CN114450855B - Packaging antenna system integrated with filtering function and communication equipment - Google Patents
Packaging antenna system integrated with filtering function and communication equipment Download PDFInfo
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- CN114450855B CN114450855B CN201980100645.3A CN201980100645A CN114450855B CN 114450855 B CN114450855 B CN 114450855B CN 201980100645 A CN201980100645 A CN 201980100645A CN 114450855 B CN114450855 B CN 114450855B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
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- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
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Abstract
A packaging antenna system integrating a filtering function and communication equipment comprise a radio frequency chip, a power divider network connected with the radio frequency chip, a plurality of radio frequency channels connected with the power divider network and a phased antenna array connected with the radio frequency channels, wherein the phased antenna array comprises a plurality of antenna units, part or all of the antenna units comprise a filtering antenna structure, the filtering antenna structure is used for filtering a frequency band, and the frequency band comprises a millimeter wave frequency band. In the packaged antenna system provided by the application, the filter antenna structure for the frequency band filtering function is integrated in the phased antenna array, so that the antenna unit has the filtering function, and therefore, a radio frequency channel coupled with the antenna unit is not required to be externally connected with a filter, thereby improving the system integration level and reducing the packaging volume required by independently designing the filter for the radio frequency channel.
Description
Technical Field
The present application relates to the field of antenna technologies, and in particular, to a packaged antenna system and a communication device.
Background
Antennas are important components required for communication between devices in wireless communication, and the basic constitution of an antenna is a reflecting plate, a radiator, a feeder line (for connecting a radio frequency signal to the antenna), a director, and the like. The main indexes of the antenna include bandwidth, gain, polarization mode and the like. Where a wider bandwidth represents that the antenna can support more operating frequency bands and thus support higher channel capacity transmissions. In 5G millimeter wave communication, the 28GHz band, 39GHz band, and 60GHz band will all become standard bands for high-speed wireless communication networks. In these high frequency bands, the wavelength size of the signal is already smaller than the chip package size, so the antenna size can be made small, thus providing the feasibility of directly designing the antenna on the package. To achieve high frequency antenna performance, while achieving high integration of multiplexing and reducing link loss, a new antenna technology is proposed, which is a packaged antenna (ANTENNA IN PACKAGE, aiP), and AiP is a chip comprising a separate transceiver and antenna array.
AiP is shorter, so the feed loss is smaller, and meanwhile, the whole antenna is more compact and the system integration is higher because the antenna is directly designed on the package. However, to reduce signal spurs and improve anti-blocking performance, a frequency selective filter needs to be configured for each radio frequency channel outside AiP. The number of the filters configured at this time is required to be the same as that of the radio frequency channels, and when the filters are arranged in the circuit board where the radio frequency channels are located, corresponding package pins are required to be configured for each filter, and when the number of the radio frequency channels is large, there are not enough package pins, and one filter cannot be configured for each time-frequency channel, so that the performance of the radio frequency channels is reduced. And the larger the number of filters, the adverse effect is to the miniaturization of the device. Most importantly, the path loss between the rf channel and the filter is very large due to the connection of the connection line between the filter and the rf channel, which reduces the communication performance.
Disclosure of Invention
The embodiment of the application aims to provide a packaged antenna system and communication equipment so as to improve system performance.
In a first aspect, there is provided a packaged antenna system comprising:
The antenna comprises a radio frequency chip, a power divider network connected with the radio frequency chip, a plurality of radio frequency channels connected with the power divider network and a phased antenna array connected with the radio frequency channels, wherein the phased antenna array comprises a plurality of antenna units, part or all of the antenna units comprise a filtering antenna structure, the filtering antenna structure is used for filtering a frequency band, and the frequency band comprises a millimeter wave frequency band. The power divider network comprises one or more power dividers, and each radio frequency channel of the plurality of radio frequency channels comprises one or more radio frequency front-end devices.
In the packaged antenna system provided by the application, the filter antenna structure for the frequency band filtering function is integrated in the phased antenna array, so that the antenna unit has the filtering function, and therefore, a radio frequency channel coupled with the antenna unit is not required to be externally connected with a filter, thereby improving the system integration level and reducing the packaging volume required by independently designing the filter for the radio frequency channel.
In an alternative implementation manner, the filtering antenna structure may be used for radiating signals in the millimeter wave band and receiving signals in the millimeter wave band, and the filtering antenna structure may also perform band filtering on the signals in the millimeter wave band.
In an alternative implementation, the filter antenna structure includes a high pass filter structure and a low pass filter structure.
In an alternative implementation, the antenna unit includes a feeding module and a feeding patch;
The feed module comprises at least one layer of superimposed microstrip resonator, and the microstrip resonator comprises at least two differential feed probes, a microstrip line and at least one microstrip patch;
the microstrip resonator comprises the microstrip line which is connected with the at least one microstrip patch through the at least one differential feed probe;
The microstrip resonator comprises at least one microstrip patch and the feed patch which are coupled to form a series capacitor, and the microstrip line and the series capacitor form the high-pass filter structure.
In an alternative implementation manner, the microstrip resonator comprises two differential feed probes which are mutually perpendicular to each other;
At least one of the two end points of the differential feed probe is connected with one of the at least one microstrip patch;
the number of the at least one microstrip patch is greater than or equal to 1 and less than or equal to 4.
In an alternative implementation, the feed module includes a coupling feed structure coupled with the resonator module;
The coupling feed structure comprises at least one layer of superimposed microstrip resonator, the microstrip resonator comprises two differential feed probes, microstrip lines and at least one microstrip patch, wherein the differential feed probes, the microstrip lines and the at least one microstrip patch are mutually perpendicular to each other, two end points of the differential feed probes are respectively connected with one microstrip patch in the at least one microstrip patch, and the microstrip lines are perpendicular to the connection positions of the two differential feed probes.
