CN114302785A - Mounting system, head unit, and imaging method - Google Patents

Abstract

An object of the present disclosure is to provide a mounting system, a head unit, and an imaging method suitable for imaging in a mounted state. A mounting system (100A) is provided with a mounting head (1) and an imaging device (2). The mounting head (1) has a capturing unit (11) for capturing a first object (T1). The mounting head (1) moves the catching part (11) between a first position facing the mounting surface (T21) of the second object (T2) and a second position spaced apart from the mounting surface (T21) from the first position, and mounts the first object (T1) on the mounting surface (T21). The imaging device (2) is fixed to the mounting head (1). The imaging device (2) includes a first specific region (R1) and a second specific region (R2) in a mounting surface (T21) in an imaging field of view (R10). The first specific region (R1) is opposed to the catching part (11) located at the first position in a direction perpendicular to the mounting surface (T21). The second specific region (R2) includes a side surface of the catching part (11) located at the second position.

Description

Mounting system, head unit, and imaging method

technical field

The present disclosure generally relates to a mounting system, a head unit, and an imaging method, and more specifically, relates to a mounting system, a head unit, and an imaging method for attaching a first object captured by a capture unit to a second object.

Background technique

Patent Document 1 discloses an imaging device and an imaging method for capturing images during a component suction and mounting operation of a surface mounter.

The imaging device described in Patent Document 1 performs imaging of the component mounting operation by the adsorption nozzle when the component is adsorbed by the capture unit (suction nozzle) and the component is mounted on a predetermined component mounting position. The imaging device is coupled to the mounting head (head main body) via the bracket, and moves together with the mounting head. In the mounting step, when the capturing section is arranged above a specific area (component mounting position) on the printed circuit board, a CCD camera of the imaging device images a predetermined range centered on the specific area. Therefore, the CCD camera of the imaging device is arranged obliquely above the specific region of the printed circuit board.

prior art literature

Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2008-103426

SUMMARY OF THE INVENTION

The present disclosure is made in view of the above-mentioned circumstances, and an object thereof is to provide a mounting system, a head unit, and an imaging method suitable for imaging in a mounted state.

A mounting system according to an aspect of the present disclosure includes a mounting head and an imaging device. The mounting head has a capture portion that captures the first object. The mounting head moves the capturing portion between a first position facing the mounting surface of the second object and a second position farther away from the mounting surface than the first position, and attaches the first position to the mounting surface. An object is mounted on the mounting surface. The camera device is fixed to the mounting head. The imaging device includes a first specific area and a second specific area in the mounting surface in an imaging field of view. The first specific region is opposed to the catch portion located at the first position in a direction perpendicular to the mounting surface. The second specific area includes a side surface of the capture portion at the second position.

A head unit according to an aspect of the present disclosure includes a mounting head and an imaging device. The mounting head has a capture portion that captures the first object. The mounting head moves the capturing portion between a first position facing the mounting surface of the second object and a second position farther away from the mounting surface than the first position, and attaches the first position to the mounting surface. An object is mounted on the mounting surface. The camera device is fixed to the mounting head. The imaging device includes a first specific area and a second specific area in the mounting surface in an imaging field of view. The first specific region is opposed to the catch portion located at the first position in a direction perpendicular to the mounting surface. The second specific area includes a side surface of the capture portion at the second position.

An imaging method according to an aspect of the present disclosure is an imaging method used in a mounting system including a mounting head. The mounting head has a capture portion that captures the first object. The mounting head moves the capturing portion between a first position facing the mounting surface of the second object and a second position farther away from the mounting surface than the first position, and attaches the first position to the mounting surface. An object is mounted on the mounting surface. The imaging method includes the step of photographing the first specific area and the second specific area with an imaging device. The camera is fixed to the mounting head, and includes the first specific area and the second specific area on the mounting surface in an imaging field of view. The first specific region is opposed to the catch portion located at the first position in a direction perpendicular to the mounting surface. The second specific area includes a side surface of the capture portion at the second position.

Description of drawings

FIG. 1 is a schematic perspective view of a mounting system according to a basic structure.

FIG. 2 is a schematic side view of the main part of the mounting system as above.

Figure 3 is a block diagram of the mounting system as above.

A of FIG. 4 is a plan view of the head unit of the same mounting system. B of FIG. 4 is a front view of the same head unit. C of FIG. 4 is a side view of the same head unit.

FIG. 5 is an explanatory diagram schematically showing an imaging field of view of an imaging device in the same mounting system.

FIG. 6A is a schematic side view of the main part of the same mounting system. B of FIG. 6 is a schematic diagram of an image obtained by the imaging device in the same mounting system.

FIG. 7 is a flowchart showing an example of the operation of the installation system as described above.

FIG. 8A is a schematic side view of a main part of the mounting system according to Embodiment 1. FIG. B of FIG. 8 is an enlarged schematic cross-sectional view of the imaging device of the same mounting system.

9 is an explanatory diagram schematically showing an imaging field of view of an imaging device in the same mounting system.

FIG. 10A is a schematic side view of the main part of the same mounting system. B of FIG. 10 is a schematic diagram of an image obtained by the imaging device in the same mounting system.

FIG. 11A is a schematic plan view of a main part of the mounting system according to Embodiment 2. FIG. FIG. 11B is a schematic side view of the main part of the same mounting system.

Detailed ways

(basic structure)

Hereinafter, the mounting system 100 , the head unit 10 , and the imaging method according to this configuration example will be described with reference to FIGS. 1 to 7 .

(1) Outline

Conventionally, since the CCD camera is arranged toward a specific area of the printed circuit board, the imaging device has been difficult to capture the state of the catching portion when the catching portion is lifted up and separated from the printed circuit board after mounting of components, for example. However, if a camera is separately provided, the area occupied by the imaging device in a plane parallel to the mounting surface becomes relatively large, and the moving range of the mounting head may be restricted.

As shown in FIG. 1, the mounting system 100 which concerns on this structural example is a mounting apparatus (mounting machine) for mounting the 1st object T1 captured by the capture|acquisition part 11 to the 2nd object T2. The installation system 100 is used for manufacturing operations of various products such as electronic equipment, automobiles, clothing, food, medicine, and handicrafts, for example, in facilities such as factories, research institutes, offices, and educational facilities.

In this configuration example, the case where the mounting system 100 is used for the manufacture of electronic equipment in a factory will be described. A general electronic device has, for example, various circuit blocks such as a power supply circuit and a control circuit. When manufacturing these circuit blocks, as an example, a soldering step, a mounting step, and a soldering step are performed in this order. In the solder application step, paste solder is applied (or printed) on a substrate (including a printed wiring board). In the mounting step, components (including electronic components) are mounted (mounted) on the substrate. In the soldering step, for example, the solder paste is melted by heating the board in the state where the components are mounted in a reflow oven, and soldering is performed. In the mounting step, the mounting system 100 performs an operation of mounting the components that are the first object T1 to the board that is the second object T2.

In this way, as shown in FIG. 1 , the mounting system 100 for mounting the first object T1 (component) on the second object T2 (substrate) includes the mounting head 1 having the capturing portion 11 for capturing the first object T1 . As an example, the capture part 11 is constituted by a suction nozzle, and captures (holds) a member that is the first object T1 in a state in which it can be released (ie, released from capture). In the state where the first object T1 is captured by the capturing unit 11, the mounting system 100 lowers the capturing unit 11 close to the second object T2, and mounts the first object T1 on the mounting surface T21 of the second object T2.

In such a mounting system 100, when the first object T1 is mounted on the mounting surface T21 of the second object T2, the specific region R1 is required to be imaged for the purpose of recognizing the specific region R1, etc., which is the mounting position on the mounting surface T21. . Therefore, the mounting system 100 according to the present configuration example includes, in addition to the mounting head 1 , an imaging device 2 as shown in FIG. 2 . As a result, the mounting system 100 can use the imaging device 2 to image the specific region R1 of the mounting surface T21 , for example, to confirm the first object T1 with the image immediately before and/or after the mounting of the first object T1 by the mounting head 1 The state of an object T1 and/or a second object T2, etc. Therefore, in the present configuration example, the imaging device 2 is configured to be able to image at least the region directly below the capture portion 11 in the attachment surface T21.

That is, as shown in FIG. 2 , the mounting system 100 according to the present configuration example includes the mounting head 1 and the imaging device 2 . The mounting head 1 has a catch portion 11 . The mounting head 1 moves the capturing portion 11 to approach the second object T2 in a state where the first object T1 is captured by the capturing portion 11, and mounts the first object T1 on the mounting surface T21 of the second object T2. The imaging device 2 is fixed to the mounting head 1 . The imaging device 2 includes the specific region R1 in the mounting surface T21 in the imaging field of view R10. The specific region R1 faces the capture portion 11 in the direction perpendicular to the mounting surface T21. The imaging device 2 has an imaging optical axis Ax1 perpendicular to the mounting surface T21.

According to the above configuration, the imaging device 2 includes the specific region R1 in the mounting surface T21 in the imaging field of view R10 that faces the capturing portion 11 in the direction perpendicular to the mounting surface T21, so that at least the capturing portion in the mounting surface T21 can be captured. The area just below 11. Furthermore, since the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21, the imaging device 2 can be arranged in a posture orthogonal to the mounting surface T21. That is, in this configuration example, instead of directing the imaging optical axis Ax1 of the imaging device 2 toward the specific region R1, the imaging optical axis Ax1 of the imaging device 2 is deliberately directed outside the specific region R1 so that the specific region R1 is reflected in the imaging device. 2 at the end of the imaging field of view R10. Thereby, the imaging optical axis Ax1 of the imaging device 2 can be made perpendicular to the mounting surface T21. Therefore, for example, the occupied area of the imaging device 2 in the plane parallel to the mounting surface T21 is suppressed to be small, and there are advantages such as being less likely to be restricted by the moving range of the imaging device 2 with respect to the mounting head 1 . Therefore, it is possible to provide the mounting system 100 more suitable for imaging of the specific region R1.

(2) Details

Hereinafter, the details of the mounting system 100, the head unit 10, and the imaging method according to this configuration example will be described.

(2.1) Premise

In this configuration example, as an example, a case where the mounting system 100 is used for mounting of a component (first object T1 ) based on Surface Mount Technology (SMT: Surface Mount Technology) will be described. That is, the component as the first object T1 is a surface mount component (SMD: Surface Mount Device), and is mounted by being arranged on the surface (mounting surface) of the substrate as the second object T2. However, the present invention is not limited to this example, and the mounting system 100 may be used for mounting a component (the first object T1 ) based on an Insertion Mount Technology (IMT: Insertion Mount Technology). In this case, the component serving as the first object T1 is a component for insertion and mounting having lead terminals, and the lead terminals are inserted into the holes of the substrate serving as the second object T2 to be mounted on the substrate (the second object T2 ). ) on the surface (mounting surface).

