CN114449829A - Thermosiphon Radiator - Google Patents

Abstract

The invention discloses a thermosiphon radiator, comprising a base plate and a heat dissipation fin assembly. The base plate at least has a first receiving cavity, a second receiving cavity and a first plate surface, and the first plate surface is provided with at least a first heat dissipation station and a first plate surface. The second heat dissipation station; the heat dissipation fin assembly at least includes a first heat dissipation fin with a first gas-liquid channel and a second heat dissipation fin with a second gas-liquid channel, and the projection of the first gas-liquid channel at least partially overlaps the second heat dissipation fin. a accommodating cavity, the projection of the second gas-liquid channel at least partially overlaps the second accommodating cavity, and partially overlaps the first accommodating cavity; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered position and The first gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are staggered, and the second gas-liquid channel is located on the upper side of the second accommodating cavity. Therefore, the technical problem that the thermosiphon radiator cannot achieve good heat dissipation effect when dissipating heat from a plurality of heat sources with different heights and deviating from the horizontal direction is solved.

Description

Thermosiphon Radiator

technical field

The present invention relates to the technical field of heat dissipation, in particular to a thermosiphon radiator.

Background technique

In the past ten years, with the rapid development of communication equipment, supercomputing, data mining, e-commerce, artificial intelligence and other fields, the demand for total heat dissipation has increased sharply. Equipment miniaturization has further increased power density, while also exacerbating the need for efficient cooling solutions.

In the prior art, components with high heat flux density can be dissipated by means of thermosiphon heat sinks. When multiple heat sources with different heights are placed deviating from the horizontal direction, especially when the heat sources are placed vertically, the existing thermosiphon radiator cannot achieve good heat dissipation when dissipating heat from multiple heat sources with different heights and deviating from the horizontal direction. effect, which in turn will affect the normal working environment of the heat source.

SUMMARY OF THE INVENTION

Based on this, it is necessary to address the above problems and propose a thermosiphon radiator to solve the problem that the conventional thermosiphon radiator cannot achieve a good heat dissipation effect when dissipating heat from a plurality of heat sources with different heights and deviating from the horizontal direction. technical problem.

To this end, an embodiment provides a thermosiphon heat sink, comprising:

A base plate, the base plate has at least a first containing cavity and a second containing cavity spaced apart in the vertical direction, the first containing cavity is filled with a first phase change working medium, and the second containing cavity is filled with a second containing cavity Phase change working medium; the base plate further has a first plate surface, and the first plate surface is provided with at least a first heat dissipation station corresponding to the first receiving cavity and a second heat dissipation station corresponding to the second receiving cavity cooling station;

A heat dissipation fin assembly, the heat dissipation fin assembly at least includes a first heat dissipation fin corresponding to the first receiving cavity and disposed on the base plate, and a heat dissipation fin corresponding to the second receiving cavity and disposed on the base plate the second heat dissipation fin; the first heat dissipation fin has a first gas-liquid channel communicating with the first receiving cavity, and the second heat dissipation fin has a second gas-liquid channel communicating with the second receiving cavity a liquid channel, the projection of the first gas-liquid channel on the first plate surface at least partially overlaps the first receiving cavity, and the projection of the second gas-liquid channel on the first plate surface at least partially overlaps overlapped with the second accommodating cavity and partially overlapped with the first accommodating cavity; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered position, and the first A gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are staggered, and the second gas-liquid channel is located on the upper side of the second accommodating cavity.

In some embodiments of the thermosiphon heat sink, the substrate is at least divided into a first part, a second part and a third part arranged in sequence along the first direction, the second receiving cavity is provided in the first part, the The first receiving cavity is arranged in the second part, the first heat dissipation fin is arranged in the third part and can partially extend to the second part, and the second heat dissipation fin is arranged in the second part part and may extend in part to the first part.

In some embodiments of the thermosiphon radiator, it further includes at least a first heat source and a second heat source, the first heat source is arranged on the first heat dissipation station, and the liquid level of the first phase change working medium is high on top of the first heat source;

The second heat source is arranged on the second heat dissipation station, and the liquid level of the second phase change working medium is higher than the top of the second heat source.

In some embodiments of the thermosiphon heat sink, the projection of the first heat source on the first plate surface is located within the projection of the first phase change working medium on the first plate surface;

The projection of the second heat source on the first plate surface is located within the projection of the second phase change working medium on the first plate surface.

In some embodiments of the thermosiphon heat sink, the base plate is provided with a first communication hole and a second communication hole, the first communication hole communicates with the first gas-liquid channel and the first receiving cavity, and the The hole wall of the first communication hole on the side close to the first heat dissipation station is higher than the liquid level of the first phase change working medium or flush with the liquid level of the first phase change working medium; the The second communication hole communicates the second gas-liquid channel and the second receiving cavity, and the hole wall of the second communication hole on the side close to the second heat dissipation station is higher than that of the second phase change station The liquid level of the second phase change working medium is flush with the liquid level of the second phase change working medium.

In some embodiments of the thermosiphon heat sink, the base plate further has a second plate surface disposed opposite to the first plate surface, and the first heat dissipation fins and the second heat dissipation fins are both disposed on the first plate surface. on the second board.

