CN114206000B - Circuit board assemblies and electronic devices - Google Patents
Circuit board assemblies and electronic devices Download PDFInfo
- Publication number
- CN114206000B CN114206000B CN202111603514.2A CN202111603514A CN114206000B CN 114206000 B CN114206000 B CN 114206000B CN 202111603514 A CN202111603514 A CN 202111603514A CN 114206000 B CN114206000 B CN 114206000B
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- conductive single
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- 230000000712 assembly Effects 0.000 title 1
- 238000000429 assembly Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 210000000988 bone and bone Anatomy 0.000 abstract description 35
- 238000004891 communication Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The application discloses a circuit board assembly and electronic equipment, which belong to the technical field of communication equipment, wherein the circuit board assembly comprises a first circuit board, a second circuit board and at least one bonding pad, the second circuit board comprises a board main body and a bone frame plate which are mutually connected, the board main body and the first circuit board are laminated along the thickness direction and are arranged at intervals, the bone frame plate is clamped between the first circuit board and the board main body, and the bonding pad is arranged at one end of the bone frame plate far away from the board main body and is electrically connected with the first circuit board; the bone stand plate is provided with at least one conductive connecting hole group which is arranged in one-to-one correspondence with the bonding pads, conductive materials are arranged in each conductive connecting hole group, and the plate main body is electrically connected with the bonding pads through the conductive connecting hole groups; at least one of the conductive connecting hole sets is a first conductive connecting hole set comprising a plurality of conductive single holes, the projection of a bonding pad corresponding to the first conductive connecting hole set in the thickness direction covers the first conductive connecting hole set, and the bonding pad is connected with one ends of the plurality of conductive single holes of the corresponding first conductive connecting hole set.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to a circuit board assembly and electronic equipment.
Background
Along with the continuous perfection of functions of electronic devices such as smart phones, the number of functional devices in the electronic devices is gradually increased, and the size of a battery of the electronic devices is correspondingly increased, so that the internal space of the electronic devices in the length and width directions of the electronic devices is gradually reduced, and the area capable of being used for arranging a circuit board in the electronic devices is seriously compressed.
At present, a Cavity (translated into a hole or a hole, etc.) plate type circuit board is mostly adopted to utilize a space in the thickness direction of an electronic device, the Cavity plate type circuit board comprises a skeleton plate structure, one end of the skeleton plate structure is provided with a bonding pad, so that two circuit boards stacked in the thickness direction are connected by the skeleton plate structure and the bonding pad, and the two circuit boards are in an electrical connection relationship. In addition, in the Cavity plate type circuit board, the width of the bone stand plate is relatively smaller, so that the space occupied by the bone stand plate can be reduced.
However, the size of the bonding pad at one end of the frame plate is relatively small due to the influence of the width of the frame plate, and when the bonding pad and the frame plate are connected through the conductive via hole, the bonding pad can only correspond to one conductive via hole, so that the mechanical connection performance and the overcurrent capability between the bonding pad and the frame plate are relatively poor.
Disclosure of Invention
The embodiment of the application aims to provide a circuit board assembly and electronic equipment, which are used for solving the problem that the mechanical connection performance and overcurrent capacity between a bonding pad and a frame plate are relatively poor in the current laminated circuit board.
In a first aspect, an embodiment of the present application discloses a circuit board assembly, which includes a first circuit board, a second circuit board and at least one pad, where the second circuit board includes a board main body and a skeleton board, the board main body and the first circuit board are stacked and arranged at intervals along a thickness direction of the first circuit board, the skeleton board is sandwiched between the first circuit board and the board main body, one end of the skeleton board is connected with the board main body, the pad is disposed at one end of the skeleton board far away from the board main body, and the pad is electrically connected with the first circuit board;
The bone stand plate is provided with at least one conductive connecting hole group, conductive materials are arranged in each conductive connecting hole group, the conductive connecting hole groups are arranged in one-to-one correspondence with the bonding pads, and the plate main body is electrically connected with the bonding pads through the conductive connecting hole groups; at least one of the conductive connecting hole sets is a first conductive connecting hole set comprising a plurality of conductive single holes, the projection of the bonding pad corresponding to the first conductive connecting hole set in the thickness direction of the first circuit board covers the first conductive connecting hole set, and the bonding pad is connected with one ends of the plurality of conductive single holes of the corresponding first conductive connecting hole set.
