CN114171919A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
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- CN114171919A CN114171919A CN202210109507.5A CN202210109507A CN114171919A CN 114171919 A CN114171919 A CN 114171919A CN 202210109507 A CN202210109507 A CN 202210109507A CN 114171919 A CN114171919 A CN 114171919A
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- metal layer
- middle frame
- electronic device
- main board
- metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/273—Adaptation for carrying or wearing by persons or animals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Engineering & Computer Science (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本申请提供了一种电子设备，其包括主板和中框，主板连接于中框，中框内设置有电磁干扰器件，其特征在于，电子设备还包括主板支架，主板支架连接于主板，电磁干扰器件位于中框和主板支架之间；其中，主板支架与电磁干扰器件位置相对的区域设置有金属层，金属层通过激光直接成型技术成型于主板支架，金属层通过主板与中框相连实现接地。本申请通过LDS工艺在主板支架上直接镭射金属层，采用LDS工艺形成的金属层厚度极薄，金属层与主板支架结合可靠，不受空间限制，相比在模内注塑钢片的设计，无需考虑拉胶结构及铁塑分离情况，也无需考虑压模、溢胶、钢片连料设计、钢片取放等一系列问题，工艺简单。
The application provides an electronic device, which includes a main board and a middle frame, the main board is connected to the middle frame, and an electromagnetic interference device is arranged in the middle frame. The device is located between the middle frame and the mainboard bracket; wherein, a metal layer is provided in the area of the mainboard bracket opposite to the electromagnetic interference device, the metal layer is formed on the mainboard bracket by laser direct forming technology, and the metal layer is connected to the middle frame through the mainboard to realize grounding. In the present application, the metal layer is directly lasered on the mainboard bracket by the LDS process. The thickness of the metal layer formed by the LDS process is extremely thin, and the metal layer is reliably combined with the mainboard bracket without space restrictions. Compared with the design of in-mold injection of steel sheets, no need Considering the rubber-stretching structure and the separation of iron and plastic, there is no need to consider a series of problems such as compression molding, overflowing glue, steel sheet connecting material design, steel sheet picking and placing, and the process is simple.
Description
Technical Field
The application relates to the technical field of electronic terminals, in particular to an electronic device.
Background
The development of smart phones, especially 5G smart phones, puts higher demands on the performance of the phones and the performance of antennas. The improvement of the performance of the mobile phone and the increase of the number of related parts can further reduce the clearance left for the antenna in the mobile phone, and devices with electromagnetic interference such as a camera module and the like are closer to the position of the antenna, so that the electromagnetic interference is easily generated on the antenna, and the performance of the antenna is poor.
Disclosure of Invention
An object of the present application is to provide an electronic device, so as to solve the problem that the performance of an antenna is restricted from being improved due to the influence of electromagnetic interference in the electronic device.
The application provides electronic equipment, which comprises a mainboard and a middle frame, wherein the mainboard is connected to the middle frame, and an electromagnetic interference device is arranged in the middle frame;
the metal layer is formed on the mainboard support through a laser direct forming technology, and the metal layer is connected with the middle frame through the mainboard to realize grounding.
This application is through the direct radium-shine metal level of laser direct forming technique on mainboard support, and the metal level thickness that adopts the LDS technology to form is extremely thin, and the metal level combines reliably with the mainboard support, does not receive the space restriction, compares the design of the steel sheet of moulding plastics in the mould, need not to consider to draw gluey structure and iron and plastics the separation condition, also need not to consider a series of problems such as moulding-die, excessive glue, steel sheet even material design, steel sheet are got and is put, simple process.
In one possible design, the metal layer is located opposite to at least one side of the emi device in a thickness direction of the electronic device and/or in a direction perpendicular to the thickness direction of the electronic device.
