CN114630504A

CN114630504A - Circuit board processing method and circuit board

Info

Publication number: CN114630504A
Application number: CN202011455717.7A
Authority: CN
Inventors: 谷新
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2022-06-14
Anticipated expiration: 2040-12-10
Also published as: CN114630504B

Abstract

The application provides a circuit board processing method and a circuit board, wherein the method comprises the following steps: providing a core board which is pressed on one side, wherein the core board sequentially comprises a first metal layer, a first dielectric layer, a pattern layer and an intermediate dielectric layer; processing the intermediate medium layer to form a groove exposing part of the pattern layer; filling a magnetic material in the groove to form a magnetic core; laminating a second dielectric layer on the surface of the intermediate dielectric layer far away from the first dielectric layer, and covering a second metal layer on the second dielectric layer to form an integral plate; drilling, hole metallization and circuit pattern processing are carried out on the integral board, and a circuit pattern and a through hole are formed; wherein the circuit pattern is connected with the via hole metal to form an annular coil. By the method, the annular coil and the magnetic core form a voltage transformation structure so as to meet the integration requirement of the circuit board.

Description

Circuit board processing method and circuit board

Technical Field

The invention relates to the technical field of PCB (printed circuit board), in particular to a circuit board processing method and a circuit board.

Background

With the increasing integration function of a single electronic product, more and more components are carried on the surface of a printed circuit board in unit area, and in order to integrate more components on the printed circuit board, embedding some components into the printed circuit board or manufacturing the components in the processing process of the printed circuit board is an important way for improving the density of the components on the printed circuit board.

The transformer is used as a common electronic component in an electronic circuit board and generally consists of a coil and a magnetic core, wherein the coil is provided with two or more windings, the winding connected with a power supply is called an input coil, and the other windings are called coupling coils. It can transform alternating voltage, current and impedance. At present, in the process of producing the transformer, firstly, an enameled wire is wound on a framework, a coil is formed after the enameled wire is wound, and then a magnetic core is installed on a framework body.

Disclosure of Invention

The application provides a circuit board processing method and a circuit board in order to solve the technical problems that in the prior art, a circuit board transformer is difficult to manufacture and the utilization rate of the circuit board is improved.

In order to solve the above problems, the present application provides a method for processing a circuit board, including: providing a core board which is pressed on one side, wherein the core board sequentially comprises a first metal layer, a first dielectric layer, a pattern layer and an intermediate dielectric layer; processing the intermediate medium layer to form a groove exposing part of the pattern layer; filling magnetic materials in the grooves to form magnetic cores; laminating a second dielectric layer on the surface of the middle dielectric layer far away from the first dielectric layer, and covering a second metal layer on the second dielectric layer to form an integral plate; drilling, metallizing holes and processing circuit patterns on the integral board to form circuit patterns and via holes; wherein, the circuit pattern and the via hole are connected to form the annular coil.

In a preferred embodiment, a toroidal coil is wound around and forms a transformer with the magnetic core.

In a preferred embodiment, the groove is a square ring groove or a circular ring groove; the step of filling the recess with a magnetic material comprises: and filling magnetic materials in the grooves to obtain a square magnetic ring or a circular magnetic ring.

The method comprises the following steps of providing a core board with a single surface pressed, wherein the core board sequentially comprises a first metal layer, a first dielectric layer, a pattern layer and an intermediate dielectric layer, and the steps comprise: the method for providing the core board with a single pressed surface comprises the following steps of: preparing a substrate sequentially comprising a first metal layer, a first dielectric layer and a copper layer; manufacturing an inner-layer circuit copper disc on the surface of the copper layer to obtain a pattern layer; wherein the copper disc is arranged corresponding to the magnetic core; and laminating an intermediate medium layer on the surface of the copper plate to obtain the core plate with one surface pressed.

In a preferred embodiment, the magnetic material comprises any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni, Fe-Cr.

In a preferred embodiment, the step of drilling, hole metallizing and circuit pattern processing the integrated board to form the circuit pattern and the via hole includes: drilling the whole body plate to obtain at least two through holes; performing electroplating metal treatment on the through hole to obtain a through hole; processing circuit patterns on the first metal layer and the second metal layer on the surface of the integral plate to obtain circuit patterns; wherein, the circuit pattern and the through hole form a ring coil.

In a preferred embodiment, the thickness of the intermediate dielectric layer is between 20 and 500 microns and the width of the groove is between 30 and 2000 microns.

