CN114243417B - Encapsulation equipment and encapsulation process for conductive connecting piece - Google Patents
Encapsulation equipment and encapsulation process for conductive connecting piece Download PDFInfo
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- CN114243417B CN114243417B CN202111476387.4A CN202111476387A CN114243417B CN 114243417 B CN114243417 B CN 114243417B CN 202111476387 A CN202111476387 A CN 202111476387A CN 114243417 B CN114243417 B CN 114243417B
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 192
- 238000000034 method Methods 0.000 title claims description 10
- 230000008569 process Effects 0.000 title claims description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 59
- 239000000843 powder Substances 0.000 claims description 154
- 230000007246 mechanism Effects 0.000 claims description 83
- 238000005056 compaction Methods 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 28
- 238000013459 approach Methods 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009413 insulation Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Basic Packing Technique (AREA)
Abstract
The invention relates to the technical field of electric connectors, in particular to a packaging device and a packaging process of an electric connector, wherein the packaging device comprises a control box, a frame, a clamping and positioning device, a packaging and positioning device, a first surface packaging device and a second surface packaging device; the clamping and positioning device is arranged on the rack and is used for clamping and transferring the conductive connecting piece; the encapsulation positioning device is arranged on the frame and is positioned below the clamping positioning device; the first surface encapsulation device and the second surface encapsulation device are respectively arranged on the encapsulation positioning device, and the encapsulation positioning device is used for driving the first surface encapsulation device and the second surface encapsulation device to move and position; the first surface encapsulation device is used for encapsulating one surface of the conductive connecting piece; the second face encapsulating device is used for encapsulating the opposite face of the encapsulated face. The invention has the advantages that the middle insulating part of the conductive connecting piece is not required to be covered and protected by the conductive parts at the two ends of the conductive connecting piece in the modes of adhesive tape, clamp and the like when being encapsulated, and the automatic encapsulation can be directly realized.
Description
Technical Field
The invention relates to the technical field of electric connectors, in particular to a conductive connector encapsulation device and an encapsulation process.
Background
The conductive connecting piece comprises conductive parts at two ends and an insulating part in the middle; in order to realize intermediate insulation of the conductive connecting piece, the middle section of the conductive connecting piece is required to be encapsulated, the conductive parts at two ends of the conductive connecting piece are encapsulated by high-temperature-resistant gummed paper, so that the conductive parts at two ends are encapsulated and then sent into a plastic dipping machine, epoxy resin powder in the plastic dipping machine is encapsulated on the middle insulation part, the epoxy resin powder cannot be directly encapsulated on the conductive parts due to the gummed paper encapsulation, the conductive connecting piece after plastic dipping is naturally cooled, and then the final product is obtained by tearing the gummed paper and then placing the gummed paper in a heat preservation furnace for solidification treatment.
In the encapsulation process, the glue paper is manually coated, the glue paper is torn off, the repeated repetition is very troublesome, the glue paper is sticky and can be adhered to the conductive part, the subsequent cleaning is required, the steps are very troublesome, and the encapsulation efficiency is very low.
Disclosure of Invention
The invention provides a conductive connecting piece encapsulation device for realizing automatic encapsulation and improving encapsulation efficiency, which aims to solve the technical problems that the existing conductive connecting piece encapsulation steps are complicated, automatic encapsulation cannot be realized, and the overall encapsulation efficiency is low.
The invention aims at realizing the following technical scheme:
the utility model provides a conductive connection piece encapsulation equipment, includes control box, frame, clamp and get positioner, encapsulation positioner, first face encapsulation device and second face encapsulation device; the frame is arranged on the control box; the clamping and positioning device is arranged on the rack and is used for clamping and transferring the conductive connecting piece; the wrapping and positioning device is arranged on the frame and is positioned below the clamping and positioning device; the first surface encapsulation device and the second surface encapsulation device are respectively arranged on the encapsulation positioning device, and the encapsulation positioning device is used for driving the first surface encapsulation device and the second surface encapsulation device to move and position; the first surface encapsulation device is used for encapsulating one surface of the conductive connecting piece; the second face encapsulating device is used for encapsulating the opposite face of the encapsulated face. The conductive connecting piece is accurately transferred and positioned through the clamping and positioning device, the front and back sides of the middle insulating part of the conductive connecting piece are encapsulated through the first surface encapsulating device and the second surface encapsulating device, automatic encapsulation is realized, and encapsulation efficiency is greatly improved.
Preferably, the rack is obliquely arranged on the control box; the clamping and positioning device comprises a horizontal positioning mechanism, a lifting positioning mechanism and a conductive connecting piece clamping mechanism; the horizontal positioning mechanism is horizontally arranged on the clamping positioning bracket; the lifting positioning mechanism is longitudinally arranged on the moving part of the horizontal positioning mechanism; the conductive connecting piece clamping mechanism is arranged on the moving part of the lifting positioning mechanism. Accurate positioning in the horizontal direction and the lifting direction is realized through the horizontal positioning mechanism and the lifting positioning mechanism, and accurate grabbing of the conductive connecting piece is realized through the conductive connecting piece clamping mechanism.
