CN114361124A - Power semiconductor devices, circuit board assemblies and electronic equipment - Google Patents

Abstract

Embodiments of the present application provide a power semiconductor device, a circuit board assembly, and an electronic device. The power semiconductor device includes a device body, a first conductive connection body and a second conductive connection body connected with the device body. The first conductive connection body and the second conductive connection body are arranged in an up-and-down stack without contacting each other. The first conductive connection body includes a first cutout portion and a second cutout portion, the second conductive connection body includes a third cutout portion aligned with the second cutout portion, and on the projection plane of the stacking direction, the projection of the third cutout portion is located at within the projection of the second cutout. The power semiconductor device provided by the present application can achieve a small current loop area by stacking the first conductive connection body and the second conductive connection body, and reduce the inductance of the current loop, thereby reducing the magnitude of the peak voltage.

Description

Power semiconductor devices, circuit board assemblies and electronic equipment

technical field

The present application relates to the technical field of semiconductor packaging, and in particular, to a power semiconductor device, a circuit board assembly, and an electronic device.

Background technique

During the normal use of the power semiconductor device, the current loop is turned on and off. The turn-on and turn-off speed of the current loop of the existing power semiconductor devices is generally very fast, and a large current change rate is generated. The current change rate is generally described by di/dt. An inductance is generated in the closed current loop, and the inductance suppresses the current change by generating a voltage. This voltage is generally called a peak voltage. The peak voltage value is equal to the product of the inductance size and the current change rate, which can be described by L*di/dt. L is the inductance value. The peak voltage will increase the switching loss of the power semiconductor device and affect the switching speed of the power semiconductor device. Excessive peak voltage may even cause the power semiconductor device to be broken down and damaged.

For the packaging design of power semiconductor devices, how to reduce the peak voltage generated in the process of turning on and off the current loop of the power semiconductor device has become a major problem to be solved urgently.

SUMMARY OF THE INVENTION

The present application provides a power semiconductor device, a circuit board assembly, and an electronic device that can reduce the magnitude of a spike voltage.

A first aspect of the embodiments of the present application provides a power semiconductor device, which includes a device body, a first conductive connector connected to the device body, and a second conductive connector. The first conductive connection body and the second conductive connection body are arranged in an up and down layer, and the first conductive connection body and the second conductive connection body are not in contact with each other, the first conductive connection body includes a first cutout portion and a second cutout portion, and the second The conductive connecting body includes a third cutout portion aligned with the second cutout portion, and on the projection plane of the lamination direction, the projection of the third cutout portion is located within the projection of the second cutout portion.

With this technical solution, the first conductive connecting body and the second conductive connecting body are in a conductor structure in which the upper and lower layers are arranged. There is a third cutout portion aligned with the second cutout portion, the first cutout portion enables the first conductive connector to be electrically connected to external components, and the second cutout portion and the third cutout portion allow the second conductive connector to be electrically connected. Electrically connected with external components, the first conductive connector and the second conductive connector can achieve a small current loop area, reduce the inductance of the current loop, thereby reducing the size of the peak voltage, and can achieve the greatest reduction in power semiconductor devices. Probability of spike voltage breakdown damage.

In some embodiments, an insulating member is further provided between the first conductive connection body and the second conductive connection body.

With this technical solution, an insulating member is used to electrically isolate the first conductive connection body and the second conductive connection body, so as to meet the requirements of the insulation gap and the creepage distance between the first conductive connection body and the second conductive connection body.

In some embodiments, the insulating member includes a fourth cut-out portion aligned with the second cut-out portion, and the projection of the third cut-out portion is located within the projection of the fourth cut-out portion on the projection plane of the lamination direction.

With this technical solution, when the second conductive connecting body, the insulating member and the first conductive connecting body are arranged in layers on top of each other, the connecting structure (such as a screw) can pass through the third cut-out portion, the fourth cut-out portion and the second cut-out portion, The second conductive connection body can be electrically connected to the external components, and the connection structure can be prevented from contacting the first conductive connection body, resulting in a short circuit between the first conductive connection body and the second conductive connection body.

