CN114489292B - Heat dissipation regulation and control method, system, device and server - Google Patents

Abstract

The invention discloses a heat dissipation regulation and control method, a system, a device and a server, wherein the type of M PCIE devices currently externally connected with the server and the positions of the M PCIE devices in N hardware interfaces are obtained, physical links correspondingly connected between each PCIE device and a BMC are determined according to the positions, information obtaining threads corresponding to each PCIE device are determined according to the types, so that for each PCIE device, the BMC obtains alarm temperature and operation temperature of each PCIE device through the physical links corresponding to the PCIE device according to information obtaining rules of the information obtaining threads corresponding to the PCIE device, and finally controls a fan module to regulate speed according to the alarm temperature and the operation temperature of each PCIE device. Compared with the prior art, the scheme does not need to pre-establish the temperature regulation table in the firmware of the BMC, solves the problems of firmware update required to be carried out due to maintenance of the temperature regulation table and firmware update carried out by a client, is convenient for the client to use and avoids the waste of human resources.

Description

A heat dissipation control method, system, device and server

technical field

The present invention relates to the field of heat dissipation control, in particular to a heat dissipation control method, system, device and server.

Background technique

The server includes PCIE devices (Peripheral Component Interconnect Express, high-speed serial computer expansion bus standard) used to realize different functions, such as CPU, network card, etc. If the temperature of these devices is too high, it will directly affect its performance. In severe cases, the device may If it does not work, it will affect the working performance and market competitiveness of the server. Therefore, in order to realize the temperature control of each device in the server, the BMC (Baseboard Management Controller, Baseboard Management Controller) can correspond to the fan module according to the temperature adjustment point of the device. control. Different PCIE devices have different temperature adjustment points, and the same PCIE devices from different manufacturers also have different temperature adjustment points. If you set a temperature adjustment point for different devices, it means that for each device, the fan blows The magnitude of the wind force is the same, which will lead to redundant heat dissipation for some devices, that is, the fan speed is too high and the power consumption is too large; for some devices, the heat dissipation is not enough, that is, the device is likely to be scrapped due to excessive temperature.

Therefore, in the prior art, a temperature regulation table will be established in advance according to the temperature regulation points of different manufacturers for different PCIE devices, and the temperature regulation table will be stored in the firmware of the BMC, so that the BMC can obtain the temperature regulation point and carry out subsequent fan operation. Module wind speed control. However, the disadvantage of this method is that for each PCIE device connected to the server, it is necessary to ensure that the temperature adjustment table has the temperature adjustment information related to the PCIE device and the manufacturer, otherwise the BMC will adjust the fan speed according to the default temperature adjustment point , which makes the speed adjustment result very inaccurate, and cannot accurately realize the heat dissipation of the PCIE device; and if you want to add information to the temperature adjustment table, you need to re-update the BMC firmware and release it, and the customer also needs to carry out the corresponding firmware Upgrade, which brings inconvenience to customers and wastes manpower for related maintenance and upgrades.

Contents of the invention

The purpose of the present invention is to provide a heat dissipation control method, system, device and server, without pre-establishing a temperature regulation table in the firmware of the BMC, which solves the need for firmware updates and the need for customers to maintain the temperature regulation table in the prior art. The problem of corresponding firmware upgrade is convenient for customers to use, and the waste of human resources for upgrade and maintenance is avoided.

In order to solve the above-mentioned technical problems, the present invention provides a heat dissipation control method, which is applied to the BMC in the server, and the server also includes a fan module and N hardware interfaces for external PCIE devices, where N≥1 and N is Integer, the heat dissipation control method includes:

Obtain the types of M PCIE devices currently connected to the server and their positions in the N hardware interfaces, where 1≤M≤N and M is an integer;

Determine the physical link correspondingly connected between each of the PCIE devices and the BMC according to the location of each of the PCIE devices;

According to the type of each said PCIE device, determine the information acquisition thread for grabbing data respectively corresponding to each said PCIE device, wherein, the information acquisition rules of different said information acquisition threads are different;

For each of the PCIE devices, obtain the warning temperature and the operating temperature of the PCIE devices through the physical link corresponding to the PCIE devices according to the information acquisition rules of the information acquisition threads corresponding to the PCIE devices;

The fan module is controlled to adjust the speed according to the alarm temperature and the operating temperature of each PCIE device.