Preferably, the conductive connecting piece clamping mechanism comprises a clamping bracket, a first clamping motor, a second clamping motor, a clamping screw, a first clamping plate, a second clamping plate, a third clamping plate and a constant-temperature heating body; the clamping bracket is arranged on the moving part of the lifting positioning mechanism; the constant temperature heating body is arranged on the clamping bracket through the insulating block, the first clamping motor and the second clamping motor are respectively arranged at two sides of the constant temperature heating body through clamping motor supporting plates, the clamping screw rod is positioned in the constant temperature heating body, two ends of the clamping screw rod are respectively connected with the first clamping motor and the second clamping motor, and threads at the left side and the right side of the clamping screw rod are opposite; the first clamping plate, the second clamping plate and the third clamping plate are respectively positioned in the constant temperature heating body; the second clamping plate is positioned between the first clamping plate and the third clamping plate; the second clamping plate is fixedly arranged on the constant-temperature heating body, and the first clamping plate and the third clamping plate are respectively sleeved on the left side and the right side of the clamping screw rod; and the clamping screw is used for rotating to enable the first clamping plate and the third clamping plate to approach the second clamping plate so as to realize clamping. The clamping of two conductive connecting pieces can be realized through the first clamping plate and the third clamping plate simultaneously, and the conductive connecting pieces can be heated through the constant temperature heating body when being clamped and transferred, so that the insulating powder behind is conveniently encapsulated on the conductive connecting pieces.
Preferably, the wrapping and positioning device comprises a front-back positioning mechanism and a front-back positioning support plate; the front and rear positioning mechanisms are arranged on the frame; the front and rear positioning support plates are arranged on the moving part of the front and rear positioning mechanism; the first surface packaging device and the second surface packaging device are respectively arranged on the front and rear positioning support plates. The front-back positioning mechanism is used for realizing accurate positioning of the first surface packaging device and the second surface packaging device.
Preferably, the first surface packaging device comprises a packaging supporting seat, a packaging driving mechanism and a powder feeding bin; the encapsulation supporting seat is arranged on the front and rear positioning supporting plates; a plurality of conductive connecting piece encapsulation placing grooves are arranged on the encapsulation supporting seat at intervals; one end of each conductive connecting piece encapsulation placing groove is provided with a conductive connecting piece jack for inserting a conductive part at the lower end of the conductive connecting piece; a powder collecting box communicated with the jack of the conductive connecting piece is arranged below the jack of the conductive connecting piece on the front and rear positioning supporting plates; the powder feeding bin is positioned at the top of the encapsulation supporting seat, a powder outlet is formed in the bottom of one end of the powder feeding bin, which is positioned at the encapsulation placing groove of the conductive connecting piece, and the powder outlet is matched with the encapsulation placing groove of the conductive connecting piece; the encapsulation driving mechanism is arranged on the encapsulation supporting seat; the movable part of the encapsulation driving mechanism is connected with the powder feeding bin, and the encapsulation driving mechanism is used for driving the powder feeding bin to fill insulating powder in the powder feeding bin into the encapsulation placing groove of the conductive connecting piece. Insulating powder in the powder conveying bin is conveyed into the conductive connecting piece packaging and placing groove through the packaging driving mechanism, so that the bottom surface of the conductive connecting piece is conveniently and directly packaged, packaging through gummed paper is not needed, and packaging efficiency is greatly improved.
Preferably, the wrapping driving mechanism comprises a wrapping driving motor and a driving screw rod; the encapsulation supporting seat is provided with a first screw rod cavity; the packaging driving motor is arranged on one side of the packaging supporting seat, a rotating shaft of the packaging driving motor is connected with the driving screw rod, and the driving screw rod is positioned in the first screw rod cavity; a sliding groove consistent with the direction of the driving screw rod is arranged at the top of the encapsulation supporting seat; the sliding groove is communicated with the first screw rod cavity; the bottom of the powder feeding bin is provided with a screw rod sliding sleeve; the screw rod sliding sleeve penetrates through the sliding groove and is sleeved on the driving screw rod, and the screw rod sliding sleeve moves back and forth along the sliding groove in the first screw rod cavity. The encapsulation driving motor is matched with the driving screw rod, so that the accuracy of moving and positioning of the powder feeding bin is further improved.
Preferably, the second surface packaging device has the same structure as the first surface packaging device, the depth of the conductive connecting piece packaging placing groove on the second surface packaging device is larger than that of the conductive connecting piece packaging placing groove on the first surface packaging device, and the second surface packaging device further comprises a powder compacting mechanism; the powder compaction mechanism comprises a compaction driving motor, a compaction driving screw rod and a powder compaction plate; a second lead screw cavity is also arranged on the encapsulation supporting seat in the second surface encapsulation device; the compaction driving motor is arranged on the encapsulation supporting seat; the rotating shaft of the compaction driving motor is connected with the compaction driving screw rod, and the compaction driving screw rod is positioned in the second screw rod cavity; the bottom of the powder compacting plate is provided with a compacting screw sleeve; the compaction screw rod sleeve is sleeved on the compaction driving screw rod, and the powder compaction plate moves back and forth in the second screw rod cavity through the compaction screw rod sleeve; the powder compacting plate is provided with compacting bayonets matched with the conductive connecting pieces; the bottom of the powder feeding bin on the second surface packaging device is also provided with an anti-collision notch for preventing collision with the powder compacting plate. Insulating powder in the powder conveying bin is conveyed into the conductive connecting piece encapsulation placing groove through the second face encapsulation device, so that the top face of the conductive connecting piece is encapsulated directly, encapsulation through gummed paper is not needed, and encapsulation efficiency is greatly improved.
Preferably, the device also comprises a feeding preheating device; the feeding preheating device is arranged on the encapsulation positioning device and is positioned at the feeding end side of the first surface encapsulation device; the feeding preheating device is provided with a plurality of preheating sockets for inserting and placing the conductive connecting pieces, and a preheating block is arranged in the feeding preheating device. The heating of the conductive connecting piece is further accelerated through the feeding preheating device, so that the conductive connecting piece is conveniently and effectively encapsulated.
Preferably, the device further comprises a device to be cured; the device to be solidified is arranged on the encapsulation positioning device and is positioned at the discharge end side of the second surface encapsulation device; the device to be cured is provided with a plurality of sockets to be cured for inserting and placing the conductive connecting pieces. The conductive connecting pieces are conveniently placed through the device to be cured, so that the next group of conductive connecting pieces are directly encapsulated, and the encapsulation efficiency is further improved.
