CN114675383B

CN114675383B - Optical module

Info

Publication number: CN114675383B
Application number: CN202210331564.8A
Authority: CN
Inventors: 吴涛; 邵乾; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2024-08-16
Anticipated expiration: 2042-03-30
Also published as: CN114675383A; CN118284836A

Abstract

The optical module provided by the application comprises a circuit board and an optical emission assembly, wherein the circuit board is provided with a jack with an opening at one side; the light emitting assembly comprises a second emitting shell, an upper cover plate, a laser, a second light path translation prism and a light collimator, wherein a clamping groove is formed in the outer side wall of the second emitting shell, the clamping groove is inserted into the jack through an opening, the upper side of the clamping groove is positioned on the front side of the circuit board, and the lower side of the clamping groove is positioned on the back side of the circuit board; the second emission shell comprises a mounting groove, and the upper cover plate covers the opening side of the top surface of the mounting groove; one end of the mounting groove is provided with a notch, and a circuit board on one side of the jack extends into the notch to be connected in a sealing way; the laser is arranged in the mounting groove and is electrically connected with the circuit board extending into the notch; the second light path translation prism is arranged in the mounting groove and is used for moving the laser beam positioned on the front surface of the circuit board upwards; one end of the light collimator is inserted into the mounting groove the other end is connected with the optical fiber in a sealing way. The application realizes the complete airtight packaging of the optical path through the unique structural design of the light emitting component.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

With the increase of communication rate, although the power consumption per unit bandwidth is decreasing, the overall power consumption of the optical module is still further increasing, and the heat dissipation mode adopted in the client device is mostly air cooling, and for a high-speed transmission system, the heat dissipation capability of the high-speed transmission system has reached a limit. To overcome the dilemma of air cooling, various liquid cooling methods have been studied, one of which is to immerse the switch in a cooling liquid such as a fluorinated liquid (FC-40).

However, due to the low cost requirement of the optical module deployed in the data center, the optical transmitting and receiving components of the optical module mostly adopt non-sealing design structures, and key optical paths of the optical module are in an open state, and when the optical module enters the refrigerating fluid along with the switch, the key optical paths and the components also enter the refrigerating fluid, so that the optical mechanism is changed and the optical surface is polluted, and the normal operation of the optical module is seriously affected.

Disclosure of Invention

The embodiment of the application provides an optical module, which is used for realizing the complete airtight packaging of an optical light path in the optical module, further realizing the long-term and reliable work of the optical module in a liquid cooling environment and improving the heat dissipation effect of the optical module.

The application provides an optical module, comprising:

the circuit board is provided with a jack, and one side of the jack is provided with an opening;

The light emitting assembly is electrically connected with the circuit board and is used for emitting light signals;

the optical fiber adapter is connected with the light emitting component through an optical fiber;

wherein the light emitting assembly comprises:

The second emission shell is provided with a clamping groove on the outer side wall, the clamping groove is inserted into the jack through the opening, the upper side of the clamping groove is positioned on the front side of the circuit board, and the lower side of the clamping groove is positioned on the back side of the circuit board; the optical fiber adapter comprises a mounting groove, wherein an opening is formed in the top surface of the mounting groove, a notch is formed in one end, facing away from the optical fiber adapter, of the mounting groove, a circuit board on one side of the jack extends into the notch, and the circuit board is connected with the notch in a sealing mode;

an upper cover plate, wherein the sealing cover is closed at the opening side of the mounting groove;

The laser is arranged in the mounting groove, is electrically connected with the circuit board extending into the notch and is used for generating laser beams;

The second light path translation prism is arranged in the mounting groove and is used for upwards moving the laser beam positioned on the front surface of the circuit board;

One end of the light collimator is inserted into the mounting groove, and the other end of the light collimator is connected with the optical fiber in a sealing way; and the second transmitting shell is connected with the outer side wall of the second transmitting shell in a sealing way.

The optical module comprises a circuit board, an optical emission assembly electrically connected with the circuit board and an optical fiber adapter connected with the optical emission assembly through an optical fiber, wherein the circuit board is provided with a jack, and one side of the jack is provided with an opening; the light emitting assembly comprises a second emitting shell, an upper cover plate, a laser, a second light path translation prism and a light collimator, wherein a clamping groove is formed in the outer side wall of the second emitting shell and is inserted into the jack through an opening, the upper side of the clamping groove is positioned on the front side of the circuit board, and the lower side of the clamping groove is positioned on the back side of the circuit board; the second emission shell comprises a mounting groove, an opening is formed in the top surface of the mounting groove, and an upper cover plate covers the opening side of the mounting groove, so that the upper cover plate and the second emission shell jointly form a cavity structure; the mounting groove of the second emission shell is provided with a notch at one end facing away from the optical fiber adapter, a circuit board at one side of the jack stretches into the notch, the circuit board is connected with the notch in a sealing way, and thus the upper cover plate, the second emission shell and the circuit board form a part of the closed shell together; the laser is arranged in the mounting groove and is electrically connected with the circuit board extending into the notch, so that the height of the wire bonding surface of the laser is the same as the front surface of the circuit board during assembly, and the connection wire bonding of the laser and the circuit board is the shortest; the second light path translation prism is arranged in the mounting groove and is used for upwards moving the laser beam positioned on the front surface of the circuit board, so that part of optical devices, particularly the optical collimator and the optical fiber, are upwards moved to the position above the circuit board, the area of the jack on the circuit board can be reduced, the jack is formed to be rectangular, and the gluing sealing treatment is conveniently carried out at the contact position of the second emission shell and the circuit board; one end of the light collimator is inserted into the mounting groove of the second emission shell, the other end of the light collimator is in sealing connection with the optical fiber, and the light collimator is in sealing connection with the outer side wall of the second emission shell, so that the sealing performance of the inner cavity of the second emission shell can be realized through the light collimator. The light emitting assembly comprises a light emitting device, an upper cover plate, a second emitting shell, a light collimator and an optical fiber, wherein one end of the second emitting shell is provided with a notch, a circuit board stretches into the notch, the circuit board, the second emitting shell and the upper cover plate form a part of a closed shell together, and the circuit board, the second emitting shell and the upper cover plate are matched with the light collimator to form a complete closed cavity structure. The application can realize the complete airtight package of the free optical path in the optical module by the unique structural design and arrangement of the light emitting component, thereby realizing the long-term and reliable work of the optical module in the liquid cooling environment and greatly improving the heat dissipation effect of the optical module.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

Fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

Fig. 5 is an assembly schematic diagram of an optical transmitting assembly, an optical receiving assembly, a circuit board and an optical fiber in an optical module according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present application;

fig. 7 is a schematic diagram of a partial assembly of a light emitting assembly and a circuit board in an optical module according to an embodiment of the present application;

fig. 8 is a schematic diagram of a turnover structure of a light emitting component in a light module according to an embodiment of the present application;

FIG. 9 is a schematic view illustrating another angular partial assembly of a light emitting module and a circuit board in an optical module according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a transmitting housing in an optical module according to an embodiment of the present application;

Fig. 11 is a schematic view of another angle structure of a transmitting housing in an optical module according to an embodiment of the present application;

fig. 12 is a partial assembled sectional view of a light emitting assembly and a circuit board in an optical module according to an embodiment of the present application;

Fig. 13 is another schematic view of a partial assembly of a light emitting module and a circuit board in an optical module according to an embodiment of the present application;

fig. 14 is a schematic diagram of a turnover structure of a light receiving component in an optical module according to an embodiment of the present application;

fig. 15 is a schematic view of another angle structure of a light receiving component in a light module according to an embodiment of the present application;

fig. 16 is a partial assembled sectional view of a light receiving assembly and a circuit board in an optical module according to an embodiment of the present application;

Fig. 17 is an assembly schematic diagram of another light emitting component, light receiving component, circuit board and optical fiber in an optical module according to an embodiment of the present application;

fig. 18 is a schematic diagram illustrating a partial assembly of another light emitting component and a circuit board in an optical module according to an embodiment of the present application;

fig. 19 is a schematic structural diagram of another circuit board in an optical module according to an embodiment of the present application;

Fig. 20 is a schematic structural diagram of another light emitting component in an optical module according to an embodiment of the present application;

fig. 21 is a schematic structural diagram of another emission housing in an optical module according to an embodiment of the present application;

Fig. 22 is a schematic view of another angle structure of another emission housing in an optical module according to an embodiment of the present application;

Fig. 23 is a schematic diagram of an exploded structure of another light emitting component in an optical module according to an embodiment of the present application;

Fig. 24 is a schematic view of a third angle structure of another emission housing in an optical module according to an embodiment of the present application;

Fig. 25 is a schematic fourth angular structure of another emission housing in an optical module according to an embodiment of the present application;

fig. 26 is a schematic partial structure of another light emitting component in an optical module according to an embodiment of the present application;

fig. 27 is a cross-sectional view of another light emitting component in an optical module according to an embodiment of the present application;

Fig. 28 is a partial assembled sectional view of another light emitting component and a circuit board in an optical module according to an embodiment of the present application;

fig. 29 is an assembly schematic diagram of another circuit board and a light receiving assembly in an optical module according to an embodiment of the present application;

fig. 30 is a schematic view illustrating a partial assembly of an optical fiber and a housing in an optical module according to an embodiment of the application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments (some embodiments)", "exemplary embodiment (exemplary embodiments)", "example (example)", "specific example (some examples)", etc. are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C" and includes the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical line terminal (Optical LINE TERMINAL, OLT) or the like in addition to the Optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver device inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member located on an outer wall of the housing thereof, the unlocking member being configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking component is located on the outer walls of the two lower side plates of the lower housing 202, including a snap-in component that mates with the cage of the host computer (e.g., cage 106 of optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component; when the unlocking component is pulled, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module 200 and the upper computer is relieved, and the optical module 200 can be pulled out of the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

The optical transceiver device includes an optical transmitting assembly 400 and an optical receiving assembly 500, which are respectively used for realizing the transmission of the optical signal and the reception of the optical signal. The light emitting assembly 400 generally includes a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively located at different sides of the light emitter, the front and back sides of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted from the front of the light emitter, so that the light beams emitted from the light emitter become parallel light or converging light, and are conveniently coupled to an external optical fiber through appropriate steps and modes.