Preferably, the types of M PCIE devices connected to the current server and the positions in the N hardware interfaces are obtained, including:

Obtain the types of the M PCIE devices externally connected to the server and their positions in the N hardware interfaces from the non-volatile storage medium of the server.

Preferably, according to the position of each said PCIE device, determine the physical link correspondingly connected between each said PCIE device and said BMC, including:

According to the location of each PCIE device, determine the corresponding physical link between each PCIE device and the BMC from the interface-link correspondence relationship pre-stored in the non-volatile storage medium of the server.

Preferably, the information acquisition thread is an II2C information acquisition thread or a PCIE information acquisition thread.

Preferably, for each of the PCIE devices, the alarm temperature and operating temperature of the PCIE device are obtained through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device After that, also include:

The control prompting module prompts the warning temperature and the operating temperature of each of the PCIE devices.

Preferably, the prompt module is a display module.

Preferably, the alarm temperature includes P alarm temperatures, wherein P≥1 and P is an integer, and when P>1, the jth alarm temperature<j+1th alarm temperature, 1≤j ≤P-1 and j is an integer;

Controlling the fan module for speed regulation according to the alarm temperature and the operating temperature of each of the PCIE devices includes:

For the i-th PCIE device, 1≤i≤M and i is an integer, perform the following steps:

When P=1 and the operating temperature ≥ the alarm temperature, determine that the i-th PCIE device intends to control the fan module to operate at a first preset speed;

When P>1 and the jth alarm temperature≤the operating temperature<the j+1th alarm temperature, it is determined that the ith PCIE device intends to operate at the j+1th preset speed;

When P>1 and the operating temperature ≥ the Pth warning temperature, it is determined that the i-th PCIE device intends to operate at the j+2th preset speed, wherein the j+1th preset speed< said j+2 preset speed;

The fan module is controlled to adjust the speed according to the maximum value of the speed determined by each PCIE device to control the operation of the fan module.

In order to solve the above technical problems, the present invention also provides a heat dissipation control system, including:

The first obtaining unit is used to obtain the types of M PCIE devices currently connected to the server and the positions in the N hardware interfaces, where 1≤M≤N and M is an integer;

A first determining unit, configured to determine a physical link correspondingly connected between each of the PCIE devices and the BMC according to the location of each of the PCIE devices;

The second determination unit is used to determine the information acquisition threads for grabbing data corresponding to each of the PCIE devices according to the type of each of the PCIE devices, wherein the information acquisition rules of different information acquisition threads are different;

The second acquiring unit is configured to, for each of the PCIE devices, acquire the alarm of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device temperature and operating temperature;

A speed regulation control unit, configured to control the fan module to perform speed regulation according to the alarm temperature and the operating temperature of each of the PCIE devices.

In order to solve the above technical problems, the present invention also provides a heat dissipation control device, including:

memory for storing computer programs;

A processor, configured to execute the steps of the heat dissipation regulation method as described above.

In order to solve the above-mentioned technical problems, the present invention also provides a server, including a BMC, a fan module, and N hardware interfaces for connecting external PCIE devices, and also includes the heat dissipation control device as described above.

