5Cu/Cu butted single crystal joint with uniform grain orientation, 300 μm×300 μm in cross-sectional dimension and 300 μm in weld width was produced.
As shown in fig. 1, a test assembly for avoiding thermal influence of a linear solder joint electromigration process according to an embodiment of the present application is characterized by comprising a linear butt-welded copper bar, a base plate 5 and a structural plate. The linear butt welding copper bar comprises a linear welding spot 21, a first copper bar 11 and a second copper bar 12; the linear welding spot 21 is positioned between the first copper bar 11 and the second copper bar 12 and is welded with the first copper bar 11 and the second copper bar 12; the structural plate wraps the linear butt welding copper rod, the cross section of the linear butt welding copper rod is rectangular, and only one side face of the linear butt welding copper rod is visible; the base plate 5 is used to carry structural plates.
According to the target size, two copper bars with 400 mu m multiplied by 10mm are selected to manufacture a linear butt welding copper bar, and the final polishing treatment is carried out to ensure that the size of the finished product meets the precision requirement. Copper metal is very easy to have oxidation reaction with moisture and oxygen in the air, so that a layer of organic matters are coated on the surface of copper, but the organic matters affect the welding quality and even lead to incapability of welding. Therefore, in the first embodiment, before the linear butt-welded copper bars are manufactured, the two copper bars 11, 12 need to be cleaned to remove the layer of organic matter and possibly the oxide that has been produced, for the organic matter protection layer, organic solution is generally used for removal, and for copper oxide, decomposition solution is generally used for removal. In the first embodiment, an acetone solution is used as an organic solution, the organic protective layer on the surface of the copper bar is removed by washing for 10 minutes in an ultrasonic environment, and then the two copper bars 11 and 12 are placed in a mixed solution of hydrochloric acid and alcohol, and are subjected to ultrasonic washing for 10 minutes as well, so that oxides on the surface of the copper bar are washed off, wherein in the first embodiment, the hydrochloric acid in the mixed solution accounts for 10% of the volume fraction.
In the first embodiment, a common PCB is used as a welding platform, the sections to be welded of the two copper bars 11 and 12 are placed in a straight line relatively, the distance between the two copper bars 11 and 12 is 300 μm, then red high-temperature glue is smeared on two ends of the copper bars for fixing, and the processed sample is placed in a drying dish for 24 hours, so that the high-temperature glue is completely dried and fixed.
In the first embodiment, sn3.0ag0.5cu solder paste is applied between two copper bars 11 and 12, a hot air repair workbench (american PACE ST 325) is adopted for remelting, the remelting condition can be set according to the melting point temperature and solidification time of the solder paste, in the first embodiment, the remelting temperature is 270 ℃, the remelting time is 30s, and air cooling is performed, so that sn3.0ag0.5cu solder butt joint linear welding spots are obtained, butt joint welding copper bars are obtained at this moment, the whole size, the welding spot shape, the size and the like do not meet the target requirements, and only the initial linear butt joint welding copper bars can be called, and further size polishing is needed for the initial copper bars so as to meet the target size requirements.
In the first embodiment, the initial copper rod is placed on the side edge of the plane of the cold mosaic resin block for alignment, the copper rods 11 and 12 at the two ends of the linear welding spots are uniformly covered by the cold mosaic resin solution, after 30min of complete solidification, each surface of the copper rod is sequentially polished by using 1000# sand paper, 1500# sand paper and 2000# sand paper, the cross section size is not lower than 320 mu m, namely, the polishing reduction size of each surface is not more than 20 mu m, and during the period, the adhesive is removed by using acetone, so that the linear butt welding copper rod with the size of 0.30mmx0.32mmx20.3mm is obtained;
next, an integral test assembly is fabricated. In the first embodiment, a 15x15x1mm PCB board is taken as the base board 5, and four 8x8x1mm PCB boards are taken as the structural boards, which are respectively labeled as a first structural board 1, a second structural board 2, a third structural board 3 and a fourth structural board 4. The first and second structural plates 1 and 2 are attached to the base plate 5 in a straight line with a spacing of 2mm and with side edges aligned with the base plate. Then, the third structural plate 3 and the linear butt welding copper bars are overlapped on the first structural plate 1 and the second structural plate 2 in the same plane, the side edges of the linear butt welding copper bars are aligned with the side edges of the first structural plate 1, the second structural plate 2 and the base plate 5, the middle linear welding spots 21 are positioned in the gaps between the first structural plate 1 and the second structural plate 2 and are suspended, and at the moment, the outer side surfaces and the bottom surfaces of the linear welding spots 21 are not contacted with the structural plates, so that heat can be directly dissipated to the air. The third structural plate 3 is not in contact with the linear butt welding copper rod, so that the inner side surface of the linear welding spot 21 can directly radiate heat to the air. Finally, the fourth structural plate 4 is covered on the top of the third structural plate 3 and the linear butt welding copper bar, and is aligned with the side edges of the lower butt welding copper bars, the first structural plate 1, the second structural plate 2 and the base plate 5, and the thickness of the structural plate is larger than the height of the copper bars, so that the fourth structural plate 4 is not attached to the top surface of the butt welding copper bar, and therefore the top surface of the linear welding spot 21 can directly radiate heat to the air, and meanwhile, the protection of the fourth structural plate 4 can be obtained. In the first embodiment, the PCB boards are bonded by resin, so as to complete the manufacture of the test assembly.
