CN114487892B - DC/DC power module short circuit positioning method - Google Patents
DC/DC power module short circuit positioning method Download PDFInfo
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- CN114487892B CN114487892B CN202111537301.4A CN202111537301A CN114487892B CN 114487892 B CN114487892 B CN 114487892B CN 202111537301 A CN202111537301 A CN 202111537301A CN 114487892 B CN114487892 B CN 114487892B
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 230000005856 abnormality Effects 0.000 claims abstract description 39
- 239000000565 sealant Substances 0.000 claims abstract description 13
- 238000012634 optical imaging Methods 0.000 claims abstract description 11
- 238000001931 thermography Methods 0.000 claims abstract description 11
- 230000004044 response Effects 0.000 claims description 21
- 230000002159 abnormal effect Effects 0.000 claims description 13
- 238000010586 diagram Methods 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 8
- 238000003331 infrared imaging Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000004382 potting Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000005070 sampling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 230000008569 process Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 230000007488 abnormal function Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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Abstract
The application provides a DC/DC power supply module short circuit positioning method, which comprises the steps of firstly testing an output end and an input end of a DC/DC power supply module, determining the position of a short circuit end in the power supply module, then carrying out optical imaging on the short circuit end, judging the specific position of the short circuit according to morphology abnormality, judging the specific position of the short circuit, opening the power supply module and removing pouring sealant, applying voltage to the short circuit end to heat internal circuits and components, finally finding the position of the heating abnormality through thermal imaging, and determining the position as a short circuit position. Therefore, the method has the advantages of strong pertinence, simplicity, feasibility and accurate failure positioning. The hidden danger of damage to devices in the traditional method of desoldering is overcome, the tedious step of desoldering a large number of components one by one is avoided, and a large amount of manpower and material resources are saved.
Description
Technical Field
The application relates to the technical field of measurement and analysis, in particular to a DC/DC power supply module short circuit positioning method.
Background
The DC/DC power supply module is used as a hybrid integrated circuit, and is internally integrated with a plurality of active and passive devices including an error amplifier, a reference circuit, an oscillator, a comparator, a control circuit, a driving circuit, a switching tube, a resistance-capacitance sensor and the like, wherein common failure modes comprise no output, input or output short circuit, abnormal functions and the like, the short circuit abnormality is the common failure mode of the DC/DC power supply module, and because the internal structure of the module is complex, the input or output end usually comprises a plurality of or ten filter capacitors, resistors, inductors, switching tubes, integrated chips and other structures, and from the aspect of the circuit mechanism of the DC/DC power supply module, the structures of the filter capacitors, the filter inductors, the switching tubes and the like of the input end and the structures of the filter capacitors, the filter inductors, the flywheel diodes and the like are all parallel structures, and any device short circuit can cause the devices to be in board test short circuit, and the short circuit devices cannot be positioned accurately, so how to position the short circuit position of the module is a great difficulty.
Disclosure of Invention
In view of the above, the present application is directed to a method for positioning a short circuit of a DC/DC power module.
Based on the above object, the present application provides a method for positioning a short circuit of a DC/DC power module, the DC/DC power module including an input terminal and an output terminal, including:
Testing the input end and the output end of the DC/DC power supply module, and determining that the input end and/or the output end is a short-circuit end according to a test result;
performing optical imaging on the short-circuit end to obtain the morphology of a device and a PCB circuit of the short-circuit end, and determining that the abnormality is device abnormality in response to the morphology abnormality of the device; responding to the appearance abnormality of the PCB circuit, and determining that the abnormality is the abnormality of the PCB circuit; taking the abnormal position as a short circuit position;
In response to the normal appearance, unsealing the DC/DC power supply module and removing the internal pouring sealant of the DC/DC power supply module so as to expose devices and PCB circuits in the short-circuit end;
Applying a voltage with a preset magnitude to the short-circuit end, and performing thermal imaging on the short-circuit end after the voltage is applied to obtain a temperature distribution diagram of a device and a PCB circuit of the short-circuit end; determining that the temperature of the device exceeds a preset temperature as a device abnormality in response to the temperature of the device exceeding the preset temperature; determining that the temperature of the PCB circuit exceeds the preset temperature as the abnormality of the PCB circuit in response to the temperature of the PCB circuit exceeding the preset temperature; and taking the position of the device and/or the PCB circuit exceeding the preset temperature in the temperature distribution diagram as a short circuit position.
