CN114284420A - Light-emitting unit, method for making the same, and light-emitting assembly - Google Patents

Abstract

The invention relates to a light-emitting unit, a manufacturing method thereof and a light-emitting component, wherein lenses on miniature flip LED chips are manufactured through a mold, the consistency of the lenses can be ensured, the manufacturing process is simple, the efficiency is high, and the cost is low; the light conversion particles for converting the color of the light emitted by the miniature flip LED chip are arranged in each lens, so that the use of a QD film can be omitted, the uniformity of the light emission can be improved, the cost can be reduced, and the structure of the display module can be simplified; when the light-emitting unit is used for manufacturing light-emitting components such as a display module and the like, the light-emitting unit can be directly and fixedly arranged on the circuit board and electrically connected with the circuit board, and the manufacturing process is simple and efficient; the manufactured display module does not need a QD film any more, and has simple structure and low cost; and the lens consistency of each used light-emitting unit is good, so that the light color of the light-emitting component is more uniform, and the display quality is higher.

Description

Light-emitting unit, method for making the same, and light-emitting assembly

technical field

The present invention relates to the field of light-emitting, and in particular, to a light-emitting unit, a manufacturing method thereof, and a light-emitting component.

Background technique

Ultra HD video is the future development direction, Mini LED and Micro LED can be used as backlight or direct display. Mini LED as LCD (Liquid Crystal Display, liquid crystal display) backlight can be controlled regionally, which can greatly improve the peak brightness, contrast and image reproduction of the LCD screen, and can also reduce power consumption.

Figure 1 shows the process of the backlight made by the existing blue light Mini LED backlight module, including:

S101: Prepare the blue light Mini LED chip 12 and the circuit substrate 11, and apply solder paste or flux on the circuit substrate 11.

S102: Place the electrodes of the blue Mini LED chip 12 facing downwards on the circuit substrate 11 accurately on the solder paste and flux positions, and reflow in a nitrogen-protected reflow oven to fix the connection lines of the blue Mini LED chip 12.

S103 : Dispensing transparent glue 14 on top of the blue Mini LED chip 12 through a glue dispenser 13 .

S104: After the transparent glue 14 is formed, a blue light Mini LED backlight module with a transparent lens 15 is formed.

When the blue light Mini LED backlight module produced in the prior art is used to make a display screen, a QD (Quantum Dots, QD) film needs to be arranged on it to convert the blue light emitted by the blue light Mini LED chip 12 into color, and the QD film is expensive. At the same time, the blue light itself contains high-energy long-wave ultraviolet UVA and low-wavelength blue light spectrum, which is easy to damage the colloidal molecular chain of the transparent glue 14, and the transparent glue 14 is prone to yellowing, cracking or even detachment failure, thereby reducing product reliability. In addition, the transparent lens 15 formed by the dispensing machine 13 is limited by the dispensing process, resulting in poor shape and size consistency of the transparent lens 15 formed on each blue Mini LED chip 12, which causes the blue Mini LED backlight module to generate light. The color is uneven and difficult to repair.

Therefore, how to solve the poor consistency of the transparent lens on the existing blue light Mini LED backlight module, the high cost of the display screen made by the blue light Mini LED backlight module, the poor reliability, and the uneven light color, is an urgent need to solve. technical problem.

SUMMARY OF THE INVENTION

In view of the above-mentioned deficiencies of the related art, the purpose of the present invention is to provide a light-emitting unit, a manufacturing method thereof, and a light-emitting assembly, aiming at solving the problem of poor consistency of the transparent lenses on the existing blue-light Mini LED backlight module, and using the blue-light Mini LED backlight module to manufacture The display screen has the problems of high cost, poor reliability, and uneven light and color.

A method for manufacturing a light-emitting unit, comprising:

A mold and an LED chip assembly are provided; a plurality of mutually isolated lens mold cavities are formed on the mold; the LED chip assembly includes a chip carrier substrate, and a plurality of micro-flip chips detachably fixed on the carrier substrate LED chip, the side of the micro-flip-chip LED chip with electrodes is fixed on the carrier substrate, and the distribution of the micro-flip-chip LED chip on the carrier substrate is consistent with the plurality of lens mold cavities A one-to-one correspondence is distributed on the mold;

filling each of the lens mold cavities with a liquid colloid, wherein the colloid is mixed with light conversion particles;

The micro-flip-chip LED chips on the carrier substrate are aligned and pressed with the lens cavity on the mold, and each of the micro-flip-chip LED chips is respectively embedded in the corresponding lens cavity. in colloid;

curing the colloid, and forming the colloid after curing to form a lens covering the micro-flip-chip LED chip;

The mold and the carrier substrate are removed to obtain a plurality of light-emitting units, and one light-emitting unit includes one of the micro-flip-chip LED chips and the lens covering the micro-flip-chip LED chips.

In one embodiment, the filling of the liquid colloid into each of the lens mold cavities includes:

Filling each of the lens mold cavities with liquid colloid, and the filled colloid is flush with the lens mold cavity;

The aligning and pressing of the micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold includes:

The micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold are aligned and pressed until the side of the carrier substrate on which the micro-flip-chip LED chip is fixed and the The cavity mouth of the lens mold cavity is fitted;

Separate individual light emitting units are obtained after removal of the mold and the carrier substrate.

In one embodiment, the filling of the liquid colloid into each of the lens mold cavities includes:

Filling each of the lens mold cavities with liquid colloid, and the filled colloid overflows each of the lens mold cavities, and the colloid overflowing from the lens mold cavity forms a flat adhesive layer on each of the lens mold cavities;

The aligning and pressing of the micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold includes:

The micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold are aligned and pressed until the side of the carrier substrate on which the micro-flip-chip LED chip is fixed and the The flat adhesive layer is attached;

After the colloid is cured and formed, the colloid located between the lenses forms an extension layer connecting the lenses.

