CN114211328A - Grinding spindle coordinate measuring method - Google Patents
Grinding spindle coordinate measuring method Download PDFInfo
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- CN114211328A CN114211328A CN202111495308.4A CN202111495308A CN114211328A CN 114211328 A CN114211328 A CN 114211328A CN 202111495308 A CN202111495308 A CN 202111495308A CN 114211328 A CN114211328 A CN 114211328A
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- Prior art keywords
- grinding wheel
- grinding spindle
- diamond
- spindle
- coordinate
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 72
- 239000010432 diamond Substances 0.000 claims abstract description 72
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 238000000691 measurement method Methods 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention provides a grinding spindle coordinate measuring method, which comprises the following steps: obtaining a reference Z-axis coordinate of the grinding spindle; step b: when the grinding spindle returns to the standby position, the position data of the diamond grinding wheel is obtained by using a detection sensor; step c: obtaining difference data of the reference Z-axis coordinate data of the grinding spindle obtained in the step a and the position data of the diamond grinding wheel obtained in the step b; step d: when the current Z-axis coordinate of the grinding spindle needs to be obtained under a specific condition, measuring the current position of the diamond grinding wheel by using the detection sensor to obtain the current position data of the diamond grinding wheel; and step e: and d, obtaining the current Z-axis coordinate of the grinding spindle according to the current position data of the diamond grinding wheel obtained in the step d and the difference data obtained in the step c. The method can quickly determine the new reference Z-axis coordinate data of the grinding spindle, can save time and improve efficiency, and is simple to operate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a grinding spindle coordinate measuring method.
Background
Semiconductor silicon wafers are the basic raw material for manufacturing semiconductor devices. The high-purity semiconductor is prepared into a wafer through the procedures of crystal pulling, slicing and the like, the wafer is subjected to a series of semiconductor manufacturing processes to form a tiny circuit structure, and then the wafer is thinned, cut, packaged and tested to form a chip which is widely applied to various electronic equipment, wherein the thinning of the wafer is an important part.
In order to improve the electrical performance of semiconductor chips, it is necessary to thin the back side of the semiconductor wafer, and the device for completing the process is a wafer thinning machine. Wafer thinners typically include a grinding spindle, a vacuum chuck table, and the like. Before the wafer is thinned, the wafer is placed on the table top of the vacuum chuck at the feeding and discharging position, then the table top is moved to the position below the grinding spindle, the grinding spindle descends to grind and thin the wafer, the grinding spindle ascends to the standby position (the distance between the lower edge of the grinding wheel and the table top of the vacuum chuck is 20mm) after grinding is completed, and the table top moves to the feeding and discharging position.
In order to improve the efficiency of thinning the silicon wafer, the grinding spindle is required to be lowered to be as close to the wafer (generally 30-50um) as possible at a high speed (300mm/min) during grinding, then the silicon wafer is thinned at a thinning process speed (50um/min), the precision requirement on the Z-axis coordinate of the grinding spindle (namely the distance value between the lower edge of the diamond grinding wheel on the grinding spindle and the table top of the vacuum chuck) is strict at this time, the grinding spindle and the table top of the vacuum chuck can collide due to error of the coordinate, the diamond grinding wheel on the grinding spindle and the silicon wafer on the table top of the vacuum chuck can be damaged, and the grinding spindle and the table top of the vacuum chuck can be damaged more seriously.
After each grinding, the diamond grinding wheel is damaged, which causes the change of the distance between the lower edge of the diamond grinding wheel and the table surface of the vacuum chuck (the damage of the grinding wheel is different according to the actual grinding quantity and the grinding material, and is normally about 10 um). If the grinding action can be normally and completely finished, the equipment can correct and correct the coordinate of the diamond grinding wheel relative to the table top of the vacuum chuck by knowing the loss of the diamond grinding wheel, and the distance between the lower edge of the diamond grinding wheel and the table top of the vacuum chuck is 20mm when the grinding spindle returns to the standby position each time. However, the coordinate value of the diamond grinding wheel relative to the table surface of the vacuum chuck cannot be corrected if the following matters occur: 1. in the grinding process, the machine alarm and the fault cause that the grinding action is not finished, and the loss of the grinding wheel cannot be known and the coordinate of the grinding spindle cannot be corrected; 2. the diamond grinding wheel is bonded, products cannot be normally ground, and the diamond grinding wheel needs to be dressed by a grinding wheel dresser (the grinding wheel dresser made of silicon carbide is placed on the table top of a vacuum chuck, the diamond grinding wheel and the silicon carbide dresser grind each other, and the surface of the diamond grinding wheel is dressed), for example, only the fact that a grinding spindle is lowered by 200um (the total loss of the diamond grinding wheel and the dresser is 200um) is known, the specific loss of the diamond grinding wheel cannot be clearly known, and the coordinate of the grinding spindle cannot be corrected; 3. after the diamond grinding wheel is replaced, the coordinate value of the lower edge of the new grinding wheel away from the table top of the vacuum chuck cannot be accurately confirmed.