In some embodiments, the method further comprises:
In response to determining the short circuit location as a location of a device, desoldering the device at the short circuit location to perform failure analysis;
and in response to determining that the short circuit position is the position of the PCB circuit, performing profile sampling on the PCB circuit at the short circuit position to perform failure analysis.
In some embodiments, the testing the input terminal and the output terminal of the DC/DC power module, and determining the input terminal and/or the output terminal as the short-circuited terminal according to the test result, includes:
Testing the input end of the DC/DC power supply module, and responding to the short circuit of the input end to determine that the input end is a short circuit end;
And testing the output end of the DC/DC power supply module, and responding to the short circuit of the output end to determine that the output end is a short circuit end.
In some embodiments, the testing the input terminal and the output terminal of the DC/DC power module, and determining the input terminal and/or the output terminal as the short-circuited terminal according to the test result, includes:
performing current-voltage characteristic curve test on an input end and an output end of the DC/DC power supply module, and determining that the input end is a short-circuit end in response to the short-circuit of the input end; and responding to the short circuit of the output end, and determining that the output end is a short circuit end.
In some embodiments, the removing the internal potting adhesive of the DC/DC power module includes: and removing the internal pouring sealant except for the input end pin and the output end pin of the DC/DC power supply module so that the input end pin and the output end pin are still connected with the input end and the output end.
In some embodiments, the device anomaly comprises: burning out the device; the PCB circuit abnormality comprises bonding wire fusing and welding abnormality.
In some embodiments, the testing of the input and output of the DC/DC power module is performed by a transistor tester.
In some embodiments, the applying a voltage of a preset magnitude to the shorted end is performed by a thermal infrared failure positioning device.
In some embodiments, the optical imaging is X-ray imaging.
In some embodiments, the thermal imaging is infrared imaging.
From the above, it can be seen that the method for positioning the short circuit of the DC/DC power module provided by the application includes the steps of testing the output end and the input end of the DC/DC power module, determining the position of the short circuit end in the power module, then performing optical imaging on the short circuit end, judging the specific position of the short circuit according to the morphology abnormality, opening the power module and removing the potting adhesive, applying voltage to the short circuit end to heat the internal circuit and the components, and finally finding the position of the heating abnormality through thermal imaging, and determining the position as the short circuit position. Therefore, the method has the advantages of strong pertinence, simplicity, feasibility and accurate failure positioning. The hidden danger of damage to devices in the traditional method of desoldering is overcome, the tedious step of desoldering a large number of components one by one is avoided, and a large amount of manpower and material resources are saved.
Drawings
In order to more clearly illustrate the technical solutions of the present application or related art, the drawings that are required to be used in the description of the embodiments or related art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort to those of ordinary skill in the art.
FIG. 1 is a flow chart of a method for locating a short circuit of a DC/DC power module according to an embodiment of the application;
FIG. 2a is a front view of a DC/DC power module according to an embodiment of the present application;
FIG. 2b is a back side view of a DC/DC power module according to an embodiment of the present application;
FIG. 3 is a schematic diagram of an embodiment of a DC/DC power module of the present application;
Fig. 4 is an infrared imaging contrast diagram of a DC/DC power module according to an embodiment of the present application.
Detailed Description
The present application will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present application more apparent.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
As described in the background section, how to accurately locate the short-circuit position of the DC/DC power module is a great difficulty, and the applicant finds that in the process of implementing the present application, the relevant short-circuit locating method independently performs failure analysis to determine whether there is an abnormality after the devices are unwelded from the DC/DC power module substrate one by one according to experience. Meanwhile, the device is subjected to de-soldering and failure analysis, so that the abnormality of the PCB circuit cannot be detected.