The light receiving assembly 500 generally includes a receiving chip and a transimpedance amplifier, the receiving chip is configured to convert a received external light signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300, and the electrical signal is transmitted to the host computer via the gold finger.

Because of the low cost requirement, the optical modules deployed in the data center mostly adopt non-sealing structure designs of the optical transmitting assembly 400 and the optical receiving assembly 500, and the key optical paths are all in an open state. When the optical module enters the refrigerating fluid along with the exchanger, the key optical paths and components are immersed in the refrigerating fluid, so that the optical mechanism is changed, the optical surface is polluted, and the normal operation of the optical module is seriously influenced.

In order to solve the above problems, the embodiment of the application provides an optical module, which adopts an innovative structural design, realizes all closed packaging of all optical paths inside the optical module, further realizes long-term and reliable operation of the optical module in a liquid cooling environment, and greatly improves the heat dissipation effect of the light emitting component 400 and the light receiving component 500 in the optical module.

Fig. 5 is an assembly schematic diagram of a circuit board, a light emitting assembly, a light receiving assembly and an optical fiber in an optical module according to an embodiment of the present application. As shown in fig. 5, the optical module provided by the embodiment of the application includes a light emitting component 400, a light receiving component 500 and an optical fiber 600, wherein the light emitting component 400 adopts a light emitter structure with an upward (flip-chip) bottom surface, so that the bottom surface of the light emitting component 400 contacts with the upper housing 201, thereby greatly improving heat dissipation of the light emitting component 400; a bundle of optical fibers 600 is connected to the light emitting assembly 400, and the emitted light beam emitted from the light emitting assembly 400 is transmitted through the optical fibers 600 to achieve light emission.

The light receiving assembly 500 and the light emitting assembly 400 may be disposed at the same side of the circuit board 300, and another bundle of optical fibers 600 is connected to the light receiving assembly 500, and external optical signals are transmitted to the light receiving assembly 500 through the optical fibers 600, and are photoelectrically converted by the light receiving assembly 500 to achieve light reception.

In a general design, the main optical path of the light emitting assembly 400 is located on a single plane, so that the circuit board 300 needs to dig out a large area to avoid the positions required by the light emitting assembly 400 and the optical fibers, which results in a large hole digging of the circuit board 300, and the shape of the hole digging is complex, so that not only is the arrangement space of electronic components greatly reduced, but also difficulty is caused to glue sealing.

The application digs holes on the circuit board 300, the laser in the light emitting component 400 is arranged on the back side of the circuit board 300, and a light path translation prism is added in the light emitting direction of the laser, so that the whole light path is moved to the front side of the circuit board, thus the digging hole area on the circuit board 300 can be reduced, and the light emitting component 400 is conveniently sealed on the back side of the circuit board 300.

Fig. 6 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present application, and fig. 7 is a schematic partial assembly diagram of a circuit board and an optical emission assembly in an optical module according to an embodiment of the present application. As shown in fig. 6 and 7, the circuit board 300 is provided with a mounting through hole 320, and the laser assembly of the light emitting assembly 400 is embedded in the mounting through hole 320 to be close to the lower surface (back surface) of the circuit board 300, so that the light emitting assembly 400 is reversely assembled to the circuit board 300 such that the wire bonding surface of the laser assembly is the same height as the back surface of the circuit board 300 at the time of assembly, thereby minimizing the wire bonding of the back surface of the circuit board 300 to the connection of the laser assembly to ensure excellent high frequency transmission performance.

The light emitting assembly 400 may include a first emitting housing 401 and an emitting cover plate 402, the laser assembly is disposed in the first emitting housing 401, and the first emitting housing 401 is covered on the front side of the circuit board 300 and is connected with the front side of the circuit board 300 in a sealing manner; the transmitting cover plate 402 is disposed on the back side of the circuit board 300, and the transmitting cover plate 402 is covered on the mounting through hole 320 and is connected with the back surface of the circuit board 300 in a sealing manner, so that the first transmitting housing 401, the circuit board 300 and the transmitting cover plate 402 form a sandwich structure.

Fig. 8 is a schematic diagram of a turnover structure of a light emitting component in a light module according to an embodiment of the present application, and fig. 9 is a schematic diagram of another angle partial assembly of a circuit board and a light emitting component in a light module according to an embodiment of the present application. As shown in fig. 8 and 9, the light emitting assembly 400 may include a first emitting housing 401 and a laser 410, a collimating lens 420, a first optical path translating prism 430, an optical isolator 450 and a light collimator 460 disposed in the first emitting housing 401, wherein a bottom surface (a surface facing away from a front surface of the circuit board 300) of the first emitting housing 401 faces the upper housing 201, the first emitting housing 401 includes a mounting cavity, the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical isolator 450 and the light collimator 460 are all mounted in the mounting cavity in the first emitting housing 401, and the mounting heights of the laser 410, the collimating lens 420 and the first optical path translating prism 430 are higher than the mounting heights of the optical isolator 450 and the light collimator 460, such that the laser 410, the collimating lens 420 and the first optical path translating prism 430 are located on a back side of the circuit board 300 through a mounting through hole 320 on the circuit board 300, and the optical isolator 450 and the light collimator 460 are located on a front side of the circuit board 300.

In some embodiments, an end of the mounting cavity in the first emission housing 401 facing the front surface of the circuit board is provided with an opening, and the mounting cavity is communicated with the mounting through hole 320 on the circuit board 300 through the opening, so that the laser 410 disposed in the mounting cavity can be embedded into the mounting through hole 320 through the opening, so that the wire bonding mounting height of the laser 410 is the same as the back surface of the circuit board 300.

One path of laser beam emitted by the laser 410 is converted into a collimated beam by the collimating lens 420, the collimated beam reflects the collimated beam positioned on the back side of the circuit board 300 to the front side of the circuit board 300 by the first optical path translation prism 430, the laser beam reflected by the first optical path translation prism 430 is directly emitted into the optical collimator 460 by the optical isolator 450, is emitted into the optical fiber 600 by the optical collimator 460, and is transmitted to the optical fiber adapter 700 by the optical fiber 600, so that the emission of one path of optical signal is realized.

In some embodiments, by adding an optical path translating prism behind the collimating lens 420, the entire optical path is moved to the front side of the circuit board 300, which reduces the area of the hole cut in the circuit board 300 and also facilitates sealing the light emitting assembly 400 at the back side of the circuit board 300.

For an optical module with a high transmission rate, such as 400G, to achieve the transmission rate of the 400G optical module, 4 optical transmitters and 4 optical receivers need to be integrated, so the optical transmitting assembly 400 includes 4 optical transmitters to achieve the transmission of 4 transmitting beams; the light receiving assembly 500 includes 4 light receivers to achieve reception of 4 reception light beams.

Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, a first optical path translating prism 430, an optical combiner 440, an optical isolator 450 and an optical collimator 460 disposed in the first emitting housing 401, the plurality of lasers 410, the plurality of collimating lenses 420, the first optical path translating prism 430, the optical combiner 440, the optical isolator 450 and the optical collimator 460 are all mounted in the mounting cavity of the first emitting housing 401, and the mounting heights of the lasers 410, the collimating lenses 420 and the first optical path translating prism 430 are Yu Guangge, the mounting heights of the optical isolator 440 and the optical isolator 450 are high.

The plurality of lasers 410 and the plurality of collimating lenses 420 are positioned on the back side of the circuit board 300 through the mounting through holes 320, one end of the first optical path translating prism 430 is positioned on the back side of the circuit board 300 through the mounting through holes 320, the other end is positioned on the front side of the circuit board 300, and the optical multiplexer 440, the optical isolator 450 and the optical collimator 460 are positioned on the front side of the circuit board 300.

The plurality of lasers 410 emit laser beams, respectively, which are parallel to the back surface of the circuit board 300; the plurality of collimating lenses 420 convert the laser beam emitted from the laser 410 into a collimated beam, and the plurality of collimated beams are transmitted to the first optical path translating prism 430, and the first optical path translating prism 430 reflects the laser beam located on the back side of the circuit board 300 to the front side of the circuit board 300.

The first optical path translating prism 430 is used to translate the multiple beams upward a distance so that all subsequent optics positions are on the front side of the circuit board 300 and maintain proper clearance from the circuit board 300. In this way, the position conflict between the optical device and the circuit board 300 is avoided, so that the hole digging area of the circuit board 300 can be reduced as much as possible, the arrangement area of the electronic devices on the circuit board 300 is increased, and the wiring of the circuit board 300 is easier.