Preferably, a conductive connecting piece encapsulation process sequentially comprises the following steps:
s1, clamping and preheating: clamping the upper conductive part of the conductive connecting piece, and transferring to a feeding preheating position for uniform heating;
s2, one surface of the middle insulating part is encapsulated: after preheating, transferring the conductive connecting piece to the bottom surface encapsulation of the insulating part, avoiding the conductive part at the lower end of the conductive connecting piece from the insulating powder, and enabling one surface of the middle insulating part of the conductive connecting piece to be in contact with the insulating powder at the bottom surface encapsulation of the insulating part; thereby encapsulating the insulating powder on one side of the intermediate insulating portion;
s3, packaging the other surface of the middle insulating part: transferring the bottom surface of the middle insulating part to the top surface sealing part of the insulating part after sealing; the lower end conductive part of the conductive connecting piece is avoided from the insulating powder, and the other surface of the middle insulating part of the conductive connecting piece is contacted with the insulating powder, so that the insulating powder is encapsulated on the other surface of the middle insulating part;
s4, curing: transferring the encapsulated conductive connecting piece to a curing part to wait for curing of the insulating powder;
s5, transferring a finished product: and (5) blanking and transferring the conductive connecting piece of the cured finished product.
According to the conductive connecting piece encapsulation equipment adopting the technical scheme, the conductive connecting piece is accurately transferred and positioned through the clamping and positioning device, the front and back sides of the middle insulating part of the conductive connecting piece are encapsulated through the first surface encapsulation device and the second surface encapsulation device, automatic encapsulation is realized, and encapsulation efficiency is greatly improved. The clamping of two conductive connecting pieces can be realized through the first clamping plate and the third clamping plate simultaneously, and the conductive connecting pieces can be heated through the constant temperature heating body when being clamped and transferred, so that the insulating powder behind is conveniently encapsulated on the conductive connecting pieces. Insulating powder in the powder conveying bin is conveyed into the conductive connecting piece packaging and placing groove through the packaging driving mechanism, so that the bottom surface of the conductive connecting piece is conveniently and directly packaged, packaging through gummed paper is not needed, and packaging efficiency is greatly improved. Insulating powder in the powder conveying bin is conveyed into the conductive connecting piece encapsulation placing groove through the second face encapsulation device, so that the top face of the conductive connecting piece is encapsulated directly, shielding protection through gummed paper or a clamp is not needed, and the encapsulation efficiency is greatly improved.
In summary, the invention has the advantages that the automatic encapsulation can be directly realized without shielding the conductive parts at the two ends of the conductive connecting piece by gummed paper or a clamp, and the encapsulation efficiency is greatly improved.
Drawings
Fig. 1 is a schematic structural view of the conductive connector encapsulation apparatus of the present invention.
Fig. 2 is a schematic structural view of the clamping and positioning device in the invention.
Fig. 3 is an exploded view of the clamping and positioning device of the present invention.
Fig. 4 is a schematic structural view of the first surface encapsulating device in the present invention.
Fig. 5 is a schematic structural view of a second face-wrapping device of the present invention.
Fig. 6 is a schematic structural view of a feeding preheating device in the present invention.
Fig. 7 is a schematic structural view of an apparatus to be cured in the present invention.
Fig. 8 is a schematic structural view of a conductive connector according to the present invention.
Fig. 9 is a schematic diagram of a comparison of powder forces on an encapsulation placement groove of a conductive connector.
Fig. 10 is a schematic structural view of a top surface encapsulation of a conductive connector.
Wherein: 1-a control box; 2-a frame; 3-clamping and positioning devices; 31-a horizontal positioning mechanism; 32-a lifting positioning mechanism; 33-a conductive connector clamping mechanism; 331-clamping a bracket; 332-a first clamping motor; 333-a second clamping motor; 334-clamping a lead screw; 335-a first splint; 336-a second splint; 337-a third clamping plate; 338-heating body at constant temperature; 339-insulating block; 4-enveloping the positioning device; 41-a front-rear positioning mechanism; 42-front-rear positioning support plates; 5-a first face encapsulation means; 51-enveloping the support; 511-the conductive connector encloses the placement slot; 512-conductive connector jacks; 513-a first lead screw chamber; 514-a chute; 52-enveloping the drive motor; 53-driving a screw; 54, powder feeding bin; 6-a second face-encapsulating means; 61-compaction drive motor; 62-compacting the drive screw; 63-powder compaction plate; 631-compacting the screw sleeve; 632-compact bayonet; 633-anti-collision notch; 64-a second lead screw cavity; 7-a feeding preheating device; 8-a device to be solidified; 9-conductive connectors; 91-upper conductive portion; 92-a lower conductive portion; 93-intermediate insulation.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
