CN114615788A - Circuit board with heat sink and method of making the same - Google Patents

Abstract

A circuit board with a heat dissipation block, comprising: a circuit substrate; a through hole penetrates the circuit substrate along a first direction; The width is smaller than the width of the first part and smaller than the width of the third part; the heat dissipation block is accommodated in the second part; the first fixing piece includes a first connecting part and one end connected to the first connecting part and is in a shape with the first connecting part; the first head part arranged in a T-shape, the first connecting part is connected to the heat dissipation block, the first head part is located in the first part and the width of the first head part is larger than that of the second part; the second fixing part includes the second connecting part and A second head connected to one end of the second connection part and arranged in a T-shape with the second connection part, the second head is located in the third part and the width of the second head is larger than the width of the second part, the second connection connected to the heat sink. The invention also relates to a manufacturing method of a circuit board with a heat dissipation block.

Description

Circuit board with heat sink and method of making the same

technical field

The invention relates to the field of circuit boards, in particular to a circuit board with a heat dissipation block and a manufacturing method thereof.

Background technique

Due to the rapid development of circuit boards, their applications are becoming more and more extensive. Among them, due to the development trend of high integration, miniaturization, and miniaturization of electronic products, the assembly density of electronic components is getting higher and higher, and the power consumption is also increasing. Correspondingly, the heat dissipation requirements for multi-layer circuit boards are also getting higher and higher. In the prior art, heat is generally dissipated by burying heat-conducting metal blocks at locations where heat dissipation is required. The thermal conductive metal block and the circuit board are usually fixed by the overflow glue of the prepreg. Therefore, the above heat dissipation method has special requirements for the prepreg. Usually, a thicker prepreg with overflow effect can meet the fixing requirements.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a circuit board with a heat dissipation block, which does not require a prepreg to fix the heat dissipation block.

A manufacturing method of the above-mentioned circuit board with heat dissipation block is also provided.

A circuit board with a heat dissipation block, comprising: a circuit substrate, and a through hole penetrating the circuit substrate along a first direction, the through hole including a first part, a second part and a third part connected in sequence along the first direction part, the width of the second part is smaller than the width of the first part and smaller than the width of the third part; the heat dissipation block is accommodated in the second part; the first fixing part includes a first connecting part and a connecting part a first head located at one end of the first connection part and arranged in a T-shape with the first connection part, the first connection part is connected to the heat dissipation block, and the first head is located in the first part and the width of the first head is greater than the width of the second part; the second fixing member includes a second connecting part and one end connected to the second connecting part and forming a T shape with the second connecting part a second head part arranged in a glyph, the second head part is located in the third part and the width of the second head part is larger than that of the second part, and the second connecting part is connected to the heat dissipation block .

A circuit board with a heat dissipation block, comprising: a circuit substrate, and a through hole penetrating the circuit substrate along a first direction, the through hole including a first part, a second part and a third part connected in sequence along the first direction part, the width of the second part is smaller than the width of the first part and smaller than the width of the third part; the heat dissipation block includes a first heat dissipation part and a second heat dissipation part connected to one end of the first heat dissipation part, The width of the second heat dissipation portion is greater than the width of the first heat dissipation portion, the first heat dissipation portion is located in the second portion, the width of the second heat dissipation portion is greater than the width of the second portion, and The second heat dissipation part is located in the first part; the fixing piece includes a connection part and a head part connected to one end of the connection part and arranged in a T-shape with the connection part, the head part is located in the first part. Among the three parts, the width of the head is greater than the width of the second part, and the connection part is connected to the first heat dissipation part.

A manufacturing method of a circuit board with a heat dissipation block, comprising the following steps:

A circuit substrate is provided, and a through hole penetrating the circuit substrate along a first direction is opened, and the through hole includes a first part, a second part and a third part connected in sequence along the first direction, the second part the width of the portion is less than the width of the first portion and less than the width of the third portion;

A first fixing piece is provided, the first fixing piece includes a first connecting part and a first head part connected to one end of the first connecting part and arranged in a T-shape with the first connecting part, the first connecting part connects a heat dissipation block and places the heat dissipation block from the first part into the second part, the width of the first head part is larger than the width of the second part; and

A second fixing member is provided, the second fixing member comprises a second connecting part and a second head connected to one end of the second connecting part and arranged in a T-shape with the second connecting part, the first Two heads are located in the third part, the width of the second head is larger than the width of the second part, and the second connection part is connected to the heat dissipation block.