In a preferred embodiment, the second dielectric layer includes two organic dielectric layers and a pattern layer, and the organic dielectric layer is disposed adjacent to the pattern layer.

The application also provides a circuit board, the circuit board includes magnetic ring and toroidal coil, toroidal coil twines the magnetic ring, is filled by organic medium between toroidal coil and the magnetic ring.

In a preferred embodiment, the magnetic ring is a square ring or a circular ring.

In a preferred embodiment, the magnetic ring material comprises any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni and Fe-Cr.

The beneficial effect of this application is: the square groove with a certain size is processed on the inner dielectric layer of the circuit board, the electroplating magnetic material is filled in the groove to form the magnetic ring, the copper circuit pattern and the through hole are interconnected and formed around the magnetic ring by adopting the mechanical through hole interconnection of the circuit board and the copper pattern processing technology, the coil and the magnetic ring are well wound to form the transformer, and the requirements of high density and integration of the circuit board are met by processing the small transformer in the circuit board manufacturing process.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic flow chart of an embodiment of a method for processing a circuit board according to the present application;

FIG. 2a is a schematic structural diagram of a first dielectric layer according to an embodiment of the present application;

FIG. 2b is a schematic structural diagram of an embodiment of a first dielectric layer with a patterned layer formed thereon according to the present application;

FIG. 2c is a schematic structural diagram of an embodiment of a core board according to the present application;

FIG. 3 is a schematic flow chart illustrating a method for manufacturing a core board according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a circuit board in the manufacturing process of step S12 in FIG. 1;

FIG. 5a is a schematic top view of a groove according to an embodiment of the present disclosure;

FIG. 5b is a schematic top view of another embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a circuit board in the manufacturing process of step S13 in FIG. 1;

FIG. 7 is a schematic structural diagram of a circuit board in the manufacturing process of step S14 in FIG. 1;

FIG. 8 is a flowchart illustrating an embodiment of step S15 of FIG. 1;

FIG. 9 is a schematic diagram of the structure of the circuit board in the manufacturing process of step S81 in FIG. 8;

fig. 10 is a schematic diagram illustrating a structural change of the circuit board in the manufacturing process of step S82 in fig. 8;

fig. 11 is a schematic diagram illustrating a structural change of the circuit board in the manufacturing process of step S83 in fig. 8;

FIG. 12a is a schematic top view of the first circuit board in the manufacturing process of step S15 in FIG. 1;

FIG. 12b is a schematic top view of the second circuit board in the manufacturing process of step S15 in FIG. 1;

FIG. 13a is a schematic side view of one embodiment of the circuit board of the present application;

FIG. 13b is a schematic top view of one embodiment of the circuit board of the present application;

FIG. 14a is a schematic diagram of a side view of another embodiment of the wiring board of the present application;

fig. 14b is a schematic top view of another embodiment of the circuit board of the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The lamination process is a common process for manufacturing an organic dielectric layer on a circuit board, and the semi-cured resin is cured on the surface of a copper circuit at high temperature and high pressure.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

The present application provides a circuit board processing method, as shown in fig. 1, fig. 1 is a schematic flow diagram of an embodiment of the circuit board processing method of the present application. The processing method comprises the following steps:

step S11: providing a core board which is pressed on one side, wherein the core board sequentially comprises a first metal layer, a first dielectric layer, a pattern layer and an intermediate dielectric layer.

Fig. 2c shows a core board structure, and fig. 2c is a schematic structural diagram of an embodiment of the core board of the present application. The core board sequentially comprises a first metal layer 120, a first dielectric layer 100, a pattern layer 111 and an intermediate dielectric layer 200.

Specifically, the method for manufacturing the core board further includes the following steps, and the flow chart is shown in fig. 3:

step S31: a substrate including a first metal layer, a first dielectric layer, and a copper layer is prepared.

Specifically, the structure of the first dielectric layer 110 is shown in fig. 2a, and fig. 2a is a schematic structural diagram of an embodiment of the first dielectric layer according to the present application. The first metal layer 120 and the copper layer 110 respectively cover the upper and lower surfaces of the first dielectric layer 100. The thickness of the copper layer 110 may be the same as or different from that of the first metal layer 120, and is selected according to the actual product performance, which is not limited herein. In this embodiment, the thickness of the copper layer 110 is the same as the thickness of the first metal layer 120. In particular, the thickness of the copper layer 110 and the first metal layer 120 may be selected between 3-100 microns. The material of the first dielectric layer 100 is an organic material, and in the embodiment, the thickness of the first dielectric layer 100 may be selected from 30 to 1000 μm. In other embodiments, the thicknesses of the first metal layer, the copper layer and the first dielectric layer may be selected according to actual production requirements of the circuit board, and the thickness in this embodiment is selected as a preferred scheme and is not limited.

