CN114390786A - Flexible circuit board, manufacturing method thereof and flexible circuit board - Google Patents

Abstract

The invention discloses a manufacturing method of a flexible circuit board. The flexible circuit board is a special-shaped flexible circuit board. The manufacturing method comprises: providing a flexible circuit board substrate with a cut material, the flexible circuit board substrate is provided with positioning holes, and the positioning holes are used for rear Process positioning; perform roll-to-roll inner layer pattern processing on the flexible circuit board substrate; perform roll-to-roll drilling process and roll-to-roll electroplating process on the flexible circuit board substrate in turn; roll-to-roll process on the flexible circuit board substrate in turn Solder mask process and roll-to-roll surface treatment process; and roll-to-roll forming process is performed on the flexible circuit board substrate to obtain a flexible circuit board. The manufacturing method of the flexible circuit board provided by the present invention obtains a special-shaped flexible circuit board by performing a roll-to-roll processing process on the flexible circuit board substrate. The manufacturing method has a novel processing method and can effectively improve the utilization rate of the board.

Description

A flexible circuit board, a method for making the same, and a flexible circuit board

technical field

The invention relates to the field of circuit boards, in particular to a manufacturing method of a flexible circuit board and a flexible circuit board.

Background technique

Since the individual flexible circuit boards are generally small in size and cannot be processed separately, it is necessary to combine multiple smaller unit boards (shipping boards) on a large board surface (processing board), and then use the edge of the large board surface. The tool graphics are processed, this process is called jigsaw puzzle. In the process of flexible circuit board processing, it needs to be assembled.

At present, the assembling of double-sided flexible circuit boards generally adopts a conventional assembling method, that is, a plurality of unit boards are assembled on the same rectangular large-area board surface to form a assembling board for processing. Due to the limitation of the timing technology of the current normalized processing methods, conventional jigsaw panels can effectively utilize the regular rectangular design in the processing procedures such as dry film sticking, exposure, and etching to realize the convenience of processing.

However, due to the irregular shape of some double-sided flexible circuit boards, that is, special shapes, if a conventional panel is used, a large number of "waste areas" will be formed on the edge of the board that need to be removed at the end, resulting in a lot of waste. Utilization is low.

If the pattern of the panel is simply adjusted according to the irregular shape of the double-sided flexible circuit board, since the edge of the large panel has a special-shaped structure, it will lead to more difficult processing in the processes of dry film, exposure, and etching.

Therefore, for flexible circuit boards with irregular shapes, it is necessary to provide a flexible circuit board special-shaped assembling method, and for the special-shaped assembling method, provide a corresponding technical method that can be effectively processed.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to propose a manufacturing method of a flexible circuit board, which aims to solve the problem that for flexible circuit boards with irregular shapes in the prior art, the use of the existing jigsaw panel processing method is likely to lead to low utilization rate of the board or difficulty in processing the edge of the heterosexual board big technical problem.

In order to achieve the above purpose, the present invention proposes a manufacturing method of a flexible circuit board, wherein the flexible circuit board is a special-shaped flexible circuit board, and the manufacturing method includes:

Provide a flexible circuit board substrate with cutting material, the flexible circuit board substrate is provided with positioning holes, and the positioning holes are used for positioning in the subsequent process;

Performing a roll-to-roll inner layer graphics process on the flexible circuit board substrate, wherein the exposure pattern in the roll-to-roll inner layer graphics process includes a special-shaped flexible circuit board panel;

performing a roll-to-roll drilling process and a roll-to-roll electroplating process on the flexible circuit board substrate in sequence;

Performing a roll-to-roll solder resist process and a roll-to-roll surface treatment process on the flexible circuit board substrate in sequence;

A roll-to-roll forming process is performed on the flexible circuit board substrate to obtain a flexible circuit board.

Further, before the steps of sequentially performing the roll-to-roll drilling process and the roll-to-roll electroplating process on the flexible circuit board substrate, include:

A roll-to-roll lamination process is performed on the flexible circuit board substrate to obtain a lamination multi-layer flexible circuit board.