A manufacturing method of a circuit board with a heat dissipation block, comprising the following steps:

A circuit substrate is provided, and a through hole penetrating the circuit substrate along a first direction is opened, and the through hole includes a first part, a second part and a third part connected in sequence along the first direction, the second part the width of the portion is less than the width of the first portion and less than the width of the third portion;

A heat dissipation block is provided, the heat dissipation block includes a first heat dissipation part and a second heat dissipation part connected to one end of the first heat dissipation part, the width of the second heat dissipation part is larger than that of the first heat dissipation part;

The heat dissipation block is placed in the through hole from the first part, the first heat dissipation part is located in the second part, the second heat dissipation part is located in the first part, and the second heat dissipation part is located in the first part. The width of the heat dissipation portion is greater than the width of the second portion; and

A fixing piece is provided, the fixing piece includes a connecting part and a head part connected to one end of the connecting part and arranged in a T-shape with the connecting part, the head part is located in the third part, the head part is The width of the portion is greater than the width of the second portion, and the connecting portion connects the heat dissipation block.

The present invention provides a circuit board with a heat dissipation block and a manufacturing method thereof. Through holes in the form of stepped holes are used to accommodate the heat dissipation block. In the substrate, there is no need to fix the heat dissipation block in the circuit substrate through the glue material.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a circuit substrate according to an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of opening a through hole in the circuit substrate shown in FIG. 1 .

3 is a schematic cross-sectional view of a heat dissipation block according to an embodiment of the present application.

FIG. 4 is a schematic cross-sectional view of the heat dissipation block shown in FIG. 3 connected to the first fixing member and then placed in the through hole shown in FIG. 2 .

5 is a schematic cross-sectional view of a circuit board with a heat dissipation block according to an embodiment of the present application.

6 is a schematic cross-sectional view of a heat dissipation block according to an embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of placing the heat dissipation block shown in FIG. 6 in the through hole shown in FIG. 2 .

8 is a schematic cross-sectional view of a circuit board with a heat dissipation block according to an embodiment of the present application.

Description of main component symbols

The following specific embodiments will further illustrate the present invention in conjunction with the above drawings.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are for the purpose of describing specific embodiments only, and are not intended to limit the application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to FIGS. 1 to 5 , a first embodiment of the present application provides a method for manufacturing a circuit board 100 a with a heat dissipation block, which includes the following steps:

In step S11, referring to FIG. 1, a circuit substrate 30 is provided. The circuit substrate 30 includes a dielectric layer 31 and at least one circuit layer 33 .

The circuit substrate 30 may be a single-layer circuit substrate, a double-layer circuit substrate or a multi-layer circuit substrate. In this embodiment, the circuit substrate 30 is a multi-layer circuit substrate, which includes a dielectric layer 31 and a first circuit layer 331 , a second circuit layer 332 , a first circuit layer 331 , a second circuit layer 332 , a first circuit layer 331 , a second circuit layer 332 , The third wiring layer 333 and the fourth wiring layer 334 . The first circuit layer 331 and the fourth circuit layer 334 are disposed on opposite sides of the dielectric layer 31 , and the second circuit layer 332 and the third circuit layer 333 are embedded in the in the dielectric layer 31 .

In step S12 , referring to FIG. 2 , a through hole 40 is formed on the circuit substrate 30 , and the through hole 40 penetrates the circuit substrate 30 along the thickness direction of the dielectric layer 31 . Wherein, the through hole 40 is a stepped hole in the shape of an "I", and includes a first part 411 , a second part 412 and a third part 413 connected in sequence along the thickness direction of the dielectric layer 31 . In the direction perpendicular to the thickness direction of the dielectric layer 31 , the width of the second portion 412 is smaller than that of the first portion 411 and smaller than the width of the third portion 413 , so that the width of the first portion 411 is A first stepped surface 401 is formed between the side wall and the side wall of the second portion 412 , and a second stepped surface 403 is formed between the side wall of the third portion 413 and the side wall of the second portion 412 .

