CN114223318A

CN114223318A - Heat sink and electronic device unit

Info

Publication number: CN114223318A
Application number: CN202080057243.2A
Authority: CN
Inventors: 太田武志; 中岛雄二; 矢口裕一朗
Original assignee: Toshiba Corp; Toshiba Infrastructure Systems and Solutions Corp
Current assignee: Toshiba Corp
Priority date: 2019-12-20
Filing date: 2020-10-15
Publication date: 2022-03-22
Anticipated expiration: 2040-10-15
Also published as: KR102642224B1; KR20220047372A; JP6877523B1; JP2021100018A; TW202126157A; TWI785379B; WO2021124665A1; CN114223318B

Abstract

The heat sink according to the embodiment includes a base plate, a protrusion, a first fin, a first protrusion, and a second protrusion. The protrusion protrudes from the base plate in a first direction intersecting the base plate, and is thermally connectable to a first heat generator mounted on the first substrate. The plurality of first fins project from the base plate in a direction opposite to the first direction and are arranged in a second direction intersecting the first direction. The first protrusion protrudes from the base plate in the direction opposite to the first direction, protrudes further in the direction opposite to the first direction than the first heat sink, and is capable of being fitted with a coupling member for coupling the outer wall of the case and the base plate. The second protrusion protrudes from the base plate in the first direction, and a joint member for joining the first base plate and the base plate can be attached.

Description

Heat sink and electronic device unit

Technical Field

Embodiments of the present invention relate to a heat sink and an electronic apparatus unit.

Background

Conventionally, there is known a heat sink including a base plate thermally connected to a heat generating element mounted on a substrate, and a plurality of fins projecting from the base plate to a side opposite to the heat generating element.

Prior art documents:

patent documents:

patent document 1: japanese patent laid-open publication No. 2019-67888

Disclosure of Invention

The invention aims to solve the problems that:

it is significant if a new structure more suitable for the fan-less electronic apparatus can be obtained in such a heat sink.

Means for solving the problems:

Drawings

Fig. 1 is an exemplary perspective view of an electronic device on which an electronic device unit including a heat sink according to an embodiment is mounted.

Fig. 2 is an exemplary perspective view of an electronic device unit including the heat sink according to the embodiment.

Fig. 3 is an exemplary perspective view of the heat sink according to the embodiment as viewed from the rear side thereof.

Fig. 4 is an illustrative YZ cross-sectional view of the electronic device of fig. 1.

Fig. 5 is an exemplary schematic XY cross-sectional view of the electronic device of fig. 1.

Detailed Description

Exemplary embodiments of the invention are disclosed below. The structure of the embodiment shown below and the action and effect produced by the structure are examples. The present invention can be realized by a configuration other than those disclosed in the following embodiments. Further, according to the present invention, at least one of various effects (including a derivative effect) obtained by the structure can be obtained.

In the present specification, the ordinal numbers are used only for distinguishing the components, members, portions, positions, directions, and the like, and do not indicate the order or priority.

[ embodiment ]

Fig. 1 is a perspective view of an electronic device 1 on which an electronic device unit 10 (see fig. 2) including a heat sink 3 described later is mounted. For convenience, three directions orthogonal to each other are defined in the following drawings. The X direction is along the depth direction (front-rear direction) of the electronic apparatus 1, and along the lateral width direction of the heat sink 3. The Y direction is along the width direction (left-right direction) of the electronic apparatus 1, and along the thickness direction of the heat sink 3. The Z direction is along the height direction (up-down direction) of the electronic apparatus 1, and along the vertical width direction of the heat sink 3.

As shown in fig. 1, the electronic device 1 is configured as a fanless industrial computer, and includes a housing 2, an electronic device unit 10 (see fig. 2) described later, and the like. The electronic device 1 is not limited to this example, and may be configured as various electronic devices 1 such as a desktop personal computer, a video display device, a television receiver, a game machine, and an information storage device.

The housing 2 is formed in a box shape of a rectangular parallelepiped shape short in the Y direction. The housing 2 has a plurality of wall portions such as a bottom wall 2a, a top wall 2b, a front wall 2c, a left wall 2d, a rear wall 2e, and a right wall 2 f. The bottom wall 2a is also referred to as a lower wall or the like, and the top wall 2b is also referred to as an upper wall or the like. The front wall 2c, the left wall 2d, the rear wall 2e, and the right wall 2f are also referred to as side walls, peripheral walls, or the like.

