CN114615594A - Integrated circuit assembly and electronic device - Google Patents

Abstract

The present application discloses an integrated circuit assembly and an electronic device, wherein the integrated circuit assembly includes: a first circuit board with at least one recess provided on the first circuit board; and at least one second circuit board covered with at least one recess. There is a second circuit board; at least one first microphone assembly, the first microphone assembly is located in the recess, the first microphone assembly includes: a first audio processing chip, arranged on the second circuit board; a first integrated circuit chip, arranged in the first On the second circuit board, the first integrated circuit chip is connected with the first audio processing chip.

Description

Integrated Circuit Components and Electronic Devices

technical field

The present application belongs to the technical field of communication equipment, and specifically relates to an integrated circuit assembly and an electronic device.

Background technique

In the related art, the microphone device in the wireless stereo noise-cancelling earphone is relatively large, occupies a large layout space of the whole machine, affects the layout of various components in the earphone, and is not conducive to the miniaturized design of the earphone. The volume of the earphone is relatively large, so it is impossible to set more electrical components with other functions in the earphone, which affects the diversity of earphone functions.

SUMMARY OF THE INVENTION

The purpose of the present application is to provide an integrated circuit assembly and an electronic device, at least to solve the problem that the microphone occupies a large layout space of the whole machine and affects the multifunctional layout of the earphone.

In order to solve the above technical problems, this application is implemented as follows:

In a first aspect, the present application proposes an integrated circuit assembly, comprising:

a first circuit board, the first circuit board is provided with at least one recess;

at least one second circuit board, the at least one recess is covered with the second circuit board;

At least one first microphone assembly, the first microphone assembly is located in the concave portion, and the first microphone assembly includes: a first audio processing chip arranged on the second circuit board; a first integrated circuit chip arranged on the second circuit board; An integrated circuit chip is connected to the first audio processing chip.

In a second aspect, the present application provides an electronic device, comprising:

An integrated circuit assembly as provided in the first aspect.

In the embodiments of the present application, the integrated circuit assembly may include a first circuit board and a second circuit board, wherein the first circuit board is provided with at least one concave portion, so that the first microphone assembly can be disposed in the concave portion, and further The overall volume of the integrated circuit package is reduced. Further, by covering the second circuit board on the concave portion, the first microphone assembly can be disposed on the second circuit board, thereby realizing the fixation of the first microphone assembly. Specifically, the first microphone assembly includes the first audio processing The chip and the first integrated circuit chip adapted to the first audio processing chip, the first audio processing chip is arranged on the second circuit board; the first integrated circuit chip is arranged on the second circuit board, the first integrated circuit The chip is connected with the first audio processing chip. On the one hand, by arranging the first audio processing chip and the first integrated circuit chip in the concave portion, the overall volume of the integrated circuit assembly can be effectively reduced, which is beneficial to realize the miniaturized design of the integrated circuit assembly. On the other hand, the cavity formed in the concave portion can also be used as a sound pickup cavity of the first microphone assembly, thereby improving the collection effect of the first microphone assembly for audio signals, thereby ensuring the noise reduction effect of the first microphone assembly.

Further, other electrical components can also be arranged on the board surface of the side of the second circuit board away from the recess, thereby realizing an increase in the layout area of the integrated circuit assembly, thereby enabling the integrated circuit assembly to be arranged with more electrical components, so that the The integrated circuit assembly can add more functions, so that the electronic device provided with the integrated circuit assembly can add more functions and improve the functionality of the electronic device.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

FIG. 1 shows a schematic structural diagram of an integrated circuit assembly according to an embodiment of the present application;

Fig. 2 shows a partial enlarged view at A in Fig. 1;

Fig. 3 shows a partial enlarged view at B in Fig. 1;

FIG. 4 shows a schematic structural diagram of a concave portion in an integrated circuit assembly according to an embodiment of the present application;

FIG. 5 shows a schematic structural diagram of a concave portion in an integrated circuit assembly according to another embodiment of the present application.

Reference number:

100 integrated circuit assembly, 102 first circuit board, 104 recess, 106 second circuit board, 110 first microphone assembly, 112 first audio processing chip, 114 first integrated circuit chip, 116 first sound pickup hole, 118 second Microphone assembly, 120 second audio processing chip, 122 second integrated circuit chip, 124 second sound pickup hole, 126 metal layer, 128 connecting part, 132 first cavity, 134 second cavity, 136 isolation part.