In an alternative implementation, the millimeter wave band includes a frequency range of 24.25GHz to 29.5GHz.
In an alternative implementation, the millimeter wave band includes a frequency range of 24.25GHz to 26.5GHz.
In an alternative implementation, the millimeter wave band includes a frequency range of 26.5GHz to 29.5GHz.
In an alternative implementation, the millimeter wave band includes a frequency range of 27.5GHz to 28.35GHz.
In an alternative implementation, the millimeter wave band includes a frequency range of 24.25GHz to 27.5GHz.
In an alternative implementation, the millimeter wave band includes a frequency range of 27.5GHz to 29.5GHz.
In an alternative implementation, the frequency at which the antenna unit operates is in frequency range 2 of the specifications of the third generation partnership project 3GPP new radio NR.
In an alternative implementation manner, the antenna unit further comprises a radiator, a resonator module coupled with the radiator, and the resonator is connected with the feed module;
the resonator module comprises a parasitic ring resonator and a feed patch;
The parasitic ring resonator is located between the radiator and the feed patch and is coupled with the radiator and the feed patch, respectively, or the feed patch is located between the radiator and the parasitic ring resonator and is coupled with the radiator and the parasitic ring resonator, respectively.
In an alternative implementation, the radiator is a metal patch having a symmetrical shape.
In an alternative implementation, the resonator module includes a parasitic ring resonator and a feed patch;
The parasitic ring resonator is located between the radiator and the feed patch and is coupled with the radiator and the feed patch, respectively, or the feed patch is located between the radiator and the parasitic ring resonator and is coupled with the radiator and the parasitic ring resonator, respectively.
In an alternative implementation manner, the parasitic ring resonator is a square ring-shaped metal patch, or a circular ring-shaped metal patch, or a duplex-shaped metal patch.
In an alternative implementation, the feeding patch is a metal patch having a symmetrical shape, and the middle of the feeding patch includes a feeding opening having a symmetrical shape.
In an alternative implementation, the feed opening is square or circular or duplex-like in shape.
When the at least two layers of microstrip resonators of the coupling feed structure are connected, two adjacent layers of microstrip resonators in the at least two layers of superimposed microstrip resonators are connected through at least one metal via hole arranged in the microstrip patch.
In an alternative implementation, the microstrip patch is square, circular or prismatic in shape.
In an alternative implementation, the intermediate and peripheral free positions of the microstrip resonator include at least one parasitic ground aperture.
In a second aspect, the application provides a communication device comprising a baseband chip and any of the above packaged antenna systems. The baseband chip and the packaged antenna system.
The communication device may further include a memory, and a baseband chip may be coupled to the memory.
The memory is used for storing instructions, the baseband chip is used for executing the instructions stored by the memory and processing signals obtained through the packaging antenna system or sending signals through the packaging antenna system.
The communication device may also include an application processor, a display screen, etc.
It should be understood that the communication device provided in the embodiment of the present application may be a wireless communication device, or may be a part of a device in a wireless communication device, such as an integrated circuit product, for example, a system chip or a communication chip. The wireless communication device may be a computer device supporting wireless communication functions.
Specifically, the wireless communication device may be a terminal such as a smart phone, or may be a radio access network device such as a base station. The system-on-chip may also be referred to as a system-on-chip (SoC), or simply as a SoC chip. The communication chip may include a baseband chip and a radio frequency processor. Baseband chips are sometimes also referred to as modems or baseband processors. The radio frequency processor is sometimes also referred to as a radio frequency transceiver (transceiver) or radio frequency chip. In a physical implementation, some or all of the communication chips may be integrated inside the SoC chip. For example, the baseband chip is integrated in the SoC chip, and the radio frequency processor is not integrated with the SoC chip.
Drawings
Fig. 1 is a schematic structural diagram of a packaged antenna system according to an embodiment of the present application;
fig. 2 is a schematic frame of an antenna unit according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an antenna unit according to an embodiment of the present application;
FIG. 4 is a schematic view of a radiator according to an embodiment of the present application;
FIG. 5 is a schematic view of another radiator according to an embodiment of the present application;
FIG. 6 is a schematic view of another radiator according to an embodiment of the present application;
FIG. 7 is a schematic view of another radiator according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a parasitic ring resonator according to an embodiment of the present application;
FIG. 9 is a schematic diagram of another parasitic ring resonator provided by an embodiment of the present application;
FIG. 10 is a schematic diagram of another parasitic ring resonator provided by an embodiment of the present application;
FIG. 11 is a schematic diagram of a feeding patch according to an embodiment of the present application;
FIG. 12 is a schematic diagram of another feeding patch according to an embodiment of the present application;
FIG. 13 is a schematic diagram of another feeding patch according to an embodiment of the present application;
FIG. 14 is a schematic diagram of another feeding patch according to an embodiment of the present application;
FIG. 15 is a schematic diagram of another feeding patch according to an embodiment of the present application;
FIG. 16 is a schematic diagram of a coupling feed structure according to an embodiment of the present application;
FIG. 17 is a schematic diagram of another coupling feed structure provided by an embodiment of the present application;
FIG. 18 is a schematic diagram of another coupling feed structure provided by an embodiment of the present application;
FIG. 19 is a schematic view of another coupling feed structure provided by an embodiment of the present application;
FIG. 20 is a schematic diagram of another coupling feed structure provided by an embodiment of the present application;
fig. 21 is a schematic diagram of a feed network according to an embodiment of the present application;
fig. 22 is a schematic diagram illustrating performance simulation of an antenna unit according to an embodiment of the present application;
Fig. 23 is a schematic diagram illustrating performance simulation of another antenna unit according to an embodiment of the present application;
fig. 24 is a schematic diagram illustrating performance simulation of another antenna unit according to an embodiment of the present application;
fig. 25 is a schematic structural diagram of AiP according to an embodiment of the present application.