In some embodiments, the second cutout portion, the third cutout portion, and the fourth cutout portion are circular holes or polygonal holes, and the second cutout portion, the third cutout portion, and the fourth cutout portion are coaxial.

By adopting this technical solution, the connecting structure (such as a screw) can pass through the third cut-out portion, the fourth cut-out portion and the second cut-out portion relatively smoothly, so as to realize the electrical connection between the second conductive connecting body and the external components.

In some embodiments, the first conductive connection body and the second conductive connection body extend from the surface of the device body to the outside of the device body along a first direction, and along the first direction, the first cutout portion is located outside the second cutout portion, The size of the second conductive connection body is smaller than the size of the first conductive connection body and smaller than the size of the insulating member, and the size of the insulating member is smaller than or equal to the size of the first conductive connection body.

With this technical solution, when the second conductive connecting body, the insulating member and the first conductive connecting body are arranged in layers on top of each other, it is possible to avoid a short circuit due to contact between the first conductive connecting body and the second conductive connecting body, and the first cut off The part is located outside the second cut-out part, so that the first conductive connecting body is electrically connected to the external components through a connecting structure (the connecting structure passes through the first cut-out part), and the second conductive connecting body is electrically connected through another connecting structure (the connecting structure passes through the first cut-out part). The structure is electrically connected to external components through the second cut-out portion, the third cut-out portion and the fourth cut-out portion).

In some embodiments, the insulating member includes a flat portion and a protruding portion. When the second conductive connecting body, the insulating member and the first conductive connecting body are arranged one above the other, the flat portion is located between the first conductive connecting body and the second conductive connecting body. Between the bodies, the flat portion includes a fourth cutout portion aligned with the second cutout portion, and the raised portion is located between the first cutout portion and the second cutout portion.

With this technical solution, the flat portion of the insulating member is used to electrically isolate the first conductive connecting body and the second conductive connecting body, and the raised portion of the insulating member can further increase the size of the first conductive connecting body and the second conductive connecting body. Insulation gaps and creepage distances between bodies.

In some embodiments, the protruding portion has a rectangular parallelepiped structure, and the protruding portion is located at the end of the insulating member.

With this technical solution, the cuboid protrusion disposed at the end of the insulator is located between the first cut-out portion and the second cut-out portion, which can increase the insulation gap and creepage between the first conductive connection body and the second conductive connection body. distance.

In some embodiments, the insulating member includes a flat portion and a pocket portion, and when the second conductive connecting body, the insulating member and the first conductive connecting body are arranged one above the other, the flat portion is located between the first conductive connecting body and the second conductive connecting body. Between the bodies, the pocket portion passes through the second cut-out portion and extends in a direction away from the plane portion.

With this technical solution, the flat portion of the insulating member is used to electrically isolate the first conductive connecting body from the second conducting connecting body, and the connecting structure (such as a screw or a nut) is accommodated by the pocket portion of the insulating member, so that the connection can be made. The structure is also electrically isolated from the first conductive connection body, which can further increase the insulation gap and the creepage distance between the first conductive connection body and the second conductive connection body.

In some embodiments, the pocket portion is a cylindrical structure with one end open.

With this technical solution, the pocket portion can be used to accommodate the connection structure (such as a screw or a nut), so that the connection structure is also electrically isolated from the first conductive connection body.

In a second aspect, an embodiment of the present application provides a circuit board assembly, including a circuit board, a first electronic component, a second electronic component, and the power semiconductor device described in the first aspect. The first electronic component, the second electronic component and the power semiconductor device are arranged on the circuit board, the first conductive connecting body is electrically connected with the first electronic component through the first screw and the first cutout, and the second conductive connecting body The second screw and the third cut-out portion are electrically connected to the second electronic component.

In a third aspect, embodiments of the present application provide an electronic device, including the circuit board assembly described in the second aspect.

It can be understood that the circuit board assembly described in the second aspect and the electronic device described in the third aspect provided above all correspond to the power semiconductor device in the first aspect. Therefore, the beneficial effects that can be achieved can be referred to the above. The beneficial effects of the provided power semiconductor device will not be repeated here.