In some embodiments of the thermosiphon radiator, the thermosiphon radiator further includes a heat dissipation member disposed corresponding to the second receiving cavity, and the heat dissipation member is on the second board surface.

In some embodiments of the thermosyphon heat sink, the projection of the second phase-change working medium on the first plate surface at least partially overlaps the projection of the heat sink on the first plate surface.

In some embodiments of thermosyphon heat sinks, the heat sinks are blown plate fins or solid fins.

In some embodiments of the thermosiphon heat sink, the first heat dissipation fin has a first liquid injection hole that communicates with the first gas-liquid channel; or the base plate has a first liquid injection hole that communicates with the first receiving cavity. The first injection hole;

The second heat dissipation fin has a second liquid injection hole that communicates with the second gas-liquid channel, or the base plate has a second liquid injection hole that communicates with the second accommodating cavity.

Adopting the embodiment of the present invention has the following beneficial effects:

The projection of the first gas-liquid channel on the first plate surface at least partially overlaps the first receiving cavity, so that the first gas-liquid channel is connected to the first receiving cavity, and the gaseous first phase-change working medium formed by thermal evaporation diffuses into the first gas-liquid channel The liquid channel condenses and releases heat; the projection of the second gas-liquid channel on the first plate surface at least partially overlaps the second receiving cavity, so that the second gas-liquid channel is connected to the second receiving cavity, so that the gaseous second phase formed by heated evaporation The modified working substance diffuses into the second gas-liquid channel to condense and release heat; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are staggered, and the first gas-liquid channel is located on the upper side of the first accommodating cavity, and the second The two accommodating cavities and the second gas-liquid channel are staggered and the second gas-liquid channel is located on the upper side of the second accommodating cavity. Therefore, the first gas-liquid channel is higher than the first accommodating cavity to prevent the first phase-change working medium from flowing into the first gas-liquid channel, the second gas-liquid channel is higher than the second receiving cavity to avoid the second phase change working medium flowing into the second gas-liquid channel; further, in the vertical direction of the substrate, the second gas-liquid channel is in the first plate The projection on the surface at least partially overlaps the first accommodating cavity, so as to make full use of the vacant space formed by the dislocation of the first gas-liquid channel and the first accommodating cavity on the substrate to arrange the position of the second gas-liquid channel, so that the first gas-liquid channel is arranged. The relative positions between the channel, the first accommodating cavity, the second gas-liquid channel and the second accommodating cavity are compactly arranged along the height extension direction of the substrate, so that a plurality of heat sources with different heights deviating from the horizontal direction can be dissipated; The combined action of two-phase heat exchange and steam movement dissipates heat from the first heat source arranged on the first heat dissipation station and the second heat source arranged on the second heat dissipation station to improve the heat dissipation effect of the thermosiphon radiator. That is, the technical problem that the thermosiphon radiator in the prior art cannot achieve good heat dissipation effect when dissipating heat from a plurality of heat sources with different heights and deviating from the horizontal direction is solved by using the technical solution.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

in:

1 shows a schematic diagram of the overall structure of a thermosiphon radiator provided according to the present invention;

Figure 2 shows a left side view of a thermosyphon heat sink in one implementation;

Figure 3 shows a left side view of a thermosyphon heat sink in another implementation;

FIG. 4 shows a schematic diagram of heat dissipation of a thermosiphon radiator provided according to an embodiment of the present invention.

Description of main component symbols:

100, thermosiphon radiator; 10, substrate; 11, first part; 12, second part; 13, third part; 10a, first receiving cavity; 10b, second receiving cavity; 10c, first board surface; 10d 10e, the first communication hole; 10f, the second communication hole; 10g, the first heat dissipation station; 10j, the second heat dissipation station; 21, the first heat source; 22, the second heat source; 30, Cooling fin assembly; 31, first cooling fin; 311, first gas-liquid channel; 312, first inner bottom surface; 32, second cooling fin; 321, second gas-liquid channel; 322, second inner bottom surface ; 40, heat sink.

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be implemented in various other forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for illustrative purposes only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to FIGS. 1 to 4 , in an embodiment of the present invention, a thermosiphon radiator 100 is provided. The thermosiphon radiator 100 cools power electronic devices through its own functions of heat conduction and heat release, such as cooling power electronic devices. The central processing unit, chip, etc. of the device dissipate heat to ensure that the power electronic device works stably within the rated temperature range.