The right side of the optical combiner 440 may include four light inlets for inputting signal light of various wavelengths, each light inlet for inputting signal light of one wavelength; the left side of the optical combiner 440 includes an optical outlet for outgoing light. Taking 4 wavelengths of λ1, λ2, λ3 and λ4 incident by the optical multiplexer 440 as an example, λ1 signal light enters the optical multiplexer 440 through the first light inlet, and is reflected by six different positions in the optical multiplexer 440 for six times to reach the light outlet; the lambda 2 signal light enters the optical multiplexer 440 through the second light inlet, and reaches the light outlet after four different reflections at four different positions in the optical multiplexer 440; the lambda 3 signal light enters the optical multiplexer 440 through the third light inlet, and is reflected twice and differently at two different positions in the optical multiplexer 440 to reach the light outlet; the λ4 signal light enters the optical multiplexer 440 through the fourth light inlet, and is directly transmitted to the light outlet. Thus, the optical multiplexer 440 can input signal light with different wavelengths through different light inlets and output signal light with different wavelengths through the same light outlet, thereby realizing the optical combination of the signal light with different wavelengths.

One end of the light collimator 460 is inserted into the installation cavity of the first emission housing 401, and the other end is connected with the optical fiber 600 in a sealing manner, i.e. one end of the optical fiber 600 is inserted into the light collimator 460, and the sealing connection between the optical fiber 600 and the light collimator 460 is realized through glue. The composite beam output by the optical combiner 440 is coupled into the optical fiber 600 via the optical collimator 460, so that the emission of one beam is realized.

In some embodiments, a gap exists between the light incident surface of the light collimator 460 and the light combiner 440, when the composite beam output by the light combiner 440 is transmitted to the light incident surface of the light collimator 460, the composite beam is reflected when transmitted to the light incident surface of the light collimator 460 due to reflection caused by the propagation of light at interfaces of different media, and the reflected beam may return to the laser 410 in the original path, which affects the high-frequency performance of the laser 410.

To avoid this problem, an optical isolator 450 is disposed between the optical combiner 440 and the optical collimator 460, and when the composite beam emitted from the optical combiner 440 is reflected on the light incident surface of the optical collimator 460, the optical isolator 450 is used to isolate the reflected beam, so as to prevent the reflected beam from returning to the laser 410 along the original path.

The light collimator 460 may include a sleeve, a focusing lens and a single-mode fiber flange, the sleeve is sleeved on the outer sides of the focusing lens and the single-mode fiber flange, the optical fiber 600 is inserted in the single-mode fiber flange, the light incident surface of the focusing lens faces the optical isolator, the light emergent surface faces the single-mode fiber flange, the composite light beam output by the optical combiner is transmitted to the focusing lens through the optical isolator, and the focusing lens converges the composite light beam to the optical fiber 600 in the single-mode fiber flange.

The focusing lens can be a cylindrical lens, and the outer diameter of the cylindrical lens and the outer diameter of the single-mode fiber flange can be slightly smaller than the inner diameter of the sleeve, so that the coupling degree of the focusing lens and the single-mode fiber flange is ensured. When the focusing lens and the single-mode fiber flange are inserted into the sleeve, the focusing lens and the single-mode fiber flange can be axially moved only in order to improve the coupling degree of the focusing lens and the single-mode fiber flange.

In order to facilitate the composite light beam transmitted through the optical isolator 450 to be emitted into the focusing lens, the focusing lens protrudes out of the sleeve, so that the distance between the light incident surface of the focusing lens and the light emergent surface of the optical isolator 450 is reduced, and the structure is more compact.

In other embodiments, the cylindrical lens may be separated from the single mode fiber flange, in which case the cylindrical lens would be changed to a rectangular lens for ease of installation, and the position of the lens would need to be adjusted separately for coupling purposes.

In some embodiments, the light emitting assembly 400 includes 4 lasers, 4 collimating lenses and one optical path translating prism, the lasers 410 are arranged in a one-to-one correspondence with the collimating lenses 420, each laser 410 emits a laser beam, each collimating lens 420 converts the laser beam into a collimated beam, the collimated beam emitted by each collimating lens 420 is transmitted to the first optical path translating prism 430, and the collimated beam is reflected by the first optical path translating prism 430 to change the transmission direction and position of the laser beam.

After the multiple laser beams on the back side of the circuit board 300 are reflected to the front side of the circuit board 300 by the first optical path translation prism 430, the multiple laser beams are combined into one composite beam by the optical combiner 440, and the composite beam is coupled to the optical fiber adapter 700 by the optical collimator 460 and the optical fiber 600, so as to realize the emission of multiple optical signals.

Fig. 10 is a schematic structural diagram of a first emission housing in an optical module according to an embodiment of the present application, and fig. 11is another schematic angular structural diagram of the first emission housing in the optical module according to an embodiment of the present application. As shown in fig. 10 and 11, to support and fix the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical multiplexer 440 and the optical isolator 450, the first emission housing 401 includes a first contact surface 4011, and the first contact surface 4011 is hermetically connected to the front surface of the circuit board 300, so as to realize the sealed connection between the first emission housing 401 and the front surface of the circuit board 300; a mounting cavity is provided in the direction from the first contact surface 4011 toward the upper housing 201, and includes a first mounting surface 4110, a second mounting surface 4120, and a third mounting surface 4130, the third mounting surface 4130 being recessed from the second mounting surface 4120, the second mounting surface 4120 being recessed from the first mounting surface 4110, and the first mounting surface 4110 being recessed from the first contact surface 4011. That is, the distance between the third mounting surface 4130 and the front surface of the circuit board 300 is greater than the distance between the second mounting surface 4120 and the front surface of the circuit board 300, the distance between the second mounting surface 4120 and the front surface of the circuit board 300 is greater than the distance between the first mounting surface 4110 and the front surface of the circuit board 300, and the first mounting surface 4110 does not contact the front surface of the circuit board 300, so that the first mounting surface 4110, the second mounting surface 4120, and the third mounting surface 4130 form a stepped surface with the first contact surface 4011.

In some embodiments, the mounting cavities forming the first mounting face 4110, the second mounting face 4120, and the third mounting face 4130 are provided with openings only at the ends facing the front side of the circuit board 300, and the first mounting face 4110 is provided with a semiconductor refrigerator 470, through which the semiconductor refrigerator 470 is inserted into the mounting through-hole 320 on the circuit board 300. Each laser 410 is disposed on a laser substrate, each laser substrate and the collimator lens 420 are disposed on the cooling surface of the semiconductor refrigerator 470, and the collimator lens 420 is disposed in the light emitting direction of the laser 410, so that the laser 410 and the collimator lens 420 are located on the back side of the circuit board 300 through the mounting through hole 320.

The first optical path translating prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110, and the first optical path translating prism 430 is vertically fixed on the second mounting surface 4120, i.e., one end of the first optical path translating prism 430 is fixed on the second mounting surface 4120, and the other end is located on the back side of the circuit board 300, so that the laser beam located on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 by the first optical path translating prism 430.

The optical combiner 440 is disposed on the second mounting surface 4120, and the optical combiner 440 is disposed in the outgoing direction of the reflected light of the first optical path shift prism 430, so that the multiple laser beams reflected by the first optical path shift prism 430 are incident into the optical combiner 440.

The optical isolator 450 is disposed on the third mounting surface 4130 recessed in the second mounting surface 4120, and the optical isolator 450 is positioned in the light emitting direction of the optical combiner 440, so that the composite light beam output from the optical combiner 440 passes through the optical isolator 450.

The end of the first emission housing 401 facing away from the laser 410 is provided with a through hole 4140, and the through hole 4140 is communicated with the installation cavity of the first emission housing 401, so that the light collimator 460 is inserted into the installation cavity of the first emission housing 401 through the through hole 4140, and the light incident surface of the light collimator 460 is arranged corresponding to the light emergent surface of the optical isolator 450, so that the composite light beam passing through the optical isolator 450 is injected into the light collimator 460 to be injected into the optical fiber 600.

In some embodiments, when the light collimator 460 is inserted into the mounting cavity of the first emission housing 401 through the through hole 4140, the light collimator 460 is connected with the outer side wall of the first emission housing 401 in a sealing manner, so that the light collimator 460 is connected with the through hole 4140 in a sealing manner, and after the first emission housing 401 is covered on the front surface of the circuit board 300, the sealing performance of the mounting cavity in the first emission housing 401 can be achieved by matching with the light collimator 460.

In some embodiments, the UV curing glue and the structural curing glue adopted by the glue for bonding and sealing are epoxy resin glue, and the glue has good fluidity and high reliability, and can meet the requirement of stable work in fluoridized liquid for a long time.

In some embodiments, the semiconductor refrigerator, the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical multiplexer 440 and the optical isolator 450 are fixed on the mounting surface of the inner cavity of the first emission housing 401 through the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 which are arranged in steps, so as to form a mounting height difference between the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical multiplexer 440 and the optical isolator 450, and the laser 410 and the collimating lens 420 with relatively high mounting heights are arranged on the back side of the circuit board 300 through the mounting through holes 320 on the circuit board 300, and the first optical path translating prism 430, the optical multiplexer 440 and the optical isolator 450 with relatively low mounting heights are arranged on the front side of the circuit board 300, so that the overlapping area of the light emitting assembly 400 and the circuit board 300 in space can be reduced.

In some embodiments, the first emission housing 401 further includes a first top surface 4014 disposed opposite the first contact surface 4011, the first top surface 4014 faces the upper housing 201, a first air bleed hole 4013 extending toward the first contact surface 4011 is disposed on the first top surface 4014, the first air bleed hole 4013 communicates with the third mounting surface 4130 in the first emission housing 401, and the first air bleed hole 4013 is a tapered hole, and the diameter of the tapered hole decreases gradually from the first top surface 4014 toward the third mounting surface 4130, such that the first emission housing 401 can communicate with the outside through the first air bleed hole 4013.