Description of drawings

FIG. 1 is a schematic structural diagram of a power semiconductor device provided by an embodiment of the present application.

FIG. 2 is a cross-sectional view of a power semiconductor device provided by an embodiment of the present application.

FIG. 3a is a schematic structural diagram of a first conductive connector provided by an embodiment of the present application.

FIG. 3b is a schematic structural diagram of a second conductive connector provided by an embodiment of the present application.

FIG. 3c is a schematic structural diagram of an insulating member provided by an embodiment of the present application.

FIG. 3d is a schematic structural diagram of a stacked arrangement of a first conductive connector, an insulating member, and a second conductive connector provided by an embodiment of the present application.

4 is a schematic structural diagram of assembling the first conductive connection body and the second conductive connection body with two sets of screws and nuts in a power semiconductor device according to an embodiment of the present application.

FIG. 5 is a schematic structural diagram of an insulating member provided by another embodiment of the present application.

FIG. 6 is a schematic structural diagram of assembling a second conductive connector and a set of screws and nuts in a power semiconductor device according to an embodiment of the present application.

FIG. 7 is a schematic structural diagram of an insulating member provided by another embodiment of the present application.

FIG. 8 is a schematic structural diagram of assembling a second conductive connecting body and a group of screws and nuts in a power semiconductor device according to another embodiment of the present application.

Description of main component symbols

Device body 10

The first conductive connector 11

first cutout 111

second cut-out portion 112

second conductive connector 12

third cut-out 121

Insulation 13

Fourth cutout 131

Bags 132

first plane part 133

bosses 134

second flat part 135

first screw 20

first nut 21

Second screw 22

Second Nut 23

Power Semiconductor Devices 100

First direction X1

Detailed ways

The embodiments of the present application are described below by specific specific examples, and those skilled in the art can understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of this application will be presented in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the present application. The following description will contain numerous specific details in order to provide an in-depth understanding of the present application. This application may also be practiced without these details. Furthermore, some specific details will be omitted from the description in order to avoid obscuring or obscuring the gist of the present application. It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict.

Hereinafter, if used, the terms "first", "second", etc. are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", etc., may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more. Orientation terms such as "upper", "lower", "left" and "right" are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used with Relative to the description and clarification, it may vary accordingly depending on the orientation in which the components are placed in the figures.

In this application, if it is used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integrated; it can be Directly connected or indirectly connected through an intermediary. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

When the following embodiments are described in detail in conjunction with schematic diagrams, for the convenience of description, the diagrams representing the partial structures of the devices will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of the protection of the present application.

In order to make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

FIG. 1 shows a schematic structural diagram of a power semiconductor device provided by an embodiment of the present application.

Referring to FIG. 1 , a power semiconductor device 100 includes a device body 10 , a first conductive connection body 11 and a second conductive connection body 12 . The internal circuit structure of the device body 10 is basically conventional in the art, and will not be described in this application. The first conductive connector 11 and the second conductive connector 12 are electrically connected to the internal circuit of the device body 10 . The two conductive connectors 12 are not in contact with each other.

In some embodiments, the first conductive connection body 11 and the second conductive connection body 12 extend from the surface of the device body 10 to the outside of the device body 10 along the first direction X1 . The first conductive connection body 11 and the second conductive connection body 12 can be used as pins of the power semiconductor device 100 , so that the power semiconductor device 100 can be electrically connected with other electronic components. For example, the first conductive connection body 11 and the second conductive connection body 12 can be used as a positive terminal and a negative terminal, a positive terminal and a neutral point terminal (zero point terminal), or a negative terminal and a neutral terminal for connecting the power semiconductor device 100 to the peripheral circuit. point terminal, etc.

In some embodiments, the power semiconductor device 100 may be a power element such as a bipolar transistor, a metal oxide semiconductor field effect transistor, a thyristor, or the like.