Along the thickness direction of the electronic equipment and/or along the thickness direction perpendicular to the electronic equipment, the projection of the metal layer can completely cover the projection of the electromagnetic interference device, so that the effective blocking and absorption of the electromagnetic interference can be realized. The electromagnetic interference exists in a dense area in a certain direction, and the metal layer can be arranged on the side, with the dense electromagnetic interference, of the electromagnetic interference device according to the arrangement state of the electromagnetic interference device, so that the electromagnetic interference can be effectively blocked and absorbed.
Preferably, the metal layer can be opposite to the electromagnetic interference device along the thickness direction of the electronic device and perpendicular to the thickness direction of the electronic device, so as to improve the electromagnetic interference absorption effect of the metal layer.
In one possible design, a first conductive portion and a second conductive portion are respectively formed on two sides of the main board, the first conductive portion is in contact with the metal layer, and the second conductive portion is in contact with the middle frame.
The main board has more wiring layers, which may be copper layers for conducting electricity, and the electronic components on the main board may be electrically connected to the wiring layers of the main board to form a part of the circuit. And part of the main board can leak copper to form a first conductive part and a second conductive part. Because the mainboard support and the middle frame are respectively positioned at two sides of the mainboard, the first conductive part and the second conductive part of the mainboard are also distributed at two sides of the mainboard, so that the first conductive part can be contacted with the metal layer on the mainboard support, the second conductive part can be contacted with the middle frame, and the metal layer grounding is realized.
In a possible design, the electronic device further includes a first metal piece, the first metal piece is disposed between the motherboard and the motherboard bracket, and two ends of the first metal piece are respectively abutted to the first conductive portion and the metal layer.
The first metal piece can be arranged between the metal layer of the second part and the first conductive part, and the first metal piece has a certain thickness, so that two ends of the first metal piece can be directly abutted against the first conductive part and the metal layer of the second part, and the metal layer of the second part is reliably contacted with the first conductive part.
In a possible design, the electronic device further includes a second metal piece, the second metal piece is disposed between the main board and the middle frame, and two ends of the second metal piece are respectively abutted to the second conductive portion and the middle frame.
The second metal piece can be arranged between the second conductive part and the middle frame, and the second metal piece has a certain thickness, so that two ends of the second metal piece can be directly abutted against the second conductive part and the middle frame, and the second conductive part and the middle frame are effectively contacted.
In a possible design, the motherboard bracket includes a first portion and a second portion, the second portion protrudes from the first portion toward one side of the motherboard, the first portion is shielded from one side of the emi device along a thickness direction of the electronic device, and the second portion is shielded from the other side of the emi device along a thickness direction perpendicular to the electronic device; the surface of the first part facing to one side of the electromagnetic interference device, the surface of the second part facing to one side of the mainboard and the surface of the second part facing to one side of the electromagnetic interference device are all provided with metal layers; and the metal layer of the second part is connected with the middle frame through the main board to realize grounding.
The metal layer of the surface of the first portion 11 facing the electromagnetic interference device 3 and the metal layer of the surface 121 of the second portion 12 facing the electromagnetic interference device 3 can absorb electromagnetic interference to the electromagnetic interference device in different directions, so that the antenna can be effectively prevented from being affected by the electromagnetic interference, and the performance of the antenna is improved.
In a possible design, the electronic device further includes a screw, the second portion is provided with a first fixing hole, the main board is provided with a second fixing hole, the middle frame is provided with a third fixing hole, and the screw sequentially penetrates through the first fixing hole and the second fixing hole to be fixed in the third fixing hole.
The first fixing hole and the second fixing hole can be unthreaded holes, the third fixing hole can be threaded holes, when the mainboard support is connected with the mainboard, screws can penetrate through the first fixing hole and the second fixing hole in sequence and then are fixed in the third fixing hole of the middle frame in the direction of threaded connection, and by adjusting the screwing force of the screws, reliable connection and fixation among the mainboard support, the mainboard and the middle frame can be guaranteed, the metal layer at the second part can be guaranteed to be reliably abutted against the first conductive part and the second conductive part can be guaranteed to be reliably abutted against the middle frame, so that effective grounding of the metal layer is realized.