Detailed Description
Embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
The technical scheme provided by the application is further described below by referring to the accompanying drawings and examples. It should be understood that the system structure and the service scenario provided in the embodiments of the present application are mainly for explaining some possible implementations of the technical solutions of the present application, and should not be construed as unique limitations of the technical solutions of the present application. Those skilled in the art can appreciate that, as the system evolves and updated service scenarios appear, the technical solution provided by the present application may still be applicable to the same or similar technical problems.
In the following description of the specific embodiments, some repetition is not described in detail, but it should be understood that the specific embodiments have mutual references and may be combined with each other.
The encapsulated antenna system provided by the embodiment of the application can be applied to various communication devices, such as terminal devices, network devices and the like. The terminal device may be a device having a wireless transceiver function or a chip that may be disposed in any device, and may also be referred to as a User Equipment (UE), an access terminal, a subscriber unit, a subscriber station, a mobile station, a remote terminal, a mobile device, a user terminal, a wireless communication device, a user agent, or a user equipment. The terminal device in the embodiment of the present application may be a mobile phone (mobile phone), a tablet computer (Pad), a computer with a wireless transceiving function, a Virtual Reality (VR) terminal, an augmented reality (augmented reality, AR) terminal, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned (SELF DRIVING), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (SMART GRID), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (SMART CITY), a wireless terminal in smart home (smart home), or the like.
The network device may be a wireless access device under various standards, such as an evolved Node B (eNB), a radio network controller (radio network controller, RNC) or a Node B (Node B, NB), a base station controller (base station controller, BSC), a base transceiver station (base transceiver station, BTS), a home base station (e.g. home evolved NodeB, or home Node B, HNB), a Base Band Unit (BBU), an Access Point (AP) in a wireless fidelity (WIRELESS FIDELITY, WIFI) system, a wireless relay Node, a wireless backhaul Node, a transmission point (transmission and reception point, TRP, or transmission point, TP), etc., a gNB or a transmission point (TRP or TP) in a 5G (NR) system, one or a group of antenna panels (including a plurality of antenna panels) of a base station in a 5G system, or a network Node such as a Base Band Unit (BBU) constituting the gNB or the transmission point, or an architecture of a Base Band Unit (BBU) in a centralized-distributed system, DU, etc.
The network architecture and the service scenario described in the embodiments of the present application are for more clearly describing the technical solution of the embodiments of the present application, and do not constitute a limitation on the technical solution provided by the embodiments of the present application, and those skilled in the art can know that, with the evolution of the network architecture and the appearance of the new service scenario, the technical solution provided by the embodiments of the present application is applicable to similar technical problems.
Fig. 1 is a schematic structural diagram of a packaged antenna system according to an embodiment of the present application. The packaged antenna system shown in fig. 1 includes a phased antenna array of at least one antenna element 110, each antenna element 110 being connected by a radio frequency channel to a power divider network that includes one or more power dividers.
The radio frequency channel may also be referred to as a transmit/receive (TX/RX) chain (chain), and the power divider may also be referred to as a splitter/combiner (splitters/combiners, S/C).
In the embodiment of the application, part or all of the antenna units comprise a filtering antenna structure, and the filtering antenna structure is used for filtering frequency bands. Different from the traditional wireless packaging antenna system with the lumped filtering structure, the embodiment of the application integrates the filtering antenna structure and the antenna unit, so that the antenna unit has the function of frequency band filtering, and therefore, an external filter on a radio frequency channel is not needed, the system integration level is improved, and the system loss is reduced.
It should be noted that the working frequency of the antenna unit provided by the embodiment of the application may be a millimeter wave frequency band, where the frequency range of the millimeter wave frequency band may include one or more of 24.25 to 29.5GHz, 24.25 to 26.5GHz, 26.5 to 29.5GHz, 27.5 to 28.35GHz, 24.25 to 27.5GHz, and 27.5 to 29.5GHz.
Of course, the antenna units provided in the embodiments of the present application may also operate at other frequencies, which are not illustrated herein one by one.
It should be noted that the specific structure of the rf channel in fig. 1 is not limited to the specific structure of the rf channel, and for example, in one possible implementation, the rf channel may include one or more rf front-end devices, such as a switch (switch), a Power Amplifier (PA), a low noise amplifier (low noise amplifier, LNA), and phase shifters (PHASE SHIFTER, PS).
In fig. 1, each rf channel is connected to an rf chip via a power divider network, which may include a transmitter 140 and a receiver 150. For example, in fig. 1, the radio frequency channel 120 is connected to a transmitter 140 and a receiver 150 via a power divider 130, a power divider 132, and a power divider 134 in a power divider network.
The transmitter 140 may include a digital-to-analog converter (digital to analog converter, DAC), an up-converter, and the like. The transmitter 140 may be used to convert the acquired baseband signals to radio frequency signals and radiate outward through antenna elements in the phased antenna array. For example, after the baseband signal is converted into an analog signal through the DAC, the analog signal is converted into a radio frequency signal through up-conversion of the up-converter, and the radio frequency signal is amplified by the PA, and finally is radiated from the selected antenna unit through selection of the antenna switch.
Other processing of the baseband signal in the transmitter 140 may also exist, and will not be described in detail herein.
The receiver 150 may include a down converter, an analog-to-digital converter (analog to digital converter, ADC), and the like. The receiver 150 may convert radio frequency signals received through antenna elements in the phased antenna array to baseband signals for processing by a baseband processor. For example, after the receiver 150 receives the rf signals input by the antenna elements in the phased antenna array, the received rf signals are usually weak and can be amplified by a low noise amplifier. The amplified signal is processed by down-conversion of a down-converter, converted into a baseband signal by an ADC, and provided for a baseband processor for processing.