In some embodiments, an insulating member 13 is disposed between the first conductive connection body 11 and the second conductive connection body 12 , and the insulating member 13 can be used to electrically isolate the first conductive connection body 11 and the second conductive connection body 12 , to avoid short circuit between the first conductive connection body 11 and the second conductive connection body 12 .

In some embodiments, both the first conductive connection body 11 and the second conductive connection body 12 may be made of conductive materials, for example, the first conductive connection body 11 and the second conductive connection body 12 may be made of tinned copper wire, tinned Iron wire, nickel-plated copper wire, etc. The insulating member 13 is made of insulating material, for example, the insulating member 13 may be made of rubber, resin, or the like.

In some embodiments, the power semiconductor device 100 may include a plurality of first conductive connectors 11 and a plurality of second conductive connectors 12 (eg, the power semiconductor device 100 is a chip integrated with a plurality of metal oxide semiconductor field effect transistors) , the number of the first conductive connectors 11 may be the same as the number of the second conductive connectors 12 . The power semiconductor device 100 may further include conductive connectors for other purposes than the first conductive connectors 11 and the second conductive connectors 12 . For example, the power semiconductor device 100 also includes a third conductive connector for controlling the conduction or cut-off between the first conductive connector 11 and the second conductive connector 12, here and in the remaining figures for reasons of clarity are not described and shown in detail.

For example, the power semiconductor device 100 is an insulated gate bipolar transistor, the first conductive connection 11 may be the collector or the emitter of the insulated gate bipolar transistor, and the second conductive connection 12 may be an insulated gate bipolar transistor The emitter or collector of the transistor, and the third conductive connection body is the base of the insulated gate bipolar transistor. The power semiconductor device 100 is a metal-oxide-semiconductor field-effect transistor, the first conductive connection body 11 can be the drain or source of the metal-oxide-semiconductor field-effect transistor, and the second conductive connection body 12 can be a metal-oxide-semiconductor field effect transistor The source or drain, and the third conductive connection body is the gate of the metal-oxide-semiconductor field-effect transistor.

As shown in FIG. 2 , the second conductive connector 12 , the insulating member 13 and the first conductive connector 11 are stacked in sequence. The shapes and sizes of the first conductive connector 11 , the insulating member 13 and the second conductive connector 12 can be determined according to The application scenarios and actual packaging requirements of the power semiconductor device 100 are set and adjusted. For example, the shapes of the first conductive connection body 11 , the second conductive connection body 12 , and the insulating member 13 may be substantially rectangular, T-shaped, or the like.

For example, the size of the first conductive connection body 11 may be set according to the overcurrent capability and overvoltage capability of the first conductive connection body 11 , and the second conductive connection body 12 may be set according to the overcurrent capability and overvoltage capability of the second conductive connection body 12 . The size of the conductive connector 12, and the shape and size of the insulating member 13 are set according to the shape and size of the first conductive connector 11 and the second conductive connector 12, so that the insulating member 13 can isolate the first conductive connector 11 from the The second conductive connector 12 .

In some embodiments, the insulating member 13 may be an insulating film, so that the gap between the first conductive connection body 11 and the second conductive connection body 12 is smaller, and the first conductive connection body 11 and the second conductive connection body are connected The body 12 is overlapped perpendicular to the first direction X1, the first conductive connection body 11 and the second conductive connection body 12 arranged up and down can realize a small current loop area, which can reduce the inductance of the current loop, thereby reducing the spike The magnitude of the voltage and the probability that the power semiconductor device 100 is damaged by the breakdown of the voltage spike.

In some embodiments, in order to realize the electrical connection between the first conductive connector 11 and the second conductive connector 12 and other electronic components or functional modules, the first conductive connector 11 includes two or more cut-out portions, The second conductive connection body 12 includes at least one cutout portion, and the insulating member 13 includes at least one cutout portion. As shown in FIGS. 3 a , 3 b and 3 c , the first conductive connection body 11 includes a first cutout portion 111 and a second cutout portion 112 , the second conductive connection body 12 includes a third cutout portion 121 , and the insulating member 13 includes a fourth cutout portion 121 . The cutout portion 131 will be described as an example.

