CN114425659A - Laser stripping method and laser processing equipment - Google Patents
Laser stripping method and laser processing equipment Download PDFInfo
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- CN114425659A CN114425659A CN202011186537.3A CN202011186537A CN114425659A CN 114425659 A CN114425659 A CN 114425659A CN 202011186537 A CN202011186537 A CN 202011186537A CN 114425659 A CN114425659 A CN 114425659A
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- 229920001721 polyimide Polymers 0.000 claims abstract description 89
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 75
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical group O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 44
- 230000003287 optical effect Effects 0.000 claims description 25
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 22
- 239000001569 carbon dioxide Substances 0.000 claims description 20
- 238000007493 shaping process Methods 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 238000003384 imaging method Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 abstract 4
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 3
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 229920006267 polyester film Polymers 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0461—Welding tables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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Abstract
The invention belongs to the technical field of laser processing, and relates to a laser stripping method and laser processing equipment, wherein the laser stripping method is applied to a flexible display panel, and comprises the following steps: planning a first processing path and a second processing path according to the position information of the flexible display panel; cutting the first polyimide layer by the first laser beam according to the first processing path to obtain a target cutting material; according to the second processing path, the second laser beam scans the bonding surface layer of the silicon oxide layer and the target cutting material through the target cutting material of the first polyimide layer so as to separate the target cutting material from the silicon oxide layer; a target flexible display panel with a light-transmitting cavity is obtained. The laser stripping method and the laser processing equipment provided by the invention can obtain the target flexible display panel, and the target under-screen camera is arranged at the light transmission cavity of the target flexible display panel, so that the color cast degree of transmitted light can be reduced, and the requirement of the target under-screen camera on the imaging effect can be met.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser stripping method and laser processing equipment.
Background
The smart phone rapidly develops to a full screen in recent years, and how to set a front camera becomes a core problem in order to realize a real full screen.
The difficulty of the screen camera technology is that the imaging quality of the camera below the screen is not influenced while the normal display function of the screen is realized. Compared with a low-temperature polycrystalline silicon liquid crystal display (LTPS-LCD) screen, the organic light emitting diode display (OLED) screen is self-luminous, does not need a backlight source, is thin in thickness, is easy to achieve high light transmittance, becomes a necessary choice of a camera technology under the screen, and is a technical focus if the light transmittance of the OLED screen is improved.
For an OLED display screen, particularly an OLED flexible screen, a flexible display panel may be made of plastic, a polyester film or a film, and since an electrode or a Thin Film Transistor (TFT) and other elements need to be disposed on the flexible display panel, a substrate of the flexible display panel is generally a high temperature resistant polymer, and a most used substrate is a high temperature resistant Polyimide (PI) material, while polyimide commonly used in the industry at present is yellow, which may cause a color cast in transmitted light emitted by a camera, and cannot meet the requirement of the camera under the screen for an imaging effect.
Disclosure of Invention
The embodiment of the invention aims to solve the technical problem that the existing flexible display panel cannot meet the requirement of an under-screen camera on the imaging effect.
In order to solve the above technical problem, an embodiment of the present invention provides a laser lift-off method, which adopts the following technical solutions:
the laser lift-off method is applied to a flexible display panel, the flexible display panel comprises a first polyimide layer and a silicon oxide layer which are arranged in a stacked mode, and the laser lift-off method comprises the following steps:
planning a first processing path and a second processing path according to a preset processing pattern and the position information of the flexible display panel to be processed;
cutting the first polyimide layer by a first laser beam emitted by a first laser according to the first processing path to obtain a target cutting material with the same shape and size as the preset processing pattern;
scanning the bonding layer surface of the silicon oxide layer and the target cutting material through the target cutting material of the first polyimide layer by a second laser beam emitted by a second laser according to the second processing path so as to separate the target cutting material from the silicon oxide layer;
and removing the target cutting material from the silicon oxide layer to obtain a target flexible display panel with a light-transmitting cavity, wherein the light-transmitting cavity is used for installing a target under-screen camera.
Optionally, the first laser is an ultraviolet laser, the first laser beam is an ultraviolet laser beam, the wavelength of the ultraviolet laser beam is 300-400 nm, and the pulse width range of the ultraviolet laser beam is 1-100ps or 10-500 fs.
Optionally, the second laser is a carbon dioxide laser, the second laser beam is a carbon dioxide laser beam, and the wavelength of the carbon dioxide laser beam is 9300nm to 11000 nm.