The thermosiphon radiator 100 includes a base plate 10 and a heat dissipation fin assembly 30; the base plate 10 has at least a first receiving cavity 10a and a second receiving cavity 10b spaced along the vertical direction of the base plate 10, and the first receiving cavity 10a is filled with a first receiving cavity 10a and a second receiving cavity 10b. A phase-change working medium (not shown in the figure), the second receiving cavity 10b is filled with a second phase-change working medium (not shown in the figure); the substrate 10 further has a first plate surface 10c, and the first plate surface 10c at least A first heat dissipation station 10g corresponding to the first accommodating cavity 10a and a second heat dissipation station 10j corresponding to the second accommodating cavity 10b are provided. The heat dissipation fin assembly 30 at least includes a first heat dissipation fin 31 corresponding to the first receiving cavity 10a and disposed on the base plate 10 and a second heat dissipation fin 32 corresponding to the second receiving cavity 10b and disposed on the base plate 10; A heat dissipation fin 31 has a first gas-liquid channel 311 that communicates with the first receiving cavity 10a, and the second heat dissipation fin 32 has a second gas-liquid channel 321 that communicates with the second receiving cavity 10b. The first gas-liquid channel 311 is in the The projection on the first plate surface 10c at least partially overlaps the first receiving cavity 10a, and the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps the second receiving cavity 10b and partially overlaps the first receiving cavity 10b. Cavity 10a; in the vertical direction of the substrate 10, the first accommodating cavity 10a and the first gas-liquid channel 311 are staggered and the first gas-liquid channel 311 is located on the upper side of the first accommodating cavity 10a, the second accommodating cavity 10b and the first The two gas-liquid channels 321 are arranged in a staggered position, and the second gas-liquid channel 321 is located on the upper side of the second accommodating cavity 10b.

It should be noted that the first phase-change working medium filled in the first containing cavity 10a is in a state of saturation pressure and saturation temperature, and the second phase-change working medium filled in the second containing cavity 10b is at a saturation pressure and saturation temperature status.

The heat dissipation process of the thermosiphon radiator 100 is illustrated by taking the first heat source 21 arranged on the first heat dissipation station 10g as an example. A phase-change working medium; when the first phase-change working medium is cooled, the gaseous first phase-change working medium can be converted into a liquid first phase-change working medium. Therefore, after being heated by the first heat source 21, the first phase-change working medium in the first containment cavity 10a will absorb the heat of the first heat source 21 through rapid vaporization, and change from a liquid state to a gaseous state; the gaseous first phase-change working medium The mass will diffuse into the first gas-liquid channel 311 when heated, and the gaseous first phase change working medium condenses on the inner wall surface of the first heat dissipation fin 31 and releases a large amount of heat at the same time, and the heat passes through the inner wall surface of the first heat dissipation fin 31. The heat is transferred to the outer surface of the first cooling fin 31, and the heat on the outer surface of the first cooling fin 31 is then released to the environment through natural convection heat exchange with the environment, forced convection heat exchange or evaporative heat exchange and other heat exchange methods. In the environment, the liquid first phase-change working medium formed by condensation flows back from the first gas-liquid channel 311 to the holding cavity under the action of gravity and continues to be heated and evaporated, thereby completing the process between the first holding cavity 10a and the first holding cavity 10a through the first phase-change working medium. The phase change cycle between the first gas-liquid channels 311 transfers heat from the first heat source 21 to the first heat dissipation fins 31 . When the second heat source 22 is arranged on the second heat dissipation station 10j, the heat dissipation process of the second heat source 22 may refer to the heat dissipation process of the first heat source 21, which is not repeated here.

It should be noted that there are multiple first heat dissipation fins 31 and second heat dissipation fins 32 , each first heat dissipation fin 31 has a first gas-liquid channel 311 formed therein, and each second heat dissipation fin 32 A second gas-liquid channel 321 is formed therein. In this technical solution, the heat is quickly transferred to each of the first heat dissipation fins 31 and the second heat dissipation fins 32 through the phase change heat of the first phase change working medium and the second phase change working medium and the diffusion motion of the steam, and then Heat is released to the environment through natural convection heat transfer, see Figure 3 for details. Since the phase change heat can realize large heat exchange under a small temperature difference, and the steam diffuses very quickly, the temperature difference between the heat source and the heat dissipation fin assembly 30 is very small, which greatly reduces the heat source to the heat dissipation fin assembly 30. The thermal resistance improves the heat exchange efficiency of the thermosiphon radiator 100 .

In the invention, the projection of the first gas-liquid channel 311 on the first plate surface 10c at least partially overlaps the first accommodating cavity 10a so that the first gas-liquid channel 311 communicates with the first accommodating cavity 10a, so that the gaseous state formed by heated evaporation The first phase-change working medium diffuses into the first gas-liquid channel 311 to condense and release heat; the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps the second receiving cavity 10b so that the second gas-liquid channel 321 The second accommodating cavity 10b is communicated, so that the gaseous second phase-change working medium formed by thermal evaporation diffuses into the second gas-liquid channel 321 to condense and release heat; in the vertical direction of the substrate 10, the first accommodating cavity 10a and the first gaseous The liquid channel 311 is dislocated and the first gas-liquid channel 311 is located on the upper side of the first accommodating cavity 10a, the second accommodating cavity 10b and the second gas-liquid channel 321 are staggered, and the second gas-liquid channel 321 is located on the upper side of the second accommodating cavity 10b. On the upper side, therefore, the first gas-liquid channel 311 is higher than the first accommodating cavity 10a to prevent the first phase change working medium from flowing into the first gas-liquid channel 311, and the second gas-liquid channel 321 is higher than the second accommodating cavity 10b to avoid the first phase change working medium flowing into the first gas-liquid channel 311. The two-phase change working medium flows into the second gas-liquid channel 321; further, in the vertical direction of the substrate 10, the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps the first receiving cavity 10a, Thus, the position of the second gas-liquid channel 321 is arranged by making full use of the vacant space formed by the dislocation of the first gas-liquid channel 311 and the first receiving cavity 10a on the substrate 10, so that the first gas-liquid channel 311, the first receiving cavity 10a, The relative positions between the second gas-liquid channel 321 and the second accommodating cavity 10b are compactly arranged along the height extension direction of the substrate 10, so that a plurality of heat sources with different heights deviating from the horizontal direction can be dissipated; Together with the steam movement, the first heat source 21 arranged on the first heat dissipation station 10g and the second heat source 22 arranged on the second heat dissipation station 10j are dissipated to improve the heat dissipation effect of the thermosiphon radiator 100 . That is, the technical problem that the thermosiphon radiator in the prior art cannot achieve good heat dissipation effect when dissipating heat from a plurality of heat sources with different heights and deviating from the horizontal direction is solved by using the technical solution.