Further, before the steps of sequentially performing a roll-to-roll solder mask process and a roll-to-roll surface treatment process on the flexible circuit board substrate, the steps include:

A roll-to-roll outer layer pattern process is performed on the laminated multi-layer flexible circuit board, wherein the exposure pattern in the roll-to-roll outer layer pattern process includes a special-shaped flexible circuit board panel.

Further, the roll-to-roll inner layer graphics process and the roll-to-roll outer layer graphics process processing include exposure process processing, and the exposure process processing includes:

performing a dry film sticking process on the flexible circuit board substrate or the laminated multi-layer flexible circuit board;

A segment-by-segment exposure process is performed on the flexible circuit board substrate or the laminated multi-layer flexible circuit board, wherein the segment-by-segment exposure process is performed in a vacuum state.

Further, the roll-to-roll surface treatment process is a horizontal roll-to-roll surface treatment process.

Further, the step of performing a roll-to-roll forming process on the flexible circuit board substrate includes:

performing a first roll-to-roll forming process on the flexible circuit board substrate;

A second molding process is performed on the flexible circuit board substrate.

Further, the special-shaped flexible circuit board panel is bent or curved.

Further, the bending type includes a one-time bending type and a multiple bending type.

Further, the curved shape is a meniscus shape, an S shape or a wave shape.

In order to achieve the above purpose, the present invention proposes a flexible circuit board, the flexible circuit board is manufactured by the above-mentioned manufacturing method.

In the technical solution of the present invention, the manufacturing method of the flexible circuit board provided by the present invention obtains a special-shaped flexible circuit board by performing a roll-to-roll processing process on the flexible circuit board substrate. The manufacturing method of the manufacturing method has a novel processing method and can effectively improve the Plate utilization.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

1a is a schematic diagram of a panel structure of a one-time bending special-shaped graphic flexible circuit board in the prior art;

FIG. 1b is a schematic diagram of a panel structure of a multiple-folded special-shaped graphic flexible circuit board in the prior art;

FIG. 1c is a schematic diagram of a panel structure of a meniscus-shaped special-shaped flexible circuit board in the prior art;

FIG. 1d is a schematic diagram of a panel structure of a wave-shaped special-shaped graphic flexible circuit board in the prior art;

2 is a schematic diagram of a process flow of a first embodiment of a method for manufacturing a flexible circuit board according to the present invention;

FIG. 3 is a schematic diagram of a panel structure of a first embodiment of a flexible circuit board according to the present invention;

FIG. 4 is a schematic diagram of a panel structure of a second embodiment of a flexible circuit board according to the present invention;

5 is a schematic diagram of a panel structure of a third embodiment of a flexible circuit board according to the present invention;

6 is a schematic diagram of a panel structure of a fourth embodiment of a flexible circuit board according to the present invention;

FIG. 7 is a schematic process flow diagram of a second embodiment of a method for manufacturing a flexible circuit board according to the present invention.

Description of the attached drawings:

100-flexible circuit board, 101-flexible circuit board, 102-flexible circuit board group.

The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the prior art, the processing flow of general common circuit boards includes: cutting material; inner layer pattern process processing (pre-treatment micro-etching, photosensitive layer film, exposure, development, etching, film stripping); typesetting and pressing process processing; drilling Hole process treatment; electroplating (copper sinking, board electric) process treatment; outer layer pattern process treatment; pattern plating process treatment; solder mask process treatment; surface treatment process treatment; forming process treatment; electrical testing process treatment; FQC appearance inspection process treatment ; packaging process processing; and shipment.

Please refer to Fig. 1a, Fig. 1b, Fig. 1c, Fig. 1d, Fig. 1a is a schematic diagram of a panel structure of a one-time bending special-shaped graphic flexible circuit board in the prior art; Fig. 1b is a prior art multiple bending Schematic diagram of the panel structure of a folded special-shaped graphic flexible circuit board; FIG. 1c is a schematic diagram of the panel structure of a meniscus-shaped special-shaped graphic flexible circuit board in the prior art; FIG. 1d is a prior art. Schematic diagram of the jigsaw structure of the circuit board.