Fig. 12 is a partial assembled sectional view of a light emitting module and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 12, the semiconductor refrigerator 470 is fixed on the first mounting surface 4110 of the first emission housing 401 such that the cooling surface of the semiconductor refrigerator 470 faces away from the first mounting surface 4110, then the laser substrate on which the laser 410 is mounted is disposed on the cooling surface of the semiconductor refrigerator 470, then the collimator lens 420 is disposed on the cooling surface of the semiconductor refrigerator 470, and the collimator lens 420 is located in the light emitting direction of the laser 410; then, the first optical path translation prism 430 is fixed on the second mounting surface 4120 such that one end of the first optical path translation prism 430 is disposed in the light emitting direction of the laser 410; then, the optical combiner 440 is fixed to the second mounting surface 4120, so that the laser beam reflected by the first optical path translation prism 430 is injected into the optical combiner 440; then, the optical isolator 450 is fixed to the third mounting surface 4130, and the light incident surface of the optical isolator 450 is disposed corresponding to the light emitting surface of the optical multiplexer 440, and the light emitting surface of the optical isolator 450 is disposed corresponding to the light incident surface of the optical collimator 460.

Then the first emission housing 401 is turned over, the laser 410, the collimating lens 420 and the first optical path translating prism 430 on the first mounting surface 4110 and the second mounting surface 4120 are embedded in the mounting through hole 320 on the circuit board 300, so that the wire bonding surface height of the laser 410 is the same as the back surface of the circuit board 300, and then the first contact surface 4011 of the first emission housing 401 and the front surface of the circuit board 300 are bonded together, so that the optical isolator 450 on the optical combiner 440 on the second mounting surface 4120 and the optical isolator 450 on the third mounting surface 4130 are located in the cavity formed by the first emission housing 401 and the front surface of the circuit board 300.

Then, the inner cavity of the emission cover plate 402 is disposed corresponding to the mounting through hole 320, and the contact surface of the emission cover plate 402 facing the back surface of the circuit board 300 is adhered to the back surface of the circuit board 300, so that the laser 410, the collimating lens 420 and the first optical path translating prism 430 located on the back surface of the circuit board 300 are disposed in the cavity formed by the emission cover plate 402 and the back surface of the circuit board 300.

In some embodiments, the first contact surface 4011 is bonded to the front side of the circuit board 300 with a UV curable glue and a structural curable glue to achieve a hermetic bond of the first contact surface 4011 of the first emission housing 401 to the front side of the circuit board 300. The contact surface of the emission cover plate 402 facing the back surface of the circuit board 300 is bonded to the back surface of the circuit board 300 through UV curable adhesive and structural curable adhesive, so as to realize sealing bonding of the emission cover plate 402 and the back surface of the circuit board 300. In this way, the first emission housing 401 is adhered to the front surface of the circuit board 300, and the emission cover 402 is adhered to the back surface of the circuit board 300, so that the sealing assembly of the first emission housing 401, the circuit board 300 and the emission cover 402 is realized.

In some embodiments, the first emission housing 401 is a relatively complete housing structure that can house all of the optical and electrical components and form a complete sealed cross section. The emitter cover plate 402 on the back of the circuit board 300 is designed as a simple cavity structure, and also forms a complete sealing cross section. During assembly, the first emission housing 401, the circuit board 300 and the emission cover plate 402 form a sandwich structure, a contact interface between the first emission housing 401 and the front surface of the circuit board 300 is sealed by gluing, a contact interface between the emission cover plate 402 and the back surface of the circuit board 300 is sealed by gluing, and then the light collimator 460 is matched to form a complete closed cavity structure.

The first emission housing 401, the circuit board 300 and the emission cover plate 402 form a sealed cavity, and the first bleed holes 4013 on the first emission housing 401 are sealed after all sealing operations are completed, so that leakage holes cannot occur in all sealing areas in the sealing process of the first emission housing 401, the circuit board 300 and the emission cover plate 402 due to air expansion.

After the first emission housing 401, the circuit board 300 and the emission cover plate 402 of the light emission assembly 400 are sealed and assembled, the laser 410 emits a laser beam under the action of driving current transmitted by the circuit board 300, the laser beam is converted into a collimated beam by the collimating lens 420, the collimated beam is reflected by the first light path translation prism 430, the collimated beam positioned on the back side of the circuit board 300 is reflected to the front side of the circuit board 300, the reflected multiple paths of collimated beams are converted into one path of composite beam by the optical combiner 440, the composite beam is directly emitted into the optical collimator 460 through the optical isolator 450, and the composite beam is transmitted into the optical fiber 600 by the optical collimator 460, so that light emission is realized.

In some embodiments, a chip processing chip (DIGITAL SIGNAL Process, DSP) 310 is disposed on the front side of the circuit board 300, and the DSP chip 310 is used for processing high-frequency signals and transmitting the high-frequency signals to the laser 410, and provides signals for the laser 410 to emit laser beams, so that the laser 410 generates signal light.

Specifically, the front surface of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to the jack end reserved for the light emitting assembly 400, so that the high-frequency signal transmitted from the golden finger end is processed by the DSP chip 310 and then transmitted to the light emitting assembly 400 through the high-frequency signal line.

In order to transmit the high frequency signal of the DSP chip 310 to the laser 410, a high frequency signal via hole is provided under the Tx output pad of the DSP chip 310, the high frequency signal via hole penetrates through the front and back surfaces of the circuit board 300, the upper end of the high frequency signal via hole is electrically connected to the Tx output pad of the DSP chip 310, the lower end of the high frequency signal via hole is electrically connected to a high frequency signal line disposed at the back surface of the circuit board 300, and the high frequency signal line is electrically connected to the laser 410 through wire bonding. The DSP chip 310 thus located on the front side of the circuit board 300 transmits the high frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high frequency signal line connected to the Tx output pad thereof to transmit the high frequency signal to the laser 410 located on the back side of the circuit board 300 to realize the high frequency signal connection of the light emitting assembly 400 and the circuit board 300 such that the laser 410 emits the signal light.

In some embodiments, the circuit board 300 is provided with a plurality of high-frequency signal vias, and the plurality of high-frequency signal vias are disposed on the right side of the mounting through hole 320, and each high-frequency signal via is connected to the laser 410 in a one-to-one correspondence manner, so that a high-frequency signal line connected to each high-frequency signal via is connected to the laser 410, and the high-frequency signal transmitted by the circuit board 300 is transmitted to the laser 410 to meet the high-frequency signal required by the light emitting assembly 400.

In some embodiments, a dc signal line is further disposed on the back surface of the circuit board 300, and the dc signal line is electrically connected to the laser 410, so as to drive the laser 410 to emit light through the bias current transmitted by the dc signal line. The direct current signal line for transmitting the bias current may be led from the right side of the mounting through hole 320 on the circuit board 300 by wire bonding, the laser 410 can emit light after receiving the bias current transmitted by the direct current signal line, and the laser 410 modulates the high frequency signal into the light beam after transmitting the high frequency signal line to the laser 410, so that the laser 410 generates the signal light.

The dc signal lines for transmitting the bias current may also be connected to the laser 410 from the upper and lower sides of the mounting via 320, i.e., the dc signal lines for connecting the laser 410 and the high frequency signal lines are located at different sides of the mounting via 320, so that interference between the high frequency signal and the dc signal is avoided, routing of the dc signal is shorter, and overcrowding of the wiring in the circuit board 300 is avoided.

Fig. 13 is another schematic view of a partial assembly of a light emitting module and a circuit board in an optical module according to an embodiment of the application. As shown in fig. 13, the first optical path translating prism 430 includes a first mirror 4310 and a second mirror 4320, the first mirror 4310 is located in the light emitting direction of the laser 410, the collimated light beam output by the collimating lens 420 is incident on the first mirror 4310, the collimated light beam is reflected at the first mirror 4310, the reflected collimated light beam is reflected again at the second mirror 4320, and the reflected collimated light beam is located on the front side of the circuit board 300.

The laser 410 emits a laser signal under the drive of bias current and high-frequency signals transmitted by the circuit board 300, in order to detect the emitted light power of the laser 410, the back surface of the circuit board 300 is provided with a light detector 330, the light detector 330 is arranged on the left side edge of the mounting through hole 320 on the circuit board 300, and the photosensitive surface of the light detector 330 faces the light emitting direction of the laser 410, so as to collect forward light emitted by the laser 410 and send the collected data to related devices on the circuit board 300, thereby realizing the monitoring of the forward light emitting power of the laser 410.

In some embodiments, the light detector 330 is positioned within the interior cavity of the emitter cap plate 402 to place the light detector 330 within the sealed cavity formed by the emitter cap plate 402 and the back side of the circuit board 300 to ensure the tightness of the light emitting assembly 400.

In some embodiments, a small portion of the collimated light beam is caused to leak through the first mirror 4310 and impinge on the photosensitive surface of the light detector 330 using the light transmission characteristics of the reflective surface of the first mirror 4310, such that the light detector 330 is able to receive a portion of the light beam, thereby resulting in the emitted light power of the laser 410.

Specifically, the first mirror 4310 of the first optical path translating prism 430 is directed to the light emitting direction of the laser 410, and is used for dividing the laser beam generated by the laser 410 into two beams, one beam (usually accounting for 95% of the total power) is reflected by the first mirror 4310 to the second mirror 4320, so as to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300, and the other beam is directly transmitted through the first mirror 4310 and is incident on the photosensitive surface of the photodetector 330, and the laser beam emitted from the light emitting surface of the laser 410 is received by the photosensitive surface.