The bottom wall 2a and the top wall 2b all extend in a direction (XY plane) orthogonal to the Z direction, are spaced apart in the Z direction, and are arranged parallel to each other. The bottom wall 2a constitutes a lower end portion of the housing 2, and the top wall 2b constitutes an upper end portion of the housing 2. A plurality of rubber legs 2h are provided on the bottom wall 2a, and the plurality of rubber legs 2h protrude in a direction opposite to the Z direction, and support the housing 2 in a state of being separated from an installation surface such as a shelf, a table, or a platform, which is not shown.

The left wall 2d and the right wall 2f all extend in a direction (XZ plane) orthogonal to the Y direction, are spaced in the Y direction, and are arranged parallel to each other. The left wall 2d spans between ends of the bottom wall 2a and the top wall 2b in the Y direction, and the right wall 2f spans between ends of the bottom wall 2a and the top wall 2b in the opposite direction to the Y direction. The left wall 2d constitutes a left end portion of the housing 2, and the right wall 2f constitutes a right end portion of the housing 2.

Further, a plurality of rubber legs 2h (see fig. 4) protruding in the Y direction may be provided on the left wall 2 d. In the present embodiment, the electronic device 1 is configured to be usable in a vertical posture in which the rubber legs 2h of the bottom wall 2a are in contact with the installation surface, and a horizontal posture in which the rubber legs 2h of the left wall 2d are in contact with the installation surface. Further, the rubber leg 2h may be detachably attached to the housing 2, and when used in one posture, the rubber leg 2h used in another posture may be detached.

The right wall 2f is positioned to face a radiator 3, which will be described later, accommodated in the housing 2. In the present embodiment, the right wall 2f is coupled to the boss portion 3d of the heat sink 3 by a plurality of coupling members 18 such as bolts or screws penetrating in the Y direction. The right wall 2f is an example of an outer wall. Further, as shown in fig. 1, in the present embodiment, the right wall 2f and the radiator 3 are fixed at three places by the joint members 18, but the number of the joint members 18 (the boss portions 3d) is not limited to this example, and may be one, two, four or more.

The front wall 2c and the rear wall 2e all extend in a direction (YZ plane) orthogonal to the X direction, are spaced apart in the X direction, and are disposed parallel to each other. The front wall 2c spans between ends of the bottom wall 2a and the top wall 2b in the X direction, and the rear wall 2e spans between ends of the bottom wall 2a and the top wall 2b in the opposite direction to the X direction. The front wall 2c constitutes a front end portion of the housing 2, and the rear wall 2e constitutes a rear end portion of the housing 2. The front wall 2c is provided with an auxiliary storage device 13, a power button 14, various connectors 15, and the like.

Further, air vents 2s are provided in the bottom wall 2a, the ceiling wall 2b, the left wall 2d, and the right wall 2f, respectively. The vent 2s is formed as a portion where a plurality of small holes penetrating the wall portions are concentrated. In the present embodiment, the heat generating components in the housing 2 can be cooled by air convection in each of the above-described upright posture and horizontal posture by the air vents 2s provided in the bottom wall 2a, the top wall 2b, the left wall 2d, and the right wall 2 f.

The housing 2 is formed by combining a plurality of members (divided bodies) such as a base cover 21, a top cover 23, a right cover 24, a bottom cover 25, and an intermediate frame 22 (see fig. 2) described later. The base cover 21, the top cover 23, the right cover 24, the bottom cover 25, and the middle frame 22 are made of a metal material such as aluminum.

The base cover 21 has a part of the bottom wall 2a or a front wall 2c, a left wall 2d, and the like. The top cover 23 includes respective portions (upper side portions) of the top wall 2b or left wall 2d, rear wall 2e, and right wall 2f, and the like. The right cover 24 has a part (central portion) of the right wall 2f or the rear wall 2e, etc. The bottom cover 25 has a part (lower side part) of the right wall 2f or a part of the bottom wall 2a, etc. The base cover 21, the top cover 23, the right cover 24, and the bottom cover 25 are coupled (integrated) with each other by a coupling member 20 such as a screw.