Optionally, the shape and size of the preset processing pattern are set according to the shape and size of the target under-screen camera.
Optionally, the step of cutting the first polyimide layer by a first laser beam emitted by a first laser according to the first processing path specifically includes:
cutting the first polyimide layer along the first processing path by a first laser beam emitted by a first laser through a first optical path system;
or, the flexible display panel is driven by the processing platform to move along the first processing path, so that the first laser beam emitted by the first laser cuts the first polyimide layer along the first processing path.
Optionally, the step of cutting the first polyimide layer along the first processing path by the first laser beam emitted by the first laser through the first optical path system specifically includes:
after being collimated by the first beam expander, a first laser beam emitted by the first laser device sequentially passes through the first reflector, the first vibrating mirror and the first focusing mirror and then is focused on the first polyimide layer, and the first polyimide layer is cut along the first processing path.
Optionally, the scanning, according to the second processing path, the step of scanning the bonding layer surface of the silicon oxide layer and the target cutting material through the target cutting material of the first polyimide layer by a second laser beam emitted by the second laser includes:
scanning the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path by a second laser beam emitted by a second laser through a second optical path system;
or the flexible display panel is driven by the processing platform to move along the second processing path so that a second laser beam emitted by a second laser scans the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path.
Optionally, the step of scanning the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path by a second laser beam emitted by a second laser through a second optical path system specifically includes:
and a second laser beam emitted by a second laser is shaped into flat top light by a beam shaping module, and the flat top light sequentially passes through a second reflecting mirror, a second vibrating mirror and a second focusing mirror and then penetrates through the target cutting material focused by the first polyimide layer to reach the bonding layer surface of the silicon oxide layer and the target cutting material, so that the flat top light scans the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path.
Optionally, the first polyimide layer has a thickness in the range of 1-20 um; the thickness of the silicon oxide layer ranges from 100 nm to 1000 nm.
In order to solve the above technical problem, an embodiment of the present invention further provides a laser processing apparatus, where the laser processing apparatus is configured to execute the laser lift-off method described above, and the laser processing apparatus includes:
the visual module is used for acquiring the position information of the flexible display panel;
the first laser is used for emitting a first laser beam, so that the first laser beam cuts the first polyimide layer along a first processing path to obtain a target cutting material with the same shape and size as a preset processing pattern;
the second laser is used for emitting a second laser beam, and the second laser beam scans the bonding layer surface of the silicon oxide layer and the target cutting material along a second processing path so as to separate the target cutting material from the silicon oxide layer;
a first optical path system for focusing the first laser beam onto the first polyimide layer;
a second optical path system for focusing the second laser beam onto the bonding layer surface of the silicon oxide layer and the target cutting material;
the processing platform is used for placing the flexible display panel and can drive the flexible display panel to move;
and the control system is electrically connected with the vision module, the first laser, the second laser, the first light path system, the second light path system and the processing platform.
Compared with the prior art, the laser stripping method and the laser processing equipment provided by the embodiment of the invention have the following main beneficial effects:
the laser stripping method is applied to a flexible display panel, and a first laser beam emitted by a first laser cuts a first polyimide layer according to a first processing path to obtain a target cutting material with the same shape and size as a preset processing pattern; according to the second processing path, a second laser beam emitted by a second laser penetrates through the target cutting material of the first polyimide layer and scans the combined layer surface of the silicon oxide layer and the target cutting material along the second processing path so as to separate the target cutting material from the silicon oxide layer; the target cutting material is removed from the silicon oxide layer, the target flexible display panel with the light transmission cavity is obtained, the camera under the target screen can be arranged at the light transmission cavity of the target flexible display panel, the transmission light in the external environment is transmitted to the camera under the target screen through the light transmission part to be imaged, and due to the fact that the target cutting material in the yellow first polyimide layer is removed, the color cast degree of the transmission light is reduced through the transmission light emitted from the light transmission cavity, the imaging effect of the camera under the target screen is improved, and the requirement of the camera under the target screen for the imaging effect is also met.