When the light detector 330 is mounted on the left side of the mounting through hole 320, the photosensitive surface of the light detector 330 can be flush with the inner side wall of the mounting through hole 320, so as to facilitate positioning of the light detector 330.

When the photodetector 330 is disposed on the back surface of the circuit board 300, the central axis of the photosensitive surface in the photodetector 330 coincides with the central axis of the laser 410, and the side of the photodetector 330 facing the back surface of the circuit board 300 is mounted on the back surface of the circuit board 300 by a Surface Mount Technology (SMT) technology, so that the light beam transmitted through the first mirror 4310 is injected into the photodetector 330 as much as possible.

In some embodiments, the back surface of the circuit board 300 is provided with 4 photo detectors 330, each photo detector 330 is disposed corresponding to each laser 410, so that each photo detector 330 collects a part of the laser beam emitted by each laser 410 and transmits through the first mirror 4310, and the forward light output of the corresponding laser 410 is measured by a device electrically connected to the photo detector 330.

Because the light detector 330 receives parallel light with a certain area, the accuracy requirement of the assembly position of the light detector 330 is low, and the assembly is easier, so long as the light transmission range of the first reflecting mirror 4310 in the first light path translation prism 430 is aligned with the photosensitive surface of the light detector 330, the light detector 330 can collect the laser beam transmitted through the first reflecting mirror 4310.

When the light detector 330 is fixed on the back surface of the circuit board 300, an anode is arranged on the side surface of the light detector 330 connected with the back surface of the circuit board 300, and the anode can be directly welded or fixed on a grounding metal layer on the circuit board 300 by a conductive adhesive or the like; the side of the light detector 330 facing away from the back surface of the circuit board 300 is provided with a cathode, and the cathode is electrically connected with the circuit board 300 through wire bonding, so that the light detector 330 is electrically connected with the circuit board 300.

After the light emitting assembly 400 is reversely mounted to the front surface of the circuit board 300, the first top surface 4014 of the first emitting housing 401 in the light emitting assembly 400 contacts the upper housing 201; after the laser 410 in the light emitting assembly 400 is connected with the DSP chip 310 on the front side of the circuit board 300 through the high frequency signal line, the laser 410 generates a laser beam under the direct current and high frequency signal driving transmitted by the circuit board 300, so that the laser 410 generates heat to raise the temperature, and the light emitting performance of the laser 410 is affected by the temperature, so that the laser 410 needs to operate in a certain fixed temperature range, the laser 410 needs to be placed on the semiconductor refrigerator 470 to ensure the operating temperature of the laser 410, and the semiconductor refrigerator 470 generates a large amount of heat in the refrigeration process, and the heat needs to be transmitted to ensure the refrigeration efficiency of the semiconductor refrigerator 470.

Since the laser 410 is fixed to the semiconductor refrigerator 470 on the first mounting surface 4110 of the first emission housing 401, heat generated from the laser 410 is transferred to the first emission housing 401 through the semiconductor refrigerator 470 to maintain the temperature of the laser 410. In order to improve the heat dissipation performance of the optical module, the first emission housing 401 may be made of tungsten copper or other metal materials with good heat conductivity, and the mass of the first emission housing 401 and the area of the first top surface 4014 are increased appropriately, so that the heat generated by the operation of the laser 410 and the semiconductor refrigerator 470 can be transferred to the upper housing 201 through the first emission housing 401, and the heat dissipation effect of the laser 410 is improved effectively.

In some embodiments, the first emission housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and the area of the bottom surface of the first emission housing 401 are properly increased, so as to increase the contact area between the first emission housing 401 and the upper housing 201, thereby improving the heat dissipation efficiency of the light emission assembly 400.

In some embodiments, to facilitate the heat transfer from the first emission housing 401 to the upper housing 201, a first heat-conducting spacer may be disposed between the first top surface 4014 of the first emission housing 401 and the inner side surface of the upper housing 201, so that the heat of the first emission housing 401 is transferred to the first heat-conducting spacer, and the first heat-conducting spacer transfers the heat to the upper housing 201, so as to effectively improve the heat dissipation effect.

In some embodiments, the first heat-conducting spacer may be a heat-conducting glue, which can adhere the first top surface 4014 of the first emission housing 401 to the inner side surface of the upper housing 201, and can conduct heat of the first emission housing 401 to the upper housing 201.

In some embodiments, the most dominant heat source of the optical module, in addition to the laser 410 and the semiconductor refrigerator 470, has a DSP chip 310, and the side of the DSP chip 310 facing away from the circuit board 300 contacts the upper housing 201, so that the heat generated by the operation of the DSP chip 310 is transferred to the upper housing 201 to transfer the heat generated by the DSP chip 310 to the outside of the optical module.

In order to facilitate the heat of the DSP chip 310 to be transferred to the upper housing 201, a second heat-conducting pad may be disposed between the DSP chip 310 and the inner side of the upper housing 201, so that the heat generated by the DSP chip 310 is transferred to the second heat-conducting pad, and the second heat-conducting pad transfers the heat to the upper housing 201, thereby effectively improving the heat dissipation effect.

In some embodiments, the light receiving component 500 and the light emitting component 400 may be disposed on the circuit board 300 side by side, and the light receiving component 500 and the circuit board 300 form a closed cavity structure to realize a sealed assembly of the light receiving component 500.

Fig. 14 is a schematic diagram of an overturning structure of a light receiving component in an optical module according to an embodiment of the present application, and fig. 15 is a schematic diagram of another angle structure of a light receiving component in an optical module according to an embodiment of the present application. As shown in fig. 14 and 15, the light receiving assembly 500 provided in the embodiment of the application includes a receiving housing 510, wherein the receiving housing 510 is covered on the front side of the circuit board 300 and is connected with the front side of the circuit board 300 in a sealing manner; the receiving housing 510 includes a second contact surface 5110 facing the circuit board 300 and a second top surface 5140 facing away from the circuit board 300, a mounting groove 5120 is disposed on the second contact surface 5110, an opening is disposed at an end of the mounting groove 5120 facing the front surface of the circuit board 300, and the mounting groove 5120 extends from the second contact surface 5110 toward the second top surface 5140.

The mounting groove 5120 of the receiving housing 510 is provided therein with the demultiplexer 520, the lens array 530, the reflecting prism 540 and the receiving light collimator 550, one end of the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 510, the other end is connected with the optical fiber 600 in a sealing manner, and the other end of the optical fiber 600 is connected with the optical fiber adapter 700, so that an external light signal is injected into the optical fiber 600 through the optical fiber adapter 700, transmitted to the receiving light collimator 550 through the optical fiber 600, and transmitted into the mounting groove 5120 through the receiving light collimator 550.

In some embodiments, when the receiving light-collimator 550 is inserted into the mounting groove 5120 of the receiving housing 510, the connection between the outer side of the receiving light-collimator 550 and the outer side wall of the receiving housing 510 is sealed by a sealant to ensure a sealed connection of the receiving light-collimator 550 and the receiving housing 510.

In the mounting groove 5120, the light-emitting surface of the receiving collimator 550 corresponds to the light-entering surface of the demultiplexer 520, the light-emitting surface of the demultiplexer 520 corresponds to the light-entering surface of the lens array 530, and the light-emitting surface of the lens array 530 corresponds to the reflecting prism 540. The received light transmitted to the received light collimator 550 through the optical fiber 600 is transmitted to the demultiplexer 520, one received light is demultiplexed into multiple split beams by the demultiplexer 520, the multiple split beams are respectively transmitted to the lens array 530, the multiple split beams are respectively transmitted to the reflecting prism 540 through the lens array 530, and the reflecting prism 540 reflects the multiple split beams onto the receiving chip on the circuit board 300, so as to realize light reception.

In some embodiments, after the demultiplexer 520, the lens array 530, the reflecting prism 540, and the receiving light collimator 550 are respectively installed in the receiving housing 510, the second contact surface 5110 of the receiving housing 510 is adhesively fixed to the front surface of the circuit board 300. Bonding the second contact surface 5110 to the front surface of the circuit board 300 by UV curable glue and structural curable glue achieves a sealed assembly of the receiving housing 510 to the front surface of the circuit board 300.

When the second contact surface 5110 is adhered to the circuit board 300, the receiving housing 510 places the receiving chip, the transimpedance amplifier and the safety region required for wire bonding on the front surface of the circuit board 300 in the mounting groove 5120 through the opening, and the receiving chip is located below the reflecting prism 540, so that the split beam reflected by the reflecting prism 540 is ensured to be emitted to the receiving chip, and photoelectric conversion is realized.

In some embodiments, the second top surface 5140 of the receiving housing 510 faces the upper housing 201, a second air vent 5130 extending toward the second contact surface 5110 is disposed on the second top surface 5140, the second air vent 5130 is in communication with the mounting groove 5120 of the receiving housing 510, and the second air vent 5130 is a tapered hole, and the diameter of the tapered hole gradually decreases from the second top surface 5140 toward the second contact surface 5110, such that the receiving housing 510 can communicate with the outside through the second air vent 5130.