Detailed ways

Embodiments of the present application will be described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The features of the terms "first" and "second" in the description and claims of this application may expressly or implicitly include one or more of such features. In the description of this application, unless stated otherwise, "plurality" means two or more. In addition, "and/or" in the description and claims indicates at least one of the connected objects, and the character "/" generally indicates that the associated objects are in an "or" relationship.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientations or positional relationships indicated by "radial direction", "circumferential direction", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying the indicated devices or elements. It must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present application.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The integrated circuit assembly and the electronic device according to the embodiments of the present application will be described below with reference to FIGS. 1 to 5 .

1 , 2 , 3 , 4 and 5 , an integrated circuit assembly 100 according to some embodiments of the present application includes a first circuit board 102 , and at least one recess 104 is provided on the first circuit board 102 ; At least one second circuit board 106 and at least one concave portion 104 are covered with the second circuit board 106; at least one first microphone assembly 110, the first microphone assembly 110 is located in the concave portion 104, and the first microphone assembly 110 includes: a first The audio processing chip 112 is disposed on the second circuit board 106 ; the first integrated circuit chip 114 is disposed on the second circuit board 106 , and the first integrated circuit chip 114 is connected to the first audio processing chip 112 .

The integrated circuit assembly 100 according to the embodiment of the present application includes a first circuit board 102 , a second circuit board 106 and a first microphone assembly 110 , wherein the first circuit board 102 is provided with at least one recess 104 , and the first microphone assembly 110 It can be arranged in the concave portion 104 so as to reduce the overall volume of the integrated circuit assembly 100 . Further, the second circuit board 106 is covered on the concave portion 104 , so that the first microphone assembly 110 can be disposed on the second circuit board 106 to realize the fixed installation of the first microphone assembly 110 .

It can be understood that one or more recesses 104 may be provided on the first circuit board 102 , and correspondingly, each recess 104 is covered with a second circuit board 106 , and each recess 104 may be provided with a second circuit board 106 . The number of the first microphone assemblies 110 , that is, the number of the second circuit boards 106 and the number of the first microphone assemblies 110 are the same as the number of the recesses 104 .

Specifically, the first microphone assembly 110 can be disposed on the side panel of the second circuit board 106 facing the concave portion 104, so that the second circuit board 106 can be covered on the concave portion 104 of the first circuit board 102, and the set The first microphone assembly 110 on the second circuit board 106 is placed in the concave portion 104 to reduce the volume of the integrated circuit assembly 100 .

By covering the second circuit board 106 on the concave portion 104 , on the one hand, the first microphone assembly 110 disposed in the concave portion 104 can be connected to the second circuit board 106 , thereby realizing the fixed connection of the first microphone assembly 110 . On the other hand, the side of the second circuit board 106 away from the recessed portion 104 can also be used to install other electrical components, thereby increasing the function of the integrated circuit assembly 100 , thereby enabling the electronic device provided with the integrated circuit assembly 100 to increase more Multiple functions to improve the functionality of electronic equipment.

Specifically, the first circuit board 102 may be fabricated by using a PCB Cavity (printed circuit board partial recess) process to implement the setting of the recesses 104 on the first circuit board 102 , thereby ensuring a reasonable arrangement of wiring on the first circuit board 102 .

Further, the first microphone assembly 110 includes a first audio processing chip 112 and a first integrated circuit chip 114 adapted to the first audio processing chip 112, wherein the first audio processing chip 112 is used for processing the received audio Processing, according to the noise existing in the received audio, convert the noise sound wave signal into a digital signal, and further calculate the sound wave opposite to the noise sound wave signal according to the digital signal, and cancel the noise sound wave signal through the sound wave signal, So as to achieve the purpose of reducing noise. The first integrated circuit chip 114 may be an application-specific integrated circuit chip compatible with the first audio processing chip 112 , that is, the first integrated circuit chip 114 is specially designed to meet the working process of the first audio processing chip 112 The integrated circuit chip reduces the volume of the first integrated circuit chip 114 on the basis of realizing the control of the first audio processing chip 112 .