In one embodiment, the removing the mold and the carrier substrate includes:

Remove the mold first, and then remove the carrier substrate;

After removing the mold, before removing the carrier substrate, or after removing the carrier substrate, further comprising:

The extension layer is cut according to preset rules to obtain separate light-emitting unit groups, and one light-emitting unit group includes at least one light-emitting unit.

In an embodiment, the cutting the extension layer according to a preset rule includes at least one of the following:

cutting along the boundary between the extension layer and the lens adjacent to the extension layer;

Cutting is performed along the middle region of the extension layer between adjacent two rows and/or two columns of the lenses.

In one embodiment, the carrier substrate is a glass substrate, and the providing the LED chip assembly includes:

Provide glass substrate;

The side of the micro flip-chip LED chip with electrodes is bonded to the glass substrate through an adhesive film.

In one embodiment, the providing mold comprises:

A mold made of glass is provided, and the plurality of lens mold cavities are distributed in an array on the mold.

In one embodiment, the light conversion particles include phosphor powder and/or quantum dot particles, and before filling the liquid colloid into each of the lens mold cavities, the method further includes preparing the colloid;

The preparing the colloid includes: mixing phosphors and/or quantum dot particles into the colloid.

Based on the same inventive concept, a light-emitting unit is also provided, and the light-emitting unit is manufactured by the above-mentioned manufacturing method of the light-emitting unit.

Based on the same inventive concept, a manufacturing method of a light-emitting component is also provided, including:

A circuit board is provided, and the circuit board is provided with pads corresponding to the electrodes of the miniature flip-chip LED chips;

The light-emitting unit manufactured by the above-mentioned method for manufacturing the light-emitting unit is arranged on the circuit board, and the electrodes of the micro-flip-chip LED chip of the light-emitting unit are electrically connected to the pads correspondingly.

In the light-emitting unit, its manufacturing method, and the light-emitting assembly provided by the present invention, a plurality of mutually isolated lens mold cavities are formed on a mold, and the electrode side of the plurality of miniature flip-chip LED chips is fixed on a carrier substrate , and the distribution of micro-flip-chip LED chips on the carrier substrate corresponds to the distribution of multiple lens cavities on the mold; first, the lens cavities are filled with liquid colloid mixed with light conversion particles, and then the carrier The micro-flip-chip LED chip on the substrate is aligned and pressed with the lens cavity on the mold, and after the colloid is cured and formed, a lens covering the micro-flip-chip LED chip is formed, which at least has the following advantages:

The lenses on each micro-flip-chip LED chip are made by a mold, so the consistency of the shape and size of each lens can be ensured, and the production process is simple, mature and reliable, and the production efficiency is high and low cost;

Each lens has light conversion particles that convert the color of the light emitted by the micro flip-chip LED chip, so the use of QD film can be omitted when it is applied to the display module, which can not only improve the uniformity of the light, but also reduce the Cost and simplify the structure of the display module; at the same time, when the micro flip-chip LED chip adopts blue LED chip, the blue light emitted by it can be converted into other colors by the light conversion particles, avoiding the formation of lenses between the long-wave ultraviolet UVA and low-wavelength blue light spectrum of blue light The molecular chain of the colloid is destroyed, so as to prevent the colloid forming the lens from yellowing, cracking, or even detachment failure, thereby improving product reliability;

When using the light-emitting unit to manufacture light-emitting components such as display modules, the light-emitting unit can be directly fixed on the circuit board and electrically connected to the circuit board, and the manufacturing process is simple and efficient; the obtained display module no longer needs to use QD film , the structure is simple and the cost is low; and the lenses of each light-emitting unit used have good consistency, so the light color of the light-emitting component is more uniform and the display quality is higher.

Description of drawings

1 is a schematic diagram of the fabrication of an existing backlight module;

FIG. 2 is a schematic flowchart of a method for fabricating a light-emitting unit according to an embodiment of the present invention;

3 is a schematic diagram of a manufacturing process of a light-emitting unit provided by an embodiment of the present invention;

FIG. 4 is a schematic diagram of a miniature flip-chip LED chip provided by an embodiment of the present invention;

FIG. 5 is a schematic diagram of the colloid being flush with the lens cavity provided by the embodiment of the present invention;

FIG. 6 is a schematic structural diagram 1 of a light-emitting unit provided by an embodiment of the present invention;

FIG. 7 is a schematic diagram of light emitting from a light-emitting unit according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a manufacturing process of another light-emitting unit according to an embodiment of the present invention;

9 is a schematic diagram of a colloid overflowing a lens mold cavity provided by an embodiment of the present invention;

10 is a schematic diagram one of cutting provided by an embodiment of the present invention;

11 is a schematic diagram of the light-emitting unit obtained after cutting in FIG. 10;

12 is a schematic diagram 2 of cutting provided by an embodiment of the present invention;

Fig. 13 is the schematic diagram of the light-emitting unit obtained after cutting in Fig. 12;

14 is a schematic diagram three of cutting provided by an embodiment of the present invention;

FIG. 15 is a schematic diagram of the light-emitting unit group obtained after cutting in FIG. 14;

16 is a schematic diagram of the distribution of light-emitting units in a light-emitting unit group provided by an embodiment of the present invention;

17 is a schematic diagram 4 of cutting provided by an embodiment of the present invention;

FIG. 18 is a schematic diagram of the light-emitting unit group obtained after cutting in FIG. 17;

19 is a schematic diagram of the distribution of light-emitting units in another light-emitting unit group provided by an embodiment of the present invention;

FIG. 20 is a schematic flowchart of a method for manufacturing a light-emitting component according to an embodiment of the present invention;

FIG. 21 is a schematic diagram 1 of a manufacturing process of a light-emitting component according to an embodiment of the present invention;

22 is a second schematic diagram of a manufacturing process of a light-emitting component provided by an embodiment of the present invention;

FIG. 23 is a schematic diagram 3 of a manufacturing process of a light-emitting component according to an embodiment of the present invention.