It should be noted that, as shown in FIG. 1-2, the above-mentioned first heat dissipation station 10g corresponds to the first accommodating cavity 10a, and the second heat dissipation station 10j corresponds to the second accommodating cavity 10b. The positions 10g are all arranged on the first plate surface 10c of the substrate 10 on the same surface as the first receiving cavity 10a, and the second heat dissipation stations 10j are all arranged on the first plate surface 10c of the substrate 10 and the second receiving cavity 10b. On the same surface, so that the heat of the first heat source 21 on the first heat dissipation station 10g can be directly transferred to the first heat source 21 in the first accommodating cavity 10a through the thin wall between the first plate surface 10c and the first accommodating cavity 10a. In terms of the phase change working medium, the heat of the second heat source 22 on the second heat dissipation station 10j can be directly transferred to the second phase in the second accommodating cavity 10b through the thin wall between the first plate surface 10c and the second accommodating cavity 10b. In terms of working medium, the first phase-change working medium absorbs heat and vaporizes to take away the heat from the first heat source 21 , and the second phase-change working medium absorbs heat and vaporizes to take away the heat from the second heat source 22 . In addition, the above-mentioned vertical direction of the substrate 10 is only a reference direction for describing the staggered arrangement of the first gas-liquid channel 311 and the first accommodating cavity 10a, and the staggered arrangement of the second gas-liquid channel 321 and the second accommodating cavity 10b, as shown in FIG. As shown in 1-3, when the substrate 10 is placed vertically, the vertical direction of the substrate 10 is the same as the Z direction as shown in FIG. The first heat source 21 on the station 10g is staggered in the Z direction as shown in FIG. 1 , and the second heat dissipation fins 32 are positioned as follows with respect to the second receiving cavity 10b and the second heat source 22 on the second heat dissipation station 10j. The Z direction shown in FIG. 1 is staggered; it can be understood that when the substrate 10 is placed horizontally, the vertical direction will also change accordingly, and the vertical direction at this time is the same as the horizontal direction; when the substrate 10 is placed obliquely , the vertical direction at this time will also be inclined relative to the horizontal plane.

When dissipating heat from the first heat source 21 and the second heat source 22 with different heights and deviating from the horizontal direction, in order to prevent the first heat source 21 and the second heat source 22 from drying out, the first phase change working medium needs to fully contact the entire first heat source. 21. The second phase change working medium needs to fully contact the entire second heat source 22. However, the first accommodating cavity 10a needs to communicate with the first gas-liquid channel 311 to diffuse the gaseous first phase-change working medium, and the second accommodating cavity 10b needs to communicate with the second gas-liquid channel 321 to diffuse the gaseous second phase-change working medium, In order to ensure sufficient filling amount of the first phase-change working medium and the second phase-change working medium, the first phase-change working medium flows into the first gas-liquid channel 311 and the second phase-change working medium flows into the second gas-liquid channel. In the case of 321, on the one hand, the filling amount of the first phase change working medium and the second phase change working medium will increase, causing unnecessary waste; on the other hand, the first phase change working medium flowing into the first gas-liquid channel 311 will Occupying the space of the first gas-liquid channel 311, the second phase change working medium flowing into the second gas-liquid channel 321 will occupy the space of the second gas-liquid channel 321, reducing the condensation area of the heated steam and limiting the cooling fin assembly 30 heat exchange efficiency. Therefore, in this technical solution, the first gas-liquid channel 311 and the first phase-change working medium are dislocated, and the second gas-liquid channel 321 and the second phase-change working medium are dislocated, that is, the first gas-liquid channel 311 is located in the first phase The second gas-liquid channel 321 is located directly above or above the side of the second phase-change working medium, which not only ensures sufficient contact of the heat source components to improve heat transfer efficiency, but also ensures the condensation of steam space.

It should be noted that, the base plate 10 of the thermosiphon radiator 100 can also be provided with three or four receiving cavities, and a plurality of sets of heat dissipation fins can be provided corresponding to the number of the receiving cavities, and the gas-liquid channels of the heat dissipation fins, The relative positions of the phase-change working medium and the heat source in the accommodating cavity are set in the structure of the above-mentioned thermosiphon radiator 100 with two accommodating cavities, so as to dissipate heat from multiple heat sources of different heights while ensuring a compact structure.