The existing solution to solve the above problems is by manual means: a standard block gauge (generally 1mm) for measurement is placed on a table top of a vacuum chuck, a grinding wheel spindle is lowered to be in contact with the standard block gauge, the Z coordinate of the upper surface of the table top of the vacuum chuck is regarded as 0 at this time, and the coordinate of the lower end face of the grinding wheel is the thickness value of the standard block gauge, namely 1000 um. However, the existing scheme is troublesome to operate, takes time and has higher requirement on the skill level of an operator.
Disclosure of Invention
The invention provides a grinding spindle coordinate measuring method for overcoming the defects in the prior art.
The invention provides a grinding spindle coordinate measuring method, which comprises the following steps: step a: obtaining a reference Z-axis coordinate of the grinding spindle; step b: when the grinding spindle returns to the standby position, the position data of the diamond grinding wheel is obtained by using a detection sensor; step c: obtaining difference data of the reference Z-axis coordinate data of the grinding spindle obtained in the step a and the position data of the diamond grinding wheel obtained in the step b; step d: when the current Z-axis coordinate of the grinding spindle needs to be obtained under a specific condition, measuring the current position of the diamond grinding wheel by using the detection sensor to obtain the current position data of the diamond grinding wheel; and step e: and d, obtaining the current Z-axis coordinate of the grinding spindle according to the current position data of the diamond grinding wheel obtained in the step d and the difference data obtained in the step c.
Preferably, the reference Z-axis coordinate of the grinding spindle is obtained manually using a standard block gauge in step a.
Preferably, the reference Z-axis coordinate is a distance value between a lower edge of a diamond grinding wheel tooth on the grinding spindle and a vacuum chuck table, and the vacuum chuck table is taken as a Z-axis origin.
Preferably, the position data of the diamond grinding wheel in the step b is a distance value between the lower edge of the tooth of the diamond grinding wheel and the table top of the vacuum chuck.
Preferably, the specific condition in step d is a condition when the coordinate value of the diamond grinding wheel relative to the table surface of the vacuum chuck cannot be corrected.
Preferably, the current position data of the diamond grinding wheel in the step e is a distance value between the lower edge of the tooth of the diamond grinding wheel and the table top of the vacuum chuck.
Preferably, in the step e, the difference data is subtracted from the current position data of the diamond grinding wheel, and the difference data is the current Z-axis coordinate of the grinding spindle.
The invention has the following beneficial effects: according to the grinding spindle coordinate measuring method, after the Z-axis coordinate of the grinding spindle, namely the reference Z-axis coordinate, is confirmed for the first time, the position of the diamond grinding wheel is detected by using the detection sensor, and according to the measured data of the sensor and the Z-axis coordinate of the grinding spindle or the difference value of the two, when a new diamond grinding wheel is replaced or the current Z-axis position of the grinding spindle needs to be confirmed, the Z-axis coordinate data of the grinding spindle can be obtained only by using the sensor for measurement, so that the time can be saved, the efficiency can be improved, and the operation is simple.
Drawings
Fig. 1 is a flowchart of a grinding spindle coordinate measuring method of the present invention.
Fig. 2 is a schematic sectional view of the grinding spindle coordinate measuring apparatus with the grinding spindle in a standby position.
Figure 3 is a schematic cross-sectional view of a grinding spindle coordinate measuring apparatus with the grinding spindle in an operating position.
Detailed Description
The embodiments of the present invention will be described below with reference to the drawings attached to the specification. It should be noted that the embodiments mentioned in the present description are not exhaustive and do not represent the only embodiments of the present invention. The following examples are given for the purpose of clearly illustrating the inventive contents of the present patent application and are not intended to limit the embodiments thereof. It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiment without departing from the spirit and scope of the invention, and it is intended to cover all such changes and modifications as fall within the true spirit and scope of the invention.