The foregoing is merely an example, and specific implementation and functions of the transmitter 140 and the receiver 150 are not limited to the embodiments of the present application, and are not described herein.
The principle frame of the antenna unit including the filtering antenna structure provided in the embodiment of the present application may be shown in fig. 2. In the embodiment of the application, the antenna unit can comprise a radiator, a resonator module coupled with the radiator and a feed module connected with the resonator, wherein the feed module comprises a filtering antenna structure, so that the antenna unit has a frequency band filtering function. The frequency band filtering may be a combination of high-pass filtering and low-pass filtering, or may be band-pass filtering. Furthermore, a parasitic structure can be added between the resonator module and the radiator, so that the sideband suppression effect can be improved.
Referring to fig. 2, as shown in fig. 3, a schematic structural diagram of an antenna unit according to an embodiment of the present application is shown. The antenna element shown in fig. 3 comprises a radiator 301, a parasitic ring resonator 302, a feed patch 303, a metallized feed via 305, a coupling feed structure 304, a feed network 306, etc.
The radiator in fig. 2 may correspond to the radiator 301, the resonator module in fig. 2 may correspond to the parasitic ring resonator 302 and the feed patch 303, i.e. the resonator module comprises the parasitic ring resonator 302 and the feed patch 303, and the feed module in fig. 2 may correspond to the coupling feed structure 304, the metallized feed via 305 and the feed network 306, i.e. the feed module comprises the coupling feed structure 304, the metallized feed via 305 and the feed network 306.
In the embodiment of the application, the feed module can comprise a high-pass filter structure for realizing a high-pass filter function and a low-pass filter structure for realizing a low-pass filter function.
For example, in one possible implementation manner, the antenna unit includes a feeding module and a feeding patch, the feeding module includes at least one layer of stacked microstrip resonator, the microstrip resonator includes at least two differential feeding probes, a microstrip line and at least one microstrip patch, the microstrip line included in the microstrip resonator is connected with the at least one microstrip patch through the at least one differential feeding probe, and the at least one microstrip patch included in the microstrip resonator is coupled with the feeding patch to form a series capacitor. The microstrip line part can be equivalent to a parallel inductor, so that the series capacitor formed by the microstrip line and the at least one microstrip patch forms a high-pass filter structure, thereby enabling the antenna unit to have a high-pass filter function.
The microstrip resonator comprises two differential feed probes which are mutually perpendicular to each other, wherein at least one of the two end points of the differential feed probes is connected with one microstrip patch of the at least one microstrip patch, so that the number of the at least one microstrip patch can be more than or equal to 1 and less than or equal to 4.
Illustratively, two ends of the two differential feed probes of the microstrip resonator are connected with one microstrip patch.
The number of the microstrip patches can be determined according to practical conditions, and the size of a capacitor formed by the microstrip patches and the feed patch can be influenced, so that the filtering bandwidth of high-pass filtering is influenced.
Further, a feed network 306 in the feed module is electrically connected to the coupling feed structure 304 through a metallized feed via 305. Where the feed network 306 is a differential feed network, it may include two polarized striplines, a first polarized stripline and a second polarized stripline, respectively. Where the feed network 306 is a single ended feed network, it may include a polarized stripline.
The feed network 306 may have at least one open-circuited stub resonator loaded on its polarized strip line, which constitutes a low-pass filtering structure, so that the antenna element has a low-pass filtering function.
As can be seen from the above description, the coupling feed structure 304 in the feed module includes at least one microstrip patch and microstrip line that form a structure with high-pass filtering characteristics, and the polarized strip line of the feed network 306 in the feed module has a low-pass filtering structure, so that the antenna unit has a band filtering function. Therefore, the antenna unit provided by the embodiment of the application is different from a traditional distributed filter structure wireless packaging antenna system with a lumped filter structure, integrates a filter and an antenna, improves the system integration level and reduces the system loss.
Also included in the feed module is a coupling feed structure 304 that may be coupled to the feed patch 303. Wherein fig. 3 includes 4 cylindrical metallized feed vias, the metallized feed vias are perpendicular to the substrate, and the point where the metallized feed via 305 connects with the coupling feed structure 304 may be referred to as a metallized feed via feed point.
Further, in the embodiment of the present application, the coupling feed structure 304 includes at least one layer of stacked microstrip resonator, where the microstrip resonator includes two differential feed probes, a microstrip line and four microstrip patches that are mutually perpendicular to each other, two end points of the differential feed probe are respectively connected with one microstrip patch of the four microstrip patches, and the microstrip line is perpendicular to a connection position of the two differential feed probes.
The four microstrip patches included in the microstrip resonator are coupled with the feed patch to form a series capacitor. The microstrip line part of the microstrip resonator is arranged below the feed opening of the feed patch 303 to avoid coupling with the feed patch 303, and further, due to the effect of differential excitation, the middle position of the microstrip line is equivalently shorted, so that the microstrip line part can be equivalently a parallel inductance, and therefore, the microstrip line of the microstrip resonator and a series capacitor formed by the microstrip patch of the microstrip resonator form a high-pass filter structure, so that the antenna unit has a high-pass filter function.
The feed network 306 is electrically connected to the coupling feed structure 304 through a metallized feed via 305. Where the feed network 306 is a differential feed network, it may include two polarized striplines, a first polarized stripline and a second polarized stripline, respectively. Where the feed network 306 is a single ended feed network, it may include a polarized stripline. As described above, the polarization strip line of the feed network 306 is loaded with at least one open-circuited stub resonator constituting a low-pass filtering structure, so that the antenna unit has a low-pass filtering function.
