CN114466585B

CN114466585B - Ball production line is planted to BGA chip

Info

Publication number: CN114466585B
Application number: CN202210045273.2A
Authority: CN
Inventors: 闻权; 钟鹏
Original assignee: Shenzhen Zhuo Mao Technology Co ltd
Current assignee: Shenzhen Zhuo Mao Technology Co ltd
Priority date: 2022-01-15
Filing date: 2022-01-15
Publication date: 2024-06-21
Anticipated expiration: 2042-01-15
Also published as: CN114466585A

Abstract

The invention discloses a ball-mounting production line for BGA chips, which comprises a feeding device, a printing device, a ball-mounting device and a laminating device which are sequentially arranged along the production line; the feeding device is used for placing the BGA into the jig and sending the jig loaded with the BGA onto the printing device; the printing device is provided with a conveying runner, and the conveying runner can convey the printed BGA to the ball mounting device; the ball planting device is used for carrying out ball planting operation on the printed BGA and sending the BGA after ball planting to the laminating device; the attaching device is used for attaching the BGA to the corresponding position of the PCB. The invention can realize the purposes of automatic feeding, ball feeding and mounting, and improves the degree of automation; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the quality of the produced product is better.

Description

Ball production line is planted to BGA chip

Technical Field

The invention relates to the technical field of Ball Grid Array (BGA) ball planting, in particular to a ball planting production line of a BGA chip.

Background

In the arrival of the information age, the electronic information industry has been developed at a high speed worldwide, electronic information products become necessities of life of people, and the development of the electronic information industry brings a lot of convenience to life of people. With the rapid development of the electronic industry, the integration capability of electronic products is continuously improved, and the electronic products have increasingly powerful functions and increasingly miniaturized volumes. The layout of electronic elements is more and more compact, the process requirements on BGA are also increasingly improved, and the traditional template method and the ball planting device method based on the ball planting process are adopted, so that a large amount of manpower and material resources are required to be added in the ball planting process, the ball planting yield is too low, a large amount of time is consumed, and meanwhile, the potential safety hazard to personnel is also greatly overcome due to too much manual intervention in the operation process. In addition, the traditional Ball Grid Array (BGA) chip ball-mounting production line is unreasonable in layout, low in production efficiency and poor in quality of produced products, and cannot be guaranteed. Along with the improvement of technological requirements, the traditional ball planting production line is difficult to meet the automation performance of the existing ball planting equipment. Therefore, we propose a novel BGA chip ball-mounting production line.

Disclosure of Invention

The invention aims to solve the technical problem of providing a ball-mounting production line for BGA chips, which aims to improve the automation degree and the product quality of ball-mounting of BGA chips.

In order to achieve the above purpose, the application provides a ball-mounting production line for BGA chips, which comprises a feeding device, a printing device, a ball-mounting device and a laminating device which are sequentially arranged along the production line;

The feeding device is used for placing the BGA into the jig and sending the jig loaded with the BGA onto the printing device; the printing device is provided with a conveying runner, and the conveying runner can convey the printed BGA to the ball mounting device; the ball planting device is used for carrying out ball planting operation on the printed BGA and sending the BGA after ball planting to the laminating device; the attaching device is used for attaching the BGA to the corresponding position of the PCB.

Further, loading attachment includes:

a feeding frame;

the lifting material box assembly is used for storing tooling discs loaded with BGA;

The feeding connection assembly is arranged on the feeding rack and comprises a connection table, the connection table is provided with a first position, and the feeding connection assembly is used for carrying the tooling disc in the lifting material box assembly to the first position; after the material taking assembly grabs the BGA in the tooling disc, the loading connection assembly drives the empty tooling disc to move from the first position to the lifting material box assembly so as to recover the tooling disc;

the pull hook assembly is provided with a second position for bearing the jig, and at least part of the pull hook assembly is configured to be movably arranged; and

And the material taking assembly is at least partially movably arranged on the feeding rack and is used for sucking the BGA in the tooling disc and conveying the BGA to the jig.

Further, the material loading subassembly of plugging into still includes:

The first horizontal moving part is arranged on the connection platform and is used for driving the clamping claw part to move along the length direction of the connection platform; and

And the clamping claw part is connected with the first horizontal moving part and is used for clamping the tooling disc in the lifting material box assembly and carrying the tooling disc to a first position.

Further, the ball planting device comprises:

the first base is provided with a ball planting station and a detection station;

The ball planting connection assembly is in butt joint with the conveying runner of the printing device and comprises a first connection assembly and a second connection assembly, wherein the first connection assembly and the second connection assembly are used for receiving a jig loaded with BGA, the second connection assembly is used for receiving an empty jig or a jig for receiving the completion of ball planting, the ball planting connection assembly can be switched between a first state and a second state, when the ball planting connection assembly is in the first state, the first connection assembly is in butt joint with the conveying runner, and when the ball planting connection assembly is in the second state, the second connection assembly is in butt joint with the conveying runner;

the jig platform assembly is arranged on the ball planting station;

The clamping jaw assembly is used for clamping the jig on the first connection assembly and sending the jig to the jig platform assembly;

the ball implantation assembly is used for performing ball implantation operation on the BGA on the ball implantation station;

The first detection component is arranged on the detection station and is used for detecting the BGA and outputting ball planting NG and OK results; or alternatively

The ball supply assembly is arranged on the base and is used for supplying balls to the ball planting assembly.