It should be noted that, the substrate 10 may be disposed deviating from the horizontal direction, that is, the substrate 10 may be disposed vertically or inclined relative to the horizontal direction. Specifically, the substrate 10 further has a second plate surface 10d disposed opposite to the first plate surface 10c. When a heat source 21 and the first heat dissipation fins 31 are located on the same side, and the second heat source 22 and the second heat dissipation fins 32 are located on the same side, the heat of the first heat source 21 and the second heat source 22 will affect the first heat dissipation fin 31 and the second heat dissipation fin 32. The heat dissipation of the two heat dissipation fins 32 generates interference, which ensures the heat exchange efficiency between the first heat dissipation fin 31 and the second heat dissipation fin 32 and the environment.

The substrate 10 may be composed of two metal substrates 10 to ensure thermal conductivity of the substrate 10 , and a substrate 10 having a first receiving cavity 10 a and a second receiving cavity 10 b is formed by the two metal substrates 10 .

Specifically, the substrate 10 is divided into at least a first part 11 , a second part 12 and a third part 13 arranged in sequence along the first direction. Part 12 is provided, the first fins 31 are provided on the third part 13 and extend partially to the second part 12 , and the second fins 32 are provided on the second part 12 and extend partially to the first part 11 . The first direction is the same as the vertical direction of the above-mentioned substrate 10 . In this embodiment, the first direction is the Z direction shown in FIG. 1 .

The thermosiphon radiator 100 further includes at least a first heat source 21 and a second heat source 22. Preferably, the first heat source 21 is arranged on the first heat dissipation station 10g, and the liquid level of the first phase change working medium is higher than that of the first heat source. 21; to ensure that the filling amount of the first phase-change working medium is sufficient to prevent the remaining first phase-change working medium in the first receiving cavity 10a from being unable to completely cover the first heat dissipation due to thermal evaporation of a part of the first phase-change working medium The first heat source 21 on the station 10g prevents the first heat source 21 from being partially dry-burned.

The second heat source 22 is arranged on the second heat dissipation station 10j, and the liquid level of the second phase change working medium is higher than the top of the second heat source 22 . In order to ensure that the filling amount of the second phase change working medium is sufficient, to prevent the remaining second phase change working medium in the second receiving cavity 10b from being unable to completely cover the second heat dissipation station 10j due to the evaporation of a part of the second phase change working medium. The second heat source 22 is used to avoid partial dry burning of the second heat source 22 .

In an embodiment, the projection of the first heat source 21 on the first plate surface 10c is within the projection of the first phase change working medium on the first plate surface 10c. Therefore, the first heat source 21 disposed on the first heat dissipation station 10g can sufficiently indirectly contact the first phase-change working medium to prevent the first heat source 21 and the substrate 10 from being dry-burned.

The projection of the second heat source 22 on the first plate surface 10c is located within the projection of the second phase change working medium on the first plate surface 10c. Therefore, the second heat source 22 disposed on the second heat dissipation station 10j can sufficiently indirectly contact the second phase-change working medium to prevent the second heat source 22 and the substrate 10 from being dry-burned.

In some specific embodiments, the bottom of the first heat source 21 arranged in the first heat dissipation station 10g is flush with the bottom surface of the first phase change working medium. That is, under the condition that the first phase change working medium fully covers the first heat source 21, by further defining the relative specific positions of the first heat source 21 and the first phase change working medium, the filling of the first phase change working medium can be reduced. quantity.

The bottom of the second heat source 22 arranged in the second heat dissipation station 10j is flush with the bottom surface of the second phase change working medium. That is, under the condition that the second phase change working medium fully covers the second heat source 22, by further defining the relative specific positions of the second heat source 22 and the second phase change working medium, the filling of the second phase change working medium can be reduced. quantity.

In some specific embodiments, the bottom of the first heat source 21 arranged in the first heat dissipation station 10g is higher than the bottom surface of the first phase change working medium, which can ensure that the first phase change working medium pair is arranged in the first heat dissipation station 10g of the first heat source 21 conducts overall heat conduction.

The bottom of the second heat source 22 arranged in the second heat dissipation station 10j is higher than the bottom surface of the second phase-change working medium, which can ensure that the second phase-change working medium can perform the second heat source 22 disposed at the second heat dissipation station 10j. Overall thermal conductivity.

As shown in FIG. 2 or FIG. 3 , wherein, the substrate 10 is provided with a first communication hole 10e that communicates with the first gas-liquid channel 311 and the first receiving cavity 10a, and the liquid level of the first phase change working medium can be higher or lower than Or flush with the hole wall of the first communication hole 10e on the side close to the first heat dissipation station 10g. When the liquid level of the first phase-change working medium is higher than the hole wall of the first communication hole 10e near the first heat dissipation station 10g, that is, the first phase-change working medium overflows to the first gas through the first communication hole 10e In the liquid channel 311, the filling amount of the first phase change working medium is guaranteed to be sufficient.

