CN114498017B - An easy-to-process millimeter-wave active dual-polarized antenna - Google Patents
An easy-to-process millimeter-wave active dual-polarized antenna Download PDFInfo
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
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Abstract
Description
技术领域Technical field
本发明涉及电子领域和无线通信技术,尤其涉及一种易加工的毫米波有源双极化天线。The invention relates to the electronic field and wireless communication technology, and in particular to an easy-to-process millimeter wave active dual-polarization antenna.
背景技术Background technique
面对第五代无线通信的系统需求,毫米波频段的有源多波束阵列天线系统受到了广泛的关注。毫米波有源阵列天线除了具备体积小巧、结构紧凑的特点外,还具备高增益、大带宽和可波束赋形等优点,可以提高无线通信中的频谱和能量利用率,提供高速的数据传输。此外,为了进一步提升毫米波通信的通信容量和质量,双极化功能几乎成为了5G毫米波天线的必备功能。Facing the system requirements of the fifth generation of wireless communications, active multi-beam array antenna systems in the millimeter wave band have received widespread attention. In addition to its small size and compact structure, millimeter-wave active array antennas also have the advantages of high gain, large bandwidth and beamforming capabilities, which can improve spectrum and energy utilization in wireless communications and provide high-speed data transmission. In addition, in order to further improve the communication capacity and quality of millimeter wave communications, the dual polarization function has almost become a necessary function of 5G millimeter wave antennas.
为了实现阵列天线的波束赋形功能,5G毫米波波束形成芯片被集成到了毫米波有源阵列天线系统中,为天线阵列中的各个单元天线提供所需的幅度和相位激励。相比于早期的由分立元件搭建而成的波束形成系统,现在流行的以多层PCB(印刷电路板)为形式的毫米波有源天线将波束形成芯片集成到天线的背面,具有体积小、成本低、信号损耗小等优点。但是,在毫米波有源双极化天线阵列的实现中,多层PCB结构的复杂度不可避免地增大,PCB层数、盲孔阶数、金属孔的厚径比等需求均达到了国内现阶段的PCB加工工艺的极限,PCB加工的报废率较高,成品率较低,不利于5G毫米波技术的普及和应用。In order to realize the beamforming function of the array antenna, the 5G millimeter wave beamforming chip is integrated into the millimeter wave active array antenna system to provide the required amplitude and phase excitation for each unit antenna in the antenna array. Compared with early beamforming systems built from discrete components, the now popular millimeter-wave active antennas in the form of multi-layer PCBs (printed circuit boards) integrate the beamforming chip into the back of the antenna, which has the advantages of small size, Low cost, small signal loss and other advantages. However, in the implementation of millimeter-wave active dual-polarized antenna arrays, the complexity of the multi-layer PCB structure inevitably increases, and requirements such as the number of PCB layers, the order of blind holes, and the thickness-to-diameter ratio of metal holes have all reached the domestic level. The current PCB processing technology is at its limit. The scrap rate of PCB processing is high and the yield is low, which is not conducive to the popularization and application of 5G millimeter wave technology.
发明内容Contents of the invention
技术为题:本发明提供了一种易加工的毫米波有源双极化天线,该有源天线结构能够将天线结构和射频馈电结构分开加工再通过表贴焊接的方式连接在一起,降低了多层PCB加工的难度,提高加工的成品率。该天线可以覆盖所需的毫米波频段,提供可靠的天线性能。Technical title: The present invention provides an easy-to-process millimeter-wave active dual-polarized antenna. The active antenna structure can process the antenna structure and the radio frequency feed structure separately and then connect them together through surface mount welding, reducing the It reduces the difficulty of multi-layer PCB processing and improves the processing yield. The antenna can cover the required millimeter wave frequency band and provide reliable antenna performance.