In addition, the "imaging optical axis" referred to in the present disclosure is an optical axis for an image captured by the imaging device 2 , and is an imaging element 21 (refer to FIG. 2 ) and an optical system 22 (refer to FIG. 2 ) of the imaging device 2 to be described later. 2) Optical axis determined by both parties. That is, the optical path through which light from the center of the image captured by the imaging device 2 passes becomes the imaging optical axis Ax1 of the imaging device 2 . Specifically, a straight line connecting the center of the light-receiving surface of the imaging element 21 and the portion imaged by the optical system 22 in the subject at the center of the light-receiving surface of the imaging element 21 is the imaging optical axis Ax1 of the imaging device 2 .

In addition, the "image" referred to in the present disclosure is an image captured by the imaging device 2, and includes a still image (still image) and a moving image (moving image). Furthermore, the "moving image" includes an image composed of a plurality of still images obtained by frame shooting or the like. The image may not be the data itself output from the imaging device 2 . For example, the image may be appropriately processed such as data compression, conversion to another data format, processing of cutting out a part of the image captured by the imaging device 2, focus adjustment, brightness adjustment, or contrast adjustment as necessary. In this configuration example, as an example, the image is a full-color still image.

In addition, the term "orthogonal" in the present disclosure includes not only a state in which the angle between the two is 90 degrees in a strict sense, but also a state in which the two are substantially orthogonal within a range of a certain degree of error. That is, the angle between the two that are orthogonal to each other is within a range of a certain degree of error (10 degrees or less, as an example) with respect to 90 degrees. In the present disclosure, "parallel" also includes not only a state in which the angle between the two is 0 degrees in the strict sense, but also a state in which the two are substantially parallel within a certain degree of error. That is, the angle between the two that are parallel falls within a range of a certain degree of error (for example, 10 degrees or less) with respect to 0 degrees.

Hereinafter, as an example, three axes of the X axis, the Y axis, and the Z axis that are orthogonal to each other are set, and the axis parallel to the surface (the mounting surface T21 ) of the substrate as the second object T2 is referred to as the “X axis” As for the "Y axis", the axis parallel to the thickness direction of the substrate is referred to as the "Z" axis. In particular, the "X axis" is an axis along the direction in which the two or more capturing portions 11 constituting the first capturing portion group G1 described later are arranged. Furthermore, the side of the capturing portion 11 viewed from the substrate as the second object T2 is defined as the positive direction of the Z axis (also referred to as "upper direction"). In addition, the state seen from the positive direction (upward) of the Z axis is also referred to as a "plan view" below. The X-axis, the Y-axis, and the Z-axis are imaginary axes, and the arrows representing "X", "Y", and "Z" in the drawings are only for illustration, and are not accompanied by a substance. Furthermore, these orientations are not meant to limit the orientation of the mounting system 100 in use.

In addition, in the installation system 100, pipes for circulating cooling water, cables for power supply, pipes for supplying air pressure (including positive pressure and vacuum), and the like are connected, but in this configuration example, these figures are appropriately omitted. Show.

(2.2) Overall structure

Next, the overall configuration of the mounting system 100 according to the present configuration example will be described with reference to FIG. 1 .

As shown in FIG. 1 , a mounting system 100 according to this configuration example includes a mounting head 1 and one or more imaging devices 2 . Further, in this configuration example, as shown in FIG. 3 , the mounting system 100 includes, in addition to the mounting head 1 and the imaging device 2 , a drive device 3 , a component supply device 4 , a conveying device 5 , a support device 6 , and a control device 7 . and lighting device 8 . However, the driving device 3 , the component supplying device 4 , the conveying device 5 , the supporting device 6 , the control device 7 , and the lighting device 8 are not essential structures of the mounting system 100 . That is, at least one of the drive device 3 , the component supply device 4 , the conveyance device 5 , the support device 6 , the control device 7 , and the lighting device 8 may not be included in the structural elements of the mounting system 100 . In addition, in FIG. 1, only the mounting head 1, the imaging device 2, and the drive device 3 are shown, and illustration of the structure of the other mounting system 100 is abbreviate|omitted suitably.

The mounting head 1 has one or more catch parts 11 . In the present configuration example, the mounting head 1 has a plurality of (16 as an example) capturing portions 11 . The mounting head 1 moves the capturing unit 11 close to the second object T2 (substrate) in a state where the first object T1 (component) is captured by the capturing unit 11 to mount the first object T1 on the second object Mounting surface T21 of T2.

The imaging device 2 is fixed to the mounting head 1 . In the present configuration example, the mounting system 100 includes a plurality of (nine as an example) imaging devices 2 . The imaging device 2 includes an imaging element 21 and an optical system 22 . The imaging device 2 is, for example, a still camera that captures still images. As described above, the imaging device 2 includes the specific region R1 facing the capturing portion 11 on the mounting surface T21 of the second object T2 (substrate) in the imaging field of view R10 (see FIG. 2 ).

One or more imaging devices 2 together with the mounting head 1 constitute a head unit 10 . That is, the head unit 10 according to this configuration example includes the mounting head 1 and the imaging device 2 . In other words, the mounting system 100 according to the present configuration example includes a head unit 10 including a mounting head 1 and an imaging device 2 , a drive device 3 , a component supply device 4 , a transport device 5 , a support device 6 , a control device 7 , and an illumination device 8 . . The mounting head 1 and the camera device 2 constituting the head unit 10 will be described in detail in the columns of "(2.3) Mounting head" and "(2.4) Camera device", respectively.

The drive device 3 is a device that moves the mounting head 1 . In this configuration example, the drive device 3 moves the mounting head 1 in the X-Y plane. The "X-Y plane" referred to here is a plane including the X axis and the Y axis, and is a plane orthogonal to the Z axis. In other words, the drive device 3 moves the mounting head 1 in the X-axis direction and the Y-axis direction.

In this configuration example, since the imaging device 2 is fixed to the mounting head 1 , the driving device 3 also moves the imaging device 2 together with the mounting head 1 . That is, the mounting head 1 and each imaging device 2 constituting the head unit 10 together with the mounting head 1 are driven in the X-Y plane by the driving device 3 . In other words, the drive device 3 moves the head unit 10 including the mounting head 1 and the imaging device 2 in the X-Y plane.

Specifically, as shown in FIG. 1 , the drive device 3 includes an X-axis drive unit 31 and a Y-axis drive unit 32 . The X-axis drive unit 31 moves the mounting head 1 straight in the X-axis direction. The Y-axis drive unit 32 moves the mounting head 1 straight in the Y-axis direction. The Y-axis drive unit 32 moves the mounting head 1 straight in the Y-axis direction by moving the mounting head 1 along the Y-axis for each X-axis drive unit 31 . In this configuration example, as an example, the X-axis drive unit 31 and the Y-axis drive unit 32 each include a linear motor, and the mounting head 1 (head unit 10 ) is moved by receiving a driving force generated by the linear motor by power supply.

The component supply device 4 supplies the component as the first object T1 captured by the capture unit 11 of the mounting head 1 . As an example, the components supply apparatus 4 has a tape feeder which supplies components accommodated in a carrier tape. Alternatively, the components supply device 4 may have a tray on which a plurality of components are placed. The mounting head 1 captures the first object T1 (component) by the capture unit 11 from such a component supply device 4 .

The conveying device 5 is a device that conveys the substrate as the second object T2. The conveying device 5 is realized by, for example, a belt conveyor or the like. The conveying device 5 conveys, for example, the second object T2 (substrate) along the X-axis. The conveying device 5 conveys the second object T2 at least in the mounting space below the mounting head 1 , that is, in the mounting space facing the capturing section 11 in the Z-axis direction. Then, the conveying device 5 stops the second object T2 in the mounting space before the mounting of the first object T1 (component) to the second object T2 (substrate) by the mounting head 1 is completed.

The support apparatus 6 supports the board|substrate which is the 2nd object T2 conveyed by the conveyance apparatus 5 to the installation space. That is, the second object T2 (substrate) conveyed to the installation space by the conveyance device 5 is held in the installation space by the support device 6 . The support device 6 supports the second object T2 in the mounting space at least until the mounting of the first object T1 (component) to the second object T2 (substrate) by the mounting head 1 is completed.

The control device 7 controls the various parts of the mounting system 100 . The control device 7 is mainly composed of a microcontroller having one or more processors and one or more memories. That is, the processor of the microcontroller executes the program recorded in the memory of the microcontroller, thereby realizing the function of the control device 7 . The program may be pre-recorded in a memory, may be provided through an electric communication line such as the Internet, or may be provided by being recorded in a non-transitory recording medium such as a memory card.

The control device 7 is electrically connected to, for example, the mounting head 1 , the imaging device 2 , the driving device 3 , the component supply device 4 , the conveying device 5 , the support device 6 , and the lighting device 8 , respectively. The control device 7 outputs a control signal to the mounting head 1 and the driving device 3 to control the mounting head 1 and the driving device 3 so that at least the first object T1 captured by the capture unit 11 is mounted on the mounting surface T21 of the second object T2. Further, the control device 7 outputs a control signal to the imaging device 2 and the lighting device 8 , controls the imaging device 2 and the lighting device 8 , and acquires an image captured by the imaging device 2 from the imaging device 2 .

The illumination device 8 illuminates the imaging field of view R10 of the imaging device 2 . The illumination device 8 only needs to illuminate the imaging field of view R10 at least at the timing of the imaging by the imaging device 2 , and, for example, emit light in accordance with the imaging timing of the imaging device 2 . In this configuration example, since the image captured by the imaging device 2 is a full-color still image, the illuminating device 8 outputs light in the wavelength region of the visible light region, such as white light. In the present configuration example, as an example, the lighting device 8 includes a plurality of light sources such as LEDs (Light Emitting Diodes). The illumination device 8 illuminates the imaging field of view R10 of the imaging device 2 by emitting light of these plurality of light sources. The lighting device 8 is realized by a suitable lighting method such as ring lighting or coaxial epi-illumination, for example.

The lighting device 8 is fixed to the mounting head 1 together with, for example, the imaging device 2 . Furthermore, the lighting device 8 constitutes a head unit 10 together with one or more imaging devices 2 and the mounting head 1 . That is, the head unit 10 according to this configuration example includes the lighting device 8 in addition to the mounting head 1 and the imaging device 2 .