The first cut-out portion 111 can be used to realize the electrical connection between the first conductive connecting body 11 and the conductive connecting bodies of other electronic components through the first screw, and the first screw can also cooperate with the first nut to improve the connection reliability of the electrical connection. . The third cut-out portion 121 can be used to realize the electrical connection between the second conductive connector 12 and the conductive connectors of other electronic components through the second screw, and the second screw can also cooperate with the second nut to improve the connection reliability of the electrical connection .

In some embodiments, as shown in FIG. 3d , when the second conductive connection body 12 , the insulating member 13 and the first conductive connection body 11 are arranged in layers one above the other, the third cutout portion 121 , the second cutout portion 112 and the fourth cutout portion 112 The cutouts 131 are aligned with each other, and the third cutout 121 , the second cutout 112 and the fourth cutout 131 are coaxial. On the projection plane perpendicular to the first direction X1 or on the stacking direction, the projection of the third cutout portion 121 is located within the projection of the fourth cutout portion 131 and is located within the projection of the second cutout portion 112 .

In some embodiments, when the second conductive connecting body 12 , the insulating member 13 and the first conductive connecting body 11 are arranged in a stacked arrangement, the first cutout portion 111 is located outside the second cutout portion 112 along the first direction X1 , The size of the second conductive connection body 12 is smaller than that of the first conductive connection body 11 and smaller than that of the insulating member 13 , and the size of the insulating member 13 is smaller than or equal to the size of the first conductive connection body 11 . In other embodiments, along the first direction X1 , the size of the second conductive connecting body 12 may also be equal to the size of the insulating member 13 .

When the second conductive connector 12 and the conductive connectors of other electronic components are electrically connected through the second screw and the second nut, the second cutout portion 112 and the fourth cutout portion 131 can avoid contact with the second screw or the second cutout portion 131. Nut contact. When the second screw and the second nut are tightened, the second screw or the second nut can pass through the third cut-out portion 121, the fourth cut-out portion 131 and the second cut-out portion 112, and the second screw or the second nut does not The two cut-out portions 112 and the fourth cut-out portion 131 are in contact. For example, there is a predetermined distance between the second screw or second nut and the second cut-out portion 112 and the fourth cut-out portion 131 to satisfy the insulation gap and creepage distance. requirements.

For example, when the second screw passes through the second cutout portion 112 and the fourth cutout portion 131 , the distances between the second screw and the second cutout portion 112 and the fourth cutout portion 131 may both be 3˜5 mm. When the second nut passes through the second cutout portion 112 and the fourth cutout portion 131 , the distances between the second nut and the second cutout portion 112 and the fourth cutout portion 131 may both be 3˜5 mm. During the actual use of the power semiconductor device, the distance between the second screw or second nut and the second cut-out portion 112 and the fourth cut-out portion 131 can be set according to the voltage of the use scene of the power semiconductor device. The higher the distance, the greater the distance.

In some embodiments, the size and shape of the first cut-out portion 111 may be set according to the shape and size of the first screw, which is not limited in this application, but it should be satisfied that the threaded portion of the first screw can pass through the first cut-out portion 111, so that the first conductive connection body 11 and the conductive connection body of other electronic components can be electrically connected through the first screw and the first nut. In FIG. 3a , the first cutout portion 111 is taken as an example of a circular hole for description. In other embodiments, the first cutout portion 111 may also be a polygonal hole such as a hexagonal hole or an octagonal hole.

The size and shape of the third cut-out portion 121 can be set according to the shape and size of the second screw, which is not limited in the present application, but it must be satisfied that the threaded portion of the second screw can pass through the third cut-out portion 121, so that the first The two conductive connectors 12 and the conductive connectors of other electronic components can be electrically connected through a second screw and a second nut. In FIG. 3b , the third cutout portion 121 is taken as an example of a circular hole for description. In other embodiments, the third cutout portion 121 may also be a polygonal hole such as a hexagonal hole or an octagonal hole.