Drawings
In order to more clearly illustrate the solution of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive effort. Wherein:
FIG. 1 is a main flow chart of a laser lift-off method in one embodiment of the present invention;
FIG. 2 is an overall flow diagram of a laser lift-off method in one embodiment of the invention;
FIG. 3 is a detailed flowchart of step S400 in FIG. 1;
FIG. 4 is a detailed flowchart of step S500 in FIG. 1;
FIG. 5 is a flow chart of a laser lift-off method according to a first embodiment of the present invention;
FIG. 6 is a flow chart of a laser lift-off method according to a second embodiment of the present invention;
FIG. 7 is a graph of the transmittance spectrum of a first polyimide layer in accordance with one embodiment of the present invention;
FIG. 8 is a transmittance vs. wavenumber plot for a first polyimide layer in an embodiment of the present invention;
FIG. 9 is a graph of the transmittance of a silicon oxide layer in accordance with an embodiment of the present invention;
FIG. 10 is a schematic diagram illustrating the front and back effects of a flexible display panel being laser stripped according to an embodiment of the present invention;
fig. 11 is a schematic view of a laser processing apparatus in an embodiment of the present invention.
The reference numbers in the drawings are as follows:
100. laser processing equipment;
1. a control system; 2. a vision module; 3. a first laser; 4. a second laser; 5. a first optical path system; 6. a second optical path system; 7. a processing platform;
8. a flexible display panel; 81. a first polyimide layer; 811. cutting a target material; 812. a light-transmitting cavity; 82. a silicon oxide layer; 83. a second polyimide layer; 84. a light emitting layer; 85. a touch layer; 86. and a polarizing layer.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, e.g., the terms "upper", "lower", etc. indicate orientations or positions based on the orientations or positions shown in the drawings, which are for convenience of description only and are not to be construed as limiting the technical aspects.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order. The meaning of "plurality" is two or more unless specifically limited otherwise.
An embodiment of the present invention provides a laser lift-off method, which is applied to a flexible display panel 8, as shown in fig. 1 and 10, the flexible display panel 8 includes a first polyimide layer 81 and a silicon oxide layer 82, which are stacked on each other, and the laser lift-off method includes the following steps:
step S300, planning a first processing path and a second processing path according to a preset processing pattern and the position information of the flexible display panel 8 to be processed;
step S400, cutting the first polyimide layer 81 by a first laser beam emitted by the first laser 3 according to the first processing path to obtain a target cutting material 811 having the same shape and size as the preset processing pattern, that is, cutting the first polyimide layer 81 by the first processing path to obtain a required shape pattern;
step S500, according to the second processing path, the second laser beam emitted by the second laser 4 scans the bonding layer (not shown in the figure) of the silicon oxide layer 82 and the target cutting material 811 through the target cutting material 811 of the first polyimide layer 81, so as to separate the target cutting material 811 from the silicon oxide layer 82, so that the target cutting material 811 can be easily removed from the silicon oxide layer without damaging the silicon oxide layer 82;
step S600, removing the target cutting material 811 from the silicon oxide layer 82 to obtain the target flexible display panel 8 with the light-transmitting cavity 812, and then the target under-screen camera can be disposed at the light-transmitting cavity 812 of the target flexible display panel 8.
In summary, compared with the prior art, the laser lift-off method has at least the following beneficial effects: the target cutting material 811, namely a part of the first polyimide layer 81, is removed from the silicon oxide layer 82 by the laser lift-off method, so that the target flexible display panel 8 with the light-transmitting cavity 812 can be obtained, the target under-screen camera can be arranged at the light-transmitting cavity 812 of the target flexible display panel 8, the transmitted light in the external environment is transmitted to the target under-screen camera through the light-transmitting part 812 for imaging, and due to the removal of the target cutting material 811 in the yellow first polyimide layer 81, the transmitted light emitted through the light-transmitting part 812 can reduce the color cast degree of imaging, so that the imaging effect of the target under-screen camera is improved, and the requirement of the target under-screen camera on the imaging effect is also met.
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 8.
In some embodiments, as shown in fig. 10, the flexible display panel 8 further includes a second polyimide layer 83, a light emitting layer 84, a touch layer 85, a polarizing layer 86, and the like in addition to the first polyimide layer 81 and the silicon oxide layer 82, wherein the first polyimide layer 81, the silicon oxide layer 82, and the second polyimide layer 83 may be combined to form a flexible substrate of the flexible display panel 8, and the silicon oxide layer 82 may be used to encapsulate and insulate water and oxygen.
In some embodiments, as shown in fig. 2, before the step of planning the first processing path and the second processing path according to the preset processing pattern and the position information of the flexible display panel 8, that is, before the step S300, the method further includes:
step S200, obtaining the position information of the flexible display panel 8 through the vision module 2.