Further, the mounting system 100 includes, for example, a communication unit and the like, in addition to the above-described configuration. The communication unit is configured to communicate with the upper system directly or indirectly via a network, a repeater, or the like. Thereby, the installation system 100 can exchange data with a higher-level system.

(2.3) Mounting head

Next, a more detailed configuration of the mounting head 1 will be described with reference to C of FIGS. 1 to 4 .

In this configuration example, the mounting head 1 includes an actuator 12 (refer to FIG. 3 ) for moving the capture portion 11 , and a head body 13 that holds the capture portion 11 and the actuator 12 in addition to the capture portion 11 . In the mounting system 100 according to the present configuration example, a plurality of (16 as an example) catching parts 11 and actuators 12 are respectively held in one head main body 13 . Thereby, in the mounting head 1, a plurality of (here, 16) first objects T1 (components) can be captured at the same time.

The capturing part 11 is, for example, a suction nozzle. The capture unit 11 is controlled by the control device 7 and can switch between a capture state in which the first object T1 is captured (held) and a release state in which the first object T1 is released (released from capture). However, the capturing unit 11 is not limited to the suction nozzle, and may be configured to capture (hold) the first object T1 by gripping (pinch), for example, like a robot hand.

Regarding the capture of the first object T1 by the capture unit 11 , the mounting head 1 operates by receiving the supply of air pressure (vacuum) as power. That is, the mounting head 1 switches the capture state and the release state of the capture part 11 by opening and closing the valve on the supply path of the air pressure (vacuum) connected to the capture part 11 .

The actuator 12 moves the capturing portion 11 straight in the Z-axis direction. Furthermore, the actuator 12 rotationally moves the capture part 11 in the rotational direction (hereinafter, referred to as "theta direction") centered on the axis along the Z-axis direction. In the present configuration example, as an example, the actuator 12 is driven by the driving force generated by the linear motor with respect to the movement of the capture portion 11 in the Z-axis direction. As for the movement of the capturing part 11 in the θ direction, the actuator 12 is driven by the driving force generated by the rotary motor. On the other hand, as described above, the mounting head 1 is moved straight in the X-axis direction and the Y-axis direction by the drive device 3 . As a result, the catching portion 11 included in the mounting head 1 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction by the drive device 3 and the actuator 12 .

Here, regarding the movement in the X-axis direction and the Y-axis direction, the plurality of capturing portions 11 included in the mounting head 1 move integrally. On the other hand, regarding the movement in the Z-axis direction and the θ direction, the plurality of capturing parts 11 included in the mounting head 1 move independently. Furthermore, the plurality of catch parts 11 included in the mounting head 1 can switch the catch state and the release state independently of each other.

As an example, the head main body 13 is made of metal and formed in a rectangular parallelepiped shape. By assembling the plurality of capturing portions 11 and the actuators 12 to the head main body 13 , the head main body 13 holds the capturing portions 11 and the actuators 12 . In the present configuration example, the capturing portion 11 is indirectly held by the head main body 13 via the actuator 12 in a state capable of moving in the Z-axis direction and the θ direction. The mounting head 1 is moved in the X-Y plane by moving the head main body 13 in the drive device 3 in the X-Y plane. In A of FIG. 4 , the head main body 13 is represented by an imaginary line (two-dot chain line).

According to the above-described configuration, the mounting head 1 can move the capturing portion 11 to approach the second object T2 (substrate) in a state where the first object T1 (component) is captured by the capturing portion 11 to mount the first object T1 on the mounting surface T21 of the second object T2. That is, the mounting head 1 moves the capturing portion 11 between at least a first position facing the mounting surface T21 of the second object T2 and a second position farther from the mounting surface T21 than the first position. Here, in FIG. 2 , the capture unit 11 and the first object T1 when the capture unit 11 is at the first position are indicated by solid lines, and the capture unit 11 when the capture unit 11 is at the second position is indicated by an imaginary line (two-dot chain line). The capturing unit 11 and the first object T1. In short, the mounting head 1 mounts the first object T1 on the mounting surface T21 of the second object T2 by moving the capturing portion 11 in a state of capturing the first object T1 from the second position to the first position.

However, in the present configuration example, the mounting head 1 has a plurality of (16 as an example) capturing portions 11 . As shown in FIG. 4A to FIG. 4C , the plurality of capturing units 11 are classified into a first capturing unit group G1 and a second capturing unit group G2 . Each of the first capturing portion group G1 and the second capturing portion group G2 includes two or more capturing portions 11 arranged along the X-axis direction (first direction). The first capturing portion group G1 and the second capturing portion group G2 face each other in the Y-axis direction (second direction) orthogonal to the X-axis direction (first direction) in plan view.

Specifically, as shown in FIG. 4A to FIG. 4C , the mounting head 1 includes the eight capture parts 11 constituting the first capture part group G1 and the eight capture parts 11 constituting the second capture part group G2 . The eight capture parts 11 constituting the first capture part group G1 are arranged in a row along the X axis. The eight capture parts 11 constituting the second capture part group G2 are arranged in a row along the X axis. Furthermore, the capturing portions 11 constituting the first capturing portion group G1 and the capturing portions 11 constituting the second capturing portion group G2 face each other in the Y-axis direction.

Here, the eight capturing units 11 constituting the first capturing unit group G1 and the eight capturing units 11 constituting the second capturing unit group G2 are arranged at equal intervals in the X-axis direction. Furthermore, the eight capturing portions 11 constituting the first capturing portion group G1 and the eight capturing portions 11 constituting the second capturing portion group G2 are arranged at predetermined intervals in the Y-axis direction (second direction). Opposite. In this configuration example, as an example, the interval between the two capturing portions 11 adjacent in the Y-axis direction is wider than the interval between the two capturing portions 11 adjacent in the X-axis direction.

(2.4) Camera device

Next, a more detailed configuration of the imaging device 2 will be described with reference to FIGS. 1 to 5 .

In this configuration example, as shown in FIGS. 2 and 3 , the imaging device 2 includes an imaging element 21 and an optical system 22 . The optical system 22 images the image Im1 of the imaging field of view R10 including the specific region R1 on the imaging element 21 (see FIG. 6B ).

The imaging element 21 is, for example, an image sensor such as a CCD (Charge Coupled Devices, charge coupled device) or a CMOS (Complementary Metal-Oxide Semiconductor, complementary metal oxide semiconductor). The imaging element 21 converts the image formed on the light-receiving surface into an electric signal and outputs it.

The optical system 22 includes one or more lenses, mirrors, and the like. In this configuration example, the optical system 22 is realized by a combination (lens group) of a plurality of lenses, as an example. The optical system 22 forms an image of the light from the imaging field R10 shown in FIG. 2 on the light-receiving surface of the imaging element 21 . In this configuration example, the optical system 22 of the imaging device 2 is a non-telecentric optical system. That is, unlike a telecentric optical system in which the chief ray is parallel to the optical axis (image pickup optical axis Ax1 ) in the entire optical system, in the imaging device 2 , the chief ray is inclined with respect to the optical axis (image pickup optical axis Ax1 ).

However, as shown in FIG. 2 , the imaging device 2 includes, in the imaging field of view R10 , a specific region R1 facing the capturing portion 11 in the direction (Z-axis direction) perpendicular to the mounting surface T21 among the mounting surfaces T21 . In other words, the imaging device 2 includes in the imaging field R10 a region directly below the capturing portion 11 of the mounting surface T21 as the specific region R1 in a state where the capturing portion 11 is positioned on the mounting surface T21 of the second object T2. Therefore, in the imaging device 2 , it is possible to capture an image of the area immediately below the capture unit 11 .

Specifically, the imaging device 2 is fixed to the mounting head 1 by the head main body 13 held by the mounting head 1 . Here, the imaging device 2 is held by the head body 13 by being fixed to the lower surface of the head body 13 , that is, the surface of the head body 13 facing the second object T2 . Since the capture unit 11 is arranged on the lower surface of the head main body 13 , the imaging device 2 is arranged on the side of the capture unit 11 in plan view.

Here, as described above, the imaging device 2 has the imaging optical axis Ax1 perpendicular to the mounting surface T21. That is, the imaging device 2 is fixed to the mounting head 1 in such a posture that the imaging optical axis Ax1 is orthogonal to the mounting surface T21. As described above, the term "orthogonal" here includes not only a state in which the angle between the two is 90 degrees in a strict sense, but also a state in which the two are substantially orthogonal within a range of a certain degree of error. Therefore, the angle between the imaging optical axis Ax1 of the imaging device 2 and the mounting surface T21 may be 90 degrees in a strict sense, or may be a range with a certain degree of error (for example, 10 degrees or less) with respect to 90 degrees. Inside. In other words, the imaging optical axis Ax1 of the imaging device 2 should just be an axis along the vertical line of the mounting surface T21.

In other words, the imaging optical axis Ax1 of the imaging device 2 is substantially parallel to the Z axis, and faces directly below the imaging device 2 . In this way, the imaging device 2 is arranged on the side of the capture unit 11 , and the imaging optical axis Ax1 is directed directly downward along the Z axis, so that the specific region R1 directly below the capture unit 11 can be captured.

In addition, in this configuration example, the specific region R1 directly below the two or more capturing units 11 is covered with one imaging device 2 . That is, in the present configuration example, as described above, the mounting head 1 has a plurality of (two or more) capturing portions 11 . The specific region R1 included in the imaging field of view R10 of one imaging device 2 is a region facing the plurality (two or more) of the capturing units 11 in the direction perpendicular to the mounting surface T21 among the mounting surfaces T21. In other words, the imaging field of view R10 of one imaging device 2 includes the specific regions R1 directly below the two or more capture units 11 , that is, the plurality of specific regions R1 . Therefore, the mounting system 100 according to the present configuration example can image the area directly below the two or more capturing units 11 with one imaging device 2 .

Here, the imaging device 2 is positioned between two capturing units 11 among the plurality of capturing units 11 in a plan view. In the present disclosure, "between" two parts means being located between the two parts in the direction in which the two parts are arranged. That is, C located between A and B arranged in the X-axis direction may be located between A and B in the X-axis direction, and does not necessarily have to be in a straight line connecting A and B. In other words, if C exists between the Y-Z plane orthogonal to the line connecting A and B (the line extending in the X-axis direction) and between the Y-Z plane including A and the Y-Z plane including B, then C is located between A and B between.