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

In the related art, the transparent lenses on the blue light Mini LED backlight module have poor consistency, and the display screen produced by the blue light Mini LED backlight module has high cost, poor reliability, and uneven light color.

Based on this, the present invention hopes to provide a solution that can solve the above technical problems, the details of which will be described in subsequent embodiments.

This embodiment provides a light-emitting unit and a manufacturing method thereof. In order to facilitate understanding, the present embodiment first takes the manufacturing method of the light-emitting unit as an example for description. Please refer to FIG. 2 , which includes but is not limited to:

S201: Provide mold and LED chip assembly.

The mold provided in this embodiment is formed with a plurality of mutually isolated lens mold cavities. In one example, the mold has a top surface and a bottom surface opposite to the top surface, an end of the mold close to the top surface is an upper end, and an end close to the bottom surface of the mold is a lower end. A plurality of lens mold cavities are formed on the upper end of the mold, the cavity bottom of each lens mold cavity is close to the bottom surface of the mold, and the cavity top of each lens mold cavity, that is, the opening of each lens mold cavity is located on the top surface of the mold. In this embodiment, the shape and size of the lens mold cavity can be specifically set according to the shape and size of the lens to be formed. The type of the lens to be formed in this embodiment can be flexibly set according to requirements, for example, it can be, but not limited to, a refractive lens, and can also be a dome-type lens. In this embodiment, the function of the lens can be used to increase the light exit angle, that is, in terms of function, the lens in this embodiment can adopt various wide-angle lenses.

It should be understood that the mold in this embodiment can be made of various materials. In one example, a material that facilitates colloid separation may be used. For example, in an application example, providing a mold may include a mold made of glass (eg, borosilicate glass), which has low cost, is easy to manufacture, and is easy to integrate with Colloid separation, for example, the colloid will be separated from the glass mold during the heat curing process, so that the use of a release agent can be omitted during the demolding process, which can not only improve the production efficiency, but also reduce the cost. Of course, in other application examples, molds made of other materials can also be used, and a release agent can be used as required. The release agent in this application example can be, but not limited to, organic oil, liquid paraffin, Vaseline, 201 ointment , No. 4 high temperature grease, etc. It should be understood that, in some application scenarios, when a glass mold is used, a mold release agent may also be used to further facilitate subsequent mold release operations.

In this example, the distribution of the multiple lens mold cavities on the mold can also be flexibly set. For example, in some application examples, the multiple lens mold cavities can be distributed in an array, or distributed in other ways, such as row and column colloid distribution. , or a single-row/single-column distribution; of course, it can also be distributed in an irregular shape, such as random distribution. It can be flexibly set according to application requirements.

The LED chip assembly provided in this embodiment includes a chip carrier substrate, and a plurality of miniature flip-chip LED chips detachably fixed on the carrier substrate. In this embodiment, the side of the micro-flip-chip LED chip with electrodes (that is, the bottom surface of the micro-flip-chip LED chip) is fixed on the carrier substrate, and the distribution of the micro-flip-chip LED chips on the carrier substrate is related to the plurality of lenses. The cavities are distributed one-to-one on the mold. It should be understood that the micro-flip-chip LED chip in this embodiment may include, but is not limited to, at least one of a flip-chip Mini LED chip and a flip-chip Micro LED chip. In this embodiment, the light emission color of the micro-flip-chip LED chip can be flexibly set according to application requirements, for example, a blue-light micro-flip-chip LED chip can be used, and a green-light or red-light flip-chip LED chip can also be used.

The chip carrier substrate in this embodiment has at least the following functions. On the one hand, the carrier substrate can be used to carry multiple miniature flip-chip LED chips. On the other hand, in the subsequent mold clamping process of the carrier substrate, the weight of the carrier substrate itself can be used to ensure The flatness after mold clamping (that is, the carrier substrate can be used as the upper mold, and the mold is used as the lower mold) can improve the consistency and yield of the prepared lenses covering each micro-flip-chip LED chip. It should be understood that, in an application example of this embodiment, a micro-flip-chip LED chip on the carrier substrate can be set to correspond to a lens cavity on the mold, that is, the micro-flip-chip LED chip and the lens mold can be arranged. The cavities correspond one-to-one. Of course, in other application examples, two or three or more micro-flip-chip LED chips on the carrier substrate can also be set to correspond to one lens mold cavity according to requirements, that is, one lens mold cavity can be correspondingly set with multiple chips Miniature flip-chip LED chips to meet the diverse needs of different application scenarios.

In this embodiment, the material of the carrier substrate can be the same as that of the mold. For example, in an application example, providing an LED chip assembly includes: providing a glass substrate; bonding the side of the micro-flip-chip LED chip with electrodes by bonding The film is bonded to the glass substrate. Of course, the carrier substrate in this embodiment is not limited to a glass substrate, and an aluminum substrate, an iron substrate, or a ceramic substrate with a certain weight can also be used.

In this embodiment, the fixing manner in which the micro flip-chip LED chip is detachably fixed on the carrier substrate can be flexibly set. For example, an adhesive adhesive layer (for example, but not limited to pyrolysis adhesive) can be provided on one side of the carrier substrate, and the micro-flip-chip LED chip can be bonded by the adhesive adhesive layer. For another example, in some examples, an adhesive film layer, such as a blue film, may be provided on one side of the carrier substrate, and the micro flip-chip LED chip is bonded to the carrier substrate through the adhesive film layer.

S202: Filling each lens mold cavity with a liquid colloid, and the colloid is mixed with light conversion particles.