In one possible design, the thickness of the metal layer is 10-30 μm.
The metal layer is directly formed on the main board support by adopting an LDS process, the problem that a glue pulling structure needs to reserve space is not required to be considered, the metal layer can be formed by utilizing the space between the existing electromagnetic interference device and the main board support, the space is not limited, and the space utilization rate is high. It can be understood that, if the way of arranging the steel sheet on the main board support is considered, the thickness of the steel sheet is generally above 0.15mm, and further the steel sheet is fixed through the glue drawing process, and the thickness of the glue layer is generally above 0.4mm, so that the total thickness of the steel sheet and the glue layer is above 0.55mm, which greatly occupies the limited space in the electronic device, and is not beneficial to the thinning of the electronic device. According to the electronic equipment provided by the embodiment of the application, the metal layer is directly formed on the main board support by adopting the LDS process, so that the thickness of the metal layer is only within the range of 10-30 microns, and compared with the mode that the steel sheet and the glue layer are combined, the thickness is greatly reduced, the occupation of space is reduced, and the reliable connection of the metal layer and the main board support is also ensured.
In one possible design, the metal layer is a composite structure layer of a copper layer and a nickel layer, or a composite structure layer of a copper layer, a nickel layer and a gold layer. The copper layer and the nickel layer both have good conductivity, can effectively absorb and shield electromagnetic interference, and ensure the radiation performance of the antenna. The nickel layer has high hardness, can improve the wear resistance of the metal layer 4 and protect the copper layer, and has high chemical stability and can prevent corrosion by a medium.
In one possible design, the electronic device is a cell phone, a watch, a tablet, or a computer.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a schematic diagram of a mobile phone;
FIG. 2 is a partial cut-away view of FIG. 1;
FIG. 3 is a schematic structural view of a motherboard bracket;
fig. 4 is a partially enlarged view at a in fig. 3.
Reference numerals:
100-mobile phone
1-mainboard support
11-first site
12-second site
121-surface
122-first fixing hole
123-surface
2-middle frame
21-third fixing hole
3-electromagnetic interference device
31-Circuit Board
4-metal layer
5-main board
51-second fixing hole
52-first conductive part
53-second conductive part
6-screw
7-first metal part
8-second metal piece.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
Electromagnetic interference refers to any electromagnetic phenomenon that can degrade the performance of a device or system. For electronic products such as mobile phones, tablets, computers, and the like, wireless signals are usually transmitted and received through internal antennas. In order to ensure the performance of the antenna, a clearance area is usually reserved in the electronic product for the antenna to prevent the device from generating electromagnetic interference on the antenna. However, with the development of 5G communication, 5G communication is applied to more and more electronic products, which also results in the increase of devices in the 5G electronic products, and the clearance area of the antenna is reduced, so that the antenna is subjected to electromagnetic interference from surrounding devices and cannot exert good antenna performance. For example, for a 5G smart phone, along with the improvement of the shooting performance of the phone, the increase of the number of cameras can lead to the further reduction of the distance between the camera module and the antenna, and the electromagnetic interference of the camera module seriously restricts the improvement of the antenna performance of the phone. Therefore, for 5G electronic products, there is a need to solve the problem that electromagnetic interference affects the performance of the antenna.
In order to reduce the influence of electromagnetic interference devices such as a camera module on the performance of an antenna, the embodiment of the present application provides an improved electronic device, which may be an electronic device with a built-in antenna, such as a mobile phone 100, a watch, a tablet, or a computer, as shown in fig. 1. The present application preferably describes an electronic device as a mobile phone 100.
As shown in fig. 2 to 4, the electronic device includes a main board 5 and a middle frame 2, the main board 5 is connected to the middle frame 2, an electromagnetic interference device 3 is disposed in the middle frame 2, the electromagnetic interference device 3 may be a camera module, a speaker, etc., and such electromagnetic interference device 3 is disposed on the main board 5. The electronic equipment further comprises a main board support 1, wherein the main board support 1 is connected to the main board 5, and the main board 5 and various devices on the main board 5 can be fixed and supported. The electromagnetic interference device 3 is located between the middle frame 2 and the main board support 1. The metal layer 4 is formed on the main board support 1 by a Laser Direct Structuring (LDS) technology, and the metal layer 4 is connected with the middle frame 2 through the main board 5 to realize grounding.