Further, the jig platform assembly is provided with a linear motor platform and a bearing assembly which is arranged on the linear motor platform and used for bearing the jig, and the linear motor platform is used for driving the bearing assembly to move.

Further, the carrier assembly includes:

The first mounting seat is arranged on the linear motor platform;

The bearing plate is arranged on the first mounting seat, the jig is fixed on the bearing plate, and a vacuum adsorption unit is arranged on the bearing plate;

the first rotating unit is arranged on the first mounting seat and is used for driving the bearing plate to rotate; and

The positioning unit is arranged on the bearing plate and used for positioning the jig.

Further, the ball supply assembly includes:

A third support frame;

The second rotating unit is arranged on the third supporting frame and is used for driving the storage bin to rotate;

The feed bin is provided with a ball inlet and a ball outlet, and the ball outlet is arranged towards the ball planting station;

the weighing piece is used for obtaining the weight information of the solder balls provided for the ball planting station, obtaining the weight information of the solder balls in the storage bin and feeding the weight information back to the prompting piece;

A prompting piece;

The control piece is arranged on the supporting frame and is respectively connected with the weighing piece and the prompting piece, and the control piece controls the prompting piece to carry out ball adding prompting according to weight information of the solder balls in the storage bin.

Further, the attaching device includes:

A second base;

the attaching platform assembly is arranged on the second base;

The conveying assembly is arranged on the second base and is used for conveying the PCB to the attaching platform assembly;

the second detection assembly is used for photographing and height measurement of the PCB on the attaching platform assembly;

The third detection assembly is arranged on the second base and is used for photographing and height measurement of the BGA product after ball placement;

And the material conveying assembly is used for conveying the BGA product to the position above the third detection assembly and the attaching platform assembly.

Further, the conforming platform assembly comprises:

the second supporting seat is arranged on the second base;

The PCB is fixed on the attaching platform;

The first lifting unit is arranged on the second supporting seat and is used for driving the attaching platform to move up and down;

The blocking unit is used for blocking the PCB positioned on the attaching platform;

and the clamping unit is used for clamping the PCB.

Further, the device also comprises a rechecking device, wherein the rechecking device is used for carrying out positioning photographing detection on the products after the lamination is completed.

Compared with the prior art, the invention has the beneficial effects that:

According to the invention, the feeding device, the printing device, the ball planting device and the attaching device are mutually matched, so that the purposes of automatic feeding, ball supplying and attaching in the production process are realized without manually feeding a jig, manually supplying balls and manually attaching, the automation degree and the working efficiency are improved, and the manpower and material resources are reduced; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the quality of the produced product is better.

Drawings

The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram of a BGA chip ball mounting line according to some embodiments of the invention;

FIG. 2 is a schematic diagram of a loading device for a ball grid array production line of BGA chips according to some embodiments of the present invention;

FIG. 3 is a schematic illustration of a lift cartridge assembly according to some embodiments of the invention;

FIG. 4 is a schematic view of a loading docking assembly according to some embodiments of the present invention;

FIG. 5 is a schematic view of a take-off assembly according to some embodiments of the invention;

FIG. 6 is a schematic diagram of a hook assembly according to some embodiments of the invention;

FIG. 7 is a schematic illustration of a ball placement device according to some embodiments of the invention;

FIG. 8 is a schematic view of a ball-mounting docking assembly, according to some embodiments of the invention;

FIG. 9 is a schematic diagram of a first detection assembly according to some embodiments of the invention;

FIG. 10 is a schematic view of a jig platform assembly according to some embodiments of the invention;

FIG. 11 is a schematic view of a load bearing assembly according to some embodiments of the invention;

FIG. 12 is a schematic view of a ball placement assembly and a ball supply assembly according to some embodiments of the invention;

FIG. 13 is a schematic view of a ball supply assembly according to some embodiments of the invention;

FIG. 14 is a block schematic diagram of a ball supply assembly according to some embodiments of the invention;

FIG. 15 is a schematic view of a conforming device in accordance with some embodiments of the invention;

FIG. 16 is a schematic view of a transport assembly and a conforming platform assembly according to some embodiments of the invention;

FIG. 17 is a schematic view of a conforming platform assembly according to some embodiments of the invention;

FIG. 18 is a schematic view of a material handling assembly and a second detection assembly according to some embodiments of the invention;

FIG. 19 is a schematic diagram of a third detection assembly according to some embodiments of the invention;

fig. 20 is a schematic view of a ball placement device and a review device according to some embodiments of the invention.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

The following describes a BGA chip ball mounting line according to an embodiment of the present invention with reference to the accompanying drawings. As shown in fig. 1 and fig. 3, the BGA chip ball mounting production line according to the embodiment of the present invention includes a feeding device 1, a printing device 2, a ball mounting device 3 and a bonding device sequentially disposed along the production line, wherein the feeding device 1 is used for placing a BGA into a jig, and sending the jig loaded with the BGA onto the printing device 2; the printing device 2 is provided with a conveying runner which can convey the printed BGA to the ball mounting device 3; the ball planting device 3 is used for carrying out ball planting operation on the printed BGA and sending the BGA after ball planting to the laminating device; the attaching device is used for attaching the BGA to the corresponding position of the PCB.

Therefore, in the ball-mounting production line for the BGA chip, provided by the embodiment, through the arrangement of the feeding device, the printing device, the ball-mounting device and the attaching device, the purposes of automatic feeding, ball-feeding and attaching in the production process are realized without manually feeding a jig, manually feeding balls and manually attaching, the automation degree and the working efficiency are improved, and the manpower and material resources are reduced; meanwhile, the invention forms a production line with reasonable layout, the whole production process has less manual interference, the production efficiency is greatly improved, and the quality of the produced product is better.

First, the feeding device 1 will be described in detail:

As shown in fig. 2, the loading device 1 includes a loading frame 10, at least one lifting box assembly 11, a loading docking assembly 12, a hook assembly 13, and a material taking assembly 14; the lifting material box assembly 11 is used for storing tooling discs loaded with BGA; the feeding connection assembly 12 is arranged on the feeding frame 10, the feeding connection assembly 12 comprises a connection table 120, the connection table 120 is provided with a first position, and the feeding connection assembly 12 is used for conveying a tooling disc in the lifting material box assembly 11 to the first position; after the material taking assembly 14 grabs the BGA in the tooling disc, the loading connection assembly 12 drives the empty tooling disc to move from the first position to the lifting material box assembly 11 so as to recycle the tooling disc; the hook component 13 has a second position for bearing a jig, and at least part of the hook component 13 is configured to be movably arranged; the material taking assembly 14 is at least partially movably arranged on the feeding frame 10, and the material taking assembly 14 is used for sucking the BGA in the tooling plate and sending the BGA to the jig. Wherein, the frock dish is the tray dish.

Therefore, the feeding device provided in this embodiment makes the tooling plate movably set on the connection table 120 through the feeding connection assembly 12, so that the tooling plate can be conveniently fed and returned, and the material taking assembly 14 is used for grabbing the BGA in the tooling plate for feeding.

As shown in fig. 3, specifically, the lifting cartridge assembly 11 includes a first support frame 110, a first lifting portion 111, a frame 112, and a frame sensor 113; the first supporting frame 110 is arranged on the feeding frame 10; the first lifting part 111 is disposed on the first supporting frame 110; the material frame 112 is connected with the first lifting part 111; the material frame sensor 113 is disposed on the material frame 112.

Further, in order to prevent the tray inside the material frame from falling accidentally during the manual transportation process, the material frame 112 has a material frame barrier portion that can be set up in a poking manner, and the material frame 112 is provided with a bar sensor 114, and the bar sensor 114 is used for detecting whether the material frame barrier portion is poked in place. The material frame barrier rib portion can be manually pressed to stir the material frame barrier rib portion to another clamping groove position, and it is understood that the material frame barrier rib portion cannot prevent the tray in the material frame from entering and exiting when in the clamping groove position, and if the material frame barrier rib portion is not dialed in place, the barrier rib sensor 114 does not sense, and then alarms and prompts.

Therefore, by arranging the material frame barrier bar part, the barrier bar sensor 114 and the material frame sensor 113, the material frame 112 is ensured not to fall off and can normally run in the artificial transportation process.

As shown in fig. 4, the loading docking assembly 12 further includes a first horizontal movement portion 121 and a jaw portion 122; the first horizontal moving part 121 is disposed on the docking station 120, and the first horizontal moving part 121 is configured to drive the clamping claw 122 to move along the length direction of the docking station 120; the clamping claw 122 is connected to the first horizontal moving part 121, and the clamping claw 32 is used for clamping the tooling disc in the lifting magazine assembly 11 and carrying to the first position. The tray in the cartridge is pulled out and sent to the first position by the claw portion 122 engaging the first lifting portion 111 in the lifting cartridge assembly 11.

Therefore, when all BGA products in one tray are removed, the tray blank is returned to the original position by the clamping jaw portion 3, and the frame 112 is lifted to a level, and the clamping jaw portion 122 is moved to the first position again, so that the operation is circulated, if the material in the material frame in the lifting material box assembly 11 is completely removed, the device stops and alarms, and the material frame blocking portion is manually pressed to move the frame blocking portion to the tray blocking position (the tray blocking position can prevent the tray in the material frame 112 from falling after the material frame 112 is removed).

Further, a first material sensor 123 is provided on the docking station 120.

As shown in fig. 5, the material taking assembly 14 includes a material sucking part 140, a detecting part, a mounting seat 142 and a second horizontal moving part 143, wherein the material sucking part 140 is used for sucking the BGA in the tooling plate at the first position into the jig at the second position; the detecting part is used for detecting whether the BGA is put into the jig; the mounting seat 142 is arranged on the feeding frame 10; the second horizontal moving portion 143 is disposed on the mounting base 142, and the second horizontal moving portion 143 is configured to drive the suction portion 140 to move along the length and width directions of the mounting base 142.

It should be appreciated that to provide for more accurate operation of the take out assembly 14, the take out assembly 14 may be provided with a spline shaft and speed reducer standard.

According to some embodiments of the present invention, the suction part 140 includes a second lifting part 1400, a rotating part 1401, and a suction cup part 1402; the second lifting part 1400 is connected to the second horizontal moving part 143; the rotating part 1401 is connected to the second elevating part 1400; the suction cup portion 1402 is connected to the rotating portion 1401. In order to effectively protect products in the process of taking and discharging materials, the sucker part 1402 is a sucker with buffering and antistatic functions.

According to some embodiments of the invention, the detection section includes a positioning vision CCD section 141 and a laser sensor 144; the positioning vision CCD 141 is arranged on the feeding frame 10; a laser sensor 144 is provided on the chuck portion 1402, and the laser sensor 144 is used to detect height measurement for the four corners of the BGA.

Sucking disc portion 1402 draws the BGA product out of the tray, then utilizes location vision CCD portion 141 to carry out the CCD location, drives the BGA product through rotation portion 1401 and rotates in order to carry out the correction of angle and correction of position, puts into the tool corresponding acupuncture point in the second position after the correction, and laser sensor 144 carries out the height measurement to four angles of BGA product, and if the measured height wherein surpasses the certain scope of demarcation height (indicate that the BGA product perk is more), can instruct the warning, and manual intervention puts the BGA product just to ensure that the BGA product is accurately put into in corresponding tool acupuncture point.

As shown in fig. 6, the hook assembly 13 includes a first supporting seat 130, a third horizontal moving portion 131, a third lifting portion 132, a hook portion 133 and a blocking portion 134; the first supporting seat 50 is arranged on the feeding frame 1; the third horizontal moving part 131 is disposed on the first supporting seat 130; the third lifting part 132 is connected to the third horizontal movement part 131; the hook part 133 is connected with the third lifting part 132; the blocking portion 134 is disposed on the first supporting seat 130, and the blocking portion 134 is a blocking cylinder. Further, a second material sensor 135 and a positioning cylinder 136 are provided on the first support 130.

Therefore, after the BGA product is fed to the jig, the hook assembly 13 is used to transport the jig at the second position, and the BGA product enters the conveying device 5 through the flow channel. Meanwhile, it should be understood that, after the conveying device 5 flows back to the empty jig, the empty jig is operated to the jig blocking position by the pull hook assembly 13, and the blocking cylinder is used for positioning the jig.

The following will describe the ball planting device 3 in detail:

As shown in fig. 7 and 8, the ball planting device 3 includes a first base 30, a first detecting component 31, a ball planting docking component 35, a clamping jaw component, a jig platform component 32, a ball planting component 33 or a ball supplying component 34; the first base 30 is provided with a ball planting station and a detection station; the first detection component 31 is arranged at a detection station, and the first detection component 31 is used for detecting the BGA and outputting ball planting NG and OK results; the ball-planting connection assembly 35 is in butt joint with a conveying runner of the printing device 2, the ball-planting connection assembly 35 comprises a first connection assembly 350 and a second connection assembly 351, wherein the first connection assembly 350 is used for receiving a jig loaded with BGA, the second connection assembly 351 is used for receiving an empty jig or a jig for receiving the ball-planting completion, the ball-planting connection assembly 35 can be switched between a first state and a second state, when the ball-planting connection assembly 35 is in the first state, the first connection assembly 350 is in butt joint with the conveying runner, and when the ball-planting connection assembly 351 is in the second state, the second connection assembly 351 is in butt joint with the conveying runner; the clamping jaw assembly is used for clamping the jig on the first connection assembly 350 and sending the jig to the jig platform assembly 32, the jig platform assembly 32 is arranged on the ball planting station, the jig platform assembly 32 is provided with a linear motor platform 320 and a bearing assembly 321 which is arranged on the linear motor platform 320 and is used for bearing the jig, and the linear motor platform 320 is used for driving the bearing assembly 321 to transfer between the ball planting station and the detection station; the ball-implanting assembly 33 is used for performing ball-implanting operation on the BGA on the ball-implanting station; the ball supply assembly 34 is disposed on the first base 30, and the ball supply assembly 34 is used for supplying balls to the ball planting assembly 33.

It should be understood that after the BGA is fed to the jig, the BGA enters the printing device through the runner mode to perform Mark point positioning, then the flux paste is printed, after printing, the jig carrying the BGA is conveyed to the first connection assembly 350 through the runner mode, and the printing device 2 performs steel mesh cleaning; then the clamping jaw assembly carries the jig carrying the BGA on the first connection assembly 350 onto the linear motor platform 320, and clamps and positions the jig, the ball is planted by utilizing the ball planting assembly, the jig after ball planting is carried onto the second connection assembly 351 by utilizing the clamping jaw assembly, the BGA after ball planting is detected by utilizing the first detection assembly, the BGA with ball planting OK enters the attaching device, the jig on the second connection assembly 351 is in an empty state at the moment, and the empty jig on the second connection assembly 351 flows back onto the feeding device through the conveying flow channel of the printing device 2. In addition, in the initial state, the second connection assembly 351 is provided with an empty jig, after the clamping jaw assembly carries the jig to the linear motor platform, meanwhile, the conveying flow channel of the printing device 2 is switched to be in butt joint with the second connection assembly 351, the empty jig on the second connection assembly 351 flows back to the feeding device through the conveying flow channel of the printing device 2, and then the feeding is waited for, so that the circulation of the two jigs in the equipment is achieved, and the higher-efficiency operation of the equipment is realized.

Therefore, it can be seen that the ball planting device 3 provided in this embodiment, through setting up the tool platform subassembly 32, the linear electric motor 320 platform in the tool platform subassembly 32 drives the tool and transports between planting ball station and detection station, need not the manual work and goes up the tool, is provided with simultaneously and supplies ball subassembly 34, realizes the purpose of automatic confession ball at planting ball in-process, has improved degree of automation and work efficiency, reduces manpower and materials.

The linear motor platform 320 can drive the bearing assembly 321 to move left and right and move back and forth, and the linear motor platform 320 has the advantages of high speed, high precision and high response speed.

As shown in fig. 9, the first detecting assembly 31 includes a second supporting frame 310, a first lifting unit 311, and an AOI detecting unit 312, which are disposed on the first base 31; the first lifting unit 311 is disposed on the second supporting frame 310; the AOI detection unit 312 is connected with the first lifting unit 311, and the first lifting unit 311 drives the AOI detection unit 312 to move up and down, wherein the AOI detection unit 312 can adopt a high-pixel high-resolution CCD, take a picture by using the CCD, pick up the position information of each welding disc point in the BGA before and after ball implantation, and ensure the quality and the yield of output products.

As shown in fig. 10 and 11, the bearing assembly 321 includes a first mounting seat 3210, a bearing plate 3211, a first rotating unit 3212 and a positioning unit 3213, which are disposed on the linear motor platform 320, and a vacuum adsorption unit 3214 is disposed on the bearing plate 3211; the bearing plate 3211 is disposed on the first installation seat 3210; the jig is fixed on the bearing plate 3211 in an adsorption mode; the first rotating unit 3212 is disposed on the first mounting seat 3210, and the first rotating unit 3212 is configured to drive the bearing plate 3211 to rotate; the positioning unit 3213 is disposed on the carrier plate 3211, the positioning unit 3213 is configured to position the jig, and the positioning unit 3213 is a positioning cylinder.

Therefore, after the jig with the BGA is operated on the carrier plate 3211, the positioning is automatically completed by the positioning cylinder, the vacuum on the carrier plate 3211 will be started to adsorb the jig on the carrier plate 3211, so as to complete the positioning and fixing of the jig and the BGA on the jig and avoid the change of the relative position. Because the jig is fixed on the bearing plate 3211 in an adsorption mode, products with various sizes can be compatible, and thus the jig can be replaced.

According to some embodiments of the present invention, the first rotating unit 3212 includes a servo motor 32120 and a harmonic reducer 32121 disposed on the first mount 3210, and the servo motor 32120, the harmonic reducer 312121, and the carrier assembly 321 are sequentially connected. The bearing assembly 321 can swing left and right within a certain angle range through the driving of the servo motor and the harmonic reducer combination.

As shown in fig. 12, the ball mounting assembly 33 includes a second mounting seat 330, a clamping unit 331 and a brush unit 332; the clamping unit 331 is disposed on the second mounting seat 330, and the clamping unit 331 is used for clamping the steel mesh; the brush unit 332 is disposed on the second mounting seat 330 and can move up and down and move left and right, and the brush unit 332 is used for removing the redundant solder balls on the steel mesh.

According to some embodiments of the present invention, the brush unit 332 includes a left-right moving unit 3320, a second elevating unit 3321, a brush 3322, and an adjusting unit; the left-right moving unit 3320 drives the second lifting unit 3321 and the brush 3322 to move left and right, the second lifting unit 3321 is used for driving the brush 442 to move up and down, and the brush 3322 can be an anti-static brush; the adjusting unit includes a first adjusting differential head 3323 and a second adjusting differential head 3324 connected to the brush 3322, respectively, and the first adjusting differential head 3323 and the second adjusting differential head 3324 are each used to adjust the position of the brush 3322 in the horizontal direction. The position of the brush 3322 can be adjusted for different sizes of products by the mutual cooperation of the left and right moving unit 3320 and the second elevating unit 441; meanwhile, the position of the brush 3322 is accurately adjusted through the first adjusting differential head 3323 and the second adjusting differential head 3324.

Further, the clamping unit 331 is connected with a protection unit, and the protection unit comprises a middle sealing electromagnetic valve and a pilot type one-way valve, so that the clamping unit 331 can be always in a clamping state under the action of the middle sealing electromagnetic valve and the pilot type one-way valve, and the steel mesh is prevented from falling.

As shown in fig. 13 and 14, the ball supply assembly 34 includes a third supporting frame 340, a second rotating unit 341, a bin 342, a weighing member 343, a cue member 344 and a control member 345.

The second rotating unit 341 is disposed on the third supporting frame 340, the bin 342 is connected with the second rotating unit 341, the second rotating unit 341 can drive the bin 3420 to rotate, a limit sensor 349 is disposed on the supporting frame 340, the limit sensor 349 is used for detecting a rotation angle of the bin 342 and feeding back the rotation angle to the second rotating unit 341, and therefore the rotation position of the bin 342 can be accurately controlled, so that tin balls can be better controlled to flow out. The bin 342 has a ball inlet and a ball outlet, the ball outlet being disposed toward the ball planting station; the weighing piece 343 is used for obtaining weight information of the solder balls provided by the orientation ball-planting station, and obtaining weight information of the solder balls in the bin 342 and feeding back the weight information to the prompt piece 344; the control piece 345 is arranged on the third supporting frame 340, the control piece 345 is respectively connected with the weighing piece 343 and the prompting piece 344, and the control piece 345 controls the prompting piece 344 to carry out ball adding prompting according to the weight information of the solder balls in the storage bin 342.

According to the ball supply assembly 34 provided by the embodiment, the second rotating unit 341 is arranged, the second rotating unit 341 is utilized to drive the bin 342 to rotate, after the bin 342 rotates for a certain angle, a certain amount of solder balls cached in the bin are poured out, and flow to the ball planting station from the ball outlet, so that automatic ball supply is realized, and manual intervention is reduced; meanwhile, the weighing piece 343 is arranged, the weight change of the solder balls in the bin 342 before and after flowing out is obtained by the weighing piece 343, so that the weight information of the solder balls is provided by the orientation ball planting station, the purpose of quantitatively supplying the solder balls to the ball planting station is achieved, in addition, the weight information of the solder balls in the bin 342 can be obtained by the weighing piece 343, and the prompt piece 344 can respond under the condition that the bin is free of solder balls or the quantity of solder balls in the bin is too small, so that the solder balls are stably and quantitatively provided.

The weighing piece 343 calculates the weight of the solder ball provided by the stock bin to the ball planting station according to the weight weighed when the solder ball is not discharged and the weight weighed after the solder ball flows out to the ball planting station. The weighing piece 343 can acquire weight information of the solder balls in the bin 342 in real time, and the prompt piece 344 can respond under the condition that the bin 342 is not provided with balls or the bin 342 is too little, so that stable and quantitative solder ball supply is realized.

The weighing piece 343 may be a weighing sensor, such as a photoelectric weighing sensor, an electromagnetic force weighing sensor, a capacitive weighing sensor, a resistance strain type weighing sensor, etc., and the specific type may be selected according to actual needs.

As shown in fig. 13, the control piece 345 is disposed on the third supporting frame 340, and the control piece 345 is respectively connected with the prompting piece 344 and the weighing piece 343, and the control piece 345 controls the prompting piece 344 to carry out ball feeding prompting according to the weight information of the solder balls in the storage bin.

In one embodiment of the invention, the reminder 344 may include an audible reminder component and/or a visual reminder. For example, the voice prompt message can be sent out through the voice prompt, or the prompt message can be displayed through the light display piece or the screen display piece, or the voice prompt message can be sent out, and the prompt message can be displayed through any display prompt piece.

In one embodiment of the invention, as shown in FIG. 13, the ball inlet is removably mounted with a first guide 347, the first guide 347 being used to guide solder balls from the ball inlet into the bin 342; the discharge port is detachably provided with a second guide 348, the second guide 348 is used for guiding the solder balls to the ball planting station, and the first guide 347 and the second guide 348 shown in fig. 13 are both funnels. By providing the first guide 347 and the second guide 348, the solder balls can be better guided in and out.

Further, the ball outlet is configured as an adjustable opening to better control the flow rate of balls supplied from the bin 342.

In one embodiment of the present invention, the third supporting frame 340 is provided with a display member 346, and the display member 346 is used for displaying weight information of the solder balls in the bin 342, and providing weight information and prompt information of the solder balls to the ball planting station.

Finally, the laminating device is developed to be described in detail:

As shown in fig. 15, the attaching device includes a second base 40, an attaching platform assembly 41, a conveying assembly 42, a second detecting assembly 43, a third detecting assembly 44, and a material transporting assembly 45; wherein the attaching platform assembly 41 and the conveying assembly 42 are both arranged on the second base 40; the conveying assembly 42 is used for conveying the PCB onto the attaching platform assembly 41; the second detection component 43 is used for photographing and height measurement of the PCB on the attaching platform component 41; the third detecting component 44 is disposed on the second base 40, and the third detecting component 44 is used for photographing and height measurement of the BGA product after ball placement; the transporting assembly 45 is used for transporting the OK BGA product to the upper position of the third detecting assembly 44 and the attaching platform assembly 41.