Fig. 2 is a perspective view of the electronic device unit 10. As shown in fig. 2, the electronic device unit 10 includes an intermediate frame 22, a heat sink 3, a main board 4, a plurality of sub boards 5 to 9, a storage bracket 16, and the like. The electronic equipment unit 10 is formed by stacking the heat sink 3, the main substrate 4, the plurality of sub-substrates 5 to 9, and the storage bracket 16 on the basis of the intermediate frame 22. The intermediate frame 22 is an example of a mounting base.

The intermediate frame 22 has an intermediate wall 22a or a plurality of studs (stud)22d and 22e, a projecting wall 22c (see fig. 4) described later, and the like. The intermediate wall 22a is located at a substantially central portion of the electronic device unit 10 in the Y direction, specifically, between the main board 4 and the sub board 6. The middle wall 22a extends in a direction (XZ plane) orthogonal to the Y direction, and is parallel to the left wall 2d and the right wall 2f of the housing 2. The middle wall 22a partitions the inside of the housing 2 into a plurality of spaces in the Y direction. The intermediate wall 22a is also called a partition wall, or the like.

The stud 22d protrudes from the intermediate wall 22a in the direction opposite to the Y direction, and is interposed between the intermediate wall 22a and the main board 4. In the present embodiment, a plurality of studs 22d are provided on the intermediate wall 22a at intervals from each other. The head of the stud 22d is pressed into the intermediate wall 22a by caulking or the like. The stud 22d is an example of a first stud.

Further, a female screw portion that engages with the male screw portion of the coupling 19 is provided on the shaft portion of the stud 22 d. The coupling member 19 is a screw, a bolt, or the like, and is coupled to the stud 22d in a state where it penetrates the heat sink 3 and the main board 4 in the Y direction. That is, in the present embodiment, the radiator 3 and the main substrate 4 are fastened together by the joint 19. The main substrate 4 is supported by the plurality of studs 22d so as to be parallel to the intermediate wall 22a in a state of being separated from the intermediate wall 22a in the direction opposite to the Y direction.

The stud 22e protrudes from the intermediate wall 22a in the Y direction, and is interposed between the intermediate wall 22a and the sub-board 6. In the present embodiment, a plurality of studs 22e are provided on the intermediate wall 22a at intervals from each other. Further, the position of the stud 22e is shifted from the stud 22d when viewed in the Y direction. The head of the stud 22e is pressed into the intermediate wall 22a by caulking or the like. The stud 22e is an example of a second stud.

Further, a female screw portion that engages with the male screw portion of the coupling 19 (see fig. 4) is provided on the shaft portion of the stud 22 e. The coupling member 19 is a screw, a bolt, or the like, and is coupled to the stud 22e in a state of penetrating at least the sub board 6 in the Y direction. The sub board 6 is supported by a plurality of studs 22e so as to be parallel to the intermediate wall 22a in a state of being separated from the intermediate wall 22a in the Y direction. The coupling member 19 is not limited to this example, and the sub board 6 and the storage bracket 16 may be fastened together.

As shown in fig. 2, the sub-substrate 5 is accommodated in the opening 22b of the intermediate frame 22. The sub board 5 extends parallel to the intermediate frame 22, and is coupled to the intermediate frame 22 by a coupling member such as a screw or a bolt. A plurality of electronic components, connectors 15, and the like are provided on the sub-board 5. The sub-substrate 5 is also called a DIO substrate, an extended substrate, or the like.

The main substrate 4 is located in the opposite direction of the Y direction of the intermediate frame 22. The primary base plate 4 extends parallel to the intermediate frame 22, and is mechanically connected to the intermediate frame 22 by the above-described stud 22d and the joint 19. In the present embodiment, the ground pattern of the primary base plate 4 is also electrically connected to the intermediate frame 22 and the heat sink 3 by fastening the joint 19 and the stud 22 d.

A plurality of electronic components such as a central processing unit 11 (see fig. 4) or a main storage device 12 (see fig. 4) described later are mounted on the main board 4. The wiring in the main substrate 4 and these plural electronic components constitute at least a part of the control circuit of the electronic apparatus 1. The main board 4 is an example of a first board.

The sub-substrate 6 is positioned in the Y direction of the intermediate frame 22. The sub board 6 extends parallel to the intermediate frame 22, and is mechanically connected to the intermediate frame 22 by the above-described stud 22e and the joint 19. In the present embodiment, the ground pattern of the sub board 6 and the intermediate frame 22 are also electrically connected by fastening the joint 19 and the stud 22 e. A plurality of electronic components, connectors 15, and the like are provided on the sub-board 6. The sub-substrate 6 is an example of a second substrate, and is also referred to as an IO substrate, an expansion substrate, or the like.