The present invention provides a heat dissipation control method, system, device and server. The solution first obtains the types of M PCIE devices currently connected to the server and their positions in N hardware interfaces, and then determines each PCIE device according to the above positions The physical link corresponding to the connection with the BMC determines the information acquisition threads corresponding to each PCIE device for capturing data according to the above types, so for each PCIE device, the BMC obtains the thread according to the information corresponding to the PCIE device The information acquisition rules of the PCIE device obtain its alarm temperature and operating temperature through the physical link corresponding to the PCIE device, and finally control the fan module to adjust the speed according to the alarm temperature and operating temperature of each PCIE device. Compared with the existing technology, this solution does not need to pre-establish a temperature regulation table in the firmware of the BMC, and can determine the alarm temperature and operating temperature of each PCIE device and adjust the fan module speed accordingly, which solves the problems in the existing technology. The problem of firmware update required for maintaining the temperature control table and the corresponding firmware update required by customers is convenient for customers to use and avoids waste of human resources for upgrade and maintenance.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the prior art and the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

Fig. 1 is a flow chart of a heat dissipation control method provided by the present invention;

Fig. 2 is a structural schematic diagram of a heat dissipation control system provided by the present invention;

Fig. 3 is a schematic structural diagram of a heat dissipation control device provided by the present invention.

Detailed ways

The core of the present invention is to provide a heat dissipation control method, system, device, and server without pre-establishing a temperature regulation table in the firmware of the BMC, which solves the need for firmware updates and the need for customers to maintain the temperature regulation table in the prior art. The problem of corresponding firmware upgrade is convenient for customers to use, and the waste of human resources for upgrade and maintenance is avoided.

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to FIG. 1 , which is a flowchart of a heat dissipation control method provided by the present invention.

The heat dissipation control method is applied to the BMC in the server. The server also includes a fan module and N hardware interfaces for external PCIE devices, where N≥1 and N is an integer. The heat dissipation control method includes:

S11: Obtain the types of M PCIE devices currently connected to the server and their positions in the N hardware interfaces, where 1≤M≤N and M is an integer;

S12: Determine the physical link corresponding to the connection between each PCIE device and the BMC according to the location of each PCIE device;

S13: Determine the information acquisition threads corresponding to each PCIE device for capturing data according to the type of each PCIE device, wherein different information acquisition threads have different information acquisition rules;

S14: For each PCIE device, obtain the alarm temperature and operating temperature of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device;

S15: Control the fan module to adjust the speed according to the alarm temperature and operating temperature of each PCIE device.

In this embodiment, considering that in the prior art, it is necessary to store in advance in the firmware of the BMC the temperature regulation tables established according to different manufacturers and for the temperature regulation points of different PCIE devices, if the current external PCIE device is not in the In this temperature adjustment table, BMC will adjust the fan speed according to the default temperature adjustment point, making the speed adjustment result inaccurate; and if you want to add information to this temperature adjustment table, you need to re-update the firmware and release it. The corresponding firmware upgrade is performed by the customer, which makes subsequent maintenance and customer use inconvenient. In order to solve the above technical problems, the present invention provides a heat dissipation control method, which can dynamically adapt the heat dissipation strategy according to the difference of the external PCIE devices.

Specifically, N hardware interfaces are used to connect to various PCIE devices, and fan modules are used to dissipate heat. Therefore, in this solution, the types of M PCIE devices currently connected to the server and the types of the above M PCIE devices on the N hardware Position in the interface, the PCIE device here can be a network card, also can be RAID (Redundant Arrays of Independent Disks, disk array), the application is not specifically limited at this; Subsequently, determine each PCIE device and Correspondingly connected physical links between BMCs; according to the type of each PCIE device, determine the information acquisition thread corresponding to each PCIE device for grabbing data. The information acquisition thread here can be II2C information acquisition thread or PCIE The information acquisition thread, which information acquisition thread is specifically used is related to the type of PCIE device; then, for each PCIE device, according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, the PCIE device is obtained through the physical link corresponding to the PCIE device. The alarm temperature and operating temperature of the equipment are dynamically obtained from the alarm temperature and operating temperature of each PCIE device; finally, the speed of the fan module is controlled according to the alarm temperature and operating temperature of each PCIE device.

