CN114300613A - Planar Magnetized Spin Orbit Magnetic Assemblies - Google Patents

Abstract

The invention provides a planar magnetized spin orbit magnetic component. The planar magnetized spin-orbit magnetic device includes a heavy metal layer, an upper electrode, and a magnetic tunneling junction. The magnetic tunnel junction is arranged between the heavy metal layer and the upper electrode. The MTJ includes a free layer and a pinned layer. The free layer is arranged on the heavy metal layer and is provided with a first film surface area. The fixed layer is arranged on the free layer and is provided with a second membrane surface area. A preset included angle is formed between the long axis direction of the membrane surface shape of the free layer and the long axis direction of the membrane surface shape of the fixed layer, and the area of the first membrane surface is larger than that of the second membrane surface.

Description

Planar Magnetized Spin Orbit Magnetic Assemblies

technical field

The invention relates to a planar magnetized spin orbit magnetic assembly.

Background technique

Magnetic Random Access Memory (MRAM) has the advantages of high speed, low power consumption, high density, non-volatile, and almost unlimited read and write, and is predicted to be the mainstream of the next generation of memory. The main structure of the storage element in the magnetic memory is composed of the Pined Layer, the Tunneling Barrier Layer and the Free Layer of the magnetic material. The stack structure composed of stacks. Such a stack structure may be referred to as a Magnetic Tunnel Junction (MTJ) device. Since the write current only passes through the selected MTJ components, and the magnetization reversal depends on the strength of the write current and the strength of the external magnetic field, it is beneficial to the decrease of the write current after the MTJ components are scaled down , in theory, it will be able to solve the problems of improving write selectivity and reducing write current at the same time.

The magnetic tunneling junction components that read and write by the spin-orbit-torque (SOT) mechanism can be divided into in-plane MTJ components and vertical MTJ components (Perpendicular MTJ). If the spin-orbit torque mechanism is used to realize the magnetic memory structure, the operation speed and writing reliability can be further improved. The flipping mechanism of the SOT in the planar MTJ device is to pass the writing current into the heavy metal layer formed of the ferromagnetic material. The heavy metal layer will generate a spin transfer torque (STT) due to the spin Hall effect. In addition, the vertical electric field of the write current through the material interface will generate Rashba Torque (RT). Since the two moments of STT and RT are both perpendicular to the direction of the write current and parallel to the film surface, these two moments will add up to each other and become SOT, which will make the magnetic moment of the ferromagnetic layer reverse, and achieve the write memory element. Purpose.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a planar magnetized spin-orbit magnetic assembly. By designing the film surface shapes of the free layer and the pinned layer, the spin-orbit moment will provide an additional lateral direction to the magnetic moment of the free layer. Therefore, the difficulty of the magnetic moment of the free layer in the magnetization reversal is slightly reduced, and the power saving effect is achieved.

The planar magnetized spin-orbit magnetic component of the embodiment of the present invention includes a heavy metal layer, an upper electrode, and a magnetic tunnel junction. The magnetic tunnel junction is arranged between the heavy metal layer and the upper electrode. The magnetic tunnel junction includes a free layer and a pinned layer. The free layer is arranged on the heavy metal layer, and the free layer has a first film surface area. The fixed layer is disposed on the free layer, and the fixed layer has a second membrane surface area. There is a preset angle between the long axis direction of the film surface shape of the free layer and the long axis direction of the film surface shape of the fixed layer, and the area of the first film surface is larger than the area of the second film surface.

Based on the above, the planar magnetization spin-orbit magnetic assembly proposed in the embodiments of the present invention is designed so that the film surface of the free layer in the magnetic tunnel junction is larger than the film surface of the pinned layer, and the film surface of the free layer and the pinned layer is The long axis directions of the shapes have a preset angle with each other. Therefore, the magnetic moment of the free layer can be more easily adjusted by the influence of the spin-orbit moment. In this way, the spin-orbit moment will provide an additional lateral moment to the magnetic moment vector of the free layer, thereby slightly reducing the difficulty of the magnetic moment of the free layer in the magnetization inversion. In other words, the magnetic moment of the free layer in this embodiment is more likely to be magnetized by the spin-orbit moment induced by the current of the heavy metal layer, and thus the magnitude of the write current in the heavy metal layer can be reduced, thereby achieving the power saving effect. .

Description of drawings

FIG. 1A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly according to a first embodiment of the present invention.

FIG. 1B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly of FIG. 1A .

FIG. 1C is a schematic diagram of the shape of the film surface of the fixed layer and the free layer in FIG. 1A .

