CN114501840B - Manufacturing method of circuit board assembly and circuit board assembly - Google Patents
Manufacturing method of circuit board assembly and circuit board assembly Download PDFInfo
- Publication number
- CN114501840B CN114501840B CN202011158019.0A CN202011158019A CN114501840B CN 114501840 B CN114501840 B CN 114501840B CN 202011158019 A CN202011158019 A CN 202011158019A CN 114501840 B CN114501840 B CN 114501840B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- solder
- groove
- connecting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 47
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A method of making a circuit board assembly, comprising: providing a first circuit board, wherein the first circuit board comprises a first surface and a second surface, the first surface is intersected with the second surface, the first circuit board comprises a slot and a connecting pad, the slot is recessed in the first surface towards the interior of the first circuit board, the slot also penetrates through the second surface, and the connecting pad is positioned on the surface of the slot towards the first surface; providing a second circuit board, wherein the second circuit board comprises a through hole, part of the second circuit board is arranged in the groove, the connecting pad is exposed to the through hole, and the surface of the second circuit board, which is away from the first circuit board, and the first surface are positioned on the same plane; printing solder in the through hole, wherein the solder is connected with the connecting pad to obtain a prefabricated product; and performing reflow soldering treatment on the prefabricated product to enable the solder to be melted and solidified, so as to obtain the circuit board assembly. The application also provides a circuit board assembly manufactured by the manufacturing method.
Description
Technical Field
The present application relates to the field of circuit board manufacturing, and in particular, to a method for manufacturing a circuit board assembly and a circuit board assembly.
Background
With the wide application of circuit boards in the electronic field, in order to fully perform the functions of electronic products, two or more circuit boards with different functions are usually required to be connected together to perform a synergistic function.
At present, the connection modes between circuit boards generally include: anisotropic conductive adhesive (Anisotropic Conductive Film, ACF) connection, thermocompression (Hotbar) process connection, board-to-Board (BTB) connection, and the like. However, the above connection method has limitations in manufacturing a circuit board with a level difference, for example, in the process of soldering, the size of solder paste is not easy to control, and there is a risk of bridging and tin overflow; or in the soldering process, the solder paste is not easy to be discharged or is not easy to be discharged due to the height difference, so that poor connection between different circuit boards is caused.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method for manufacturing a circuit board assembly with good connectivity between different circuit boards.
In addition, it is also necessary to provide a circuit board assembly.
A manufacturing method of a circuit board assembly comprises the following steps:
Providing a first circuit board, wherein the first circuit board comprises a first surface and a second surface, the first surface is intersected with the second surface, the first circuit board comprises a groove and a connecting pad, the groove is recessed in the first surface towards the interior of the first circuit board, the groove also penetrates through the second surface, and the connecting pad is positioned on the surface of the groove towards the first surface;
providing a second circuit board, wherein the second circuit board comprises a through hole, a part of the second circuit board is arranged in the groove, the connecting pad is exposed to the through hole, and the surface of the second circuit board, which is away from the first circuit board, and the first surface are positioned on the same plane;
Printing solder in the through hole, wherein the solder is connected with the connecting pad to obtain a prefabricated product; and
And carrying out reflow soldering treatment on the prefabricated product so as to enable the solder to be melted and then solidified, and obtaining the circuit board assembly.
Further, the first circuit board manufacturing includes the following steps:
Providing a circuit substrate, wherein the circuit substrate comprises the first surface and the second surface, and the first surface is connected with the second surface;
Performing uncovering treatment on the first surface to form the grooves; and
And forming the connecting pad on the surface of the groove facing the first surface to obtain the first circuit board.
Further, the first circuit board manufacturing includes the following steps:
providing two circuit substrates, and
And superposing the two circuit substrates to form the first circuit board with the grooves.
Further, before the step of placing a part of the second circuit board in the slot, the method further comprises a step of providing an adhesive layer on the surface of the first circuit board or the second circuit board, so that the adhesive layer is arranged on the periphery of the connection pad after the second circuit board is placed in the slot.
Further, a direction perpendicular to the first surface is defined as a first direction, and along the first direction, a recess depth of the slot is equal to a sum of thicknesses of the second circuit board and the connection pad.
Further, defining a direction parallel to the first surface as a second direction, along which the width of the connection pad is D, and the diameter of the through hole is R, so as to satisfy: R-D is less than or equal to 1/3D.