Further, the first audio processing chip 112 and the first integrated circuit chip 114 are both disposed on the second circuit board 106 and inside the concave portion 104 . On the one hand, by arranging the first audio processing chip 112 and the first integrated circuit chip 114 in the concave portion 104 , the overall volume of the integrated circuit assembly 100 can be effectively reduced, which is beneficial to realize the miniaturized design of the integrated circuit assembly 100 . On the other hand, the cavity formed in the concave portion 104 can also be used as a sound pickup cavity of the first microphone assembly 110 , thereby improving the collection effect of the first microphone assembly 110 for audio signals, thereby ensuring the noise reduction of the first microphone assembly 110 Effect. On the other hand, the side panel of the second circuit board 106 away from the first audio processing chip 112 and the first integrated circuit chip 114 can also be used to set other electrical components, so that the electrical components on the integrated circuit assembly 100 can be increased. Therefore, the function of the integrated circuit assembly 100 is increased, so that the electronic device provided with the integrated circuit assembly 100 can add more functions and improve the functionality of the electronic device.

Specifically, the first audio processing chip 112 may be a Micro-Electro-Mechanical System (MEMS) chip, and the first integrated circuit chip 114 may be an Application Specific Integrated Circuit (Application Specific Integrated Circuit) adapted to the MEMS chip Circuit, ASIC) chip.

As shown in FIGS. 2 and 4 , as a possible implementation manner, the integrated circuit assembly 100 further includes a first sound pickup hole 116 , the first sound pickup hole 116 is opened on the first circuit board 102 , and the first sound pickup hole 116 116 communicates with the recessed portion 104 .

Specifically, the first sound pickup hole 116 may be opened on the first circuit board 102 and located on the bottom wall of the concave portion 104 , that is, the first sound pickup hole 116 is opened on the bottom wall of the concave portion 104 of the first circuit board 102 , the first sound pickup hole 116 is a through-hole structure. Through the arrangement of the first sound pickup hole 116 , the audio signal can be effectively transmitted to the concave portion 104 through the first sound pickup hole 116 , that is, through the first sound pickup hole 116 The audio signal is transmitted to the sound pickup cavity where the first microphone assembly 110 is located, so as to ensure the sound pickup effect of the first microphone assembly 110 , thereby ensuring the noise reduction effect of the first microphone assembly 110 .

As a possible implementation manner, the integrated circuit assembly 100 further includes an isolation portion 136 disposed in the at least one concave portion 104 , and the isolation portion 136 divides the concave portion 104 into a first cavity 132 and a second cavity 134 .

As shown in FIGS. 3 and 5 , specifically, an isolation portion 136 is provided in the concave portion 104 of the first circuit board 102 , so that the space in the concave portion 104 can be divided into a first cavity 132 and a second cavity 134 , thereby The volume of the accommodating space in the concave portion 104 can be reduced, thereby making the propagation path of the audio signal in the concave portion 104 shorter, thereby improving the transmission effect of the high-frequency frequency signal in the concave portion 104, and avoiding the signal of the high-frequency frequency signal The source interferes in the process of audio signal transmission and causes audio signal attenuation, which ensures the inductive strength of the first microphone assembly 110 disposed in the concave portion 104 to the audio signal, thereby ensuring the processing effect of the integrated circuit assembly 100 for the audio signal.

Wherein, when the first circuit board 102 includes a plurality of concave portions 104 , the isolation portion 136 may be disposed on at least one of the plurality of concave portions 104 to reduce the processing cost of the integrated circuit assembly 100 , or in all the concave portions 104 . The isolation parts 136 are all provided to improve the audio processing effect of the integrated circuit assembly 100 .

Specifically, the first audio processing chip 112 of the first microphone assembly 110 may be disposed in the first cavity 132, and the first sound pickup hole 116 is communicated with the first cavity 132, thereby reducing the first audio frequency The volume of the sound pickup cavity where the processing chip 112 is located, thereby improving the sound pickup effect of the first audio processing chip 112 . Correspondingly, the first integrated circuit chip 114 compatible with the first audio processing chip 112 may be disposed in the second cavity 134 to ensure auxiliary control of the first audio processing chip 112 .

It should be noted that when the first microphone assembly 110 is used to perform noise reduction processing on audio, the audio signal with higher frequency has less influence on the MEMS chip included in the first microphone assembly 110. Therefore, the first The isolation portion 136 may not be provided in the concave portion 104 where the microphone assembly 110 is located, so as to reduce the manufacturing cost of the integrated circuit assembly 100 .