As shown in fig. 1, a conductive connecting piece encapsulation device comprises a control box 1, a frame 2, a clamping and positioning device 3, an encapsulation and positioning device 4, a first surface encapsulation device 5 and a second surface encapsulation device 6; the control box 1 is used for controlling the action, running speed, heating temperature and the like of the whole equipment. The frame 2 is obliquely arranged on the control box 1; as shown in fig. 8 and 9, if the mold is placed horizontally, the powder particles at the positions indicated by the arrows in the drawing are subjected to a force, and the gravity of the powder particles is greater than the adsorption force between the powder particles, so that the powder particles naturally slide down, and the encapsulation effect cannot meet the requirement; therefore, the frame is inclined, so that the mould is inclined to the rear lower side by a proper angle, the gravity born by the powder particles in the figure and the adsorption force among the powder particles are balanced, the powder particles cannot naturally flow, and a good encapsulation effect is achieved. The clamping and positioning device 3 is used for clamping and transferring the conductive connecting piece; the clamping and positioning device 3 comprises a horizontal positioning mechanism 31, a lifting positioning mechanism 32 and a conductive connecting piece clamping mechanism 33; the horizontal positioning mechanism 31 is a horizontal positioning electric cylinder, and the horizontal positioning electric cylinder is arranged above the frame 2; the lifting and positioning mechanism 32 is a lifting and positioning electric cylinder, and the lifting and positioning electric cylinder is longitudinally arranged on the moving part of the horizontal positioning mechanism 31, and is driven to perform horizontal positioning by the horizontal positioning electric cylinder. The conductive connecting piece clamping mechanism 33 is arranged on the moving part of the lifting positioning mechanism 32, and the lifting positioning electric cylinder drives the conductive connecting piece clamping mechanism 33 to lift and position. Accurate positioning in the horizontal direction and the lifting direction is realized through the horizontal positioning mechanism 31 and the lifting positioning mechanism 32, and accurate grabbing of the conductive connecting piece 9 is realized through the conductive connecting piece clamping mechanism 33. The envelope positioning device 4 includes a front-rear positioning mechanism 41 and a front-rear positioning support plate 42; the front-rear positioning mechanism 41 is provided on the frame 2; the front-rear positioning support plate 42 is provided on the moving part of the front-rear positioning mechanism 41; the first face-packing means 5 and the second face-packing means 6 are provided on the front-rear positioning support plate 42, respectively. The precise positioning of the first surface encapsulating device 5 and the second surface encapsulating device 6 is realized by the front-rear positioning mechanism 41, so that the conductor connecting piece 9 on the conductor connecting piece clamping mechanism 33 can be conveniently moved downwards to the first surface encapsulating device 5 and the second surface encapsulating device 6 for encapsulation. The first surface encapsulating device 5 is used for encapsulating one surface of the conductive connecting piece; the second face-encapsulating means 6 are used to encapsulate the opposite face to the encapsulated face. The accurate transfer and positioning of the conductive connecting piece are realized through the clamping and positioning device 3, and the front and back sides of the middle insulating part 93 of the conductive connecting piece 9 are encapsulated through the first surface encapsulating device 5 and the second surface encapsulating device 6, so that automatic encapsulation is realized, and the encapsulation efficiency is greatly improved.
As shown in fig. 8, the conductive connecting member 9 to be encapsulated in the present invention is shown, and the conductive connecting member 9 is integrally zigzag-shaped; the conductive connecting piece 9 is composed of an upper conductive part 91, an intermediate insulating part 93 and a lower conductive part 92, wherein the intermediate insulating part 93 is in a ladder shape; the intermediate insulating portion 93 on the conductive connecting member 9 needs to be encapsulated by the insulating powder 10, and the insulating powder 10 is an epoxy resin powder.
As shown in fig. 1 to 3, the conductive connector clamping mechanism 33 includes a clamping bracket 331, a first clamping motor 332, a second clamping motor 333, a clamping screw 334, a first clamping plate 335, a second clamping plate 336, a third clamping plate 337, and a constant temperature heating body 338; the gripping bracket 331 is provided on the moving part of the elevation positioning mechanism 33; the constant temperature heating body 338 is arranged on the clamping bracket 331 through an insulating block 339, the first clamping motor 332 and the second clamping motor 333 are respectively arranged at two sides of the constant temperature heating body 338 through clamping motor support plates 3321, the clamping screw rod 334 is positioned in the constant temperature heating body 338, two ends of the clamping screw rod 334 are respectively connected with the first clamping motor 332 and the second clamping motor 333, and threads at the left side and the right side of the clamping screw rod 334 are opposite; the clamping screw 334 is more precisely controlled by the first clamping motor 332 and the second clamping motor 333, and the clamping and loosening phenomena to the middle and to the two sides can be realized by opposite threads. The first clamping plate 335, the second clamping plate 336 and the third clamping plate 337 are respectively positioned in the constant temperature heating body 338; the second clamping plate 336 is located between the first clamping plate 335 and the third clamping plate 337; the second clamping plate 336 is fixedly arranged on the constant temperature heating body 338, and the first clamping plate 335 and the third clamping plate 337 are respectively sleeved on the left side and the right side of the clamping screw 334; and the clamping screw 334 is rotated to enable the first clamping plate 335 and the third clamping plate 337 to approach the second clamping plate 336 for clamping. The clamping of the upper end conductive parts 91 of the two conductive connecting pieces 9 can be achieved through the first clamping plate 335 and the third clamping plate 337, and the upper end conductive parts 91 can be heated through the constant temperature heating body 338 while clamping and transferring, so that heat is transferred to the middle insulating part 93, and the following insulating powder 10 is conveniently encapsulated on the conductive connecting pieces 9.
