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CN114173501A - Waterproof box and electronic equipment - Google Patents

Waterproof box and electronic equipment Download PDF

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Publication number
CN114173501A
CN114173501A CN202111288924.2A CN202111288924A CN114173501A CN 114173501 A CN114173501 A CN 114173501A CN 202111288924 A CN202111288924 A CN 202111288924A CN 114173501 A CN114173501 A CN 114173501A
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CN
China
Prior art keywords
box
water
cavity
bottom plate
waterproof
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111288924.2A
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Chinese (zh)
Inventor
黄凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Dahua Technology Co Ltd
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Zhejiang Dahua Technology Co Ltd
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Application filed by Zhejiang Dahua Technology Co Ltd filed Critical Zhejiang Dahua Technology Co Ltd
Priority to CN202111288924.2A priority Critical patent/CN114173501A/en
Publication of CN114173501A publication Critical patent/CN114173501A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The application discloses waterproof box and electronic equipment, wherein waterproof box includes: the side wall of the water retaining box is in an inverted bell mouth shape, and the section area of the water retaining box changes along the height direction of the water retaining box; the bottom plate is provided with a welding blocking rib, and the bottom plate is in abutting fit with the water retaining box through the welding blocking rib so that the bottom plate seals the water retaining box; the cavity box is provided with a groove, the bottom plate and the cavity box form a sealed cavity, and the water retaining box is positioned in the sealed cavity. In this way, this application is through sealing process to manger plate box to prevent that external rivers from flowing into manger plate box, and then protect the article in the manger plate box.

Description

Waterproof box and electronic equipment
Technical Field
The application relates to the field of waterproof technologies, in particular to a waterproof box and an electronic device.
Background
Generally, with the increase of various demands of people for product equipment, when the product equipment is used for waterproofing, users often want to be able to keep both the timeliness of waterproofing and the reasonableness of waterproofing in the product equipment.
At present, printed circuit boards are often arranged inside electronic equipment on the market and carry key tasks of controlling components, so that the protection of the printed circuit boards is the most important of the electronic equipment, and the prevention of the circuit boards from being affected with damp and losing efficacy is the key for preventing the equipment from being damaged.
Generally, the problem of being affected with damp is often solved on the key device on the printed circuit board by adopting the glue filling mode, however, glue filling operability is poor, equipment investment is large, and the heat dissipation of the board after glue filling is affected, the board is easy to burn, and the board cannot be dismantled and repaired after being damaged.
Disclosure of Invention
In order to solve the above technical problem, a technical solution adopted in the first aspect of the present application is to provide a waterproof box, including: the side wall of the water retaining box is in an inverted bell mouth shape, and the section area of the water retaining box changes along the height direction of the water retaining box; the bottom plate is provided with a welding blocking rib, and the bottom plate is in abutting fit with the water retaining box through the welding blocking rib so that the bottom plate seals the water retaining box; the cavity box is provided with a groove, the bottom plate and the cavity box form a sealed cavity, and the water retaining box is positioned in the sealed cavity.
In order to solve the above technical problem, a second aspect of the present application provides an electronic device, which at least includes a waterproof case implementing the first aspect of the present application.
The beneficial effect of this application is: this application is the shape of falling horn mouth through the lateral wall that sets up the manger plate box, can guide the water droplet of gathering on the manger plate box, prevents that the liquefied vapor of cavity box inner surface from dripping in the manger plate box to make printed circuit board in the manger plate box keep apart with the water droplet, and then carry out dampproofing and waterproofing to printed circuit board, play the guard action.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an embodiment of the waterproof box of the present application;
FIG. 2 is a schematic view of the overall arrangement of the waterproof box of the present application;
FIG. 3 is a schematic top view of an embodiment of the present invention;
FIG. 4 is a front view of the water baffle box of FIG. 3;
FIG. 5 is a schematic sectional view of the water baffle box of FIG. 4;
FIG. 6 is a schematic view of the internal structure of the chamber box of the present application;
FIG. 7 is a schematic view of a spatial structure between a circuit board structure and a thermal pad according to the present application;
FIG. 8 is a schematic view of the installation of the circuit board in the water retaining box of the present application;
FIG. 9 is a schematic line-passing view of the plug wire in the water retaining box of the present application;
FIG. 10 is a schematic view of the backplane configuration of the present application;
fig. 11 is a schematic structural view of the waterproof box of the present application assembled as a finished product.