As shown in fig. 2, the sub-board 7 is positioned in the X direction of the middle frame 22. The sub-board 7 extends perpendicularly to the intermediate frame 22 and is parallel to the rear wall 2e of the housing 2. The sub board 7 is mechanically connected to the intermediate frame 22 by the same structure as the

studs

22d, 22e and the coupling 19. That is, an unillustrated standing wall extending in the Y direction is provided at an end of the intermediate frame 22 in the direction opposite to the X direction, and the stud protrudes from the standing wall toward the sub-board 7.

In the present embodiment, the ground pattern of the sub-board 7 and the intermediate frame 22 are also electrically connected by fastening the above-described coupling member and the stud. A plurality of electronic components, connectors 7a (see fig. 5), and the like are provided on the sub board 7. The sub board 6, the main board 4, and the like are inserted into the connector 7 a. The sub-substrate 7 is also referred to as a backplane substrate, a rear substrate, an extension substrate, or the like.

As shown in fig. 2, the sub-substrate 8 is positioned in the Y direction of the sub-substrate 6 and in the opposite direction to the Z direction of the auxiliary storage device 13. The sub-board 8 extends parallel to the sub-board 6 and the intermediate frame 22, and is supported by a bottom wall 16a of a storage tray 16 described later. A plurality of electronic components, a power supply circuit, and the like are provided on the sub-board 8. The sub-substrate 8 is also referred to as a power supply substrate or the like.

The sub-board 9 is positioned in the opposite direction to the Z direction of the middle frame 22. The sub-board 9 extends perpendicularly to the intermediate frame 22 and is parallel to the bottom wall 2a of the housing 2. The sub board 9 is mounted with a plurality of electronic components and the like, and is inserted into a connector 6a (see fig. 4) of the sub board 6, and the sub board 9 is also referred to as a PCI board, an expansion board, or the like.

The storage tray 16 is positioned in the Y direction of the sub board 6, and constitutes an end portion of the electronic device unit 10 in the Y direction. The storage tray 16 supports the sub-board 8 or the auxiliary storage device 13. The auxiliary storage device 13 is an SSD (solid state drive) or an HDD (hard disk drive).

The heat sink 3 is located in the opposite direction to the Y direction of the main substrate 4, and constitutes an end portion of the electronic equipment unit 10 in the opposite direction to the Y direction. The heat sink 3 includes a base plate 3a, a plurality of fins 3b, a plurality of protrusions 3d, and the like. The plurality of fins 3b project from the base plate 3a in the direction opposite to the Y direction and are arranged at intervals in the X direction. In the present embodiment, the Y direction is an example of the first direction, and the X direction is an example of the second direction. The heat sink 3 is made of a metal material such as aluminum.

The base plate 3a extends parallel to the main base plate 4. In the present embodiment, the size of the base plate 3a is substantially the same as the size of the main base plate 4. The base plate 3a has a back surface 3a2 (refer to fig. 3) facing the Y direction of the main base plate 4 and a surface 3a1 (refer to fig. 2) facing the opposite direction of the Y direction of the right wall 2f of the housing 2. The surface 3a1 is provided with fins 3b, projections 3d, and the like. The heat radiation fins 3b are an example of the first heat radiation fins, and are also referred to as heat radiation portions.

The plurality of projections 3d project from the base plate 3a in the direction opposite to the Y direction, and project further in the direction opposite to the Y direction than the heat radiation fins 3 b. The boss 3d is provided with a female screw portion to be engaged with the male screw portion of the coupling member 18. The coupling member 18 is a screw, a bolt, or the like, and is coupled to the boss portion 3d in a state of penetrating the right wall 2f of the housing 2 in the Y direction. The projection 3d is an example of a first projection.

Fig. 3 is a perspective view of the heat sink 3 viewed from the rear surface 3a2 side. As shown in fig. 3, the heat sink 3 further has a protrusion 3c, a plurality of

bosses

3e and 3g, a plurality of fins 3f, and the like.