When the liquid level of the first phase change working medium is lower than the hole wall of the first communication hole 10e on the side close to the first heat dissipation station 10g, that is, the hole on the side of the first communication hole 10e close to the first heat dissipation station 10g The wall is higher than the liquid level of the first phase change working medium, and the liquid level of the first phase change working medium in the first receiving cavity 10a is a certain distance from the lower hole wall of the first communication hole 10e, so the first phase change working medium is The mass will not flow into the first gas-liquid passages 311 of the first heat dissipation fins 31 , which can ensure the condensation area of the first gas-liquid passages 311 .

Preferably, the hole wall of the first communication hole 10e on the side close to the first heat dissipation station 10g is flush with the liquid level of the first phase change working medium, that is, the liquid level of the first phase change working medium and the first communication hole 10e The lower hole wall is flush, which not only ensures that the first phase change working medium will not overflow to the first gas-liquid channel 311 to prevent the condensation area from being reduced, but also ensures that the filling amount of the first phase change working medium is sufficient.

The base plate 10 is also provided with a second communication hole 10f that communicates with the second gas-liquid channel 321 and the second receiving cavity 10b, and the liquid level of the second phase change working medium can be higher, lower or flush with the second communication hole 10f. Close to the hole wall on the side of the second heat dissipation station 10j. When the liquid level of the second phase-change working medium is higher than the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j, that is, the second phase-change working medium overflows to the second gas through the second communication hole 10f In the liquid channel 321, the filling amount of the second phase change working medium is guaranteed to be sufficient.

When the liquid level of the second phase change working medium is lower than the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j, that is, the hole on the side of the second communication hole 10f close to the second heat dissipation station 10j The wall is higher than the liquid level of the second phase change working medium, and the liquid level of the second phase change working medium in the second receiving cavity 10b is a certain distance from the lower hole wall of the second communication hole 10f, so the second phase change working medium is The mass will not flow into the second gas-liquid channels 321 of the second heat dissipation fins 32 , which can ensure the condensation area of the second gas-liquid channels 321 .

Preferably, the hole wall of the second communication hole 10f on the side close to the second heat dissipation station 10j is flush with the liquid level of the second phase change working medium, that is, the liquid level of the second phase change working medium is the same as the second communication hole 10f The lower hole wall is flush, which not only ensures that the second phase change working medium will not overflow to the second gas-liquid channel 321 to prevent the condensation area from being reduced, but also ensures that the filling amount of the second phase change working medium is sufficient.

In one embodiment, the thermosiphon radiator 100 further includes a heat sink 40 disposed corresponding to the second receiving cavity 10b, and the heat sink 40 is on the second board surface 10d. The heat dissipation capability of the thermosiphon heat sink 100 is improved through the heat conduction between the heat sink 40 and the substrate 10 .

In some specific embodiments, the heat dissipation member 40 is other forms of heat dissipation fins such as blown plate fins, solid fins and the like. Wherein, the heat sink 40 and the heat dissipation fins may be provided in an integrated structure, or may be provided in a split structure, see FIG. 2 and FIG. 3 .

In an embodiment, the projection of the second phase change working medium on the first plate surface 10c at least partially overlaps with the projection of the heat sink 40 on the first plate surface 10c. That is, the heat of the second phase-change working medium can be dissipated not only by the steam, but also by the heat conduction of the heat dissipating member 40 .

In some specific embodiments, the first heat dissipation fin 31 is flush with one end of the substrate 10 , and the heat dissipation member 40 is flush with the other end of the substrate 10 . That is, when the space occupied by the thermosiphon radiator 100 is given, the heat dissipation area of the first heat dissipation fins 31 and the heat conduction area of the heat dissipation member 40 are sufficiently increased to improve the heat dissipation efficiency.

In some specific embodiments, the first heat dissipation fin 31 may protrude from one end of the substrate 10 , and/or the heat dissipation member 40 may protrude from the other end of the substrate 10 to improve heat dissipation efficiency.

In some specific embodiments, referring to FIG. 2 or FIG. 3 , the second accommodating cavity 10b is opened in the first part 11 of the substrate 10 , and the second accommodating cavity 10b extends to the end of the first part 11 away from the second part 12 , namely The second accommodating cavity 10b extends to the bottom end of the first part 11 to make full use of the volume of the substrate 10, that is, the volume of the thermosiphon heat sink 100 can be reduced and the applicability thereof can be improved. It should be noted that the position setting of the second containing cavity 10b includes but is not limited to this, and in the height extension direction of the substrate 10, the second gas-liquid channel 321 is always located above the first phase change working medium, the first gas The liquid channel 311 is always located above the first phase change working medium.

In one embodiment, the first heat dissipation fins 31 and the second heat dissipation fins 32 are arranged at intervals. put one's oar in. The distance between the first heat dissipation fins 31 and the second heat dissipation fins 32 can be adjusted according to the compactness and heat dissipation of the overall structure of the thermosiphon radiator 100 .