Therefore, in operation, the laminating device provided in this embodiment firstly uses the conveying component 3 to convey the PCB board to the laminating platform component 41, then uses the second detecting component to detect the PCB board, meanwhile uses the transporting component 45 to convey the BGA with the ball-planting OK to the position above the third detecting component, detects the BGA product through the third detecting component, then continues to use the transporting component 45 to convey the BGA product with the OK after the detection to the position above the laminating platform component, and finally laminates the BGA product to the PCB board. The whole attaching process of the PCB and the BGA product is automated, so that attaching precision between the PCB and the BGA product is improved, and production efficiency is improved; meanwhile, through the arrangement of the second detection assembly and the third detection assembly, the ball-implanted BGA product can be precisely attached to the position corresponding to the printed solder paste PCB.

In another embodiment of the present invention, as shown in fig. 16, the transport assembly 42 includes a first flow channel 420 and a second flow channel 421, each of the first flow channel 420 and the second flow channel 421 extending along a transport direction of the transport assembly 42, the first flow channel 420 and the second flow channel 421 being configured for commonly transporting PCB boards; the conforming platform assembly 41 is disposed between the first flow channel 420 and the second flow channel 421, and the conforming platform assembly 41 is configured as a liftable platform.

As shown in fig. 17, the above-mentioned attaching platform assembly 41 includes a second supporting seat 410 disposed on the second base, an attaching platform 411, a third lifting unit 412, a blocking unit 414, and a clamping unit 413; the PCB board is fixed to the attaching platform 411 in an adsorption manner. For example, the upper end of the attaching platform 411 is provided with a vacuum adsorption unit 415, and the PCB board is adsorbed on the attaching platform 411 by the vacuum adsorption unit 415, so that multiple PCB boards can be compatible, and different PCB boards can be switched quickly and conveniently. The third lifting unit 412 is disposed on the second supporting seat 410, and the first lifting unit 412 is used for driving the attaching platform 411 to move up and down; the blocking unit 414 is used for blocking the PCB positioned on the attaching platform 411; the clamping unit 413 is used for clamping the PCB, the blocking unit 414 shown in fig. 2 is a blocking cylinder, and the clamping unit 413 is a clamping cylinder.

Further, as shown in fig. 16, the conveying assembly 42 is provided with a material sensor 422, the material sensor 422 is used for sensing position information of the PCB and feeding back the position information to the blocking unit 414, and after the material sensor 422 senses the PCB running from upstream (the PCB is in a printed tin paste state), the blocking cylinder (the blocking cylinder is in an ascending state before the PCB enters the attaching platform) blocks the flow of the PCB.

When the conveying assembly 42 and the attaching platform assembly 41 provided above are in operation, the PCB is conveyed to the attaching platform 41 through the first flow channel 420 and the second flow channel 421, the blocking cylinder blocks the flow of the PCB, then the attaching platform 411 is driven by the third lifting unit 412 to lift and lift the PCB to be higher than the upper end face of the conveying assembly 42, and simultaneously the blocking cylinder is lowered to the same height as the clamping cylinder, the clamping cylinder clamps the PCB, then the vacuum adsorption unit on the attaching platform 411 is opened to suck and fix the PCB.

In another embodiment of the present invention, as shown in fig. 18, the material transporting assembly 45 includes a third supporting seat 450, a gripping unit 451, a third rotating unit 452, a second horizontal driving unit and a second lifting unit 453; the clamping unit 45 is used for clamping the BGA product; the third rotating unit 62 is used for driving the gripping unit 451 to rotate; the second horizontal driving unit 453 includes a left-right moving unit 454 and a forward-backward moving unit 455 for driving the gripping unit 451 to move left-right and forward-backward, respectively, and the BGA product can be transferred to the position above the third inspection assembly and the bonding stage assembly 41 by the second horizontal driving unit 453; the second lifting unit 453 is used to drive the gripping unit 451 to move up and down.

More specifically, the clamping unit 451 is an electric clamping jaw, and the clamping surface of the electric clamping jaw can be subjected to an anti-static mold opening and encapsulation process, so that a product can be effectively protected in the process of grabbing the product, friction force is increased, and loosening of the product is prevented. The second horizontal driving unit 453 is provided with a linear motor and a grating ruler, and can achieve the functions of high speed, high precision and high response speed by means of the combination of the linear motor and the grating ruler, and meanwhile, the second horizontal driving unit 453 is matched with the rotating unit 452, so that the angle calibration of the clamping unit 451 can be achieved, and the stability of the material conveying assembly 45 is guaranteed.

In addition, above-mentioned second detection subassembly and third rotary unit 452 are integrated on same connecting plate, and the connecting plate is connected with second horizontal drive unit, is favorable to simultaneously through the horizontal drive unit of second can realizing that the second detection subassembly removes the position to laminating platform subassembly 41 top, need not to set up the drive unit in addition and drives the second detection subassembly and remove, has guaranteed compactness and the rationality of structure, has reduced the occupation space of this BGA product laminating device simultaneously.