As shown in fig. 1 and 4, the first surface packaging device 5 comprises a packaging support seat 51, a packaging driving mechanism and a powder feeding bin 54; the envelope supporting seat 51 is provided on the front-rear positioning supporting plate 42; two conductive connector encapsulating placement grooves 511 are arranged at intervals at the rear part of the encapsulating support seat 51; the front end of each conductive connector encapsulation placing groove 511 is provided with a conductive connector jack 512 for inserting the lower conductive part 92 of the conductive connector 9; the upper conductive part 91 is clamped by the first clamping plate 335 and the third clamping plate 337, and the upper conductive part 91 is not contacted with the insulating powder 10 when the encapsulation is realized, and the lower conductive part 92 is not contacted with the insulating powder 10 by the conductive connector insertion hole 512, so that the encapsulation can be realized only by contacting the middle insulating part 92 with the insulating powder 10. The powder collecting box 55 which is positioned below the conductive connecting piece jack 512 and is communicated with the conductive connecting piece jack 512 is arranged on the front and rear positioning support plates 42, so that the insulating powder 10 which is extruded in excess in the encapsulation process can fall into the powder collecting box 55 through the conductive connecting piece jack 512 for recycling. The powder feeding bin 54 is located at the top of the encapsulation supporting seat 51, and the bottom surface of the powder feeding bin 54 is tightly attached to the top surface of the encapsulation supporting seat 51, so that the insulating powder 10 in the powder feeding bin 54 can be prevented from scattering on the encapsulation supporting seat 51 in moving as much as possible. A powder outlet 541 is arranged at the bottom of one end of the powder feeding bin 54, which is positioned at the conductive connecting piece encapsulation placing groove 511, and the powder outlet 541 is matched with the conductive connecting piece encapsulation placing groove 511; the area of the powder outlet 541 is the same as the area of the conductive connector encapsulating and placing groove 511 minus the area of the conductive connector jack 512, so that the insulating powder 10 can be prevented from directly falling into the powder collecting box 55 from the powder outlet 541, and the conductive connector encapsulating and placing groove 511 can be better filled with a layer of insulating powder 10. The envelope driving mechanism is provided on the envelope supporting seat 51; the moving part of the encapsulation driving mechanism is connected with the powder feeding bin 54, and the encapsulation driving mechanism is used for driving the powder feeding bin 54 to fill the insulating powder 10 in the powder feeding bin 54 into the conductive connecting piece encapsulation placing groove 511. The insulating powder 10 in the powder feeding bin 54 is conveyed into the conductive connecting piece encapsulation placing groove 511 through the encapsulation driving mechanism, so that the bottom surface of the conductive connecting piece 9 is directly encapsulated conveniently, encapsulation through gummed paper is not needed, and the encapsulation efficiency is greatly improved. In the process of encapsulating the bottom surface of the middle insulating part 93, as shown in fig. 10, the thickness of the insulating powder 10 filled in the insulating powder filling layer in the insulating powder filling groove 511 of the middle insulating part 93 of the first surface encapsulating device 5 is larger than the thickness of the insulating layer required to be encapsulated on the bottom surface of the middle insulating part 93 of the conductive connecting part 9, so that the bottom surface of the middle insulating part 93 of the conductive connecting part 9 can be better encapsulated according to the designated thickness through the redundant insulating powder 10, the encapsulation can be more comprehensive, and the phenomena that the encapsulation thickness does not reach the standard and the encapsulation is incomplete can be avoided, thereby achieving better encapsulation effect and insulating effect. The envelope drive mechanism includes an envelope drive motor 52 and a drive lead screw 53; a first screw cavity 513 is horizontally arranged on the encapsulation support seat 51; the encapsulation driving motor 52 is arranged on the right side of the encapsulation supporting seat 51, a rotating shaft of the encapsulation driving motor 52 is connected with the driving screw 53, and the driving screw 53 is horizontally positioned in the first screw cavity 513; a sliding groove 514 which is consistent with the driving screw 53 in direction is arranged at the top of the encapsulation supporting seat 51; the chute 514 is in communication with the first lead screw chamber 513; the bottom of the powder feeding bin 54 is provided with a screw rod sliding sleeve 541; the screw rod sliding sleeve 541 passes through the sliding groove 514 and is sleeved on the driving screw rod 53, and the screw rod sliding sleeve 541 horizontally moves back and forth along the sliding groove 514 in the first screw rod cavity 513. The accuracy of the moving and positioning of the powder feeding bin 54 is further improved through the matching of the encapsulation driving motor 52 and the driving screw 53.
As shown in fig. 4, the structure of the second surface encapsulating device 6 is the same as that of the first surface encapsulating device 5, and the depth of the conductive connector encapsulating and placing groove 511 on the second surface encapsulating device 6 is greater than that of the conductive connector encapsulating and placing groove 511 on the first surface encapsulating device 5, so that after the bottom surface of the intermediate insulating part 93 has been encapsulated, the top surface of the intermediate insulating part 93 is encapsulated after the intermediate insulating part 93 is placed in the conductive connector encapsulating and placing groove 511 on the second surface encapsulating device 6. In the process of encapsulating the top surface of the middle insulating part 93, as shown in fig. 10, the powder feeding bin 54 of the second surface encapsulating device 6 moves to above the conductive connecting piece encapsulating and placing groove 511, and presses the middle insulating part 93 below the powder feeding bin 54, the thickness of a layer of insulating powder 10 filled in the middle insulating part 93 by the powder feeding bin 54 is larger than the thickness of an insulating layer required to be encapsulated on the top surface of the middle insulating part 93 of the conductive connecting piece 9, so that the top surface of the middle insulating part 93 on the conductive connecting piece 9 can be encapsulated according to the specified thickness better through the redundant insulating powder 10, the encapsulation is more comprehensive, and the phenomena of unqualified encapsulation thickness and incomplete encapsulation are avoided, thereby achieving better encapsulation effect and insulation effect. And the second face-wrapping device 6 further comprises a powder compacting mechanism; the powder compacting mechanism includes a compaction drive motor 61, a compaction drive screw 62, and a powder compacting plate 63; the second lead screw cavity 64 in the front-rear direction is also arranged on the wrapping support seat 51 in the second surface wrapping device 6; the compaction drive motor 61 is provided at the front of the envelope support seat 51; the rotation shaft of the compaction drive motor 61 is connected with the compaction drive screw 62, and the compaction drive screw 62 is positioned in the second screw cavity 64 in the front-rear direction; the bottom of the powder compacting plate 63 is provided with a compacting screw sleeve 631; the compaction screw sleeve 631 is sleeved on the compaction driving screw 62, and the powder compaction plate 63 moves back and forth and is positioned in the second screw cavity 64 through the compaction screw sleeve 631; the powder compacting plate 63 is provided with compacting bayonets 632 that cooperate with the conductive connectors; the width of the compacted bayonet 632 matches the width of the conductive connector 9. The insulating powder 10 can be more neatly and firmly encapsulated on the intermediate insulating portion 93 by the powder compacting plates 63. The bottom of the powder feeding bin 54 on the second surface packaging device 6 is also provided with an anti-collision notch 633 which prevents collision with the powder compacting plate 63, and the anti-collision notch 633 is arranged in a horizontal direction, so that the powder feeding bin 54 on the second surface packaging device 6 can slide over the powder compacting plate 63 when moving horizontally, and collision between the powder feeding bin and the powder compacting plate 63 is prevented. The insulating powder 10 in the powder feeding bin 54 is conveyed into the conductive connecting piece encapsulation placing groove 511 through the second face encapsulation device 6, so that the top face of the conductive connecting piece 9 is encapsulated directly, encapsulation through gummed paper is not needed, and the encapsulation efficiency is greatly improved.