It can be understood that the flexible display panel 8 is provided with an identification pattern for positioning, such as a square, a circle, a cross, etc., the identification pattern on the flexible display panel 8 is shot through the vision module 2, the position information of the identification pattern is obtained through algorithm calculation, and the preset processing pattern is combined, so that the position information of the position to be processed on the flexible display panel 8 is obtained.
In some embodiments, as shown in fig. 2, before the step of acquiring the position information of the flexible display panel 8 by the vision module 2, that is, before step S200, the method further includes:
step S100, the flexible display panel 8 to be processed is loaded on the processing platform 7.
It is understood that when the flexible display panel 8 to be processed is loaded on the processing platform 7, the first polyimide layer 81 is located on top of the silicon oxide layer 82, and the first polyimide layer 81 is also the topmost layer of the flexible display panel 8.
In some embodiments, the first laser 3 may be an ultraviolet laser (UV laser), and correspondingly, the first laser beam may be an ultraviolet laser beam (UV laser beam) having a wavelength of 300nm to 400nm, and a pulse width of 1 to 100ps or 10 to 500 fs; preferably, the wavelength of the ultraviolet laser beam is 343nm or 355nm, and the pulse width of the ultraviolet laser beam is in the range of 2 to 50 ps.
It is understood that, as shown in fig. 7, the polyimide material, i.e., the first polyimide layer 81, has very low transmittance, i.e., very high absorptivity, with respect to the ultraviolet laser beam having the wavelength of 343nm or 355 nm. The ultraviolet laser beam with the wavelength is used for cutting the first polyimide layer 81, so that the target cutting material 811 can be cut off from the first polyimide layer 81, the silicon oxide layer 82 cannot be damaged, and a good processing effect of the flexible display panel 8 is obtained; in addition, by using the ultrafast ultraviolet laser beam having a pulse width unit of ps or fs, the processing thermal influence can be effectively reduced, the damage to the first polyimide layer 81 in the peripheral region can be avoided, and the yield can be improved.
When the first polyimide layer 81 is cut by the first laser beam emitted from the first laser 3, the cutting depth is controlled by adjusting the processing parameters such as the power, frequency, and processing speed of the first laser beam with reference to the known thickness of the first polyimide layer 81, so as to avoid damage to the silicon oxide layer 82.
In some embodiments, the second laser 4 may be a carbon dioxide laser (CO2 laser), correspondingly, the second laser beam is a carbon dioxide laser beam (CO2 laser beam), which may have a wavelength of 9300nm to 11000 nm; preferably, the wavelength of the oxidized carbon laser beam is 9600 nm.
It is understood that, as shown in fig. 8, which is a graph of transmittance vs. wavenumber of the polyimide material, the transmittance of the carbon dioxide laser beam is 95%, so that the carbon dioxide laser beam can smoothly act through the first polyimide layer 81.
Meanwhile, as shown in fig. 9, the transmittance curve of the silicon oxide layer 82 is shown, and the wave number k is about 1040cm-1 when the wavelength λ is 9.6um, and it can be seen from the curve that the transmittance of the silicon oxide layer 82 to the carbon dioxide laser beam is low and does not reach 20%, that is, the absorption rate exceeds 80%, the carbon dioxide laser beam is focused on the bonding layer between the silicon oxide layer 82 and the first polyimide layer 81, and the high energy of the carbon dioxide laser beam acts on the material, so that the material of a very thin silicon oxide layer 82 is vaporized, and the silicon oxide layer 82 is separated from the first polyimide layer 81.
Note that, when the bonding layer surface of the silicon oxide layer 82 and the first polyimide layer 81 is scanned with the second laser beam emitted by the second laser 4.
In summary, the target cutting member 811 is peeled off from the silicon oxide layer 82 by the carbon dioxide laser beam, so that the target cutting member 811 can be peeled off from the silicon oxide layer 82 without damaging the silicon oxide layer 82, the second polyimide layer 83, and other layers in the inner layer of the flexible display panel 8, and excellent water and oxygen barrier properties can be maintained, and a good processing effect can be obtained.
In some embodiments, the shape and size of the predetermined processing pattern are set according to the shape and size of the target under-screen camera, so that the first polyimide layer 81 does not block the target under-screen camera.
