CN114245566A

CN114245566A - Substrate, camera module and electronic equipment

Info

Publication number: CN114245566A
Application number: CN202111596231.XA
Authority: CN
Inventors: 王鹏; 徐波
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-03-25
Anticipated expiration: 2041-12-22
Also published as: CN114245566B; WO2023116597A1

Abstract

The embodiment of the application provides a substrate, a camera module and electronic equipment, wherein the substrate comprises a heat dissipation piece, a support plate, a first metal layer, a first substrate film and a second metal layer which are arranged in a laminated mode; the surface of the first metal layer, which is far away from the first base material film, is provided with a heat dissipation area for placing a functional device, the heat dissipation area is provided with a plurality of heat dissipation holes at intervals, and the heat dissipation holes extend towards the first base material film; a first groove is formed in the surface, away from the first substrate film, of the second metal layer at a position opposite to the heat dissipation area, the support plate covers the surface, away from the first substrate film, of the second metal layer, and an accommodating cavity is formed by the support plate and the first groove; the heat dissipation piece is placed in the containing cavity. The heat generated by the functional device is transferred to the heat dissipation member through the heat dissipation hole, so that the heat dissipation member dissipates the heat.

Description

Substrate, camera module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a substrate, a camera module and electronic equipment.

Background

With the development of science and technology, the functions of electronic equipment are more and more complete. Electronic devices are usually provided with a camera module to facilitate the shooting of images and videos by users. In order to promote the formation of image effect, increased the anti-shake function in the camera module among the present electronic equipment, the anti-shake mode includes optics anti-shake, electron anti-shake and cloud platform anti-shake etc. and wherein, cloud platform anti-shake uses more.

For the camera module of cloud platform anti-shake, install the camera unsettled on cloud platform support usually, drive the relative cloud platform support motion of camera through actuating mechanism, realize cloud platform anti-shake purpose. The circuit substrate of camera module includes stereoplasm portion and flexible portion, and the stereoplasm portion is connected with the camera, and the one end and the stereoplasm portion of flexible portion are connected, and flexible portion is "Z" style of calligraphy beta structure usually. When the camera moves relative to the holder support and the whole camera module vibrates, the flexible part can generate a certain damping effect, and the Z-shaped folding structure can ensure the reliability of connection between the hard part and the flexible part.

In the process of implementing the present application, the inventors found that at least the following problems exist in the related art: the heat dissipation effect of the circuit substrate is poor, heat generated by an image sensor in the camera module is difficult to dissipate, and the working performance of the image sensor is affected, so that the working performance of the image camera module is improved.

Disclosure of Invention

The embodiment of the application provides a substrate, a camera module and electronic equipment to solve the technical problems that in the prior art, the heat dissipation effect of a circuit substrate in the camera module is poor, and the heat generated by an image sensor is difficult to dissipate.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a substrate, including a heat sink, a support plate, and a first metal layer, a first substrate film, and a second metal layer stacked in layers;

the surface of the first metal layer, which is far away from the first substrate film, is provided with a heat dissipation area for placing a functional device, the heat dissipation area is provided with a plurality of heat dissipation holes at intervals, and the heat dissipation holes extend towards the first substrate film;

a first groove is formed in the surface, away from the first substrate film, of the second metal layer at a position opposite to the heat dissipation area, the support plate covers the surface, away from the first substrate film, of the second metal layer, and an accommodating cavity is formed by the support plate and the first groove;

the heat dissipation piece is placed in the accommodating cavity.

In a second aspect, an embodiment of the present application provides a camera module, which includes an image sensor and the substrate;

the image sensor is placed on the heat dissipation area of the substrate.

In a third aspect, an embodiment of the present application provides an electronic device, which includes a camera module.