技术方案:本发明的一种易加工的毫米波有源双极化天线包含层叠的毫米波双极化天线、射频馈电结构以及连接毫米波双极化天线、射频馈电结构的连接结构;其中毫米波双极化天线包含两层叠放的上层金属贴片、下层金属贴片和与上层金属贴片、下层金属贴片垂直连接的双探针缝隙耦合馈电结构即馈电探针和耦合缝隙;连接结构包含位于馈电探针下的馈电焊盘、连接馈电焊盘和下部射频馈电结构的第一锡球、位于天线边沿用于结构支撑的第二锡球和位于第二锡球上的固定焊盘;射频馈电结构包括多层金属层、和与多层金属层垂直连接的双拟同轴传输线,在双拟同轴传输线下面是底层的微带线,微带线的下面是第三锡球、第三锡球下面是波束形成芯片。Technical solution: An easy-to-process millimeter wave active dual-polarized antenna of the present invention includes a stacked millimeter-wave dual-polarized antenna, a radio frequency feed structure, and a connection structure connecting the millimeter wave dual-polarized antenna and the radio frequency feed structure; The millimeter-wave dual-polarized antenna consists of two stacked upper metal patches, a lower metal patch, and a dual-probe slot coupling feed structure that is vertically connected to the upper metal patch and the lower metal patch, that is, the feed probe and coupling Gap; the connection structure includes a feed pad located under the feed probe, a first solder ball connecting the feed pad and the lower RF feed structure, a second solder ball located at the edge of the antenna for structural support, and a second solder ball located at the edge of the antenna for structural support. the fixed pad on; the RF feed structure includes a multi-layer metal layer and a double quasi-coaxial transmission line vertically connected to the multi-layer metal layer. Below the double quasi-coaxial transmission line is the bottom microstrip line, and below the microstrip line It is the third solder ball, and below the third solder ball is the beam forming chip.
所述的毫米波双极化天线采用了多层PCB的结构形式,在上层金属贴片、下层金属贴片之间以及下层金属贴片下面都设置多层PCB。The millimeter-wave dual-polarized antenna adopts a multi-layer PCB structure, and multi-layer PCBs are arranged between the upper metal patch, the lower metal patch and below the lower metal patch.
所述的射频馈电结构采用了多层PCB的结构形式,在多层金属层的上、下两层之间设有多层PCB。The radio frequency feed structure adopts a multi-layer PCB structure, and a multi-layer PCB is arranged between the upper and lower layers of the multi-layer metal layer.
所述的毫米波双极化天线在传统的探针馈电双层金属贴片的结构上加入了耦合缝隙进行馈电,以配合连接结构中的空气层结构实现更方便的天线匹配。The millimeter-wave dual-polarized antenna adds a coupling gap to the traditional probe-feeding double-layer metal patch structure for feeding, so as to cooperate with the air layer structure in the connection structure to achieve more convenient antenna matching.
所述的连接结构中,毫米波双极化天线中的馈电探针和射频馈电结构中的双拟同轴传输线依托第一锡球通过表面焊接的工艺连接起来。In the connection structure, the feed probe in the millimeter-wave dual-polarized antenna and the dual quasi-coaxial transmission line in the radio frequency feed structure are connected through a surface welding process relying on the first solder ball.
所述的毫米波双极化天线、射频馈电结构之间设有空气层。There is an air layer between the millimeter-wave dual-polarized antenna and the radio frequency feed structure.
所述的耦合缝隙位于上层金属贴片或下层金属贴片与馈电探针之间。The coupling gap is located between the upper metal patch or the lower metal patch and the feeding probe.