In some embodiments, as shown in fig. 3, as an implementation manner of step S400, the step of cutting the first polyimide layer 81 by the first laser beam emitted by the first laser 3 according to the first processing path specifically includes:
step S400a cuts the first polyimide layer 81 along the first processing path by the first laser beam emitted from the first laser through the first optical path system 5.
Alternatively, in some embodiments, as another implementation manner of step S400, the step of cutting the first polyimide layer 81 by the first laser beam emitted by the first laser 3 according to the first processing path specifically includes:
step S400b, the flexible display panel 8 is driven by the processing platform 7 to move along the first processing path, so that the first laser beam emitted by the first laser cuts the first polyimide layer 81 along the first processing path.
In some embodiments, the step S400a of cutting the first polyimide layer 81 along the first processing path by the first laser beam emitted by the first laser through the first optical path system 5 specifically includes:
a first laser beam emitted by the first laser is collimated by the first beam expander, then sequentially passes through the first reflector, the first galvanometer and the first focusing mirror, and is focused on the first polyimide layer 81, and the first polyimide layer 81 is cut along the first processing path, so as to obtain a target cutting material 811.
In some embodiments, as shown in fig. 4, as an implementation manner of step S500, the step of scanning the bonding layer of the silicon oxide layer 82 and the target cutting 811 through the target cutting 811 of the first polyimide layer 81 by the second laser beam emitted by the second laser 4 according to the second processing path specifically includes:
step S500a, scanning the bonding layer of the silicon oxide layer 82 and the target cutting material 811 along the second processing path by the second laser beam emitted by the second laser through the second optical path system 6.
Alternatively, in some embodiments, as another implementation manner of the step S500, the step of scanning the bonding layer of the silicon oxide layer 82 and the target cutting 811 by the second laser beam emitted by the second laser 4 through the target cutting 811 of the first polyimide layer 81 according to the second processing path specifically includes:
step S500b, the processing platform 7 drives the flexible display panel 8 to move along the second processing path, so that the second laser beam emitted by the second laser scans the bonding layer of the silicon oxide layer 82 and the target cutting material 811 along the second processing path.
In some embodiments, the second laser beam emitted by the second laser is scanned along the second processing path by the second optical path system 6 at the junction level of the silicon oxide layer 82 and the target cutting material 811, that is, step S500a specifically includes:
the second laser beam emitted by the second laser is shaped into flat top light by the beam shaping module, and the flat top light passes through the second reflecting mirror, the second vibrating mirror and the second focusing mirror in sequence and then passes through the target cutting material 811 focused by the first polyimide layer 81 to reach the bonding layer of the silicon oxide layer 82 and the target cutting material 811, so that the flat top light scans the bonding layer of the silicon oxide layer 82 and the target cutting material 811 along the second processing path, and the target cutting material 811 is separated from the silicon oxide layer 82.
In some embodiments, the thickness of the first polyimide layer 81 may range from 1-20 um; the thickness of the silicon oxide layer 82 may range from 100 to 1000 nm.
In summary, in order to better understand the specific implementation process of the laser lift-off method provided by the embodiment of the present invention, two complete embodiments are respectively described as follows:
example one
As shown in fig. 5 and 10:
step S100', the flexible display panel 8 to be processed is loaded on the processing platform 7;
step 200', obtaining the position information of the flexible display panel 8 through the vision module 2;
step 300', a first processing path and a second processing path are planned according to the preset processing pattern and the position information of the flexible display panel 8 to be processed;
step S400 a', the ultraviolet laser beam emitted by the ultraviolet laser passes through the first vision system to cut the first polyimide layer 81 along the first processing path, so as to obtain a target cut material 811 having the same shape and size as the preset processing pattern;
step S500 a', the carbon dioxide laser beam emitted by the carbon dioxide laser passes through the second vision system to be able to penetrate through the target cutting material 811 of the first polyimide layer 81 and scan the bonding layer of the silicon oxide layer 82 and the target cutting material 811 along the second processing path, so as to separate the target cutting material 811 from the silicon oxide layer 82;
in step S600', the target cutting material 811 is manually removed from the silicon oxide layer 82 to obtain the target flexible display panel 8 with the light-transmitting cavity 812, and then the target under-screen camera can be disposed at the light-transmitting cavity 812 of the target flexible display panel 8.