Furthermore, one imaging device 2 positioned between the two capture units 11 includes a specific area R1 directly below the two capture units 11 in the imaging field of view R10 . That is, the imaging field of view R10 of one imaging device 2 includes at least the specific region R1 located directly below the two capturing portions 11 on both sides of the imaging device 2 . In this configuration example, as an example, the mounting head 1 has 16 capture parts 11 , and one imaging device 2 covers the specific region R1 directly below two or four capture parts 11 among the plurality of capture parts 11 . In other words, one imaging device 2 includes two or four specific regions R1 in the imaging field of view R10.

More specifically, as described above, the mounting system 100 according to the present configuration example includes a plurality of (nine as an example) imaging devices 2 . Among the plurality of imaging devices 2, all of the plurality of (here, 16) capturing units 11 can include the specific region R1 in the imaging field of view R10.

That is, as shown in FIG. 4A to FIG. 4C , a plurality of (nine in this case) imaging devices 2 are arranged in a row along the X-axis direction (first direction). On the other hand, as described above, the mounting head 1 includes the first capture unit group G1 and the second capture unit group G2 each including the eight capture units 11 arranged along the X-axis direction (first direction). Nine imaging units The device 2 is arranged between the first capture unit group G1 and the second capture unit group G2 divided into the above-mentioned two rows.

Here, the nine imaging devices 2 are arranged at equal intervals in the X-axis direction. Furthermore, each imaging device 2 is located at the center (middle) of the eight capturing units 11 constituting the first capturing unit group G1 and the eight capturing units 11 constituting the second capturing unit group G2 in the Y-axis direction (second direction). In addition, among the nine imaging devices 2 , the seven imaging devices 2 other than the two imaging devices 2 serving as both ends in the X-axis direction are all arranged at positions equidistant from the four capturing units 11 .

According to such an arrangement, with respect to the seven imaging devices 2 excluding the two imaging devices 2 serving as both ends in the X-axis direction among the nine imaging devices 2 , the four capturing units 11 are all located around. Therefore, in each of these seven imaging devices 2 , the imaging field of view R10 includes the specific region R1 immediately below the four surrounding capture units 11 . That is, the imaging field of view R10 of each of the seven imaging devices 2 includes at least the specific region R1 immediately below the four capturing units 11 located around the imaging devices 2 . In other words, each of these seven imaging devices 2 includes four specific regions R1 in the imaging field of view R10 .

In addition, with respect to the two imaging apparatuses 2 serving as both ends in the X-axis direction among the nine imaging apparatuses 2 , the two capturing units 11 are located in the periphery. Therefore, in each of these two imaging devices 2, the imaging field R10 includes a specific region R1 immediately below the two surrounding capture units 11. That is, each imaging field of view R10 of the two imaging devices 2 includes at least a specific region R1 located directly below the two capturing portions 11 around the imaging devices 2 . In other words, these two imaging devices 2 (which become both ends in the X-axis direction) each include two specific regions R1 in the imaging field of view R10 .

However, in the mounting system 100 according to this configuration example, when the imaging field of view R10 is divided into the central portion R101 and the peripheral portion R102 as shown in FIG. The central portion R101 is relatively high resolution. FIG. 5 is an explanatory diagram schematically showing an imaging field of view R10 of the imaging device 2 in a plan view. In the example of FIG. 5 , the central portion R101 is a circular region located at the center of the imaging field of view R10 of each imaging device 2 , and the peripheral portion R102 is an annular region surrounding the central portion R101 . In other words, in the imaging field of view R10, an area along the outer periphery in a plan view is the peripheral portion R102, and an area surrounded by the peripheral portion R102 is the central portion R101. In FIG. 5 , the hatched (dotted hatched) area represents the peripheral portion R102.

The “resolution” referred to in the present disclosure refers to the combined performance of the imaging element 21 and the optical system 22 . That is, as an example of an index indicating the performance of the optical system 22, there is a modulation transfer function (MTF: Modulation Transfer Function) characteristic, which simultaneously indicates both the resolution and the contrast of the optical system 22 (lens). In this configuration example, since the peripheral portion R102 has a higher resolution than the central portion R101 of the imaging field of view R10, the MTF characteristic of the peripheral portion R102 is higher (good) than the central portion R101. Therefore, the subject included in the peripheral portion R102 can be captured by the imaging device 2 with higher precision than the subject included in the central portion R101 of the imaging field of view R10 .

Here, in the present configuration example, as described above, the imaging device 2 is arranged on the side of the capture unit 11 , and the imaging optical axis Ax1 is directed directly downward along the Z axis, so that a specific area directly below the capture unit 11 can be captured. R1. That is, the imaging device 2 captures the specific region R1 not in the central portion R101 of the imaging field of view R10 but in the peripheral portion R102 of the imaging field of view R10 , thereby enabling imaging of the specific region R1 directly below the capture portion 11 . In other words, when the imaging field R10 of the imaging device 2 is divided into the central portion R101 and the peripheral portion R102 , the specific region R1 is included in the peripheral portion R102 of the imaging field R10 of the imaging device 2 .

Furthermore, the peripheral portion R102 including the specific region R1 has a higher resolution than the central portion R101 in the imaging field of view R10. Therefore, the imaging device 2 can capture the specific region R1 in the peripheral portion R102 of the imaging field of view R10, and can obtain a higher-resolution image of the specific region R1 (compared with the central portion R101).

Furthermore, the structure in which the peripheral portion R102 of the imaging device 2 has a higher resolution than the central portion R101 of the imaging field of view R10 can be used independently from the structure in which the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21 . That is, the mounting system 100 includes the mounting head 1 and the imaging device 2 . The mounting head 1 has a catch portion 11 . The mounting head 1 moves the capturing portion 11 to approach the second object T2 in a state where the first object T1 is captured by the capturing portion 11, and mounts the first object T1 on the mounting surface T21 of the second object T2. The imaging device 2 is fixed to the mounting head 1 . The imaging device 2 includes, in the imaging field of view R10 , a specific region R1 facing the capturing portion 11 in the direction perpendicular to the mounting surface T21 among the mounting surfaces T21 . Here, when the imaging field of view R10 is divided into the central portion R101 and the peripheral portion R102, in the imaging device 2, the peripheral portion R102 has a higher resolution than the central portion R101 of the imaging field of view R10. In this case, the imaging optical axis Ax1 of the imaging device 2 does not necessarily have to be perpendicular to the mounting surface T21, and the imaging optical axis Ax1 of the imaging device 2 may be inclined with respect to the vertical line of the mounting surface T21.

Furthermore, as shown in FIG. 5 , in the mounting system 100 according to the present configuration example, two imaging devices 2 of a plurality of (nine in this case) imaging devices 2 are used as the first imaging device 201 and the second imaging device 202, thereby realizing a stereo camera. That is, in the present configuration example, two imaging devices 2 (the first imaging device 201 and the second imaging device 202 ) that are adjacent in the X-axis direction among the nine imaging devices 2 can obtain a stereo camera method. Distance information to the subject.

In short, the mounting system 100 according to this configuration example further includes a second imaging device 202 that is fixed to the mounting head 1 and includes a specific region R1 in the imaging field of view R10 , unlike the first imaging device 201 serving as the imaging device 2 . The second imaging field of view R200 , which is the imaging field of view R10 of the second imaging device 202 , includes a different area from the first imaging field of view R100 , which is the imaging field of view R10 of the first imaging device 201 . The specific region R1 includes a region overlapping the first imaging field of view R100 and the second imaging field of view R200.

Accordingly, the specific region R1 directly below the capture unit 11 is included in both the imaging field of view R10 (first imaging field of view R100 ) of the first imaging device 201 and the imaging field of view R10 (second imaging field of view R200 ) of the second imaging device 202 square. Therefore, a stereoscopic image of the specific region R1 can be obtained from the outputs of both the first imaging device 201 and the second imaging device 202 . Therefore, the mounting system 100 can acquire the distance information indicating the distance from the mounting head 1 with respect to the subject in the specific area R1 by the stereo camera method. As a result, the mounting system 100 can three-dimensionally capture the subject within the specific region R1.

Here, in this configuration example, all of the nine imaging devices 2 have a common configuration. Therefore, the first imaging device 201 may be any imaging device 2 among the nine imaging devices 2 , and the second imaging device 202 may be any imaging device 2 adjacent to the first imaging device 201 . For example, any imaging device of the first imaging device 201 and the second imaging device 202 has an imaging optical axis Ax1 perpendicular to the mounting surface T21. In addition, in any imaging device of the first imaging device 201 and the second imaging device 202, when the imaging field of view is divided into the central portion R101 and the peripheral portion R102, the peripheral portion R102 and the central portion R101 of the imaging field of view R10 compared to high resolution.

In particular, in this configuration example, the capture unit 11 is positioned between the first imaging device 201 and the second imaging device 202 in a plan view. More specifically, the capture unit 11 located between the first imaging device 201 and the second imaging device 202 is located at the center (middle) of the first imaging device 201 and the second imaging device 202 in the X-axis direction. Thereby, as shown in FIG. 5 , the peripheral portion R102 of the imaging field of view R10 (first imaging field of view R100 ) of the first imaging device 201 and the periphery of the imaging field of view R10 (second imaging field of view R200 ) of the second imaging device 202 can be The repeating portion of the portion R102 is aligned with the specific region R1. Therefore, according to the first imaging device 201 and the second imaging device 202, it is possible to capture the subject in the specific region R1 three-dimensionally and with a relatively high resolution (compared to the central portion R101).

In addition, in the present configuration example, as described above, the mounting head 1 has the eight capture parts 11 that constitute the first capture part group G1 and the eight capture parts 11 that constitute the second capture part group G2. Here, as shown in FIG. 4A , the first imaging device 201 and the second imaging device 202 are located between the first capturing unit group G1 and the second capturing unit group G2 in a plan view. In short, in this configuration example, nine imaging devices 2 including two imaging devices 2 that can be the first imaging device 201 and the second imaging device 202 are arranged in the first capturing unit group G1 and the second capturing unit group between G2. Therefore, the first imaging device 201 and the second imaging device 202 are located between the first capturing unit group G1 and the second capturing unit group G2 in plan view.

(3) Camera method

Next, the imaging method according to this configuration example will be described with reference to FIG. 6A , FIG. 6B , and FIG. 7 .