2 is a side view of the structure of the planar magnetized spin-orbit magnetic assembly according to the first embodiment and the second embodiment of the present invention.

3A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly according to a second embodiment of the present invention.

FIG. 3B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly of FIG. 3A .

FIG. 3C is a schematic diagram of the shape of the film surface of the fixed layer and the free layer in FIG. 3A .

4A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly according to a third embodiment of the present invention.

FIG. 4B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly of FIG. 4A .

FIG. 4C is a schematic diagram of the shape of the film surface of the fixed layer and the free layer in FIG. 4A .

5 is a side view of the structure of the planar magnetized spin-orbit magnetic assembly according to the third embodiment and the fourth embodiment of the present invention.

6A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly according to a fourth embodiment of the present invention.

FIG. 6B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly of FIG. 6A .

FIG. 6C is a schematic diagram of the shape of the film surface of the fixed layer and the free layer in FIG. 6A .

7 is a schematic diagram of the shape of the free layer and the input current in the heavy metal layer after adjusting the preset angle when the shape of the film surface of the fixed layer is oval in the embodiment of the present invention.

Description of reference numerals

100, 300, 400, 600: Planar magnetized spin-orbit magnetic components;

110, 410, 610: heavy metal layer;

120: upper electrode;

130, 330: magnetic tunnel junction;

131: cover layer;

132, 332: fixed layer;

133: barrier layer;

134, 334: free layer;

134-1, 134-3: Capsule-shaped semicircle;

134-2: Capsule-shaped rectangle;

151, 351: the magnetic moment vector of the free layer;

152, 352: the magnetic moment vector of the fixed layer;

162, 362: annealing direction;

440, 640: lower electrode;

470: the opening of the lower electrode;

710, 720, 730, 740: label;

Ic: input current;

A1: The area of the first film surface;

A2: The area of the second membrane surface;

LD1, LD3: the long axis direction of the film surface shape of the free layer;

LD2, LD4: the long axis direction of the film surface shape of the fixed layer;

P1: center point;

X: X-axis direction;

Y: Y-axis direction;

Z: Z-axis direction;

θ: preset included angle;

LAD: the long axis of the capsule;

SAD: capsule-shaped short axis;

P1: The center point of the film surface shape of the free layer.

Detailed ways

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and description to refer to the same or like parts.

This embodiment is specially designed for the film surface shapes and corresponding structures of the free layer and the fixed layer in the magnetic tunnel junction, so that the magnetic moment of the free layer in each embodiment of the present invention will be more susceptible to the current of the heavy metal layer The induced spin-orbit moment causes the magnetization to flip. The details in each embodiment are described below.

FIG. 1A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly 100 according to a first embodiment of the present invention. FIG. 1B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly 100 of FIG. 1A . FIG. 1C is a schematic diagram of the shape of the film surface of the fixed layer 132 and the free layer 134 in FIG. 1A . FIG. 2 is a side view of the structure of the planar magnetized spin-orbit magnetic assembly 100 according to the first embodiment and the second embodiment of the present invention. Here, the first embodiment of the present invention is described first with reference to FIGS. 1A to 1C and FIG. 2 .

The planar magnetized spin-orbit magnetic component 100 mainly includes a heavy metal layer 110 , an upper electrode 120 and a magnetic tunnel junction 130 . The magnetic tunnel junction 130 is disposed between the heavy metal layer 110 and the upper electrode 120 . The magnetic tunnel junction 130 mainly includes a free layer 134 and a pinned layer 132 .

The heavy metal layer 110 may also be referred to as a write line. The heavy metal layer 110 obtains the input current Ic through the electrode contact to generate a spin current, so that the magnetization reversal of the magnetic tunnel junction 130 occurs. The material of the heavy metal layer 110 in this embodiment may be tantalum (Ta), platinum (Pt), tungsten (W), or an alloy of a combination of the above three.

The upper electrode 120 may also be referred to as a bit line, which is used for reading data stored in the magnetic tunnel junction 130 in the planar magnetized spin orbit magnetic device 100 . The material of the upper electrode 120 is a conductive material, such as copper (Cu), aluminum (Al), tantalum (Ta), or an alloy of a combination of the above elements.