The substrate provided by the embodiment of the application has the following advantages:

in the embodiment of the application, the substrate comprises a first metal layer, a first substrate film and a second metal layer which are arranged in a laminated manner, wherein a heat dissipation area for placing a functional device is arranged on the surface of the first metal layer, which is far away from the first substrate film, a plurality of heat dissipation holes are arranged at intervals in the heat dissipation area, and the heat dissipation holes extend towards the first substrate film and are blind holes; the surface that the second metal layer deviates from first substrate membrane is equipped with first recess in the position relative with the heat dissipation district, and the backup pad lid fits on the surface that the second metal layer deviates from first substrate membrane, and forms with first recess and holds the chamber, and the radiating piece is placed in holding the intracavity. Therefore, heat generated by the functional device (such as an image sensor in the camera module) can be transmitted to the heat dissipation member through the heat dissipation holes, the heat dissipation member dissipates the heat, and therefore the substrate has a good heat dissipation effect.

Drawings

Fig. 1 is a schematic view of a substrate according to an embodiment of the present disclosure;

fig. 2 is a second schematic view of a substrate according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a portion of a second metal layer of the substrate of FIG. 1;

fig. 4 is a schematic diagram illustrating a second metal layer of a substrate according to an embodiment of the present disclosure.

Reference numerals:

10: a first metal layer; 11: a heat dissipation area; 12: heat dissipation holes; 20: a first substrate film; 30: a second metal layer; 31: a first groove; 32: a second groove; 33: a connecting region; 34: a second line area; 40: a support plate; 41: a third metal layer; 411: a coverage area; 412: a first line region; 42: a second substrate film; 43: a fourth metal layer; 50: a capillary structure; 60: an insulating layer; 70: a functional device; 80: heat conducting glue; 90: and (4) conducting wires.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In the embodiment of the present application, a substrate is proposed, and referring to fig. 1 to 4, the substrate may specifically include a heat sink, a support plate 40, and a first metal layer 10, a first substrate film 20, and a second metal layer 30 stacked in layers; the surface of the first metal layer 10 departing from the first substrate film 20 is provided with a heat dissipation region 11 for placing the functional device 70, the heat dissipation region 11 is provided with a plurality of heat dissipation holes 12 at intervals, and the heat dissipation holes 12 extend towards the first substrate film 20; a first groove 31 is formed in the surface of the second metal layer 30, which is far away from the first base material film 20, at a position opposite to the heat dissipation area 11, and the support plate 40 covers the surface of the second metal layer 30, which is far away from the first base material film 20, and forms an accommodating cavity with the first groove 31; the heat dissipation piece is placed in the containing cavity. The heat generated by the functional device 70 (e.g., an image sensor in a camera module) is transferred to the heat sink through the heat dissipation holes 12, and the heat sink dissipates the heat, so that the substrate has a good heat dissipation effect.

Specifically, as shown in fig. 1 to 3, the first metal layer 10, the first substrate film 20, and the second metal layer 30 are arranged in this order from the top to the bottom in the figure, and the material of the first metal layer 10 and the second metal layer 30 may be copper foil, aluminum foil, gold foil, or other conductive material. In the present embodiment, a copper foil is preferred, and the first metal layer 10 is a first copper foil and the second metal layer 30 is a second copper foil. The first substrate film 20 may be a polyimide film (PI film for short), a polyester film (PET film for short), a fluorocarbon vinyl film, an imide fiber paper, a polybutylene terephthalate film, or other insulating base film materials. The first copper foil, the first substrate film 20 and the second copper foil form a flexible copper clad laminate (first flexible copper clad laminate for short).

In practice, the flexible copper clad laminate has thinness, lightness and flexibility, and the flexible copper clad laminate using the PI film has the characteristics of excellent electrical property, thermal property and heat resistance, so the PI film is preferable for the first substrate film 20 of the embodiment.

Specifically, as shown in fig. 1 and fig. 2, a surface of the first copper foil facing away from the first substrate film 20 (i.e., an upper surface of the first copper foil) is provided with a heat dissipation area 11 for placing a functional device 70, in practice, the functional device generates heat to generate heat during operation, and the functional device may be a resistor, a transformer, a photosensor, an image sensor, or the like, and the functional device is taken as an image sensor for example hereinafter.

Specifically, as shown in fig. 1 and fig. 2, the heat dissipation region 11 is provided with a plurality of heat dissipation holes 12 at intervals, the heat dissipation holes 12 extend toward the first substrate film 20, that is, the heat dissipation holes 12 extend downward from the upper surface of the first copper foil, and the heat dissipation holes 12 may be blind holes or through holes, and are specifically set according to the type of the actual heat dissipation device.