Step S32: and manufacturing a copper disc on the surface of the copper layer to obtain a pattern layer. The manufacturing process of the copper disc comprises the following steps: a circuit board circuit pattern processing technology. In the present embodiment, the copper pads of the pattern layer 111 are disposed corresponding to the magnetic cores such that the magnetic cores are disposed at the corresponding locations of the copper pads. Referring to fig. 2b, fig. 2b is a schematic structural diagram of an embodiment of a first dielectric layer with a patterned layer formed thereon according to the present application.

Step S33: and laminating the intermediate medium layer 200 on the surface of the pattern layer to obtain the core board with one side pressed. The middle dielectric layer 200 is an organic dielectric layer, and the thickness of the middle dielectric layer 200 can be selected according to performance requirements, specifically, the thickness of the organic dielectric layer with a thickness of 20-500 micrometers can be selected. The resulting core plate structure is shown in fig. 2 c.

The laminating process is a process manufacturing process for solidifying semi-solidified resin on the surface of the copper circuit at high temperature and high pressure.

Step S12: and processing the intermediate medium layer to form a groove exposing part of the pattern layer.

Specifically, a groove 210 with a certain width is processed on the surface of the intermediate dielectric layer 200 corresponding to the pattern layer 111, and the specific structure is as shown in fig. 4. The intermediate dielectric layer 200 is an organic dielectric layer, and the processing means for processing the intermediate dielectric layer 200 includes laser ablation or mechanical depth-controlled drilling and then processing by the laser ablation process to obtain the groove 210. The width of the groove 210 may be machined to a width of between 30-2000 microns as performance requirements dictate. The thickness of the recess 210 is the same as that of the intermediate dielectric layer 200, so as to expose part of the pattern layer 111, wherein the thickness of the intermediate dielectric layer 200 can be selected from 20 μm to 500 μm.

In this embodiment, the groove 210 can be a square ring groove, a top view of which is shown in fig. 5a, and fig. 5a is a schematic structural view of an embodiment of the groove 210 according to the present application. In another embodiment, the groove 210 can also be a circular ring groove, and a top view thereof is shown in fig. 5b, and fig. 5b is a schematic structural view of another embodiment of the groove 210 of the present application.

Step S13: and filling the magnetic material in the groove.

Specifically, a plating process is used to deposit a magnetic material in the groove 210, wherein the magnetic material includes any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni, and Fe-Cr. Fig. 6 shows a schematic structure of the groove 210 after being filled with the magnetic material.

In this embodiment, the magnetic ring 211 is obtained after the annular groove 210 is filled with the magnetic material, and the process flow for manufacturing the magnetic ring 211 includes forming a conductive layer by electroless copper plating or nickel sputtering, and then electroplating Ni — Fe alloy to obtain the magnetic ring 211.

Step S14: and laminating a second dielectric layer on the surface of the intermediate dielectric layer, which is far away from the first dielectric layer, and covering a second metal layer on the surface of the second dielectric layer to form an integral plate.

After the middle dielectric layer 200 completes the manufacture of the magnetic ring 211: the second dielectric layer 220 and the second metal layer 230 are sequentially laminated on the surface of the middle dielectric layer 200 to form an integral board. The structure of the integral plate thereof is shown in fig. 7. The second dielectric layer 220 is an organic dielectric layer, the thickness of the second dielectric layer 220 is consistent with that of the first dielectric layer 100, and the thickness of the second metal layer 230 is consistent with that of the first metal layer 120. In this embodiment, the materials of the first dielectric layer and the second dielectric layer should be consistent.

In another embodiment, the method further comprises the following steps: and laminating a second dielectric layer, a second metal layer, a third dielectric layer and a third metal layer on the surface of the middle dielectric layer far away from the first dielectric layer in sequence. The number of layers of the second dielectric layer and the second metal layer is not limited, and the layers can be superposed according to actual needs.

In another embodiment, the first dielectric layer further includes a first organic dielectric layer, a metal layer, a second organic dielectric layer, and the like, wherein the first organic dielectric layer and the second organic dielectric layer are separated by the metal layer, and the number of layers of the first organic dielectric layer and the second organic dielectric layer is not limited.