In this embodiment, the light conversion particles mixed in the colloid may include, but are not limited to, at least one of phosphor powder and quantum dot particles. For example, in some application examples, phosphors can be mixed in the colloid, and the type of the mixed phosphors can be based on the light output color of the micro-flip-chip LED chip used, and the desired target light color (that is, converted by phosphor powder). The resulting light color) can be set flexibly. For example, in some application scenarios, when the light output color of the micro flip-chip LED chip is blue and the target light color is white light, the set phosphors may include various phosphors that convert blue light into white light, such as YAG yellow phosphors. In this application example, phosphor powder is used, which has low cost and good versatility and can meet the requirements of luminous quality. In another application example, quantum dot particles can be mixed in the colloid, and the type of the mixed quantum dot particles can also be flexibly set according to the light output color of the micro flip-chip LED chip and the desired target light color. Of course, in another application example, phosphor powder and quantum dot particles can be mixed in the colloid, and the type of the mixed phosphor powder and quantum dot particles can also be based on the light output color of the micro-flip-chip LED chip used and the desired The color of the target light can be set flexibly, and will not be repeated here. Of course, it should be understood that in some application scenarios that do not need to convert the light output color of the micro flip-chip LED chip, the colloid in this embodiment may not be provided with light conversion particles, that is, the colloid may directly use transparent adhesive.

The material of the colloid in this embodiment can be set flexibly, for example, a thermosetting colloid or a thermoplastic colloid can be used. In some specific application scenarios, the colloid may be, but not limited to, resin glue or epoxy glue, etc., which will not be repeated here.

In this embodiment, the method of filling liquid colloid into each lens mold cavity can be flexibly adopted, for example, but not limited to, glue dispensing, silk screen printing and other methods can be adopted flexibly. And in this embodiment, colloid is first injected into the lens cavity on each mold, and the colloid is directly injected into each lens cavity through the cavity of each lens cavity. The structure is simple, the cost is low, the injection efficiency is high, and the controllability is good.

S203: Align and press the micro-flip-chip LED chips on the carrier substrate with the lens mold cavity on the mold, and each micro-flip-chip LED chip is respectively embedded in the colloid in the corresponding lens mold cavity.

In some application examples of this embodiment, the cavity of the lens mold cavity can be directed upward, and the micro flip-chip LED chip on the carrier substrate can be directly aligned with the lens mold cavity on the mold, and then the carrier substrate can be placed on the mold. , and can directly utilize the weight of the carrier substrate to realize pressing, and at the same time, the flatness of the mold clamping can be ensured, thereby ensuring the consistency and yield of the subsequently produced lenses. In this application example, it is no longer necessary to use additional pressure equipment to press the carrier substrate and the mold, which can further simplify the manufacturing process, reduce the manufacturing cost and improve the manufacturing efficiency.

S204 : curing the colloid, and forming a lens including a lens covering the micro flip-chip LED chip after the colloid is cured and formed.

In this embodiment, the manner of curing the colloid can be set according to the specific colloid type used. For example, when the colloid is a thermosetting colloid or a thermoplastic colloid, the colloid can be cured by, but not limited to, heating.

S205 : removing the mold and the carrier substrate to obtain a plurality of light-emitting units, and one light-emitting unit includes a micro-flip-chip LED chip and a lens covering the micro-flip-chip LED chip.

In this embodiment, when removing the mold and the carrier substrate, the mold may be removed first, and then the carrier substrate may be removed, or the carrier substrate may be removed first, and then the mold may be removed, or both removal steps may be performed simultaneously. The light-emitting unit obtained in this embodiment includes a micro-flip-chip LED chip and a lens covering the micro-flip-chip LED chip. The lens on the micro-flip-chip LED chip is made by a mold, so the shape and size of each lens can be guaranteed to be consistent In addition, the production process is simple, mature and reliable, and the production efficiency is high and the cost is low; each lens has light conversion particles that convert the color of the light emitted by the micro flip-chip LED chip, so it can be applied to display modules. Omitting the use of the QD film can not only improve the uniformity of light output, but also reduce the cost and simplify the structure of the display module; at the same time, when the micro flip-chip LED chip adopts a blue light LED chip, the blue light emitted by it can be converted by light conversion particles into For other colors, the long-wave ultraviolet UVA and low-wavelength blue light spectrum of blue light will not damage the molecular chain of the colloid forming the lens, so as to prevent the colloid forming the lens from yellowing, cracking, or even detachment failure, thereby improving product reliability.

For ease of understanding, this embodiment is described below with two exemplary light-emitting unit fabrication methods.

Example one:

In this example, filling the liquid colloid into each lens mold cavity in the above S202 may include: filling each lens mold cavity with liquid colloid, and the filled colloid is flush with the lens mold cavity. The above-mentioned S203 aligning and pressing the micro-flip-chip LED chip on the carrier substrate with the lens cavity on the mold includes: aligning and pressing the micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold until the carrier is mounted. The surface of the substrate on which the micro flip-chip LED chip is fixed is attached to the cavity of the lens mold cavity. Since the liquid colloid filled in each lens cavity in this example is flush with the lens cavity, after the colloid is cured and the mold and the carrier substrate are removed, a separate light-emitting unit can be obtained directly, without the need to perform a cutting step. Therefore, the manufacturing process can be further simplified, the manufacturing efficiency can be improved, and the manufacturing cost can be reduced.

For ease of understanding, this embodiment is described below with reference to a specific manufacturing example. The production process is shown in Figure 3, which includes but is not limited to:

S301: Provide mold 2. The mold 2 in this example is made of Peng Si glass. The mold 2 is provided with a plurality of lens mold cavities 21 . The lens cavity 21 in this example is a wide-angle lens cavity. The lens mold cavities 21 in this example may be distributed in an array on the mold.