Specifically, in the process of processing the concave portion 104 , the position of the isolation portion 136 can be reserved, and then the first circuit board 102 is processed on both sides of the isolation portion 136 by using the PCB Cavity process, and the concave portion is processed. At the same time as 104 , an isolation portion 136 between the first cavity 132 and the second cavity 134 is formed. Further, when disposing the second circuit board 106 , the isolation posts can be welded to the surface of the second circuit board 106 to ensure the airtightness of the first cavity 132 and the second cavity 134 .

As shown in FIGS. 3 and 5 , as a possible implementation manner, the integrated circuit assembly 100 further includes at least one second microphone assembly 118 located in the concave portion 104 , and the second microphone assembly 118 includes: a second audio processing chip 120 , The second integrated circuit chip 122 is disposed on the second circuit board 106 and is located in the second cavity 134, and the second integrated circuit chip 122 is connected to the second cavity 134. The second audio processing chip 120 is connected.

Specifically, the integrated circuit assembly 100 may further include a second microphone assembly 118, and the second microphone assembly 118 is configured to process audio, so as to process the audio information input by the user during the call, that is, the second microphone assembly 118 may be a call microphone. Specifically, the second microphone assembly 118 is used to convert the audio signal during the user's call into a digital signal, and other related electrical components on the integrated circuit assembly 100 can transmit the digital signal to the target device for the target device to identify. , and then implement the call process.

Wherein, the second microphone assembly 118 includes a second audio processing chip 120 and a second integrated circuit chip 122 adapted to the second audio processing chip 120, wherein the second audio processing chip 120 is used for the audio signal input by the user Collect and convert the audio signal into a digital signal, and then transmit the digital signal to realize the call function. The second integrated circuit chip 122 is an integrated circuit chip specially designed to meet the working process of the second audio processing chip 120 . On the basis of realizing the control of the second audio processing chip 120 , the volume of the second integrated circuit chip 122 is reduced. .

Further, the second audio processing chip 120 and the second integrated circuit chip 122 are both disposed on the second circuit board 106 and located in the concave portion 104 . On the one hand, by arranging the second audio processing chip 120 and the second integrated circuit chip 122 in the concave portion 104 , the overall volume of the integrated circuit assembly 100 can be effectively reduced, which is beneficial to realize the miniaturized design of the integrated circuit assembly 100 . On the other hand, the cavity formed in the concave portion 104 can also be used as a sound pickup cavity of the second microphone assembly 118 , thereby improving the collection effect of the second microphone assembly 118 for audio signals, thereby ensuring the noise reduction of the second microphone assembly 118 Effect. On the other hand, the side panel of the second circuit board 106 away from the second audio processing chip 120 and the second integrated circuit chip 122 can also be used to set other electrical components, so that the electrical components on the integrated circuit assembly 100 can be increased. Therefore, the function of the integrated circuit assembly 100 is increased, so that the electronic device provided with the integrated circuit assembly 100 can add more functions and improve the functionality of the electronic device.

Further, based on the fact that the second microphone assembly 118 is used for making calls, the second audio processing chip 120 has higher requirements on the frequency of the audio signal, and the audio signal source with a higher frequency will cause interference to the audio signal during the propagation of the audio signal. As a result, the audio signal is attenuated, thereby affecting the collection effect of the second microphone assembly 118 for the audio signal, thereby affecting the call quality. Therefore, as shown by the arrow in FIG. 3 , the second audio processing chip 120 is arranged in the first cavity 132 , thereby reducing the volume of the sound pickup cavity where the second audio processing chip 120 is located, so that the audio signal is in the first cavity. The propagation path in the body 132 is shorter, thereby improving the transmission effect of the audio signal with higher frequency, avoiding interference, and ensuring the inductive strength of the second audio processing chip 120 for the audio signal, thereby ensuring the call effect.

Specifically, the first audio processing chip 112 may be a MEMS chip, and the first integrated circuit chip 114 may be an ASIC chip adapted to the MEMS chip.

As shown in FIG. 3 and FIG. 5 , as a possible implementation manner, the second circuit board 106 is provided with a wire slot; the second microphone assembly 118 further includes a wire, the wire is located in the wire slot, and one end of the wire is connected to the first end of the wire. The two audio processing chips 120 are connected, and the other end is connected to the second integrated circuit chip 122 .