Step S15: drilling, hole metallization and circuit pattern processing are carried out on the integral board, and a circuit pattern and a via hole are formed; wherein, the circuit pattern and the via hole are connected to form the annular coil.

Specifically, the manufacturing process is shown in fig. 8, and fig. 8 is a schematic flow chart of an embodiment of step S15, including:

step S81: the integral plate is drilled to obtain at least two through holes. Specifically, the monolithic plate is drilled using a mechanical drilling process. In this embodiment, holes are respectively drilled at both sides of the magnetic ring 211 so that the through holes are uniformly distributed at both sides of the magnetic ring 211, and thus the via holes and the line patterns form a toroidal coil surrounding the magnetic core.

In this embodiment, a hole is sequentially drilled in the entire board to obtain a first through hole 300, a second through hole 400, a third through hole 500, and a fourth through hole 600, and the specific structure is shown in fig. 9. The number of the first through holes 300, the second through holes 400, the third through holes 500 and the fourth through holes 600 is not less than 1. In other embodiments, only the first through holes 300 and the second through holes 400 may be formed, where the first through holes 300 are located on the inner ring of the magnetic ring, the second through holes 400 are located on the outer ring of the magnetic ring, and the number of the first through holes 300 and the number of the second through holes 400 are not 1.

Step S82: and carrying out electroplating metal treatment on the through hole to obtain the through hole. Specifically, the wall of the through hole is metallized to form a via hole having a certain copper thickness. The process means for metalizing the hole wall of the through hole comprises the following steps: copper deposition and copper electroplating. The structure after copper plating is shown in fig. 10, wherein the thickness of the first metal layer 120 and the second metal layer 230 is also increased during the process of metallizing the via. The thickness of the copper layer of the via hole is set according to actual conditions, and is not limited herein.

Step S83: and carrying out circuit pattern processing on the first metal layer and the second metal layer on the surface of the integral plate to obtain a circuit pattern.

In this embodiment, a circuit pattern processing method may be used to process the metal layer on the surface of the integrated board, specifically, the first metal layer 120 and the second metal layer 230 are processed to form the first circuit layer 121 and the second circuit layer 231, and the metal of the first circuit layer 121 and the second circuit layer 231 is connected to the metal of the via hole to form a loop coil, which surrounds the magnetic core. The first circuit layer 121 and the second circuit layer 231 respectively include parallel metal circuit patterns, the circuit patterns and the via holes form non-closed loop coils around the magnetic ring 211, and the loop coils and the magnetic ring 211 form a transformer.

In this embodiment, the structure of the loop coil formed by connecting the circuit layer and the via hole is shown in fig. 11. Specifically, the via holes are respectively connected to the first circuit layer 121 and the second circuit layer 231 to electrically connect the first circuit layer 121 and the second circuit layer 231. The circuit layer connects the first via hole 300 and the second via hole 400, and the third via hole 500 and the fourth via hole 600, respectively, to form two sets of coils. Fig. 12a and 12b are top views of the circuit board, where fig. 12a is a top view of the circuit board with the first circuit layer 121 as an upper surface, and fig. 12b is a top view of the circuit board with the second circuit layer 231 as an upper surface. The first wiring layer 121 and the second wiring layer 231 do not intersect in a top view projection. The first circuit layer 121 and the second circuit layer 231 respectively intersect with the first via hole 300 and the second via hole 400, and the third via hole 500 and the fourth via hole 600 two by two to form a multilayer continuous and non-intersecting annular coil.

The beneficial effect of this embodiment is: the square groove with a certain size is processed on the inner dielectric layer of the circuit board, the electroplated magnetic material is filled in the groove to form the magnetic core, the copper circuit pattern and the through hole are interconnected and formed by adopting the mechanical through hole interconnection and the copper pattern processing technology of the circuit board around the magnetic core, the good winding of the coil and the magnetic core is realized, the transformer is formed, the high-density and integration requirements of the circuit board are met by processing the miniature transformer in the circuit board manufacturing process, and the characteristics of the circuit board are not influenced.

Fig. 13a and 13b are schematic side view and fig. 13a is schematic top view of an embodiment of a circuit board of the present application. This circuit board includes: the circuit board comprises a magnetic ring 1 and a ring coil 2, wherein the ring coil 2 and the magnetic ring 1 are arranged in a surrounding and spaced mode, and an organic dielectric layer is wrapped between the ring coil 2 and the magnetic ring 1.