In the prior art, for the flexible circuit board 101 with special-shaped pattern (irregular pattern), a conventional paneling method is adopted, that is, the flexible circuit board 101 is directly assembled on a square or rectangular board surface to form a flexible circuit substrate 100, and then the flexible circuit is used. The substrate 100 is processed with a board edge graphic tool.

The manufacturing method of this embodiment focuses on the flow processing of the flexible circuit board for special-shaped panels.

Please refer to FIG. 2 and FIG. 3 , FIG. 2 is a schematic diagram of a process flow of a first embodiment of a manufacturing method of a flexible circuit board of the present invention, and FIG. 3 is a schematic diagram of a panel structure of a first embodiment of a flexible circuit board of the present invention.

As shown in FIG. 3 , the flexible circuit board 101 of this embodiment is obtained by the manufacturing method of FIG. 1 . The flexible circuit board 101 is a special-shaped flexible circuit board, and a plurality of special-shaped flexible circuit boards 101 are assembled to form a special-shaped flexible circuit board group 102 . A plurality of special-shaped flexible circuit board groups 102 are combined to form a roll-shaped flexible circuit board 100 . In this embodiment, four special-shaped flexible circuit board groups 102 are provided on each flexible circuit substrate 100 and each special-shaped flexible circuit board group 102 is composed of ten special-shaped flexible circuit boards 101. Quantity is limited.

Please refer to FIG. 2 to FIG. 6 together. The specific steps of the manufacturing method of a flexible circuit board of the present invention include:

Step S100 : providing an open flexible circuit board substrate, the flexible circuit board substrate is provided with a positioning hole, and the positioning hole is used for positioning in a subsequent process.

In this embodiment, the flexible circuit board is a special-shaped flexible circuit board, and the flexible circuit board is a single-layer or double-layer flexible circuit board. The flexible circuit board substrate 100 provided with the cutting material is a roll-shaped flexible circuit board substrate, or a flat flexible circuit board substrate, and the flexible circuit board substrate 100 in this embodiment may be a long material. In the cutting process, positioning holes are processed on the flexible circuit board substrate 100, and the positioning holes are used for positioning in the subsequent process.

In a specific application, a long material of the flexible circuit board 100 is used in the cutting process, and is cut into a length that requires roll-to-roll processing by a cutter. That is, the shape of the entire open flexible circuit board substrate is still a rectangle, and the inside includes various special-shaped flexible circuit board groups 102 and various special-shaped flexible circuit boards 101 to be fabricated. Then, on each special-shaped flexible circuit board group 102 of the long material, pattern alignment holes are made to facilitate alignment and positioning in subsequent processing steps.

Step S200 : performing a roll-to-roll inner layer graphics process on the flexible circuit board substrate, wherein the exposure patterns in the roll-to-roll inner layer graphics process include special-shaped flexible circuit board panels.

Specifically, a roll-to-roll inner layer pattern process is performed on the flexible circuit board substrate. Among them, the roll-to-roll inner layer graphic process processing specifically includes: pre-treatment micro-etching, photosensitive layer film, exposure, development, etching, and film stripping and other branch processing processes. The branch processing flow is basically the same as that of the circuit board. This will not be repeated. The difference is that the whole process of this embodiment adopts a roll-to-roll processing method. Before each process starts, a traction board needs to be attached to the front end of the special-shaped flexible circuit board substrate 100 to be processed. The 100 is pulled to the take-up reel, and the pulling plate will produce a pulling effect in each process. Wherein, the exposure pattern in the roll-to-roll inner layer pattern process includes a special-shaped flexible circuit board panel.