In a second aspect, an embodiment of the present application discloses an electronic device, which includes the above-mentioned circuit board assembly.
The embodiment of the application discloses a circuit board assembly, which comprises a first circuit board, a second circuit board and a bonding pad, wherein a board main body of the second circuit board and the first circuit board are arranged in a stacked manner along the thickness direction of the first circuit board, a bone frame plate of the second circuit board is clamped between the first circuit board and the board main body, one end of the bone frame plate is connected with the board main body, and the bonding pad is arranged at one end of the bone frame plate far away from the board main body. And be provided with at least one conductive connection hole group on the bone stand board, be provided with conductive material in the conductive connection hole group, conductive connection hole group and pad one-to-one set up to make the mutual electric connection of pad and board main part, and then make first circuit board and board main part form electric connection relation.
Meanwhile, at least one of the conductive connecting hole sets is a first conductive connecting hole set comprising a plurality of conductive single holes, so that the overcurrent capacity of the first conductive connecting hole set can be improved; meanwhile, the projection of the bonding pad corresponding to the first conductive connecting hole group in the thickness direction of the first circuit board covers the first conductive connecting hole group, and the bonding pad is connected with one ends of a plurality of conductive single holes in the corresponding first conductive connecting hole group, so that the connection area between the first conductive connecting hole group and the bonding pad is increased, the connection reliability between the first conductive connecting hole group and the bonding pad is relatively high, the adhesion capability between the bonding pad and the bone frame plate is improved, and the overall performance of the circuit board assembly is relatively good.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present application;
FIG. 2 is an enlarged view of a portion of the structure of one embodiment of a circuit board assembly disclosed in an embodiment of the present application;
FIG. 3 is a schematic view of a portion of the structure of the circuit board assembly shown in FIG. 2 in another direction;
FIG. 4 is an enlarged view of a portion of the structure of another embodiment of a circuit board assembly disclosed in an embodiment of the present application;
FIG. 5 is a schematic view of a portion of the structure of the circuit board assembly shown in FIG. 4 in another direction;
FIG. 6 is an enlarged view of a portion of the structure of a circuit board assembly according to yet another embodiment of the present disclosure;
fig. 7 is a schematic view of a portion of the circuit board assembly shown in fig. 6 in another direction.
Reference numerals illustrate:
100-a first circuit board,
210-Plate body, 220-bone plate, 230-mechanical hole, 240-first set of conductive connecting holes, 241-conductive single hole, 241 a-first aperture, 241 b-second aperture, 250-conductive layer,
300-First bonding pad,
400-Solder ball,
500-Electronic component,
600-Pad external connection.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that some, but not all embodiments of the application are described. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The folding mechanism and the electronic device provided by the embodiment of the application are described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.
As shown in fig. 1 to 7, an embodiment of the present application discloses a circuit board assembly and an electronic device, in which the circuit board assembly can be applied to the electronic device. The circuit board assembly includes a first circuit board 100, a second circuit board, and at least one pad.
The first circuit board 100 may be a conventional flat circuit board, on which the electronic component 500 may be soldered; of course, the first circuit board 100 may also be a special-shaped circuit board, which is not limited herein.
As shown in fig. 1, the second circuit board includes a board main body 210 and a bone stand plate 220, wherein the board main body 210 is a portion of the second circuit board for mounting the electronic component 500, that is, the electronic component 500 to be mounted on the second circuit board may be soldered to the board main body 210. In other words, the board body 210 in the second circuit board may be identical in structure and function to the first circuit board 100 described above.
The board main body 210 and the first circuit board 100 are stacked and spaced apart in the thickness direction of the first circuit board 100, so that the circuit board assembly can utilize the space in the thickness direction of the electronic device as much as possible, and the space for accommodating the circuit board assembly in the electronic device is increased. And, the bone stand plate 220 is interposed between the first circuit board 100 and the plate body 210 to provide a structural basis for the connection between the first circuit board 100 and the plate body 210.
Meanwhile, one end of the bone stock plate 220 is connected with the plate body 210 so that the plate body 210 is integrally connected with the bone stock plate 220; alternatively, the board body 210 and the bone plate 220 may be formed in an integrally formed manner to enhance the structural reliability of the second circuit board and the reliability of the electrical connection relationship between the board body 210 and the first circuit board 100.