After complete solidification, coarse polishing is carried out by adopting alpha-alumina suspension with the thickness of 0.3-0.5 mu m, fine polishing is carried out by adopting silica suspension with the thickness of 0.02-0.05 mu m, and finally, a one-dimensional linear butt welding spot 21 with the size of 0.3mm x20.3mm is obtained, and the welding spot can be used for electromigration test.
Example two
Fig. 2 is a schematic flow chart of a method for manufacturing a test assembly for avoiding thermal influence in a linear solder joint electromigration process according to a second embodiment of the present application, which mainly includes the following steps:
s1, pre-welding pretreatment is carried out on two copper bars to be welded, and a standby copper bar is obtained. The pre-welding pretreatment mainly comprises the steps of selecting the size of a copper bar and removing attachments on the surface of the copper bar by adopting a proper method.
S2, welding the two standby copper bars by using solder paste according to a preset space position to obtain linear butt welding copper bars; the selection of the solder paste is selected according to the composition of a target welding spot, and the space position of the copper bar is determined according to the size of a target test assembly and the requirements of an electromigration test. Further, the dimension precision can be ensured by adopting a manual polishing mode.
S3, based on the linear butt welding copper bars, a base plate and a structural plate are arranged, and the test assembly is built according to a preset space structure. A schematic diagram of the finished test assembly is shown in fig. 1. The periphery of the welding spot is not contacted with any structural plate or substrate plate, so that the welding spot can radiate heat in all directions.
The foregoing embodiments are merely illustrative of the preferred embodiments of the present application and are not intended to limit the scope of the present application, and various modifications and improvements made by those skilled in the art to the technical solutions of the present application should fall within the protection scope defined by the claims of the present application.
Claims (5)
1. The test assembly for avoiding the thermal influence of the electromigration process of the linear welding spots is characterized by comprising a linear butt welding copper rod, a base plate and a structural plate;
the linear butt welding copper bar comprises a linear welding spot, a first copper bar and a second copper bar;
the linear welding spots are positioned between the first copper bar and the second copper bar and are welded with the first copper bar and the second copper bar;
the structural plate wraps the linear butt welding copper rod, the cross section of the linear butt welding copper rod is rectangular, and only one side face of the linear butt welding copper rod is visible;
the base plate is used for bearing the structural plate;
the base plate and the structural plate are both PCB plates;
the structural plates comprise a first structural plate, a second structural plate, a third structural plate and a fourth structural plate;
the first structural plate and the second structural plate are fixedly connected with one side face of the linear butt welding copper rod, the thickness of the third structural plate is larger than the cross section size of the linear butt welding copper rod, and neither the third structural plate nor the fourth structural plate is in contact with the linear butt welding copper rod;
the first structural plate and the second structural plate are adhered to the base plate, the first structural plate and the second structural plate are arranged in a straight line, the side edges of the first structural plate and the second structural plate are aligned with the base plate, a gap is reserved between the first structural plate and the second structural plate, the width of the gap is larger than the height of the linear welding spots, and the linear welding spots are positioned above the gap;
the third structural plate and the linear butt welding copper bars are overlapped on the first structural plate and the second structural plate in the same plane, the side edges of the linear butt welding copper bars are aligned with the side edges of the first structural plate, the second structural plate and the base plate, and the middle linear welding spots are positioned in gaps between the first structural plate and the second structural plate and suspended;
the fourth structural plate covers the tops of the third structural plate and the linear butt welding copper bars and is aligned with the side edges of the lower butt welding copper bars, the first structural plate, the second structural plate and the base plate;
the manufacturing method of the test assembly comprises the following steps:
pre-welding the two copper bars to be welded to obtain a standby copper bar;
welding the two standby copper bars by using solder paste according to a preset space position to obtain linear butt welding copper bars;
based on the linear butt welding copper bars, a base plate and a structural plate are arranged, and the test assembly is built according to a preset space structure.
2. The test assembly of claim 1, wherein the first copper bar and the second copper bar have the same geometry, and wherein the linear solder joint has the same cross-sectional geometry as the first copper bar and the second copper bar.
3. The test assembly of claim 2, wherein the first and second copper bars require the use of organic and decomposition solutions to remove organics and oxides adhering to the surfaces of the first and second copper bars prior to soldering the first and second copper bars to the linear solder joints.
4. The test assembly of claim 3, wherein the organic solution is an acetone solution and the decomposition solution is a mixed solution of hydrochloric acid and alcohol.
5. The test assembly of claim 1, wherein the linear solder joint is a Cu/sn3.0ag0.5cu/Cu butt single crystal joint and is made using sn3.0ag0.5cu solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111400563.6A CN114152862B (en) | 2021-11-19 | 2021-11-19 | Test assembly for avoiding thermal influence of linear welding spot electromigration process and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111400563.6A CN114152862B (en) | 2021-11-19 | 2021-11-19 | Test assembly for avoiding thermal influence of linear welding spot electromigration process and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114152862A CN114152862A (en) | 2022-03-08 |
| CN114152862B true CN114152862B (en) | 2024-01-12 |
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