Specifically, the special-shaped flexible circuit board panel is bent or curved. The bending type includes a one-time bending type (see Figure 2) and a multiple bending type (see Figure 3). The curved shape is a meniscus shape (see Fig. 4 ), an S shape (see Fig. 5 ) or a wave shape.

Step S300 : performing a roll-to-roll drilling process and a roll-to-roll electroplating process on the flexible circuit board substrate in sequence.

Specifically, sequentially performing the roll-to-roll drilling process and the roll-to-roll electroplating process on the flexible circuit board substrate includes:

performing a roll-to-roll drilling process on the flexible circuit board substrate;

A roll-to-roll electroplating process is performed on the flexible circuit board substrate.

Wherein, performing the roll-to-roll drilling process on the flexible circuit board substrate includes adopting the method of successive drilling, that is, using a drilling machine with open ends, through local positioning, alignment, and local drilling (for example, Drilling holes one by one unit board, that is, a single special-shaped flexible circuit board group 102 ), forms the effect of section-by-section drilling.

The roll-to-roll drilling process processing on the flexible circuit board substrate is specifically performed by electroplating with a horizontal electroplating line. The method of using the horizontal electroplating line for electroplating processing refers to the existing horizontal electroplating line processing method, which will not be repeated here.

Step S400 : sequentially performing a roll-to-roll solder resist process and a roll-to-roll surface treatment process on the flexible circuit board substrate.

Specifically, sequentially performing the roll-to-roll solder mask process and the roll-to-roll surface treatment process on the flexible circuit board substrate specifically includes:

performing a roll-to-roll solder resist process on the flexible circuit board substrate;

A roll-to-roll surface treatment process is performed on the flexible circuit board substrate.

Wherein, the roll-to-roll solder mask process processing on the flexible circuit board substrate is specifically the roll-to-roll screen printing solder mask process processing, which refers to the use of a solder mask screen printing machine with open ends to perform segment-by-segment alignment and segment-by-segment screen printing. Processing method. Among them, the roll-to-roll solder mask process processing specifically includes: screen printing, pre-baking, exposure, and development and other branch processing processes.

In this embodiment, the entire processing process is roughly as follows: on the screen printing table, the flexible circuit board substrate 100 is subjected to a screen printing process by a screen printing scraper. The tension clamp of the screen printing machine tensions the flexible circuit board substrate 100 (that is, clamps the edge of the flexible circuit board substrate 100), and sends the flexible circuit board substrate 100 into the oven. The oven also includes oven clamps, and the oven clamps also clamp the flexible circuit board substrate. On the edge of the board 100, pre-bake the flexible circuit board substrate 100. In this embodiment, a horizontally continuous oven is used to bake the flexible circuit board substrate 100 roll-to-roll. Further, the rear end of the oven is connected to the exposure machine, and the solder mask exposure process is specifically processed by using open exposure at both ends and exposure by segment. The solder mask exposure process is followed by a solder mask development process, and the solder mask development process is a horizontal roll-to-roll development process.

Further, performing the roll-to-roll surface treatment process on the flexible circuit board substrate is specifically a processing method using a horizontal roll-to-roll surface treatment equipment. In other embodiments, if there is no corresponding horizontal surface treatment processing equipment, the flexible circuit board substrate 100 processed by roll-to-roll processing is first divided into independent special-shaped flexible circuit board groups 102. 102 performs surface treatment process processing.

Step S500 : performing a roll-to-roll forming process on the flexible circuit board substrate to obtain a flexible circuit board.

Specifically, performing a roll-to-roll forming process on the flexible circuit board substrate to obtain a flexible circuit board is to form the flexible circuit board substrate 100 into a single flexible circuit board 101 .

In this embodiment, the roll-to-roll surface treatment process adopts the horizontal roll-to-roll surface treatment process. The roll-to-roll forming process of the flexible circuit board substrate is specifically divided into:

performing a first roll-to-roll forming process on the flexible circuit board substrate;

A second molding process is performed on the flexible circuit board substrate.