S302: Provide LED chip components. The LED chip assembly in this example includes a carrier substrate 3 and a flip-chip Mini LED chip 4 detachably fixed on the carrier substrate 3 . The flip-chip Mini LED chip 4 is shown in FIG. 4 , and includes a chip body 41 and electrodes 42 . The electrodes 42 are disposed on the bottom surface of the chip body 41 , and the top surface of the chip body 41 serves as the main light-emitting surface of the flip-chip Mini LED chip 4 . In some examples, the flip-chip Mini LED chip 4 can emit light only from the top surface, or can emit light from the top surface and at least one side surface. In this example, the Distributed Bragg Reflection (DBR) does not need to be set on the light-emitting surface of the flip-chip Mini LED chip 4, thereby further reducing the cost and improving the light-emitting efficiency of the flip-chip Mini LED chip 4. The test can be improved by at least 15%, so the brightness can be improved and the cost can be greatly reduced. Of course, in some application examples, a flip-chip Mini LED chip 4 with a DBR layer may also be used. It should be understood that the flip-chip Mini LED chip 4 in this example can also be replaced with a Micro LED chip. For ease of understanding, this example uses the flip-chip Mini LED chip 4 as a blue LED chip for description.

S303 : inject the liquid colloid 50 mixed with light conversion particles into each lens cavity 21 .

In this example, the colloid may be prepared first, including mixing phosphors and/or quantum dot particles into the colloid, and then filling each lens cavity 21 with the liquid colloid 50 through but not limited to a molding machine or a glue dispenser. In this example, the liquid colloid 50 filled in the lens mold cavity 21 is flush with the lens mold cavity 21 (ie, flush with the top surface of the mold 2 ). For example, as shown in FIG. 5 , the maximum depth of the lens mold cavity 21 is H1 , and the maximum height of the filled colloid 50 is H1 . Of course, it can also be slightly lower than the top surface of the mold 2 . In this example, in order to ensure that the filled liquid colloid 50 is flush with the lens mold cavity 21 , the excess colloid that may overflow the lens mold cavity 21 can be removed by, but not limited to, a scraper. For the convenience of understanding, the light conversion particles are described as yellow phosphors 52 in this example.

S304: Align and press the flip-chip Mini LED chip 4 on the carrier substrate 3 with the lens cavity 21 on the mold 2 until the side of the carrier substrate 3 on which the flip-chip Mini LED chip 4 is fixed and the lens mold cavity 21 Cavity fit (ie fit with the top surface of mold 2).

S305 : the carrier substrate 3 and the mold 2 are put into the oven together for heating, and the colloid 50 is cured to form the lens 53 . Of course, it should be understood that this example is not limited to heating by an oven.

S306 : Remove the mold 2 to obtain a plurality of detachable light-emitting units fixed on the carrier substrate 3 .

S307: Remove the carrier substrate 3 to obtain a plurality of light-emitting units separated from each other as shown in FIG. 6 . A light-emitting unit includes a flip-chip Mini LED chip 4 and a lens 51 covering the flip-chip Mini LED chip 4 , and the lens 51 includes yellow phosphor 52 . After the light emitted by the flip-chip Mini LED chip 4 enters the lens 51 , it is converted by the yellow phosphor 52 inside the lens 51 to emit white light.

In this example, the liquid colloid 50 filled in each lens cavity 21 is flush with the lens cavity 21, so after the colloid 50 is cured and the mold 2 and the carrier substrate 3 are removed (see step S307), the separation can be directly obtained The single light-emitting unit is not required to perform a cutting step, so the manufacturing process can be further simplified, the manufacturing efficiency can be improved, and the manufacturing cost can be reduced. The light-emitting schematic diagram of a single light-emitting unit produced in this example is shown in FIG. 7 . Compared with the light-emitting angle of the LED chip on the backlight module shown in FIG. 1 (less than 140°), the light-emitting angle of the light-emitting unit in this example can be It can reach more than 165°, so when using this light-emitting unit to make a display module, the distance between chips can be increased, the white light emitted is more uniform, and ultra-high-definition LCD TVs (displays, etc.) no longer need quantum films, which can also greatly reduce costs. .

Example two:

In this example, filling the liquid colloid into each lens mold cavity in the above S202 may include: filling each lens mold cavity with liquid colloid, and the filled colloid overflows each lens mold cavity, and the colloid overflowing from the lens mold cavity is A flat glue layer is formed on each lens cavity. The above-mentioned S203 aligning and pressing the micro-flip-chip LED chip on the carrier substrate with the lens cavity on the mold includes: aligning and pressing the micro-flip-chip LED chip on the carrier substrate and the lens cavity on the mold until the carrier is mounted. The side with the micro-flip-chip LED chip fixed on the substrate is attached to the flat adhesive layer; since the liquid colloid filled in each lens mold cavity in this example is connected into one by the flat adhesive layer formed on each lens mold cavity, so After the colloid is cured and formed, the colloid (that is, the flat adhesive layer) between the lenses is formed as an extension layer connecting the lenses, that is, a plurality of light-emitting units connected together by the extension layers can be obtained. In this example, multiple light-emitting units that are connected as a whole can be flexibly cut according to requirements. × 1, 3 × 2, 3 × 3, 4 × 4, etc. are used as units to obtain a light-emitting unit group. Of course, in some examples, the cutting step may not be performed, and a preset number of light-emitting units that are connected as a whole can be directly obtained. It can be seen that the light-emitting unit manufacturing method provided in this example can directly produce a plurality of light-emitting units that are connected as a whole, and can also selectively cut light-emitting unit groups that meet different needs according to requirements. When the light-emitting component is fabricated on the circuit board, the coverage area of the circuit board can also be increased, thereby improving its protection performance and further improving its reliability.