The protruding portion 3c protrudes from the base plate 3a in the Y direction. The protrusion 3c has a front end surface 3c1 in the Y direction and a side surface 3c2 extending between the front end surface 3c1 and the back surface 3a 2. The front end surface 3c1 faces the central processing unit 11 (see fig. 4) mounted on the main board 4. In other words, the protrusion 3c protrudes from the base plate 3a toward the central processing unit 11. The size of the distal end surface 3c1 is substantially the same as the size of the surface of the cpu 11.

In the present embodiment, the distal end surface 3c1 and the central processing unit 11 are thermally connected to each other via heat conductive paste (grease) or the like. The front end surface 3c1 is also referred to as a top surface, a heat transfer surface, or the like. The front end surface 3c1 is not limited to this example, and may be in direct contact with the central processing unit 11. The central processing unit 11 is an example of the first heat generator.

The side face 3c2 faces the space between the main board 4 and the base board 3 a. In the present embodiment, the side surface 3c2 is inclined toward the center of the distal end surface 3c1 as it is separated from the rear surface 3a2 in the Y direction. In other words, the protruding portion 3c has a substantially trapezoidal cross section. The protrusion 3c has such a side surface 3c2, which improves formability according to the draft angle of the mold and increases the surface area of the protrusion 3 c.

The plurality of projections 3g project from the base plate 3a in the Y direction. In the present embodiment, the boss portion 3g is provided adjacent to two corners on a diagonal line of the projection portion 3 c. A coupling member such as a screw or a bolt for coupling the heat sink 3 and the main substrate 4 is attached to the boss portion 3 g.

By screwing the heat sink 3 at the projecting portion 3c in the vicinity of the projecting portion 3g, the projecting portion 3c and the central processing unit 11 are prevented from being separated in the Y direction and from deteriorating in heat transfer performance. Further, the height of the projection 3g in the Y direction is lower than the height of the projection 3c and the projection 3e in the Y direction.

The plurality of bosses 3e protrude from the base plate 3a in the Y direction, and are interposed between the base plate 3a and the main substrate 4. The projection 3e is positioned to overlap the stud 22d (see fig. 4) when viewed in the Y direction. That is, the joint 19 that fastens the radiator 3 and the main substrate 4 together is attached to the boss portion 3 e. The

projections

3e and 3g are examples of the second projection.

The plurality of fins 3f protrude from the base plate 3a in the Y direction and are arranged at intervals in the X direction. The heat sink 3f faces the space between the primary base plate 4 and the base plate 3 a. The height of the heat sink 3f in the Y direction is lower than the height of the protruding portion 3c in the Y direction.

In the present embodiment, the surface area of the heat sink 3 is increased by the heat radiation fins 3f, and the back surface 3a2 of the base plate 3a is reinforced. The heat radiation fins 3b are an example of the second heat radiation fins, and are also referred to as heat radiation portions, beads (ビード), and the like.

Fig. 4 is a YZ cross-sectional view of the electronic device 1 of fig. 1. As shown in fig. 4, the intermediate frame 22 has a protruding wall 22 c. The protruding wall 22c protrudes from the middle wall 22a in the direction opposite to the Y direction, and is bent to extend along the main base plate 4 at a position separated from the middle wall 22 a.

The protruding wall 22c faces the main storage device 12 mounted on the main substrate 4. In other words, the protruding wall 22c protrudes from the middle wall 22a toward the main storage 12. The protruding wall 22c is coupled to the middle wall 22a by a coupling member 22f such as a screw or a bolt. The middle wall 22a is also referred to as a first metal plate or the like, and the protruding wall 22c is also referred to as a second metal plate or the like.

In the present embodiment, the protruding wall 22c is thermally connected to the main storage device 12 via the heat conductive member 30. This enables heat of main storage device 12 to be released to intermediate frame 22 by heat diffusion through heat conductive member 30. Main storage device 12 is an example of the second heat generating element. The main memory device 12 is attached to the surface of the main board 4 opposite to the central processing unit 11, and is displaced from the central processing unit 11 when viewed in the Y direction.

Further, the heat conductive member 30 has paste 31 and a sheet 32. The paste 31 is applied to the end surface of the projecting wall 22c in the direction opposite to the Y direction. The paste 31 is a thermally conductive paste containing an electrically conductive material.