10-water retaining box, 20-bottom plate, 30-cavity box, 101-heat conducting pad, 102-circuit board, 103-water retaining box fastening screw, 104-circuit board fastening screw, 105-sealing ring, 201-welding blocking rib, 202-drying agent, 203-bottom plate fastening screw, 106-water retaining box fixing through hole, 107-circuit board mounting hole, 108-plug wiring harness, 11-pyramid-shaped flow guide structure, 12-inverted horn water guide structure, 13-abutting table, 31-wire passing hole, 32-sealing ring mounting groove, 33-water retaining box fixing through hole, 34-bottom plate mounting hole position, 1021-electronic device and 303-water accumulating groove.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In order to explain the technical scheme of this application, this application provides a reliable circuit board dampproofing and waterproofing scheme to with low costs, strong operability, easy maintenance do not have the influence to the board self heat dissipation. The following description is made by way of specific embodiments, and referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of an embodiment of a waterproof box of the present application, and first, the waterproof box specifically includes: the water-retaining box comprises a water-retaining box 10, a bottom plate 20 and a cavity box 30, wherein the water-retaining box 10 is arranged in the cavity box 30, and the bottom plate 20 is arranged at the bottom of the cavity box 30 and the bottom of the water-retaining box 10 and is used for sealing the water-retaining box 10.
The side wall of the water retaining box 10 is in an inverted bell mouth shape, and the sectional area of the water retaining box 10 changes along the height direction of the water retaining box 10, so that water drops flow downwards from the top of the water retaining box 10 along the side wall of the water retaining box 10 to form gradient protection on the water retaining box 10.
The bottom plate 20 is provided with a welding blocking rib 201, and the bottom plate 20 is in interference fit with the water retaining box 10 through the welding blocking rib 201 so that the bottom plate 20 seals the water retaining box 10; preferably, the welding barrier rib 201 can be in interference fit with the matching water blocking box 10, so as to seal the water blocking box 10 and prevent water vapor from entering the water blocking box 10.
The cavity box 30 is provided with a groove 301 for placing the water blocking box 10 or setting a blending space for a component to be installed when the water blocking box 10 is installed, the bottom plate 20 and the cavity box 30 form a sealed cavity 302, and the water blocking box 10 is located in the sealed cavity 302, so that the cavity box 30 further protects the water blocking box 10 against water and moisture.
Therefore, this application is the shape of falling the horn mouth through the lateral wall that sets up water retaining box 10, can guide the water droplet of gathering on water retaining box 10, prevents that the liquefied vapor of cavity box 30 internal surface from dripping in water retaining box 10 to make printed wiring board 102 and the water droplet in the water retaining box 10 keep apart, and then carry out dampproofing and waterproofing to printed wiring board 102, play the guard action.
More directly, please refer to fig. 2, fig. 2 is a schematic diagram of an overall arrangement explosion structure of the waterproof box of the present application; specifically, the waterproof box may include a water blocking box 10, a cavity box 30, a circuit board 102, a thermal pad 101, a desiccant 202, a water blocking box fastening screw 103, a circuit board fastening screw 104, a sealing ring 105, a bottom plate 20, and a bottom plate 20 fastening screw. The moisture barrier mechanism for the various components inside the water trap box 10 can be clearly seen in fig. 2. The cavity box 30, the sealing ring 105 and the bottom plate 20 form a basic airtight cavity to realize water resistance; the water retaining box 10, the drying agent 202 and the heat conducting pad 101 form an internal damp-proof mechanism, wherein the cavity box 30 can be an aluminum alloy cavity, so that the cavity sealing structure is waterproof, and the water vapor in the sealed aluminum alloy cavity is liquefied and then absorbed into the drying agent 202 to realize damp-proof.
Further, please refer to fig. 3 to 5, fig. 3 is a schematic top view of an embodiment of the water blocking box of the present application; FIG. 4 is a front view of the water baffle box of FIG. 3; fig. 5 is a schematic sectional view of the water blocking box of fig. 4 according to the present application.
As shown in fig. 3-5, the water retaining box 10 includes an upper wall, a side wall surrounding the upper wall, and the upper wall is disposed in an inclined plane, specifically, the upper wall may be disposed in a pyramid shape on a side away from the bottom plate 20, such as the pyramid-shaped flow guiding structure 11 shown in fig. 5 along the direction of the section B-B.
The inverted-horn-mouth shape of the side wall (specifically, as shown in fig. 5, the inverted-horn water guide structure 12) is composed of a first inverted-horn-mouth section connected with the pyramid shape and a second inverted-horn-mouth section connected with the first inverted-horn-mouth section, and the projection area of the first inverted-horn-mouth section on the upper wall is smaller than that of the second inverted-horn-mouth section on the upper wall.