The metal layer 4 constitutes a grounded anti-interference protective layer. Through the shielding effect of the metal layer 4, the electromagnetic interference signal of the electromagnetic interference device 3 can be effectively absorbed through the metal layer 4, and the performance of the antenna in the electronic equipment can be obviously improved.
In addition, it should be noted that, in order to solve the problem of electromagnetic interference, in the conventional method, an additional metal part is usually added, and the metal part is fixed in the electronic device by means of in-mold injection molding, the metal part is generally a metal sheet metal part with a relatively large thickness, such as a steel sheet, the thickness of the steel sheet is usually greater than 0.15mm, in order to avoid iron-plastic separation, a part or all of the steel sheet needs to be wrapped and fixed on the electronic device by a glue drawing process, the thickness of a glue layer is usually greater than 0.4mm, and the total thickness of the layer and the steel sheet is greater than 0.55mm, thereby greatly increasing the thickness of the electronic device. And for electronic products such as mobile phones and the like, because the internal space is limited, a large amount of glue drawing space is difficult to reserve for metal parts, and in addition, the newly added steel sheets and other metal parts increase the injection molding difficulty, and a series of problems such as compression molding prevention, glue overflow prevention, steel sheet connecting design, steel sheet taking and placing need to be considered.
In this embodiment, through direct laser metal level 4 on mainboard support 1 of LDS technology, the metal level 4 that adopts the LDS technology to form is extremely thin, and metal level 4 combines reliably with mainboard support 1, need not to consider to draw gluey structure and iron-plastic separation condition, does not receive the space restriction, and space utilization is high, and simple process, compares above-mentioned design of moulding plastics the steel sheet in the mould, adopts direct laser metal level 4 on mainboard support 1 of LDS technology, need not to consider a series of problems such as moulding-die, excessive glue, steel sheet material design, steel sheet are got and is put.
As a specific implementation, the metal layer 4 is located opposite to at least one side of the electromagnetic interference device 3 in a thickness direction of the electronic apparatus and/or in a thickness direction perpendicular to the electronic apparatus.
As shown in fig. 2, the thickness direction of the electronic device is a Z direction, the thickness direction perpendicular to the electronic device is an X direction, and along the Z direction and/or the X direction, the projection of the metal layer 4 can completely cover the projection of the electromagnetic interference device 3, so that effective blocking and absorption of electromagnetic interference can be realized. As for the emi device 3, the components that generate emi are mainly located on the circuit board 31, and are affected by parasitic coupling between adjacent circuits inside the circuit board 31 and field coupling of internal components, and signals have crosstalk along the transmission path; or second harmonics due to voltage or power supply jumps, electromagnetic interference may also occur. The electromagnetic interference exists in a dense area in a certain direction, and the metal layer 4 can be arranged on the side, where the electromagnetic interference of the electromagnetic interference device 3 is dense, according to the arrangement state of the electromagnetic interference device 3, so that the electromagnetic interference can be effectively blocked and absorbed. In this embodiment, in order to improve the electromagnetic interference absorption effect of the metal layer 4, the metal layer 4 can be opposite to the electromagnetic interference device 3 along the thickness direction of the electronic device and the thickness direction perpendicular to the electronic device.