In some embodiments, the size and shape of the second cutout portion 112 and the fourth cutout portion 131 can also be set according to the shape and size of the second screw or second nut, so that the second screw or second nut passes through the first When the two cut-out parts 112 and the fourth cut-out part 131 are not in contact with the second cut-out part 112 and the fourth cut-out part 131 , the requirements of insulation clearance and creepage distance are satisfied. For example, the second cutout portion 112 and the fourth cutout portion 131 may have the same shape and size, and both the second cutout portion 112 and the fourth cutout portion 131 are hexagonal holes.

In some embodiments, the second cutout portion 112 and the fourth cutout portion 131 may also have different shapes and/or sizes. For example, the second cutout portion 112 and the fourth cutout portion 131 have the same shape, but the size of the fourth cutout portion 131 is slightly smaller than that of the second cutout portion 112 .

In some embodiments, when the second conductive connection body 12 is electrically connected to the conductive connection body of other electronic components through the second screw and the second nut, in order to avoid the second conductive connection body 12 and the first conductive connection body 11 When a short circuit occurs, it is set that the second screw or the second nut does not contact the second cut-out portion 112 when passing through the second cut-out portion 112 , so as to meet the requirements of insulation clearance and creepage distance. When the second screw or second nut passes through the fourth cut-out portion 131 , the second screw or second nut is in contact with the fourth cut-out portion 131 , which will not cause a short circuit between the second conductive connection body 12 and the first conductive connection body 11 That is, when the second screw or the second nut passes through the second cut-out portion 112 and the fourth cut-out portion 131, the second screw or the second nut does not contact the second cut-out portion 112, but the second screw or the second cut-out portion 131 The second nut may be in contact with the fourth cutout portion 131 . At this time, the size of the fourth cutout portion 131 is smaller than the size of the second cutout portion 112 .

The power semiconductor device 100 provided in the embodiment of the present application includes a first conductive connection body 11 , a second conductive connection body 12 and an insulating member 13 . The first conductive connection body 11 is provided with a first cutout portion 111 and a second cutout portion 112 . The second conductive connector 12 is provided with a third cut-out portion 121 , the insulating member 13 is provided with a fourth cut-out portion 131 , and the insulating member 13 is disposed between the first conductive connector 11 and the second conductive connector 12 to form an upper and lower layer. The arranged conductor structure provides the installation space for the first screw through the first cut-out portion 111, and provides the installation space for the second screw or second nut through the second cut-out portion 112, the third cut-out portion 121 and the fourth cut-out portion 131, The second screw and the second nut are not in contact with the second cut-out portion 112 to avoid short circuit between the first conductive connector 11 and the second conductive connector 12. The first conductive connector 11 and the second conductive connector 12 can be The small current loop area is achieved, the inductance of the current loop is reduced, thereby reducing the magnitude of the peak voltage, and the probability that the power semiconductor device 100 is damaged by the breakdown of the peak voltage can be reduced to the greatest extent.

FIG. 4 shows a schematic structural diagram of assembling the first conductive connection body and the second conductive connection body with two sets of screws and nuts in a power semiconductor device according to an embodiment of the present application.

When the power semiconductor device 100 is electrically connected to other components, the first conductive connection body 11 of the power semiconductor device 100 can be connected to the conductive connection body of a certain component through the first screw 20 and the first nut 21 (similarly, a cutout can be provided. part) electrical connection. For example, the threaded portion of the first screw 20 passes through the first cutout portion 111 on the first conductive connection body 11 and the cutout portion of the conductive connection body of the component, and the head of the first screw 20 cannot pass through the first cutout portion part 111 to prevent the first screw 20 from falling off the first conductive connector 11, and tighten the first screw 20 and the first nut 21 to make the first conductive connector 11 closely fit with the conductive connector of the component together, make an electrical connection.