Specifically, the space in the concave portion 104 is divided into relatively independent first cavity 132 and second cavity 134 based on the isolation portion 136 , and the second audio processing chip 120 is located in the first cavity 132 , and the second integrated circuit chip is located in the first cavity 132 . 122 is located in the second cavity 134, and by opening a wire slot on the second circuit board 106, the wires used to connect the second audio processing chip 120 and the second integrated circuit chip 122 can be arranged in the wire slot, While ensuring the effective connection between the second audio processing chip 120 and the second integrated circuit chip 122 , the airtightness of the first cavity 132 and the second cavity 134 is ensured, thereby ensuring that the second audio processing chip 120 has no effect on the audio. processing effect.

Further, a wire passage can also be opened inside the second circuit board 106, and the openings at both ends of the wire passage are respectively located in the first cavity 132 and the second cavity 134, so that the wire can be passed through the wire passage. Inside, the two ends of the wire are respectively connected with the second audio processing chip 120 located in the first cavity 132 and the second integrated circuit chip 122 located in the second cavity 134, thereby realizing the second audio processing chip 120 and the second integrated circuit chip 122. Connection between two integrated circuit chips 122 .

As shown in FIG. 3 and FIG. 5 , as a possible implementation manner, the integrated circuit assembly 100 further includes a second sound pickup hole 124 , the second sound pickup hole 124 is opened on the first circuit board 102 , and the second sound pickup hole 124 124 communicates with the first cavity 132 .

Specifically, the space in the concave portion 104 is divided into relatively independent first cavity 132 and second cavity 134 based on the isolation portion 136 , and the second audio processing chip 120 is located in the first cavity 132 , and the second integrated circuit chip is located in the first cavity 132 . 122 is located in the second cavity 134 . The second isolation hole can be opened on the first circuit board 102 and communicated with the first cavity 132, that is, the second sound pickup hole 124 is disposed opposite the second audio processing chip 120, so that the audio frequency can be effectively The signal is transmitted to the first cavity 132 through the second sound pickup hole 124 , so as to ensure the sound pickup effect of the second audio processing chip 120 , thereby ensuring the call effect of the second microphone assembly 118 .

As shown in FIG. 4 and FIG. 5 , as a possible implementation manner, the inner wall of the concave portion 104 is covered with a metal layer 126 .

Specifically, by laying the metal layer 126 on the inner wall of the concave portion 104, the metal layer 126 can be used to achieve the shielding effect of the interference signal, so as to avoid the interference signal generated by other electrical components of the integrated circuit assembly 100 during the operation of the concave portion 104. The audio signal causes interference to ensure the audio signal processing effect of the first microphone assembly 110 in the recessed portion 104 .

Further, based on the isolation portion 136 provided in the recessed portion 104 , the metal layer 126 is laid on the inner wall of the recessed portion 104 and the side walls on both sides of the isolation portion 136 to ensure the inner walls of the first cavity 132 and the second cavity 134 A metal layer 126 is laid on both, thereby ensuring the shielding effect of the first cavity 132 and the second cavity 134 against interference.

Wherein, the metal layer 126 can be laid with copper, and the metal copper is laid on the surface of the inner wall of the recess 104 through an electroplating process.

As a possible implementation manner, the first circuit board 102 is provided with a first wiring; the second circuit board 106 is provided with a second wiring, and the second wiring is connected to the first wiring.

Specifically, the first circuit board 102 is provided with a first wiring, and through the setting of the first wiring, the connection between the various electrical components installed on the first circuit board 102 can be realized, thereby ensuring the connection between the various electrical components The corresponding functions of the integrated circuit assembly 100 can be realized by the matching connection. Further, on the second circuit board 106, a second wiring is provided, and through the setting of the second wiring, the connection between the various electrical components installed on the second circuit board 106 can be realized, thereby ensuring the connection between the various electrical components. The corresponding functions of the integrated circuit assembly 100 can be realized by the matching connection. Further, the first wiring on the first circuit board 102 and the second wiring on the second circuit board 106 are connected to each other, and by connecting the first wiring and the second wiring to each other, the first circuit board is connected to each other. 102 is combined with the second circuit board 106 as a whole, so as to arrange the electrical components, thereby realizing the increase of the layout area of the integrated circuit assembly 100, thereby increasing the function of the integrated circuit assembly 100, so that the integrated circuit assembly is provided with the integrated circuit assembly 100. The electronic device of 100 can add more functions and improve the functionality of the electronic device.

Specifically, both the first wiring and the second wiring can be arranged in multiple layers. According to the specific connection requirements of the electrical components arranged on the first circuit board 102 and the second circuit board 106, each layer of the first wiring and each layer are arranged The connection method between the second wirings.