In view of this, one or more embodiments of the present disclosure provide a method for positioning a short circuit of a DC/DC power module, specifically, first testing an output end and an input end of the DC/DC power module, determining a position of a short circuit end on the power module, then performing optical imaging on the short circuit end, judging a specific position of the short circuit according to a morphology abnormality, performing optical imaging, unsealing the power module, removing a potting adhesive, applying a voltage to the short circuit end to heat an internal circuit and components thereof, and finally finding a position of the heating abnormality through thermal imaging, and determining the position as a short circuit position. Therefore, the method has the advantages of strong pertinence, simplicity, feasibility and accurate failure positioning. The hidden danger of damage to devices in the traditional method of desoldering is overcome, the tedious step of desoldering a large number of components one by one is avoided, and a large amount of manpower and material resources are saved.
The technical solutions of one or more embodiments of the present specification are described in detail below by means of specific embodiments.
Referring to fig. 1, a method for locating a short circuit of a DC/DC power module according to an embodiment of the present disclosure includes the steps of:
Step S101, testing an input end and an output end of the DC/DC power supply module, and determining that the input end and/or the output end is a short-circuit end according to a test result;
The DC// DC power module as a whole can be divided into two parts: an input and an output. The inputs and outputs specifically include, but are not limited to: error amplifier, reference circuit, oscillator, comparator, switch tube, resistance-capacitance sensor, etc. and control circuit and driving circuit included in PCB circuit.
In this embodiment, it is first necessary to preliminarily determine whether there is an abnormality in the input end or the output end of the power module, and coarsely locate the position where a short circuit occurs in the DC/DC power module, and determine whether the short circuit position is at the input end or the output end.
Step S102, carrying out optical imaging on the short-circuit end to obtain the appearance of a device and a PCB circuit of the short-circuit end, and determining that the abnormality is device abnormality in response to the appearance abnormality of the device; responding to the appearance abnormality of the PCB circuit, and determining that the abnormality is the abnormality of the PCB circuit; taking the abnormal position as a short circuit position;
In this step, after the short-circuit end is determined, the position of the specific internal short-circuit of the short-circuit end needs to be positioned. Through optical imaging, the internal appearance of the short-circuit end is imaged, and whether the short-circuit end has internal burning, bonding wire fusing, abnormal welding or other abnormal phenomena can be checked. In some embodiments, the optical imaging includes, but is not limited to, X-ray imaging, and perspective imaging can be accomplished. The anomalies are divided into two types, one is a device anomaly and the other is a PCB trace anomaly, including but not limited to: burning out the device; the PCB circuit anomalies include, but are not limited to: bonding wire fusing and welding anomalies. By observing the morphology, a part of simple abnormal conditions can be determined, and the position of the short circuit can be obtained according to the abnormal conditions to complete positioning.
Step S103, unsealing the DC/DC power supply module and removing the internal pouring sealant of the DC/DC power supply module in response to the normal appearance so as to expose devices and PCB circuits in the short-circuit end;
In this step, for some cases where it is impossible to determine whether or not the short circuit position is abnormal by the surface topography, further determination is required. Specifically, the DC/DC power module to be tested is unsealed, the internal pouring sealant is removed, the internal components are protected during photoresist removal, all the internal components are exposed, and the input end pins and the output end pins of the power module are required to be reserved, so that the follow-up detection and analysis are convenient.