有益效果:所述的毫米波双极化天线,天线结构是以传统的探针馈电叠层贴片天线为基础改进而来的。两层贴片之间的距离对应了两者之间的耦合,可以通过调整耦合获得理想的天线带宽。探针是由一个贯穿多层PCB的金属化通孔实现的。不同于传统的探针馈电叠层贴片天线,探针并不是直接连接金属贴片的,而是通过缝隙耦合馈电机制对上下两个金属贴片进行激励的。该激励方法有效地中和了由于前面所述的连接结构中的空气层所引起的反射,使得天线的工作带宽得到保证。Beneficial effects: The antenna structure of the millimeter-wave dual-polarized antenna is improved based on the traditional probe-fed laminated patch antenna. The distance between the two layers of patches corresponds to the coupling between the two, and the ideal antenna bandwidth can be obtained by adjusting the coupling. The probe is implemented by a metallized via that penetrates the multilayer PCB. Different from the traditional probe-fed stacked patch antenna, the probe is not directly connected to the metal patch, but excites the upper and lower metal patches through a gap coupling feeding mechanism. This excitation method effectively neutralizes the reflection caused by the air layer in the connection structure mentioned above, so that the operating bandwidth of the antenna is guaranteed.
所述的连接结构,连接馈电探针的锡球和用于结构支撑的锡球均可以采用植球的工艺放置于预先设计好的焊盘上,前面所述的毫米波双极化天线的下方和射频馈电结构的最上层适当对应位置均设计有焊盘。锡球的高度会影响毫米波双极化天线下方被垫高的空气层的高度,进而影响整个天线的匹配,需要在天线仿真计算中被精确考虑。The connection structure, the solder balls connected to the feed probes and the solder balls used for structural support can all be placed on the pre-designed pads using the ball planting process. The millimeter wave dual polarized antenna mentioned above can Welding pads are designed at appropriate corresponding positions below and on the uppermost layer of the RF feed structure. The height of the solder ball will affect the height of the raised air layer below the millimeter-wave dual-polarized antenna, which in turn affects the matching of the entire antenna. It needs to be accurately considered in the antenna simulation calculation.
该有源天线结构能够将天线结构和射频馈电结构分开加工再通过表贴焊接的方式连接在一起,降低了多层PCB加工的难度,提高加工的成品率,该天线可以覆盖所需的毫米波频段,提供可靠的天线性能。This active antenna structure can process the antenna structure and the RF feed structure separately and then connect them together through surface mount welding, which reduces the difficulty of multi-layer PCB processing and improves the processing yield. The antenna can cover the required millimeters wave frequency band, providing reliable antenna performance.
附图说明Description of the drawings
图1是本发明提供的易加工的毫米波有源双极化天线叠层剖面示意图;Figure 1 is a schematic cross-sectional view of an easy-to-process millimeter-wave active dual-polarized antenna stack provided by the present invention;
图2是本发明提供的易加工的毫米波有源双极化天线叠层三维示意图;Figure 2 is a three-dimensional schematic diagram of the easy-to-process millimeter wave active dual-polarized antenna stack provided by the present invention;
图3(a)是毫米波双极化天线上层贴片与馈电探针连接的结构示意图,图3(b)是下层贴片与馈电探针连接的结构示意图;Figure 3(a) is a schematic structural diagram of the connection between the upper patch of the millimeter-wave dual-polarized antenna and the feed probe, and Figure 3(b) is a schematic structural diagram of the connection between the lower patch and the feed probe;
图4是毫米波双极化天线输入端口反射系数仿真和测试结果;Figure 4 is the simulation and test results of the reflection coefficient of the millimeter-wave dual-polarized antenna input port;
图5是毫米波有源双极化天线在发射状态下水平极化波束指向0°时的主极化和交叉极化方向图测量结果;Figure 5 shows the main polarization and cross-polarization pattern measurement results of the millimeter-wave active dual-polarization antenna when the horizontal polarization beam points to 0° in the transmitting state;
图6是毫米波有源双极化天线在发射状态下水平极化波束指向40°时的主极化和交叉极化方向图测量结果;Figure 6 shows the main polarization and cross-polarization pattern measurement results of the millimeter-wave active dual-polarization antenna when the horizontal polarization beam is pointed at 40° in the transmitting state;
图中有:上层金属贴片1、下层金属贴片2、馈电探针3、馈电焊盘4、耦合缝隙5、固定焊盘6,第一锡球7、第二锡球8、空气层9、双拟同轴传输线10、底层的微带线11、第三锡球12、波束形成芯片13,多层金属层14。The figure shows: upper metal patch 1, lower metal patch 2, feed probe 3, feed pad 4, coupling gap 5, fixed pad 6, first solder ball 7, second solder ball 8, air layer 9. Dual quasi-coaxial transmission line 10, bottom microstrip line 11, third solder ball 12, beam forming chip 13, and multi-layer metal layer 14.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。凡是按照本发明提出的技术思想,在技术方案基础上所做的任何改动,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Any changes made based on the technical ideas proposed by the present invention and based on the technical solutions shall fall within the scope of protection of the present invention.