As shown in FIGS. 2 to 5 , as a possible implementation manner, the integrated circuit assembly 100 further includes a connecting portion 128 , the number of the connecting portion 128 is multiple, and the multiple connecting portions 128 are disposed on the first circuit board 102 . And distributed along the circumferential direction of the concave portion 104 , the second circuit board 106 is connected to the first circuit board 102 through a plurality of connecting portions 128 .

Specifically, the first circuit board 102 and the second circuit board 106 may be connected through the connecting portion 128 . The connecting portions 128 may be disposed on the first circuit board 102, and the number of the connecting portions 128 is multiple, and the multiple connecting portions 128 are distributed along the circumferential direction of the concave portion 104 on the first circuit board 102, so as to realize the first The multi-point connection between the circuit board 102 and the second circuit board 106 ensures the stability of the connection between the first circuit board 102 and the second circuit board 106 .

Wherein, the connection part 128 may include a plurality of pads disposed on the surfaces of the first circuit board 102 and the second circuit board 106 , and a plurality of pads connected to the pads on the first circuit board 102 and the pads on the second circuit board 106 metal tin between. Specifically, the metal tin is melted into tin balls by a soldering device, and the tin balls are brought into contact with the pads on the first circuit board 102 and the second circuit board 106 at the same time. After the tin balls are cooled and solidified, the first The circuit board 102 is connected to the second circuit board 106 .

As a possible implementation manner, the first wiring is connected to the second wiring through at least one of the plurality of connection parts 128 .

Specifically, by connecting the first wiring and the second wiring through the connecting portion 128, the connecting portion 128 can not only realize the fixed connection of the relative position between the first circuit board 102 and the second circuit board 106, but also ensure the first circuit board 102 and the second circuit board 106. The stability of the connection between the circuit board 102 and the second circuit board 106, at the same time, the connection part 128 can also realize the connection between the first wiring and the second wiring, so as to ensure the electrical components on the first circuit board 102 and the second circuit The effective connection between the electrical components on the board 106 ensures that the integrated circuit assembly 100 can realize the corresponding functions. The structure of the integrated circuit package 100 is simplified, and the manufacturing cost of the integrated circuit package 100 is reduced.

Specifically, the number of the connection parts 128 may be multiple, and at the same time, the number of the first wiring and the number of the second unwanted wiring may also be multiple. The corresponding relationship between the plurality of first wirings and the plurality of second wirings is determined, and then the first wirings on the first circuit board 102 are connected with the corresponding second wirings on the second circuit board 106 through the connecting portion 128 , Accordingly, the corresponding connections between the plurality of first wirings and the plurality of second wirings are realized, and the effective connection between the first circuit board 102 and the second circuit board 106 is ensured.

Further, as shown in FIGS. 1 to 3 , the integrated circuit assembly 100 further includes a plurality of other electrical components, and the plurality of other electrical components are disposed on the first circuit board 102 and/or the second circuit board 106 .

Specifically, corresponding electrical components may be provided on the first circuit board 102 and/or the second circuit board 106 according to the specific structure of the electronic device to which the integrated circuit assembly 100 is applied and the specific functions required by the electronic device.

Wherein, according to the structural features of the electronic device to which the integrated circuit assembly 100 is applied, a plurality of electrical components may be arranged only on the first circuit board 102 or only on the second circuit board 106, so as to ensure the functionality of the electronic device while ensuring the functionality of the electronic device. , which also satisfies the structural characteristics of the electronic device. Correspondingly, according to the functional requirements of the electronic device to which the integrated circuit assembly 100 is applied, for example, on the basis of ensuring the volume of the electronic device, in order to enable the electronic device to achieve more functions, at this time, multiple electrical components can be It is arranged on the first circuit board 102 and the second circuit board 106 at the same time, and at the same time, on the basis of the connection between the first wiring on the first circuit board 102 and the second wiring on the second circuit board 106, it can ensure that Corresponding connections between the electrical components on the first circuit board 102 and the second circuit board 106 further realize the multi-functionality of the electronic device.