As shown in fig. 1 to 3, the grinding spindle coordinate measuring method of the present invention for measuring the Z-axis coordinate of the grinding spindle of the wafer thinner includes the following steps a to e. The steps are explained in detail below.
Step a: and obtaining a reference Z-axis coordinate of the grinding spindle. In the step a, a standard block gauge is used for obtaining a reference Z-axis coordinate of the grinding spindle in a manual mode. And the reference Z-axis coordinate is a distance value between the lower edge of a diamond grinding wheel tooth on the grinding spindle and the table top of the vacuum chuck, and the table top of the vacuum chuck is taken as a Z-axis origin. Specifically, a standard block gauge for measurement is placed on a table top of a vacuum chuck, the thickness of the standard block gauge is generally 1mm, the grinding spindle is lowered to the surface of the standard block gauge, the lowest end of the grinding spindle, namely the lower edge of the diamond grinding wheel tooth, is in contact with the upper surface of the standard block gauge, at this time, the upper surface of the table top of the vacuum chuck is taken as a Z-axis origin, and then the coordinate of the lowest end of the grinding spindle, namely the lower edge of the diamond grinding wheel tooth (namely the Z-axis coordinate of the grinding spindle) is the thickness value of the standard block gauge, namely 1000 microns.
Step b: when the grinding spindle returns to the standby position, the position data of the diamond grinding wheel is obtained by the detection sensor. In the step b, the position data of the diamond grinding wheel is the distance value between the lower edge 31 of the tooth of the diamond grinding wheel and the table top 9 of the vacuum chuck. Specifically, a detection sensor 6 is arranged right below a diamond grinding wheel tooth of the grinding spindle, and the detection sensor 6 is fixed by a fixed seat 7. For example, in one embodiment, the detection sensor 6 detects the position data 2000um of the diamond wheel while the grinding spindle is in the standby position.
Step c: and c, obtaining difference data of the reference Z-axis coordinate data of the grinding spindle obtained in the step a and the position data of the diamond grinding wheel obtained in the step b. When the reference Z-axis coordinate of the grinding spindle is 1000um, the position of the diamond grinding wheel when the grinding spindle returns to the standby position is 2000um, and the difference value of the two is 1000 um.
Step d: and when the current Z-axis coordinate of the grinding spindle needs to be obtained under a specific condition, measuring the current position of the diamond grinding wheel by using the detection sensor to obtain the current position data of the diamond grinding wheel. Here, the specific condition is various conditions when the coordinate value of the diamond grinding wheel relative to the vacuum chuck table cannot be corrected, including that a machine alarm occurs during the grinding process, the grinding operation is not completed due to a fault, or the diamond grinding wheel is bonded, and the product cannot be normally ground, or after a new diamond grinding wheel is replaced, the coordinate value of the lower edge of the new grinding wheel away from the vacuum chuck table cannot be accurately confirmed, and the like, in these conditions, the reference Z-axis coordinate of the original grinding spindle is already inaccurate, and therefore a new reference Z-axis coordinate needs to be obtained. In the invention, the current position of the diamond grinding wheel is measured by the detection sensor, and the current position data of the diamond grinding wheel is obtained to be 2500um, for example.
Step e: and d, obtaining the current Z-axis coordinate of the grinding spindle according to the current position data of the diamond grinding wheel obtained in the step d and the difference data obtained in the step c. Here, the current position data of the diamond grinding wheel is a distance value between the lower edge of the tooth of the diamond grinding wheel and the table top of the vacuum chuck. Specifically, the difference data is subtracted from the current position data of the diamond grinding wheel, and the current Z-axis coordinate of the grinding spindle is obtained. When the current position data of the diamond grinding wheel is 2500um and the difference data is 1000um, the current Z-axis coordinate of the grinding spindle is 2500-.