The imaging method according to this configuration example is an imaging method for the mounting system 100 including the mounting head 1 . The mounting head 1 has a catch portion 11 . The mounting head 1 moves the capturing portion 11 to approach the second object T2 in a state where the first object T1 is captured by the capturing portion 11, and mounts the first object T1 on the mounting surface T21 of the second object T2. The above-described imaging method includes the step of imaging the specific region R1 with the imaging device 2 . The imaging device 2 is fixed to the mounting head 1 . The imaging device 2 includes a specific region R1 facing the capturing portion 11 in the direction perpendicular to the mounting surface T21 among the mounting surface T21 in the imaging field of view R10, and has an imaging optical axis Ax1 perpendicular to the mounting surface T21.

That is, the imaging method according to the present configuration example is a method of imaging the specific region R1 using the mounting system 100 according to the present configuration example. In this imaging method, the imaging device 2 that includes the specific region R1 facing the capture unit 11 in the direction perpendicular to the mounting surface T21 in the imaging field of view R10 captures the specific region R1 . Therefore, it is possible to image at least the area immediately below the capturing portion 11 in the mounting surface T21. Furthermore, since the imaging optical axis Ax1 of the imaging device 2 is perpendicular to the mounting surface T21, the imaging device 2 can be arranged in a posture orthogonal to the mounting surface T21.

In this imaging method, the imaging optical axis Ax1 of the imaging device 2 is not directed toward the specific region R1, but the imaging optical axis Ax1 of the imaging device 2 is deliberately directed outside the specific region R1, so that the specific region R1 is reflected in the specific region R1. The end of the imaging field of view R10. Thereby, the imaging optical axis Ax1 of the imaging device 2 can be made perpendicular to the mounting surface T21. Therefore, for example, the occupied area of the imaging device 2 in the plane parallel to the mounting surface T21 is suppressed to be small, and there are advantages such as being less likely to be restricted by the moving range of the imaging device 2 with respect to the mounting head 1 . Therefore, an imaging method more suitable for imaging of the specific region R1 can be provided.

Then, according to the above-described imaging method, for example, as shown in FIG. 6A , the first object T1 is attached to the specific region R1 directly below the capturing portion 11 in the attachment surface T21 of the second object T2 (substrate) In the state of the (component), the first object T1 can be imaged by the imaging device 2 . That is, in the state of A in FIG. 6 , in any of the imaging devices 2 , as shown in B in FIG. 6 , an image Im1 in a state in which the first object T1 is reflected in the specific region R1 is obtained. The image Im1 shown in B of FIG. 6 is formed by any of the imaging devices 2 including the four specific regions R1 in the imaging field of view R10 , that is, any of the seven imaging devices 2 excluding the two imaging devices 2 at both ends in the X-axis direction image obtained by the camera.

In this way, according to the imaging method according to the present configuration example, the imaging device 2 can image the first object T1 located in the specific region R1 directly below the capture unit 11 . Here, since the imaging device 2 captures the specific region R1 not in the central portion R101 of the imaging field of view R10 but in the peripheral portion R102 of the imaging field of view R10, as shown in B of FIG. 6 , the first object T1 is reflected in the image Im1. The surrounding area (here, the four corners). Furthermore, in this configuration example, since the peripheral portion R102 has a higher resolution than the central portion R101 of the imaging field of view R10, it is possible to image the first portion located in the specific region R1 with a relatively high resolution (compared with the central portion R101). An object T1. In addition, in this imaging method, the first imaging device 201 and the second imaging device 202 can three-dimensionally capture the first object T1 in the specific region R1 by a stereo camera method.

FIG. 7 is a flowchart showing the overall operation of the mounting system 100 including the imaging method according to the present configuration example.

First, the installation system 100 executes the capturing step S1. In the capturing step S1, the mounting system 100 moves (descends) the capturing section 11 located above the first object T1 (component) supplied from the component supplying device 4 in the direction of approaching the components supplying device 4 (first object T1). ), the first object T1 is captured by the capture unit 11 . Then, the mounting system 100 moves (raises) the capturing unit 11 in a state of capturing the first object T1 in a direction away from the component supply device 4 (the first object T1 ). In the present configuration example, since the mounting head 1 includes a plurality of capturing units 11 , in the capturing step S1 , the mounting system 100 drives the plurality of capturing units 11 to be captured by the respective capturing units of the plurality of capturing units 11 . The first object T1. After capturing the first object T1, the mounting system 100 drives the mounting head 1 using the drive device 3, and moves the capturing unit 11 in a state of capturing the first object T1 toward the second object T2.

Next, the mounting system 100 implements the imaging method according to this configuration example ( S2 ). That is, the mounting system 100 uses the imaging device 2 to capture the image of the specific region R1 directly below the capturing portion 11 in a state where the capturing portion 11 is positioned on the second object T2 ( S2 ).

When the specific region R1 is captured by the imaging device 2, the imaging device 2 outputs the obtained image Im1 to the control device 7 (S3). The control device 7 may record only the image Im1 acquired from the imaging device 2, or may analyze the image Im1 acquired from the imaging device 2 in real time.

In the attaching step S4, the attaching system 100 moves (descends) the capturing portion 11 located above the second object T2 in the direction of approaching the second object T2, and attaches the first object T1 to the second object T2. Mounting surface T21. That is, when the first object T1 reaches the mounting surface T21 of the second object T2, the mounting system 100 releases the capture by the capturing unit 11 and releases the first object T1. Then, the mounting system 100 moves (raises) the capturing part 11 that has released the first object T1 in a direction away from the second object T2. In the present configuration example, since the mounting head 1 includes the plurality of catch parts 11, in the mounting step S4, the mounting system 100 drives the plurality of catch parts 11 to mount using each catch part of the plurality of catch parts 11. The first object T1.

From the image Im1 obtained by the above-described imaging method ( S2 ), for example, the state of the mounting surface T21 before mounting of the first object T1 , the state of application of solder paste, the presence or absence of foreign matter, or deformation, etc. confirm. In particular, in this configuration example, since the specific region R1 directly below the capture unit 11 can be imaged, it is easy to confirm the mounting surface T21 immediately before the first object T1 is mounted.

The flowchart in FIG. 7 is merely an example of the overall operation of the installation system 100, and processing may be omitted or added as appropriate, and the order of processing may be appropriately changed. For example, after the mounting step S4, if the specific region R1 directly below the capture unit 11 is photographed by the imaging device 2, the state of the mounting surface T21 after the mounting of the first object T1 can be performed. The normality/abnormality of the attachment of the one object T1, the orientation of the first object T1, the shortage, etc. are checked. In particular, in the present configuration example, since the specific region R1 directly below the capture portion 11 can be imaged, the attachment surface T21 immediately after the attachment of the first object T1 can be easily confirmed.

In addition, in the middle of the mounting step S4, if the imaging device 2 captures the image of the specific region R1 directly below the capture unit 11, the state of the mounting surface T21 during the mounting of the first object T1 can be obtained. As an example, The capture state and the like of the first object T1 in the capture unit 11 are checked. In particular, in this configuration example, since the specific region R1 directly below the capture unit 11 can be imaged, the mounting surface T21 can be easily confirmed even during the mounting of the first object T1.

(4) Modifications

The basic structure is but one of various embodiments of the present disclosure. As long as the object of the present disclosure can be achieved, the basic structure can be variously changed according to design and the like. In addition, the drawings referred to in the present disclosure are schematic drawings, and the respective ratios of the sizes and thicknesses of the respective structural elements in the drawings do not necessarily reflect the actual dimensional ratios. In addition, the same functions as those of the imaging method according to the basic configuration can also be embodied by installing the system 100 , a (computer) program, or a non-transitory recording medium in which the program is recorded. The program according to one aspect is a program for causing one or more processors to execute the imaging method according to the basic structure.

Hereinafter, modification examples of the basic structure will be listed. The modifications described below can be applied in combination as appropriate.

The installation system 100 in the present disclosure includes, for example, a computer system in the control device 7 or the like. A computer system has a processor as hardware and a memory as the main structures. The function as the installation system 100 in the present disclosure is realized by executing the program recorded in the memory of the computer system by the processor. The program may be pre-recorded in the memory of the computer system, provided via an electrical communication line, or provided by being recorded in a non-transitory recording medium such as a memory card, optical disc, hard disk drive, etc. readable by the computer system. The processor of the computer system is composed of one to a plurality of electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). The integrated circuits such as IC or LSI mentioned here are called differently depending on the degree of integration, including system LSI, VLSI (Very Large Scale Integration, very large scale integration), or ULSI (Ultra Large Scale Integration, very large scale integrated circuit). integrated circuit. Furthermore, it is also possible to use an FPGA (Field-Programmable Gate Array) that can be programmed after the manufacture of an LSI, or a logic device that can perform reconfiguration of the bonding relationship in the LSI or reconfiguration of the circuit division in the LSI. Use a processor. A plurality of electronic circuits may be integrated into one chip, or may be distributed over a plurality of chips. A plurality of chips may be integrated in one device or distributed in a plurality of devices. A computer system as referred to herein includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also constituted by 1 to a plurality of electronic circuits including semiconductor integrated circuits or large scale integrated circuits.

In addition, a structure in which a plurality of functions in the installation system 100 are integrated into one housing is not an essential structure of the installation system 100 . The components of the mounting system 100 may be distributed and provided in a plurality of housings. Furthermore, at least a part of the functions of the installation system 100 may be realized by a cloud (cloud computing) or the like.

Conversely, in the basic structure, the functions of at least a part of the mounting system 100 dispersed in a plurality of devices may be integrated into one housing. For example, part of the functions dispersed in the mounting head 1 and the control device 7 may all be integrated into the mounting head 1 .

Furthermore, the use of the mounting system 100 is not limited to the manufacture of electronic equipment in a factory. For example, when the mounting system 100 is used for mounting a mechanical component to a glass plate, the mounting system 100 performs the operation of mounting the mechanical component as the first object T1 to the glass plate as the second object T2.

In addition, the number of capturing sections 11 and the number of imaging devices 2 included in the head unit 10 are not limited to those described in the basic configuration. For example, the number of capturing units 11 may be 15 or less or 17 or more, and the number of imaging devices 2 may be 8 or less or 10 or more. Of course, the head unit 10 may include only one capture unit 11 , or may include only one camera device 2 . Furthermore, the arrangement of the capturing unit 11 and the imaging device 2 is not limited to the arrangement described in the basic configuration, and can be appropriately changed.

In addition, the imaging device 2 is not limited to a still camera capable of capturing full-color still images, and may be, for example, a camera capable of capturing monochrome images, a camera capable of capturing moving images, or a line sensor.

Further, the peripheral portion R102 of the imaging field of view R10 is not limited to a ring shape of a perfect circle, and may be a ring shape including an ellipse, a triangle, a polygon, or a free-form curve.