The sheet 32 extends along the main substrate 4, between the paste 31 and the main storage 12. The sheet 32 is a heat sheet, and has thermal conductivity and insulation. In the present embodiment, by sandwiching such a sheet 32 between the main storage device 12 and the paste 31, conduction due to contact between the paste 31 and the terminals of the main storage device 12 or the terminals of the main board 4 is suppressed.

The storage tray 16 has a bottom wall 16a that supports the auxiliary storage device 13, the sub board 8, and the like. The bottom wall 16a extends along the intermediate frame 22, and covers the side surface 13a of the auxiliary storage device 13 in the direction opposite to the Y direction or the surface of the sub board 8 in the direction opposite to the Y direction.

In other words, the bottom wall 16a is located at a position in the middle of a heat transfer path from a heat generating element such as the intermediate frame 22, the main storage device 12, and the cpu 11 to the auxiliary storage device 13 and the sub board 8. The storage tray 16 is made of a heat insulating material such as synthetic resin. The bottom wall 16a is an example of a heat insulating wall, and the side surface 13a is an example of a second surface.

Fig. 5 is an XY sectional view of the electronic apparatus 1 of fig. 1. As shown in fig. 5, the heat sink 3 is provided with a recess 3h corresponding to the protrusion 3 c. The recess 3h is recessed in the Y direction from a surface 3a1 of the projection 3c on the side opposite to the cpu 11, that is, on the side opposite to the Y direction. The surface 3a1 is an example of the first surface.

Further, the heat sink 3b has a plurality of heat sinks 3b1 and a plurality of heat sinks 3b 2. The fins 3b1 extend in the Y direction opposite direction from the surface 3a1, and the fins 3b2 extend in the Y direction opposite direction from the bottom 3h1 of the recess 3 h. In the present embodiment, the length of the fin 3b1 in the Y direction is substantially the same as the length of the fin 3b2 in the Y direction. Therefore, a recess recessed in the Y direction from the fin 3b2 is provided at the tip of the fin 3 b.

In the present embodiment, the heat radiation fins 3b2 overlapping the cpu 11 in the Y direction are arranged further away from the right wall 2f of the housing 2. This can suppress a local temperature increase in the right wall 2f due to heat radiation (radiation) from the fin 3b2, which is more likely to become a high temperature than the fin 3b1, in the fin 3 b.

In the present embodiment, at least a part of the heat radiation fins 3b2 is covered with a portion of the right wall 2f (see fig. 1) where the air vent 2s is not provided, from the direction opposite to the Y direction. Thereby increasing the flow velocity of the air flowing near the fins 3b 2. Therefore, according to the present embodiment, the cooling effect (heat radiation effect) by the air can be further improved in the vicinity of the heat radiation fins 3b2, which are most likely to increase in temperature, of the heat sink 3.

Next, an example of a method of mounting the electronic device 1 will be described. First, the sub-board 5, the main board 4, and the heat sink 3 are assembled in this order on one side of the middle frame 22, that is, in the direction opposite to the Y direction (S1). S1 is an example of the first step.

Next, the intermediate frame 22 is turned over, and the sub-board 7 is assembled perpendicularly to the intermediate frame 22 (S2). S2 is an example of the second step.

Next, the sub board 6 and the storage bracket 16 are assembled in this order on the other side of the intermediate frame 22, that is, in the Y direction, and the electronic device unit 10 is assembled by assembling the sub boards 8 and 9 (S3). S3 is an example of the third step.

Next, the electronic device unit 10 is assembled to the base cover 21 of the housing 2 (S4). Then, the top cover 23, the right cover 24, and the bottom cover 25 are assembled to assemble the electronic apparatus 1 (S5). S4 shows an example of the fourth step, and S5 shows an example of the fifth step.

As described above, in the present embodiment, the heat sink 3 includes: a base plate 3 a; a protrusion 3c protruding from the base plate 3a in the Y direction (first direction) and thermally connectable to a central processing unit 11 (first heat generator) mounted on the main base plate 4 (first board); a plurality of fins 3b (first fins) protruding from the base plate 3a in a direction opposite to the Y direction and arranged in the X direction (second direction); a boss portion 3d (first boss portion) projecting from the base plate 3a in the direction opposite to the Y direction and projecting further in the direction opposite to the Y direction than the heat radiating fins 3b, and to which a coupling member 18 for coupling the right wall 2f (outer wall) of the case 2 and the base plate 3a can be attached; and a boss portion 3e (second boss portion) projecting from the base plate 3a in the Y direction, and to which a joint 19 for joining the main base plate 4 and the base plate 3a can be attached.