The above is merely an example, and the filtering antenna structure may be implemented in other ways in the feeding module of the antenna unit, which is not illustrated one by one.
In the embodiment of the present application, the connection relationship between the structures included in the antenna unit may be shown in fig. 3. The antenna element shown in fig. 3 has a multilayer substrate. In fig. 3, which is illustrated by taking a 4-layer substrate as an example, the antenna unit shown in fig. 3 may include five layers of substrates, from top to bottom, respectively, a first layer of substrate to a fifth layer of substrate, and thicknesses of the substrates are H1, H2, H3, H4, and H5, respectively.
It should be noted that the material of the substrate in the embodiment of the present application is not limited, and the dielectric constant of the substrate may be 3.19 and the dielectric tangent loss may be 0.003.
The radiator 301 is disposed on the first substrate, and the radiator 301 may be used to radiate signals. Other names for the radiator may also be present, such as parasitic patches and the like. The implementation manner of the radiator according to the embodiment of the present application is not limited, for example, in fig. 1, the radiator 301 includes four sub-patches, where each of the four sub-patches has the same shape and size, and the distances between adjacent sub-patches are also the same.
Illustratively, the radiator 301 may be printed on the upper surface of the first layer substrate.
A parasitic ring resonator 302 and a feed patch 303 are disposed on the second substrate. The parasitic ring resonator 302 may be a ring-shaped metal patch, or may be a metal patch of other shapes. The feeding patch 303 may be a metal patch having a symmetrical shape.
Illustratively, the parasitic ring resonator 302 may be printed on the upper surface of the second layer substrate and the feed patch 303 may be printed on the lower surface of the second layer substrate. In this case, the parasitic ring resonator 302 is located between the radiator 301 and the feed patch 303, and is coupled with the radiator 301 and the feed patch 303, respectively.
Illustratively, the parasitic ring resonator 302 may also be printed on the lower surface of the second layer substrate, and correspondingly, the feed patch 303 is printed on the upper surface of the second layer substrate. In this case, the feeding patch 303 is located between the radiator 301 and the parasitic ring resonator 302, and the feeding patch 303 is coupled with the radiator 301 and the parasitic ring resonator 302, respectively.
In an embodiment of the present application, the parasitic ring resonator 302 has the function of enhancing the filtered edge roll-off. When parasitic ring resonator 302 is loaded over feed patch 303, coupled to feed patch 303, a radiation suppression null may be additionally introduced and passband edge frequency selectivity enhanced.
The third substrate is provided with a coupling feed structure 304, and other names may also exist for the coupling feed structure, for example, a pi-type coupling feed structure, which is not limited in the embodiment of the present application. The coupling feed structure 304 is printed on the lower surface of the third layer substrate, connected down to the feed network 306 by at least one metallized feed via 305, while the coupling feed structure 304 is coupled to the feed patch 303. Wherein fig. 3 includes 4 cylindrical metallized feed vias, the metallized feed vias are perpendicular to the substrate, and the point where the metallized feed via 305 connects with the coupling feed structure 304 may be referred to as a metallized feed via feed point.
The coupling feed structure 304 includes at least one layer of superimposed microstrip resonator, where the four microstrip patches included in the microstrip resonator are coupled with the feed patch to form a series capacitor. The microstrip line portion of the microstrip resonator is disposed below the feed opening of the feed patch 303, avoiding coupling with the feed patch 303.
A feed network 306 is provided on the fourth substrate, the feed network 306 being electrically connected to the coupling feed structure 304 by means of a metallized feed via 305. Where the feed network 306 is a differential feed network, it may include two polarized striplines, a first polarized stripline and a second polarized stripline, respectively. Where the feed network 306 is a single ended feed network, it may include a polarized stripline.
At least one open-circuited stub resonator is loaded on the polarized strip line of the feed network 306, which constitutes a low-pass filtering structure, so that the filtering antenna has a low-pass filtering function.
The fifth layer of substrate may refer to a port connected to the feed network, and so on.
As can be seen from the above description, the filter antenna provided by the embodiment of the present application includes a coupling feed structure with a high-pass filter characteristic, a parasitic ring resonator for enhancing the edge roll-off of the filter, and a feed network with a low-pass filter characteristic, so that the filter antenna has a filter function and achieves a band-pass filter characteristic of a high roll-off and a wide stop band. Meanwhile, the radiator is arranged in the filter antenna, so that the sideband suppression effect can be improved. Therefore, the filter antenna provided by the embodiment of the application is different from a traditional distributed filter structure wireless transceiver system with a lumped filter structure, integrates a filter and an antenna, improves the system integration level and reduces the system loss.
Further, possible implementations of the individual components of the antenna unit will be described in detail below.
Radiator:
In the embodiment of the present application, the radiator 301 is a metal patch with a symmetrical shape, and the shape of the radiator 301 may be a square, a round, a prismatic or other symmetrical shape.
For example, as shown in fig. 4, a schematic diagram of a radiator is provided in an embodiment of the present application. The shape of the radiator in fig. 4 is square. Fig. 4 is merely an example, and other cases are not one-to-one.
Illustratively, in embodiments of the present application, the middle of the radiator 301 may also include an opening. By providing an opening in the radiator 301, the radiator can be made to introduce out-of-band radiation and suppress nulls.
Illustratively, when the middle of the radiator 301 includes an opening, the shape of the opening may have symmetry.
For example, in one possible implementation, a radiator 301 including an opening may be as shown in fig. 5. The shape of the radiator in fig. 5 is square, and the shape of the opening in the radiator is also square. Of course, fig. 5 is only an example, and the shape of the opening of the radiator may also be a circular shape, etc., which is not illustrated here.