As a specific implementation manner, as shown in fig. 2 and fig. 4, the main board support 1 includes a first portion 11 and a second portion 12, the second portion 12 protrudes from the first portion 11 toward one side of the main board 5, the first portion 11 is shielded on one side of the electromagnetic interference device 3 along a thickness direction of the electronic apparatus, the second portion 12 is shielded on the other side of the electromagnetic interference device 3 along a thickness direction perpendicular to the electronic apparatus, and the one side and the other side of the electromagnetic interference device 3 are two adjacent sides of the electromagnetic interference device 3. The second portion 12 protrudes from the first portion 11, so that a step is formed between the second portion 12 and the first portion 11. The surface of the first portion 11 facing the electromagnetic interference device 3, the surface 123 of the second portion 12 facing the motherboard 5, and the surface 121 of the second portion 12 facing the electromagnetic interference device 3 are all provided with a metal layer 4, and the surface of the first portion 11 facing the electromagnetic interference device 3 and the metal layer 4 of the surface 121 of the second portion 12 facing the electromagnetic interference device 3 can absorb electromagnetic interference to the electromagnetic interference device 3 in different directions, so that the influence of electromagnetic interference on the antenna can be effectively avoided, and the performance of the antenna is improved. The metal layer 4 of the surface 123 of the second portion 12 facing the motherboard 5 may be grounded by connecting the motherboard 5 to the middle frame 2. Wherein, the first part 11 and the second part 12 are of an integrated structure.
As a specific implementation manner, as shown in fig. 2, a first conductive portion 52 and a second conductive portion 53 are formed on both sides of the motherboard bracket 1, respectively, the first conductive portion 52 is in contact with the metal layer 4, and the second conductive portion 53 is in contact with the middle frame 2.
The main board 5 has a large number of wiring layers, which may be copper layers, for conducting electricity, and the electronic components on the main board 5 may be electrically connected to the wiring layers of the main board 5 to form a part of a circuit. In which a part of the main board 5 may be copper-leaked to form the first conductive part 52 and the second conductive part 53. Because the motherboard bracket 1 and the middle frame 2 are respectively located at two sides of the motherboard 5, the first conductive part 52 and the second conductive part 53 of the motherboard 5 are also distributed at two sides of the motherboard 5, so that the first conductive part 52 can be in contact with the metal layer 4 on the motherboard bracket 1, and the second conductive part 53 can be in contact with the middle frame 2, thereby realizing grounding of the metal layer 4.
As shown in fig. 2, the electronic device further includes a screw 6, the second portion 12 is provided with a first fixing hole 122, the main board 5 is provided with a second fixing hole 51, the middle frame 2 is provided with a third fixing hole 21, and the screw 6 sequentially passes through the first fixing hole 122 and the second fixing hole 51 and is fixed to the third fixing hole 21.
When the motherboard bracket 1 and the motherboard 5 are connected, the screws 6 may sequentially pass through the first fixing holes 122 and the second fixing holes 51 and then be fixed in the third fixing holes 21 of the middle frame 2 in the direction of threaded connection, and by the tightening force of the adjusting screws 6, not only can the reliable connection and fixation among the motherboard bracket 1, the motherboard 5 and the middle frame 2 be ensured, but also the reliable abutting of the metal layer 4 of the second portion 12 against the first conductive portion 52 and the reliable abutting of the second conductive portion 53 against the middle frame 2 can be ensured, thereby realizing the effective grounding of the metal layer 4.
As a specific implementation manner, as shown in fig. 2, the electronic device further includes a first metal part 7, the first metal part 7 is disposed between the motherboard 5 and the motherboard bracket 1, and two ends of the first metal part 7 are respectively abutted against the first conductive part 52 and the metal layer 4.
It can be understood that the main board 5 can contact the metal layer 4 of the second portion 12 in a copper leakage manner, since the copper leakage portion formed on the main board 5 as the first conductive portion 52 is generally a plane, and the copper leakage portion is generally formed in the main board 5 and does not protrude from the surface of the main board 5, when the main board bracket 1 is connected to the main board 5, the second portion 12 of the main board bracket 1 is difficult to reliably contact the copper leakage portion of the main board 5, which is likely to cause the metal layer 4 not to be effectively grounded. Therefore, in the present embodiment, the first metal fitting 7 may be disposed between the metal layer 4 of the second portion 12 and the first conductive portion 52, and the first metal fitting 7 has a certain thickness, so that both ends of the first metal fitting 7 can directly abut against the first conductive portion 52 and the metal layer 4 of the second portion 12, thereby achieving reliable contact between the metal layer 4 of the second portion 12 and the first conductive portion 52.