(Embodiment 1)

As shown in FIG. 8A and FIG. 8B , the mounting system 100A according to the present embodiment includes the imaging device 2 in addition to the first specific region R1 as the specific region R1 in the imaging field of view R10 of the imaging device 2 . The second specific region R2 is included in the imaging field of view R10 of , which is different from the mounting system 100 involved in the basic configuration. Hereinafter, the same reference numerals are assigned to the same configuration as the basic configuration, and the description is appropriately omitted.

The mounting system 100A includes a mounting head 1 and an imaging device 2 . The mounting head 1 has the capture part 11 which captures the 1st object T1. The mounting head 1 moves the capturing portion 11 between the first position and the second position, and mounts the first object T1 on the mounting surface T21. The first position is a position facing the mounting surface T21 of the second object T2. The second position is a position farther from the mounting surface T21 than the first position. The imaging device 2 includes a first specific region R1 and a second specific region R2 in the imaging field of view R10. The first specific region R1 is a region of the mounting surface T21 facing the capturing portion 11 located at the first position in the direction (Z-axis direction) perpendicular to the mounting surface T21. The second specific region R2 is a region including the side surface of the capture portion 11 located at the second position.

Here, in FIG. 8A , the capturing unit 11 and the first object T1 when the capturing unit 11 is located at the first position are indicated by solid lines, and the capturing unit 11 at the second position is indicated by an imaginary line (two-dot chain line). The capturing part 11 and the first object T1 at the time. In short, the mounting head 1 mounts the first object T1 on the mounting surface T21 of the second object T2 by moving the capturing portion 11 in a state of capturing the first object T1 from the second position to the first position. The first specific region R1 is a region directly below the capturing portion 11 in the mounting surface T21 in a state where the capturing portion 11 is located at the first position. The second specific region R2 is a region including the side surface of the capturing portion 11 , that is, a region of the capturing portion 11 viewed from the side in a state where the capturing portion 11 is located at the second position. In the present embodiment, the first position is the bottom dead center of the catch portion 11 , and the second position is the top dead center of the catch portion 11 . The “bottom dead center” referred to in the present disclosure does not refer to the lower limit position in the movable area of the capture portion 11 , but refers to the capture when the first object T1 is mounted on the mounting surface T21 of the second object T2 The lower limit position of the part 11 .

According to the above-described configuration, the imaging device 2 includes the first specific region R1 in the imaging field of view R10 that faces the capturing portion 11 in the direction perpendicular to the mounting surface T21 among the mounting surfaces T21, so that at least the capturing portion in the mounting surface T21 can be captured. the area just below the part 11 . In addition to the first specific region R1, the second specific region R2 including the side surface of the capture unit 11 located at the second position is also included in the imaging field of view R10 of the imaging device 2, so that, for example, the first object of the capture unit 11 can be confirmed. Capture state of T1. Therefore, there is an advantage in that the state of the mounting surface T21 and the state of the capturing portion 11 before or after mounting can be confirmed, and the occupied area of the imaging device 2 in the plane parallel to the mounting surface T21 can be suppressed to a small size and less susceptible to damage. Restrictions on the movement range of the mounting head 1 by the imaging device 2 and the like. Therefore, the mounting system 100A which is more suitable for imaging of the mounted state can be provided.

In the present embodiment, one or more imaging devices 2 together with the mounting head 1 constitute the head unit 10A. That is, the head unit 10A according to the present embodiment includes the mounting head 1 and the imaging device 2 . In other words, the mounting system 100A according to the present embodiment includes the head unit 10A including the mounting head 1 and the imaging device 2 , the drive device 3 , the component supply device 4 , the transport device 5 , the support device 6 , the control device 7 , and the lighting device 8 . .

Here, in the present embodiment, the imaging field of view R10 of the imaging device 2 includes both the first specific region R1 and the second specific region R2. That is, in the imaging device 2, when the first specific region R1 is included in the imaging field of view R10, the second specific region R2 is also included in the imaging field of view R10. Therefore, the imaging device 2 can simultaneously image the first specific region R1 and the second specific region R2 without imaging the first specific region R1 and the second specific region R2 separately.

Further, as shown in A of FIG. 8 , the imaging device 2 includes an imaging element 21 and an optical system 22 . The optical system 22 images an image of the imaging field R10 including the first specific region R1 and the second specific region R2 on the imaging element 21 . In short, in the optical system 22 , a first optical path for imaging the light from the first specific region R1 on the light-receiving surface of the imaging element 21 , and a first optical path for imaging the light from the second specific region R2 on the light-receiving surface of the imaging element 21 are formed. second optical path. Furthermore, in the present embodiment, the imaging field of view R10 of the imaging device 2 includes both the first specific region R1 and the second specific region R2, and thus these first optical paths and second optical paths are simultaneously formed.

In particular, as shown in B of FIG. 8 , the optical system 22 includes a lens group 221 and a prism 222 . The lens group 221 and the prism 222 are arranged side by side in the Z-axis direction below the imaging element 21 so that the lens group 221 is on the imaging element 21 side (upper side).

The prism 222 has a reflecting surface, and the light L1 incident on the imaging device 2 from the side (ie, the direction intersecting the Z axis) is reflected by the reflecting surface toward the lens group 221 side. On the other hand, the light L2 incident on the imaging device 2 from obliquely below (ie, a direction oblique to the Z axis from below) is incident on the lens group 221 through the side of the prism 222 . The lens group 221 forms an image of the light L1 that has passed through the prism 222 and the light L2 that has passed the side of the prism 222 on the light-receiving surface of the imaging element 21 . Here, the light L1 reflected by the prism 222 is light incident from the second specific region R2, and the light L2 passing through the side of the prism 222 is light incident from the first specific region R1. By such an optical system 22 , light from both the first specific region R1 and the second specific region R2 is incident on the imaging element 21 . As a result, the optical system 22 images an image of the imaging field of view R10 including the first specific region R1 and the second specific region R2 on the imaging element 21 .

Further, as shown in A of FIG. 8 , the first specific region R1 and the second specific region R2 are different regions that can be separated. That is, in the first specific region R1 and the second specific region R2, there is no overlapping region, and the first specific region R1 and the second specific region R2 can be completely separated. More strictly speaking, the lower end position of the second specific region R2 is located higher than the upper end position of the first specific region R1 .

However, since the first specific region R1 in the present embodiment corresponds to the specific region R1 in the basic structure, the structure of the specific region R1 described in the basic structure can also be applied to the first specific region R1. Hereinafter, the same points as those of the specific region R1 described in the basic structure will be described with reference to FIG. 9 . FIG. 9 is an explanatory diagram schematically showing an imaging field of view R10 of the imaging device 2 in a plan view. In FIG. 9 , only the imaging fields R10 of some of the nine imaging devices 2 (here, three) of the imaging devices 2 are shown, but the imaging fields R10 of the other imaging devices 2 are also the same. In FIG. 9 , the head main body 13 is shown by an imaginary line (two-dot chain line).

For example, as shown in FIG. 9 , in the mounting system 100A according to the present embodiment, two imaging devices 2 among a plurality of (nine in this case) imaging devices 2 are used as the first imaging device 201 and the second imaging device 202, thereby realizing a stereo camera. That is, in the present embodiment, two imaging devices 2 (the first imaging device 201 and the second imaging device 202 ) that are adjacent in the X-axis direction among the nine imaging devices 2 can be obtained by a stereo camera method. Distance information to the subject.

In short, the mounting system 100A according to the present embodiment further includes a second imaging device that is fixed to the mounting head 1 and includes the first specific region R1 in the imaging field of view R10, unlike the first imaging device 201 serving as the imaging device 2 . 202. The second imaging field of view R200 , which is the imaging field of view R10 of the second imaging device 202 , includes a different area from the first imaging field of view R100 , which is the imaging field of view R10 of the first imaging device 201 . The first specific region R1 includes a region overlapping the first imaging field of view R100 and the second imaging field of view R200.

Accordingly, the first specific region R1 directly below the capture unit 11 is included in the imaging field of view R10 (first imaging field of view R100 ) of the first imaging device 201 and the imaging field of view R10 (second imaging field of view R200 ) of the second imaging device 202 both parties. Therefore, a stereoscopic image of the first specific region R1 can be obtained from the outputs of both the first imaging device 201 and the second imaging device 202 . Therefore, the mounting system 100A can acquire the distance information indicating the distance from the mounting head 1 with respect to the subject in the first specific region R1 by the stereo camera method. As a result, the mounting system 100A can three-dimensionally capture the subject within the first specific region R1.

Here, in the present embodiment, all of the nine imaging devices 2 have a common configuration. Therefore, the first imaging device 201 may be any imaging device 2 among the nine imaging devices 2 , and the second imaging device 202 may be any imaging device 2 adjacent to the first imaging device 201 . For example, any imaging device of the first imaging device 201 and the second imaging device 202 includes the second specific region R2 in the imaging field of view R10 of the imaging device 2 in addition to the first specific region R1.

In addition, in the present embodiment, the first specific region R1 directly below the two or more capturing units 11 is covered with one imaging device 2 . That is, in the present embodiment, the mounting head 1 has a plurality of (two or more) capturing portions 11 . Furthermore, the first specific region R1 included in the imaging field of view R10 of one imaging device 2 is a plurality (two or more) of the capturing portions 11 located at the first position in the direction perpendicular to the mounting surface T21 in the mounting surface T21 Opposite area. In other words, the imaging field of view R10 of one imaging device 2 includes the first specific regions R1 directly below the two or more capture units 11 , that is, the plurality of first specific regions R1 . Therefore, the mounting system 100 according to the present embodiment can use one imaging device 2 to image the areas directly below the two or more capturing units 11 .

Among them, the number of capturing parts 11 covered by one imaging device 2 is a first specific region R1 that is directly below the capturing part 11 and a second specific region R2 (viewed from the side) that captures the capturing part 11 from the side (viewed from the side). different in. That is, among the plurality of capturing units 11 , in the imaging field R10 of one imaging device 2 , the number of capturing units 11 corresponding to the first specific area R1 is greater than the number of capturing units 11 corresponding to the second specific area R2 . Here, the number of capturing portions 11 corresponding to the first specific region R1 refers to the capturing portion 11 having the first specific region R1 directly below, that is, the number of capturing portions 11 directly above the first specific region R1. The number of the capturing parts 11 corresponding to the second specific region R2 refers to the number of the capturing parts 11 including the side surfaces in the second specific region R2.