For example, in the embodiment of the present application, when the shape of the radiator 301 is square, the four corners of the radiator 301 may have notches with the same shape. By providing notches at the four corners of the radiator 301, the impedance bandwidth of the radiator can be increased.
For example, in one possible implementation, the radiator 301 with four corners including a notch may be as shown in fig. 6. Fig. 6 is only an example, and the shape of the notches provided at the four corners of the radiator may be other shapes, which are not exemplified here.
Illustratively, in embodiments of the present application, the radiator 301 may also include a plurality of sub-patches. For example, as shown in fig. 7, the radiator 301 includes four sub-patches, which are formed in a shape having symmetry. The shape and the size of each sub-patch in the four sub-patches are the same, and the distance between the adjacent sub-patches is the same.
In fig. 7, the side length of the radiator 301 is W2, each sub-patch included in the radiator 301 is square, the side length is W1, and the distance between adjacent sub-patches is WS, where specific values of WS, W1 and W2 may be determined according to the operating frequency band of the antenna unit.
Fig. 7 is merely an example, and the radiator 301 may be further formed of 9 sub-patches having the same shape and size, 16 sub-patches having the same shape and size, etc., and the number of sub-patches according to the embodiment of the present application is not limited and is not illustrated one by one.
Parasitic ring resonator:
in an embodiment of the present application, the parasitic ring resonator 302 in the antenna element has the function of enhancing the filtered edge roll-off. When the parasitic ring resonator 302 is coupled to the feed patch 303, a radiation suppression null may be additionally introduced and passband edge frequency selectivity is enhanced.
In the embodiment of the present application, the parasitic ring resonator 302 shown in fig. 3 is a square ring, and for clarity of description, reference may be made specifically to fig. 8. The parasitic ring resonator shown in fig. 8 is in the shape of a square ring, and each side has a width WL.
The above is merely an example, and the shape of the parasitic ring resonator 302 is not limited and may be a ring structure of any shape.
For example, as shown in fig. 9, the parasitic ring resonator shown in fig. 9 is in the shape of a circular ring.
As another example, as shown in fig. 10, the parasitic ring resonator shown in fig. 10 has a double-sided character shape.
Fig. 8 to 10 are merely examples, and other shapes of the parasitic ring resonator are not illustrated one by one.
Feeding patch:
in the embodiment of the present application, the feeding patch 303 may control the frequency of the low-frequency radiation suppression zero point, the feeding patch 303 is a metal patch having a symmetrical shape, and the middle of the feeding patch 303 includes a feeding opening having a symmetrical shape. In the embodiment of the present application, the feeding aperture in the feeding patch 303 shown in fig. 3 is square in shape, and for better clarity, reference may be made specifically to fig. 11. The feeding patch shown in fig. 11 has the same shape as the feeding patch in fig. 3, and the feeding opening in the feeding patch shown in fig. 11 has a square shape.
When the feeding patch 303 and the parasitic ring resonator 302 are bonded to one substrate, reference is made to fig. 12. In fig. 12, the feeding patch 303 and the parasitic ring resonator 302 are respectively located on the upper surface and the lower surface of a substrate, and four corners of the parasitic ring resonator 302 are respectively located at intermediate positions of four sides of the feeding patch 303. The parasitic ring resonator 302 is a square ring and each side has a width WL. In fig. 12, the feeding patch 303 is square, and the side length of the feeding patch is W3, the feeding opening in the feeding patch is square, and the side length of the feeding opening is W4.
In the embodiment of the application, the frequency of the radiation suppression zero point can be adjusted by changing the size of the feed opening in the feed patch and the size of the microstrip resonator in the coupling feed structure. For example, when the shape of the feeding opening in the feeding patch is square, the side length of the feeding opening is equal to one eighth wavelength of the low-frequency zero frequency signal, and meanwhile, the length of the microstrip line of the microstrip resonator in the coupling feeding structure is equal to the side length of the feeding opening, at this time, the zero position and impedance matching can be further controlled by adjusting the size of the microstrip patch in the microstrip resonator.
In embodiments of the present application, the shape of the feeding opening on the feeding patch 303 may also be other symmetrical shapes, including but not limited to square, circle, diamond, duplex, etc.
For example, as shown in fig. 13, the feeding patch 303 in fig. 13 includes a circular feeding opening.
As another example, as shown in fig. 14, the feeding patch 303 in fig. 14 includes a prismatic feeding opening.
As another example, as shown in fig. 15, the feeding patch 303 in fig. 15 includes a feeding opening in a double-letter shape.
Fig. 11 to 15 are only examples, and other cases are not illustrated one by one.
Coupling feed structure:
In the embodiment of the present application, the coupling feed structure 304 has a high-pass filtering function, is coupled to the feed patch 303, and is electrically connected to the feed network 306 through the metallized feed via 305.
The coupling feed structure 304 shown in fig. 16 comprises a microstrip resonator. In fig. 16, the microstrip resonator includes two differential feed probes, a microstrip line and four microstrip patches, which are perpendicular to each other, wherein two end points of each differential feed probe are respectively connected with one microstrip patch of the four microstrip patches. The coupled feed structure 304 of this structure can achieve differential excitation.
Further, in fig. 16, the intersection of two mutually perpendicular differential feed probes is connected to a microstrip line, where the microstrip line is a metal line with a specific length, and the length of the microstrip line perpendicular to the connection of the two differential feed probes may be equal to the side length of the feed opening in the feed patch.