In this embodiment, the first metal member 7 may be a steel sheet, a steel ring, or the like, and after the first metal member 7 is disposed between the second portion 12 of the motherboard bracket 1 and the first conductive portion 52 of the motherboard 5, the first metal member 7 may be clamped between the second portion 12 and the first conductive portion 52 by tightening the screw 6, so as to ensure that the metal layer 4 of the second portion 12 can be connected with the first conductive portion 52 through the first metal member 7 on one hand, and on the other hand, the two ends of the first metal member 7 may be in micro interference fit with the metal layer 4 and the first conductive portion 52 by tightening the screw 6 on the other hand, thereby ensuring the reliability of connection between the motherboard bracket 1, the first metal member 7, and the motherboard 5.
As a specific implementation manner, as shown in fig. 2, the electronic device further includes a second metal piece 8, the second metal piece 8 is disposed between the main board 5 and the middle frame 2, and two ends of the second metal piece 8 are respectively abutted against the second conductive part 53 and the middle frame 2.
The second conductive portion 53 may be formed so as to leak copper onto the main board 5. It can be understood that, since the copper leaking portion formed on the main board 5 as the second conductive portion 53 is generally a plane, and the copper leaking portion is generally formed in the main board 5 and does not protrude from the surface of the main board 5, when the main board 5 is connected to the middle frame 2, the middle frame 2 is difficult to reliably contact with the copper leaking portion of the main board 5, and the metal layer 4 is likely to be unable to be effectively grounded. For this reason, in this embodiment, the second metal member 8 may be disposed between the second conductive part 53 and the middle frame 2, and the second metal member 8 has a certain thickness, so that both ends of the second metal member 8 can directly abut against the second conductive part 53 and the middle frame 2, thereby achieving effective contact between the second conductive part 53 and the middle frame 2.
In this embodiment, the second metal member 8 may be a metal gasket, such as a steel ring, a copper ring, and the like, and after the second metal member 8 is disposed between the second conductive portion 53 and the main board 5, the second metal member 8 may be clamped between the second conductive portion 53 and the middle frame 2 by tightening the screw 6, so that on one hand, it is ensured that the second conductive portion 53 can be connected with the middle frame 2 through the second metal member 8, and on the other hand, there is a slight interference fit between two ends of the second metal member 8 and the second conductive portion 53 and the middle frame 2 by tightening the screw 6, and the reliability of connection between the main board 5, the second metal member 8, and the middle frame 2 is ensured.
Specifically, the thickness of the metal layer 4 may be 10 to 30 μm. This metal level 4 adopts LDS technology direct shaping on mainboard support 1, need not to consider to draw the problem that gluey structure needs the headspace, and this metal level 4 can utilize the space shaping between current electromagnetic interference device 3 and the mainboard support 1, does not receive the space restriction, and space utilization is high. It can be understood that, if the way of arranging the steel sheet on the main board bracket 1 is considered, the thickness of the steel sheet is generally above 0.15mm, and further the steel sheet is fixed by the glue drawing process, and the thickness of the glue layer is generally above 0.4mm, thereby resulting in the total thickness of the steel sheet and the glue layer being above 0.55mm, greatly occupying the limited space in the electronic device, and being not beneficial to the thinning of the electronic device. The electronic equipment provided by the embodiment of the application directly forms the metal layer 4 on the main board support 1 by adopting the LDS process, so that the thickness of the metal layer 4 is only within the range of 10-30 microns, and compared with the mode of combining the steel sheet and the glue layer, the thickness is greatly reduced, the space occupation is reduced, and the reliable connection of the metal layer 4 and the main board support 1 is also ensured. In the present embodiment, the thickness of the metal layer 4 is preferably 10 μm, 15 μm, 20 μm, 25 μm, or 30 μm.