Specifically, the magnetic ring 1 is horizontally arranged on the middle medium layer 200, the center of the magnetic ring 1 is overlapped with the center of the middle medium layer 200, the magnetic ring 1 has a certain width and thickness, and the thickness of the magnetic ring 1 is the same as that of the middle medium layer 200, that is, the magnetic ring 1 penetrates through the middle medium layer 200. Preferably, the width of the magnetic ring 1 is 30-2000 microns, namely, the radius difference between the outer ring and the inner ring of the magnetic ring 1 is 30-2000 microns. The upper surface and the lower surface of the middle dielectric layer 200 are also provided with circuit copper layers, wherein the patterns of the circuit copper layers are arranged corresponding to the magnetic ring 1. The upper and lower surfaces of the magnetic ring 1 are further provided with a first dielectric layer 100 and a second dielectric layer 220, the surfaces of the first dielectric layer 100 and the second dielectric layer 220 away from the magnetic ring 1 are provided with a first coil layer 121 and a second coil layer 231, and the circuit patterns of the first coil layer 121 and the second coil layer 231 are shown in fig. 13 b. The inner ring and the outer ring of the magnetic ring 1 are respectively provided with a via hole, in this embodiment, the outer ring of the magnetic ring 1 is provided with a first via hole 310 and a fourth via hole 610, and the inner ring of the magnetic ring 1 is provided with a second via hole 410 and a third via hole 510, wherein the number of the first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 is not 1. The first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 respectively penetrate through the first coil layer 121 and the second coil layer 231, and metal layers of the first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 are connected with the first coil layer 121 and the second coil layer 231 to form a coil. Specifically, the first coil layer 121 and the second coil layer 231 connect the first via hole 310 and the second via hole 410, so that the first coil layer 121, the first via hole 310, the second coil layer 231 and the second via hole 410 form a non-closed coil, wherein the coil surrounds the magnetic core 1 to form a small transformer. The first coil layer 121 and the second coil layer 231 connect the third via hole 510 and the fourth via hole 610, so that the first coil layer 121, the third via hole 510, the second coil layer 231, and the fourth via hole 610 form a non-closed coil.

In this embodiment, the magnetic ring 1 is a square ring. In a preferred embodiment, the non-closed coil surrounds the periphery of the core 1.

In this embodiment, a voltage input device and a voltage output device are further disposed on the surface of the first coil layer 121 and/or the second coil layer 231.

In this embodiment, the material of the magnetic ring 1 includes any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni, and Fe-Cr.

In this embodiment, the number of layers of the first dielectric layer 100 and the second dielectric layer 200 may include multiple dielectric layers and multiple copper layers, which is not limited herein.

The beneficial effect of this embodiment is: the magnetic core and the coil are manufactured on the inner dielectric layer of the circuit board, so that more devices can be integrated on the circuit board, and the requirement that more devices are carried on the surface of the circuit board in unit area of the circuit board is met.

The application also provides a schematic structural diagram of another implementation mode of the circuit board. The structure is shown in fig. 14a-14b, fig. 14a is a schematic side view structure diagram of another embodiment of the circuit board of the present application, and fig. 14b is a schematic top view structure diagram of another embodiment of the circuit board of the present application. This circuit board includes: the circuit board comprises a magnetic ring 1 and an annular coil 2, wherein the annular coil 2 and the magnetic ring 1 are arranged in a surrounding and spaced mode, and an organic dielectric layer and a circuit copper layer are wrapped between the annular coil 2 and the magnetic ring 1.