Further, the solder includes at least one of solder paste and copper paste.
A circuit board assembly comprising a first circuit board, a second circuit board, and solder; the first circuit board comprises a first surface and a second surface, the first surface is intersected with the second surface, the first circuit board comprises a groove and a connecting pad, the groove is recessed in the first surface towards the interior of the first circuit board, the groove also penetrates through the second surface, and the connecting pad is positioned on the surface of the groove towards the first surface; the second circuit board comprises a through hole penetrating through the second circuit board, a part of the second circuit board with the through hole is accommodated in the groove, the connecting pad is positioned in a projection area of the through hole, and the surface of the second circuit board facing away from the first circuit board and the first surface are in the same plane; solder is located in the through hole and connected with the connection pad.
Further, the circuit board assembly further comprises an adhesive layer, wherein the adhesive layer is positioned at the periphery of the connecting pad and is used for connecting the first circuit board and the second circuit board.
Further, defining a direction parallel to the first surface as a second direction, along which the width of the connection pad is D, and the diameter of the through hole is R, so as to satisfy: R-D is less than or equal to 1/3D; the solder also connects the adhesive layer.
According to the manufacturing method of the circuit board assembly, the grooved concave depth matched with the thickness of the second circuit board is arranged on the first circuit board, so that the surface of the second circuit board deviating from the first circuit board is located on the same plane as the first surface, and the solder can flow to the through holes conveniently, so that the solder can be connected with the connecting pads at the bottoms of the through holes, and the connection performance of the first circuit board and the second circuit board can be improved; in addition, the manufacturing method is suitable for manufacturing circuit board components with any level difference by designing the concave depth of the groove to be matched with the thickness of the second circuit board, and the application range is wide.
Drawings
Fig. 1 is a schematic cross-sectional view of a first circuit board according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a second circuit board inserted into the slot of the first circuit board shown in fig. 1.
Fig. 3 is a schematic cross-sectional view of a preform obtained by forming solder in the through-hole shown in fig. 2 and connecting the connection pads at the bottom of the through-hole.
Fig. 4 is a schematic cross-sectional view of a circuit board assembly obtained by subjecting the preform shown in fig. 3 to a reflow process.
Description of the main reference signs
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. The embodiments of the present application and the features in the embodiments may be combined with each other without collision. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes all and any combination of one or more of the associated listed items.
In various embodiments of the present application, for convenience of description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical coupling, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which change accordingly when the absolute position of the object to be described changes.
Referring to fig. 1 to 4, an embodiment of the present application provides a method for manufacturing a circuit board assembly 100, which includes the following steps:
Step S1: referring to fig. 1, a first circuit board 10 is provided, the first circuit board 10 includes a first surface 112 and a second surface 114, the first surface 112 intersects the second surface 114, the first circuit board 10 includes a slot 12 and a connection pad 14, the slot 12 is recessed in the first surface 112 toward the inside of the first circuit board 10, the slot 12 further penetrates the second surface 114, and the connection pad 14 is located on a surface of the slot 12 facing the first surface 112.
The first circuit board 10 may be a flexible board, a hard board, a flexible-rigid board, a Chip On Film (COF), or an IC package carrier.
The first circuit board 10 is a multi-layer circuit board, that is, includes a plurality of circuit layers 16 and insulating layers 18 disposed between the circuit layers 16, and the plurality of circuit layers 16 may be electrically connected by an electrical conductor (not shown) passing through the insulating layers 18.
The insulating layer 18 may be a dielectric layer or a glue layer. The material of the insulating layer 18 may be one of Polyimide (PI), glass fiber epoxy (FR 4), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), and the like. The material of the dielectric layer and the adhesive layer can be the same or different.
The circuit layer 16 and the insulating layer 18 are disposed in a stacked manner along a first direction L1, and it is understood that the first direction L1 is perpendicular to the first surface 112. The first surface 112 is an upper surface of the first circuit board 10, and the second surface 114 is a side surface of the first circuit board 10. It will be appreciated that due to the arrangement of the slot 12, the first surface 112 and the second surface 114 are not directly connected, but intersect at an extension of the plane in which they lie.
The area of the first circuit board 10 where the slot 12 is not disposed has a first thickness H1 along the first direction L1, and the area of the first circuit board 10 where the slot 12 is disposed has a second thickness H2 along the first direction L1, that is, the depth of the recess of the slot 12 along the first direction L1 is H1-H2.