It should be noted that the cavity box 30 and the water blocking box 10 may be a cube, a cylinder or a polygonal prism matched with each other, and may be selected according to the requirement, which is not limited herein.
Referring to fig. 6 and 7, fig. 6 is a schematic view of an internal structure of the chamber box according to the present application; FIG. 7 is a schematic view of a spatial structure between a circuit board structure and a thermal pad according to the present application; the cavity box 30 is also provided with a side wall and an upper wall, wherein the side wall is provided with a wire passing hole 31, and one side of the cavity box 30, which is connected with the bottom plate 20, is provided with a bottom plate mounting hole position 34 and a sealing ring mounting groove 32; the upper wall of the cavity box 30 is provided with a water retaining box fixing excessive position 33 which is used for being matched with a water retaining box fastening screw 103 to fix the water retaining box 10 in the groove 301 of the cavity box 30.
The waterproof box comprises a drying agent 202, is arranged in the groove 301 and is positioned outside the water blocking box 10; a water collecting groove 303 is formed among the welding barrier rib 201, the cavity box 30 and the water blocking box 10, and is used for collecting condensed water drops so that the condensed water drops move to the drying agent 202.
Further, referring to fig. 8 and 9, fig. 8 is a schematic view illustrating the installation of the wiring board 102 in the water blocking box 10 according to the present application; FIG. 9 is a schematic line-by-line illustration of the plug wires inserted into the water stop box 10 of the present application; as shown in fig. 5, the side of the upper wall of the water blocking box 10 away from the bottom plate 20 is further provided with an abutment platform 13 having a protruding portion.
As shown in fig. 7, the abutting table 13 is provided with a heat conduction pad 101, and the projected area of the heat conduction pad 101 is larger than or equal to the projected area of the abutting table. After the circuit board 102 with the thermal pad 101 attached to the back surface is fastened to the water retaining box 10 by the circuit board fastening screw 104, the whole body formed by the thermal pad 101 and the circuit board 102 is locked and attached to the aluminum alloy housing of the chamber box 30.
Because the heat conduction pad 101 can dissipate heat uniformly, the inner wall of the sealed cavity 302 will not condense water drops, and the outer wall of the sealed cavity 302 and the outside of the water retaining box 10 will meet the condensed water drops.
In addition, the waterproof box further comprises a circuit board 102, the circuit board 102 is arranged in the waterproof box 10, an electronic device 1021 is arranged on the circuit board 102, and the electronic device 1021 can be abutted against the heat conducting pad 101. Specifically, various components, such as the electronic device 1021, may be arranged on the circuit board 102, and the components may be constituted by chips that can generate heat, and chip components with large heat generation amount may be arranged in the middle of one side, and components with a large volume may be arranged on the other side, and the heat conducting pad 101 is used to cover the surface of the heat generating components after the arrangement is completed.
In addition, a circuit board mounting hole 107 is provided in the upper wall of the water blocking box 10, and the circuit board 102 is fixed to the upper wall through the circuit board mounting hole 107.
Wherein, be equipped with the fixed via hole 33 of water blocking box in the cavity box 30, water blocking box 10 is fixed in cavity box 30 through the fixed via hole 33 of water blocking box.
In addition, please refer to fig. 10 and 11, fig. 10 is a schematic configuration diagram of the bottom plate 20 of the present application; fig. 11 is a schematic structural view of the waterproof box of the present application assembled as a finished product.
Specifically, the water blocking box 10 is provided with mounting hole sites connected to the circuit board 102 and the cavity box 30, the top surface is provided with a pyramid-shaped flow guiding structure 11 to ensure that the top accumulated water flows down along the tower wall, and the side wall is an inverted horn-shaped water guiding structure 12 to guide the top-flowing accumulated water into a water accumulating tank 303 in a labyrinth structure a to be absorbed by the drying agent 202, so as to prevent water vapor from overflowing into the sealed cavity 302, wherein the labyrinth structure a is shown in an enlarged detail view in fig. 11.
The cavity box 30 is provided with a sealing ring 105 mounting groove, and the sealing ring 105 mounting groove is surrounded at the connecting part of the cavity box 30 and the bottom plate 20; the waterproof box comprises a sealing ring 105, the sealing ring 105 is arranged in the mounting groove of the sealing ring 105, and the bottom plate 20 is locked after the sealing ring 105 is mounted in place and used for preventing external water vapor from entering the cavity box 30.