Specifically, as shown in FIG. 9 , the imaging field of view R10 of the imaging device 2 includes side portions R103 in addition to the central portion R101 and the peripheral portion R102 . The side portion R103 is a region extending from the imaging device 2 toward both sides (directions orthogonal to the Z axis), and is directed toward the second specific region R2. That is, the second specific region R2 is included in the side portion R103 in the imaging field of view R10. In FIG. 9 , hatched (dotted hatching) regions indicate the peripheral portion R102 and the side portion R103.

9 , in the imaging field of view R10 of one imaging device 2, the first specific region R1 included in the peripheral portion R102 corresponds to the four capturing portions 11, and the second specific region R2 included in the lateral portion R103 corresponds to the four capturing portions 11. Corresponds to the two capture parts 11 . Specifically, the first specific region R1 corresponds to the four capturing portions 11 located in the annular peripheral portion R102 centered on the imaging device 2 . On the other hand, when viewed from the imaging device 2, the second specific region R2 corresponds to the two capture portions 11 located on the diagonal in the X-Y plane. By setting it as such a structure, the shape of the prism 222 can be made into a relatively simple shape. Furthermore, according to the plurality of (nine here) imaging devices 2 , the second specific region R2 can be included in the imaging field of view R10 for all of the multiple (here, 16) capture units 11 .

Wherein, in this structure, only the first specific region R1 in the first specific region R1 and the second specific region R2 can obtain the stereoscopic image. That is, since the second specific area R2 is not included in the area where the imaging field of view R10 (first imaging field of view R100 ) of the first imaging device 201 and the imaging field of view R10 (second imaging field of view R200 ) of the second imaging device 202 overlap, Therefore, a stereoscopic image cannot be obtained. As a result, the mounting system 100A can three-dimensionally capture a subject only for the first specific region R1 among the first specific region R1 and the second specific region R2.

Next, the imaging method according to the present embodiment will be described with reference to FIGS. 10A and 10B .

The imaging method according to the present embodiment is an imaging method used in the mounting system 100 including the mounting head 1 . The mounting head 1 has the capture part 11 which captures the 1st object T1. The mounting head 1 moves the capturing portion 11 between a first position facing the mounting surface T21 of the second object T2 and a second position farther from the mounting surface T21 than the first position, and mounts the first object T1 on the mounting surface T21. The above-described imaging method includes the step of imaging the first specific region R1 and the second specific region R2 with the imaging device 2 . The imaging device 2 is fixed to the mounting head 1 . The imaging device 2 includes in the imaging field of view R10: a first specific region R1, which faces the capturing portion 11 at the first position in the direction perpendicular to the mounting surface T21 in the mounting surface T21; and a second specific region R2, including The side surface of the catch portion 11 at the second position.

That is, the imaging method according to the present embodiment is a method of imaging the first specific region R1 and the second specific region R2 using the mounting system 100A according to the present embodiment. In this imaging method, in the imaging field R10 of the imaging device 2 including the first specific region R1 of the mounting surface T21 that faces the capturing section 11 located at the first position in the direction perpendicular to the mounting surface T21, imaging is performed. The first specific area R1. Therefore, it is possible to image at least the area immediately below the capturing portion 11 in the mounting surface T21.

In addition to the first specific region R1, the second specific region R2 including the side surface of the capture unit 11 located at the second position is also included in the imaging field of view R10 of the imaging device 2, so that, for example, the first object of the capture unit 11 can be confirmed. Capture state of T1. Therefore, there is an advantage in that the state of the mounting surface T21 and the state of the capturing portion 11 before or after mounting can be confirmed, and the occupied area of the imaging device 2 in the plane parallel to the mounting surface T21 can be suppressed to a small size and less susceptible to damage. Restrictions on the movement range of the mounting head 1 by the imaging device 2 and the like. Therefore, it is possible to provide an imaging method that is more suitable for imaging of the mounted state.

Then, according to the above-described imaging method, for example, as shown in FIG. 10A , the first specific region R1 is mounted on the mounting surface T21 of the second object T2 (substrate) directly below the capture portion 11 in the first specific region R1 In the state of the object T1 (part), the imaging device 2 can capture the image of the first object T1 . That is, in the state of A in FIG. 10 , in any of the imaging devices 2 , as shown in B in FIG. 10 , an image Im1 in a state in which the first object T1 is reflected in the first specific region R1 is obtained. Furthermore, in the state of A in FIG. 10 , in any of the imaging devices 2 , as shown in B of FIG. 10 , an image Im1 in a state in which the capture unit 11 is reflected in the second specific region R2 is obtained. The image Im1 shown in B of FIG. 10 is obtained by the imaging field R10 including the four imaging devices 2 of the first specific region R1, that is, the seven imaging devices 2 excluding the two imaging devices 2 serving as both ends in the x-axis direction. any of the resulting images.

In this way, according to the imaging method according to the present embodiment, the imaging device 2 can image the first object T1 in the first specific region R1 located directly below the capturing unit 11 at the first position. Furthermore, it is possible to image the second specific region R2 including the side surface of the capture unit 11 located at the second position by the imaging device 2 . Here, since the imaging device 2 captures the first specific region R1 not in the central portion R101 of the imaging field of view R10 but in the peripheral portion R102 of the imaging field of view R10, as shown in B of FIG. 10 , the first object T1 is reflected in the image The peripheral region R12 of Im1 (here, the four corners). On the other hand, since the imaging device 2 captures the second specific region R2 in the center portion R101 of the imaging field of view R10, the capture portion 11 (located at the second position) in the second specific region R2 is reflected in the image as shown in B of FIG. 10 . The central region R11 of Im1. In the example of FIG. 10B , the central region R11 is a rectangular region located in the center of the image Im1 , and the peripheral region R12 is a rectangular frame-shaped region surrounding the central region R11 . In other words, the area along the outer periphery in the image Im1 is the peripheral area R12, and the area surrounded by the peripheral area R12 is the central area R11. In B of FIG. 10 , the shaded area represents the central area R11.

That is, when the image Im1 imaged on the imaging element 21 is divided into the central region R11 and the peripheral region R12, the first specific region R1 is included in the peripheral region R12 of the image Im1, and the second specific region R2 is included in the peripheral region R12 of the image Im1. Central area R11. Such a structure is realized by the design of the optical system 22 . That is, as shown in B of FIG. 8 , by designing the optical system 22 so that the light L1 from the second specific region R2 is imaged on the center portion of the light-receiving surface of the imaging element 21, the second specific region R2 is included in the image Im1. Central area R11.

Furthermore, in the present embodiment, since the peripheral portion R102 has a higher resolution than the central portion R101 of the imaging field of view R10, it is possible to image the image located in the first specific region R1 with a relatively high resolution (compared with the central portion R101). the first object T1. In other words, the imaging device 2 has a higher resolution in the peripheral region R12 than in the central region R11 of the image Im1. In addition, in this imaging method, the first object T1 in the first specific region R1 can be three-dimensionally captured by the stereo camera method by the first imaging device 201 and the second imaging device 202 .

The configuration described in Embodiment 1 (including modified examples) can be applied in appropriate combination with the configuration described in the basic configuration (including modified examples).

(Embodiment 2)

As shown in FIG. 11A and FIG. 11B , the mounting system 100B according to the present embodiment differs from the mounting system 100 according to the basic configuration in that the mounting head 1 of the head unit 10B is a rotary head. Hereinafter, the same reference numerals are assigned to the same configuration as the basic configuration, and the description is appropriately omitted.

In the present embodiment, the mounting head 1 includes a plurality of (eight, as an example) capturing portions 11 . The plurality of capturing parts 11 are arranged at equal intervals on the circumference around the rotation axis C1. Then, one spot on the circumference around the rotation axis C1 becomes the "attachment position", and as shown in B of FIG. on the second object T2. The mounting head 1 has a function of switching the capturing portions 11 located at the mounting positions by rotating the plurality of capturing portions 11 around the rotation axis C1 (see arrows in A in FIG. 11 ).

The mounting system 100B according to the present embodiment includes two imaging devices 2 . The mounting system 100B realizes a stereo camera by using these two cameras 2 as the first camera 201 and the second camera 202 . As shown in FIG. 11A and FIG. 11B , the two imaging devices 2 are arranged adjacent to one of the plurality of capturing units 11 located at the attachment position. In this state, the two imaging devices 2 include the (first) specific region R1 located directly below the one capturing portion 11 at the installation position in the imaging field of view R10 thereof. Here, when the mounting head 1 rotates the plurality of capture parts 11 around the rotation axis C1 , the capture parts 11 located at the mounting positions are switched, so that the two imaging devices 2 are shared by the plurality of capture parts 11 .

Also in this embodiment, as in Embodiment 1, in addition to the first specific region R1 serving as the specific region R1, it is preferable that the imaging field of view R10 of the imaging device 2 includes a second specific region R2.

Furthermore, as a modification of the second embodiment, only one imaging device 2 may be used, or two or more imaging devices may be used.

In addition, as another modification of the second embodiment, the mounting head 1 may include only one capturing portion 11 .

The configuration described in Embodiment 2 (including modified examples) can be used in combination with the basic configuration or the configuration described in Embodiment 1 (including modified examples) as appropriate.

(Summarize)

As described above, the mounting system (100, 100A, 100B) according to the first aspect includes the mounting head (1) and the imaging device (2). The mounting head (1) has a capture portion (11) that captures the first object (T1). The mounting head (1) places the capturing portion (11) at one of a first position facing the mounting surface (T21) of the second object (T2) and a second position farther from the mounting surface (T21) than the first position move between, and attach the first object (T1) to the attachment surface (T21). The camera device (2) is fixed to the mounting head (1). The imaging device (2) includes a first specific area (R1) and a second specific area (R2) in the mounting surface (T21) in the imaging field of view (R10). The first specific region ( R1 ) faces the capturing portion ( 11 ) located at the first position in the direction perpendicular to the mounting surface ( T21 ). The second specific region (R2) includes the side surface of the capturing portion (11) located at the second position.

According to this aspect, the imaging device (2) includes, in the imaging field of view (R10), the first specific region (R1) facing the capturing portion (11) in the direction perpendicular to the mounting surface (T21) among the mounting surfaces (T21). ), it is therefore possible to photograph the area directly below the capture portion (11) in the mounting surface (T21). Moreover, in addition to the first specific region (R1), a second specific region (R2) including the side surface of the capturing portion (11) located at the second position is also included in the imaging field of view (R10) of the imaging device (2), Therefore, for example, the capture state of the first object (T1) by the capture unit (11) can be confirmed. Therefore, the state of the mounting surface (T21) and the state of the capturing portion (11) before or after mounting can be confirmed, and the occupied area of the imaging device (2) in the plane parallel to the mounting surface (T21) can be suppressed to a minimum. smaller. Thereby, there is an advantage that the movement range of the mounting head (1) by the imaging device (2) is not easily restricted. Therefore, it is possible to provide the mounting system (100, 100A, 100B) more suitable for imaging of the mounted state.