In summary, the present application provides a heat dissipation control method. Compared with the prior art, this solution does not need to pre-establish a temperature regulation table in the firmware of the BMC, and can dynamically determine the alarm temperature and operating temperature of each PCIE device and based on this Adjusting the speed of the fan module solves the problem of firmware update required for maintenance of the temperature control table and the corresponding firmware upgrade required by customers in the prior art, which is convenient for customers to use and avoids human resources for upgrade and maintenance waste.

On the basis of above-mentioned embodiment:

As a kind of preferred embodiment, obtain the type of M PCIE equipments connected to the current server and the positions in N hardware interfaces, including:

The types of the M PCIE devices connected to the current server and their positions in the N hardware interfaces are obtained from the non-volatile storage medium of the server.

In this application, the types of the M PCIE devices connected to the current server and the positions in the N hardware interfaces can be obtained directly from the non-volatile storage medium (i.e. memory) of the server. It should be noted that if the server pre-installs the current The types of the M PCIE devices connected to the server and their positions in the N hardware interfaces are stored in other memories, and the BMC only needs to fetch data from other memories, which is not specifically limited in this application.

It can be seen that in this way, the types of the M PCIE devices connected to the current server and their positions in the N hardware interfaces can be obtained directly and simply and reliably for subsequent actions.

As a kind of preferred embodiment, determine the physical link correspondingly connected between each PCIE device and BMC according to the position of each PCIE device, including:

According to the location of each PCIE device, the physical link corresponding to the connection between each PCIE device and the BMC is determined from the interface-link correspondence relationship pre-stored in the non-volatile storage medium of the server.

In this embodiment, it is considered that for N hardware interfaces, an interface-link correspondence is pre-stored in the non-volatile storage medium in the server, and the interface-link correspondence includes the physical link between the BMC and each hardware interface. Link information, therefore, in this application, the physical link corresponding to the connection between each PCIE device and BMC can be determined from the interface-link correspondence relationship pre-stored in the non-volatile storage medium of the server according to the location of each PCIE device way, and the implementation method is simple and reliable.

As a preferred embodiment, the information acquisition thread is an II2C information acquisition thread or a PCIE information acquisition thread.

In this embodiment, considering that when the types of external PCIE devices are different, the information acquisition threads for grabbing data that need to be loaded are also different. Corresponding to the information acquisition threads used to capture data, different information acquisition threads have different information acquisition rules, the information acquisition threads here can be II2C information acquisition threads, or PCIE information acquisition threads, which can be simple and effective according to each The type of PCIE device captures data for information monitoring.

As a kind of preferred embodiment, for each PCIE equipment, after obtaining the warning temperature and the running temperature of PCIE equipment by the physical link corresponding to PCIE equipment according to the information acquisition rule of the information acquisition thread corresponding to PCIE equipment, also include:

The control prompt module prompts the alarm temperature and operating temperature of each PCIE device.

In this embodiment, in order to present the alarm temperature and operating temperature of each PCIE device more intuitively, in the present application, according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, the physical link corresponding to the PCIE device is used to obtain the information of the PCIE device. After the alarm temperature and operating temperature, the processor will also control the prompt module to prompt the alarm temperature and operating temperature of each PCIE device, the display is more intuitive, and it is convenient for developers or users to grasp the alarm temperature and operating temperature of each PCIE device and perform subsequent processing wait.

As a preferred embodiment, the prompt module is a display module.

In this application, the prompt module can be a display module, which directly displays the alarm temperature and operating temperature of each PCIE device, and the display is more intuitive; it should be noted that the prompt module here can also be a voice module, which directly displays the alarm temperature of each PCIE device. And the operating temperature is displayed in the form of voice broadcast, which is not specifically limited in this application.