The microstrip patches and microstrip lines at the two ends of one differential feed probe may form a stepped impedance resonator structure. The microstrip patch is arranged below the metal part in the feed patch 303, so that capacitive coupling is formed and components of series capacitance are introduced, and the microstrip line is arranged below the feed opening in the middle of the feed patch 303, so that coupling with the feed patch 303 is avoided. Because of the effect of differential excitation, the middle position of the microstrip line is equivalently short-circuited, so that the microstrip line part can be equivalently a parallel inductor, and an equivalent high-pass filter circuit is formed by the microstrip line part and a series capacitor provided by the microstrip patch, so that the radiation of the low frequency band of the antenna can be effectively inhibited. In addition, at the resonance frequency of the microstrip resonator, the current flowing at the edge of the notch on the feeding patch and the current distributed on the microstrip resonator form a loop, so that the current on the feeding patch is concentrated in the middle area and does not radiate towards the edge, thereby leading a radiation suppression zero point to the lower side of the working frequency band of the gain curve, improving the edge roll-off effect of filtering, and adjusting the frequency of the radiation suppression zero point by changing the size of the feeding opening in the feeding patch 303 and the size of the microstrip resonator structure.
In fig. 16, the two end points of each differential feed probe further include a metallized feed through Kong Kui points, which as previously described is the connection point of the metallized feed through Kong Kui point to the coupling feed structure 304.
In fig. 16, the microstrip patch has a square shape, and the microstrip patch may have other shapes having symmetry, such as a circle or a prism.
For example, as shown in fig. 17, the microstrip patch is circular in shape.
As another example, as shown in fig. 18, the microstrip patch has a prismatic shape.
Optionally, in fig. 16, the surrounding free positions of the two mutually perpendicular differential feed probes include at least one parasitic grounding hole, so that the quality factor of the microstrip resonator can be improved, and the edge drop of the gain curve is steeper.
Alternatively, the parasitic ground holes may be distributed around the differential feed probe in other ways, as shown in fig. 19, for example.
In the embodiment of the present application, the coupling feed structure 304 may also include a plurality of microstrip resonators, where two adjacent microstrip resonators are connected through at least one metal via hole disposed in the microstrip patch. Referring to fig. 19, metal vias may be located in microstrip patches, each of which may include a plurality of metal vias. As shown in fig. 20, a 3D view of a coupling feed structure 304 comprising a 3-layer microstrip resonator is shown.
A feed network:
the feed network 306 shown in fig. 21 is a differential feed network comprising a first polarized stripline 3061 and a second polarized stripline 3062. The feed network 306 may also be a single ended feed network, which is not shown here.
Further, one end of each polarized strip line in the feed network 306 is connected to one differential feed probe of the coupling feed structure 304 through the metallized feed via 305, and then is connected to the other end of the differential feed probe after being extended by a length which is the half-wave length of the center frequency of the operating frequency band of the antenna unit, i.e., L13 in fig. 21. The connection point of the polarized stripline to the metallized feed-through 305 may be referred to as a metallized feed-through feed-point. The distance between the two metallized feed-through feed-points connected by the first polarized stripline 3061 is L11 and the distance between the two metallized feed-through feed-points connected by the second polarized stripline 3062 is L12.
In fig. 21, the widths of the first polarized stripline 3061 and the second polarized stripline 3062 are WF. The first polarized strip line 3061 and the second polarized strip line 3062 are respectively provided with at least one open-circuit branch type resonator, and the plurality of open-circuit branch type resonators are arranged on the polarized strip line, so that the polarized strip line has a wide stop band low-pass filtering effect, and the introduced insertion loss is small. In fig. 21, an example is described in which 4 open-circuited dendrite resonators are loaded on each polarization strip line, and the lengths of the 4 open-circuited dendrite resonators are L10, L8, L6, and L4, respectively, and the pitches of the 4 open-circuited dendrite resonators are L9, L7, and L5, respectively, as shown in fig. 21. The specific values of WF above, and L4 to L13, may be determined according to the operating frequency band of the antenna unit.
Optionally, the periphery of the connection point between the polarized strip line and the metallized feed via 305 includes at least one parasitic ground hole, and the parasitic ground hole is connected to the upper and lower metal floors, so that isolation between ports can be enhanced and insertion loss caused by the metallized feed via 305 can be reduced.
Further, when the working frequency band of the antenna unit provided by the embodiment of the present application is 24-30GHz, the specific values of the dimensions as noted in fig. 3 to 21 may be as follows:
W1＝10mm,W2＝3.53mm,W3＝2.35mm,W4＝0.8mm,W5＝0.31mm,W6＝0.31mm,WL＝2.0mm,L1＝0.42mm,L2＝0.42mm,L3＝0.86mm,L4＝1mm,L5＝0.5mm,L6＝1.2mm,L7＝0.5mm,L8＝0.85mm,L9＝0.4mm,L10＝0.7mm,L11＝L12＝0.96mm,L13＝0.8mm,H1＝0.69mm,H2＝0.05mm,H3＝0.25mm,H4＝0.2mm,H5＝0.2mm,WS＝0.17mm,WF＝0.1mm.
The above is merely an example, and the specific dimensions of the antenna elements may be adapted to accommodate in receiving and transmitting devices of wireless communication systems of different frequency bands.
In combination with the above dimensions, when the operating frequency band of the antenna unit is 24-30GHz, simulation diagrams of the antenna performance can be shown in fig. 22 to 24. As shown in fig. 22, a graph of the low frequency sideband gain versus the various conditions for an embodiment of the present application. The simulation result graphs of 4 different cases are shown in fig. 22, wherein the 4 cases are respectively that 1, the antenna unit is not loaded with a parasitic ring resonator, the coupling feed structure of the antenna unit is not loaded with a parasitic grounding hole, 2, the antenna unit is loaded with a parasitic ring resonator, but the coupling feed structure of the antenna unit is not loaded with a parasitic grounding hole, 3, the antenna unit is not loaded with a parasitic ring resonator, but the middle and the surrounding free positions of the coupling feed structure of the antenna unit are loaded with a parasitic grounding hole, and 4, the antenna unit is loaded with a parasitic ring resonator, and the middle and the surrounding free positions of the coupling feed structure of the antenna unit are loaded with a parasitic grounding hole.