In some embodiments, the second conductive connecting body 12 of the power semiconductor device 100 can be electrically connected to the conductive connecting body of a certain component (which can also be provided with a cutout portion) through the second screw 22 and the second nut 23 . For example, the threaded portion of the second screw 22 passes through the cutout portion of the conductive connection body of the component, the third cutout portion 121 on the second conductive connection body 12 , the fourth cutout portion 131 on the insulating member 13 , and the first conductive The second cut-out portion 112 on the connector 11, and the head of the second screw 22 cannot pass through the cut-out portion of the conductive connector of the component, so as to prevent the second screw 22 from falling off the conductive connector of the component, Tighten the second screw 22 and the second nut 23, so that the second conductive connection body 12 and the conductive connection body of the component are closely attached together to achieve electrical connection, and the second screw 22 and the second nut 23 need not be removed. Contact with the first conductive connection body 11 to avoid short circuit between the first conductive connection body 11 and the second conductive connection body 12 .

In some embodiments, the insulating member 13 may be designed as a structure including a pocket portion, and the second screw 22 or the second nut 23 is accommodated by the pocket portion, so that the second screw 22, the second nut 23 and the second conductive The connecting bodies 12 are all electrically isolated from the first conductive connecting body 11 , so that the requirements of insulation gap and creepage distance can be easily satisfied between the first conductive connecting body 11 and the second conductive connecting body 12 . As shown in FIG. 5 , the insulating member 13 includes a pocket portion 132 and a first flat portion 133 . The pocket portion 132 is a cylindrical structure with an opening. The pocket portion 132 can be used to accommodate the second screw 22 or the second nut 23. The shape and size of the pocket portion 132 can be designed to be compatible with the second screw 22 or the second nut 23. Nut 23 to match.

In FIG. 5 , the pocket portion 132 is described as an example in which the second nut 23 is accommodated. The shape of the pocket portion 132 is the same as that of the second nut 23 , and the second nut 23 can be completely accommodated in the pocket portion 132 . When the second conductive connection body 12 , the insulating member 13 and the first conductive connection body 11 are arranged in a stacked arrangement, the first plane portion 133 is located between the first conductive connection body 11 and the second conductive connection body 12 , and the pocket portion 132 Passing through the second cut-out portion 112 and extending in a direction away from the first plane portion 133 , the first conductive connection body 11 and the second conductive connection body 12 arranged on top of each other are electrically isolated by the insulating member 13 .

FIG. 6 shows a schematic structural diagram of assembling a second conductive connecting body and a group of screws and nuts in a power semiconductor device according to an embodiment of the present application.

The insulating member 13 is mounted on the first conductive connection body 11 through the second cutout portion 112 , the first flat portion 133 is located on the other surface of the first conductive connection body 11 , and the pocket portion 132 passes through the second cutout portion 112 and faces toward the first conductive connection body 11 . It extends in a direction away from the first plane portion 133 . The second conductive connection body 12 of the power semiconductor device 100 is electrically connected to the conductive connection body of a certain component (also may be provided with a cut-out portion) through the second screw 22 and the second nut 23 . For example, the threaded portion of the second screw 22 passes through the cutout portion of the conductive connection body of the component, the third cutout portion 121 on the second conductive connection body 12, and the second cutout portion 112 on the first conductive connection body 11, The head of the second screw 22 cannot pass through the cutout portion of the conductive connecting body of the component, so as to prevent the second screw 22 from falling off the conductive connecting body of the component. By tightening the second screw 22 and the second nut 23 placed in the pocket portion 132 in advance, the second conductive connection body 12 and the conductive connection body of the component are tightly attached to achieve electrical connection.

In some embodiments, the insulating member 13 can also be designed to include a protruding structure, and the protruding structure can increase the insulating gap and the creepage distance, thereby reducing the design of the first conductive connecting body 11 and the second conductive connecting body 12 length. As shown in FIG. 7 , the insulating member 13 includes a protruding portion 134 and a second plane portion 135 , and the second plane portion 135 includes a fourth cutout portion 131 .

In some embodiments, the raised portion 134 may be located at the end of the insulator 13 . The shape and size of the protruding portion 134 can be set according to the actual use requirements of the power semiconductor device 100 . For example, the raised portion 134 has a rectangular parallelepiped structure.