In the mounting system (100, 100A, 100B) according to the second aspect, in the first aspect, the imaging field of view (R10) of the imaging device (2) includes both the first specific area ( R1 ) and the second specific area ( R2).

According to this aspect, the first specific region ( R1 ) and the second specific region ( R2 ) can be imaged simultaneously.

In the mounting system (100, 100A, 100B) according to the third aspect, in the first or second aspect, the imaging device (2) includes an imaging element (21) and an optical system (22). The optical system (22) images an image of the imaging field (R10) including the first specific area (R1) and the second specific area (R2) on the imaging component (21).

According to this aspect, by using the optical system (22), imaging of the imaging field of view (R10) including the first specific region (R1) and the second specific region (R2) can be realized.

In the mounting system (100, 100A, 100B) according to the fourth aspect, in the third aspect, the image (Im1) formed on the imaging element (21) is divided into a central area (R11) and a peripheral area (R12) ). In this case, the first specific region (R1) is included in the peripheral region (R12) of the image (Im1), and the second specific region (R2) is included in the central region (R11) of the image (Im1).

According to this method, the position on the image (Im1) can be divided by the first specific region (R1) and the second specific region (R2).

In the mounting system (100, 100A, 100B) according to the fifth aspect, in the fourth aspect, the imaging device (2) is higher in the peripheral region (R12) than the central region (R11) of the image (Im1) resolution.

According to this aspect, compared to the second specific region ( R2 ) including the side surface of the capturing portion ( 11 ) located at the second position, it is possible to image the mounting surface ( T21 ) at a higher resolution than the second specific region ( R2 ) that is perpendicular to the mounting surface ( T21 ) A first specific region (R1) opposite to the capturing part (11) at the first position in the direction of .

In the mounting system (100, 100A, 100B) according to the sixth aspect, in any of the first to fifth aspects, the first specific region (R1) and the second specific region (R2) are separable different regions.

According to this aspect, the first specific region ( R1 ) and the second specific region ( R2 ) that can be separated from each other can be photographed by the imaging device ( 2 ).

In the mounting system (100, 100A, 100B) according to the seventh aspect, in any one of the first to sixth aspects, the mounting head (1) has a plurality of capturing parts (11). The first specific area (R1) included in the imaging field of view (R10) of one imaging device (2) is a plurality of captured images located at the first position in the installation surface (T21) in a direction perpendicular to the installation surface (T21). The area where the part (11) is opposite.

According to this aspect, the first specific region ( R1 ) corresponding to the plurality of capturing units ( 11 ) can be photographed by one imaging device ( 2 ).

In the mounting system (100, 100A, 100B) according to the eighth aspect, in the seventh aspect, among the plurality of capturing units (11), in the imaging field of view (R10) of one imaging device (2), the same The number of capturing parts ( 11 ) corresponding to the first specific region ( R1 ) is greater than the number of capturing parts ( 11 ) corresponding to the second specific region ( R2 ).

According to this aspect, in the imaging field of view ( R10 ) of one imaging device ( 2 ), the number of capturing units ( 11 ) corresponding to the first specific area ( R1 ) is set to the same number as the number of capturing units ( 11 ) corresponding to the second specific area ( R2 ) Compared with the case where the number of the capturing parts (11) is the same, the simplification of the imaging device (2) is easily realized.

In any of the first to eighth aspects, the mounting system (100, 100A, 100B) according to the ninth aspect further includes a second imaging device (202). Different from the first imaging device (201) as the imaging device (2), the second imaging device (202) is fixed to the mounting head (1), and includes the first specific area (R1) in the imaging field of view (R10). The second imaging field of view (R200), which is the imaging field of view (R10) of the second imaging device (202), includes a different area from the first imaging field of view (R100), which is the imaging field of view (R10) of the first imaging device (201). The first specific area ( R1 ) is included in the area where the first imaging field of view ( R100 ) and the second imaging field of view ( R200 ) overlap.

According to this method, the subject in the first specific region ( R1 ) can be three-dimensionally captured by the stereo camera method.

In the mounting system (100, 100A, 100B) according to the tenth aspect, in any one of the first to ninth aspects, the imaging device (2) is arranged on the side of the capture unit (11).

According to this aspect, when the capturing unit (11) moves, the imaging device (2) is less likely to become an obstacle.

The head unit (10, 10A, 10B) according to the eleventh aspect includes a mounting head (1) and an imaging device (2). The mounting head (1) has a capture portion (11) that captures the first object (T1). The mounting head (1) places the capturing portion (11) at one of a first position facing the mounting surface (T21) of the second object (T2) and a second position farther from the mounting surface (T21) than the first position move between, and attach the first object (T1) to the attachment surface (T21). The camera device (2) is fixed to the mounting head (1). The imaging device (2) includes a first specific area (R1) and a second specific area (R2) in the mounting surface (T21) in the imaging field of view (R10). The first specific region ( R1 ) faces the capturing portion ( 11 ) located at the first position in the direction perpendicular to the mounting surface ( T21 ). The second specific region (R2) includes the side surface of the capturing portion (11) located at the second position.

According to this aspect, it is possible to provide the head unit ( 10 , 10A, 10B) more suitable for imaging in the mounted state.

The imaging method according to the twelfth aspect is an imaging method used in a mounting system (100, 100A, 100B) including a mounting head (1). The mounting head (1) has a capture portion (11) that captures the first object (T1). The mounting head (1) places the capturing portion (11) at one of a first position facing the mounting surface (T21) of the second object (T2) and a second position farther from the mounting surface (T21) than the first position move between, and attach the first object (T1) to the attachment surface (T21). The imaging method includes a step of imaging the first specific area (R1) and the second specific area (R2) with an imaging device (2). The imaging device (2) is fixed to the mounting head (1), and includes a first specific area (R1) and a second specific area (R2) in the mounting surface (T21) in the imaging field of view (R10). The first specific region ( R1 ) faces the capturing portion ( 11 ) located at the first position in the direction perpendicular to the mounting surface ( T21 ). The second specific region (R2) includes the side surface of the capturing portion (11) located at the second position.

According to this aspect, it is possible to provide an imaging method suitable for imaging in a mounted state.

Not limited to the above-described embodiment, basic configuration, and various configurations (including modifications) of the mounting systems (100, 100A, 100B) according to Embodiments 1 and 2 can be embodied by an imaging method.

The configurations according to the second to tenth aspects are not required for the mounting system (100, 100A, 100B), and can be appropriately omitted.

-Symbol Description-

1 Mounting head

2 Cameras

11 Capture Department

21 Camera element

22 Optical system

10, 10A, 10B head unit

100, 100A, 100B Mounting Systems

201 The first camera

202 Second camera

Ax1 camera optical axis

G1 first capture group

G2 Second Capture Group

Im1 image

R1 specific area (first specific area)

R2 Second specific area

R10 Camera Field of View

R11 Central Area

R12 Surrounding Area

R100 first camera field of view

R200 Second Camera Field of View

R101 Central

R102 Peripheral part

T1 first object

T2 second object

T21 mounting surface.

Claims (12)

1. An installation system having: The mounting head has a capturing portion for capturing a first object, and the capturing portion is located at a first position facing the mounting surface of the second object and a second position farther from the mounting surface than the first position moving between positions to mount the first object on the mounting surface; and a camera device fixed to the mounting head, The camera device includes in the camera field of view: a first specific area, in the mounting surface facing the catch portion located at the first position in a direction perpendicular to the mounting surface; and The second specific area includes the side surface of the capture portion at the second position. 2. The mounting system of claim 1, wherein: The imaging field of view of the imaging device includes both the first specific area and the second specific area. 3. The mounting system of claim 1 or 2, wherein, The camera has: camera element; and An optical system images an image of the imaging field of view including the first specific area and the second specific area on the imaging element. 4. The mounting system of claim 3, wherein: In the case of dividing the image formed on the imaging element into a central area and a peripheral area, the first specific area is included in the peripheral area of the image, The second specific area is included in the central area of the image. 5. The mounting system of claim 4, wherein: The imaging device has a higher resolution in the peripheral region than in the central region of the image. 6. The mounting system of any one of claims 1 to 5, wherein: The first specific region and the second specific region are other regions that can be separated. 7. The mounting system of any one of claims 1 to 6, wherein: The mounting head has a plurality of the catch portions, The first specific area included in the imaging field of view of one of the imaging devices is the plurality of capturing portions located at the first position in the mounting surface in a direction perpendicular to the mounting surface. Opposite area. 8. The mounting system of claim 7, wherein: Among the plurality of capturing units, in the imaging field of view of one of the imaging devices, the number of the capturing units corresponding to the first specific area is higher than the number of the capturing units corresponding to the second specific area The number of departments is large. 9. The mounting system of any one of claims 1 to 8, wherein: The mounting system further includes a second imaging device that is fixed to the mounting head and includes the first specific region in an imaging field of view, different from the first imaging device serving as the imaging device, The second imaging field of view, which is the imaging field of view of the second imaging device, includes an area different from the first imaging field of view, which is the imaging field of view of the first imaging device, The first specific area includes an area overlapping the first imaging field of view and the second imaging field of view. 10. The mounting system of any one of claims 1 to 9, wherein: The imaging device is arranged on the side of the capture unit. 11. A head unit having: The mounting head has a capturing portion for capturing a first object, and the capturing portion is located at a first position facing the mounting surface of the second object and a second position farther from the mounting surface than the first position moving between positions to mount the first object on the mounting surface; and a camera device fixed to the mounting head, The camera device includes in the camera field of view: a first specific area, in the mounting surface facing the catch portion located at the first position in a direction perpendicular to the mounting surface; and The second specific area includes the side surface of the capture portion at the second position. 12. A camera method, which is a camera method for installing a system, The mounting system includes a mounting head having a capturing portion that captures a first object, and the capturing portion is positioned at a first position facing the mounting surface of the second object and compared with the first position moving between second positions away from the mounting surface to mount the first object on the mounting surface, The imaging method includes the step of using an imaging device to photograph the first specific area and the second specific area, the imaging device is fixed to the installation head, and the imaging field of view includes: the first specific area, the among the mounting surfaces facing the catch portion located at the first position in a direction perpendicular to the mounting surface; and a second specific area including a side surface of the catch portion located at the second position .

Images