As can be seen from fig. 22, the effect of edge roll-off of the filtering can be improved when the antenna element is loaded with the parasitic ring resonator and the parasitic ground holes are loaded in the middle and the surrounding free positions of the coupling feed structure. Meanwhile, two ways of lifting edge roll-off are adopted, and the inhibition capacity at 22.5GHz can be improved by 14dB on the premise of not introducing extra insertion loss.
As shown in fig. 23, a graph of simulation results of reflection coefficients of an antenna unit provided by the embodiment of the present application can achieve good impedance matching when the working frequency band of the antenna unit is 24-30 GHz.
As shown in FIG. 24, the gain curve simulation result diagram of the antenna unit provided by the embodiment of the application shows that when the working frequency band of the antenna unit is within 24-30GHz, the gain of the antenna is stable and is over 5.8dBi, 22% of relative bandwidth is achieved, the high roll-off filter characteristic is provided at two sides of the passband, and the filter suppression exceeding 25dB from 0-22.5GHz and the wide stop band filter suppression exceeding 25dB from 34-60GHz are realized. The low frequency sideband roll-off is significantly improved when the antenna element is loaded with a parasitic ring resonator as compared to when the antenna element is not loaded with a parasitic ring resonator.
As shown in fig. 25, an embodiment of the present application further provides AiP. Figure 25 is a figure AiP integrated with a 4x4 phased antenna array, comprising a total of 16 antenna elements, each of which may be described above for specific implementation. It should be noted that the number of antenna elements included in the phased antenna array AiP in fig. 25 is merely an example, and other numbers of antenna elements are possible.
In fig. 25, aiP of the phased antenna array may be connected to a radio frequency chip, and reference is specifically made to the foregoing description, which is not repeated here. AiP in fig. 25 also includes other structures, and reference may be made specifically to the description of AiP in the prior art, and details are not repeated here.
The foregoing is merely illustrative embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present application, and the application should be covered. Therefore, the protection scope of the application is subject to the protection scope of the claims.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (11)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/109713 WO2021062789A1 (en) | 2019-09-30 | 2019-09-30 | Filtering function-integrated antenna in package system and communication device |
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| CN114450855A CN114450855A (en) | 2022-05-06 |
| CN114450855B true CN114450855B (en) | 2025-07-08 |
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| CN113141708B (en) * | 2021-04-29 | 2022-09-27 | 成都天锐星通科技有限公司 | A multi-beam chip integrated module and phased array system |
| CN113594676B (en) * | 2021-07-07 | 2023-08-18 | 安徽大学 | Millimeter wave dual-band dual-circularly polarized antenna unit and array and design method thereof |
| CN113851845B (en) * | 2021-10-13 | 2024-01-26 | 中国信息通信研究院 | An integrated filter duplex antenna that suppresses in-band signals |
| CN216928916U (en) * | 2021-11-25 | 2022-07-08 | 中兴通讯股份有限公司 | Antenna module and mobile terminal |
| CN114204256B (en) * | 2021-11-29 | 2022-12-13 | 广东工业大学 | Broadband high-isolation patch antenna applied in full duplex and wireless communication equipment |
| CN114256616B (en) * | 2021-12-30 | 2024-11-05 | 中国科学院微电子研究所 | Antenna unit and antenna array |
| CN114361782B (en) * | 2022-01-11 | 2022-12-02 | 西安电子科技大学 | Reconfigurable low RCS circularly polarized antenna array |
| CN114843729B (en) * | 2022-04-28 | 2024-03-19 | 南通大学 | An unbalanced to balanced millimeter wave substrate integrated waveguide filter power splitter |
| CN115308575A (en) * | 2022-05-20 | 2022-11-08 | 成都天锐星通科技有限公司 | A radio frequency package chip testing system and method |
| CN117199805A (en) * | 2022-05-30 | 2023-12-08 | 华为技术有限公司 | Antenna, communication device and communication system |
| CN117199777A (en) * | 2022-05-30 | 2023-12-08 | 华为技术有限公司 | Antenna array, antenna and network device |
| CN115051154B (en) * | 2022-07-27 | 2023-07-18 | 重庆邮电大学 | A Differential Broadband Endfire Filter Antenna Based on Open Step Slots |
| CN115513627B (en) * | 2022-08-24 | 2024-02-06 | Oppo广东移动通信有限公司 | Frequency divider and antenna array |
| CN116505268A (en) * | 2023-05-04 | 2023-07-28 | 电子科技大学 | Millimeter wave broadband microstrip patch antenna with parasitic patch |
| CN118970458A (en) * | 2024-07-19 | 2024-11-15 | 合肥联宝信息技术有限公司 | Antenna and working method thereof |
| CN119994424A (en) * | 2025-04-17 | 2025-05-13 | 中天通信技术有限公司 | Patch cavity filter |
| CN120184586B (en) * | 2025-05-22 | 2025-08-22 | 北京理工大学 | Triple-band common-aperture differential antenna with adjustable decoupling network and decoupling method |
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| CN110224215A (en) * | 2019-06-06 | 2019-09-10 | 天通凯美微电子有限公司 | A kind of millimeter wave antenna battle array and the integrated electronic equipment of radio frequency front-end devices |
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| CN105680182A (en) * | 2015-12-11 | 2016-06-15 | 中国电子科技集团公司信息科学研究院 | Array antenna |
| CN109326892A (en) * | 2018-11-22 | 2019-02-12 | 江苏贝孚德通讯科技股份有限公司 | Millimeter wave antenna array element, aerial array, communication device |
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