In step S13, referring to FIG. 3, a heat dissipation block 50 is provided. The heat dissipation block 50 includes a first surface 501 and a second surface 503 opposite to each other, and a first mounting hole 51 is formed recessed from the first surface 501 toward the second surface 503 , and a first mounting hole 51 is formed from the second surface 503 A second mounting hole 53 is recessed toward the first surface 501 .

The inner wall of the first installation hole 51 may be provided with a first inner thread 511 , and the inner wall of the second installation hole 53 may be provided with a second inner thread 531 .

In this embodiment, the heat dissipation block 50 is made of a metal material or an alloy material with good thermal conductivity, for example, a copper block, a gold block, a silver block, or the like. In some embodiments, the heat dissipation block 50 can also be made of other materials with high thermal conductivity.

In this embodiment, the first installation hole 51 and the second installation hole 53 are respectively a blind hole. In some embodiments, the first installation hole 51 may also communicate with the second installation hole 53 .

Step S14 , please refer to FIG. 4 , providing a first connecting portion 612 and a first head portion 614 connected to one end of the first connecting portion 612 and arranged in a T-shape with the first connecting portion 612 . Fixing member 61, the first connecting portion 612 is fixed with the first mounting hole 51, and the heat dissipation block 50 connected to the first fixing member 61 is placed from the first part 411 to the second part In 412 , the width of the first head portion 614 is greater than the width of the second portion 412 .

In this embodiment, the first connecting portion 612 is provided with a first external thread 615, and the first external thread 615 and the first internal thread 511 cooperate with each other to connect the first fixing member 61 and the The heat dissipation block 50 is fixed.

The first head 614 is located on the first portion 411 . Preferably, the thickness of the first head portion 614 is less than or equal to the depth of the first portion 411 .

Step S15 , referring to FIG. 5 , provide a second connecting portion 632 and a second head portion 634 connected to one end of the second connecting portion 632 and arranged in a T-shape with the second connecting portion 632 . The fixing member 63 is fixed, and the second connecting portion 632 is fixed with the second mounting hole 53 . The width of the second head portion 634 is larger than the width of the second portion 412 , so that the heat dissipation block 50 is fixed. locked in the circuit substrate 30 .

Preferably, the thickness of the heat dissipation block 50 is less than or equal to the depth of the second portion 412 , the first head portion 614 abuts against the first stepped surface 401 , and the second head portion 634 abuts against the first step surface 401 . The second stepped surface 403 locks the heat dissipation block 50 and the circuit substrate 30 to prevent the heat dissipation block 50 from moving relative to the circuit substrate 30 .

In this embodiment, the second connecting portion 632 is provided with a second external thread 635, and the second external thread 635 and the second internal thread 531 cooperate with each other to connect the second fixing member 63 to the second fixing member 63. The heat dissipation block 50 is fixed.

The second head 634 is located on the third portion 413 . Preferably, the thickness of the second head portion 634 is less than or equal to the depth of the third portion 413 .

Preferably, the first fixing member 61 and the second fixing member 63 are made of materials with good thermal conductivity.

Please refer to FIG. 6 to FIG. 8 , the second embodiment of the present application provides a manufacturing method of a circuit board 100 b with a heat dissipation block, which includes the following steps:

In step S21, referring to FIG. 6, a heat dissipation block 50a is provided. The heat dissipation block 50a includes a first heat dissipation portion 55 and a second heat dissipation portion 56 connected to one end of the first heat dissipation portion 55. The width of the second heat dissipation portion 56 is greater than the width of the first heat dissipation portion 55, so that all A third stepped surface 57 is formed between the peripheral surface of the first heat dissipation portion 55 and the peripheral surface of the second heat dissipation portion 56 . A surface of the first heat dissipation portion 55 facing away from the second heat dissipation portion 56 is recessed toward the second heat dissipation portion 56 to form a mounting hole 51 a.

The inner wall of the mounting hole 51a may be provided with an inner thread 511a.

The width of the second heat dissipation portion 56 is greater than the width of the second portion 412 and less than or equal to the width of the first portion 411 .