In some application scenarios in this example, when the cutting step needs to be performed, the mold can be removed first, and then the carrier substrate can be removed; after the mold is removed, before the carrier substrate is removed, or after the carrier substrate is removed, the lens is cut according to preset rules. The extension layer between the two is cut to obtain separate light-emitting unit groups, and one light-emitting unit group includes at least one light-emitting unit. In this example, using preset rules to cut the extension layer may include, but is not limited to, at least one of the following:

cutting along the boundary between the extension layer and the lens adjacent to the extension layer;

The cuts are made along the middle region of the extended layer between adjacent two rows and/or two columns of lenses.

For ease of understanding, this embodiment is described below with reference to a specific manufacturing example. The production process is shown in Figure 8, which includes but is not limited to:

S401: Provide mold 2. The mold 2 in this example is also made of Peng Si glass. The mold 2 is provided with a plurality of lens mold cavities 21, which will not be repeated here.

S402: Provide LED chip components. The LED chip assembly in this example includes a carrier substrate 3 and a flip-chip Mini LED chip 4 detachably fixed on the carrier substrate 3 . The flip-chip Mini LED chip 4 is shown in FIG. 4 and will not be repeated here.

S403 : inject the liquid colloid 50 mixed with light conversion particles into each lens cavity 21 .

In this example, the liquid colloid 50 filled in the lens mold cavity 21 is higher than the lens mold cavity 21 (ie, higher than the top surface of the mold 2 ), that is, the filled colloid 50 overflows each lens mold cavity 21 and overflows the lens mold cavity The glue 50 of 21 forms a flat glue layer 501 on and between the lens mold cavities 21 . For example, referring to FIG. 9 , as shown in FIG. 5 , the maximum depth of the lens cavity 21 is H1 , the maximum height of the filled glue 50 is H2 , and the thickness of the flat glue layer 501 is the difference between H2 and H1 . In this example, in order to ensure the flatness of the filled flat adhesive layer 501 , the flattening adhesive layer 501 may be flattened by, but not limited to, a scraper. For ease of understanding, this example is also described with the light conversion particles as the yellow phosphor 52 . It should be understood that the phosphors or light conversion particles in this example can be flexibly set according to the color of the target light and the light emission color of the Mini LED chip used, and details are not repeated here.

S404: Align and press the flip-chip Mini LED chip 4 on the carrier substrate 3 with the lens cavity 21 on the mold 2 until the side of the carrier substrate 3 on which the flip-chip Mini LED chip 4 is fixed is attached to the flat adhesive layer 501 combine.

S405 : the carrier substrate 3 and the mold 2 are put into an oven together for heating, and the colloid 50 is cured to form the lenses 53 and the extension layers 531 connecting the lenses 53 . Of course, it should be understood that this example is not limited to heating by an oven.

S406 : Remove the mold 2 to obtain a plurality of light-emitting units detachably fixed on the carrier substrate 3 , and the plurality of light-emitting units are connected as a whole through the extension layer 531 .

In this example, when flexible cutting is performed on a plurality of light-emitting units connected as a whole to obtain a desired light-emitting unit group according to requirements, flexible cutting may also be performed as shown above. For ease of understanding, this embodiment is described below with several cutting examples.

Cutting example 1: Referring to FIG. 9 and FIG. 10 , take a single light-emitting unit (of course, multiple light-emitting units can be used as an example) as a unit, along the boundary area between the extension layer 531 and the lens 53 adjacent to the extension layer 531 (The position shown by the A0 cutting line in FIG. 10 ) is cut, and the light-emitting unit structure obtained after cutting is shown in FIG. 11 . After cutting, the extension layer 531 between the adjacent lenses 53 is removed, and the cutting surface 532 is formed to stand upright Compared with the light-emitting unit shown in FIG. 6 , the area of the cut surface 532 can further enrich the light-emitting angle of the lens 53 .

Cutting example 2: Referring to FIG. 12 and FIG. 13 , taking a single light-emitting unit as a unit, cut along the middle area of the extension layer 531 between two adjacent lenses 53 (the position shown by the cutting line A1 in FIG. 12 ) 13. The structure of the light-emitting unit obtained after cutting is shown in FIG. 13. After cutting, the extension layer 531 between adjacent lenses 53 is retained. Compared with the light-emitting unit shown in FIG. 6, the retained extension layer 531 constitutes the epitaxial part of the lens 53. , which can not only further enrich the wide angle of the lens 53 , but also increase the bonding area between the light-emitting unit and the circuit board, and improve the bonding strength and density between the two.

Cutting example 3: Referring to Fig. 14 to Fig. 16 , in the unit of 2×2 light-emitting units, along the middle region of the extension layer 531 of the lens 53 between the corresponding adjacent two rows and two columns (Fig. 14 and The position shown by the cutting line A2 in FIG. 16) is cut, and the light-emitting unit structure obtained after cutting is shown in FIG. 15. After cutting, the extension layer 531 between the adjacent lenses 53 is retained. Compared with the light-emitting unit shown in FIG. 6 The light-emitting unit group obtained after cutting includes 4 light-emitting units distributed in an array, so the transfer efficiency of the light-emitting unit can be doubled, the manufacturing cost of the subsequent light-emitting components can be reduced, and the distance between the light-emitting unit group and the circuit board can be further improved. The coverage area can further improve the bonding strength and density between the two.

Cutting Example 4: Referring to Figures 17 to 19, in units of 3*3 light-emitting units, along the middle area of the extended layer 531 of the lens 53 between the corresponding adjacent two rows and two columns (Figures 17 and 19) The position shown by the cutting line A3 in FIG. 19 ) is cut, and the light-emitting unit structure obtained after cutting is shown in FIG. 18 . After cutting, the extension layer 531 between the adjacent lenses 53 is also preserved. Compared with the one shown in FIG. 6 Light-emitting unit, the light-emitting unit group obtained after cutting includes 9 light-emitting units distributed in an array, which can further double the transfer efficiency of the light-emitting unit, reduce the production cost of subsequent light-emitting components, and improve the relationship between the two light-emitting unit groups and the circuit board. bond strength and density.