The electronic devices 1021 on the circuit board 102 can be connected through the plug-in wiring harness 108, the plug-in wiring harness 108 penetrates into the cavity through the wire passing hole 31 on the cavity box 30 and is plugged with the circuit board 102, and after reliable fixation, glue is dispensed at the wire passing hole 31 to ensure airtightness, and specifically, the adhesive-backed drying agent 202 can be adhered to the position, shown in fig. 11, of the bottom plate 20.
In addition, a lead wire may be further disposed on the circuit board 102, the cavity box 30 is disposed with a wire passing hole 31, and the lead wire connects the electronic device 1021 with an external circuit through the wire passing hole 31.
Specifically, the abutting table 13 is used for promoting effective contact between the heat conducting pad 101 and the water retaining box 10, that is, the abutting table 13 compresses the heat conducting pad 101 to abut against the heating component of the circuit board 102; the bottom plate 20 may be a sheet metal flat plate structure, on which the blocking ribs 201 are welded and the desiccant 202 with gum is disposed, and may be used to absorb water collected in the water collecting tank 303.
The cavity box 30 and the bottom plate 20 form a sealed cavity 302, the whole body achieves a waterproof effect, when water vapor appears in the sealed cavity 302 and the circuit board 102 is in a damp risk, the circuit board 102 and the water retaining box 10 are communicated through the heat conducting pad 101, the circuit board 102 which generates heat and the water retaining box 10 form a whole body, the whole temperature is higher than the surrounding environment temperature, and therefore the water vapor can be liquefied on the inner surface of the cavity box 30.
The water vapor liquefied on the inner surface drops to the water retaining box 10, and flows into the water accumulating tank 303 under the labyrinth structure a under the action of the pyramid-shaped flow guide structure 11 and the inverted bell mouth water guide structure 12 of the water retaining box 10 to be absorbed by the desiccant 202, and meanwhile, the labyrinth structure a can prevent the liquefied water vapor from invading the circuit board 102 again.
In addition, the embodiment of the present application further provides an electronic device, where the electronic device at least includes the waterproof box 10 as described above, and details are not repeated here.
Through the arrangement of the circuit board 102, the thermal pad 101 and the water blocking box 10, the heat of the circuit board 102 can be dissipated while the water vapor is prevented from being liquefied thereon. Moreover, the pyramid and inverted bell mouth structure of the water blocking box 10 can guide the liquefied vapor to enter the water collecting tank 303 and prevent the liquefied vapor on the inner surface of the cavity box 30 from dropping on the circuit board 102. Furthermore, by arranging the labyrinth structure A, the water flow is guided to enter the labyrinth structure A while the liquefied water vapor is prevented from flowing, the liquefied water flow is prevented from flowing back to the surface of the circuit board 102 on the surface of the water retaining box 10, and the liquefied water vapor is blocked and guided, so that the guided water flow is absorbed by the drying agent 202.
Therefore, this application is the shape of falling the horn mouth through the lateral wall that sets up water retaining box 10, can guide the water droplet of gathering on water retaining box 10, prevents that the liquefied vapor of cavity box 30 internal surface from dripping in water retaining box 10 to make printed wiring board 102 and the water droplet in the water retaining box 10 keep apart, and then carry out dampproofing and waterproofing to printed wiring board 102, play the guard action.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims (10)