As a preferred embodiment, the warning temperature includes P warning temperatures, where P≥1 and P is an integer, and when P>1, the jth warning temperature<j+1th warning temperature, 1≤j≤ P-1 and j is an integer;

According to the alarm temperature and operating temperature of each PCIE device, the fan module is controlled to adjust the speed, including:

For the i-th PCIE device, 1≤i≤M and i is an integer, perform the following steps:

When P=1 and the operating temperature is greater than or equal to the warning temperature, it is determined that the i-th PCIE device intends to control the fan module to operate at the first preset speed;

When P>1 and the jth alarm temperature≤operating temperature<j+1th alarm temperature, determine that the i-th PCIE device intends to operate at the j+1th preset speed;

When P>1 and the operating temperature ≥ the Pth alarm temperature, it is determined that the i-th PCIE device intends to operate at the j+2th preset speed, wherein the j+1th preset speed<j+2th preset speed;

The control fan module performs speed regulation according to the maximum value of the speed to be controlled by each PCIE device to control the operation of the fan module.

In this embodiment, considering that each PCIE device includes P alarm temperatures, in order to finally determine the speed of the fan module, it is necessary to first determine the speed of each PCIE device to control the fan module, so, for the i-th PCIE device, when P=1 And when the operating temperature is greater than or equal to the warning temperature, it means that the PCIE device only includes one warning temperature, so it is determined that the i-th PCIE device intends to control the fan module to run at the first preset speed. The specific value of the set speed is not limited, it can be set according to actual needs and conforms to the control logic;

When P>1 and the jth alarm temperature ≤ operating temperature < j+1th alarm temperature, determine that the i-th PCIE device intends to operate at the j+1th preset speed; when P>1 and the operating temperature ≥ Pth When an alarm temperature is reached, it is determined that the i-th PCIE device intends to operate at the j+2th preset speed, wherein the j+1th preset speed<j+2th preset speed. After obtaining the speed of the fan module to be controlled by each PCIE device, the BMC controls the fan module to adjust the speed according to the maximum value of the speed of the fan module to be controlled by each PCIE device.

Specifically, taking P=3 as an example, each PCIE device includes three warning temperatures, and the first warning temperature < the second warning temperature < the third warning temperature, so when the first warning temperature ≤ operating temperature < the third warning temperature When the second alarm temperature is reached, determine that the i-th PCIE device intends to control the fan module to operate at the second preset speed; when the second alarm temperature ≤ operating temperature < the third alarm temperature, determine that the i-th PCIE device intends to control the fan module to operate at the second preset speed Run at three preset speeds; when the operating temperature ≥ the third alarm temperature, determine that the i-th PCIE device intends to control the fan module to run at the fourth preset speed, where the second preset speed<the third preset speed<the third preset speed Four preset speeds. It should be noted that the relational terms such as first, second, third, etc. herein are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations Any such actual relationship or order exists between. After obtaining the speed of the fan module to be controlled by each PCIE device, when the maximum value of the speed of the fan module to be controlled by all PCIE devices is the fourth preset speed, explain the PCIE corresponding to the fourth preset speed The operating temperature of the device is not lower than its own third alarm temperature, so the fan module is controlled to run at the fourth preset speed; the maximum speed of the fan module to be controlled to be determined by all PCIE devices is the third preset speed , control the fan module to run at the third preset speed; when the maximum value of the speed to be controlled by all PCIE devices to control the fan module is the second preset speed, control the fan module to run at the second preset speed. It should be noted that when the speed of the fan module is adjusted according to the duty cycle, the second preset speed here can be that the speed of the fan module is adjusted according to the duty cycle of 80%, and the third preset speed here can be that the fan module The speed is adjusted according to the duty cycle of 90%. The fourth preset speed here can be the speed adjustment of the fan module according to the duty cycle of 100%. This application does not make a special limitation here, and it only needs to meet the above-mentioned logical requirements.