参考附图1-附图3,本发明提供的易加工的毫米波有源双极化天线包含层叠的毫米波双极化天线、射频馈电结构以及连接毫米波双极化天线、射频馈电结构的连接结构;其中毫米波双极化天线包含两层叠放的上层金属贴片1、下层金属贴片2和与上层金属贴片1、下层金属贴片2垂直连接的双探针缝隙耦合馈电结构即馈电探针3;连接结构包含位于馈电探针3下的馈电焊盘4、连接馈电焊盘4和下部射频馈电结构的第一锡球7、位于天线边沿用于结构支撑的第二锡球8和位于第二锡球8上的固定焊盘6;射频馈电结构包括多层金属层14、和与多层金属层14垂直连接的双拟同轴传输线10,在双拟同轴传输线10下面是底层的微带线11,微带线11的下面是第三锡球12、第三锡球12下面是波束形成芯片13。射频馈电结构包含连接天线各个端口的射频连接线、毫米波波束形成芯片,另有射频输入电路、直流供电电路和控制电路等。Referring to Figures 1 to 3, the easy-to-process millimeter wave active dual-polarized antenna provided by the present invention includes a stacked millimeter-wave dual-polarized antenna, a radio frequency feed structure, and a connected millimeter-wave dual polarized antenna and radio frequency feed structure. The connection structure of the structure; the millimeter-wave dual-polarized antenna includes two stacked upper metal patches 1, lower metal patches 2, and dual probe slot coupling feeds vertically connected to the upper metal patches 1 and lower metal patches 2. The electrical structure is the feed probe 3; the connection structure includes a feed pad 4 located under the feed probe 3, a first solder ball 7 connecting the feed pad 4 and the lower RF feed structure, and a first solder ball 7 located on the edge of the antenna for structural support. The second solder ball 8 and the fixed pad 6 located on the second solder ball 8; the radio frequency feed structure includes a multi-layer metal layer 14 and a dual quasi-coaxial transmission line 10 vertically connected to the multi-layer metal layer 14. Below the quasi-coaxial transmission line 10 is the underlying microstrip line 11 , below the microstrip line 11 is the third solder ball 12 , and below the third solder ball 12 is the beam forming chip 13 . The RF feed structure includes RF connecting lines connecting each port of the antenna, millimeter wave beam forming chips, RF input circuits, DC power supply circuits and control circuits.
所述的射频馈电结构,包括了用于连接天线各个端口的射频连接线、毫米波波束形成芯片,另外还有射频输入电路、直流供电电路和控制电路等结构。用于连接天线各个端口的射频连接线包含了双拟同轴传输线、微带线,其中双拟同轴传输线是贯穿整个多层PCB射频馈电结构的,包含了中心的馈电通孔和周围的接地通孔,微带线负责连接拟同轴线和波束形成芯片的射频输出端口。用于给波束形成芯片馈电和供电的射频输入电路、直流供电和控制电路集成在了射频馈电结构的多层PCB中。The radio frequency feed structure includes radio frequency connection lines for connecting various ports of the antenna, millimeter wave beam forming chips, radio frequency input circuits, DC power supply circuits, control circuits and other structures. The RF connection lines used to connect each port of the antenna include dual quasi-coaxial transmission lines and microstrip lines. The dual quasi-coaxial transmission lines run through the entire multi-layer PCB RF feed structure, including the central feed through hole and the surrounding The ground via hole and microstrip line are responsible for connecting the quasi-coaxial line and the RF output port of the beamforming chip. The RF input circuit, DC power supply and control circuit used to feed and power the beamforming chip are integrated in the multi-layer PCB of the RF feed structure.