Specifically, the magnetic ring 1 is horizontally arranged on the middle medium layer 200, the center of the magnetic ring 1 is overlapped with the center of the middle medium layer 200, the magnetic ring 1 has a certain width and thickness, and the thickness of the magnetic ring 1 is the same as that of the middle medium layer 200. The upper surface and the lower surface of the middle dielectric layer 200 are provided with a first circuit copper layer and a second circuit copper layer, wherein the patterns of the first circuit copper layer and the second circuit copper layer are arranged corresponding to the magnetic ring 1. The upper and lower surfaces of the first circuit copper layer and the second circuit copper layer, which are far away from the magnetic ring 1, are further provided with a first dielectric layer 120 and a second dielectric layer 210, the surfaces of the first dielectric layer 120 and the second dielectric layer 210, which are far away from the first circuit copper layer and the second circuit copper layer, are further provided with a third copper layer and a fourth copper layer, the surfaces of the third copper layer and the fourth copper layer, which are far away from the first dielectric layer 120 and the second dielectric layer 210, are provided with a third dielectric layer 100 and a fourth dielectric layer 220, and the surfaces of the third dielectric layer 100 and the fourth dielectric layer 220, which are far away from the third copper layer and the fourth copper layer, are provided with a first coil layer 121 and a second coil layer 231. In this embodiment, the outer ring of the magnetic ring 1 is provided with the first via hole 310 and the fourth via hole 610, and the inner ring of the magnetic ring 1 is provided with the second via hole 410 and the third via hole 510, wherein the number of the first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 is not 1. The first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 respectively penetrate through the first coil layer 121 and the second coil layer 231, and metal layers of the first via hole 310, the second via hole 410, the third via hole 510 and the fourth via hole 610 are connected with the first coil layer 121 and the second coil layer 231 to form a coil. Specifically, the first coil layer 121 and the second coil layer 231 connect the first via hole 310 and the second via hole 410, so that the first coil layer 121, the first via hole 310, the second coil layer 231 and the second via hole 410 form a non-closed coil, wherein the coil surrounds the magnetic ring 1 to form a miniature transformer. The first coil layer 121 and the second coil layer 231 connect the third via hole 510 and the fourth via hole 610, so that the first coil layer 121, the third via hole 510, the second coil layer 231 and the fourth via hole 610 form a non-closed coil, and the coil surrounds the magnetic ring 1 to form a transformer.

In the present embodiment, the first coil layer 121 and/or the second coil layer 231 are provided with a voltage input component and a voltage output component on the surface.

In the embodiment, the magnetic ring 1 is a square ring, and the material of the magnetic ring 1 includes any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni and Fe-Cr.

The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A method of processing a circuit board, the method comprising:

providing a core board which is pressed on one side, wherein the core board sequentially comprises a first metal layer, a first dielectric layer, a pattern layer and an intermediate dielectric layer;

processing the intermediate medium layer to form a groove exposing part of the pattern layer;

filling a magnetic material in the groove to form a magnetic core;

laminating a second dielectric layer on the surface of the intermediate dielectric layer far away from the first dielectric layer, and covering a second metal layer on the second dielectric layer to form an integral plate;

drilling, hole metallization and circuit pattern processing are carried out on the integral board, and a circuit pattern and a through hole are formed; wherein the circuit pattern is connected with the via hole metal to form an annular coil.

2. The method for processing a circuit board according to claim 1, wherein the toroidal coil is wound around the magnetic core and the magnetic core to form a transformer.

3. The wiring board processing method according to claim 1,

the groove is a square ring groove or a circular ring groove;

the step of filling the recess with a magnetic material comprises: and filling magnetic materials in the grooves to obtain a square magnetic ring or a circular magnetic ring.

4. The method for processing a circuit board according to claim 1, wherein the step of providing the core board with a single-sided laminated structure, the core board sequentially comprising the first metal layer, the first dielectric layer, the pattern layer and the intermediate dielectric layer comprises:

preparing a substrate sequentially comprising a first metal layer, a first dielectric layer and a copper layer;

manufacturing an inner-layer circuit copper disc on the surface of the copper layer to obtain the pattern layer; the copper disc is arranged corresponding to the magnetic core;

and laminating an intermediate medium layer on the surface of the copper plate to obtain the core plate with one surface pressed.

5. The method for processing a circuit board according to claim 1, wherein the magnetic material comprises any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni and Fe-Cr.

6. The method for processing the circuit board according to claim 1, wherein the first dielectric layer and the second dielectric layer have the same thickness, and the first metal layer and the second metal layer have the same thickness.

7. The method for processing a circuit board according to claim 1, wherein the step of drilling, hole metallization and circuit pattern processing the integrated board to form a circuit pattern and a via hole comprises:

drilling the whole body plate to obtain at least two through holes;

performing electroplating metal treatment on the through hole to obtain a through hole;

performing circuit pattern processing on the first metal layer and the second metal layer on the surface of the integral plate to obtain a circuit pattern;

wherein the circuit pattern and the via hole form a ring-shaped coil.

8. A circuit board is characterized by comprising a magnetic ring and a ring-shaped coil, wherein the ring-shaped coil is wound around the magnetic ring, and an organic medium is filled between the ring-shaped coil and the ring-shaped magnetic core.

9. The circuit board of claim 8, wherein the magnetic ring is a square ring or a circular ring.

10. The circuit board of claim 8, wherein the magnetic ring material comprises any one or more of Ni, Ni-Cr, Ni-Fe, Fe-Co-Ni, and Fe-Cr.