The free layer 134 is disposed on the heavy metal layer 110 . The fixed layer 132 is disposed on the free layer 134 . The material of the pinned layer 132 is a ferromagnetic material with a planar magnetic moment, and the magnetic moment vector 152 of the pinned layer 132 is aligned parallel to the film surface. The material of the pinned layer 132 includes iron (Fe), cobalt (Co), nickel (Ni), gadolinium (Gd), terbium (Tb), dysprosium (Dy), boron (B) or an alloy of combinations thereof. In detail, the pinned layer 132 is, for example, a ferromagnetic/non-magnetic metal/ferromagnetic material stack composed of a lower pinned layer, a coupling layer and an upper pinned layer. The upper fixed layer and the lower fixed layer can be a single layer or a composite multi-layer structure. The upper pinned layer or the lower pinned layer of the single-layer structure can be realized by ferromagnetic materials such as iron (Fe), cobalt (Co), nickel (Ni), etc., or an alloy of these elements. The upper or lower fixed layer of the multi-layer composite structure can be a composite layer structure of ferromagnetic material and metal material, such as cobalt (Co)/platinum (Pt), cobalt (Co)/nickel (Ni), cobalt (Co) (Co)/Palladium (Pd)... and other elements of the composite layer structure.

The free layer 134 is a memory layer in the planar magnetized spin-orbit magnetic assembly 100 . The heavy metal layer 110 can receive the input current Ic from the electrode contacts of the planar magnetized spin-orbit magnetic assembly 100 . The input current Ic will flow through the heavy metal layer 110 to generate a variety of spin currents with different directions due to the spin Hall effect (SHE), thereby generating a resultant torque to reverse the magnetic moment of the free layer 134 to achieve data reading purpose of writing. The material of the free layer 134 is a ferromagnetic material having horizontal heterogeneity. The magnetic moment of the free layer 134 is determined by the shape of the free layer, that is, the direction of the magnetic moment of the free layer will be determined according to the long axis direction in the shape of the free layer, and the magnetic moment vector of the free layer is aligned parallel to the film surface. . The ferromagnetic material of the free layer 134 may be iron (Fe), cobalt (Co), nickel (Ni), gadolinium (Gd), terbium (Tb), dysprosium (Dy), boron (B) or an alloy of these elements, such as CoFeB, NF, FeB...etc. The free layer 134 may be a single-layer structure or a multi-layer composite structure. If the free layer is a composite structure formed of multi-layer ferromagnetic materials, the materials of these multi-layer composite structures may be cobalt (Co)/platinum (Pt), cobalt (Co)/nickel (Ni), cobalt (Co) /Palladium (Pd) ... and other elements of the composite layer structure.

The magnetic tunnel junction 130 of this embodiment further includes a capping layer 131 and a barrier layer 133 . The capping layer 131 is disposed between the upper electrode 120 and the fixed layer 132 . The barrier layer 133 is disposed between the free layer 134 and the fixed layer 132 . The barrier layer 133 can have a predetermined thickness obtained through experiments, so as to effectively isolate the spin current transfer of the metal or ferromagnetic material in the upper and lower layers, so that the operation mechanism of each layer can be simple and not affect each other. The barrier layer 133 in this embodiment may be an insulating material with magnetic tunneling conditions at a specific thickness. These insulating materials can be magnesia, alumina, or a combination of both. The cover layer 131 and the fixed layer 132 in this embodiment have the same shape and surface area, and the barrier layer 133 and the free layer 134 have the same shape and surface area, as shown in FIG. 1A .

For the convenience of description, coordinate axes X, Y, and Z are set in the drawings of various embodiments of the present invention to facilitate subsequent descriptions. In FIGS. 1B and 1C, the X-axis direction is the extension direction of the heavy metal layer 110, the Y-axis direction is the extension direction of the upper electrode 120, and the plane formed by the X-axis direction and the Y-axis direction is each layer (eg, the upper electrode 120, For the film surfaces of the heavy metal layer 110, the fixed layer 132 and the free layer 134), the Z-axis direction is a direction perpendicular to the film surfaces. The film surface of each layer is parallel to the XY plane. In this embodiment, the transmission direction of the input current Ic is the positive X-axis direction.

The fixed layer 132 and the free layer 134 in FIG. 1B and FIG. 1C respectively represent their own position and the shape of the film surface. This embodiment is specially designed for the film surface shapes and corresponding structures of the free layer 134 and the fixed layer 132 in the magnetic tunnel junction 130 , so that the magnetic moment of the free layer in each embodiment of the present invention is more susceptible to heavy metals The magnetization inversion occurs due to the spin-orbit torque induced by the current in the layer. Specifically, in this embodiment, the shape of the film surface of the free layer 134 is one of an oval shape and a capsule shape, and the shape of the film surface of the fixed layer 132 is an oval shape. Both elliptical and capsule shapes have a major axis and a minor axis.