As shown in FIG. 8 , when the first conductive connection body 11 , the insulating member 13 and the second conductive connection body 12 are arranged in a stacked arrangement, the raised portion 134 is located between the first cutout portion 111 and the second cutout portion 112 . The two plane portions 135 are located between the first conductive connection body 11 and the second conductive connection body 12 , and the fourth cutout portion 131 on the second plane portion 135 is aligned with the third cutout portion 121 .

The present application also provides a circuit board assembly, including a circuit board, a first electronic component, a second electronic component, and the above-mentioned power semiconductor device 100 . The first electronic component, the second electronic component and the power semiconductor device 100 can be arranged on the circuit board, and the first conductive connecting body 11 can pass through the first screw 20 (or the first screw 20 and the first nut 21 ) and the first The cut-out portion 111 is electrically connected to the first electronic component, and the second conductive connector 12 can be electrically connected to the second electronic component through the second screw 22 (or the second screw 22 and the second nut 23 ) and the third cut-out portion 121 .

The present application also provides an electronic device, including the above-mentioned circuit board assembly, so that the electronic device can communicate with other electronic devices or servers. The electronic device may be a power supply device, a communication device, or the like.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be covered within the disclosure scope of the present application. .

Claims (11)

1. The utility model provides a power semiconductor device, includes the device body, its characterized in that, still include with first electrically conductive connector and the electrically conductive connector of second that the device body is connected, first electrically conductive connector with the electrically conductive connector of second is range upon range of arrangement from top to bottom, just first electrically conductive connector with the electrically conductive connector of second is not contacted mutually, first electrically conductive connector includes first excision and second excision, the electrically conductive connector of second include with the third excision that the second excision aligns, on the plane of projection of range upon range of direction, the projection of third excision is located in the projection of second excision.

2. The power semiconductor device of claim 1, wherein an insulator is further disposed between the first conductive connector and the second conductive connector.

3. The power semiconductor device according to claim 2, wherein the insulating member includes a fourth cut portion aligned with the second cut portion, and a projection of the third cut portion is located within a projection of the fourth cut portion on a projection plane in the stacking direction.

4. The power semiconductor device according to claim 3, wherein the second cutout, the third cutout, and the fourth cutout are circular holes or polygonal holes, and the second cutout, the third cutout, and the fourth cutout are coaxial.

5. The power semiconductor device according to claim 3, wherein the first conductive connector and the second conductive connector extend from the surface of the device body to the outside of the device body in a first direction in which the first cutout is located outside the second cutout, a size of the second conductive connector is smaller than a size of the first conductive connector and smaller than a size of the insulator, and a size of the insulator is smaller than or equal to a size of the first conductive connector.

6. The power semiconductor device of claim 2, wherein the insulator includes a planar portion and a raised portion, the planar portion is located between the first conductive connector and the second conductive connector when the second conductive connector, the insulator, and the first conductive connector are stacked one on top of the other, the planar portion includes a fourth cut-out aligned with the second cut-out, and the raised portion is located between the first cut-out and the second cut-out.

7. The power semiconductor device according to claim 6, wherein the protrusion is a rectangular parallelepiped structure, and the protrusion is located at an end of the insulating member.

8. The power semiconductor device of claim 2, wherein the insulator includes a planar portion and a pocket portion, the planar portion is located between the first conductive connector and the second conductive connector when the second conductive connector, the insulator and the first conductive connector are stacked up and down, and the pocket portion passes through the second cut-out portion and extends away from the planar portion.

9. The power semiconductor device according to claim 8, wherein the pocket portion is a columnar structure having one end open.

10. A circuit board assembly comprising a circuit board, a first electronic component and a second electronic component, further comprising a power semiconductor device according to any one of claims 1 to 9;

the first electronic component, the second electronic component and the power semiconductor device are arranged on the circuit board, the first conductive connecting body is electrically connected with the first electronic component through a first screw and the first cutting portion, and the second conductive connecting body is electrically connected with the second electronic component through a second screw and the third cutting portion.

11. An electronic device comprising the circuit board assembly of claim 10.

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