According to such a configuration, since the protruding portion 3c can avoid interference between the components other than the central processing unit 11 mounted on the main board 4 and the base board 3a, the base board 3a and the heat sink 3 can be configured to be large in size as large as the main board 4. As a result, the surface area of the heat sink 3 can be increased, and the temperature rise of the central processing unit 11 can be more effectively suppressed even in the electronic device 1 without a fan. Further, since the heat sink 3 can be fixed to the case 2 and the main substrate 4 by the

bosses

3d, 3e and the engaging

pieces

18, 19 protruding from the base plate 3a, even a relatively large heat sink 3 can be held more reliably or more firmly. Further, by fastening the

coupling members

18, 19 to the

bosses

3d, 3e, it is also possible to electrically connect the ground pattern of the main substrate 4 to the heat sink 3 and the case 2. Thus, the case 2 can function as a grounding member for the heat sink 3 and the main board 4, and can cope with EMI (electromagnetic Interference).

In the present embodiment, the protrusion 3c is provided with a recess 3h recessed in the Y direction from the surface 3a1 (first surface) on the side opposite to the cpu 11, and the heat radiation fins 3b2, which are part of the heat radiation fins 3b, protrude in the direction opposite to the Y direction from the bottom 3h1 of the recess 3 h.

According to such a configuration, when the plurality of fins 3b are formed so that the lengths in the Y direction are substantially the same, the fins 3b2 protruding from the bottom 3h1 of the recess 3h can be disposed further away from the right wall 2f of the case 2. This can suppress a local temperature increase in the right wall 2f due to heat radiation (radiation) from the fin 3b2, which is more likely to become a high temperature than the fin 3b1, in the fin 3 b. If the plurality of fins 3b are formed so that the tips thereof in the direction opposite to the Y direction are aligned, the length of the fin 3b2 can be made longer than the length of the fin 3b 1. This may further increase the surface area of the heat sink 3, and may further improve the cooling effect (heat radiation effect) of the cpu 11.

In the present embodiment, the heat sink 3 includes a plurality of fins 3f (second fins) that protrude from the base plate 3a in the Y direction and are arranged in the X direction.

According to such a configuration, the surface area of the heat sink 3 can be increased by the heat radiation fins 3f, and therefore, the cooling effect (heat radiation effect) of the central processing unit 11 can be further improved. Further, the rear surface 3a2 of the base plate 3a on the side opposite to the heat radiation fins 3b can be reinforced by the heat radiation fins 3f, and the base plate 3a can be prevented from deforming toward the heat radiation fins 3b due to thermal contraction.

In the present embodiment, the electronic device unit 10 is configured such that the following parts, each of which includes: a heat sink 3; a main board 4 on which a central processing unit 11 is mounted in thermal connection with the protrusion 3c of the heat sink 3; an intermediate frame 22 (mounting base) located in the Y direction on the opposite side of the main substrate 4 from the heat sink 3; a sub-substrate 6 (second substrate) positioned in the Y direction of the intermediate frame 22; and a storage tray 16 positioned in the Y direction of the sub board 6 and holding the auxiliary storage device 13.

According to such a configuration, as compared with a case where the heat sink 3, the main board 4, the intermediate frame 22, the sub board 6, the storage bracket 16, and the like are individually assembled in the case 2, the electronic device unit 10 that is made into a block can reduce labor and time required for manufacturing (assembling operation) the electronic device 1, or can configure the electronic device 1 more compactly.

In the present embodiment, the intermediate frame 22 includes: a middle wall 22a located between the main substrate 4 and the sub-substrate 6; a stud 22d (first stud) which protrudes from the middle wall 22a in the direction opposite to the Y direction and to which the coupling 19 for coupling the main board 4 and the middle frame 22 can be attached; and a stud 22e (second stud) projecting from the intermediate wall 22a in the Y direction, and to which a joint 19 for joining the sub-board 6 and the intermediate frame 22 can be attached.