In some specific embodiments, there are multiple first heat dissipation fins 31 and second heat dissipation fins 32, and the plurality of first heat dissipation fins 31 are all communicated with the first receiving cavity 10a, that is, a plurality of first heat dissipation fins The fins 31 communicate with each other through the first accommodating cavity 10a; the plurality of second radiating fins 32 are all communicated with the first accommodating cavity 10a, that is, the plurality of second radiating fins 32 communicate with each other through the second accommodating cavity 10b. Therefore, the vapor formed by the heating and evaporation of the first phase-change working medium in the first accommodating cavity 10a can quickly diffuse into the first gas-liquid channels 311 of each of the first heat dissipation fins 31, and the steam in the second accommodating cavity 10b The steam formed by the heating and evaporation of the second phase change working medium can be quickly diffused into the second gas-liquid channels 321 of the second heat dissipation fins 32, and all the first heat dissipation fins 31 and the second heat dissipation fins 32 are fully utilized for Heat dissipation to improve heat dissipation efficiency. Meanwhile, the plurality of first heat dissipation fins 31 are spaced apart and arranged in parallel, and the plurality of second heat dissipation fins 32 are spaced apart and disposed in parallel with each other. The heat exchange with the environment can be fully balanced to ensure the heat dissipation effect of the heat dissipation fin assembly 30 . This solves the problem in the prior art that when the size of the heat source is small, the entire heat sink cannot be used for heat dissipation due to the weak diffusion capability of the substrate 10 of the conventional heat sink.

Wherein, the first heat dissipation fin 31 may have a rectangular structure, and the first heat dissipation fin 31 has a first inner bottom surface 312 forming a first gas-liquid channel 311, and the first heat dissipation fin 31 is provided with a first gas-liquid channel 311. and the third communication hole of the first communication hole 10e, that is, the first gas-liquid channel 311 and the first receiving cavity 10a are communicated with the first communication hole 10e and the third communication hole, and the hole wall of the third communication hole is connected to the first inner bottom surface. 312. The second communication holes 10f are connected, so that the condensed first phase-change working medium can flow back into the first receiving cavity 10a through the first inner bottom surface 312, the third communication hole, and the first communication hole 10e. It should be noted that the shape of the first heat dissipation fin 31 includes but is not limited to this. For example, the first inner bottom surface 312 of the first heat dissipation fin 31 used to form the first gas-liquid channel 311 can be set to be inclined, or Arc-shaped inclined surface, etc., and make the inclined surface or arc-shaped inclined surface connect with the hole wall of the third communication hole of the first heat dissipation fin 31, so that the condensed liquid can flow through the inclined surface or the arc-shaped inclined surface and return to the first receiving cavity 10a.

The second heat dissipation fins 32 may have a rectangular structure, and the second heat dissipation fins 32 have second inner bottom surfaces 322 forming the second gas-liquid passages 321 . The fourth communication hole of the two communication holes 10f, and the hole wall of the fourth communication hole is connected with the second inner bottom surface 322 and the hole wall of the second communication hole 10f, so that the condensed second phase change working medium can pass through the second inner bottom surface 322 and the hole wall of the second communication hole 10f. The bottom surface 322, the fourth communication hole, and the second communication hole 10f flow back into the second receiving cavity 10b. It should be noted that the shape of the second heat dissipation fin 32 includes but is not limited to this, for example, the second inner bottom surface 322 of the second heat dissipation fin 32 used to form the second gas-liquid channel 321 can be set to be inclined, or Arc-shaped inclined surface, etc., and make the inclined surface or arc-shaped inclined surface connect with the hole wall of the fourth communication hole of the second heat dissipation fin 32, so that the condensed liquid can flow through the inclined surface or the arc-shaped inclined surface and return to the second receiving cavity 10b.

In addition, the heat dissipation fin assemblies 30 are fixed on the base plate 10 by welding, so as to ensure the relative stability between the heat dissipation fin assemblies 30 and the base plate 10 .

In an embodiment, the first heat dissipation fin 31 is provided with a first liquid injection hole (not shown in the figure) that communicates with the first gas-liquid channel 311 . The first liquid injection hole can be opened at the end of the first heat dissipation fin 31 away from the first receiving cavity 10a, that is, the first liquid injection hole is opened at the top of the first heat dissipation fin 31, and the first liquid injection hole A phase-change working medium is injected into the first gas-liquid channel 311, and the first phase-change working medium flows through the first inner bottom surface 312, the third communication hole and the first communication hole 10e in sequence under the action of gravity, and is stored in the first receiving cavity 10a.

The second heat dissipation fins 32 are provided with second liquid injection holes (not shown in the figure) which are communicated with the second gas-liquid passages 321 . The second liquid injection hole can be opened at one end of the second heat dissipation fin 32 away from the second receiving cavity 10b, that is, the second liquid injection hole is opened at the top of the second heat dissipation fin 32, and the second liquid injection hole The second phase change working medium is injected into the second gas-liquid channel 321, and the second phase change working medium flows through the second inner bottom surface 322, the fourth communication hole, and the second communication hole 10f in sequence under the action of gravity, and is stored in the second receiving cavity 10b.

In one embodiment, the substrate 10 is provided with a first liquid injection hole (not shown in the figure) that communicates with the first receiving cavity 10a, and the first phase change working medium is injected into the first liquid injection hole through the first liquid injection hole. in the receiving cavity 10a.