The connection pad 14 is located at the bottom of the recess 12 along the first direction L1, and the connection pad 14 is used for electrical connection.
Further, there are various ways of forming the first circuit board 10. For example, the opening process is performed on a circuit board (not shown) to form the slot 12, so as to obtain the first circuit board 10, wherein the recess depth of the slot 12 in the first direction L1 is equal to the sum of the thicknesses of the second circuit board 20 and the connection pads 14; or providing circuit substrates with thicknesses H1 and H1-H2 along the first direction L1, and then superposing the circuit substrates along the first direction L1 to form the first circuit board 10 with the grooves 12.
Step S2: referring to fig. 2, a second circuit board 20 is provided, the second circuit board 20 includes a through hole 22, and a portion of the second circuit board 20 is disposed in the slot 12, wherein the connection pad 14 is exposed to the through hole 22, and a surface of the second circuit board 20 facing away from the first circuit board 10 is on the same plane as the first surface 112.
The second circuit board 20 may be a flexible board, a hard board, a flexible-rigid board, a Chip On Film (COF), or an IC package carrier.
The second circuit board 20 may be a single-layer circuit board or a multi-layer circuit board. When the second circuit board 20 is a multi-layer circuit board, the second circuit board 20 includes circuit layers (not shown) and insulating layers (not shown) located between the circuit layers, and the multi-layer circuit layers can be electrically connected through electrical conductors penetrating through the insulating layers.
The through hole 22 is located at an end of the second circuit board 20 and penetrates the second circuit board 20 along the first direction L1. The number of the through holes 22 is at least two.
Further, the extending direction of the first circuit board 10 and the second circuit board 20 is defined as a second direction L2, and the second direction L2 is perpendicular to the first direction L1. In the second direction L2, the connection pad 14 has a width D, and the diameter of the through hole 22 is R. Wherein the width D may be less than, or equal to, or greater than the diameter R. When D is greater than or equal to R, the connecting pad 14 is positioned in the middle of the bottom of the through hole 22, namely, the connecting pad 14 seals one end of the through hole 22; when D < R, the connection pad 14 is located in the projection area of the through hole 22 in the first direction L1, wherein: R-D is less than or equal to 1/3D, and the risk of occurrence of less solder 30 or empty solder 30 in the subsequent treatment process is reduced.
The second circuit board 20 has a third thickness H3 along the first direction L1, and since the connection pad 14 has a certain thickness along the first direction L1, the third thickness H3 is slightly smaller than the recess depth H1-H2 of the slot 12 along the first direction L1, so that when a part of the second circuit board 20 is placed in the slot 12, the surface of the second circuit board 20 facing away from the first circuit board 10 is on the same plane as the first surface 112; the remaining portion of the second circuit board 20 protrudes from the second surface 114 and extends along the second direction L2.
It will be appreciated that, if the slot 12 is formed by uncapping, the thickness of the second circuit board 20 in the first direction L1 may be measured in advance, and then the slot 12 may be formed by uncapping a circuit board, where the circuit board includes the first surface 112 and the second surface 114, and the first surface 112 and the second surface 114 abut each other and intersect each other before the slot 12 is not formed. The recess depth of the slot 12 along the first direction L1 is equal to the sum of the thickness of the second circuit board 20 along the first direction L1 and the thickness of the connection pad 14, so as to ensure that the surface of the second circuit board 20 facing away from the first circuit board 10 is on the same plane as the first surface 112. If the second circuit board 20 is formed by stacking, two circuit boards may be provided, wherein a thickness of one circuit board is equal to a sum of the thicknesses of the second circuit board 20 and the connection pads 14, and then the two circuit boards are stacked along the first direction L1, and the first circuit board 10 having the slot 12 is formed.
Further, before the step of disposing a portion of the second circuit board 20 in the slot 12, the method further includes a step of disposing an adhesive layer 32 on a surface of the first circuit board 10 or the second circuit board 20, such that the adhesive layer 32 is disposed on a periphery of the connection pad 14 after the second circuit board 20 is disposed in the slot 12, and the adhesive layer 32 is used for bonding the first circuit board 10 and the second circuit board 20.
Step S3: referring to fig. 3, solder 30 is printed in the through hole 22, and the solder 30 is connected to the connection pad 14 to obtain a preform (not shown).