With this configuration, the primary base plate 4 and the secondary base plate 6 can be relatively easily fixed to the intermediate frame 22 by the

studs

22d and 22e protruding from the intermediate wall 22a and the coupling 19. Further, the ground pattern of the main board 4 and the ground pattern of the sub board 6 can be electrically connected to the intermediate frame 22 by fastening the fasteners 19 to the

studs

22d and 22 e. Thus, the intermediate frame 22 can function as a grounding member for the main board 4 and the sub board 6, and can cope with EMI (electromagnetic Interference).

In the present embodiment, the main storage device 12 (second heat generating element) is further provided, the main storage device 12 is mounted on the main board 4 and is provided in a state of being thermally connected to the intermediate frame 22 via the heat conductive member 30, and the heat conductive member 30 includes the paste 31 applied to the intermediate frame 22 and the sheet 32 interposed between the paste 31 and the main storage device 12.

According to such a configuration, since the heat of the main storage device 12 can be released to the intermediate frame 22 by the heat diffusion through the heat conductive member 30, the temperature rise of the main storage device 12 can be more effectively suppressed. Further, the sheet 32 interposed between the paste 31 and the main storage device 12 can prevent the paste 31 from coming into contact with the terminals of the main storage device 12, the terminals of the main board 4, and the like and being electrically connected.

In the present embodiment, the storage tray 16 has a bottom wall 16a that covers at least a side surface 13a (second surface) of the auxiliary storage device 13 in the direction opposite to the Y direction.

According to this configuration, heat transfer from the intermediate frame 22, the main storage device 12, the central processing unit 11, and the like to the auxiliary storage device 13 is suppressed by the bottom wall 16a, and therefore, a temperature rise in the auxiliary storage device 13 can be suppressed.

The embodiments of the present invention have been described above, but the above embodiments are examples and are not intended to limit the scope of the present invention. The above embodiments may be implemented in various other ways, and various omissions, substitutions, combinations, and changes may be made without departing from the spirit of the invention. Further, specifications such as the structure and the shape (structure, type, direction, form, size, length, width, thickness, height, number, arrangement, position, material, and the like) may be appropriately changed and implemented.

Claims

1. A radiator, comprising:

base plate;

a protruding portion, protruding from the base plate in a first direction intersecting with the base plate, and capable of being thermally connected with the first heating element mounted on the first base plate;

a plurality of first heat sinks, protruding from the base plate in a direction opposite to the first direction, and arranged in a second direction intersecting with the first direction;

The first protrusion protrudes from the base plate in the opposite direction of the first direction, and further protrudes in the opposite direction of the first direction than the first heat sink, and can be assembled with the casing. a joint for combining the outer wall and the base plate;

The second boss protrudes from the base plate in the first direction, and can be fitted with a coupling member for coupling the first base plate and the base plate.

2. The heat sink of claim 1, wherein,

The protruding portion is provided with a concave portion recessed in the first direction from the first surface on the opposite side of the first heating element,

A portion of the first heat sink protrudes from the bottom of the recessed portion in a direction opposite to the first direction.

3. The heat sink of claim 1 or 2, wherein,

A plurality of second heat dissipation fins are provided, the second heat dissipation fins protrude from the base plate in the first direction and are arranged in the second direction.

4. An electronic equipment unit, wherein each of the following parts can be assembled into a housing in an integrated state, the parts comprising:

The radiator according to any one of claims 1 to 3;

a first substrate mounted with a first heat generating body disposed in a state of being thermally connected to the protruding portion of the heat sink;

an assembly base located on the first direction of the opposite side of the first substrate from the heat sink;

a second substrate located in the first direction of the mounting base; and

A storage tray, located in the first direction of the second base plate, holds an auxiliary storage device.

5. The electronic equipment unit of claim 4, wherein the mounting base has:

a middle wall, located between the first substrate and the second substrate;

a first stud, protruding from the middle wall in a direction opposite to the first direction, and capable of assembling a coupling member for coupling the first substrate and the assembly base; and

A second stud protrudes from the middle wall in the first direction, and can be fitted with a coupling member that joins the second substrate and the mounting base.

6. An electronic equipment unit according to claim 4 or 5, wherein,

having a second heat-generating body mounted on the first substrate or the second substrate and provided in a state of being thermally connected to the mounting base via a heat-conducting member,

The thermally conductive member has:

paste applied to the mounting base; and

A sheet is interposed between the paste and the second heating element.

7. The electronic equipment unit of claim 6, wherein,

The storage tray has a heat insulating wall covering at least a second surface opposite to the first direction of the auxiliary storage device.