Specifically, as shown in fig. 3 and 4, the surface of the second copper foil facing away from the first base material film 20 (i.e., the lower surface of the second copper foil) is provided with a first groove 31 at a position opposite to the heat dissipation area 11. The lower surface of second copper foil is covered in the backup pad 40 to form with first recess 31 and hold the chamber, and the radiating piece is placed in holding the intracavity, and like this, the heat that image sensor produced can transmit to the radiating piece through louvre 12 on, so that the radiating piece is with the heat effluvium, and it is visible, this base plate has good radiating effect.

It should be noted that the image sensor can be a sensor in the camera module, and the image sensor is mainly used for receiving light passing through the lens of the camera module to convert these light signals into an electrical signal, so that when the camera module takes a picture or takes a video, the image sensor can generate heat and generate heat. In practice, the image sensor can be placed on the heat dissipation area 11, so that heat generated by the image sensor can be transmitted to the heat dissipation element through the heat dissipation hole 12, and the heat dissipation element dissipates the heat.

Particularly, because the radiating piece is to be placed in the second copper foil, the thickness of the second copper foil is greater than that of the first copper foil, the first copper foil is thin, the rapid heat transfer is facilitated, heat generated by the image sensor can be rapidly transferred to the radiating piece through the radiating hole 12 to be radiated, and the radiating effect of the substrate is further improved.

In a preferred embodiment of the present application, as shown in fig. 1 and fig. 2, the heat dissipation member is a capillary structure 50, and the capillary structure 50 is filled with a heat dissipation medium; the surface of the second metal layer 30 departing from the first substrate film 20 is further provided with a plurality of second grooves 32, and the plurality of second grooves 32 are arranged around the first grooves 31 and are respectively communicated with the first grooves 31; the heat dissipation holes 12 are blind holes, and the support plate 40, the first groove 31 and the second groove 32 form a containing cavity, which is a vacuum cavity.

Specifically, as shown in fig. 4, the lower surface of the second copper foil is further provided with a plurality of second grooves 32, and the plurality of second grooves 32 are disposed around the first grooves 31 and respectively communicate with the first grooves 31, so that the support plate 40 forms accommodating cavities with the first grooves 31 and the second grooves 32. The heat dissipation holes 12 are blind holes, so that the accommodating cavity is a vacuum cavity. Thus, the capillary structure is disposed in the vacuum chamber, and since the capillary structure 50 is filled with the heat dissipation medium, after the heat is transferred to the capillary structure 50, the heat dissipation medium begins to generate liquid phase gasification in a vacuum environment, and at this time, the heat dissipation medium absorbs the heat energy and expands rapidly, the whole vacuum cavity is filled with the gaseous heat dissipation medium rapidly, when the heat dissipation medium in the gas phase contacts the region (the second groove 32) with lower temperature, condensation occurs, thereby releasing the heat accumulated during evaporation, the condensed liquid-phase heat-dissipating medium is sucked back to the high-temperature region of the vacuum chamber due to the adsorption of the capillary structure 50, and then the liquid phase is gasified in the next cycle, the process is carried out in the vacuum cavity repeatedly, and the cycle can take away the heat generated by the image sensor, so that the substrate can achieve good cycle heat dissipation effect. The heat dissipation medium can be pure water or other medium which can absorb heat and undergo phase change.

In the illustration, the thermal via 12 penetrates through the first copper foil and the first base material film 20, and of course, the thermal via 12 may also penetrate through the first copper foil, the first base material film 20 and the second copper foil, and may be specifically set according to actual requirements.

It should be noted that, after the first grooves 31 and a plurality of (8 shown in fig. 4) second grooves 32 are etched on the lower surface of the second copper foil, the etched pattern is as shown in fig. 4; then, the capillary structure 50 is placed in the second groove 32, and a heat dissipation medium (preferably pure water) is injected into the capillary structure 50; covering the supporting plate 40 on the lower surface of the second copper foil, and sealing to enable the supporting plate 40, the first groove 31 and the second groove 32 to form an accommodating cavity; then, the air in the accommodating cavity is pumped out by the vacuum pump, so that the accommodating cavity is a vacuum cavity and is pumped into a negative pressure state, and the capillary structure 50 can be adsorbed in the first groove 31.