Specifically, the metal layer 4 may be a composite structure layer of a copper layer and a nickel layer, specifically, the material of the portion of the motherboard bracket 1 for disposing the metal layer is a material containing an organic metal compound, and the organic metal compound can release metal particles after being irradiated by laser light, that is, a set region of the motherboard bracket 1 for disposing the metal layer 4 can generate a physicochemical reaction by a laser beam to form an activated metal layer, and then the copper layer and the nickel layer can be sequentially plated on the activated metal layer. The copper layer and the nickel layer both have good conductivity, can effectively absorb and shield electromagnetic interference, and ensure the radiation performance of the antenna. The nickel layer has high hardness, can improve the wear resistance of the metal layer 4 and protect the copper layer, and has high chemical stability and can prevent corrosion by a medium. In addition, the metal layer 4 may also be a composite structure layer of a copper layer, a nickel layer and a gold layer, and the copper layer, the nickel layer and the gold layer are sequentially stacked from one side of the motherboard bracket 1 to the direction of the electromagnetic interference device 3.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. An electronic device comprises a mainboard and a middle frame, wherein the mainboard is connected with the middle frame, and an electromagnetic interference device is arranged in the middle frame;
the metal layer is formed on the mainboard support through a laser direct forming technology, and the metal layer is connected with the middle frame through the mainboard to realize grounding.
2. The electronic device of claim 1, wherein the metal layer is located opposite to at least one side of the electromagnetic interference device in a thickness direction of the electronic device and/or in a thickness direction perpendicular to the electronic device.
3. The electronic apparatus according to claim 1, wherein a first conductive portion and a second conductive portion are formed on both sides of the main board, respectively, the first conductive portion being in contact with the metal layer, and the second conductive portion being in contact with the middle frame.
4. The electronic device according to claim 3, further comprising a first metal member, wherein the first metal member is disposed between the motherboard and the motherboard bracket, and two ends of the first metal member are respectively abutted against the first conductive portion and the metal layer.
5. The electronic device according to claim 3, further comprising a second metal piece, wherein the second metal piece is disposed between the main board and the middle frame, and two ends of the second metal piece are respectively abutted against the second conductive part and the middle frame.
6. The electronic device according to any one of claims 1 to 5, wherein the main board support includes a first portion and a second portion, the second portion protrudes from the first portion toward one side of the main board, the first portion is shielded from one side of the EMI component along a thickness direction of the electronic device, and the second portion is shielded from the other side of the EMI component along a direction perpendicular to the thickness direction of the electronic device;
the surface of the first part facing to one side of the electromagnetic interference device, the surface of the second part facing to one side of the mainboard and the surface of the second part facing to one side of the electromagnetic interference device are all provided with metal layers;
and the metal layer of the second part is connected with the middle frame through the main board to realize grounding.
7. The electronic device according to claim 6, further comprising a screw, wherein the second portion is provided with a first fixing hole, the main board is provided with a second fixing hole, the middle frame is provided with a third fixing hole, and the screw sequentially passes through the first fixing hole and the second fixing hole and is fixed to the third fixing hole.
8. The electronic device according to any of claims 1-5, wherein the metal layer has a thickness of 10-30 μm.
9. The electronic device according to any one of claims 1 to 5, wherein the metal layer is a composite structure layer of a copper layer and a nickel layer, or a composite structure layer of a copper layer, a nickel layer, and a gold layer.
10. The electronic device of any of claims 1-5, wherein the electronic device is a cell phone, a watch, a tablet, or a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210109507.5A CN114171919A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210109507.5A CN114171919A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
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| Publication Number | Publication Date |
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| CN114171919A true CN114171919A (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210109507.5A Pending CN114171919A (en) | 2022-01-29 | 2022-01-29 | Electronic equipment |
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| US20230344140A1 (en) * | 2022-04-21 | 2023-10-26 | Samsung Electronics Co., Ltd. | Electronic device including emi absorber |
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Application publication date: 20220311 |