Specifically, when the roll-to-roll surface treatment is processed by horizontal roll-to-roll surface treatment equipment, the roll-to-roll forming process will be divided into two roll-to-roll forming processes, that is, the first roll-to-roll processing is performed first. The flexible circuit board substrate 100 is divided into independent flexible circuit board groups 102; the processed flexible circuit board group 102 is divided for the second time, that is, the unit board flexible circuit board 101 of the flexible circuit board group 102 is formed. . In other embodiments, if the long board of the flexible circuit board 100 has been divided into independent flexible circuit board groups 102 with a special-shaped structure before the surface treatment process, the flexible circuit board group 102 with a special-shaped structure is directly processed in the special-shaped structure board. The molding process of the unit board flexible circuit board 101 .

The manufacturing method of the flexible circuit board provided by the present invention obtains a special-shaped flexible circuit board by performing a roll-to-roll processing process on the flexible circuit board substrate. The manufacturing method has a novel processing method and can effectively improve the utilization rate of the board.

Please refer to FIG. 7 , this embodiment is basically the same as the first embodiment, the difference is that the flexible circuit board 101 of this embodiment is a multi-layer flexible circuit board, and its processing and manufacturing process is basically the same, the difference is that the manufacturing process increases Roll-to-roll lamination process and roll-to-roll outer layer graphics process. The specific steps of the method for manufacturing a multilayer flexible circuit board in this embodiment include:

Step S100 : providing an open flexible circuit board substrate, the flexible circuit board substrate is provided with a positioning hole, and the positioning hole is used for positioning in a subsequent process.

The steps are basically the same as those of the first embodiment, refer to the above.

Step S200 : performing a roll-to-roll inner layer graphics process on the flexible circuit board substrate, wherein the exposure patterns in the roll-to-roll inner layer graphics process include special-shaped flexible circuit board panels.

The steps are basically the same as those of the first embodiment, refer to the above.

Step S600 : performing a roll-to-roll lamination process on the flexible circuit board substrate to obtain a laminated multi-layer flexible circuit board.

Specifically, a roll-to-roll lamination process is performed on the flexible circuit board substrate to obtain a laminated multi-layer flexible circuit board. Specifically, the different layers are arranged one by one and aligned by patterns (aligned by patterns). Orifice alignment, or use the built-in X-ray probe to directly capture graphic alignment), and perform roll-to-roll lamination.

Step S300 : performing a roll-to-roll drilling process and a roll-to-roll electroplating process on the flexible circuit board substrate in sequence.

The steps are basically the same as those of the first embodiment, refer to the above.

Step S700 : performing a roll-to-roll outer layer graphics process on the laminated multi-layer flexible circuit board, wherein the exposure patterns in the roll-to-roll outer layer graphics process include special-shaped flexible circuit board panels.

In this embodiment, the process of the roll-to-roll outer layer graphics process is basically the same as the roll-to-roll inner layer graphics process process, which is not repeated here.

Wherein, the roll-to-roll inner layer graphics process and the roll-to-roll outer layer graphics process both include exposure process processing, and the exposure process processing includes:

performing a dry film sticking process on the flexible circuit board substrate or the laminated multi-layer flexible circuit board;

A segment-by-segment exposure process is performed on the flexible circuit board substrate or the laminated multi-layer flexible circuit board, wherein the segment-by-segment exposure process is performed in a vacuum state.

Further, the dry film sticking process is to apply dry film to the entire flexible circuit board substrate 100 , but between each flexible circuit board group 102 , dry film cutting with a special-shaped structure using a knife or a laser is required.

The exposure process is specifically a processing method of open exposure at both ends and segment-by-segment exposure. That is, both ends of the exposure machine are open, the flexible circuit board groups 102 enter the exposure area one by one, and the exposure machine performs vacuuming for exposure.

Step S400 : sequentially performing a roll-to-roll solder resist process and a roll-to-roll surface treatment process on the flexible circuit board substrate.

The steps are basically the same as those of the first embodiment, refer to the above.