Step S104, applying a voltage with a preset magnitude to the short-circuit end, and performing thermal imaging on the short-circuit end after the voltage is applied to obtain a temperature distribution diagram of a device and a PCB circuit of the short-circuit end, wherein the thermal imaging comprises but is not limited to infrared imaging; determining that the temperature of the device exceeds a preset temperature as a device abnormality in response to the temperature of the device exceeding the preset temperature; determining that the temperature of the PCB circuit exceeds the preset temperature as the abnormality of the PCB circuit in response to the temperature of the PCB circuit exceeding the preset temperature; and taking the position of the device and/or the PCB circuit exceeding the preset temperature in the temperature distribution diagram as a short circuit position.
In some embodiments, the applying a voltage of a predetermined magnitude to the shorted end may be performed by a thermal infrared failure positioning device.
In this step, whether the short-circuit position is damaged or not in the component, for example, cannot be determined from the surface topography, for the case that whether the short-circuit position is abnormal or not cannot be determined from the surface topography. However, if a short circuit occurs, a large amount of heat is generated due to the short circuit after a voltage is applied across the short circuit, resulting in an increase in temperature. According to the circuit principle, the short circuit part is preferentially heated by larger current, the short circuit position can be accurately positioned through infrared imaging, the position of a device or a PCB circuit which causes short circuit failure can be effectively and rapidly found by comparing the distribution of devices and the PCB circuit in the module, and failure analysis can be further carried out on the positioned device after the device is unwelded. Therefore, the short-circuited end is further detected by applying a voltage to the short-circuited end and performing thermal imaging. Through thermal imaging, a temperature distribution diagram of all devices and PCB lines in a short-circuit end under the applied voltage can be obtained, and if the temperature of a certain device and/or a certain section of PCB line is higher than a preset temperature, the device and/or the PCB line can be judged to be abnormal, so that the position of the short circuit is positioned.
Therefore, the short circuit positioning method of the DC/DC power supply module can accurately position the short circuit position inside the module, and has the advantages of strong pertinence, simple operation and accurate short circuit positioning. The complicated step of one-to-one welding disassembly of a large number of components is avoided, and a large number of manpower and material resources are saved.
In still other embodiments, for the method of the preceding embodiments, it may further comprise:
In response to determining the short circuit location as a location of a device, desoldering the device at the short circuit location to perform failure analysis;
and in response to determining that the short circuit position is the position of the PCB circuit, performing profile sampling on the PCB circuit at the short circuit position to perform failure analysis.
In this embodiment, after determining the position of the short circuit of the DC/DC power module, failure analysis may also be performed on the shorted device and/or PCB circuit. For a failed device, the device can be subjected to a de-soldering process, and for a failed PCB circuit, the cross-section sample can be subjected to a next process.
In some other embodiments, for testing the input terminal and the output terminal of the DC/DC power module according to the foregoing embodiments, determining that the input terminal and/or the output terminal is a short-circuited terminal according to a test result includes:
Testing the input end of the DC/DC power supply module, and responding to the short circuit of the input end to determine that the input end is a short circuit end;
And testing the output end of the DC/DC power supply module, and responding to the short circuit of the output end to determine that the output end is a short circuit end.
In this embodiment, a determination is made as to whether the specific input terminal or output terminal of the DC/DC power module is shorted. The method has the advantages that the workload of removing the internal pouring sealant of the DC/DC power supply module in the subsequent steps can be reduced, the internal pouring sealant is only required to be removed from one end which is determined to be a short-circuit end, the working time is greatly saved, meanwhile, the step of removing the pouring sealant easily causes different degrees of damage to devices and circuits in the DC/DC power supply module, and therefore the position of removing the pouring sealant is reduced, the DC/DC power supply module can be protected, and unnecessary damage to the DC/DC power supply module caused by misoperation is avoided.
In some other embodiments, for testing the input terminal and the output terminal of the DC/DC power module according to the foregoing embodiments, determining that the input terminal and/or the output terminal is a short-circuited terminal according to a test result includes:
performing current-voltage characteristic curve test on an input end and an output end of the DC/DC power supply module, and determining that the input end is a short-circuit end in response to the short-circuit of the input end; and responding to the short circuit of the output end, and determining that the output end is a short circuit end.