Fig. 2 is a schematic sectional view of the grinding spindle coordinate measuring apparatus with the grinding spindle in a standby position. Figure 3 is a schematic cross-sectional view of a grinding spindle coordinate measuring apparatus with the grinding spindle in an operating position. The edge of the grinding spindle 1 is provided with a circle of diamond grinding wheel seats 2, a circle of diamond grinding wheel teeth 3 are arranged below the grinding wheel seats 2, and the grinding spindle 1 can move up and down and can rotate around a central shaft so as to grind the upper surface of a wafer bearing table 5, namely a silicon wafer 4 on a vacuum chuck table top 9. The detection sensor 8 is fixed on the fixed seat 8. And a sensor telescopic head 7 of the detection sensor 6 is arranged right below the diamond grinding wheel teeth 3 and used for detecting position data of the lower edges of the diamond grinding wheel teeth.
It will be apparent to those skilled in the art that the above embodiments are merely illustrative of the present invention and are not to be construed as limiting the present invention, and that changes and modifications to the above described embodiments may be made within the spirit and scope of the present invention as defined in the appended claims.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111495308.4A CN114211328A (en) | 2021-12-09 | 2021-12-09 | Grinding spindle coordinate measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111495308.4A CN114211328A (en) | 2021-12-09 | 2021-12-09 | Grinding spindle coordinate measuring method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114211328A true CN114211328A (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111495308.4A Pending CN114211328A (en) | 2021-12-09 | 2021-12-09 | Grinding spindle coordinate measuring method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182688A (en) * | 2023-11-06 | 2023-12-08 | 江苏京创先进电子科技有限公司 | Thinning method, system and thinning machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101480785A (en) * | 2008-12-16 | 2009-07-15 | 机械工业第三设计研究院 | Automatic tool setting device of grinding machine and tool setting method |
| CN103052470A (en) * | 2011-07-04 | 2013-04-17 | 日本精工株式会社 | Grinding disc and grinding method |
| CN107107296A (en) * | 2014-09-22 | 2017-08-29 | 康宁股份有限公司 | Grinding processing equipment for processing the edges of glass objects |
| CN107914215A (en) * | 2016-10-05 | 2018-04-17 | 株式会社迪思科 | It is ground the dressing method of grinding tool |
| CN108568712A (en) * | 2017-03-13 | 2018-09-25 | 光洋机械工业株式会社 | Flat surface grinding method and surface grinding machine |
| CN109590893A (en) * | 2019-01-04 | 2019-04-09 | 京东方科技集团股份有限公司 | Utilize the grinding method of grinding system, grinding system |
| CN110497315A (en) * | 2019-09-04 | 2019-11-26 | 厦门大学 | A device for automatic tool setting and measuring workpiece center point and tool setting method |
| CN112222989A (en) * | 2020-09-28 | 2021-01-15 | 万华化学集团电子材料有限公司 | Adjustable grinding device based on monocrystalline silicon piece and grinding processing method for monocrystalline silicon piece |
-
2021
- 2021-12-09 CN CN202111495308.4A patent/CN114211328A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101480785A (en) * | 2008-12-16 | 2009-07-15 | 机械工业第三设计研究院 | Automatic tool setting device of grinding machine and tool setting method |
| CN103052470A (en) * | 2011-07-04 | 2013-04-17 | 日本精工株式会社 | Grinding disc and grinding method |
| CN107107296A (en) * | 2014-09-22 | 2017-08-29 | 康宁股份有限公司 | Grinding processing equipment for processing the edges of glass objects |
| CN107914215A (en) * | 2016-10-05 | 2018-04-17 | 株式会社迪思科 | It is ground the dressing method of grinding tool |
| CN108568712A (en) * | 2017-03-13 | 2018-09-25 | 光洋机械工业株式会社 | Flat surface grinding method and surface grinding machine |
| CN109590893A (en) * | 2019-01-04 | 2019-04-09 | 京东方科技集团股份有限公司 | Utilize the grinding method of grinding system, grinding system |
| CN110497315A (en) * | 2019-09-04 | 2019-11-26 | 厦门大学 | A device for automatic tool setting and measuring workpiece center point and tool setting method |
| CN112222989A (en) * | 2020-09-28 | 2021-01-15 | 万华化学集团电子材料有限公司 | Adjustable grinding device based on monocrystalline silicon piece and grinding processing method for monocrystalline silicon piece |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117182688A (en) * | 2023-11-06 | 2023-12-08 | 江苏京创先进电子科技有限公司 | Thinning method, system and thinning machine |
| CN117182688B (en) * | 2023-11-06 | 2024-03-12 | 江苏京创先进电子科技有限公司 | Thinning method, system and thinning machine |
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Application publication date: 20220322 |