It should also be noted that, when the operating temperature of the PCIE device is below P alarm temperatures, the speed regulation of the fan module's speed is not specifically limited in this application, and it is set according to the actual speed regulation requirements. For example, it can be set according to the speed -The temperature speed regulation curve regulates the speed of the fan module.

In addition, each PCIE device considered here based on the actual application includes P alarm temperatures, and further, although some PCIE devices may only include two alarm temperatures, from the actual application in the future, each Each PCIE device includes three alarm temperatures, which is more in line with the speed regulation needs in production and life, and the speed regulation effect can be more accurate and better, which is also the trend of future development; and if different PCIE devices include different personal If there are several alarm temperatures, you only need to follow the logic in this application, after obtaining the alarm temperature and operating temperature of each PCIE device, control the fan module to adjust the speed according to the maximum value of the speed of the fan module to be controlled by each PCIE device That is, the present application does not make a special limitation here.

It can be seen that in this way, the speed regulation of the fan module can be controlled simply and reliably according to the alarm temperature and operating temperature of each PCIE device, and the speed regulation effect is better.

Please refer to FIG. 2 . FIG. 2 is a schematic structural diagram of a heat dissipation control system provided by the present invention.

The cooling control system includes:

The first obtaining unit 21 is used to obtain the types of M PCIE devices currently connected to the server and the positions in the N hardware interfaces, where 1≤M≤N and M is an integer;

The first determining unit 22 is used to determine the physical link correspondingly connected between each PCIE device and the BMC according to the position of each PCIE device;

The second determining unit 23 is used to determine the information acquisition thread for grabbing data corresponding to each PCIE device according to the type of each PCIE device, wherein, the information acquisition rules of different information acquisition threads are different;

The second acquisition unit 24 is used for each PCIE device, according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, to obtain the warning temperature and the operating temperature of the PCIE device through the physical link corresponding to the PCIE device;

The speed regulation control unit 25 is used to control the fan module to regulate the speed according to the alarm temperature and operating temperature of each PCIE device.

For the introduction of the heat dissipation control system provided in the present invention, please refer to the above embodiment of the heat dissipation control method, which will not be repeated here.

Please refer to FIG. 3 . FIG. 3 is a schematic structural diagram of a heat dissipation regulating device provided by the present invention.

The heat dissipation control device includes:

memory 31 for storing computer programs;

The processor 32 is configured to execute the steps of the heat dissipation control method as described above.

For the introduction of the heat dissipation control device provided in the present invention, please refer to the above embodiment of the heat dissipation control method, which will not be repeated here.

The present invention also provides a server, which includes a BMC, a fan module, and N hardware interfaces for connecting external PCIE devices, and also includes the heat dissipation control device as described above.

For the introduction of the server provided in the present invention, please refer to the above-mentioned embodiment of the heat dissipation control method, which will not be repeated here.

Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for relevant details, please refer to the description of the method part.

It should also be noted that in this specification, relative terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations There is no such actual relationship or order between the operations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