The heat dissipation block 50a is made of a metal material or an alloy material with good thermal conductivity, for example, a copper block, a gold block, a silver block, and the like. In some embodiments, the heat dissipation block 50a can also be made of other materials with high thermal conductivity.

In this embodiment, the mounting hole 51a is a blind hole. In some embodiments, the mounting holes 51a can also be through holes.

Step S22 , referring to FIG. 7 , a circuit substrate 30 having the through hole 40 is provided, and the heat dissipation block 50 a is placed in the through hole 40 from the first part 411 , wherein the first The heat dissipation portion 55 is located in the second portion 412 , and the width of the second heat dissipation portion 56 is larger than that of the second portion 412 .

The second heat dissipation portion 56 is located in the first portion 411 . Preferably, the thickness of the second heat dissipation portion 56 is less than or equal to the depth of the first portion 411 .

Step S23, please refer to FIG. 8, provide a fixing member 64 including a connecting portion 642 and a head portion 644 connected to one end of the connecting portion 642 and arranged in a T shape with the connecting portion 642, and attaching the connecting portion 642 to the fixing member 64. The width of the head 644 is larger than the width of the second portion 412 , so that the heat dissipation block 50 is locked in the circuit substrate 30 .

Preferably, the thickness of the first heat dissipation portion 55 is less than or equal to the depth of the second portion 412 , the third stepped surface 57 abuts against the first stepped surface 401 , and the head 644 abuts against the first stepped surface 401 . The second stepped surface 403 locks the heat dissipation block 50 and the circuit substrate 30 to prevent the heat dissipation block 50 from moving relative to the circuit substrate 30 .

In this embodiment, the connecting portion 642 is provided with an external thread 645 , and the external thread 645 and the internal thread 511 a cooperate with each other to fix the fixing member 64 and the heat dissipation block 50 .

The head 644 is located in the third portion 413 . Preferably, the thickness of the head portion 644 is less than or equal to the depth of the third portion 413 .

Preferably, the fixing member 64 is made of a material with good thermal conductivity.

Referring to FIG. 5 , a circuit board 100 a with a heat dissipation block according to a first embodiment of the present application includes a circuit substrate 30 , a heat dissipation block 50 , a first fixing member 61 and a second fixing member 63 . A through hole 40 extends through the circuit substrate 30 along the first direction. The through hole 40 includes a first part 411 , a second part 412 and a third part 413 which are connected in sequence along the first direction. In a direction perpendicular to the first direction, the width of the second portion 412 is smaller than the width of the first portion 411 and smaller than the width of the third portion 413 , so that the sidewall of the first portion 411 and the A first stepped surface 401 is formed between the sidewalls of the second portion 412 , and a second stepped surface 403 is formed between the sidewalls of the third portion 413 and the sidewall of the second portion 412 .

The heat dissipation block 50 includes a first surface 501 and a second surface 503 opposite to each other, and a first mounting hole 51 is formed recessed from the first surface 501 toward the second surface 503 , and a first mounting hole 51 is formed from the second surface 503 toward the second surface 503 . The first surface 501 is recessed to form a second mounting hole 53 . The heat sink 50 is located in the second portion 412 . The first surface 501 faces away from the third portion 413 and the second surface 503 faces away from the first portion 411 .

The first fixing member 61 includes a first connecting portion 612 and a first head portion 614 connected to one end of the first connecting portion 612 and arranged in a T-shape with the first connecting portion 612 . The second fixing member 63 includes a second connecting portion 632 and a second head portion 634 connected to one end of the second connecting portion 632 and arranged in a T-shape with the second connecting portion 632 . The first connecting portion 612 is fixed with the first mounting hole 51 , and the second connecting portion 632 is fixed with the second mounting hole 53 . The width of the first head portion 614 is larger than the width of the second portion 412, and the width of the second head portion 634 is larger than the width of the second portion 412, thereby locking the heat sink 50 to the circuit in the substrate 30 .

Preferably, the thickness of the heat dissipation block 50 is less than or equal to the depth of the second portion 412 , the first head portion 614 abuts against the first stepped surface 401 , and the second head portion 634 abuts against the first step surface 401 . The second stepped surface 403 locks the heat dissipation block 50 and the circuit substrate 30 to prevent the heat dissipation block 50 from moving relative to the circuit substrate 30 .