Also, the pads are disposed at an end of the bone plate 220 remote from the plate body 210, i.e., the pads are disposed at an end of the bone plate 220 near the first circuit board 100, the pads being capable of providing a bridging effect for the electrical connection between the first circuit board 100 and the second circuit board. The bonding pad is electrically connected with the first circuit board 100, specifically, the bonding pad may directly form an electrical connection relationship with a corresponding position on the first circuit board 100 by means of fusion welding or the like; in another embodiment of the present application, optionally, the pads are electrically connected to the first circuit board 100 through the solder balls 400, which can improve the connection reliability between the pads and the first circuit board 100 and reduce the connection difficulty between the pads and the first circuit board 100.
In order to enable the board main body 210 to form an electrical connection with the bonding pad through the bone stand plate 220, as shown in fig. 1, at least one conductive connection hole group is arranged on the bone stand plate 220, and a conductive material is arranged in each conductive connection hole group, wherein the conductive material is arranged in a manner including but not limited to filling, electroplating or bonding, and the conductive material includes but not limited to a metal conductive material such as copper, tin, and the like; and the conductive connection hole groups are arranged in one-to-one correspondence with the bonding pads, so that the plate main body 210 can form an electrical connection relationship with the bonding pads through the conductive connection hole groups under the action of the conductive material in the conductive connection hole groups. The conductive connecting hole group can be formed in a laser processing mode, so that the processing difficulty of the conductive connecting hole group is reduced, and the processing precision of the conductive connecting hole group can be improved.
The dimensions of the conductive connection hole group in the thickness direction of the first circuit board 100 may be determined according to the specific conditions such as the processing technology and the actual requirements, and are not limited herein. The number of the conductive connection hole groups between the board body 210 and the pads may be one or more, and by making the number of the conductive connection hole groups between the board body 210 and the pads correspond to the number of the pads, it is ensured that the pads can be disposed in one-to-one correspondence with the conductive connection hole groups. In the case that the number of the conductive connection hole groups is plural, the bone stand plate 220 may have a multi-layered structure, and one ends of the plurality of conductive connection hole groups facing away from the bonding pads are respectively connected to different positions of the bone stand plate 220. The conductive material may be specifically copper metal, and copper metal may be injected into the conductive connection hole group through a copper injection process, so that the board body 210 and the pad form an electrical connection relationship. In addition, a conductive layer 250 may be embedded in the bone plate 220, so that the conductive material in the conductive connection hole set can form an electrical connection relationship with the plate body 210 through the conductive layer 250.
Meanwhile, in order to further enhance the overcurrent capability between the first circuit board 100 and the board main body 210 in the circuit board assembly, as shown in fig. 2, 4 and 6, at least one conductive connection hole group may include a plurality of conductive single holes 241. Specifically, as described above, the number of the conductive connection hole groups may be one or more, in which case at least one of the conductive connection hole groups may be made the first conductive connection hole group 240, and the first conductive connection hole group 240 includes a plurality of conductive single holes 241, in which case the amount of conductive material that the first conductive connection hole group 240 can accommodate is relatively greater with the sectional area of each conductive single hole 241 maintained, and thus the sectional area of the first conductive connection hole group 240 can be increased, and by connecting the pad to one end of each of the plurality of conductive single holes 241 in the corresponding first conductive connection hole group 240, an effect of improving the overcurrent capacity of the first conductive connection hole group 240 can be achieved. It should be noted that, even if the size of the conductive single holes 241 in the first conductive connecting hole group 240 is reduced compared to the cross-sectional area of the conventional conductive holes, the cross-sectional area of the entire first conductive connecting hole group 240 may be increased in the case that the first conductive connecting hole group 240 includes a plurality of conductive single holes 241.
Of course, in order to ensure that the connection reliability between the first conductive connection hole set 240 and the bonding pad is relatively high, it is also necessary to cover the first conductive connection hole set 240 with the projection of the bonding pad corresponding to the first conductive connection hole set 240 in the thickness direction of the first circuit board 100, so that the conductive material in each conductive single hole 241 in the first conductive connection hole set 240 can "fall on" the surface of the bonding pad, so as to improve the adhesion capability between the bonding pad and the first conductive connection hole set 240, and further improve the comprehensive performance of the circuit board assembly.