Specifically, the capillary structure 50 may be a metal mesh, or a porous structure formed by sintering metal powder, or a part of the metal mesh and a part of the metal mesh. The metal powder or the metal mesh is made of a material with high heat conductivity, such as copper, iron, aluminum and other metals. The preferred embodiment is a copper mesh or copper powder capillary 50. The capillary structure 50 may have a groove structure or a tube structure, or may have a groove structure in one portion and a tube structure in another portion.

In another optional embodiment of the present application, the heat dissipation hole 12 may also be a through hole or a blind hole, where the heat dissipation hole may also be a semiconductor Cooler (TEC). In practical applications, the TEC is made using the peltier effect of semiconductor materials. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials of TEC, and the bismuth telluride elements are electrically connected in series and generate heat in parallel. The TEC comprises a number of P-type and N-type pairs (sets) connected together by electrodes and sandwiched between two ceramic electrodes; when current flows through the TEC, heat generated by the current is transferred from one side of the TEC to the other side, which is the refrigeration principle of the TEC. The specific structure of the semiconductor cooler 4 is known to those skilled in the art, and reference may be made to the structure of the prior art, which is not described herein in detail.

Specifically, the cold end of the TEC faces the functional device 70, and the hot end faces away from the functional device 70, so that heat generated by the functional device 70 during operation can be absorbed by the cold end and transferred from the hot end to the support plate 40, wherein the area of the support plate 40 is larger than that of the functional device 70, and therefore, heat generated by the functional device 70 in a small area can be diffused through the support plate 40 in a large area. The area of the supporting plate 40 may be more than 2 times the area of the functional device 70, and the area of the supporting plate 40 is specifically several times the area of the functional device 70. In addition, the supporting plate 40 can be a metal plate, which is good in heat conductivity and favorable for heat diffusion, and the metal plate can also play a certain supporting role for the flexible copper clad laminate, so that the substrate is thinner, the space can be saved, and the thinning is facilitated.

In the embodiment of the present application, the first groove 31 is rectangular, the area of the orthographic projection of the first groove 31 is greater than or equal to the area of the orthographic projection of the second groove 32, and the shape of the capillary structure 50 is matched with the shape of the first groove 31; the second groove 32 is rectangular, the second groove 32 extends from the side edge of the first groove 31 to a direction away from the first groove, and the depth of the second groove 32 is less than or equal to the depth of the first groove 31.

In practice, since the heat dissipation region 11 is generally rectangular, the first groove 31 of the present embodiment is also rectangular. The area of the orthographic projection of the first groove 31 is larger than or equal to the area of the orthographic projection of the second groove 32, the shape of the capillary structure 50 is matched with the shape of the first groove 31, namely, the area of the orthographic projection of the capillary structure 50 is larger than or equal to the area of the orthographic projection of the second groove 32, therefore, heat generated by the image sensor can be transmitted to the capillary structure 50 through the heat dissipation holes 12 as far as possible, more heat can be dissipated out through the capillary structure 50, and the heat dissipation effect of the substrate is further improved. It should be noted that, due to the limited space in the electronic device, the area of the orthographic projection of the first groove 31 is generally equal to the area of the orthographic projection of the second groove 32, which is beneficial to reducing the occupied space of the substrate.

As shown in fig. 4, in order to improve the processing efficiency, the second groove 32 may be rectangular, and the second groove 32 extends from the side edge of the first groove 31 to a direction away from the first groove, and as can be seen from fig. 4, a preset distance is provided between the side edge of the second groove 32 away from the first groove 31 and the side edge of the second copper foil, that is, the second groove 32 does not extend to the side edge of the second copper foil, so that the support plate 40 may form a receiving cavity with the first groove 31 and the second groove 32. Moreover, the depth of the second groove 32 is less than or equal to the depth of the first groove 31, and the depth of the second groove 32 in the figure is less than the depth of the first groove 31, so that the condensed liquid-phase heat dissipation medium can flow back to the high-temperature region of the vacuum chamber, the heat transfer circulation can be realized more quickly, and the heat generated by the image sensor can be dissipated more quickly.