1.一种防水盒,其特征在于,包括:1. a waterproof box, is characterized in that, comprises: 挡水盒,所述挡水盒的侧壁呈倒喇叭口形状,所述挡水盒的截面面积沿所述挡水盒的高度方向变化;a water blocking box, the side wall of the water blocking box is in the shape of an inverted bell mouth, and the cross-sectional area of the water blocking box varies along the height direction of the water blocking box; 底板,设有焊接挡筋,所述底板通过所述焊接挡筋与所述挡水盒抵触配合,以使所述底板密封所述挡水盒;The bottom plate is provided with a welding retaining rib, and the bottom plate collides with the water retaining box through the welding retaining rib, so that the bottom plate seals the water retaining box; 腔体盒,具有一凹槽,所述底板和所述腔体盒形成一密封腔体,所述挡水盒位于所述密封腔体内。The cavity box has a groove, the bottom plate and the cavity box form a sealed cavity, and the water blocking box is located in the sealed cavity. 2.根据权利要求1所述的防水盒,其特征在于,2. The waterproof case according to claim 1, characterized in that, 所述挡水盒包括上壁,所述侧壁围绕所述上壁设置,所述上壁呈斜面设置;The water blocking box includes an upper wall, the side wall is arranged around the upper wall, and the upper wall is arranged in an inclined plane; 所述侧壁的所述倒喇叭口形状由连接所述金字塔形状的第一段倒喇叭口以及连接所述第一段倒喇叭口的第二段倒喇叭口组成,所述第一段倒喇叭口在所述上壁的投影面积小于所述第二段倒喇叭口在所述上壁的投影面积。The shape of the inverted bell mouth of the side wall is composed of a first section of inverted bell mouth connected to the pyramid shape and a second section of inverted bell mouth connected to the first section of inverted bell mouth, and the first section of inverted bell mouth is formed. The projected area of the mouth on the upper wall is smaller than the projected area of the second-section inverted bell mouth on the upper wall. 3.根据权利要求1所述的防水盒,其特征在于,所述防水盒包括干燥剂,设置于所述凹槽内,且位于所述挡水盒外;3 . The waterproof box according to claim 1 , wherein the waterproof box comprises a desiccant, which is arranged in the groove and outside the water blocking box; 3 . 所述焊接挡筋、所述腔体盒以及所述挡水盒之间形成一积水槽,用于收集凝结的水滴,以使所述凝结的水滴移动至所述干燥剂处。A water sump is formed between the welding retaining rib, the cavity box and the water retaining box for collecting the condensed water droplets, so that the condensed water droplets can be moved to the desiccant. 4.根据权利要求2所述的防水盒,其特征在于,4. The waterproof case according to claim 2, characterized in that, 所述挡水盒的上壁远离所述底板的一侧还设有具突出部分的抵接台,所述抵接台上设有导热垫,所述导热垫的投影面积大于或等于所述抵接台的投影面积。The side of the upper wall of the water blocking box away from the bottom plate is also provided with an abutment table with a protruding part, and a heat conduction pad is arranged on the abutment table, and the projected area of the heat conduction pad is greater than or equal to the abutment table. The projection area of the receiver. 5.根据权利要求4所述的防水盒,其特征在于,5. The waterproof case according to claim 4, characterized in that, 所述防水盒还包括线路板,设置于所述挡水盒内,所述线路板上设有电子器件,所述电子器件与所述导热垫抵接。The waterproof box further includes a circuit board, which is arranged in the water blocking box, and an electronic device is arranged on the circuit board, and the electronic device is in contact with the heat conducting pad. 6.根据权利要求5所述的防水盒,其特征在于,6. The waterproof case according to claim 5, characterized in that, 所述上壁设有线路板安装孔,所述线路板通过所述线路板安装孔固定于所述上壁。The upper wall is provided with a circuit board mounting hole, and the circuit board is fixed to the upper wall through the circuit board mounting hole. 7.根据权利要求1所述的防水盒,其特征在于,7. The waterproof case according to claim 1, characterized in that, 所述腔体盒内设有挡水盒固定过孔,所述挡水盒通过所述挡水盒固定过孔固定于所述腔体盒。The cavity box is provided with a water blocking box fixing via hole, and the water blocking box is fixed to the cavity box through the water blocking box fixing via hole. 8.根据权利要求1所述的防水盒,其特征在于,8. The waterproof case according to claim 1, characterized in that, 所述腔体盒设有密封圈安装槽,所述密封圈安装槽围设于所述腔体盒与所述底板的连接处;The cavity box is provided with a sealing ring installation groove, and the sealing ring installation groove is surrounded by the connection between the cavity box and the bottom plate; 所述防水盒包括密封圈,所述密封圈设置于所述密封圈安装槽内,用于防止外界水蒸气进入所述腔体盒内。The waterproof box includes a sealing ring, and the sealing ring is arranged in the sealing ring installation groove to prevent external water vapor from entering the cavity box. 9.根据权利要求5或6所述的防水盒,其特征在于,9. The waterproof box according to claim 5 or 6, characterized in that, 所述线路板上还设有导线;The circuit board is also provided with wires; 所述腔体盒设有过线孔,所述导线通过所述过线孔将所述电子器件与外部电路连接。The cavity box is provided with a wire hole, and the wire connects the electronic device with an external circuit through the wire hole. 10.一种电子设备,其特征在于,所述电子设备至少包括如权利要求1~9任一项所述的防水盒。10 . An electronic device, characterized in that, the electronic device at least comprises the waterproof case according to any one of claims 1 to 9 .
CN202111288924.2A 2021-11-02 2021-11-02 Waterproof box and electronic equipment Pending CN114173501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111288924.2A CN114173501A (en) 2021-11-02 2021-11-02 Waterproof box and electronic equipment

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Application Number Priority Date Filing Date Title
CN202111288924.2A CN114173501A (en) 2021-11-02 2021-11-02 Waterproof box and electronic equipment

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CN114173501A true CN114173501A (en) 2022-03-11

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