Preferably, the thickness of the first head portion 614 is less than or equal to the depth of the first portion 411 . The thickness of the second head portion 634 is less than or equal to the depth of the third portion 413 .

The inner wall of the first mounting hole 51 may be provided with a first internal thread 511 , the first connecting portion 612 may be provided with a first external thread 615 , the first external thread 615 and the first internal thread 511 Cooperate with each other to fix the first fixing member 61 and the heat dissipation block 50 . The inner wall of the second mounting hole 53 may be provided with a second inner thread 531 , the second connecting portion 632 may be provided with a second outer thread 635 , the second outer thread 635 and the second inner thread 531 Cooperate with each other to fix the second fixing member 63 and the heat dissipation block 50 .

A circuit board 100b with a heat dissipation block according to a second embodiment of the present application is different from the circuit board with heat dissipation block 100a of the first embodiment in that the heat dissipation block 50a includes a first heat dissipation part 55 and is connected to the first heat dissipation part 55; A second heat dissipation portion 56 at one end of a heat dissipation portion 55, the width of the second heat dissipation portion 56 is greater than the width of the first heat dissipation portion 55, so that the peripheral surface of the first heat dissipation portion 55 and the second heat dissipation portion A third stepped surface 57 is formed between the peripheral surfaces of 56 . A surface of the first heat dissipation portion 55 facing away from the second heat dissipation portion 56 is recessed toward the second heat dissipation portion 56 to form a mounting hole 51 a. The first heat dissipation part 55 is located in the second part 412 , and the width of the second heat dissipation part 56 is larger than that of the second part 412 and located in the first part 411 . A fixing member 64 includes a connecting portion 642 and a head portion 644 connected to one end of the connecting portion 642 and arranged in a T-shape with the connecting portion 642. The connecting portion 642 is fixed with the mounting hole 51a. The width of the head portion 644 is larger than that of the second portion 412 in the third portion 413 .

Preferably, the thickness of the first heat dissipation portion 55 is less than or equal to the depth of the second portion 412 , the third stepped surface 57 abuts against the first stepped surface 401 , and the head 644 abuts against the first stepped surface 401 . The second step surface 403 is used to lock the heat dissipation block 50 a with the circuit substrate 30 to prevent the heat dissipation block 50 a from moving relative to the circuit substrate 30 .

Preferably, the thickness of the head portion 644 is less than or equal to the depth of the third portion 413 , and the thickness of the second heat dissipation portion 56 is less than or equal to the depth of the first portion 411 .

The inner wall of the mounting hole 51a may be provided with an inner thread 511a. The connecting portion 642 may be provided with an external thread 645 , and the external thread 645 cooperates with the internal thread 511 a to fix the fixing member 64 and the heat dissipation block 50 .

The present invention provides a circuit board with a heat dissipation block and a manufacturing method thereof. Through holes in the form of stepped holes are used to accommodate the heat dissipation block. In the substrate, there is no need to fix the heat dissipation block in the circuit substrate through the glue material.

The above is only the preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as described above, it is not intended to limit the present invention. , without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments with equivalent changes, provided that the content of the technical solution of the present invention is not departed from, the technical solution of the present invention Substantially any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solutions of the present invention.

Claims (8)

1. A circuit board having a heat slug, comprising:

the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;

the heat dissipation block is accommodated in the second part, and the thickness of the heat dissipation block is smaller than or equal to the depth of the second part;

the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with the heat dissipation block, the first head part is positioned in the first part, and the width of the first head part is larger than that of the second part;

the second fixing piece comprises a second connecting portion and a second head portion which is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, the second connecting portion is connected with the heat dissipation block, the first head portion abuts against a first step surface between the second portion and the first portion, and the second head portion abuts against a second step surface between the second portion and the third portion.

2. The circuit board with the heat dissipation block as claimed in claim 1, wherein a first mounting hole and a second mounting hole are respectively formed at two opposite sides of the heat dissipation block, a first internal thread is formed on an inner wall of the first mounting hole, a second internal thread is formed on an inner wall of the second mounting hole, a first external thread is formed on the first connecting portion, a second external thread is formed on the second connecting portion, the first external thread of the first connecting portion is matched and fixed with the first internal thread of the first mounting hole, and the second external thread of the second connecting portion is matched and fixed with the second internal thread of the second mounting hole.