Fig. 16 is a partial assembly sectional view of a light receiving assembly and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 16, the receiving light collimator 550 is inserted into the receiving housing 510, and then the demultiplexer 520 is mounted into the mounting groove 5120 of the receiving housing 510 such that the light incident surface of the demultiplexer 520 is disposed corresponding to the light emergent surface of the receiving light collimator 550; then, the lens array 530 is mounted in the mounting groove 5120 of the receiving housing 510, such that the light incident surface of the lens array 530 corresponds to the light emergent surface of the demultiplexer 520; then, a reflecting prism 540 is mounted to the light emitting surface of the lens array 530; then, the receiving housing 510 is reversely mounted to the front surface of the circuit board 300, and the second contact surface 5110 of the receiving housing 510 is bonded to the front surface of the circuit board 300, so that the receiving housing 510 covers the receiving chip and TIA on the circuit board 300, and the reflecting prism 540 is located directly above the receiving chip.

In this way, the external optical signal transmitted by the optical fiber is transmitted to the receiving optical collimator 550, the optical signal is transmitted to the demultiplexer 520 through the receiving optical collimator 550, one path of light beam is demultiplexed into multiple paths of light beams through the demultiplexer 520, the multiple paths of light beams are converted into multiple paths of converging light beams through the lens array 530, the multiple paths of converging light beams are reflected through the reflecting prism 540, the reflected multiple paths of converging light beams are respectively transmitted to the receiving chip on the circuit board 300, the optical signal is converted into the electric signal through the receiving chip, the converted electric signal is amplified through the TIA, the amplified electric signal is transmitted to the DSP chip 310, and the electric signal is processed through the DSP chip 310 and then transmitted to the upper computer through the golden finger, so that the light receiving is realized.

In some embodiments, the manner of sealing and packaging the light emitting assembly 400 and the light receiving assembly 500 is not limited to the above-mentioned embodiments, but the emitting housing of the light emitting assembly 400 may be formed as a separate housing, and the circuit board 300 may extend into the notch of the emitting housing, so that the circuit board 300 and the light emitting assembly 400 together form a part of a closed housing.

Fig. 17 is an assembly schematic diagram of another light emitting component, a light receiving component, a circuit board and an optical fiber in the light module according to the embodiment of the application, and fig. 18 is a partial assembly schematic diagram of another light emitting component and a circuit board in the light module according to the embodiment of the application. As shown in fig. 17 and 18, the light emitting assembly 400 adopts a light emitter structure with a front surface facing upward (forward), so that the front surface of the light emitting assembly 400 contacts the upper case 201; a bundle of optical fibers 600 is connected to the light emitting assembly 400, and the emitted light beam emitted from the light emitting assembly 400 is transmitted through the optical fibers 600 to achieve light emission.

The light receiving assembly 500 and the light emitting assembly 400 are disposed at the same side of the circuit board 300, and another bundle of optical fibers 600 is connected to the light receiving assembly 500, and external optical signals are transmitted to the light receiving assembly 500 through the optical fibers 600, and are photoelectrically converted by the light receiving assembly 500 to achieve light reception.

Fig. 19 is a schematic structural diagram of another circuit board in the optical module according to the embodiment of the present application. As shown in fig. 19, the present application digs a hole in the circuit board 300, embeds the light emitting module 400 in the hole in the circuit board 300, and extends the circuit board 300 into the notch of the light emitting module 400, and the circuit board 300 and the light emitting module 400 together form a part of a closed housing.

Specifically, the circuit board 300 is provided with a jack 340, the jack 340 penetrates the circuit board 300, and one side (upper side shown in fig. 19) of the jack 340 is provided with an opening, so that the jack 340 forms a U-shaped hole. The outer edge of the light emitting assembly 400 is provided with a clamping groove, the light emitting assembly 400 is inserted into the jack 340 through the clamping groove, namely, the left side edge of the jack 340 extends into the left side clamping groove of the light emitting assembly 400, the right side edge of the jack 340 extends into the right side clamping groove of the light emitting assembly 400, the lower side (shown in fig. 19) edge of the jack 340 extends into the front side (shown in fig. 18) clamping groove of the light emitting assembly 400, and the rear side (shown in fig. 18) side wall of the light emitting assembly 400 can be seen when viewed from the upper side (shown in fig. 19) of the circuit board 300.

Fig. 20 is a schematic structural diagram of another light emitting component in the optical module according to the embodiment of the present application. As shown in fig. 20, the light emitting assembly 400 includes a second emitting housing 404, the second emitting housing 404 including a top surface 4041 facing the upper housing 201; the inner cavity of the second emission housing 404 includes a mounting groove, and an opening is disposed on a top surface of the mounting groove, where the opening is located, and a top surface 4041 of the second emission housing 404 are the same surface. I.e. the top surface 4041 of the second emitter housing 404 is provided with an opening which communicates with a mounting slot in the interior cavity of the second emitter housing 404.

The second emission housing 404 further includes an upper cover plate 403, and the upper cover plate 403 is covered on an opening side of the mounting groove, so that the upper cover plate 403 and the second emission housing 404 form a cavity structure. In some embodiments, the upper cover plate 403 may be adhesively sealed to the second emitter housing 404 using a UV curable glue and a structural curable glue when the upper cover plate 403 is applied to the second emitter housing 404.

The outer side wall of the second transmitting housing 404 is further provided with a clamping groove 406, the second transmitting housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the clamping groove 406, the upper side of the clamping groove 406 is located on the front side of the circuit board 300, and the lower side of the clamping groove 406 is located on the back side of the circuit board 300. In this way, the second transmitting housing 404 is fastened to the circuit board 300 through the fastening slot 406, so as to fix the second transmitting housing 404 and the circuit board 300.

In some embodiments, the length dimension of the upper portion of the clamping groove 406 in the left-right direction is greater than the length dimension of the lower portion of the clamping groove 406 in the left-right direction, and the length dimension of the clamping groove 406 in the left-right direction may be equal to or less than the length dimension of the lower portion of the clamping groove 406 in the left-right direction, so that the second emission housing 404 is formed in a shape with a narrow middle portion and wide two side portions, to facilitate insertion of the second emission housing 404 into the insertion hole 340.

In some embodiments, the second emitter housing 404 is inserted into the receptacle 340 of the circuit board 300 through the slot 406, the optics of the light emitter assembly 400 are disposed in the mounting slot in the inner cavity of the second emitter housing 404, and then the upper cover plate 403 is covered on the integral structure, such that the upper cover plate 403, the second emitter housing 404, and the circuit board 300 form a complete sealed cavity.

In some embodiments, a third bleed hole 4031 is provided in the upper cover plate 403, the third bleed hole 4031 being in communication with a mounting slot of the second emitter housing 404. The closing of the third bleed hole 4031 is performed after all sealing operations are completed to ensure that all sealing areas do not leak due to air expansion during sealing. The third vent hole 4031 may be a tapered hole having a diameter gradually decreasing in size from the top surface of the upper cover plate 403 toward the bottom surface, so that the second emission housing 404 may communicate with the outside through the third vent hole 4031.

Fig. 21 is a schematic structural view of another emission housing in an optical module according to an embodiment of the present application, and fig. 22 is a schematic structural view of another angle of another emission housing in an optical module according to an embodiment of the present application. As shown in fig. 21 and 22, the outer side wall of the lower side of the second emission housing 404 includes a first side 4051, a second side 4052, a third side 4053 and a fourth side 4054, the first side 4051 is disposed opposite to the fourth side 4054, the second side 4052 is disposed opposite to the third side 4053, the first side 4051 is disposed corresponding to the lower side (lower side shown in fig. 19) of the jack 340, the second side 4052 is disposed corresponding to the left side circuit board of the jack 340, the third side 4053 is disposed corresponding to the right side circuit board of the jack 340, and the fourth side 4054 is disposed corresponding to the opening of the jack 340.

In some embodiments, the card slot 406 includes a first groove 4061, a second groove 4062, and a third groove 4063, the first groove 4061 is disposed on the first side 4051, the second groove 4062 is disposed on the second side 4052, and the third groove 4063 is disposed on the third side 4053. The first, second and third grooves 4061, 4062 and 4063 are all open toward the outside of the second emission housing 404, and one end of the first groove 4061 communicates with the second groove 4062 and the other end communicates with the third groove 4063. Thus, the clamping groove 406 is a U-shaped groove formed by the first groove 4061, the second groove 4062 and the third groove 4063.

In some embodiments, when the second transmitting housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the clamping groove 406, three sides of the insertion hole 340 are respectively inserted into the first groove 4061, the second groove 4062 and the third groove 4063, so as to support and fix the second transmitting housing 404 through the circuit board 300.

When the light emitting assembly 400 is inserted into the jack 340, the first side 4051 of the second emitting housing 404 is first directed to the opening of the jack 340, and then the second emitting housing 404 is moved inward, so that the circuit board at the lower side of the jack 340 extends into the first groove 4061, the left circuit board of the jack 340 extends into the second groove 4062, the right circuit board of the jack 340 extends into the third groove 4063, and the fourth side 4054 is exposed through the upper opening of the jack 340.

In some embodiments, when the circuit board on the side of the jack 340 extends into the first groove 4061, the second groove 4062 and the third groove 4063, the front surface of the circuit board 300 is adhered to the upper side walls of the first groove 4061, the second groove 4062 and the third groove 4063, so as to fix the circuit board 300 and the second emission housing 404.

After the front surface of the circuit board 300 is bonded with the upper side walls of the first groove 4061, the second groove 4062 and the third groove 4063, the back surface of the circuit board 300 and the lower side walls of the first groove 4061, the second groove 4062 and the third groove 4063 can be bonded together, that is, the thickness of the circuit board 300 is consistent with the dimensions of the first groove 4061, the second groove 4062 and the third groove 4063 in the up-down direction, so as to ensure the installation tightness of the circuit board 300 and the second emission shell 404.