As shown in fig. 6 and 7, the apparatus further comprises a feeding preheating device 7 and a device to be solidified 8; the feeding preheating device 7 is arranged on the encapsulation positioning device 4, and the feeding preheating device 7 is positioned at the feeding end side of the first surface encapsulation device 5; the feeding preheating device 7 is provided with a plurality of preheating sockets 71 for inserting and placing conductive connectors, and a preheating block is arranged in the feeding preheating device 7. The heating of the conductive connecting piece 9 is further accelerated by the feeding preheating device 7, so that the conductive connecting piece 9 is conveniently and effectively encapsulated. The device to be solidified 8 is arranged on the encapsulation positioning device 4, and the device to be solidified 8 is positioned at the discharge end side of the second surface encapsulation device 6; the device to be cured 8 is provided with a plurality of sockets 81 to be cured for the insertion of conductive connectors. The conductive connecting pieces 9 are conveniently placed through the device 8 to be cured, so that the next group of conductive connecting pieces 9 are directly encapsulated, and the encapsulation efficiency is further improved.
An encapsulation process of a conductive connecting piece sequentially comprises the following steps:
s1, clamping and preheating: clamping the upper conductive part 91 of the conductive connecting piece 9, and transferring to a feeding preheating position for uniform heating;
the specific operations of the device incorporating the invention are: the first surface encapsulating device 5 and the second surface encapsulating device 6 which are filled with the insulating powder 10 are moved to the lower part of the clamping and positioning device 3 through the encapsulating and positioning device 4, the two conductive connecting pieces 9 are clamped through the conductive connecting piece clamping mechanism 33 on the clamping and positioning device 3, and the two conductive connecting pieces 9 are inserted into the feeding preheating device 7 for preheating through the horizontal positioning mechanism 31 and the lifting and positioning mechanism 32.
S2, one surface of the middle insulating part is encapsulated: after preheating, transferring the conductive connecting piece 9 to one surface of the insulating part for encapsulation, so that the conductive part 92 at the lower end of the conductive connecting piece 9 is avoided from the insulating powder 10, and one surface of the middle insulating part 93 of the conductive connecting piece 9 is contacted with the insulating powder 10 at the one surface of the insulating part for encapsulation; so that the insulating powder 10 is encapsulated on one side of the intermediate insulating portion 93;
the specific operations of the device incorporating the invention are: filling a layer of insulating powder 10 on the two conductive connecting piece encapsulation placing grooves 511 through a powder feeding bin 54 on the first face encapsulation device 5; the preheated two conductive connecting pieces 9 are transferred and conveyed to the first surface packaging device 5, the lower conductive parts 92 of the conductive connecting pieces 9 are inserted into the conductive connecting piece insertion holes 512, so that the bottom surfaces of the middle insulating parts 93 of the conductive connecting pieces 9 are attached to the insulating powder 10 on the conductive connecting piece packaging and placing grooves 511, the conductive connecting pieces 9 are pressed downwards through the lifting and positioning mechanism 32, packaging is more compact, the insulating powder is packaged on the bottom surfaces of the middle insulating parts 93, and packaging of the bottom surfaces of the middle insulating parts 93 is completed.
S3, packaging the other surface of the middle insulating part: transferring one surface of the middle insulating part 93 to the other surface of the insulating part after the encapsulation is completed; the lower end conductive part 92 of the conductive connector 9 is avoided from the insulating powder 10, and the other surface of the middle insulating part 93 of the conductive connector 9 is contacted with the insulating powder 10, so that the insulating powder 10 is encapsulated on the other surface of the middle insulating part 93;
the specific operations of the device incorporating the invention are: the conductive connecting pieces 9 with the encapsulated bottom surfaces of the two middle insulating parts 93 are transferred to the second surface encapsulating device 6, the conductive parts 92 at the lower ends of the conductive connecting pieces 9 are inserted into the conductive connecting piece inserting holes 512 of the second surface encapsulating device 6, so that the bottom surfaces of the middle insulating parts 93 of the conductive connecting pieces 9 are attached to the conductive connecting piece encapsulating and placing grooves 511, insulating powder 10 does not exist on the conductive connecting piece encapsulating and placing grooves 511, after the conductive connecting pieces 9 are placed, the powder feeding bin 54 of the second surface encapsulating device 6 is moved to the upper side of the middle insulating parts 93 to encapsulate the top surfaces of the middle insulating parts 93, and after the encapsulation, the insulating powder 10 on the top surfaces and the bottom surfaces of the middle insulating parts 93 is further compacted through the powder compacting mechanism, so that the encapsulation quality is improved.
S4, curing: transferring the encapsulated conductive connecting piece 9 to a curing place to wait for the curing of the insulating powder 10;
the specific operations of the device incorporating the invention are: the two conductive connection pieces 9 are transferred after both sides are encapsulated, and the lower end conductive portions 92 of the two conductive connection pieces 9 are inserted into the device 8 to be cured, and the curing of the insulating powder 10 is waited.
S5, transferring a finished product: and blanking and transferring the conductive connecting piece 9 of the cured finished product.