Example two
As shown in fig. 6 and 10:
step S100', loading the flexible display panel 8 to be processed on the processing platform 7;
step S200', obtaining the position information of the flexible display panel 8 through the vision module 2;
step S300', a first processing path and a second processing path are planned according to a preset processing pattern and the position information of the flexible display panel 8 to be processed;
step S400b ″, an ultraviolet laser beam emitted by an ultraviolet laser is focused onto the first polyimide layer 81 by a first vision system, and the processing platform 7 moves along the first processing path to drive the flexible display panel 8 to move along the first processing path, so that the ultraviolet laser beam can cut the first polyimide layer 81 along the first processing path to obtain a target cutting material 811 having the same shape and size as the preset processing pattern;
step S500b ″, focusing a carbon dioxide laser beam emitted by the carbon dioxide laser through the first polyimide layer 81 by the second vision system onto the silicon oxide layer 82, and moving the processing platform 7 along the second processing path to drive the flexible display panel 8 to move along the second processing path, so that the carbon dioxide laser beam can scan the bonding layer of the silicon oxide layer 82 and the target cutting material 811 along the second processing path to separate the target cutting material 811 from the silicon oxide layer 82;
step S600 ″, the target cutting material 811 is removed from the silicon oxide layer 82 by the suction cup to obtain the target flexible display panel 8 with the light-transmitting cavity 812, and then the target under-screen camera can be disposed at the light-transmitting cavity 812 of the target flexible display panel 8.
An embodiment of the present invention further provides a laser processing apparatus 100, as shown in fig. 11, configured to perform the laser lift-off method described above, where the laser processing apparatus 100 includes:
the vision module 2 can be used for acquiring the position information of the flexible display panel 8;
the first laser 3 may be configured to emit a first laser beam, so that the first laser beam cuts the first polyimide layer 81 along a first processing path to obtain a target cutting material 811 having the same shape and size as the preset processing pattern;
the second laser 4 is used for reflecting a second laser beam, so that the second laser beam scans the bonding layer surface of the silicon oxide layer 82 and the target cutting material 811 along a second processing path, and the target cutting material 811 is separated from the silicon oxide layer 82;
a first optical path system 5 operable to focus the first laser beam onto the first polyimide layer 81;
a second optical path system 6 operable to focus the second laser beam onto the silicon oxide layer 82;
the processing platform 7 can be used for installing the flexible display panel 8 and can drive the flexible display panel 8 to move;
the control system 1 is electrically connected with the vision module 2, the first laser 3, the second laser 4, the first optical path system 5, the second optical path system 6 and the processing platform 7.
In some embodiments, the vision module 2 includes a camera, and the camera can photograph a specific mark on the flexible display panel 8, and then process an image of the photographed photograph and feed the processed image back to the control system 1, so as to position the flexible display panel 8 and ensure the processing accuracy.
In some embodiments, a large number of micropores are formed in the processing platform 7, the processing platform 7 can be connected with a vacuum pump, namely the flexible display panel 8 is fixed on the processing platform 7 in a vacuum adsorption mode, the flexible display panel 8 can be fixed while the flexible display panel 8 is prevented from warping, and therefore the uniform processing effect is guaranteed.
In some embodiments, the first optical path system 5 includes a first beam expander, a first galvanometer, and a first focusing mirror, wherein the first beam expander can be used for collimating and expanding the first laser beam; the first galvanometer can be used for controlling the transmission direction of the first laser beam and carrying out rapid scanning under the driving of a high-speed motor; a first focusing mirror may be used to focus the first laser beam onto the first polyimide layer 81, increasing the energy density to facilitate the cutting process on the first polyimide layer 81.
In some embodiments, the second optical path system 6 includes a second beam expander, a beam shaping device, a second galvanometer, and a second focusing lens, wherein the second beam expander can be used for collimating and expanding the second laser beam; the beam shaping device may be used to shape the gaussian-distributed second laser beam, in particular the carbon dioxide laser beam in the present embodiment, into a flat top light, in particular, the beam shaping device may be a diffractive optical element; the second galvanometer can be used for controlling the transmission direction of the second laser beam and carrying out rapid scanning under the driving of a high-speed motor; a second focusing mirror may be used to focus the second laser beam onto the bonded layer of the silicon oxide layer 82 and the first polyimide layer 81, increasing the energy density to facilitate the scanning process of the bonded layer of the silicon oxide layer 82 and the first polyimide layer 81.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A laser lift-off method is applied to a flexible display panel, the flexible display panel comprises a first polyimide layer and a silicon oxide layer which are arranged in a stacked mode, and the laser lift-off method is characterized by comprising the following steps:
planning a first processing path and a second processing path according to a preset processing pattern and the position information of the flexible display panel to be processed;
cutting the first polyimide layer by a first laser beam emitted by a first laser according to the first processing path to obtain a target cutting material with the same shape and size as the preset processing pattern;
scanning the bonding layer surface of the silicon oxide layer and the target cutting material through the target cutting material of the first polyimide layer by a second laser beam emitted by a second laser according to the second processing path so as to separate the target cutting material from the silicon oxide layer;
and removing the target cutting material from the silicon oxide layer to obtain a target flexible display panel with a light-transmitting cavity, wherein the light-transmitting cavity is used for installing a target under-screen camera.