In the embodiment of the present application, as shown in fig. 4, the number of the second grooves 32 is at least four, and at least four second grooves 32 are uniformly arranged around the first groove 31.

Exemplarily, two second grooves 32 are disposed on each side of the first groove 31, or three second grooves 32 or other numbers of second grooves 32 may be disposed, and may be specifically set according to actual requirements. The plurality of second grooves 32 are uniformly arranged around the first grooves 31, so that after the heat dissipation medium absorbs heat energy and expands rapidly, the gas-phase heat dissipation medium expands outwards from all directions to fill the whole vacuum chamber more rapidly, and when the gas-phase heat dissipation medium contacts a region (the second grooves 32) with lower temperature, a condensation phenomenon is generated, so that heat accumulated during evaporation is released more rapidly, the condensed liquid-phase heat dissipation medium is absorbed back to the high-temperature region of the vacuum chamber more rapidly, and then enters the next circulation of liquid-phase gasification, the process is performed in the vacuum chamber repeatedly, and the circulation can rapidly take away heat generated by the image sensor.

It should be noted that the shape of the second grooves 32 is not limited to a rectangle, and may also be other shapes, such as a trapezoid, and the arrangement of the second grooves 32 is not limited to the arrangement shown in the drawing, the plurality of second grooves 32 are uniformly arranged, and the angles between two adjacent second grooves 32 are equal, and the specific shape and the arrangement structure of the second grooves 32 may not be limited in this embodiment, and may be specifically set according to actual requirements.

In the embodiment of the present application, the surface of the second metal layer 30 facing away from the first substrate film 20 is provided with a connection region 33 in the region excluding the first recess 31 and the second recess 32, and the connection region 33 is used for being connected with the support plate 40 in a sealing manner.

Specifically, as shown in fig. 1 and 4, the connection region 33 is provided around the first groove 31, and is provided in a region where the second groove 32 is not provided and a region on a side of the second groove 32 away from the first groove 31. The first connection region 33 may be hermetically connected to the first support plate 40 by welding or by bonding with a sealing medium so that the support plate 40 forms a sealed accommodation chamber with the first recess 31 and the second recess 32, so that the accommodation chamber may become a vacuum chamber.

In the embodiment of the present application, as shown in fig. 1, the supporting plate 40 includes a third metal layer 41, a second substrate film 42 and a fourth metal layer 43, which are stacked, and the third metal layer 41 covers a surface of the second metal layer 30 facing away from the first substrate film 20; the third metal layer 41 further comprises a covering region 411 and a first circuit region 412, the covering region 411 covers the first groove 31 and the second groove 32, the connection region 33 is located in the region of the covering region 411 except the first groove 31 and the second groove 32, the first circuit region 412 is located in the partial region of the third metal layer 41 except the covering region 411 and is insulated from the covering region 411, and a first bonding pad is arranged on the first circuit region 412 and is used for being electrically connected with the functional device 70 through a conducting wire; the surface of the fourth metal layer 43 away from the second substrate film 42 and the region of the first metal layer 10 excluding the heat dissipation region 11 are both provided with an insulating layer 60.

In the top-down direction, the support plate 40 includes a third metal layer 41, a second base material film 42, and a fourth metal layer 43 in this order, and the substrate includes a first metal layer 10, a first base material film 20, a second metal layer 30, a third metal layer 41, a second base material film 42, and a fourth metal layer 43 in this order. The material of the third metal layer 41 and the fourth metal layer 43 may be copper foil, aluminum foil, gold foil, or other conductive materials. In the present embodiment, a copper foil is preferred, and the third metal layer 41 is a third copper foil and the fourth metal layer 43 is a fourth copper foil will be described as an example. The second substrate film 42 may be a polyimide film (PI film for short), a polyester film (PET film for short), a fluorocarbon vinyl film, an imide fiber paper, a polybutylene terephthalate film, or other insulating base film materials. The third copper foil, the second substrate film 42 and the fourth copper foil form a flexible copper clad laminate (a second flexible copper clad laminate for short). That is to say, the first flexible copper clad laminate and the second flexible copper clad laminate which are arranged in a laminated manner are basically adopted in the embodiment, and the thickness of the substrate is thinner because the flexible copper clad laminate is thinner, which is beneficial to thinning. The substrate can be applied to a camera module with a tripod head anti-shaking function, so that space can be saved, a good circulating heat dissipation effect is achieved, and the problem that the working performance of the camera module is affected due to the poor heat dissipation effect of the existing circuit substrate is avoided.