In summary, the invention has the advantages that the automatic encapsulation can be directly realized without shielding the conductive parts at the two ends of the conductive connecting piece by gummed paper or a clamp, and the encapsulation efficiency is greatly improved.
Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the invention.
Claims (9)
1. The conductive connecting piece encapsulation equipment is characterized by comprising a control box (1), a frame (2), a clamping and positioning device (3), an encapsulation and positioning device (4), a first surface encapsulation device (5) and a second surface encapsulation device (6); the frame (2) is arranged on the control box (1); the clamping and positioning device (3) is arranged on the frame (2), and the clamping and positioning device (3) is used for clamping and transferring the conductive connecting piece; the encapsulation positioning device (4) is arranged on the frame (2) and is positioned below the clamping positioning device (3); the first surface encapsulation device (5) and the second surface encapsulation device (6) are respectively arranged on the encapsulation positioning device (4), and the encapsulation positioning device (4) is used for driving the first surface encapsulation device (5) and the second surface encapsulation device (6) to move and position; the first surface packaging device (5) comprises a packaging supporting seat (51), a packaging driving mechanism and a powder feeding bin (54); the encapsulation supporting seat (51) is arranged on the front and rear positioning supporting plates (42); a plurality of conductive connecting piece encapsulation placing grooves (511) are arranged on the encapsulation supporting seat (51) at intervals; one end of each conductive connecting piece encapsulation placing groove (511) is provided with a conductive connecting piece jack (512) for inserting a lower conductive part (92) of a conductive connecting piece (9); a powder collecting box (55) communicated with the conductive connecting piece jack (512) is arranged below the conductive connecting piece jack (512) on the front and rear positioning support plates (42); the powder feeding bin (54) is positioned at the top of the encapsulation supporting seat (51), a powder outlet (541) is formed in the powder feeding bin (54) and positioned at the bottom of one end of the conductive connecting piece encapsulation placing groove (511), and the powder outlet (541) is matched with the conductive connecting piece encapsulation placing groove (511); the encapsulation driving mechanism is arranged on the encapsulation supporting seat (51); the moving part of the encapsulation driving mechanism is connected with the powder feeding bin (54), and the encapsulation driving mechanism is used for driving the powder feeding bin (54) to fill insulating powder in the powder feeding bin (54) into the encapsulation placing groove (511) of the conductive connecting piece; the structure of the second surface packaging device (6) is the same as that of the first surface packaging device (5), and the depth of the conductive connecting piece packaging and placing groove (511) on the second surface packaging device (6) is larger than that of the conductive connecting piece packaging and placing groove (511) on the first surface packaging device (5); the first surface encapsulation device (5) is used for encapsulating one surface of the conductive connecting piece; the second face encapsulating means (6) is for encapsulating the opposite face to the encapsulated face.
2. A conductive connector encapsulation apparatus according to claim 1, wherein the frame (2) is arranged obliquely to the control box (1); the clamping and positioning device (3) comprises a horizontal positioning mechanism (31), a lifting positioning mechanism (32) and a conductive connecting piece clamping mechanism (33); the horizontal positioning mechanism (31) is horizontally arranged on the frame (2); the lifting positioning mechanism (32) is longitudinally arranged on the moving part of the horizontal positioning mechanism (31); the conductive connecting piece clamping mechanism (33) is arranged on the moving part of the lifting positioning mechanism (32).
3. The electrical connector encapsulation apparatus of claim 2, wherein the electrical connector clamping mechanism (33) comprises a clamping bracket (331), a first clamping motor (332), a second clamping motor (333), a clamping screw (334), a first clamping plate (335), a second clamping plate (336), a third clamping plate (337), and a constant temperature heating body (338); the clamping bracket (331) is arranged on the moving part of the lifting positioning mechanism (33); the constant temperature heating body (338) is arranged on the clamping bracket (331) through an insulating block (339), the first clamping motor (332) and the second clamping motor (333) are respectively arranged at two sides of the constant temperature heating body (338) through clamping motor supporting plates (3321), the clamping screw rod (334) is positioned in the constant temperature heating body (338), two ends of the clamping screw rod (334) are respectively connected with the first clamping motor (332) and the second clamping motor (333), and threads at the left side and the right side of the clamping screw rod (334) are opposite; the first clamping plate (335), the second clamping plate (336) and the third clamping plate (337) are respectively positioned in the constant temperature heating body (338); the second clamping plate (336) is positioned between the first clamping plate (335) and the third clamping plate (337); the second clamping plate (336) is fixedly arranged on the constant-temperature heating body (338), and the first clamping plate (335) and the third clamping plate (337) are respectively sleeved on the left side and the right side of the clamping screw (334); and the clamping screw (334) is used for rotating to enable the first clamping plate (335) and the third clamping plate (337) to approach the second clamping plate (336) so as to realize clamping.
4. A conductive connector encapsulation apparatus according to claim 1, wherein said encapsulation positioning means (4) comprises a front-rear positioning mechanism (41) and a front-rear positioning support plate (42); the front and rear positioning mechanism (41) is arranged on the frame (2); the front and rear positioning support plates (42) are arranged on the moving part of the front and rear positioning mechanism (41); the first surface packaging device (5) and the second surface packaging device (6) are respectively arranged on the front and rear positioning support plates (42).
5. A conductive connector encapsulation apparatus according to claim 1, wherein said encapsulation drive mechanism comprises an encapsulation drive motor (52) and a drive lead screw (53); the encapsulation supporting seat (51) is provided with a first screw rod cavity (513); the encapsulation driving motor (52) is arranged on one side of the encapsulation supporting seat (51), a rotating shaft of the encapsulation driving motor (52) is connected with the driving screw rod (53), and the driving screw rod (53) is positioned in the first screw rod cavity (513); a sliding groove (514) which is consistent with the direction of the driving screw rod (53) is arranged at the top of the encapsulation supporting seat (51); the sliding groove (514) is communicated with the first screw rod cavity (513); the bottom of the powder feeding bin (54) is provided with a screw rod sliding sleeve (541); the screw rod sliding sleeve (541) passes through the sliding groove (514) and is sleeved on the driving screw rod (53), and the screw rod sliding sleeve (541) moves back and forth along the sliding groove (514) in the first screw rod cavity (513).