Professionals can further realize that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, computer software or a combination of the two. In order to clearly illustrate the possible For interchangeability, in the above description, the composition and steps of each example have been generally described according to their functions. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present invention.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. A heat dissipation control method is characterized in that, applied to the BMC in the server, the server also includes a fan module and N hardware interfaces for external PCIE equipment, N≥1 and N is an integer, the heat dissipation control Methods include: Obtain the types of M PCIE devices currently externally connected to the server and the positions in the N hardware interfaces, where 1≤M≤N and M is an integer; Determine the physical link correspondingly connected between each of the PCIE devices and the BMC according to the location of each of the PCIE devices; According to the type of each described PCIE device, determine the information acquisition thread for grabbing data corresponding to each of the PCIE devices respectively, wherein, the information acquisition rules of different described information acquisition threads are different; the information acquisition thread is II2C Information acquisition thread or PCIE information acquisition thread; For each of the PCIE devices, obtain the warning temperature and the operating temperature of the PCIE devices through the physical link corresponding to the PCIE devices according to the information acquisition rules of the information acquisition threads corresponding to the PCIE devices; The fan module is controlled to adjust the speed according to the alarm temperature and the operating temperature of each PCIE device. 2. The heat dissipation control method as claimed in claim 1, wherein obtaining the types of M PCIE devices externally connected to the current server and the positions in the N hardware interfaces includes: Obtain the types of the M PCIE devices externally connected to the server and their positions in the N hardware interfaces from the non-volatile storage medium of the server. 3. The heat dissipation control method as claimed in claim 1, wherein the physical link correspondingly connected between each said PCIE device and said BMC is determined according to the position of each said PCIE device, comprising: According to the location of each PCIE device, determine the corresponding physical link between each PCIE device and the BMC from the interface-link correspondence relationship pre-stored in the non-volatile storage medium of the server. 4. The heat dissipation control method as claimed in claim 1, wherein, for each of the PCIE devices, according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device, pass through the corresponding information of the PCIE device. After the physical link obtains the alarm temperature and operating temperature of the PCIE device, it also includes: The control prompting module prompts the warning temperature and the operating temperature of each of the PCIE devices. 5. The heat dissipation control method according to claim 4, wherein the prompt module is a display module. 6. The heat dissipation control method according to any one of claims 1 to 5, wherein the alarm temperature includes P alarm temperatures, where P≥1 and P is an integer, and when P>1, the jth The first alarm temperature < the j+1th alarm temperature, 1≤j≤P-1 and j is an integer; Controlling the fan module for speed regulation according to the alarm temperature and the operating temperature of each of the PCIE devices includes: For the i-th PCIE device, 1≤i≤M and i is an integer, perform the following steps: When P=1 and the operating temperature ≥ the alarm temperature, determine that the i-th PCIE device intends to control the fan module to operate at a first preset speed; When P>1 and the jth alarm temperature≤the operating temperature<the j+1th alarm temperature, it is determined that the ith PCIE device intends to control the fan module according to the j+1th preset speed operation; When P>1 and the operating temperature ≥ the Pth alarm temperature, it is determined that the i-th PCIE device intends to control the fan module to operate at the j+2th preset speed, wherein the j+th 1 preset speed < said j+2 preset speed; The fan module is controlled to adjust the speed according to the maximum value of the speed determined by each PCIE device to control the operation of the fan module. 7. A heat dissipation control system, characterized in that it is applied to the BMC in the server, and the server also includes a fan module and N hardware interfaces for external PCIE devices, N≥1 and N is an integer, including: The first obtaining unit is used to obtain the types of M PCIE devices currently connected to the server and the positions in the N hardware interfaces, where 1≤M≤N and M is an integer; A first determining unit, configured to determine a physical link correspondingly connected between each of the PCIE devices and the BMC according to the location of each of the PCIE devices; The second determination unit is used to determine the information acquisition threads for grabbing data corresponding to each of the PCIE devices according to the type of each of the PCIE devices, wherein the information acquisition rules of different information acquisition threads are different; Described information acquisition thread is II2C information acquisition thread or PCIE information acquisition thread; The second acquisition unit is used to obtain the alarm of the PCIE device through the physical link corresponding to the PCIE device according to the information acquisition rule of the information acquisition thread corresponding to the PCIE device for each of the PCIE devices temperature and operating temperature; A speed regulation control unit, configured to control the fan module to perform speed regulation according to the alarm temperature and the operating temperature of each of the PCIE devices. 8. A heat dissipation control device, characterized in that it comprises: memory for storing computer programs; A processor, configured to execute the steps of the thermal regulation method according to any one of claims 1 to 6. 9. A server, characterized in that it comprises a BMC, a fan module, and N hardware interfaces for externally connecting PCIE devices, and also comprises a heat dissipation regulating device as claimed in claim 8.