In some embodiments, a gap may also exist between the back surface of the circuit board 300 and the lower sidewalls of the first, second, and third recesses 4061, 4062, 4063, but the gap is not in communication with the mounting groove in the second emitter housing 404, and does not affect the mounting tightness of the circuit board 300 and the second emitter housing 404.

Fig. 23 is an exploded view of another light emitting module in the optical module according to the embodiment of the present application. As shown in fig. 23, one end of the mounting groove in the second emission housing 404 is provided with a notch 4042, the notch 4042 faces away from the fiber optic adapter 700, the circuit board 300 on the right side (shown in fig. 19) of the insertion hole 340 extends into the notch 4042, and the circuit board 300 is connected with the notch 4042 in a sealing manner, so that the circuit board 300 is electrically connected with the light emitting device in the second emission housing 404.

Specifically, a semiconductor refrigerator 470 is disposed at one end of the mounting groove where the notch 4042 is disposed, a laser 410 and a collimator lens 420 are disposed on a cooling surface of the semiconductor refrigerator 470, the collimator lens 420 is disposed in a light emitting direction of the laser 410, the laser 410 is electrically connected with the circuit board 300 extending into the notch 4042 through wire bonding, and a wire bonding surface of the laser 410 and a front surface of the circuit board 300 are at the same height, so that a wire bonding connection between the circuit board 300 and the laser 410 is shortest, so as to ensure excellent high-frequency transmission performance.

In some embodiments, the light emitting height of the laser 410 is approximately the same as the front surface of the circuit board 300, and the laser beam can be moved up to above the circuit board 300 by the beam translation prism, so as to reduce the hole digging area on the circuit board 300, and also make the hole digging structure rectangular, so that the glue sealing treatment is conveniently performed at the contact position of the light emitting component 400 and the circuit board 300.

Specifically, a second optical path translation prism 480 is further disposed in the mounting groove of the second emission housing 404, the second optical path translation prism 480 is disposed in the light emitting direction of the laser 410, the laser beam emitted by the laser 410 is converted into a collimated beam by the collimating lens 420, and the collimated beam reflects the collimated beam located on the front surface of the circuit board 300 to the upper side of the front surface of the circuit board 300 by the second optical path translation prism 480.

The second optical path translating prism 480 functions to translate the laser beam upward a distance such that all subsequent optics positions are located on the top side of the front side of the circuit board 300 and maintain a proper clearance from the circuit board 300. In this way, the position conflict between the optical device and the circuit board 300 is avoided, so that the hole digging area of the circuit board 300 can be reduced as much as possible, the arrangement area of the electrical devices on the circuit board 300 is increased, and the wiring of the circuit board 300 is easier.

In some embodiments, the light emitting assembly 400 further includes a light collimator 460, and the light incident surface of the light collimator 460 is disposed corresponding to the light emergent surface of the second light path translating prism 480. One end of the light collimator 460 is inserted into the installation groove of the second emission housing 404, and the other end is hermetically connected with the optical fiber 600, and the hermetically connection between the optical fiber 600 and the second emission housing 404 is realized through the light collimator 460. In this way, the laser beam reflected and moved upward by the second optical path translation prism 480 is incident into the light collimator 460 and coupled into the optical fiber 600 by the light collimator 460.

In some embodiments, the light emitting assembly 400 further includes an optical isolator 450, where the light incident surface of the optical isolator 450 is disposed corresponding to the light emergent surface of the second optical path translation prism 480, and the light emergent surface of the optical isolator 450 is disposed corresponding to the light incident surface of the optical collimator 460, so that the laser beam reflected by the second optical path translation prism 480 and moved upwards is directly transmitted through the optical isolator 450 and is injected into the optical collimator 460; when the reflected laser beam is reflected at the light entrance surface of the optical collimator 460, the optical isolator 450 is used to isolate the reflected beam, and prevent the reflected beam from returning to the laser 410 along the original path.

In some embodiments, when the second emitter housing 404 is inserted into the receptacle 340 of the circuit board 300 through the slot 406, a portion of the mounting slots in the second emitter housing 404 are located on the back side of the circuit board 300 and another portion of the mounting slots are located on the front side of the circuit board 300.

In some embodiments, to increase the transmission rate of the optical module, multiple optical transmitters need to be integrated, so the optical transmitter assembly 400 may include multiple lasers 410 to achieve the emission of multiple transmitted beams. Based on this, the light emitting assembly 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, an optical combiner 440, a second optical path translating prism 480, an optical isolator 450, and an optical collimator 460 disposed in the mounting groove, the plurality of lasers 410 and the plurality of collimating lenses 420 being mounted in the mounting groove located at the back side of the circuit board 300, and the optical combiner 440, the second optical path translating prism 480, and the optical isolator 450 being mounted in the mounting groove located at the front side of the circuit board 300 to move up the laser beam located at the front side of the circuit board 300 through the second optical path translating prism 480.

Fig. 24 is a schematic structural view of another emission housing according to an embodiment of the present application, and fig. 25 is a schematic structural view of another angle of another emission housing according to an embodiment of the present application. As shown in fig. 24 and 25, to support and fix the laser 410, the collimator lens 420, the optical multiplexer 440, the second optical path translating prism 480 and the optical isolator 450, the mounting groove in the second emission housing 404 includes a fourth mounting surface 4045, a fifth mounting surface 4044 and a sixth mounting surface 4043, the fourth mounting surface 4045 is in communication with the notch 4042, the fourth mounting surface 4045 is recessed in the fifth mounting surface 4044, and the fifth mounting surface 4044 is recessed in the sixth mounting surface 4043, such that the fourth mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 form a step surface.

In some embodiments, the fourth mounting surface 4045 is located on the back side of the circuit board 300 and both the fifth mounting surface 4044 and the sixth mounting surface 4043 are located on the front side of the circuit board 300.

In some embodiments, the fourth mounting surface 4045 and the lower sidewall of the third recess 4063 may be coplanar, such that two opposite sidewalls of the third recess 4063 are provided with a notch, through which the circuit board 300 extends into the mounting slot of the second transmitting housing 404.

In some embodiments, a through hole may be disposed on an upper sidewall of the third recess 4063 and is in up-down communication with the notch 4042, so that after the circuit board 300 extends into the notch 4042, the extending circuit board 300 may be exposed through the through hole, so that an electrical device, a wire bonding, etc. are conveniently disposed on the circuit board 300 of the exposed portion, so as to facilitate wire bonding connection between the circuit board 300 and the laser 410.

In some embodiments, the fourth mounting surface 4045 may be flush with the back surface of the circuit board 300, and the fourth mounting surface 4045 may be adhesively secured to the back surface of the circuit board 300 when the circuit board 300 is inserted into the notch 4042; the fourth mounting surface 4045 may also be recessed from the back surface of the circuit board 300 such that a gap exists between the back surface of the circuit board 300 and the fourth mounting surface 4045.

A seventh mounting surface 4046 recessed downward is provided on the fourth mounting surface 4045, the seventh mounting surface 4046 is recessed from the fourth mounting surface 4045 toward the lower case 202, and the size of the seventh mounting surface 4046 in the left-right direction is smaller than the size of the fourth mounting surface 4045 in the left-right direction, so that the seventh mounting surface 4046 is also located on the back side of the circuit board 300.

The semiconductor refrigerator 470 is disposed on the seventh mounting surface 4046, and a side wall of the semiconductor refrigerator 470 facing the notch 4042 may abut against a connection surface between the fourth mounting surface 4045 and the seventh mounting surface 4046 to reduce a distance between the semiconductor refrigerator 470 and the circuit board 300 extending into the notch 4042.

Since the laser 410 and the collimator lens 420 are sequentially disposed on the cooling surface of the semiconductor refrigerator 470 and the seventh mounting surface 4046 is recessed in the fourth mounting surface 4045, the heights of the wire bonding surfaces of the laser 410 can be the same as the front surface of the circuit board 300 after the semiconductor refrigerator 470, the laser 410 and the collimator lens 420 are disposed on the seventh mounting surface 4046.

The optical combiner 440 is disposed on the fifth mounting surface 4044, and the light incident surface of the optical combiner 440 corresponds to the light emergent surface of the collimating lens 420, so that the collimated light beam output by the collimating lens 420 can be incident into the optical combiner 440, and thus, the collimated light beam is combined in the optical combiner 440.

One end of the second optical path translating prism 480 is disposed on the fifth mounting surface 4044, and the other end protrudes from the sixth mounting surface 4043, so that the composite beam output by the optical combiner 440 is reflected upward under the action of a reflecting mirror of the second optical path translating prism 480, and the reflected composite beam is reflected leftward under the action of another reflecting mirror, so that the composite beam reflected flush with the front surface of the circuit board 300 is moved upward above the front surface of the circuit board 300.

One end of the second emission housing 404 facing away from the notch 4042 is provided with a light hole 4047, the light incident surface of the light collimator 460 is inserted into the second emission housing 404 through the light hole 4047, and the mounting height of the light collimator 460 is higher than the sixth mounting surface 4043. The optical isolator 450 is disposed on the sixth mounting surface 4043 such that the reflected light beam output by the second optical path translating prism 480 is directly transmitted through the optical isolator 450 and enters the optical collimator 460.