In practice, the flexible copper clad laminate using the PI film is also characterized by excellent electrical, thermal and heat resistance, and therefore the PI film is preferable as the second substrate film 42 of this embodiment.

Specifically, for the third copper foil, in order to ensure that the footprint 411 can completely cover the first recess 31 and the second recess 32, as shown in fig. 1, the orthographic area of the footprint 411 may be equal to the orthographic area of the structure shown in fig. 4, that is, the orthographic area of the footprint 411 is equal to the orthographic area of the second copper foil. As shown in fig. 4, the connection region 33 is located in the area of the covering region 411 except for the first recess 31 and the second recess 32, and in fig. 1, the connection region 33 is located on the side of the second recess 32 away from the first recess 31 and on the side edge of the second recess 32.

Specifically, for the third copper foil, the first circuit area 412 is located in a partial area of the third copper foil except the covering area 411, as shown in fig. 1, the first circuit area 412 is located at two sides of the covering area 411, the first circuit area 412 may be a patterned circuit area, the first circuit area 412 avoids the covering area 411 for etching circuits, as shown in fig. 1, an unetched area is located between the covering area 411 and the first circuit area 412, and the area is provided with an insulating layer 60 so as to make the covering area 411 and the first circuit area 412 non-conductive, that is, to make the covering area 411 and the first circuit area 412 insulated, so that copper around the capillary structure 50 is non-conductive.

Specifically, the first circuit area 412 is provided with a first bonding pad, one end of the conductive wire is soldered to the first bonding pad, and the other end of the conductive wire is electrically connected to the image sensor, so that the first circuit area 412 supplies power to the image sensor.

As shown in fig. 1, the surface of the fourth copper foil facing away from the second substrate film 42 (the lower surface of the fourth copper foil) and the region of the first copper foil excluding the heat dissipation area 11 are both provided with an insulating layer 60, the insulating layer 60 on the lower surface of the fourth copper foil can be completed by pressing, and the insulating layer 60 on the first copper foil can be completed by attaching.

It should be noted that the fourth copper foil is also a patterned circuit layer, and for the specific structure of each layer of the second flexible copper clad laminate, area division can be performed according to actual requirements, and corresponding processing is performed on different areas, for example, the first circuit area 412 and the fourth copper foil are subjected to imaging circuit, and the connection area 33 of the third copper foil is subjected to surface processing to be welded or bonded with the support plate 40.

In the embodiment of the present application, the support plate 40 is a metal plate; the first metal layer 10 further comprises a second circuit area 34, the second circuit area 34 is located in a partial area of the first metal layer 10 excluding the heat dissipation area 11 and insulated from the heat dissipation area 11, a second bonding pad is arranged on the second circuit area 34, and the second bonding pad is used for being electrically connected with the functional device 70 through a conducting wire; the second metal layer 30 is provided with an insulating layer 60 except for the first recess 31, the second recess 32 and the connection region 33.

In practice, since the metal plate has good thermal conductivity and hardness, the support plate 40 of this embodiment may be a metal plate, and the material of the metal plate may be alloy, steel, or other materials, which may be specifically selected according to actual requirements, and this embodiment may not be limited thereto. The connection region 33 of the second copper foil may be hermetically connected to the support plate 40 by means of soldering.

It should be noted that the supporting plate 40 may also be a non-metal plate with a certain hardness, and the non-metal plate may be hermetically connected to the supporting plate 40 by a sealant, wherein the sealant is preferably a bonding medium whose viscosity is not affected by heat so as to prevent air leakage from the vacuum chamber.