In this embodiment, a current-voltage characteristic curve test (i.e., an I-V curve test) is performed on an input end or an output end of the DC/DC power module to be tested, and whether the input end or the output end of the power module is abnormal is primarily determined. In general, the difference of obvious I-V characteristic curves is not easily seen between the input end and/or the output end pins of the DC/DC power supply module with the rising no-load output voltage, and the difference only appears as abnormal function. When the test data is inconsistent with the standard data, the abnormal end can be directly positioned according to the I-V characteristic curve, and subsequent failure analysis is facilitated.
In other embodiments, the testing of the input and output of the DC/DC power module is performed by a transistor tester.
The transistor tester has stable performance, can automatically read accurate data, is convenient to use, and can test various diodes, triodes, thyristors and MOS field effect transistors; the device type, the polarity of the pins, the output HFE, the valve voltage, the junction capacitance of the field effect transistor, and the like can be judged, and the additional conditions can be measured. The method is particularly suitable for transistor pairing and hybrid surface-mounted element identification. In this example, an XJ4810 type transistor tester was used.
As a specific example, the steps of the I-V characteristic test are given:
Firstly, a transistor tester applies voltage to an input terminal pin; the data acquisition device of the transistor tester acquires the voltage of pins at two ends of the input end and transmits the voltage to the controller of the transistor tester; the controller of the transistor tester triggers the electronic load to scan the I-V characteristics of the devices inside the power module in a voltage or current manner. Meanwhile, the data collectors of the transistor tester collect the voltages of pins at two ends of the input end respectively, and when the electronic load scans from the short-circuit end (or the open-circuit end) to the open-circuit end (or the short-circuit end) of the I-V characteristic curve in a current mode or a voltage mode within a specified time, all data collection is completed. At this point the controller of the transistor tester begins to normalize the output current and voltage of the device under measurement according to fixed rules, and the controller of the transistor tester displays the corrected current and voltage data via a display and stores the data. This measurement process is completed.
In still other embodiments, removing the internal potting adhesive of the DC/DC power module as described for the previous embodiments comprises: and removing the internal pouring sealant except for the input end pin and the output end pin of the DC/DC power supply module so that the input end pin and the output end pin are still connected with the input end and the output end.
In this embodiment, the input terminal pin and the output terminal pin are fixed at the input terminal and the output terminal by the potting adhesive, and the potting adhesive at the pin remains, so that the voltage can be applied more conveniently in the subsequent step to complete the further test.
A specific example of the short circuit positioning of the DC/DC power module is given below, and referring to fig. 2a and 2b, a front view and a back view of a DC/DC power module are shown. Firstly, the power module is complete in structure through appearance inspection, and obvious anomalies such as cracking and burning are not seen; then, through an I-V characteristic curve test, the short circuit phenomenon exists at the input end (VIN and VIN-) of the device, and the output end is free from obvious abnormality such as short circuit and the like; then, observing through X rays that phenomena such as device burning, bonding wire fusing, abnormal welding and the like do not exist in the short-circuit end, wherein the ray morphology is shown in fig. 3, and four views in fig. 3 are respectively X-ray diagrams of different visual angles of the short-circuit end; unsealing the DC/DC power supply module, removing the internal pouring sealant, and exposing all devices in the DC/DC power supply module; applying 2V voltage to a short-circuit end (input end) by adopting thermal infrared failure analysis positioning equipment, wherein the obvious heating phenomenon exists in 1 MOS tube at the input end through infrared imaging, the obvious heating phenomenon does not exist in other parts, referring to FIG. 4, the left side is an infrared imaging diagram of a DC/DC power supply module under normal conditions, the right side is an infrared imaging diagram of the DC/DC power supply module, the inside of a circle is a corresponding MOS tube, the position of the MOS tube in the right side is brighter to indicate that the obvious heating phenomenon exists in the MOS tube, and therefore, the short-circuit failure cause of the DC/DC power supply module can be accurately positioned because the short-circuit occurs in 1 MOS tube at the input end; unsealing the MOS tube after the welding, and placing the MOS tube under a microscope for internal visual inspection, so that obvious burning marks are formed on the surface of the chip.