The substrate 10 is further provided with a second liquid injection hole (not shown in the figure) communicating with the second receiving cavity 10b, and the second phase change working medium is injected into the second receiving cavity 10b through the second liquid injection hole.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

It is worth noting that there may be multiple first heat dissipation stations 10g and second heat dissipation stations 10j, and the plurality of first heat dissipation stations 10g and the plurality of second heat dissipation stations 10j are spaced apart along the width direction of the substrate 10 . set up. In addition, the above embodiments are only for the case where only two receiving cavities and two heat dissipation stations are included. In other embodiments, the thermosiphon heat sink 100 may also have third receiving cavities spaced apart in the vertical direction of the substrate. , the fourth containment cavity, the fifth containment cavity, etc., as well as multiple third heat dissipation stations, multiple fourth heat dissipation stations, multiple fifth heat dissipation stations, etc., multiple third heat dissipation stations, multiple A fourth heat dissipation station and a plurality of fifth heat dissipation stations correspond to the third receiving cavity, the fourth receiving cavity, the fifth receiving cavity, etc. Different cooling requirements.

The above examples only represent several embodiments of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent application. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (10)

1. a thermosiphon radiator, is characterized in that, comprises: A base plate, the base plate has at least a first containing cavity and a second containing cavity spaced apart in the vertical direction, the first containing cavity is filled with a first phase change working medium, and the second containing cavity is filled with a second containing cavity Phase change working medium; the base plate further has a first plate surface, and the first plate surface is provided with at least a first heat dissipation station corresponding to the first receiving cavity and a second heat dissipation station corresponding to the second receiving cavity cooling station; A heat dissipation fin assembly, the heat dissipation fin assembly at least includes a first heat dissipation fin corresponding to the first receiving cavity and disposed on the base plate, and a heat dissipation fin corresponding to the second receiving cavity and disposed on the base plate the second heat dissipation fin; the first heat dissipation fin has a first gas-liquid channel communicating with the first receiving cavity, and the second heat dissipation fin has a second gas-liquid channel communicating with the second receiving cavity a liquid channel, the projection of the first gas-liquid channel on the first plate surface at least partially overlaps the first receiving cavity, and the projection of the second gas-liquid channel on the first plate surface at least partially overlaps overlapped with the second accommodating cavity and partially overlapped with the first accommodating cavity; in the vertical direction of the substrate, the first accommodating cavity and the first gas-liquid channel are arranged in a staggered position, and the first A gas-liquid channel is located on the upper side of the first accommodating cavity, the second accommodating cavity and the second gas-liquid channel are staggered, and the second gas-liquid channel is located on the upper side of the second accommodating cavity. 2 . The thermosiphon heat sink according to claim 1 , wherein the base plate is at least divided into a first part, a second part and a third part arranged in sequence along the first direction, and the second receiving cavity is provided in the The first part, the first accommodating cavity is provided in the second part, the first heat dissipation fin is provided in the third part and can partially extend to the second part, the second heat dissipation fin A sheet is provided on the second portion and extends partially to the first portion. 3 . The thermosiphon radiator according to claim 1 , further comprising at least a first heat source and a second heat source, the first heat source is arranged on the first heat dissipation station, and the first phase The liquid level of the changed working substance is higher than the top of the first heat source; The second heat source is arranged on the second heat dissipation station, and the liquid level of the second phase change working medium is higher than the top of the second heat source. 4 . The thermosiphon heat sink according to claim 3 , wherein the projection of the first heat source on the first plate surface is located on the first plate surface of the first phase change working medium. 5 . within the projection; The projection of the second heat source on the first plate surface is located within the projection of the second phase change working medium on the first plate surface. 5 . The thermosiphon heat sink according to claim 1 , wherein the base plate is provided with a first communication hole and a second communication hole, and the first communication hole communicates the first gas-liquid channel with the a first receiving cavity, and the hole wall of the first communication hole on the side close to the first heat dissipation station is higher than the liquid level of the first phase change working medium or the liquid level of the first phase change working medium. The liquid level is flush; the second communication hole communicates with the second gas-liquid channel and the second accommodating cavity, and the hole wall of the second communication hole on the side close to the second heat dissipation station is higher than The liquid level of the second phase-change working medium may be flush with the liquid level of the second phase-change working medium. 6 . The thermosiphon heat sink according to claim 1 , wherein the base plate further has a second plate surface opposite to the first plate surface, and the first heat dissipation fins Both the fins and the second heat dissipation fins are arranged on the second plate surface. 7 . The thermosiphon radiator according to claim 6 , wherein the thermosiphon radiator further comprises a heat dissipation member corresponding to the second receiving cavity, and the heat dissipation member is on the second board surface. 8 . . 8 . The thermosiphon heat sink according to claim 7 , wherein the projection of the second phase change working medium on the first plate surface is the same as the projection of the heat sink on the first plate surface. 9 . The projections on the board overlap at least partially. 9 . The thermosiphon radiator according to claim 8 , wherein the heat dissipation member is an inflation plate fin or a solid fin. 10 . 10 . The thermosiphon radiator according to claim 9 , wherein the first heat dissipation fin has a first liquid injection hole communicating with the first gas-liquid channel; or, the base plate has a the first liquid injection hole communicated with the first receiving cavity; The second heat dissipation fin has a second liquid injection hole that communicates with the second gas-liquid channel, or the base plate has a second liquid injection hole that communicates with the second accommodating cavity.

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