Specifically, as shown in fig. 2, the first metal layer 10 further includes a second circuit area 34, the second circuit area 34 is located in a partial area of the first copper foil except the heat dissipation area 11, as shown in fig. 2, the second circuit area 34 is located at two sides of the heat dissipation area 11, the second circuit area 34 may be a patterned circuit area, the second circuit area 34 avoids etching circuits of the heat dissipation area 11, a section of unetched area is located between the heat dissipation area 11 and the second circuit area 34, and an insulating layer 60 is disposed in the area, so that the heat dissipation area 11 is not connected to the second circuit area 34, that is, the heat dissipation area 11 is insulated from the second circuit area 34.

As shown in fig. 2, the side of the second circuit layer away from the heat dissipation region 11 is also provided with an insulating layer 60, and the second metal layer 30 is provided with the insulating layer 60 except for the first recess 31, the second recess 32 and the connection region 33. It should be noted that, for the specific structure of each layer of the first flexible copper clad laminate, area division can be performed according to actual requirements, and corresponding processing is performed on different areas, for example, the second circuit area 34 is subjected to imaging circuit, and the heat dissipation area 11 is drilled to form the heat dissipation holes 12.

It should be noted that the material of the insulating layer 60 may be resin fiberglass cloth, thermosetting pure glue or other insulating materials, and the specific material of the insulating layer 60 in this embodiment is not limited, and may be specifically set according to actual requirements.

in the embodiment of the present application, the substrate includes a first metal layer 10, a first substrate film 20 and a second metal layer 30, which are stacked, wherein a heat dissipation region 11 for placing a functional device is disposed on a surface of the first metal layer 10 away from the first substrate film 20, the heat dissipation region 11 is provided with a plurality of heat dissipation holes 12 at intervals, and the heat dissipation holes 12 extend towards the first substrate film 20 and are blind holes; the surface of the second metal layer 30 departing from the first substrate film 20 is provided with a first groove 31 at a position opposite to the heat dissipation area 11, the support plate 40 covers the surface of the second metal layer 30 departing from the first substrate film 20 and forms an accommodating cavity with the first groove 31, and the heat dissipation member is placed in the accommodating cavity. The heat generated by the functional device 70 (image sensor of the camera module) in this embodiment can be transmitted to the heat dissipation member through the heat dissipation hole 12, and the heat dissipation member dissipates the heat, so that the substrate has a good heat dissipation effect, and the problem that the heat generated by the image sensor is difficult to dissipate due to poor heat dissipation of the circuit substrate in the camera module and affects the working performance of the image sensor can be avoided, thereby the working performance of the image camera module can be improved.

In the embodiment of the application, still provide a camera module, the camera module includes image sensor and above-mentioned base plate.

Specifically, the camera module may be a pan-tilt-zoom camera module, which includes an image sensor and the substrate, where the image sensor may be fixed to the heat dissipation area 11 of the first metal layer 10 through the thermal conductive adhesive 80.

It should be noted that the image sensor is mainly used to receive light passing through the lens of the camera module, so as to convert these light signals into electrical signals.

Specifically, the specific structure and operation principle of the substrate have been described in detail above, and are not described herein again.

Particularly, the heat that image sensor produced passes to the radiating piece through louvre 12 to through the radiating piece with heat effluvium, the radiating effect of this base plate is better, can avoid influencing the working property of camera module because the radiating effect of base plate is poor, and this base plate can comprise first flexible copper-clad plate and metal sheet, perhaps comprises first flexible copper-clad plate and the flexible copper-clad plate of second, the thickness of base plate is thinner, saves space, does benefit to slim development.

In the embodiment of the application, the electronic equipment is further provided, and the electronic equipment can comprise a camera module.

In the embodiment of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.

Specifically speaking, can include the camera module among the electronic equipment, the camera module can be for having the camera module of cloud platform anti-shake function, and the camera module includes above-mentioned base plate, and the concrete structure of base plate has been detailed above, and this place is no longer repeated.

Specifically, the camera module further comprises a digital signal processing chip, the shot scenery projects generated optical images onto the image sensor through the lens, then the optical images are converted into electric signals, the electric signals are converted into digital signals through analog-to-digital conversion, the digital signals are processed through the digital signal processing chip and then sent to a processor in the electronic equipment to be processed, and finally the digital signals are converted into images which can be seen on the screen of the electronic equipment.