Specifically, the first surface 112 and a surface of the second circuit board 20 are located on the same plane, a copper mesh 40 is covered on the first surface 112, the copper mesh 40 also covers the surface of the second circuit board 20, and solder 30 is printed by using a doctor (not shown). During printing, the liquid solder 30 flows to the bottom of the through hole 22 through the copper mesh 40 and is connected to the connection pad 14, and during the subsequent processing, the liquid solder 30 is solidified to connect the first circuit board 10 and the second circuit board 20. In this case, the liquid solder 30 moves in the through hole 22 toward the region where the temperature is high due to the wick effect, and moves upward along the sidewall of the through hole 22.
The first surface 112 and a surface of the second circuit board 20 are located on the same plane, so that a step difference between the first circuit board 10 and the second circuit board 20 along the first surface 112 is eliminated, the solder 30 is facilitated to flow to the through hole 22, and the connection performance of the first circuit board 10 and the second circuit board 20 is improved.
The solder 30 may be a conductive material such as solder paste or copper paste. In this embodiment, the solder 30 is solder paste.
Step S4: referring to fig. 4, the pre-form is subjected to a reflow process to melt and solidify the solder 30, resulting in the circuit board assembly 100.
The solder 30 is melted when the reflow process is performed, and when the temperature is lowered, the solder 30 is solidified, thereby connecting the first circuit board 10 and the second circuit board 20.
Referring again to fig. 4, the present application further provides a circuit board assembly 100, the circuit board assembly 100 includes a first circuit board 10, a second circuit board 20 and solder 30, and the solder 30 connects the first circuit board 10 and the second circuit board 20. The thickness of the first circuit board 10 along the first direction L1 is greater than the thickness of the second circuit board 20 along the first direction L1, and the first direction L1 is a direction in which the first circuit board 10 and the second circuit board 20 are stacked.
The first circuit board 10 includes a first surface 112 and a second surface 114, the first surface 112 intersects the second surface 114, the first circuit board 10 includes a slot 12 and a connection pad 14, the slot 12 is recessed in the first surface 112 toward the inside of the first circuit board 10, the slot 12 also penetrates the second surface 114, and the connection pad 14 is located on a surface of the slot 12 toward the first surface 112.
The second circuit board 20 includes a through hole 22 penetrating the second circuit board 20. The portion of the second circuit board 20 having the through hole 22 is accommodated in the slot 12, the connection pad 14 is located in a projection area of the through hole 22 along the first direction L1, and a surface of the second circuit board 20 facing away from the first circuit board 10 is in the same plane as the first surface 112.
Further, the circuit board assembly 100 further includes an adhesive layer 32, and the adhesive layer 32 is located at the periphery of the connection pad 14 to connect the first circuit board 10 and the second circuit board 20.
Further, when D < R, i.e., the diameter of the through hole 22 is larger than the width of the connection pad 14, it is satisfied that: R-D is less than or equal to 1/3D; at this time, the solder 30 is also connected to the adhesive layer 32.
According to the manufacturing method of the circuit board assembly 100 provided by the application, the concave depth of the groove 12 matched with the thickness of the second circuit board 20 is arranged on the first circuit board 10, so that the surface of the second circuit board 20 deviating from the first circuit board 10 is positioned on the same plane with the first surface 112, and the solder 30 can flow to the through hole 22 conveniently, so that the solder is connected with the connecting pad 14 positioned at the bottom of the through hole 22, and the connection performance of the first circuit board 10 and the second circuit board 20 is improved; in addition, the above manufacturing method is suitable for manufacturing the circuit board assembly 100 with any step by designing the recess depth of the slot 12 to be matched with the thickness of the second circuit board 20, and has wide application range.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. The manufacturing method of the circuit board assembly is characterized by comprising the following steps of:
Providing a first circuit board, wherein the first circuit board comprises a first surface and a second surface, the first surface is intersected with the second surface, the first circuit board comprises a groove and a connecting pad, the groove is recessed in the first surface towards the interior of the first circuit board, the groove also penetrates through the second surface, and the connecting pad is positioned on the surface of the groove towards the first surface;
providing a second circuit board, wherein the second circuit board comprises a through hole, a part of the second circuit board is arranged in the groove, the connecting pad is exposed to the through hole, and the surface of the second circuit board, which is away from the first circuit board, and the first surface are positioned on the same plane;
covering a copper mesh on the first surface, wherein the copper mesh also covers the surface of the second circuit board, printing solder by adopting a scraper, enabling the liquid solder to flow to the bottom of the through hole through the copper mesh and be connected with the connecting pad, enabling the liquid solder to move towards a region with high temperature in the through hole due to a wick effect, and further enabling the liquid solder to move upwards along the side wall of the through hole, so as to obtain a prefabricated product; and
And carrying out reflow soldering treatment on the prefabricated product so as to enable the solder to be melted and then solidified, and obtaining the circuit board assembly.