In another embodiment of the present invention, as shown in fig. 19, the third detecting assembly 44 includes a first horizontal driving unit 441, a first visual detecting unit 442, and a first height measuring unit 443; the first horizontal driving unit 441 is configured to drive the first visual inspection unit 442 and the first height measurement unit 443 to move horizontally; the first visual detection unit 442 is used for photographing the BGA product; the first height measurement unit 443 is used for performing height measurement processing on the BGA product. For example, the first visual detection unit 442 uses a CCD camera, the first height measurement unit 443 uses a laser displacement sensor, the CCD camera is used to photograph the BGA product with the ball-planting OK to obtain the diagonal coordinates of the BGA product and obtain the information of the middle point position of the diagonal coordinates, so as to obtain the BGA down-shooting visual data, and the laser displacement sensor is used to measure the height of the BGA product, so that the attaching precision is ensured.

The structure of the second detecting component 43 is identical to the structure of the third detecting component 44, the second detecting component 43 includes a second visual detecting unit 430 and a second height measuring unit 431, the second visual detecting unit 430 employs a CCD camera, the second height measuring unit 431 employs a laser displacement sensor, after the CCD camera in the second detecting component 43 photographs 3 MARK points in the fixed PCB board, visual data of the attaching position of the PCB board are obtained, then each single board in the PCB board is laser-measured one by the laser displacement sensor, and after the processing, the material transporting component moves to a material taking position, the material taking position refers to a position where the BGA product with ball planting OK is placed. After the BGA product is photographed and the height measurement is finished, the electric clamping jaw runs the BGA product above one of the attaching positions of the PCB, visual data of the BGA lower photographing and the visual data of the attaching position of the PCB are compared through the BGA provided by the system, the angle and the position of the BGA product are compensated through the rotating unit 62 and the second horizontal driving unit, meanwhile, the laser displacement sensor is used for carrying out height measurement on the PCB, then the attachment of the BGA and the PCB is finished, the attaching height and the attaching precision are guaranteed, and the risk of solder paste overflow due to the problem of the depressing height is greatly reduced.

In some examples, as shown in fig. 20, the BGA chip ball-planting production line further includes a rechecking device 7, where the rechecking device 7 is configured to perform positioning photographing detection on the product after finishing the bonding, and send the product to the rechecking device 7 for positioning photographing detection after finishing the bonding, where NG products are removed and carried to an operation surface for recycling, and OK products flow into downstream equipment for performing the next process.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The BGA chip ball-planting production equipment is characterized by comprising a feeding device, a printing device, a ball-planting device and a laminating device which are sequentially arranged along the production equipment;

The feeding device is used for placing the BGA into the jig and sending the jig loaded with the BGA onto the printing device; the printing device is provided with a conveying runner, and the conveying runner can convey the printed BGA to the ball mounting device; the ball planting device is used for carrying out ball planting operation on the printed BGA and sending the BGA after ball planting to the laminating device; the attaching device is used for attaching the BGA to the corresponding position of the PCB;

the loading attachment includes:

a feeding frame;

The feeding connection assembly is arranged on the feeding rack and comprises a connection table, the connection table is provided with a first position, and the connection assembly is used for carrying the tooling disc in the lifting material box assembly to the first position; after the material taking assembly grabs the BGA in the tooling disc, the loading connection assembly drives the empty tooling disc to move from the first position to the lifting material box assembly so as to recover the tooling disc;

2. The BGA chip ball mounting apparatus of claim 1, wherein the feed docking assembly further comprises:

3. The BGA chip ball mounting apparatus of claim 1, wherein said ball mounting device comprises:

the jig platform assembly is arranged on the ball planting station;

4. The BGA chip ball mounting apparatus of claim 3, wherein the jig platform assembly includes a linear motor platform and a carrier assembly disposed on the linear motor platform for carrying a jig, the linear motor platform being configured to drive the carrier assembly to move.

5. The BGA chip ball mounting apparatus of claim 4, wherein the carrier assembly includes:

The first mounting seat is arranged on the linear motor platform;

6. The BGA chip ball mounting apparatus of claim 3, wherein said ball supply assembly includes:

A third support frame;

the weighing piece is used for obtaining the weight information of the solder balls provided for the ball planting station, obtaining the weight information of the solder balls in the storage bin and feeding back the weight information to the prompting piece;

A prompting piece;

The control piece is arranged on the third supporting frame, is respectively connected with the weighing piece and the prompting piece, and controls the prompting piece to carry out ball adding prompting according to weight information of the solder balls in the storage bin.

7. The BGA chip ball mounting apparatus of claim 1, wherein the bonding means includes:

A second base;

the attaching platform assembly is arranged on the second base;

8. The BGA chip ball mounting apparatus of claim 7, wherein said bonding stage assembly includes:

the second supporting seat is arranged on the second base;

The PCB is fixed on the attaching platform;

and the clamping unit is used for clamping the PCB.

9. The BGA chip ball mounting apparatus of claim 1, further comprising a rechecking device for performing a positioning photo inspection of the bonded product.