The heat generated by the image sensor is transmitted to the heat dissipation member through the heat dissipation holes 12 so as to dissipate the heat through the heat dissipation member, the heat dissipation effect of the substrate is good, the influence on the working performance of the camera module due to the poor heat dissipation effect of the substrate can be avoided, and the influence on the use experience of a user due to the fact that the heat generated by the image sensor cannot be diffused in time is also avoided; in addition, the substrate of the embodiment can be composed of a first flexible copper clad laminate and a metal plate, or a first flexible copper clad laminate and a second flexible copper clad laminate, and the thickness of the substrate is small, so that the space of the electronic equipment can be saved, and the thinning development of the electronic equipment is facilitated.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While alternative embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or terminal device comprising the element. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The technical solutions provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, and meanwhile, for a person of ordinary skill in the art, according to the principles and implementation manners of the present application, changes may be made in the specific embodiments and application ranges.

Claims

1. A substrate, characterized in that it comprises a heat sink, a support plate, and a first metal layer, a first base film and a second metal layer arranged in layers;

The surface of the first metal layer facing away from the first base film is provided with a heat dissipation area for placing functional devices, the heat dissipation area is provided with a plurality of heat dissipation holes at intervals, and the heat dissipation holes face the first base film extend;

The surface of the second metal layer facing away from the first base film is provided with a first groove at a position opposite to the heat dissipation area, and the support plate is covered with the second metal layer facing away from the first on the surface of the base film, and forms a receiving cavity with the first groove;

The heat sink is placed in the accommodating cavity.

2 . The substrate according to claim 1 , wherein the heat dissipation member is a capillary structure member, and the capillary structure member is filled with a heat dissipation medium; 3 .

The surface of the second metal layer facing away from the first base film is further provided with a plurality of second grooves, the plurality of second grooves are arranged around the first grooves, and are respectively connected with the first grooves. groove connection;

The heat dissipation holes are blind holes, the support plate and the first groove and the second groove form the accommodating cavity, and the accommodating cavity is a vacuum cavity.

3 . The substrate according to claim 2 , wherein the first groove is rectangular, and the area of the orthographic projection of the first groove is greater than or equal to the area of the orthographic projection of the second groove, so 3 . The shape of the capillary structure is adapted to the shape of the first groove;

The second groove is rectangular, the second groove extends from the side edge of the first groove in a direction away from it, and the depth of the second groove is less than or equal to the depth of the first groove. depth.

4 . The substrate according to claim 3 , wherein the number of the second grooves is at least four, and at least four of the second grooves are evenly arranged around the first grooves. 5 .

5 . The substrate according to claim 2 , wherein a surface of the second metal layer facing away from the first substrate film is provided with an area except for the first groove and the second groove on the surface of the second metal layer. 6 . A connection area, the connection area is used for sealing connection with the support plate.

6 . The substrate according to claim 5 , wherein the support plate comprises a third metal layer, a second base film and a fourth metal layer which are arranged in layers, and the third metal layer covers the substrate. 7 . on the surface of the second metal layer facing away from the first substrate film;

The third metal layer includes a cover area and a first circuit area, the cover area covers the first groove and the second groove, and the connection area is located in the cover area except the first groove and the area of the second groove, the first circuit area is located in a part of the third metal layer except the coverage area, and is insulated from the coverage area, and the first circuit area is provided with There is a first pad, and the first pad is used for electrical connection with the functional device through a wire;

An insulating layer is provided on the surface of the fourth metal layer facing away from the second base film and the region of the first metal layer except the heat dissipation area.

7. The substrate according to claim 5, wherein the support plate is a metal plate;

The first metal layer further includes a second circuit area, the second circuit area is located in a part of the first metal layer except the heat dissipation area, and is insulated from the heat dissipation area, and the second circuit area is A second pad is arranged on the area, and the second pad is used for electrical connection with the functional device through a wire;

An insulating layer is provided on the second metal layer except for the first groove, the second groove and the connecting area.

8 . The substrate according to claim 2 , wherein the capillary structure member is a porous structure formed by sintering metal mesh or metal powder. 9 .

9. A camera module, comprising an image sensor and the substrate according to any one of claims 1 to 8;

The image sensor is placed on the heat dissipation area of the substrate.

10. An electronic device, comprising the electronic device of claim 9.