2. The laser lift-off method of claim 1, wherein the first laser is an ultraviolet laser, the first laser beam is an ultraviolet laser beam, the wavelength of the ultraviolet laser beam is 300-400 nm, and the pulse width of the ultraviolet laser beam is 1-100ps or 10-500 fs.
3. The laser lift-off method according to claim 1 or 2, wherein the second laser is a carbon dioxide laser, the second laser beam is a carbon dioxide laser beam, and the wavelength of the carbon dioxide laser beam is 9300nm to 11000 nm.
4. The laser lift-off method of claim 1, wherein the shape and size of the predetermined processing pattern are set according to the shape and size of the target under-screen camera.
5. The laser lift-off method of claim 1, wherein said step of cutting said first polyimide layer by a first laser beam emitted by a first laser according to said first processing path comprises:
cutting the first polyimide layer along the first processing path by a first laser beam emitted by a first laser through a first optical path system;
or, the flexible display panel is driven by the processing platform to move along the first processing path, so that the first laser beam emitted by the first laser cuts the first polyimide layer along the first processing path.
6. The laser lift-off method of claim 5, wherein said step of cutting said first polyimide layer along a first processing path by a first laser beam emitted from a first laser via a first optical path system comprises:
after being collimated by the first beam expander, a first laser beam emitted by the first laser device sequentially passes through the first reflector, the first vibrating mirror and the first focusing mirror and then is focused on the first polyimide layer, and the first polyimide layer is cut along the first processing path.
7. The laser lift-off method of claim 1 wherein said step of scanning the bonding layer of said silicon oxide layer and said target kerf of said first polyimide layer through said target kerf of said first polyimide layer with a second laser beam emitted by said second laser according to said second processing path comprises:
scanning the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path by a second laser beam emitted by a second laser through a second optical path system;
or the flexible display panel is driven by the processing platform to move along the second processing path so that a second laser beam emitted by a second laser scans the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path.
8. The laser lift-off method of claim 7 wherein scanning the bonded interface of the silicon oxide layer and the target kerf along the second processing path with a second laser beam emitted by a second laser via a second optical path system comprises:
and a second laser beam emitted by a second laser is shaped into flat top light by a beam shaping module, and the flat top light sequentially passes through a second reflecting mirror, a second vibrating mirror and a second focusing mirror and then is focused on the bonding layer surface of the silicon oxide layer and the target cutting material through the target cutting material of the first polyimide layer, so that the flat top light scans the bonding layer surface of the silicon oxide layer and the target cutting material along the second processing path.
9. The laser lift-off method of claim 1 wherein the first polyimide layer has a thickness in the range of 1-20 um; the thickness of the silicon oxide layer ranges from 100 nm to 1000 nm.
10. A laser processing apparatus for performing the laser lift-off method of any one of claims 1 to 9, the laser processing apparatus comprising:
the visual module is used for acquiring the position information of the flexible display panel;
the first laser is used for emitting a first laser beam, so that the first laser beam cuts the first polyimide layer along a first processing path to obtain a target cutting material with the same shape and size as a preset processing pattern;
the second laser is used for emitting a second laser beam, and the second laser beam scans the bonding layer surface of the silicon oxide layer and the target cutting material along a second processing path so as to separate the target cutting material from the silicon oxide layer;
a first optical path system for focusing the first laser beam onto the first polyimide layer;
a second optical path system for focusing the second laser beam onto the bonding layer surface of the silicon oxide layer and the target cutting material;
the processing platform is used for placing the flexible display panel and can drive the flexible display panel to move;
and the control system is electrically connected with the vision module, the first laser, the second laser, the first light path system, the second light path system and the processing platform.
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