6. A conductive connector encapsulation apparatus according to claim 1, wherein the second face encapsulation means (6) further comprises a powder compaction mechanism; the powder compaction mechanism comprises a compaction driving motor (61), a compaction driving screw rod (62) and a powder compaction plate (63); a second screw rod cavity (64) is also arranged on the encapsulation supporting seat (51) in the second surface encapsulation device (6); the compaction driving motor (61) is arranged on the encapsulation supporting seat (51); the rotating shaft of the compaction driving motor (61) is connected with the compaction driving screw rod (62), and the compaction driving screw rod (62) is positioned in the second screw rod cavity (64); the bottom of the powder compacting plate (63) is provided with a compacting screw sleeve (631); the compaction screw sleeve (631) is sleeved on the compaction driving screw (62), and the powder compaction plate (63) moves back and forth in the second screw cavity (64) through the compaction screw sleeve (631); the powder compaction plate (63) is provided with compaction bayonets (632) matched with the conductive connecting pieces; the bottom of the powder feeding bin (54) on the second surface packaging device (6) is also provided with an anti-collision notch (633) for preventing collision with the powder compacting plate (63).
7. A conductive connector encapsulation apparatus according to claim 1, further comprising a feed preheating device (7); the feeding preheating device (7) is arranged on the encapsulation positioning device (4), and the feeding preheating device (7) is positioned at the feeding end side of the first surface encapsulation device (5); the feeding preheating device (7) is provided with a plurality of preheating sockets (71) for inserting and placing conductive connectors, and a preheating block is arranged in the feeding preheating device (7).
8. A conductive connection encapsulation apparatus according to claim 1, further comprising means (8) to be cured; the device to be solidified (8) is arranged on the encapsulation positioning device (4), and the device to be solidified (8) is positioned at the discharge end side of the second surface encapsulation device (6); the device to be solidified (8) is provided with a plurality of sockets (81) to be solidified for inserting and placing the conductive connecting pieces.
9. A process for encapsulating electrically conductive connectors, characterized in that it comprises, in succession, the following steps, using an electrically conductive connector encapsulation device according to claim 2:
s1, clamping and preheating: clamping the upper end conductive part (91) of the conductive connecting piece (9), and transferring to a feeding preheating position for uniform heating;
s2, one surface of the middle insulating part is encapsulated: after preheating, transferring the conductive connecting piece (9) to an encapsulation position on one surface of an insulating part, avoiding the conductive part (92) at the lower end of the conductive connecting piece (9) from insulating powder, and enabling one surface of an intermediate insulating part (93) of the conductive connecting piece (9) to be in contact with the insulating powder at the encapsulation position on one surface of the insulating part; so that the insulating powder is encapsulated on one face of the intermediate insulating part (93); filling a layer of insulating powder (10) on the two conductive connecting piece encapsulation placing grooves (511) through a powder feeding bin (54) on the first face encapsulation device (5); transferring and conveying the two preheated conductive connecting pieces (9) to a first surface packaging device (5), and inserting a lower conductive part (92) of the conductive connecting pieces (9) into a conductive connecting piece jack (512), so that the bottom surface of an intermediate insulating part (93) of the conductive connecting pieces (9) is attached to insulating powder (10) on a conductive connecting piece packaging and placing groove (511), and downwards pressing the conductive connecting pieces (9) by clamping a lifting and positioning mechanism (32) in a positioning device (3), so that packaging is more compact, and the insulating powder is packaged on the bottom surface of the intermediate insulating part (93), thereby finishing packaging of the bottom surface of the intermediate insulating part (93);
s3, packaging the other surface of the middle insulating part: transferring one surface of the middle insulating part (93) to the other surface of the insulating part after the encapsulation is completed; the lower end conductive part (92) of the conductive connecting piece (9) is avoided from insulating powder, and the other surface of the middle insulating part (93) of the conductive connecting piece (9) is contacted with the insulating powder, so that the insulating powder is encapsulated on the other surface of the middle insulating part (93); transferring the conductive connecting pieces (9) with the bottom surfaces of the two middle insulating parts (93) encapsulated to the second surface encapsulating device (6), inserting the lower conductive parts (92) of the conductive connecting pieces (9) into the conductive connecting piece inserting holes (512) of the second surface encapsulating device (6), attaching the bottom surfaces of the middle insulating parts (93) of the conductive connecting pieces (9) to the conductive connecting piece encapsulating placing grooves (511), placing the conductive connecting pieces (9) without insulating powder (10) on the conductive connecting piece encapsulating placing grooves (511), and then moving the conductive connecting pieces to the top surfaces of the middle insulating parts (93) above the middle insulating parts (93) through the powder feeding bin (54) of the second surface encapsulating device (6);
s4, curing: transferring the encapsulated conductive connecting piece (9) to a curing part to wait for curing of the insulating powder;
s5, transferring a finished product: and (3) blanking and transferring the conductive connecting piece (9) of the cured finished product.
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| CN202111476387.4A CN114243417B (en) | 2021-12-06 | 2021-12-06 | Encapsulation equipment and encapsulation process for conductive connecting piece |
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| CN202111476387.4A CN114243417B (en) | 2021-12-06 | 2021-12-06 | Encapsulation equipment and encapsulation process for conductive connecting piece |
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| CN114243417B true CN114243417B (en) | 2024-04-05 |
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