3. A circuit board having a heat slug, comprising:

the through hole penetrates through the circuit substrate along a first direction, the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;

the radiating block comprises a first radiating part and a second radiating part connected to one end of the first radiating part, the width of the second radiating part is larger than that of the first radiating part, the first radiating part is positioned in the second part, the width of the second radiating part is larger than that of the second part, the second radiating part is positioned in the first part, and the thickness of the first radiating part is smaller than or equal to the depth of the second part;

the fixing piece comprises a connecting part and a head part which is connected to one end of the connecting part and arranged in a T shape with the connecting part, the head part is located in the third part, the width of the head part is larger than that of the second part, the connecting part is connected with the first heat dissipation part, the second heat dissipation part abuts against a first step surface between the second part and the first part, and the head part abuts against a second step surface between the second part and the third part.

4. The circuit board with the heat dissipation block as recited in claim 3, wherein an end of the first heat dissipation portion facing away from the second heat dissipation portion is provided with a mounting hole with internal threads, and the connecting portion is provided with external threads and is fixed in fit with the internal threads of the mounting hole.

5. A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:

providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;

providing a first fixing piece, wherein the first fixing piece comprises a first connecting part and a first head part which is connected to one end of the first connecting part and arranged in a T shape with the first connecting part, the first connecting part is connected with a radiating block, the radiating block is placed in the second part from the first part, the width of the first head part is larger than that of the second part, and the thickness of the radiating block is smaller than or equal to the depth of the second part; and

providing a second fixing piece, wherein the second fixing piece comprises a second connecting portion and a second head portion which is connected to one end of the second connecting portion and arranged in a T shape with the second connecting portion, the second head portion is located in the third portion, the width of the second head portion is larger than that of the second portion, the second connecting portion is connected with the heat dissipation block, the first head portion abuts against a first step surface between the second portion and the first portion, and the second head portion abuts against a second step surface between the second portion and the third portion.

6. The method according to claim 5, wherein the heat slug includes a first surface and a second surface opposite to each other, and a first mounting hole having a first internal thread is formed by recessing from the first surface toward the second surface, and a second mounting hole having a second internal thread is formed by recessing from the second surface toward the first surface, the first connection portion has a first external thread, the first external thread and the first internal thread cooperate to fix the first fixing member and the heat slug, the second connection portion has a second external thread, and the second external thread and the second internal thread cooperate to fix the second fixing member and the heat slug.

7. A manufacturing method of a circuit board with a heat dissipation block comprises the following steps:

providing a circuit substrate, and forming a through hole penetrating through the circuit substrate along a first direction, wherein the through hole comprises a first part, a second part and a third part which are sequentially communicated along the first direction, and the width of the second part is smaller than that of the first part and smaller than that of the third part;

providing a heat dissipation block, wherein the heat dissipation block comprises a first heat dissipation part and a second heat dissipation part connected to one end of the first heat dissipation part, and the width of the second heat dissipation part is larger than that of the first heat dissipation part;

placing the heat dissipation block in the through hole from the first part, wherein the first heat dissipation part is positioned in the second part, the second heat dissipation part is positioned in the first part, the width of the second heat dissipation part is larger than that of the second part, and the thickness of the first heat dissipation part is smaller than or equal to the depth of the second part; and

providing a fixing piece, wherein the fixing piece comprises a connecting part and a head part which is connected to one end of the connecting part and arranged in a T shape with the connecting part, the head part is positioned in the third part, the width of the head part is larger than that of the second part, the connecting part is connected with the heat dissipation block, the second heat dissipation part abuts against a first step surface between the second part and the first part, and the head part abuts against a second step surface between the second part and the third part.

8. The method for manufacturing a circuit board having a heat sink as claimed in claim 7, wherein a surface of the first heat sink portion facing away from the second heat sink portion is recessed toward the second heat sink portion to form a mounting hole having internal threads, the connecting portion has external threads, and the internal threads and the external threads cooperate to fix the fixing element and the heat sink.

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