Specifically, a plurality of electrical components can be divided into active electrical components and passive electrical components according to the functions achieved and the volume of the occupied space. For example, passive electrical components may include electrical components such as capacitors, electrons, and inductors. Such electrical components Since the second circuit board 106 has a certain thickness, the body of the second circuit board 106 protrudes from the surface of the first circuit board 102, therefore, the smaller size The passive electrical components are disposed on the second circuit board 106 , which can effectively prevent the overall height of the integrated circuit assembly 100 from being too high, and ensure the miniaturized design of the integrated circuit assembly 100 . Correspondingly, the active electrical components may include Bluetooth modules, processors and chips capable of realizing different functions, etc. Such electrical components are relatively large in size and may be arranged on the first circuit board 102, thereby reducing the volume of such electrical components Influence on the overall volume of the integrated circuit assembly 100 .

The present application provides an electronic device, including: the integrated circuit assembly 100 provided in the first aspect.

Since the electronic device provided in this application includes the integrated circuit assembly 100 provided by any of the above embodiments, it has all the beneficial effects of the integrated circuit assembly 100 provided by any of the above embodiments, and will not be described one by one here.

Among them, the electronic devices include earphones, watches, or terminal devices such as mobile phones, computers, and notebook computers.

As a possible implementation manner, the electronic device may include a casing for placing the integrated circuit assembly 100 to protect the integrated circuit assembly 100 . In addition, in the present application, by disposing at least one recess 104 on the first circuit board 102 of the integrated circuit assembly 100 , the first microphone assembly 110 or the second microphone assembly 118 can be arranged in the recess 104 , thereby realizing the reduction of the integrated circuit assembly 100 On the basis of ensuring that the electronic device can realize the relevant functions, the volume of the casing of the electronic device is reduced, so as to realize the miniaturization design of the electronic device. Further, by covering the second circuit board 106 of the integrated circuit assembly 100 on the concave portion 104 of the first circuit board 102 , the second circuit board 106 can be further away from the first microphone assembly 110 or the second microphone assembly 118 . Other electrical components are arranged on the side panel, thereby increasing the layout area of the integrated circuit assembly 100 , thereby increasing the functions of the electronic device and improving the functionality of the electronic device by adding electrical components on the integrated circuit assembly 100 .

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (11)

1. An integrated circuit assembly, characterized in that, comprising: a first circuit board, the first circuit board is provided with at least one recess; at least one second circuit board, the at least one recess is covered with the second circuit board; At least one first microphone assembly, the first microphone assembly is located in the recess, and the first microphone assembly includes: a first audio processing chip, disposed on the second circuit board; The first integrated circuit chip is arranged on the second circuit board, and the first integrated circuit chip is connected to the first audio processing chip. 2. The integrated circuit assembly of claim 1, further comprising: A first sound pickup hole, the first sound pickup hole is opened on the first circuit board, and the first sound pickup hole is communicated with the concave portion. 3. The integrated circuit assembly of claim 1, further comprising: The isolation part is arranged in the at least one concave part, and the isolation part divides the concave part into a first cavity and a second cavity. 4. The integrated circuit assembly of claim 3, further comprising at least one second microphone assembly located in the recess, the second microphone assembly comprising: a second audio processing chip, disposed on the second circuit board, and located in the first cavity; A second integrated circuit chip is disposed on the second circuit board and located in the second cavity, and the second integrated circuit chip is connected to the second audio processing chip. 5. The integrated circuit assembly of claim 4, wherein The second circuit board is provided with a wire slot; The second microphone assembly further includes a wire, the wire is located in the wire-passing slot, one end of the wire is connected to the second audio processing chip, and the other end is connected to the second integrated circuit chip. 6. The integrated circuit assembly of claim 3, further comprising: A second sound pickup hole, the second sound pickup hole is opened on the first circuit board, and the second sound pickup hole is communicated with the first cavity. 7. The integrated circuit assembly of any one of claims 1 to 6, wherein The inner wall of the recess is covered with a metal layer. 8. The integrated circuit assembly of any one of claims 1 to 6, wherein The first circuit board is provided with a first wiring; A second wiring is provided on the second circuit board, and the second wiring is connected to the first wiring. 9. The integrated circuit assembly of claim 8, further comprising: connecting parts, the number of the connecting parts is plural, the connecting parts are arranged on the first circuit board and distributed along the circumferential direction of the concave part, and the second circuit board passes through a plurality of the connecting parts The connection part is connected to the first circuit board. 10. The integrated circuit assembly of claim 9, wherein: The first wiring is connected to the second wiring through at least one of the plurality of connecting portions. 11. An electronic device, characterized in that, comprising: An integrated circuit assembly as claimed in any one of claims 1 to 10.

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