Specifically, the layout manner of the plurality of conductive single holes 241 in the first conductive connection hole group 240 may be determined based on the size of the bonding pad, so as to determine specific relative positions of the plurality of conductive single holes 241 when the correspondence between the bonding pad and the plurality of conductive single holes 241 is satisfied. More specifically, the number of the conductive single holes 241 may be two, and the two conductive single holes 241 may be disposed at an area of the pad having the largest size span, and the plurality of conductive single holes 241 may be disposed in a structure corresponding to the pad. For example, the bonding pad may be a circular structure, in which case the conductive single hole 241 may be disposed corresponding to a straight line where any diameter on the bonding pad is located.
The embodiment of the application discloses a circuit board assembly, which comprises a first circuit board 100, a second circuit board and a bonding pad, wherein a board main body 210 of the second circuit board and the first circuit board 100 are stacked along the thickness direction of the first circuit board 100, a bone frame plate 220 of the second circuit board is clamped between the first circuit board 100 and the board main body 210, one end of the bone frame plate 220 is connected with the board main body 210, and the bonding pad is arranged at one end of the bone frame plate 220 far away from the board main body 210. And, the bone stand plate 220 is provided with at least one conductive connection hole set, and the conductive connection hole set and the bonding pad are arranged in a one-to-one correspondence, so that the bonding pad and the plate main body 210 are electrically connected with each other, and further, the first circuit board 100 and the plate main body 210 form an electrical connection relationship.
Meanwhile, at least one of the conductive connection hole groups is a first conductive connection hole group 240 including a plurality of conductive single holes 241, which enables the overcurrent capability of the first conductive connection hole group 240 to be improved; meanwhile, the projection of the bonding pad corresponding to the first conductive connection hole group 240 in the thickness direction of the first circuit board 100 covers the first conductive connection hole group 240, so that the connection area between the first conductive connection hole group 240 and the bonding pad is increased, the connection reliability between the first conductive connection hole group 240 and the bonding pad is relatively high, the adhesion capability between the bonding pad and the bone frame plate 220 is improved, and the overall performance of the circuit board assembly is relatively good.
Optionally, the number of the conductive single holes 241 in the first conductive connection hole group 240 is two, which can improve the overcurrent capability of the conductive material in the first conductive connection hole group 240 and improve the connection reliability between the conductive material in the first conductive connection hole group 240 and the bonding pad while not changing the structure of the existing bonding pad.
On this basis, the two conductive vias 241 in the first conductive via group 240 may be a first conductive via and a second conductive via, respectively, alternatively, a projection of the first conductive via in the thickness direction of the first circuit board 100 is located outside the second conductive via. In other words, the first conductive via and the second conductive via are independent of each other. Under the condition of adopting the technical scheme, the positions of the two conductive single holes 241 (namely the first conductive single hole and the second conductive single hole) are determined, so that the first conductive connecting hole group 240 can be formed in a laser processing mode, the processing difficulty is relatively low, and the cost is not obviously increased while the overcurrent capacity of the first conductive connecting hole group 240 is improved.
In the above embodiment, alternatively, the cross-sectional areas of the conductive vias 241 at different positions are the same, and the first conductive via and the second conductive via may be arranged in a tangential manner.
In another embodiment of the present application, alternatively, the cross-sectional areas of the conductive single holes 241 in the first conductive connection hole group 240 are different at different positions, and in detail, the cross-sectional area of each conductive single hole 241 may be gradually reduced along the direction in which the first hole 241a of the conductive single hole 241 is directed to the second hole 241b thereof, wherein the first hole 241a is a hole of the conductive single hole 241 directed to the bonding pad, and the second hole 241b is a hole of the conductive single hole 241 directed to the mechanical hole 230. Under the condition of adopting the technical scheme, the forming difficulty of the conductive single hole 241 can be reduced.
Based on the above embodiment, as shown in fig. 3, the first hole opening 241a of the first conductive single hole and the first hole opening 241a of the second conductive single hole may be spaced apart, so as to further reduce the processing difficulty of the first conductive single hole and the second conductive single hole; and moreover, the mutual interference of the processing processes of the first conductive single hole and the second conductive single hole can be prevented as much as possible, and the processing precision and reliability of the first conductive single hole and the second conductive single hole are improved.
Specifically, the distance between the first apertures 241a of the first conductive vias and the first apertures 241a of the second conductive vias may be determined according to the actual conditions such as the size of the bonding pad, and the size of the space between the first apertures 241a of the first conductive vias and the second conductive vias may be made as larger as possible within a feasible range, so as to maximally reduce the processing difficulty of the first conductive vias and the second conductive vias.
In addition, in the case that the cross-sectional areas at different positions on each conductive via 241 are different, the cross-sectional area of each conductive via 241 at the second opening toward the mechanical hole 230 is the smallest, that is, the cross-sectional area of the conductive material in the conductive via 241 is represented, and also the current passing capability of the conductive via 241 is represented. In the case that the first conductive connection hole group 240 includes two conductive single holes 241 of the above-described structure, the overcurrent capability of the first conductive connection hole group 240 is twice the sectional area of the second aperture of the conductive single hole 241.
In the case where the first conductive connection hole group 240 includes two conductive single holes 241 and the cross-sectional area of each conductive single hole 241 is gradually reduced along the direction in which the first hole 241a is directed to the second hole, the two conductive single holes 241 may be the first conductive single hole and the second conductive single hole, respectively. On the basis, in order to further improve the overcurrent capacity of the first conductive connecting hole set 240, the portion between the second orifices of the first conductive single hole and the second conductive single hole can also be filled with a conductive material by arranging a communication cavity from the second orifice of each of the first conductive single hole and the second conductive single hole, so that the electric conductivity of the first conductive connecting hole set 240 is further improved.
In detail, the first conductive connection hole group 240 further includes a communication cavity, and similar to each conductive single hole 241, the communication cavity may be filled with a conductive material. In the process of arranging the first conductive single hole and the second conductive single hole, the arrangement positions of the first conductive single hole and the second conductive single hole can be determined based on the sizes of the second holes of the first conductive single hole and the second conductive single hole, so that the second holes of the first conductive single hole and the second holes of the second conductive single hole are mutually spaced. Furthermore, the part of the space between the second orifices of the two conductive single holes 241 can be removed by means of laser hole digging, so as to form a communication cavity, and the communication cavity is communicated between the second orifice of the first conductive single hole and the second orifice of the second conductive single hole, so that in the process of filling the conductive material, the second orifices of the two conductive single holes 241 are integrated with the conductive material in the communication cavity, and overcurrent capacity is provided. Obviously, in the case that the first conductive connection hole group 240 includes two conductive single holes 241, the above technical solution can further increase the current passing capability of the first conductive connection hole group 240.
In the above embodiment, the first apertures of the first conductive single holes and the second conductive single holes may be spaced from each other, in which case the communication cavity may further extend from the second aperture of the conductive single hole 241 to the first aperture 241a, and the first aperture 241a of the first conductive single hole and the first aperture 241a of the second conductive single hole are also communicated with each other through the communication cavity, so as to further ensure that the current-passing capability of the conductive connection hole set disclosed in this embodiment is significantly increased.
In another embodiment of the present application, as shown in fig. 4 and 5, the projected portions of the first conductive single hole and the second conductive single hole in the thickness direction of the first circuit board 100 may be made to coincide; alternatively, a portion of the projection of the first aperture 241a of the first conductive single hole in the thickness direction of the first circuit board 100 may be located within the first aperture 241a of the second conductive single hole.
Of course, in this embodiment, since the first conductive single hole and the second conductive single hole partially overlap in the thickness direction, there is necessarily a portion where the walls of the first conductive single hole and the second conductive single hole are connected to each other, and the communication cavity communicates with the respective second apertures of the first conductive single hole and the second conductive single hole, based on which, in order to prevent the formation material of the bone plate 220 from still being interposed between the first conductive single hole and the second conductive single hole, the communication cavity may extend from the position where the second aperture of the first conductive single hole is located to the junction of the walls of the first conductive single hole and the second conductive single hole. That is, in the conductive connecting hole group disclosed in this embodiment, the first conductive single hole and the second conductive single hole are each directly connected along a part of the hole wall in the thickness direction of the first circuit board 100, and the other part is indirectly connected through the cavity wall of the communication cavity, so that the first conductive single hole and the second conductive single hole are integrally communicated together.
Under the condition of adopting the technical scheme, the processing difficulty of the first conductive single hole and the second conductive single hole can be reduced to a certain extent, and the processing difficulty of the communication cavity is relatively low. Of course, in the case where the first apertures 241a of the two conductive vias 241 overlap each other, it is necessary to ensure that the second apertures of the two conductive vias 241 remain spaced apart from each other, thereby ensuring a relatively large overcurrent capability of the first conductive connection hole group 240.
In another embodiment of the present application, the first conductive connection hole set 240 may include at least three conductive single holes 241, in which case, the utilization rate of the soldering area on the pad may be further improved, so that the over-current capability of the conductive material in the first conductive connection hole set 240 may be further increased, and the adhesion reliability between the conductive material in the first conductive connection hole set 240 and the pad may be improved. Of course, in the process of laying out at least three conductive single holes 241 in the first conductive connection hole group 240, it is necessary to ensure that any two conductive single holes 241 cannot be completely overlapped.
As described above, the number of pads may be one or more, in which case at least one of the pads may be the first pad 300, and the first pad 300 is disposed corresponding to the first conductive connection hole group 240, and accordingly, the number of the first conductive connection hole group 240 is the same as the number of the first pad 300 and corresponds one to one.
Based on the above embodiments, optionally, the circuit board assembly disclosed in the embodiments of the present application may further include a pad external connection portion 600, where the outer edge of the first pad 300 is externally connected to the pad external connection portion 600, so that the first pad 300 and the pad external connection portion 600 are combined to form a "new pad" with a larger size, and the docking area on the "new pad" is relatively larger, so that the circuit board assembly can be matched with a larger number of conductive single holes 241.
In this regard, in the case where at least three conductive vias 241 are included in the first conductive via group 240, projections of the conductive vias 241 of the first conductive via group 240 in the thickness direction of the first circuit board 100 may also be made non-overlapping with each other. Furthermore, the processing difficulty of at least three conductive single holes 241 in the first conductive connecting hole set 240 is relatively small.
In addition, as described above, by connecting the bonding pad and the board body 210 by the combination of the mechanical hole 230 and the conductive connection hole group of the frame plate 220, the bonding pad size can be as small as possible, but in the above embodiment, since the outer edge of the first bonding pad 300 is externally connected with the bonding pad external connection part 600, the bonding area on the "new bonding pad" is relatively large, and for this purpose, in this embodiment, the side of the bonding pad external connection part 600, which is away from the first circuit board 100, may also be covered with an insulating layer, so that the exposed portion, i.e. the portion capable of conducting electricity, can be kept unchanged while providing a larger bearing area for the conductive connection hole group, and the portion with the electrical connection capability on the surface of the bonding pad is relatively small.
Specifically, during the processing, the first bonding pad 300 and the bonding pad external connection portion 600 at the outer edge thereof may be formed in an integrally formed manner, so that on one hand, the forming difficulty of the two is reduced, and on the other hand, the connection reliability between the first bonding pad 300 and the bonding pad external connection portion 600 is relatively higher, and the bearing capacity of the new bonding pad is improved. In addition, the insulating layer may be specifically a solder resist ink, so as to ensure that the conductive material in the plurality of conductive single holes 241 can form a reliable insulating relationship with the pad external connection portion 600 through the insulating layer.
In the case that the number of the conductive single holes 241 in the first conductive connection hole group 240 is at least three, and the outer edge of the first bonding pad 300 is externally connected with the bonding pad external connection part 600, further, any two conductive single holes 241 in the first conductive connection hole group 240 may be spaced from each other toward the aperture of the first bonding pad 300, that is, the projections of any two conductive single holes 241 in the first conductive connection hole group 240 in the thickness direction of the first circuit board 100 are spaced from each other, which may further reduce the difficulty of forming each conductive single hole 241 in the first conductive connection hole group 240, and may prevent the processing processes of any two conductive single holes 241 from interfering with each other.
Alternatively, as shown in fig. 7, the first conductive connection hole set 240 may include three conductive single holes 241, in which case, the intervals between any two adjacent conductive single holes 241 may be equal, or the connecting lines of the centers of the first holes 241a (or the second holes) of the three conductive single holes 241 may form an equilateral triangle, in which case, the size of the area occupied by the whole first conductive connection hole set 240 can be reduced as much as possible, so as to reduce the size of the pad external connection portion 600 that needs to be added; meanwhile, the cross-sectional area of the conductive material filled in the first conductive connection hole group 240 can be maximized, the overcurrent capacity of the conductive material in the first conductive connection hole group 240 can be improved, and the connection reliability between the conductive material in the first conductive connection hole group 240 and the first bonding pad 300 can be improved.
In addition, based on the circuit board assembly disclosed in the above embodiments, in the process of forming the bone stand plate 220 in the second circuit board, the respective advantages of the conductive connection hole groups disclosed in different embodiments can be utilized to form the conductive connection hole groups with different structures at different positions of the bone stand plate 220, so that the whole bone stand plate 220 has the advantages of excellent performance, lower processing difficulty and the like, and the market competitiveness of the circuit board assembly is improved to the greatest extent.
As described above, the conductive connection hole group may be processed by a laser processing method, that is, the conductive connection hole group is a laser hole group, in this case, the depth of the conductive connection hole group needs to be within a preset range due to factors such as the maximum cross-sectional area of the conductive connection hole group, and in the process of connecting the board main body 210 and the first circuit board 100, if the size of the space between the two is relatively large, optionally, the bone frame plate 220 is further provided with a mechanical hole 230, that is, a via hole formed by a mechanical processing method, the mechanical hole 230 is in communication with the conductive connection hole group, and the mechanical hole 230 can also be filled with a conductive material, so that the board main body 210 can be electrically connected with the pad through the conductive connection hole group and the mechanical hole 230.
Further, along the thickness direction of the first circuit board 100, at least one first conductive connecting hole group 240 may be disposed at opposite ends of the mechanical hole 230, that is, at least one conductive connecting hole group is disposed at opposite ends of the mechanical hole 230, and at least one first conductive connecting hole group 240 is correspondingly included in at least one conductive connecting hole group at opposite ends of the mechanical hole 230, and each first conductive connecting hole group includes a plurality of conductive single holes 241. Wherein, one end of each of the plurality of conductive single holes 241 in the first conductive connection hole group at the side of the mechanical hole 230 facing away from the bonding pad is connected with the plate main body 210, so as to improve the reliability and overcurrent capability of the mechanical connection between the bone stand plate 220 and the plate main body 210.
Based on any one of the above embodiments, the present application further discloses an electronic device, where the electronic device includes the circuit board assembly disclosed in any one of the above embodiments, and of course, the electronic device may also include other devices such as a chip and a battery, which are not described in detail herein in view of brevity.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.
Claims (12)
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| CN202111603514.2A CN114206000B (en) | 2021-12-24 | 2021-12-24 | Circuit board assemblies and electronic devices |
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| CN202111603514.2A CN114206000B (en) | 2021-12-24 | 2021-12-24 | Circuit board assemblies and electronic devices |
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| CN114206000B true CN114206000B (en) | 2024-09-10 |
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| CN114679841B (en) * | 2022-03-01 | 2024-11-08 | 维沃移动通信有限公司 | Circuit board assemblies and electronic devices |
| CN115767884A (en) * | 2022-11-25 | 2023-03-07 | 维沃移动通信有限公司 | Circuit board assembly and method for preparing circuit board assembly |
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| CN209283569U (en) * | 2018-08-21 | 2019-08-20 | 深圳市宇隆宏天科技有限公司 | Connector pcb board structure with multiple via holes |
| CN212463649U (en) * | 2020-07-30 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
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| JP2010045155A (en) * | 2008-08-12 | 2010-02-25 | Fcm Kk | Multilayer laminated circuit board |
| KR20120017245A (en) * | 2010-08-18 | 2012-02-28 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
| CN106973495B (en) * | 2017-05-04 | 2019-12-13 | 奇酷互联网络科技（深圳）有限公司 | Debugging method for inner layer circuit of printed circuit board |
| CN107613673A (en) * | 2017-09-27 | 2018-01-19 | 生益电子股份有限公司 | A kind of processing method of PCB and PCB |
| KR20190099739A (en) * | 2018-02-19 | 2019-08-28 | 삼성전기주식회사 | Interposer and printed circuit board having the same |
| KR102680006B1 (en) * | 2018-12-12 | 2024-07-02 | 삼성전기주식회사 | printed circuit board |
| KR102661196B1 (en) * | 2019-11-08 | 2024-04-29 | 삼성전자 주식회사 | Electronic device including stacked printed circuit board |
| CN113133198A (en) * | 2019-12-30 | 2021-07-16 | 华为技术有限公司 | Circuit board assembly and electronic device |
| CN211184426U (en) * | 2020-02-24 | 2020-08-04 | 维沃移动通信有限公司 | A circuit board stacking structure and electronic equipment |
| US11257790B2 (en) * | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
| CN113498247A (en) * | 2020-03-20 | 2021-10-12 | 华为技术有限公司 | Circuit board assembly and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209283569U (en) * | 2018-08-21 | 2019-08-20 | 深圳市宇隆宏天科技有限公司 | Connector pcb board structure with multiple via holes |
| CN212463649U (en) * | 2020-07-30 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
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