毫米波双极化天线是制作加工在一块6层PCB上的,其中的关键结构包括了:上层金属贴片1、下层金属贴片2和分别用于激发两种极化辐射模式的馈电探针3,其中,馈电探针3上的信号均是通过耦合缝隙5对上层金属贴片1、下层金属贴片2进行馈电激励的,如图2和图3(a)、图3(b)所示。另外,馈电探针3的下方和天线周围的适当位置下方均分别放置了馈电焊盘4和固定焊盘6,以便与连接结构中的第一锡球7和第二锡球8进行焊接。The millimeter-wave dual-polarized antenna is manufactured on a 6-layer PCB. The key structures include: upper metal patch 1, lower metal patch 2 and feed probes used to excite two polarized radiation modes. Needle 3, where the signals on the feeding probe 3 are fed and excited to the upper metal patch 1 and the lower metal patch 2 through the coupling gap 5, as shown in Figure 2, Figure 3(a), Figure 3( b) shown. In addition, a feed pad 4 and a fixing pad 6 are respectively placed below the feed probe 3 and at appropriate positions around the antenna, so as to be soldered to the first solder ball 7 and the second solder ball 8 in the connection structure.
连接结构包括了用于连接毫米波双极化天线中的馈电探针3和射频馈电结构中的双拟同轴传输线10的第一锡球7,还包括了放置于天线底部周围适当位置的用于进行结构支撑的第二锡球8,经计算和试验,第二锡球8对天线的性能参数的影响较小,而由于连接结构将天线PCB垫高了一定的高度,其中的空气层9会对天线的输入匹配产生很大影响,本发明提供的缝隙耦合结构可以用于中和连接结构中的空气层9对天线匹配的影响。如图4所示,天线的输入散射参数在所需的毫米波工作频段均小于-10dB,满足使用需要。The connection structure includes a first solder ball 7 for connecting the feed probe 3 in the millimeter-wave dual-polarized antenna and the dual quasi-coaxial transmission line 10 in the radio frequency feed structure, and also includes a first solder ball 7 placed at an appropriate position around the bottom of the antenna. The second solder ball 8 is used for structural support. After calculation and testing, the second solder ball 8 has a small impact on the performance parameters of the antenna. Since the connection structure raises the antenna PCB to a certain height, the air in it Layer 9 will have a great impact on the input matching of the antenna. The slot coupling structure provided by the present invention can be used to neutralize the impact of the air layer 9 in the connection structure on the antenna matching. As shown in Figure 4, the input scattering parameters of the antenna are less than -10dB in the required millimeter wave operating frequency band, which meets the needs of use.
射频馈电结构是制作加工在一块8层PCB上的,主要包括了连接天线端口和波束形成芯片输出口的双拟同轴传输线10、底层的微带线11、第三锡球12、毫米波多通道射频收发波束形成芯片13、射频输入电路、直流供电电路和控制等其他电路等结构。其中,贯穿多层PCB的双拟同轴传输线10和底层的微带线11均设计成与波束形成芯片13端口一致的50欧姆阻抗,以确保良好的连接性能。连接波束形成芯片13输入端口的射频输入电路、控制电路和供电电路等结构被集成在多层金属层14中,并无特别之处,在此不赘述。The RF feed structure is fabricated and processed on an 8-layer PCB, and mainly includes dual quasi-coaxial transmission lines 10 connecting the antenna port and the output port of the beam forming chip, the bottom microstrip line 11, the third solder ball 12, millimeter wave multi-layer The channel radio frequency transceiver beam forming chip 13, radio frequency input circuit, DC power supply circuit, control and other other circuits and other structures. Among them, the dual quasi-coaxial transmission line 10 running through the multi-layer PCB and the bottom microstrip line 11 are designed to have an impedance of 50 ohms consistent with the port of the beam forming chip 13 to ensure good connection performance. The radio frequency input circuit, control circuit, power supply circuit and other structures connected to the input port of the beam forming chip 13 are integrated in the multi-layer metal layer 14 and have no special features, which will not be described again here.
为了验证本发明提供的易加工的毫米波有源双极化天线的真实性和可靠性,特按照本实施案例制作了一个工作在24GHz至28GHz频段的有源双极化阵列天线,阵列的规模为2×4。采用了两块8通道毫米波波束形成芯片,用于对八个天线单元的一共16个通道进行激励。设计的实例PCB均采用罗杰斯3003板材作为芯板,罗杰斯4450F板材作为粘连材料。附图5-附图6给出了实物阵列天线在发射状态下水平极化的辐射方向图结果。从实验结果可以看出,该阵列天线经过校准最大相控波束扫描角度可以达到±40°,并且可以在波束指向的方向提供较高的交叉极化抑制。In order to verify the authenticity and reliability of the easy-to-process millimeter-wave active dual-polarized antenna provided by the present invention, an active dual-polarized array antenna operating in the 24GHz to 28GHz frequency band was produced according to this implementation case. The scale of the array is 2×4. Two 8-channel millimeter wave beam forming chips are used to excite a total of 16 channels of eight antenna units. The designed example PCBs all use Rogers 3003 sheet as the core board and Rogers 4450F sheet as the adhesive material. Figures 5 to 6 show the radiation pattern results of the horizontally polarized radiation pattern of the physical array antenna in the transmitting state. It can be seen from the experimental results that the array antenna can reach a maximum phased beam scanning angle of ±40° after calibration, and can provide high cross-polarization suppression in the direction of the beam pointing.
以上实施例仅为说明本发明的技术思想,不能以此限定本发明的保护范围,凡是按照本发明提出的技术思想,在技术方案基础上所做的任何改动,均落入本发明保护范围之内。The above embodiments are only for illustrating the technical ideas of the present invention and cannot limit the protection scope of the present invention. Any changes made based on the technical solutions based on the technical ideas proposed by the present invention will fall within the protection scope of the present invention. Inside.
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| PCT/CN2023/089962 WO2023165634A1 (en) | 2022-03-01 | 2023-04-22 | Easily processed millimeter wave active dual-polarized antenna |
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| CN116250818A (en) * | 2022-09-06 | 2023-06-13 | 电子科技大学长三角研究院(湖州) | A dual-polarization direction backtracking millimeter wave health monitoring system and its application method |
| CN116826365B (en) * | 2022-11-18 | 2024-08-23 | 江苏欧佳智能科技有限公司 | Millimeter wave wide angle scanning antenna array |
| CN118676621B (en) * | 2024-07-18 | 2025-03-25 | 南通大学 | A broadband low active reflection patch phased array antenna |
| CN119050634B (en) * | 2024-10-30 | 2025-02-28 | 南京荣熹通信技术有限公司 | A ka-band phased array antenna unit and antenna array |
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| WO2020134471A1 (en) * | 2018-12-29 | 2020-07-02 | 瑞声声学科技(深圳)有限公司 | Millimeter wave array antenna module and mobile terminal |
| WO2021022941A1 (en) * | 2019-08-06 | 2021-02-11 | 维沃移动通信有限公司 | Antenna array and terminal |
| CN112787089A (en) * | 2020-12-28 | 2021-05-11 | 京信网络系统股份有限公司 | Millimeter wave package antenna and array antenna |
| CN213906670U (en) * | 2021-01-22 | 2021-08-06 | 苏州硕贝德创新技术研究有限公司 | Millimeter wave communication AIP module |
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