It can be seen from the above cutting examples that in this embodiment, the light emitting unit can be flexibly cut according to specific application requirements, and is not limited to the several cutting methods in the above examples, which will not be repeated here.

In this embodiment, after the light-emitting unit is produced, the electrical properties of a single light-emitting unit or a light-emitting unit group can be measured by a spectrometer, and the voltage, wavelength (color coordinate) and luminous flux can be divided into BIN and packaged for post-processing. patch. In this embodiment, the lenses on each micro-flip-chip LED chip are made by a mold, so the shape and size of each lens can be guaranteed to be consistent, and the manufacturing process is simple, mature and reliable, and the manufacturing efficiency is high. It has light conversion particles that convert the color of the light emitted by the micro flip-chip LED chip, so when it is applied to the display module, the use of QD film can be omitted, which can not only improve the uniformity of light output, but also reduce costs and simplify The structure of the display module; at the same time, when the micro flip-chip LED chip adopts a blue LED chip, the blue light emitted by it can be converted into other colors by the light conversion particles, so as to avoid the long-wave ultraviolet UVA and low-wave blue light spectrum of the blue light from affecting the colloid forming the lens. The molecular chain is damaged, so as to prevent the colloid forming the lens from yellowing, cracking or even detachment failure, thereby improving product reliability. In particular, the reliability of the light-emitting components produced by using the light-emitting unit, including but not limited to display modules, can be improved.

For ease of understanding, this embodiment is described below by using the light-emitting unit shown in the above examples to manufacture a light-emitting component as an example, as shown in FIG. 20 , which includes but is not limited to:

S2001: Provide a circuit board, and the circuit board is provided with pads corresponding to the electrodes of the miniature flip-chip LED chip.

When the light-emitting component in this embodiment is a display component, the circuit board can be various display backplanes; when the light-emitting component is a lighting component, the circuit board can be various lighting circuit boards.

In this embodiment, the circuit board can be, but not limited to, a conductive metal substrate, and the materials of the two can be the same or different. For example, in one example, the circuit board may be, but not limited to, at least one of an aluminum substrate, a copper substrate, a silver substrate, or a conductive alloy substrate. It should be understood that, in this embodiment, at least one of the circuit boards can also be replaced with a non-metal substrate and a corresponding conductive layer correspondingly disposed thereon. For example, in some examples, equivalent replacements may be made with a substrate body having an insulating body and a composite substrate having corresponding wire traces within the substrate body. Wherein, the substrate body can be a rigid material, such as but not limited to phenolic paper laminates, epoxy paper laminates, polyester glass felt laminates, epoxy glass cloth laminates, BT resin boards, and can also be used Glass plate; the main body of the substrate can also be a flexible material, such as but not limited to polyester film, polyimide film, and fluorinated ethylene propylene film. In this embodiment, the circuit board adopts a single-layer substrate, or a composite-layer substrate composed of at least two layers of sub-substrates.

S2002: Disposing the light-emitting unit on the circuit board, and electrically connecting the electrodes of the micro-flip-chip LED chip of the light-emitting unit to the pads correspondingly.

In this embodiment, the electrical connection between the electrodes of the miniature flip-chip LED chip and the pads may be connected by, but not limited to, solder or conductive glue. In this example, when soldering is performed by solder, solder paste may be used, and the solder paste may be, but not limited to, lead-containing solder alloys, such as tin-lead (Sn-Pb) alloys, tin-lead-bismuth (Sn-Pb-Bi) ) alloys or tin-lead-silver (Sn-Pb-Ag) alloys, etc.; lead-free solder alloys can also be used, such as tin-silver (Sn-Ag) alloys, tin-bismuth (Sn-Bi) alloys , tin-zinc (Sn-Zn) alloy, tin-antimony (Sn-Sb), tin-silver-copper (Sn-Ag-Cu) alloy or tin-bismuth-silver (Sn-Bi-Ag) alloy Wait. In this example, when the conductive adhesive is used for bonding, the conductive adhesive used has the properties of conducting electricity and bonding. When the conductive adhesive is classified according to the conductive filler, the conductive adhesive used may include, but is not limited to, conductive silver adhesive, copper powder conductive adhesive, nickel-carbon conductive adhesive, silver-copper conductive adhesive, and the like.

For ease of understanding, the light-emitting assembly is used as the backlight assembly, and several manufacturing examples of the backlight assembly are used for description.

Production example 1: See Figure 21, including:

S2101: Prepare the white light emitting unit 71 (the light emitting unit shown in FIG. 6 is used in this example, and the light emitting unit emits white light as an example for description) and the circuit board 6. The circuit board 6 in this example includes a substrate and is printed on the substrate of solder paste.

S2102: The white light emitting unit 71 is accurately mounted on the substrate printed with solder paste, and the backlight module is formed after reflow soldering. The backlight module produced in this example has at least the following advantages:

The large viewing angle white light emitting unit is adopted, which is convenient for maintenance. There is no need to use QD film in the backlight module, which reduces the cost;

Since the white light emitting unit splits the light and then sticks it on the substrate, the light color is uniform;

The white light emitting unit contains less UVA and blue light components, and the lens has a long life and better reliability;

By using white light emitting units with a large viewing angle, the spacing between the light emitting units can be made larger, the use of the number of light emitting units can be reduced, and the cost can be further reduced.

Production example 2: See Figure 22, including:

S2201: Prepare the white light-emitting unit 72 (the light-emitting unit shown in FIG. 13 is used in this example, and the light-emitting unit emits white light as an example for description) and the circuit board 6. The circuit board 6 in this example includes a substrate and is printed on the substrate of solder paste.

S2202: The white light emitting unit 72 is accurately mounted on the substrate printed with solder paste, and the backlight module is formed after reflow soldering. In addition to the above advantages, the backlight module produced in this example also has at least a richer light-emitting angle of the light-emitting unit, which can further improve the display quality; and the bonding area between the light-emitting unit and the substrate is larger, which can further improve the relationship between the two. The bonding strength and sealing between them can improve their overall strength and protective performance.

Production Example 3: See Figure 23, including:

S2301: Prepare the white light emitting unit 73 (the light emitting unit shown in FIG. 18 is used in this example, and the light emitting unit emits white light as an example for description) and the circuit board 6. The circuit board 6 in this example includes a substrate and is printed on the substrate of solder paste.

S2302: The white light emitting unit 73 is accurately mounted on the substrate printed with solder paste, and the backlight module is formed after reflow soldering. In addition to the above advantages, the backlight module fabricated in this example also has at least a higher transfer efficiency of the light-emitting unit, for example, it can be nine times as high as in the above-mentioned fabrication examples 1 and 2, which can further reduce the fabrication cost; and can further improve the light-emitting unit and the substrate The bonding area between the two can further improve the bonding strength and sealing between the two, and improve their overall strength and protective performance.

It should be understood that the light-emitting assembly provided in this embodiment can be widely used in electronic devices with display screens, such as mobile phones, notebook computers, tablet computers, smart wearables, eye protection products, vehicle terminals, advertising display terminals, etc. It can be widely used in various lighting equipment such as indoor lighting and outdoor lighting, and will not be repeated here.

It should be understood that the application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above descriptions, and all these improvements and transformations should belong to the protection scope of the appended claims of the present invention.

Claims (10)

1. A method of fabricating a light emitting cell, comprising:

providing a mold and an LED chip assembly; a plurality of lens cavities which are mutually isolated are formed on the mould; the LED chip assembly comprises a chip bearing substrate and a plurality of miniature flip LED chips which are detachably and fixedly arranged on the bearing substrate, wherein one side of each miniature flip LED chip provided with an electrode is fixedly arranged on the bearing substrate, and the distribution of the miniature flip LED chips on the bearing substrate is in one-to-one correspondence with the distribution of the lens die cavities on the die;

filling liquid colloid into each lens mold cavity, wherein light conversion particles are mixed in the colloid;

aligning and pressing the miniature flip LED chips on the bearing substrate and the lens mold cavity on the mold, wherein each miniature flip LED chip is respectively embedded into the colloid in the corresponding lens mold cavity;

curing the colloid, and forming a lens covered on the miniature flip LED chip after the colloid is cured and molded;

and removing the mold and the bearing substrate to obtain a plurality of light-emitting units, wherein each light-emitting unit comprises one miniature flip LED chip and the lens covered on the miniature flip LED chip.

2. The method of claim 1, wherein filling each lens cavity with a liquid gel comprises:

filling liquid colloid into each lens mold cavity, wherein the filled colloid is flush with the lens mold cavity;

the contraposition and pressing of the miniature flip-chip LED chip on the bearing substrate and the lens mold cavity on the mold comprises the following steps:

aligning and pressing the miniature flip LED chip on the bearing substrate and the lens mold cavity on the mold until one surface of the bearing substrate, on which the miniature flip LED chip is fixedly arranged, is attached to the cavity opening of the lens mold cavity;

and obtaining separated single light-emitting units after removing the mould and the bearing substrate.

3. The method of claim 1, wherein filling each lens cavity with a liquid gel comprises:

filling liquid colloid into each lens cavity, wherein the filled colloid overflows each lens cavity, and the colloid overflowing the lens cavities forms a flat adhesive layer on each lens cavity;

the contraposition and pressing of the miniature flip-chip LED chip on the bearing substrate and the lens mold cavity on the mold comprises the following steps:

aligning and pressing the miniature flip LED chip on the bearing substrate and the lens mold cavity on the mold until one surface of the bearing substrate, on which the miniature flip LED chip is fixedly arranged, is attached to the flat adhesive layer;

after the colloid is solidified and molded, the colloid positioned between the lenses forms an extension layer for connecting the lenses.

4. The method of claim 3, wherein removing the mold and the carrier substrate comprises:

removing the mold and then removing the bearing substrate;

after removing the mold, before removing the carrier substrate, or after removing the carrier substrate, further comprising:

and cutting the extension layer according to a preset rule to obtain separated light-emitting unit groups, wherein one light-emitting unit group comprises at least one light-emitting unit.

5. The method of claim 4, wherein the cutting the extension layer according to the predetermined rule comprises at least one of:

cutting along the extension layer and an interface region of the lens adjacent to the extension layer;

the cutting is performed along the middle area of the extension layer between two adjacent rows and/or two columns of the lenses.

6. The method of any of claims 1-5, wherein the carrier substrate is a glass substrate, and wherein providing the LED chip assembly comprises:

providing a glass substrate;

and adhering one side of the miniature flip LED chip provided with the electrode to the glass substrate through an adhesive film.

7. The method of fabricating a light emitting cell according to any of claims 1-5, wherein the providing a mold comprises:

a mold made of glass is provided, and the plurality of lens cavities are distributed in an array on the mold.

8. The method of any of claims 1-5, wherein the light conversion particles comprise phosphor and/or quantum dot particles, and wherein the preparing the gel before filling the liquid gel into each of the lens cavities;

the preparing the colloid comprises the following steps: phosphor and/or quantum dot particles are mixed into the colloid.

9. A light-emitting unit produced by the method for producing a light-emitting unit according to any one of claims 1 to 8.

10. A method of making a light emitting assembly, comprising:

providing a circuit board, wherein the circuit board is provided with welding pads corresponding to the electrodes of the miniature flip LED chip respectively;

disposing a light emitting cell fabricated by the light emitting cell fabrication method according to any one of claims 1 to 8 on the circuit board, and electrically connecting the electrodes of the micro flip LED chip of the light emitting cell to the pads in correspondence.

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