It should be noted that, the method of the embodiment of the present application may be performed by a single device, for example, a computer or a server. The method of the embodiment can also be applied to a distributed scene, and is completed by mutually matching a plurality of devices. In the case of such a distributed scenario, one of the devices may perform only one or more steps of the method of an embodiment of the present application, the devices interacting with each other to accomplish the method.
It should be noted that the foregoing describes some embodiments of the present application. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
Claims (10)
1. A method for locating a short circuit of a DC/DC power module, the DC/DC power module comprising an input and an output, the method comprising:
Testing the input end and the output end of the DC/DC power supply module, and determining that the input end and/or the output end is a short-circuit end according to a test result;
performing optical imaging on the short-circuit end to obtain the morphology of a device and a PCB circuit of the short-circuit end, and determining that the abnormality is device abnormality in response to the morphology abnormality of the device; responding to the appearance abnormality of the PCB circuit, and determining that the abnormality is the abnormality of the PCB circuit; taking the abnormal position as a short circuit position;
In response to the normal appearance, unsealing the DC/DC power supply module and removing the internal pouring sealant of the DC/DC power supply module so as to expose devices and PCB circuits in the short-circuit end;
Applying a voltage with a preset magnitude to the short-circuit end, and performing thermal imaging on the short-circuit end after the voltage is applied to obtain a temperature distribution diagram of a device and a PCB circuit of the short-circuit end; determining that the temperature of the device exceeds a preset temperature as a device abnormality in response to the temperature of the device exceeding the preset temperature; determining that the temperature of the PCB circuit exceeds the preset temperature as the abnormality of the PCB circuit in response to the temperature of the PCB circuit exceeding the preset temperature; and taking the position of the device and/or the PCB circuit exceeding the preset temperature in the temperature distribution diagram as a short circuit position.
2. The method according to claim 1, wherein the method further comprises:
In response to determining the short circuit location as a location of a device, desoldering the device at the short circuit location to perform failure analysis;
and in response to determining that the short circuit position is the position of the PCB circuit, performing profile sampling on the PCB circuit at the short circuit position to perform failure analysis.
3. The method according to claim 1, wherein the testing the input and output terminals of the DC/DC power module, and determining the input and/or output terminal as a short-circuited terminal according to the test result, comprises:
Testing the input end of the DC/DC power supply module, and responding to the short circuit of the input end to determine that the input end is a short circuit end;
And testing the output end of the DC/DC power supply module, and responding to the short circuit of the output end to determine that the output end is a short circuit end.
4. The method according to claim 1, wherein the testing the input and output terminals of the DC/DC power module, and determining the input and/or output terminal as a short-circuited terminal according to the test result, comprises:
performing current-voltage characteristic curve test on an input end and an output end of the DC/DC power supply module, and determining that the input end is a short-circuit end in response to the short-circuit of the input end; and responding to the short circuit of the output end, and determining that the output end is a short circuit end.
5. The method of claim 1, wherein the removing the internal potting adhesive of the DC/DC power module comprises: and removing the internal pouring sealant except for the input end pin and the output end pin of the DC/DC power supply module so that the input end pin and the output end pin are still connected with the input end and the output end.
6. The method of claim 1, wherein the device anomaly comprises: burning out the device; the PCB circuit abnormality comprises bonding wire fusing and welding abnormality.
7. The method of claim 1, wherein the testing the input and output of the DC/DC power module is performed by a transistor tester.
8. The method of claim 1, wherein said applying a voltage of a predetermined magnitude to said shorting terminal is performed by a thermal infrared failure positioning device.
9. The method of claim 1, wherein the optical imaging is X-ray imaging.
10. The method of claim 1, wherein the thermal imaging is infrared imaging.
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