2. The method of manufacturing a circuit board assembly according to claim 1, wherein the first circuit board manufacturing comprises the steps of:
Providing a circuit substrate, wherein the circuit substrate comprises the first surface and the second surface, and the first surface is connected with the second surface;
Performing uncovering treatment on the first surface to form the grooves; and
And forming the connecting pad on the surface of the groove facing the first surface to obtain the first circuit board.
3. The method of manufacturing a circuit board assembly according to claim 1, wherein the first circuit board manufacturing comprises the steps of:
providing two circuit substrates, and
And superposing the two circuit substrates to form the first circuit board with the grooves.
4. The method of claim 1, further comprising the step of disposing an adhesive layer on a surface of the first circuit board or the second circuit board before the step of disposing a portion of the second circuit board in the slot, such that the adhesive layer is disposed on a periphery of the connection pad after the second circuit board is disposed in the slot.
5. The method of claim 1, wherein a direction perpendicular to the first surface is defined as a first direction, and wherein a depth of the recess of the slot is equal to a sum of thicknesses of the second circuit board and the connection pad along the first direction.
6. The method of manufacturing a circuit board assembly according to claim 1, wherein a direction parallel to the first surface is defined as a second direction, a width of the connection pad is D along the second direction, and a diameter of the through hole is R, which satisfies: R-D is less than or equal to 1/3D.
7. The method of claim 1, wherein the solder comprises at least one of solder paste and copper paste.
8. A circuit board assembly, the circuit board assembly comprising:
The first circuit board comprises a first surface and a second surface, the first surface is intersected with the second surface, the first circuit board comprises a groove and a connecting pad, the groove is recessed in the first surface towards the interior of the first circuit board, the groove also penetrates through the second surface, and the connecting pad is positioned on the surface of the groove towards the first surface;
The second circuit board comprises a through hole penetrating through the second circuit board, a part of the second circuit board with the through hole is accommodated in the groove, the connecting pad is positioned in a projection area of the through hole, and the surface of the second circuit board facing away from the first circuit board and the first surface are in the same plane; and
And the solder is positioned in the through hole and connected with the connecting pad, wherein the solder moves upwards along the side wall of the through hole and is connected with the side wall due to a wick effect in the through hole.
9. The circuit board assembly of claim 8, further comprising an adhesive layer located at a periphery of the connection pad and connecting the first circuit board and the second circuit board.
10. The circuit board assembly of claim 9, wherein a direction parallel to the first surface is defined as a second direction along which the width of the connection pad is D and the diameter of the via is R, satisfying: R-D is less than or equal to 1/3D; the solder also connects the adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011158019.0A CN114501840B (en) | 2020-10-26 | 2020-10-26 | Manufacturing method of circuit board assembly and circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011158019.0A CN114501840B (en) | 2020-10-26 | 2020-10-26 | Manufacturing method of circuit board assembly and circuit board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114501840A CN114501840A (en) | 2022-05-13 |
| CN114501840B true CN114501840B (en) | 2024-07-05 |
Family
ID=81471049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011158019.0A Active CN114501840B (en) | 2020-10-26 | 2020-10-26 | Manufacturing method of circuit board assembly and circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114501840B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813626A (en) * | 2012-11-13 | 2014-05-21 | 欧司朗有限公司 | Circuit board module, circuit board and lamp |
| CN104244563A (en) * | 2013-06-11 | 2014-12-24 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU3415095A (en) * | 1994-09-06 | 1996-03-27 | Sheldahl, Inc. | Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture |
| US6974333B2 (en) * | 2004-03-30 | 2005-12-13 | General Electric Company | High-density connection between multiple circuit boards |
| US8101868B2 (en) * | 2005-10-14 | 2012-01-24 | Ibiden Co., Ltd. | Multilayered printed circuit board and method for manufacturing the same |
| WO2011045994A1 (en) * | 2009-10-14 | 2011-04-21 | シャープ株式会社 | Flexible circuit board connection structure and display device |
| JP5066208B2 (en) * | 2010-03-17 | 2012-11-07 | 株式会社東芝 | Printed circuit board manufacturing method, printed circuit board, and electronic device including the printed circuit board |
| CN102271463B (en) * | 2010-06-07 | 2013-03-20 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103517584A (en) * | 2012-06-27 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multilayer circuit board |
| CN103517585B (en) * | 2012-06-29 | 2016-05-04 | 富葵精密组件(深圳)有限公司 | Rigid-flexible circuit board and preparation method thereof |
| JP6342626B2 (en) * | 2013-07-17 | 2018-06-13 | Ｎｅｃプラットフォームズ株式会社 | Laminated board |
| TWI667865B (en) * | 2014-05-07 | 2019-08-01 | 易鼎股份有限公司 | Flexible circuit board line lap structure |
| CN204217210U (en) * | 2014-10-24 | 2015-03-18 | 咸瑞科技股份有限公司 | Flexible circuit board combination |
| JP2016143774A (en) * | 2015-02-02 | 2016-08-08 | 株式会社日立製作所 | Printed circuit board manufacturing method and electronic device including printed circuit board manufactured using the same |
| KR101766476B1 (en) * | 2015-11-20 | 2017-08-09 | 주식회사 심텍 | Method of manufacturing cavity printed circuit board |
| CN107666770A (en) * | 2016-07-29 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Has circuit board of weld pad and preparation method thereof |
| KR102442386B1 (en) * | 2017-10-20 | 2022-09-14 | 삼성전기주식회사 | printed circuit board |
| KR20190099738A (en) * | 2018-02-19 | 2019-08-28 | 삼성전기주식회사 | Printed circuit board |
| CN110856375B (en) * | 2018-08-21 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | Hot-pressing tin-melting welding circuit board and manufacturing method thereof |
-
2020
- 2020-10-26 CN CN202011158019.0A patent/CN114501840B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103813626A (en) * | 2012-11-13 | 2014-05-21 | 欧司朗有限公司 | Circuit board module, circuit board and lamp |
| CN104244563A (en) * | 2013-06-11 | 2014-12-24 | 富葵精密组件(深圳)有限公司 | Circuit board structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114501840A (en) | 2022-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2954760B1 (en) | Fusion bonded liquid crystal polymer circuit structure | |
| US8677612B2 (en) | Method for manufacturing flex-rigid wiring board | |
| US8238109B2 (en) | Flex-rigid wiring board and electronic device | |
| US9055682B2 (en) | Circuit module | |
| CN1323435C (en) | module parts | |
| CN112638063B (en) | Waterproof circuit board and manufacturing method thereof | |
| US10028388B2 (en) | Component-embedded substrate | |
| US11406013B2 (en) | Resin multilayer substrate and electronic device | |
| US20120176751A1 (en) | Electronic component module and manufacturing method therefor | |
| CN101534610A (en) | Embedded capacitor element circuit board and manufacturing method thereof | |
| CN113597085B (en) | Transmission circuit board and manufacturing method thereof | |
| US9730322B2 (en) | Production method of component-embedded substrate, and component-embedded substrate | |
| CN114501840B (en) | Manufacturing method of circuit board assembly and circuit board assembly | |
| US20060032669A1 (en) | Electronic circuit device | |
| CN112514054B (en) | Electronic Control Devices | |
| US20110247871A1 (en) | Multi-layer printed circuit board comprising film and method for fabricating the same | |
| US20190289724A1 (en) | Multilayer circuit board and method of manufacturing the same | |
| CN103545303A (en) | IC package and assembly | |
| KR20200067607A (en) | Printed circuit board | |
| CN110972413A (en) | Composite circuit board and manufacturing method thereof | |
| CN216531888U (en) | Resin multilayer substrate | |
| CN113853069A (en) | Manufacturing method of circuit board intermediate, circuit board and manufacturing method thereof | |
| KR20150059086A (en) | Chip Embedded Board And Method Of Manufacturing The Same | |
| CN114731763A (en) | Embedded circuit board and manufacturing method thereof | |
| CN113597086A (en) | Transmission circuit board and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |