CN114579386A - Temperature regulation test unit of memory module and memory module test device using the same - Google Patents

Abstract

The invention relates to a temperature regulation test unit of a memory module and a memory module test device using the same, the invention comprises: a test board part installed in the test space, divided into a plurality of memory module installation regions, and capable of installing a plurality of memory modules in the plurality of memory module installation regions; a test box part formed in a manner of surrounding the memory module mounting area; a control box part which is configured at the upper part of the test box part, can move up and down and is used for covering the memory module installation area together with the test box part; a drive section; a rotation shaft portion that rotates in accordance with rotation of the drive portion; a pinion gear part rotating with the rotation of the rotation shaft part; a rack gear part installed to move the control box part up and down by receiving a rotational force of the rotational shaft; and a temperature control unit for detecting the internal temperature of the control box unit and setting the temperature, the temperature control unit including a Peltier element.

Description

Temperature regulation test unit for memory module and memory module test device using the above test unit

technical field

The present invention relates to a memory module temperature adjustment test unit and a memory module test device using the test unit. In particular, it relates to a memory module temperature adjustment test unit that can realize temperature control and a memory module test device using the above test unit.

Background technique

Generally, a general server computer uses relatively more memory than a desktop computer or a notebook computer, and mainly uses a memory such as a Registered Dual In-line Memory Module (R-DIMM, Registered Dual In-line Memory Module).

In particular, the above-mentioned server computer is equipped with a memory zone (zone) including a plurality of memory slots for installing a plurality of memories, and a memory zone and a temperature detection element (for example, a thermal diode < Thermal diode>) memory module.

The memory module is controlled by a central processing unit (CPU) installed in the motherboard of the server computer to perform data processing operations of reading, writing or storing data.

Furthermore, as is well known, memory modules recently used in personal computers (PCs) or servers (Servers) are used to process complex and important data, and thus high reliability is required. Therefore, in order to meet the requirements as described above, all active and passive chips including the memory used in the memory module need to be tested in advance by performing a Burn-in (aging) test at a certain high temperature. Troubleshoot the defects and various problems that may occur during the module assembly process.

A temperature control device for performing a memory test for a server computer is disclosed in Republic of Korea Registered Patent No. 10-1940223 (2019.04.11. Gazette, hereinafter referred to as Patent Document 1).

However, in Patent Document 1, when a plurality of memories are tested at the same time, even when the target control temperature value is reached, the positions of the plurality of memories are different from each other, resulting in temperature inconsistency at each position, and further Problems that lead to reduced reliability of test results.

In addition, Patent Document 1 takes a considerable time to change from the preset temperature to the initial temperature before the test, so it is difficult to quickly perform a test applying other conditions, which makes it difficult to perform within the preset time. test question.

prior art literature

Patent Literature

(Patent Document 0001) Korean Registered Patent No. 10-1940223

SUMMARY OF THE INVENTION

The present invention is intended to solve the above-mentioned conventional problems, and an object of the present invention is to provide a memory that can more accurately control temperature by using a plurality of lower side blowing fans by dividing a location where a memory module is installed into a plurality of areas A temperature regulation test unit of a module and a memory module test device using the above test unit.

Another object of the present invention is to provide a temperature display part exposed to the outside that allows the user to quickly and in real time confirm the temperature corresponding to each memory area without the need for a separate display component, so as to quickly A temperature adjustment test unit of a memory module that performs temperature control of each memory area, and a memory module test device using the above test unit.

Another object of the present invention is to provide a temperature adjustment test unit for a memory module that can quickly complete initialization after completing a certain test, that is, rapidly change its temperature and thereby shorten the time until the next test is performed, and use The memory module test device of the above test unit.

In order to achieve the above-mentioned purpose of the present invention, a temperature adjustment test unit for a memory module according to an embodiment of the present invention includes: a test board part, which is installed in the test space, and is divided into a plurality of independently used for installing memory a memory module installation area of the module; a test box part, arranged on the upper part of the above-mentioned test board part, and forming a test space by selectively surrounding any one or more of the above-mentioned plurality of memory module installation areas; a storage part for the above-mentioned test The board part and the test box part store the process and result of testing the memory module in the test space; and the control part is used to control the test board part, the test box part and the storage part; wherein , the above-mentioned test box part includes: a support plate part, which is formed with a through hole through which the plurality of memory modules installed in the above-mentioned test plate part can pass through, and is equipped on the upper part of the above-mentioned test plate part; The support plate portion covers the plurality of memory modules penetrating through the through holes of the support plate portion together; and the Peltier portion includes a thermoelectric element that performs heat exchange in order to adjust the temperature of the test space; wherein the above The control unit may individually control the temperatures of the plurality of memory module mounting regions according to the user's selection.

In the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied, the cover part may include: a control box part, which is arranged on the upper part of the test box part and can move up and down, and is used together with the test box part Covering the above-mentioned memory module installation area; a driving part for receiving an external power supply and rotating; a rotating shaft part, being installed on the above-mentioned driving part and rotating with the rotation of the above-mentioned driving part; a pinion part for supplying The rotating shaft portion penetrates through and rotates with the rotation of the rotating shaft portion; the rack and pinion portion is mounted so as to move the control box portion up and down by receiving the rotational force of the rotating shaft; and the temperature control portion, It is used to detect and set the internal temperature of the above-mentioned control box, and includes a Peltier element.

In the temperature adjustment test unit for a memory module to which one embodiment of the present invention is applied, the above-mentioned test board portion may further include: a memory slot for installing the above-mentioned memory module; and a locking member for preventing installation in the above-mentioned memory module The memory module in the socket is disengaged.

In the temperature adjustment test unit of a memory module to which one embodiment of the present invention is applied, the test box portion may further include: a heat sink portion for absorbing or dissipating heat inside the test space.

In the temperature adjustment test unit for a memory module to which one embodiment of the present invention is applied, the test box portion may further include: a blower fan portion for causing the test by forming a flow of wind downward from the upper portion of the memory module mounting area. The air inside the space circulates and thereby induces temperature transitions inside the test space as described above.

In the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied, the test box portion may further include: a cooling portion disposed on the upper portion of the Peltier portion and allowing cooling water to move.

In the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied, the cooling part may further include: a cooling water inflow inlet, through which cooling water can flow in from the outside; a cooling pipe, one end of which is communicated with the cooling water inflow inlet, to The U-shape is formed by bending multiple times; and the cooling water discharge port communicates with the other end of the cooling pipe, and is used for discharging the cooling water inside the cooling pipe.

The temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied may further include: a cooling water measuring device for measuring the flow of the cooling water supplied to the cooling unit; and a cooling water A filter for filtering out foreign matter contained in the cooling water supplied to the cooling unit.

In the temperature adjustment test unit of the memory module to which the embodiment of the present invention is applied, the control unit may select the test condition that was executed last time from the storage unit without changing the test condition by the user, and perform the test. conditions are set.

In the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied, the control unit may select a test condition required by the user from a plurality of test conditions stored in the storage unit and set the test condition .

In the temperature adjustment test unit for a memory module according to an embodiment of the present invention, the above-mentioned test conditions required by the user may be test conditions pre-set according to the expected place or environment where the model of the corresponding memory module is actually installed .

In the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied, the storage unit may store conditions that change during the execution of the test of the memory module.

In the temperature adjustment test unit for a memory module to which an embodiment of the present invention is applied, the control unit may stop when an abnormality or error occurs in the memory module during the process of setting any test conditions and testing the memory module. The ongoing test records the test conditions or the change process of the test conditions until the abnormality or error occurs in the storage unit, and then the memory module in which the abnormality or error occurs is tested again under the same test conditions.

In the temperature adjustment test unit for a memory module to which an embodiment of the present invention is applied, the control unit may stop when an abnormality or error occurs in the memory module during the process of setting any test conditions and testing the memory module. In the ongoing test, the test conditions until the occurrence of the above-mentioned abnormality or error or the change process of the test conditions are recorded in the above-mentioned storage unit, and then when the corresponding model of the memory module in which the above-mentioned abnormality or error occurs is tested, you can The test is performed after resetting the test conditions or the change process of the test conditions until the occurrence of the above abnormality or error.

In order to achieve the purpose of the present invention as described above, a memory module testing device using a temperature adjustment test unit of a memory module to which one embodiment of the present invention is applied may include: a housing unit, which is internally equipped with a memory module for testing the memory module. The above-mentioned test space; a temperature-adjusted test unit, disposed inside the above-mentioned housing unit, comprising a test board portion disposed in the above-mentioned test space, a test board portion disposed on the upper portion of the above-mentioned test board portion and formed in a manner to surround the above-mentioned memory module installation area A box portion, a storage portion for storing the process and results of testing the memory module in the test space by the test board portion and the test box portion, and the storage portion for the test board portion and the test box portion and the storage. a control part that controls the memory module; a cooling water supply unit, arranged on one side of the above-mentioned housing unit, reduces the rising temperature by supplying cooling water to the above-mentioned test space or the above-mentioned test unit; an air supply unit , is arranged on one side of the above-mentioned housing unit, and supplies air for the temperature rise and fall of the above-mentioned test space or the above-mentioned test unit; the alarm unit is arranged on one side of the above-mentioned housing unit to notify the outside through sound or visual means in the above-mentioned test space. A state of being tested; a universal serial bus (USB) port unit is arranged on one side of the above-mentioned housing unit, and is electrically connected to realize data transmission with external electronic equipment; a display unit is arranged on one side of the above-mentioned housing unit, in order to It is convenient for the user to visually identify the test state of the memory module or the internal state of the shell of the test unit and display it in a visual manner; One side of the housing unit is used to control the above-mentioned multiple test units.

In the memory module test device using the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied, the cooling water supply unit may further include: a cooling water measuring device installed in the housing unit and configured to measure all the cooling water. The flow of the supplied cooling water is measured; and a cooling water filter is attached to the above-mentioned housing unit, and is used for filtering out foreign matter when the cooling water is supplied.

In the memory module testing device using the temperature regulation testing unit of the memory module according to an embodiment of the present invention, the above-mentioned alarm unit may include: an emergency stop button, which stops all functions when the user presses it in an emergency situation. An emergency off (EMO) switch consists of an alarm setting button for the user to set the alarm; and an alarm reset button for resetting the alarm set by the user.

In the memory module testing device using the temperature adjustment test unit of the memory module according to an embodiment of the present invention, the test space may further include: a shelf for supporting the test unit on the lower side of the test unit , which can be slid to the outside of the above housing according to the user's choice.

The present invention divides the location for installing the memory module into a plurality of areas and can individually adjust the temperature of each area, so that a variety of tests under different conditions can be performed at the same time.

The present invention uses Peltier elements in each memory module mounting area, so that temperature control can be more accurately achieved.

After completing a certain test, the present invention quickly completes initialization, that is, changes its temperature rapidly and thereby shortens the time until the next test is performed, so that more testing opportunities can be obtained within a preset period, so as to pass the test. Improve the test speed to achieve fast testing.

Description of drawings

FIG. 1 is a schematic perspective view of a memory module test apparatus using a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

FIG. 2 is a front view of FIG. 1 .

3 is a front view of a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied.

4 is an internal perspective view of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applied.

FIG. 5 is a schematic diagram illustrating a sliding working state of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

FIG. 6 is a schematic diagram illustrating a working state of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

FIG. 7 is a schematic diagram illustrating a frontal state when the control box in FIG. 6 is slid up and down.

FIG. 8 is a schematic diagram illustrating a test board of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

9 is a schematic diagram illustrating a state in which test items are mounted on a test board of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

10 is a perspective view of a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied.

11 is a rear view of a cover portion of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

12 is a side view illustrating the inside of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

13 is a bottom perspective view of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

14 is a plan view illustrating a cooling portion of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

Description of reference numerals

100: Housing unit

200: Temperature regulation test unit

210: Test Board Department

211: Memory module installation area

212: 1st memory module installation area

212a: memory slot

212b: Locking parts

213: 2nd memory module installation area

213a: memory slot

213b: Locking parts

214: 3rd memory module installation area

214a: memory slot

214b: Locking parts

220: Test Box Department

221: Support plate part

221a: Support rod

221b: Through hole

222: Radiator part

223: Blower section

224: Cooling Section

224a: Cooling water inlet

224b: Cooling pipe

224c: Cooling water discharge port

224d: Cooling water meter

224e: Cooling water filter

225: Temperature display part

225a: 1st memory temperature display part

225b: 2nd memory temperature display part

225c: 3rd memory temperature display

226: Lower side blower fan

227: Ministry of Peltier

230: Control Box Department

240: Drive Department

250: Rotary shaft

260: Pinion Department

270: Rack and pinion part

280: Temperature Control Department

290: Shelves

291: Handle

300: Cooling water supply unit

400: Gas Supply Unit

500: Alarm Unit

510: Emergency stop button

520: Alarm setting unit

530: Alarm reset unit

600: Universal Serial Bus (USB) port unit

700: Display unit

800: Keyboard Monitor Mouse (KVM) Switching Unit

Detailed ways

Next, some embodiments to which the present invention is applied will be described in detail with reference to the exemplary drawings. It should be noted that, in the process of allocating reference symbols to the constituent elements of the respective drawings, even if they are illustrated in different drawings, the same constituent elements are assigned the same reference symbols as much as possible. Further, in the description of the embodiments to which the present invention is applied, if it is determined that specific descriptions of related well-known configurations or functions may obstruct the understanding of the embodiments to which the present invention is applied, detailed descriptions thereof will be omitted.

In addition, in the description of the constituent elements of the embodiment to which the present invention is applied, terms such as 1st, 2nd, A, B, (a), and (b) may be used. However, the above-mentioned terms are only used to distinguish the above-mentioned constituent elements from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by the above-mentioned terms. When a constituent element is described as "connected", "combined" or "contacted" with other constituent elements, the aforementioned constituent element may be directly connected or in contact with the aforementioned other constituent element, but it should be understood that each constituent element may also be in contact with each other. There are other constituent elements "connected", "joined" or "contacted".

Next, referring to the accompanying drawings, the temperature adjustment test unit of the memory module to which one embodiment of the present invention is applied will be described.

During the description of an embodiment applicable to the present invention, the contents related to the memory module testing unit will be included in the description of the memory module testing apparatus.

1 is a schematic perspective view of a memory module testing device using a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, FIG. 2 is a front view of FIG. 1 , and FIG. 3 is an embodiment of the present invention applied A front view of a temperature regulation test unit for a memory module, FIG. 4 is an internal perspective view of a temperature regulation test unit for a memory module to which an embodiment of the present invention is applied, and FIG. A schematic diagram illustrating the sliding working state of the adjustment test unit, FIG. 6 is a schematic diagram illustrating the working state of the temperature adjustment testing unit of the memory module to which one embodiment of the present invention is applied, and FIG. 7 is a schematic diagram illustrating the control in FIG. 6 . A schematic diagram illustrating the frontal state when the box slides up and down, FIG. 8 is a schematic diagram illustrating a test board of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, and FIG. A schematic diagram illustrating a state in which a test item is installed on a test board of a temperature adjustment test unit of a memory module according to an embodiment.

Referring to FIG. 1 to FIG. 2 , a memory module testing device using a temperature adjustment test unit of a memory module according to an embodiment of the present invention may include a housing unit 100 , a temperature adjustment test unit 200 , a cooling water supply unit 300 , and a gas supply unit 400 , an alarm unit 500, a universal serial bus (USB) port unit 600, a display unit 700, and a keyboard monitor mouse (KVM) switching unit.

In an embodiment to which the present invention is applied, a Registered Dual In-line Memory Module (R-DIMM) used in a server-class personal computer (PC) can be used as a target for temperature control. Simultaneously perform reliability testing.

The housing unit 100 is in the shape of a hexahedron, and may be equipped with a test space for testing the memory module inside.

Inside the above-mentioned test space, the temperature adjustment test unit 200 described later may be configured, and the temperature adjustment test unit 200 may be exposed on the front side.

In the drawings, the case where six test spaces and temperature adjustment test units 200 are respectively provided is illustrated, but this is only an example, and the number is not particularly limited, but can be determined according to the intention of the manufacturer Comes in different quantities.

The temperature adjustment test unit 200 may be arranged inside the housing unit 100 , that is, in the above-mentioned test space.

3 to 4 , the temperature adjustment test unit 200 may include a test board part 210, a test box part 220, a control box part 230, a driving part 240, a rotating shaft part 250, a pinion part 260, a rack and pinion part 270, and a temperature control unit 280 .

The temperature adjustment test unit 200 may include a test board part 210 , and may perform a reliability test by disposing a memory module on the upper part of the test board part 210 . In this case, the test board portion 210 is preferably an ethylene/vinyl acetate copolymer board (EvaBoard).

Referring to FIG. 5 , at least three memory module mounting areas 212 , 213 and 214 may be formed in the test board portion 210 . The memory module mounting area 211 can be divided into first to third memory module mounting areas 212, 213, and 214, and the first to third memory module mounting areas 212, 213, and 214 may be provided with a plurality of memory modules, respectively. Memory slots 212a, 213a, 214a. As shown in FIG. 5 , three memory slots 212a and 214a may be provided in the first and third memory module mounting areas 212 and 214, and six memory sockets 213a may be provided in the second memory module mounting area 213a.

Referring to FIGS. 4 and 6 , the locking members 212b, 213b, and 214b can fix the memory modules by being disposed in the respective memory module mounting areas 212, 213, and 214 of the test board portion 210. As shown in FIG. The locking members 212b, 213b, and 214b can prevent the memory modules from being detached by being disposed at the ends in the longitudinal direction of each slot.

Referring back to FIG. 4 , the lower blower fan 226 may be disposed between the first and second memory module installation areas 212 and 213 and between the second and third memory module installation areas 213 and 214 . The lower side blower fan 226 may inject the air flowing in from the air supply unit 400 described later.

Referring to FIG. 6 , the test box part 220 may be disposed on the upper part of the test board part 210 . The test box part 220 may be formed to surround the memory module mounting areas 212 , 213 , and 214 , respectively.

The temperature display unit 225 may be arranged in a part of the test box part 220, that is, a part of the frame (no reference sign).

As the temperature display portion 225, the first to third temperature display portions 225a, 225b, and 225c corresponding to the positions of the first to third memory module mounting regions 212, 213, and 214 may be arranged.

As shown in FIG. 3, the temperature display part 225 may be arranged on the upper side of the test board part 210, but may be installed in various positions as a manufacturer's choice. However, in consideration of the visibility of the user, it is preferable to mount them in positions corresponding to the first to third memory module mounting areas 212 , 213 , and 214 , respectively.

Referring back to FIGS. 3 and 4 , the temperature adjustment test unit 200 may include a control box portion 230 . The control box part 230 may be arranged on the upper part of the test box part 220 .

The control box unit 230 may be provided so as to correspond to the respective memory module mounting areas 212 , 213 , and 214 . That is, when a certain test board unit 210 is provided with three memory module mounting areas, three control box units 230 may also be provided in a manner corresponding to the size of the memory module mounting area. Thereby, when the number of memory modules to be tested is relatively small, if there is a memory module installation area where no memory modules are installed, it is possible to install memory modules in only a part of the memory module installation area while the above-mentioned area is vacant. The test is performed only with the control box section 230 corresponding thereto. In the drawings, the case where the control box unit 230 covers all of the three memory module mounting areas 212 , 213 , and 214 is illustrated, but this is only an example, and the present invention is not limited to this. It is understood that the control box unit 230 corresponding to each of the memory module mounting areas 212 , 213 , and 214 is provided.

The control box part 230 can be moved up and down by the interlocking of the drive part 240 , the rotation shaft part 250 , the pinion gear 260 , and the rack and pinion part 270 , which will be described later. When the control box part 230 rises, the memory module installation area 221 will be exposed to the outside and the upper part is open, and when the control box part 230 is lowered, the memory module installation area 221 can be closed or covered with the test box part 220 together with the test box part 220 .

During the description of an embodiment to which the present invention is applied, the detailed information related to the test board part 210 and the test box part 220 of the temperature adjustment test unit 200 will be described in the following content.

The driving part 240 may receive power supply and perform rotational motion.

One end of the rotating shaft part 250 may receive the transmitted rotational motion of the driving part 240 by being connected to the driving part 240 . That is, the rotation shaft part 250 can rotate with the rotation of the driving part 240 .

A pinion gear portion 260 may be attached to the rotating shaft portion 250 . In other words, the rotation shaft portion 250 may pass through the pinion gear portion 260 and rotate with the rotation of the rotation shaft portion 250 .

The other end of the rotating shaft part 250 may be connected to the control box part 230 . At this time, the rack and pinion portion 270 may be attached to the control box portion 230 . The rack and pinion portion 270 can convert the rotational motion of the driving portion 240 , the rotating shaft portion 250 , and the pinion portion 260 into linear motion in the vertical direction. That is, the longitudinal direction of the rack and pinion portion 270 matches the vertical direction of the control box portion 230 , so that the control box portion 230 can be moved up and down by engaging with the pinion portion 260 .

A temperature control part 280 may be provided on one side of the control box part 230 . The temperature control unit 280 can check the internal temperature of the control box unit 230 , that is, the internal temperature of the memory module mounting area 211 , and set the temperature according to the user's intention. The temperature control part 280 may include a Peltier element. For reference, although not described above, it should be understood that any one or more of the test board portion 210 , the test box portion 220 , and the control box portion 230 are provided with memory module mounting regions 212 , 213 , A temperature sensor (not shown) that detects the temperature of 214 . In addition, the temperature control unit 280 may inject air using the lower side blowing fan 222 until the temperature of the memory module mounting area 211 reaches a temperature set according to the user's intention.

At this time, the air injected by the lower side blowing fan 22 may be higher or lower than normal temperature (25°C). For example, when the user needs to lower the temperature of the memory module installation areas 212 , 213 , and 214 , the user can inject air at a lower temperature than the above-mentioned normal temperature or use the cooling water described later. Air at a temperature higher than the above-mentioned normal temperature can be injected.

For reference, the temperature control part 280 may vary the temperature of the memory module mounting areas 212, 213, 214 within a range of 0 to 90°C. In addition, in an embodiment to which the present invention is applied, the above-mentioned normal temperature may be heated to 85° C. within 5 minutes by the above-mentioned method, and the above-mentioned normal temperature may be cooled to 5° C. within 10 minutes.

Furthermore, the temperature control unit 280 may check the outflow of the supplied cooling water.

The thermoregulation test unit 200 may also include a shelf 290 .

As shown in FIG. 1 and FIG. 2 , in an embodiment of the present invention, six of the above-mentioned test spaces can be equipped with six temperature adjustment test units 200 . Each temperature adjustment test unit 200 can be The inside of the housing unit 100 slides to the outside. The shelf may support the temperature adjustment test unit 200 at the lower side of the temperature adjustment test unit 200 in the above-mentioned test space. At this time, a handle 291 may be provided on the shelf 290 , and the user can pull out the temperature adjustment test unit 200 from the housing unit 100 by holding and pulling the handle 291 .

Referring to FIGS. 7 and 8 , the user can install the memory modules into the memory slots 212a, 213a, 214a after holding the handle 291 and pull out the shelf 290 to the outside and fix it by using the locking member 224, thereby preventing it detachment occurs. In addition, after the user holds the handle 291 and pushes the shelf 290 into the housing unit 100, when the user presses a start button (not shown) in order to start the test, the control box portion 230 descends and is connected to the housing unit 100. The test box parts 220 are overlapped to form a three-dimensional space in the memory module mounting area 211 and cover it. Next, the temperature control part 280 may adjust the temperature of the memory module installation areas 212, 213, 214 and perform other tests.

A memory module testing device using a temperature adjustment testing unit of a memory module applicable to an embodiment of the present invention may include a cooling water supply unit 300 .

The cooling water supply unit 300 may be provided on one side of the housing unit 100 . The purpose of the cooling water supply (Power Supply Cooling Water, PCW) is to cool the heat generated during the memory module test performed by the temperature adjustment test unit 200 . That is, the rising temperature in the above-described test space or the temperature-regulated test unit 200 can be lowered by supplying cooling water.

The air supply unit 400 may be provided on one side of the housing unit 100 . The air supply unit 400 is used to raise or lower the temperature of the memory module installation area 211 by supplying air to the above-mentioned test space or test unit.

The alarm unit 500 may be provided on one side of the housing unit 100 . The state of the temperature adjustment test unit 200 testing the memory module in the memory module installation area 211 may be notified to the outside through sound or visual means.

The alarm unit 500 may include an emergency stop button, an alarm setting button 520 and an alarm reset button 530 .

The emergency stop button 510 can stop all functions when pressed by the user in a critical situation that occurs during memory module testing. The emergency stop button 510 is preferably an emergency OFF (EMO, Emergency OFF) switch.

The alarm setting button 520 can be pressed by the user to select a condition that the user needs to confirm and set a corresponding alarm.

The alarm reset button 530 can reset the alarm preset by the user by pressing the user.

Although not shown, the alarm unit 500 may be equipped with a speaker (not shown) or an indicator light (not shown), etc., so that sounds related to the corresponding situation can be played through the speaker or various lights can be emitted through the indicator light. That is, the alarm unit 500 can enable the user to recognize the test status of the memory module through auditory or visual means.

The universal serial bus (USB) port unit 600 is arranged on one side of the housing unit 100 and can be connected to external electronic equipment formed with a universal serial bus (USB) terminal electrically connected by being inserted into the universal serial bus (USB) port (not shown) for data transfer.

The display unit 700 may be disposed on one side of the housing unit 100 . The display unit 700 may be visually displayed for the user to visually recognize the memory module test condition of the temperature adjustment test unit 200 or the internal condition of the housing unit 100 . In addition, the user can only confirm the test result of the memory module with the naked eye by means of the display unit 700, and display the statistical information in the form of a graph.

In addition, the display unit 700 may also be constituted by a touch screen.

The keyboard monitor mouse (KVM) switching unit 800 may be disposed on one side of the housing unit 100 . The keyboard monitor mouse (KVM) refers to the keyboard (Keyboard), the monitor (Video Monitor) and the mouse (Mouse). The keyboard monitor mouse (KVM) switch can communicate with external electronic devices through the universal serial bus (USB) port unit 600 transmit and receive.

10 is a perspective view of a temperature regulation test unit of a memory module to which an embodiment of the present invention is applied, FIG. 11 is a rear view of a cover portion of the temperature regulation test unit of a memory module to which an embodiment of the present invention is applied, and FIG. A side view illustrating the interior of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, FIG. 13 is a bottom perspective view of the temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied, and FIG. 14 is a A plan view illustrating a cooling portion of a temperature adjustment test unit of a memory module to which an embodiment of the present invention is applied.

10 to 14 , a temperature adjustment test unit for a memory module according to an embodiment of the present invention may include a test board part 210 and a test box part 220 , a storage part (not shown) and a control part (not shown).

The test board part 210 may be installed in the test space. The test board portion 210 may be divided into a plurality of memory module mounting areas 212 , 213 , and 214 . A plurality of memory modules can be installed in the plurality of memory module installation areas 212 , 213 , and 214 .

At this time, the memory slots 212a, 213a, and 214a and the locking members 212b, 213b, and 214b may be arranged in the plurality of memory module mounting areas 212, 213, and 214. Memory modules can be installed in the memory slots 212a, 213a, 214a. The locking parts 212b, 213b, 214b can prevent the memory modules installed in the memory slots 212a, 213a, 214a from being disengaged.

The test box part 220 may be arranged on the upper part of the test board part 210 . The test box part 220 may form a test space by surrounding the plurality of memory module mounting areas 212 , 213 , and 214 , respectively.

The test box part 220 may include a support plate part 221 and a cover part (no reference sign) and a Peltier part 227 .

The support plate portion 221 may be arranged on the upper portion of the test plate portion 210 . In the support plate portion 221 , memory module mounting regions 212 , 213 , and 214 may be formed so that the test board portion 210 , that is, the memory modules mounted in the memory slots 212 a , 213 a , and 214 a and the locking members 212 b , 213 b , and 214 b pass through. The shape and width of the corresponding through holes 221b. Further, a support rod 221 a is attached to the lower side of the support plate portion 221 and is supported by the test plate portion 210 .

The above-mentioned covering portion may cover a plurality of memory modules penetrating through the supporting plate portion 221 together with the supporting plate portion 221 .

The test box portion 220 may also include a heat sink portion 222 .

The heat sink portion 222 is disposed so as to face the memory modules mounted in the memory module mounting regions 212 , 213 , and 214 , and can absorb or dissipate the heat inside the test space.

The test box part 220 may further include a blower fan part 223 . The blower fan unit 223 has a different structure from the lower side blower fan 226 described above, and is mounted on the lower side of the heat sink unit 222 to blow air to the memory modules mounted in the memory module mounting areas 212 , 213 , and 214 . At this time, the blown air will circulate between the support plate portion 221 and the cover portion, that is, inside the test space, thereby reducing the temperature of the memory module. Next, the air whose temperature has risen will rise along the wall surface of the covering portion and be cooled by coming into contact with the radiator portion 222, and the radiator portion 222 can receive the heat transferred from the air.

That is, the blower fan unit 223 can create a flow of wind downward from the upper parts of the memory module mounting areas 212 , 213 , and 214 to circulate the air in the test space, thereby inducing temperature conversion in the test space.

The test box portion 220 may also include a cooling portion 224 . The cooling part 224 may be located on the upper part of the radiator part 222 , especially, may be located on the upper part of the Peltier part 227 described later. The cooling part 224 can move the cooling water supplied from the cooling water supply unit 300 so as to cool the temperature inside the test space.

The cooling part 224 may include a cooling water inflow port 224a and a cooling pipe 224b, and a cooling water discharge port 224c.

The cooling water may flow in from the cooling water supply unit 300, which is outside the cooling water inflow port 224a.

One end of the cooling pipe 224b may communicate with the cooling water inflow port 224a. In addition, the cooling pipe 224b can be formed by bending multiple times in a U-shape, whereby the cooling efficiency thereof can be further improved by maximizing the contact area with the hot gas in the minimum space.

The cooling water discharge port 224c may be communicated with the other end of the cooling pipe 224b for discharging the cooling water inside the cooling pipe 224b.

Further, the cooling unit 224 may further include a cooling water measuring device 224d and a cooling water filter 224e. Referring to FIG. 1 , the cooling water measuring device 224d and the cooling water filter 224e may be provided inside the housing unit 100 .

The cooling water measuring device 224d can measure the flow of the cooling water supplied from the cooling water supply unit 300 to the cooling unit 224 . For example, the cooling water measuring device 224d can measure the flow rate per unit time.

The cooling water filter 224e can filter foreign matter contained in the cooling water before the cooling water supplied to the cooling part 224 reaches the cooling water inflow inlet 224a.

The Peltier portion 227 may be arranged between the radiator portion 222 and the cooling portion 224 . The Peltier portion 227 can adjust the temperature of the above-mentioned test space using a thermoelectric element. In an embodiment of the present invention, the memory module mounting area 211 of any one of the test board parts 210 can be divided into 3 areas and thereby divided into 3 test spaces. Thereby, the memory modules arranged in each test space can be tested under different conditions, and the temperature of each memory module installation area 212 , 213 , 214 can be selectively controlled according to the user's choice.

An embodiment to which the present invention is applied may include a storage unit (not shown) and a control unit (not shown).

The storage unit may store the process and result of testing the memory module in the test space by the test board unit 210 and the test box unit 220 as data. That is, the above-mentioned storage unit may store all of the test procedures and results performed multiple times as data, respectively. In addition, the storage unit may store conditions that change during the execution of the test of the memory module.

The control unit can control the test board unit 210, the test box unit 220, and the storage unit. In addition, the above-mentioned control part may also be used for the control box part 230 , the driving part 240 , and the rotating shaft part in the memory module test device to which the temperature adjustment test unit using a memory module according to an embodiment of the present invention described above is applied. 250 , the pinion part 260 , the rack and pinion part 270 , and the temperature control part 280 are controlled.

The temperature adjustment test unit of the memory module applicable to one embodiment of the present invention can set test conditions such as temperature, time, pressure, etc. in advance before testing the memory module.

However, when the test is repeatedly executed because the test conditions are the same, or when the test conditions are changed because the user does not set individual test conditions, the above-mentioned control unit may directly select the test conditions executed last time and Set the test conditions to be executed.

In addition, the control unit may select a test condition required by the user from among a plurality of test conditions stored in the storage unit, and may set the test condition. That is, the storage unit may store the data values of the test conditions under different conditions in advance, and when the user selects the required corresponding test conditions, the control unit may perform the required test conditions according to the selected test conditions. Make settings. For example, with respect to the memory module of type B delivered by company A, when the user selects the test condition C, the test conditions can be set and the memory module can be measured. At this time, the test conditions required by the user, that is, the test conditions for testing the memory modules of the B model delivered by the A company, may be performed in advance according to the expected location or environment where the models of the corresponding memory modules are actually installed. set test conditions. That is, when the expected location or environment where the B-type memory module is installed is at D temperature, the above-mentioned C test conditions can test the above-mentioned B-type memory module under the premise of reflecting the D temperature.

In addition, even if the test conditions stored in the storage unit are changed during the test of the memory module, the control unit may adjust the test conditions. For example, when the test condition needs to be changed from the D temperature to the E temperature during the test, the above-mentioned control part may change its temperature during the execution of the test.

That is, the test conditions to be executed are respectively stored in the storage unit in the form of scripts, and the control unit can read and set the stored test conditions according to the user's selection.

In addition, the control unit may stop the ongoing test when an abnormality or error occurs in the memory module in the process of setting any one of the test conditions to test the memory module.

In addition, the control unit may record in the storage unit the test conditions until the abnormality or error occurs, or the change process of the test conditions.

Next, the control unit may re-test the memory module in which the abnormality or error has occurred under the same test conditions.

In addition, in the case of testing the corresponding model of the memory module in which the abnormality or error occurs, the test conditions or the change process of the test conditions until the abnormality or error occurs may be reset and the test can be performed.

The content described above is only an embodiment for realizing the temperature adjustment test unit of the memory module to which the present invention is applied and the memory module test device using the above test unit, and the present invention is not limited to the above-mentioned embodiment. The technical spirit of the present invention should be understood to include various modified embodiments made by those having ordinary knowledge in the technical field to which the present invention pertains without departing from the spirit of the present invention claimed in the appended claims.

Claims (18)

1. A temperature regulation test unit of a memory module, characterized in that, comprising: The test board part is installed in the test space, and is divided into a plurality of memory module installation areas independently used for installing memory modules; a test box part, disposed on the upper part of the test board part, and forming a test space by selectively surrounding any one or more of the plurality of memory module mounting areas; a storage unit for storing the process and result of testing the memory module by the test board unit and the test box unit in the test space; and, a control part for controlling the test board part, the test box part and the storage part; Among them, the above-mentioned test box part includes: The support plate portion is formed with a through hole through which the plurality of memory modules installed in the test plate portion can pass through, and is arranged on the upper portion of the test plate portion; a covering portion for covering, together with the support plate portion, the plurality of memory modules penetrating through the through holes of the support plate portion; and, a Peltier part, including a thermoelectric element for heat exchange in order to adjust the temperature of the test space; The control unit controls the temperatures of the plurality of memory module mounting regions respectively according to the user's selection. 2. The temperature regulation test unit of the memory module according to claim 1, wherein: The above-mentioned covering part, including: The control box part is arranged on the upper part of the test box part and can move up and down, and is used to cover the memory module installation area together with the test box part; The drive part is used to receive external power supply and rotate; a rotating shaft part, which is mounted on the driving part and rotates with the rotation of the driving part; a pinion gear part for passing through the rotating shaft part and rotating with the rotation of the rotating shaft part; a rack and pinion portion mounted in such a manner that the control box portion moves up and down by receiving the rotational force of the rotating shaft; and, The temperature control unit for detecting the internal temperature of the control box unit and setting the temperature includes a Peltier element. 3. The temperature regulation test unit of memory module according to claim 1, is characterized in that: The above-mentioned test board part also includes: memory sockets for the aforementioned memory modules; and, The locking part is used to prevent the memory module installed in the above-mentioned memory slot from being disengaged. 4. The temperature regulation test unit of the memory module according to claim 1, is characterized in that: The above-mentioned test box section also includes: The heat sink part is used for absorbing or dissipating the heat inside the test space. 5. The temperature regulation test unit of the memory module according to claim 1, wherein: The above-mentioned test box section also includes: The blower fan unit circulates the air in the test space by creating a flow of wind downward from the upper part of the memory module mounting area, thereby inducing temperature conversion in the test space. 6. The temperature regulation test unit of the memory module according to claim 1, wherein: The above-mentioned test box section also includes: The cooling part is arranged on the upper part of the Peltier part so as to allow movement of cooling water. 7. The temperature regulation test unit of the memory module according to claim 6, wherein: The above cooling part also includes: Cooling water inlet for cooling water to flow in from the outside; A cooling pipe, one end of which is communicated with the above-mentioned cooling water inlet, is formed by bending in a U shape for many times; and, The cooling water discharge port communicates with the other end of the cooling pipe, and is used to discharge the cooling water inside the cooling pipe. 8. The temperature regulation test unit of the memory module according to claim 6, characterized in that, further comprising: a cooling water meter for measuring the flow of cooling water supplied to the cooling unit; and, A cooling water filter for filtering out foreign matter contained in the cooling water supplied to the cooling unit. 9. The temperature regulation test unit of the memory module according to claim 1, wherein: When the user does not change the test conditions, the control unit selects the test conditions executed last time from the storage unit and sets the test conditions. 10. The temperature regulation test unit of the memory module according to claim 1, wherein: The control unit selects a test condition required by the user from among a plurality of test conditions stored in the storage unit, and sets the test condition. 11. The temperature regulation test unit of the memory module according to claim 10, wherein: The above-mentioned test conditions required by the user are the test conditions set in advance according to the expected place or environment where the model of the corresponding memory module is actually installed. 12. The temperature regulation test unit of the memory module according to claim 1, wherein: The storage unit stores conditions that change during execution of the test of the memory module. 13. The temperature regulation test unit of the memory module according to claim 1, wherein: The above-mentioned control unit, when setting any one of the test conditions and testing the above-mentioned memory module, when an abnormality or error of the above-mentioned memory module occurs, the ongoing test is terminated, and the test condition or test condition until the above-mentioned abnormality or error occurs. The change process is recorded in the above-mentioned storage unit, and then the above-mentioned abnormal or faulty memory module is tested again under the same test conditions. 14. The temperature regulation test unit of the memory module according to claim 1, wherein: The above-mentioned control unit, when setting any one of the test conditions and testing the above-mentioned memory module, when an abnormality or error of the above-mentioned memory module occurs, the ongoing test is terminated, and the test condition or test condition until the above-mentioned abnormality or error occurs. The change process is recorded in the storage unit, and when the model corresponding to the memory module in which the abnormality or error occurs is tested, the test conditions until the abnormality or error occurs or the change process of the test conditions is reset. carry out testing. 15. A memory module testing device, comprising: a housing unit, internally equipped with the above-mentioned test space for testing the memory module; The temperature adjustment test unit is arranged inside the housing unit, and includes a test board part arranged in the test space, a test box part arranged on the upper part of the test board part and formed so as to surround the memory module mounting area, A storage unit for storing the process and results of testing the memory module in the test space by the test board section and the test box section, and a storage section for controlling the test board section, the test box section, and the storage section. The control part is used to test the memory module; a cooling water supply unit, disposed on one side of the housing unit, and reducing the rising temperature by supplying cooling water to the test space or the test unit; an air supply unit, arranged on one side of the housing unit, to supply air for the temperature rise and fall of the test space or the test unit; An alarm unit, arranged on one side of the above-mentioned housing unit, notifies the outside of the test status in the above-mentioned test space through sound or visual means; A universal serial bus (USB) port unit, which is arranged on one side of the above-mentioned housing unit, and is electrically connected to realize data transmission with external electronic equipment; a display unit, arranged on one side of the housing unit, to visually display the test status of the memory module of the test unit or the internal status of the housing for the user to visually recognize; and, A keyboard, monitor, and mouse (KVM (Keyboard, Video Monitor, Mouse)) switching unit is disposed on one side of the above-mentioned housing unit, and is used to control the above-mentioned multiple test units. 16. The memory module testing device according to claim 15, wherein: The above cooling water supply unit also includes: A cooling water measuring device attached to the above-mentioned housing unit for measuring the flow of the supplied cooling water; and, The cooling water filter is installed in the above-mentioned housing unit, and is used to filter out foreign matter when cooling water is supplied. 17. The memory module testing device according to claim 15, wherein: The above alarm unit, including: Emergency stop button, consisting of an emergency off (EMO) switch that stops all functions when pressed by the user in a critical situation; an alarm setting button for the user to set the alarm; and, The alarm reset button is used to reset the alarm set by the user. 18. The memory module testing device according to claim 15, wherein: The test space further includes: a shelf for supporting the test unit on the lower side of the test unit, which can be slid to the outside of the casing according to the user's choice.

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