The "capsule shape" is described in detail here. The shape of the film surface of the free layer 134 in FIGS. 1B and 1C is presented in a capsule shape. In this embodiment, the capsule shape of the free layer 134 is formed by combining two semicircles 134-1 and 134-3 and a rectangle 134-2. In the embodiment of the present invention, the connection line between two points with the longest distance in the capsule shape of the free layer 134 is referred to as the long axis LAD of the capsule shape, and the long axis LAD passes through the center point of the capsule shape rectangle 134-2 ( That is, the center point P1) of the film surface shape of the free layer. On the other hand, this embodiment will pass through the center point of the capsule-shaped rectangle 134-2 (ie, the center point P1 of the film surface shape of the free layer), and connect the semicircle 134-1 or 134-3 with the rectangle 134- The connecting lines that are parallel to each other at the junction between 2 are called capsule-shaped short-axis SAD. That is to say, both the long axis LAD and the short axis SAD of the capsule shape pass through the center point P1 of the film surface shape of the free layer. The direction corresponding to the long axis LAD is the long axis direction LD1 in FIG. 1C .

In this embodiment, the length of the long axis LAD can be the diameter of the semicircle 134-1 or 134-3 plus the side of the rectangle 134-2 that does not fit with the semicircle 134-1 or 134-3 (Fig. In 1B and FIG. 1C, the length of the long side of the rectangle 134-2 is used as an example). The length of the short axis SAD in this embodiment may be the diameter of the semicircle 134-1 or 134-3.

The capsule shape in this embodiment is composed of two semicircles 134-1 and 134-3 and a rectangle 134-2 combined with each other. In other embodiments, two oval shapes and a rectangle can also be combined with each other. If it is a capsule in which two semi-ellipses and rectangles are combined with each other, the length of the major axis of the capsule is the length of the major axes of the two semi-ellipses plus the length of the major axes of the two semi-ellipses plus the rectangle that does not fit the two semi-ellipses. The length of one side of the capsule; the length of the minor axis of this capsule is equal to the length of the minor axis of the two semi-ellipses.

The free layer 134 of this embodiment has a first film surface area A1, and the fixed layer 132 has a second film surface area A2, and the first film surface area A1 is larger than the second film surface area A2. In this embodiment, the center point of the film surface shape of the free layer 134 and the center point of the film surface shape of the fixed layer 132 (the center point P1 in FIG. 1C ) may overlap each other. Those applying this embodiment can also make the center point of the film surface shape of the free layer different from the center point of the film surface shape of the fixed layer.

By design, a predetermined angle θ exists between the long axis direction LD1 of the film surface shape of the free layer 134 and the long axis direction LD2 of the film surface shape of the fixed layer 132 in this embodiment. In this way, the spin-orbit torque will provide additional lateral torque to the magnetic moment vector 151 of the free layer 134 , thereby slightly reducing the difficulty of the magnetic moment of the free layer 134 in magnetization inversion. In this embodiment, the absolute value of the preset angle θ is preferably greater than zero degrees and less than 45 degrees. If the absolute value of the preset angle θ is greater than 45 degrees, the additional lateral torque provided by the spin-orbit torque is less obvious, which will lead to the instability of the magnetization reversal of the free layer. In other words, if the absolute value of the preset angle θ is greater than 45 degrees, it may cause unexpected magnetization inversion of the free layer. The preset included angle in this embodiment is not equal to 0 and 90 degrees.

In this embodiment, the magnetic moment vector 152 of the pinned layer 132 in this embodiment is the same as the long axis direction LD2 of the film surface shape of the free layer 134 . When the annealing step is performed on the pinned layer 132 in the semiconductor manufacturing process of the planar magnetization spin-orbit magnetic device 100, the present embodiment is designed so that the annealing direction 162 is performed along the long axis direction LD2 of the film surface shape of the free layer 132, Thus, the magnetic moment vector 152 of the pinned layer 132 is determined/fixed. In detail, the process of manufacturing a planar magnetized spin-orbit magnetic device or a related magnetoresistive random access memory (MRAM) using a semiconductor process is outlined as follows. The physical vapor deposition (PVD) technology is used to coat the substrate, magnetic annealing (field anneal), masking (Mask) or patterning (patterning), etching (etch) and other steps. The preceding steps may be interleaved. After the aforementioned steps are completed, the substrate will undergo device testing and encapsulation, thereby completing the fabrication of the planar magnetized spin-orbit magnetic assembly 100 . The annealing direction in this embodiment is to perform operations such as heating and cooling the substrate at a specific temperature in the magnetic annealing step in the semiconductor process, so as to fix the magnetic moment vector of a certain level of components.

In the first embodiment, the capping layer 131 and the fixed layer 132 are etched simultaneously in the semiconductor process, while the barrier layer 133 and the free layer 134 are etched simultaneously at another point in the semiconductor process. Therefore, the shape of the film surface of the capping layer 131 and the fixed layer 132 is the same, and the shape of the film surface of both the barrier layer 133 and the free layer 134 is the same. The shape of the film surface of the capping layer 131 and the fixed layer 132 is different from the shape of the film surface of the free layer 134 and the barrier layer 133 . In the etching process of the semiconductor process of the present embodiment, if the barrier layer 133 is etched together with the capping layer 131 and the fixed layer 132 at the same time, since part of the free layer 134 is not covered by the barrier layer 133 and is exposed, there may be As a result, the part of the free layer 134 that is not covered by the barrier layer 133 loses its magnetic properties, so that the free layer 134 cannot provide additional flipping torque due to the shape anisotropy. Therefore, in order to avoid the aforementioned situation, in this embodiment, both the barrier layer 133 and the free layer 134 are etched at the same time, so that the film surface shapes of the barrier layer 133 and the free layer 134 are the same.

Herein, the second embodiment of the present invention is described with reference to FIG. 2 and FIGS. 3A to 3C . The structure of each layer in the side view of the device 100 of the first embodiment and the device 300 of the second embodiment are the same, so FIG. 2 is a side view of the planar magnetized spin-orbit magnetic device 300 . FIG. 3A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly 300 according to a second embodiment of the present invention. FIG. 3B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly 300 of FIG. 3A. FIG. 3C is a schematic diagram of the shape of the film surface of the fixed layer 332 and the free layer 334 in FIG. 3A .

The materials and functions of the components of each layer in the first embodiment and the second embodiment are the same. The difference between the first embodiment and the second embodiment is that the positional configuration of the free layer 334 and the pinned layer 332 in the planar magnetization spin-orbit magnetic assembly 300 is the same as that of the free layer 134 in the planar magnetization spin-orbit magnetic assembly 100 . The positional configuration of the fixed layer 132 is different from each other. In particular, in the second embodiment, the long-axis direction LD3 of the film surface shape of the free layer 334 is parallel to the Y-axis direction, and the long-axis direction LD4 of the film surface shape of the fixed layer 332 is not parallel to the Y-axis direction. In the example, the long-axis direction LD1 of the film surface shape of the free layer 134 is not parallel to the Y-axis direction, and the long-axis direction LD2 of the film surface shape of the pinned layer 132 is parallel to the Y-axis direction. For the materials and functions of the free layer 334 and the pinned layer 332 of the planar magnetized spin-orbit magnetic assembly 300 , please refer to the free layer 134 and the fixed layer 132 of the planar magnetized spin-orbit magnetic assembly 100 in the foregoing embodiments. The magnetic moment vector 352 of the pinned layer 332 is parallel to the annealing direction 362 in the semiconductor process. The magnetic moment vector 351 of the free layer 334 is parallel to the long axis direction LD3 of the film surface shape of the free layer 334 .

In the first embodiment and the second embodiment, the relationship between the long-axis directions LD1 and LD3 of the film surface shapes of the free layers 134 and 334 and the long-axis directions LD2 and LD4 of the film surface shapes of the fixed layers 132 and 332 are all distances from each other. A positive preset angle θ. That is, the major axis directions LD1 and LD3 are located on the left side of the major axis directions LD2 and LD4, respectively. Those who apply the various embodiments of the present invention can also make the long axis directions LD1 and LD3 of the film surface shapes of the free layers 134 and 334 in the first embodiment and the second embodiment and the long axes of the film surface shapes of the fixed layers 132 and 332 . The relationship between the directions LD2 and LD4 is a negative preset angle θ. That is, in other embodiments, the long-axis directions LD1, LD3 may be located on the right side of the long-axis directions LD2, LD4, respectively. That is to say, the long axis direction LD1 of the film surface shape of the free layer 134 in the first embodiment and the long axis direction LD2 of the film surface shape of the fixed layer 132 can be replaced with each other, and the film of the free layer 334 in the second embodiment The long-axis direction LD3 of the surface shape and the long-axis direction LD4 of the film surface shape of the fixed layer 332 can be replaced with each other, so that the film surface shape of the free layer 134 and the fixed layer 132 can be adjusted by the angle in the structure to produce another method according to the present invention. Example.

The shapes of the film surfaces of the free layers 134 and 334 in the first embodiment and the second embodiment are both capsule-shaped. Those applying this embodiment can also use the free layers 134 and 334 in the first embodiment and the second embodiment. The shape of the membrane surface is designed as an oval.

Herein, the third embodiment of the present invention will be described with reference to FIGS. 4A to 4C and FIG. 5 . FIG. 4A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly 400 according to a third embodiment of the present invention. FIG. 4B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly 400 of FIG. 4A. FIG. 4C is a schematic diagram of the shape of the film surface of the fixed layer 132 and the free layer 134 in FIG. 4A . The components with the same numbers in the first embodiment and the third embodiment are the same components, and both have the same materials and the same functions. The main difference between the first embodiment and the third embodiment is that the heavy metal layer 410 and the free layer 134 of the planar magnetization spin-orbit magnetic component 400 have the same film shape and area, and the planar magnetization spin The track magnetic assembly 400 also includes a lower electrode 440 . In the semiconductor manufacturing process, the heavy metal layer 410 and the free layer 134 can be etched at the same time, so that the heavy metal layer 410 and the free layer 134 have the same film surface shape and film surface area. For the material and function of the heavy metal layer 410 of the planar magnetization spin-orbit magnetic assembly 400 , please refer to the heavy metal layer 110 of the planar magnetization spin-orbit magnetic assembly 100 in the foregoing embodiment.

至6千埃

应用本实施例者可依其需求调整下电极440的厚度。因此，输入电流Ic通过下电极440的一端流经重金属层410而抵达下电极440的另一端，从而实现重金属层410的功能。The lower electrode 440 is disposed under the heavy metal layer 410 . The two lower electrodes 440 are respectively disposed on opposite sides of the heavy metal layer 410 . The lower electrode 410 of this embodiment includes an opening 470 . The opening 470 is disposed under the heavy metal layer 410 . The width H1 of the opening 470 in the direction parallel to the short axis SAD of the heavy metal layer 410 is smaller than the length of the short axis SAD of the film surface shape of the heavy metal layer 410 , and the width of the opening 470 is smaller than the short axis of the film surface shape of the free layer 134 and the heavy metal layer 410 . axis width, and the extending direction of the opening 470 is parallel to the long axis direction LD1 of the film surface shape of the free layer 134 (as shown in FIG. 4B and FIG. 4C ). The material of the lower electrode 440 is a conductive material. For example, the material of the lower electrode may be an alloy of copper (Cu), aluminum (Al), tantalum (Ta) or a combination of the above elements. The thickness of the lower electrode 440 in this embodiment may be 1 kA

to 6 k Angstroms

Those applying this embodiment can adjust the thickness of the lower electrode 440 according to their needs. Therefore, the input current Ic flows through the heavy metal layer 410 through one end of the lower electrode 440 and reaches the other end of the lower electrode 440 , thereby realizing the function of the heavy metal layer 410 .

The structure of each layer shown in the side view is the same, so FIG. 2 shows the side view of the planar magnetized spin-orbit magnetic device 300 .

Herein, the fourth embodiment of the present invention is described with reference to FIG. 5 and FIGS. 6A to 6C . The layers of the planar magnetization spin-orbit magnetic assembly 400 of the third embodiment and the planar magnetization spin-orbit magnetic assembly 600 of the fourth embodiment are the same in side views, so the planar magnetization is shown in FIG. 5 . Side view of spin-orbit magnetic assembly 600 . FIG. 6A is a schematic structural diagram of a planar magnetized spin-orbit magnetic assembly 600 according to a fourth embodiment of the present invention. FIG. 6B is a top view of the structure of the planar magnetized spin-orbit magnetic assembly 600 of FIG. 6A. FIG. 6C is a schematic diagram of the shape of the film surface of the fixed layer 332 and the free layer 334 in FIG. 6A .

The materials and functions of the components of each layer in the second embodiment and the fourth embodiment are the same. The difference between the second embodiment and the fourth embodiment is that the heavy metal layer 610 and the free layer 334 of the planar magnetization spin-orbit magnetic component 600 have the same film shape and area, and the planar magnetization spin The track magnetic assembly 600 also includes a lower electrode 640 . In the semiconductor manufacturing process, the heavy metal layer 610 and the free layer 334 can be etched at the same time, so that the heavy metal layer 610 and the free layer 334 have the same film surface shape and film surface area. For the materials and functions of the heavy metal layer 610 of the planar magnetization spin-orbit magnetic assembly 600 , please refer to the heavy metal layer 110 of the planar magnetization spin-orbit magnetic assembly 100 in the foregoing embodiment.

The lower electrode 640 is disposed under the heavy metal layer 610 . The two lower electrodes 640 are respectively disposed on opposite sides of the heavy metal layer 610 . The lower electrode 640 of this embodiment includes an opening 670 . The opening 670 is disposed under the heavy metal layer 610 . The width of the opening 670 in the direction parallel to the short axis SAD of the heavy metal layer 610 is smaller than the length of the short axis SAD of the film surface shape of the heavy metal layer 610 , and the extension direction of the opening 670 is parallel to the long axis direction of the film surface shape of the free layer 334 . LD3 (shown in Figures 6B and 6C). For the materials and functions of the heavy metal layer 610 and the lower electrode 640 of the planar magnetized spin-orbit magnetic assembly 600 , please refer to the heavy metal layer 410 and the lower electrode 440 of the planar magnetized spin-orbit magnetic assembly 400 in the third embodiment.

In the third embodiment and the fourth embodiment, the relationship between the long-axis directions LD1 and LD3 of the film surface shapes of the free layers 134 and 334 and the long-axis directions LD2 and LD4 of the film surface shapes of the fixed layers 132 and 332 are all distances from each other. A positive preset angle θ. That is, the major axis directions LD1 and LD3 are located on the left side of the major axis directions LD2 and LD4, respectively. Those applying each embodiment of the present invention can also make the long axis directions LD1 and LD3 of the film surface shapes of the free layers 134 and 334 in the third embodiment and the fourth embodiment and the long axes of the film surface shapes of the fixed layers 132 and 332 The relationship between the directions LD2 and LD4 is a negative preset angle θ. That is, in other embodiments, the long-axis directions LD1, LD3 may be located on the right side of the long-axis directions LD2, LD4, respectively. That is to say, the long-axis direction LD1 of the film surface shape of the free layer 134 in the third embodiment and the long-axis direction LD2 of the film surface shape of the fixed layer 132 can be replaced with each other, and the film of the free layer 334 in the fourth embodiment The long-axis direction LD3 of the surface shape and the long-axis direction LD4 of the film surface shape of the fixed layer 332 can be replaced with each other, so that the film surface shape of the free layer 134 and the fixed layer 132 can be adjusted by the angle in the structure to produce another method according to the present invention. Example.

The film surface shapes of the free layers 134 and 334 in the third embodiment and the fourth embodiment are both capsule-shaped. Those who apply this embodiment can also use the free layers 134 and 334 in the third embodiment and the fourth embodiment. The shape of the membrane surface is designed as an oval.

7 is a schematic diagram of the shape of the free layer and the input current in the heavy metal layer after adjusting the preset angle when the shape of the film surface of the fixed layer is oval in the embodiment of the present invention. Figure 7 shows the results obtained from the simulation at an absolute temperature (T) of 300K.

The vertical axis of FIG. 7 represents, in amperes (A) per square centimeter, how many amperes the input current in the heavy metal layer needs to reach to cause the magnetic moment vector in the free layer to flip the magnetization. The reference numeral 710 in FIG. 7 represents the input current in the heavy metal layer when the film surface shapes of the fixed layer and the free layer are both designed to be elliptical in the absence of a preset angle θ (that is, the default angle θ is zero degrees). How many amperes must be reached to flip the magnetization of the magnetic moment vector in the free layer. The reference numeral 720 in FIG. 7 indicates that when there is a preset angle θ (for example, the preset angle θ is 10 degrees), when the film surface shapes of the fixed layer and the free layer are both designed to be elliptical, the input in the heavy metal layer How many amperes the current needs to reach to flip the magnetization of the magnetic moment vector in the free layer. The reference numeral 730 in FIG. 7 indicates that when there is no preset angle θ (that is, the default angle θ is zero degrees), when the fixed layer is elliptical and the film surface shape of the free layer is designed as a capsule, the heavy metal layer How many amperes the input current needs to reach in order to flip the magnetization of the magnetic moment vector in the free layer. Reference numeral 740 in FIG. 7 indicates that when there is a preset angle θ (for example, the preset angle θ is 10 degrees), when the fixed layer is elliptical and the film surface shape of the free layer is designed as a capsule, the heavy metal How many amperes the input current in the layer needs to reach to flip the magnetization of the magnetic moment vector in the free layer.

As can be seen from FIG. 7 , when the preset angle θ is 10 degrees, the amperage of the input current required by the heavy metal layers in the reference numeral 720 and 740 is lower than that without the preset included angle θ (the default included angle θ is zero degrees). The amperage of the input current required for the heavy metal layer in case 710 and 730.

To sum up, the planar magnetized spin-orbit magnetic assembly proposed in the embodiment of the present invention is designed by designing the shape of the film surface of the free layer in the magnetic tunnel junction to be an ellipse or a capsule shape, and the shape of the film surface of the fixed layer. It is elliptical, the film surface of the free layer is larger than the film surface of the fixed layer, and the long axis directions of the film surface shapes of the free layer and the fixed layer have a preset angle with each other. Therefore, the magnetic moment of the free layer can be more easily adjusted by the influence of the spin-orbit moment. That is to say, due to the anisotropy of the film surface shapes of the pinned layer and the free layer, and the annealing direction of the free layer and the pinned layer in the semiconductor process, both are the long axis direction of the film surface shape of the pinned layer. In this way, the spin-orbit moment will provide an additional lateral moment to the magnetic moment vector of the free layer, thereby slightly reducing the difficulty of the magnetic moment of the free layer in the magnetization inversion. In other words, the magnetic moment of the free layer in this embodiment is more likely to be magnetized by the spin-orbit moment induced by the current of the heavy metal layer, and thus the magnitude of the write current in the heavy metal layer can be reduced, thereby achieving the power saving effect. .

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features thereof can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. scope.

Claims (18)

1. A planar magnetized spin orbit magnetic component, comprising:

a heavy metal layer;

an upper electrode; and

a magnetic tunneling junction disposed between the heavy metal layer and the upper electrode,

wherein the magnetic tunneling junction comprises:

a free layer disposed on the heavy metal layer, the free layer having a first film face area; and

a fixed layer disposed on the free layer, the fixed layer having a second film face area,

and a preset included angle is formed between the long axis direction of the membrane surface shape of the free layer and the long axis direction of the membrane surface shape of the fixed layer, and the area of the first membrane surface is larger than that of the second membrane surface.

2. The planar magnetized spin orbit magnetic component of claim 1, wherein the film surface shape of the free layer is one of an elliptical shape and a capsule shape.

3. The planar magnetized spin orbit magnetic component of claim 2, wherein the film surface of the pinned layer has an elliptical shape.

4. The planar magnetized spin orbit magnetic component of claim 1, further comprising:

a barrier layer disposed between the free layer and the fixed layer.

5. The planar magnetized spin orbit magnetic component of claim 4, wherein the barrier layer is made of magnesium oxide, aluminum oxide or a combination thereof.

6. The planar magnetized spin orbit magnetic component of claim 1, further comprising:

a cover layer disposed between the upper electrode and the fixed layer.

7. The planar magnetized spin orbit magnetic component of claim 1, further comprising:

and the lower electrodes are arranged below the heavy metal layer and are respectively arranged on two opposite sides of the heavy metal layer.

8. The planar magnetized spin orbit magnetic device of claim 7, wherein the lower electrode comprises an opening, the opening is disposed below the heavy metal layer, a width of the opening in a direction parallel to a short axis of the heavy metal layer is smaller than a length of a short axis of a film surface shape of the heavy metal layer, and an extending direction of the opening is parallel to a long axis of the film surface shape of the free layer.

9. The planar magnetized spin orbit magnetic component of claim 7, wherein the material of the lower electrode is copper, aluminum, tantalum, or alloys of combinations thereof.

10. The planar magnetized spin orbit magnetic component of claim 7, wherein the heavy metal layer and the free layer have the same film side area and film side shape.

11. The planar magnetized spin orbit magnetic device of claim 7, wherein the heavy metal layer and the free layer are etched simultaneously during semiconductor processing.

12. The planar magnetized spin-orbit magnetic component of claim 1, wherein the heavy metal layer obtains an input current through electrode contacts to generate a spin current to cause magnetization switching of the MTJ,

the material of the heavy metal layer is tantalum, platinum, tungsten or alloy of the combination of the three.

13. The planar magnetized spin orbit magnetic component of claim 1, wherein the free layer is a ferromagnetic material with horizontal anisotropy, and the magnetic moment vector of the free layer is aligned parallel to the film plane.

14. The planar magnetized spin orbit magnetic component of claim 1, wherein the pinned layer is a ferromagnetic material having a planar magnetic moment, and the pinned layer has a magnetic moment vector aligned parallel to the film plane.

15. The planar magnetized spin orbit magnetic component of claim 1, wherein the material of the pinned layer comprises iron, cobalt, nickel, gadolinium, terbium, dysprosium, boron, or alloys of combinations of the seven.

16. The planar magnetized spin orbit magnetic component of claim 1, wherein the predetermined included angle is not equal to 90 degrees.

17. The planar magnetized spin orbit magnetic component of claim 1, wherein the predetermined angle has an absolute value greater than zero degrees and less than 45 degrees.

18. The planar spin-orbit magnetic device of claim 1, wherein the annealing direction for the pinned layer in the semiconductor process for manufacturing the planar spin-orbit magnetic device is the same as the long axis direction of the film surface shape of the pinned layer.

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