Step S500 : performing a roll-to-roll forming process on the flexible circuit board substrate to obtain a flexible circuit board.

The steps are basically the same as those of the first embodiment, refer to the above.

In summary, by setting irregular-shaped or special-shaped flexible circuit boards with special-shaped panels designed and realized according to their shapes, the utilization rate of the board can be effectively improved, and the cost can be effectively saved; and the roll-to-roll processing for special-shaped panels can be set up. The technical matching of each process is adopted to form a process technology of roll-to-roll processing, which can effectively realize the efficient processing of special-shaped panels, and provide a full range of technologies from paneling methods to processing technologies for the processing of double-layer or multi-layer flexible circuit boards.

To sum up, in the technical solution of the present invention, in the manufacturing method of the flexible circuit board provided by the present invention, a special-shaped flexible circuit board is obtained by performing a roll-to-roll processing process on the flexible circuit board substrate. The processing method of the manufacturing method It is novel and can effectively improve the utilization rate of the board.

The above descriptions are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structural transformations made by the contents of the description and drawings of the present invention, or the direct/indirect application Other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. A manufacturing method of a flexible circuit board is characterized in that the flexible circuit board is a special-shaped flexible circuit board, and the manufacturing method comprises the following steps:

providing a cut flexible circuit board substrate, wherein the flexible circuit board substrate is provided with a positioning hole, and the positioning hole is used for positioning in a post process;

carrying out roll-to-roll inner layer figure process treatment on the flexible circuit board substrate, wherein an exposure figure in the roll-to-roll inner layer figure process comprises a special-shaped flexible circuit board spliced board;

sequentially carrying out a roll-to-roll drilling process and a roll-to-roll electroplating process on the substrate of the flexible circuit board;

sequentially carrying out a roll-to-roll solder resisting process and a roll-to-roll surface treatment process on the substrate of the flexible circuit board;

and carrying out roll-to-roll forming process treatment on the substrate of the flexible circuit board to obtain the flexible circuit board.

2. The method of claim 1, wherein the step of sequentially performing the roll-to-roll drilling process and the roll-to-roll electroplating process on the flexible circuit board substrate comprises:

and carrying out roll-to-roll lamination process treatment on the substrate of the flexible circuit board to obtain a laminated multilayer flexible circuit board.

3. The manufacturing method of claim 2, wherein the step of sequentially performing the roll-to-roll solder mask process and the roll-to-roll surface treatment process on the flexible circuit board substrate comprises the following steps:

and carrying out a roll-to-roll outer layer figure process treatment on the laminated multilayer flexible circuit board, wherein an exposure figure in the roll-to-roll outer layer figure process comprises a special-shaped flexible circuit board spliced board.

4. The production method according to claim 1 or 3, wherein the roll-to-roll inner layer patterning process and the roll-to-roll outer layer patterning process include an exposure process, and the exposure process includes:

carrying out dry film pasting process on the flexible circuit board substrate or the laminated multilayer flexible circuit board;

and carrying out exposure process treatment on the flexible circuit board substrate or the laminated multilayer flexible circuit board section by section, wherein the exposure process section by section is carried out in a vacuum state.

5. The method of claim 1, wherein the roll-to-roll surface treatment process is a horizontal roll-to-roll surface treatment process.

6. The method of claim 5, wherein the step of performing a roll-to-roll forming process on the flexible circuit board substrate comprises:

carrying out first roll-to-roll forming procedure treatment on the substrate of the flexible circuit board;

and carrying out secondary molding procedure treatment on the flexible circuit board substrate.

7. The method as claimed in claim 1, wherein the shaped flexible circuit board panels are bent or curved.

8. The method of claim 7, wherein the bending types include one-time bending type and multi-time bending type.

9. The method of claim 7, wherein the curve is meniscus, S-shaped, or wavy.

10. A flexible circuit board, characterized in that it is manufactured by the manufacturing method of any one of claims 1 to 9.

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