In the first embodiment, after the light collimator 460 is inserted into the mounting groove of the second emission housing 404 through the light hole 4047, the light collimator 460 is hermetically connected with the outer sidewall of the second emission housing 404, so that the tightness of the mounting groove in the second emission housing 404 is achieved by the light collimator 460.

Fig. 26 is a schematic partial structure diagram of another light emitting component in the optical module according to the embodiment of the present application, and fig. 27 is a cross-sectional view of another light emitting component in the optical module according to the embodiment of the present application. As shown in fig. 26 and 27, the semiconductor refrigerator 470 is fixed on the seventh mounting surface 4046 of the second emission housing 404, and then the laser substrate on which the laser 410 is mounted is disposed on the cooling surface of the semiconductor refrigerator 470 such that the wire bonding surface height of the laser 410 is the same as the front surface of the circuit board 300; then, the collimator lens 420 is disposed on the cooling surface of the semiconductor refrigerator 470, and the collimator lens 420 is located in the light emitting direction of the laser 410; then, the optical multiplexer 440 is fixed on the fifth mounting surface 4044, so that multiple laser beams emitted by the multiple lasers 410 are multiplexed in the optical multiplexer 440; then, the second optical path shift prism 480 is fixed to the fifth mounting surface 4044 such that one end of the second optical path shift prism 480 is disposed in the light emitting direction of the optical combiner 440; then, the optical isolator 450 is mounted on the sixth mounting surface 4043, so that the composite beam reflected by the other end of the second optical path translation prism 480 is transmitted through the optical isolator 450, and the composite beam transmitted through the optical isolator 450 is injected into the optical fiber 600 through the optical collimator 460; the upper cover plate 403 is then adhesively bonded to the open side of the top surface of the mounting slot in the second emitter housing 404 such that the upper cover plate 403 and the second emitter housing 404 together form part of a closed housing.

Fig. 28 is a partial assembled cross-sectional view of another light emitting module and a circuit board in an optical module according to an embodiment of the present application. As shown in fig. 28, the second transmitting housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the clamping groove 406, so that the left side circuit board (as shown in fig. 18) of the insertion hole 340 is inserted into the notch 4042 of the second transmitting housing 404, and the back surface of the circuit board 300 inserted into the notch 4042 may be flush with the fourth mounting surface 4045 of the second transmitting housing 404; the right side and the front side of the insertion hole 340 are inserted into the second groove 4062 and the first groove 4061 of the clamping groove 406, so that the circuit board 300 is fixedly connected with the second transmitting housing 404 through the clamping groove 406.

After the second emission housing 404 is bonded and fixed to the circuit board 300 through the clip groove 406, the semiconductor refrigerator 470 is fixed to the seventh mounting surface 4046, the laser 410 and the collimator lens 420 are fixed to the cooling surface of the semiconductor refrigerator 470, the optical multiplexer 440 and the second optical path translating prism 480 are fixed to the fifth mounting surface 4044, and the optical isolator 450 is fixed to the sixth mounting surface 4043.

After the high-frequency signal transmitted by the golden finger end is processed by the DSP chip 310, the high-frequency signal is transmitted to the lasers 410 through high-frequency signal wires and wires distributed on the front surface of the circuit board 300, the lasers 410 are driven to emit multiple paths of laser beams, and the multiple paths of laser beams are converted into multiple paths of collimated beams through the multiple collimating lenses 420; the multiple paths of collimated light beams are combined into one path of composite light beam through the optical combiner 440, the composite light beam is reflected by the second optical path translation prism 480 to move upwards to the upper side of the front surface of the circuit board 300, the reflected composite light beam is directly transmitted through the optical isolator 450 to be emitted into the optical collimator 460, and the composite light beam is emitted into the optical fiber 600 through the optical collimator 460, so that the emission of the multiple paths of light beams through one optical fiber is realized.

In some embodiments, the DSP chip 310 is disposed on the front surface of the circuit board 300, and the height of the wire bonding surface of the laser 410 is the same as that of the front surface of the circuit board 300, so that the high-frequency signal connection wires are disposed from the DSP chip 310 to the jack 340 on the front surface of the circuit board 300, and the circuit design on this surface is that the high-frequency signal transmitted from the golden finger end is processed by the DSP chip 310 and then transmitted to the laser 410 via the high-frequency signal wires.

The light emitting assembly 400 shown in the embodiment of the present application is composed of a light emitter assembly, an upper cover plate 403, and a second emitting housing 404, where the upper cover plate 403 and the second emitting housing 404 together form a housing with a notch at one end, and the circuit board 300 extends into the notch of the housing, so that the circuit board 300, the upper cover plate 403, and the second emitting housing 404 together form a part of a closed housing, and then form a complete closed cavity structure in cooperation with the light collimator 460.

In some embodiments, the upper cover 403 and the second emission housing 404 are made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the second emission housing 404 and the area of the upper cover 403 are increased appropriately, so as to increase the contact area between the upper cover 403 and the upper housing 201, and further improve the heat dissipation efficiency of the light emission assembly 400.

In some embodiments, to facilitate the heat transfer from the second emission housing 404 to the upper housing 201, a heat-conducting pad may be disposed between the top surface 4041 of the second emission housing 404, the top surface of the upper cover plate 403 and the inner side surface of the upper housing 201, so that the heat of the second emission housing 404 is transferred to the heat-conducting pad, and the heat-conducting pad transfers the heat to the upper housing 201, so as to effectively improve the heat dissipation effect.

In some embodiments, the light receiving component 500 and the light emitting component 400 may be disposed side by side on the same surface of the circuit board 300, i.e. the light receiving component 500 is disposed on the front surface of the circuit board 300 and located on one side of the jack 340; the light receiving assembly 500 and the light emitting assembly 400 may also be disposed on different sides of the circuit board 300, i.e., the light receiving assembly 500 is disposed on the back side of the circuit board 300.

Fig. 29 is a schematic diagram of a turnover structure of another light receiving assembly in an optical module according to an embodiment of the application. As shown in fig. 29, the light receiving assembly 500 includes a receiving housing, which is fastened to the front side of the circuit board 300 and is hermetically connected to the front side of the circuit board 300; the receiving housing includes a mounting cavity therein, a light receiving device is disposed in the mounting cavity, and an opening is disposed at an end of the mounting cavity facing the front side of the circuit board 300, through which the light receiving device communicates with the front side of the circuit board 300. Thus, a closed cavity structure is formed by the receiving housing and the circuit board 300, within which the optical receiver assembly is disposed.

In some embodiments, the receiving enclosure carries all passive optical components including light receiving collimators, splitters, focusing mirrors, corner prisms, etc., while the receiving enclosure covers the detectors PD and TIA on the circuit board 300, as well as the required security area for routing. In this manner, the light receiver assembly is fixedly installed in the inner cavity of the receiving housing, and then the receiving housing is flip-capped on the front surface of the circuit board 300 to achieve the sealing assembly of the light receiver assembly 500.

The surface of the receiving shell facing away from the front surface of the circuit board 300 is provided with a vent hole, the vent hole is communicated with the inner cavity of the receiving shell, and the sealing of the vent hole on the receiving shell is performed after all sealing operations are completed, so that the leakage holes cannot occur in all sealing areas in the sealing process due to air expansion.

Because in conventional optical module designs, the connection of the external optical fiber to the optical module is achieved by inserting the external optical fiber adapter into the optical adapter of the optical module, the optical fiber flange in the adapter is in physical contact with the end face of the optical fiber adapter. When the optical module enters the refrigerating fluid, the contact surface is polluted by the refrigerating fluid, and extra loss is caused. Also in this scenario, the contaminated endface cannot be cleaned, creating permanent damage.

Fig. 30 is a schematic view illustrating a partial assembly of an optical fiber and a housing in an optical module according to an embodiment of the application. As shown in fig. 30, in order to avoid pollution of the contact surface between the optical fiber and the optical fiber adapter by the cooling liquid when the optical module enters the cooling liquid, the optical fiber 600 is directly led out by adopting a connection mode of an optical fiber tail fiber at the optical port 205 of the optical module, so that the optical fiber 600 passes through the optical port 205.

In some embodiments, to protect the optical fiber 600, an optical fiber protector 610 is disposed at the optical port 205, the optical fiber protector 610 is inserted into the optical port 205, and the optical fiber 600 is embedded in the optical fiber protector 610, so that the risk of port contamination when the optical fiber 600 is connected to the optical module can be eradicated, and long-term stable operation of the optical module can be ensured.

The optical module provided by the embodiment of the application is applied to the structural design of a high-altitude optical communication module, and comprises innovative considerations of optics, structure, high-frequency signal transmission, heat dissipation and the like, and the optical emission assembly is designed into a completely closed structure, so that the problem of emission light path sealing is solved; the light receiving component is designed into a completely closed structure, so that the problem of sealing a receiving light path is solved; the optical interface adopts a tail fiber mode, the contact connection between the optical fiber adapter and the optical interface of the optical module is canceled, and the pollution and sealing problems at the optical interface are eliminated; the optical assembly and the optical assembly are in sealing connection with the circuit board by adopting epoxy system glue, so that the structure connection and reinforcement effects are achieved, the sealing effect is achieved, and the cooling liquid is prevented from penetrating into the optical emission assembly and the optical receiving assembly; the bonding interface is reasonably designed, so that the gluing and bonding processes are simplified, and the sealing problem of the assembly bonding part of the component is solved; the structure design is simple, and the method is suitable for batch production.

The application realizes the complete airtight package of the free optical path in the optical module through unique structural design and arrangement, thereby realizing the long-term and reliable work of the optical module in a liquid cooling environment and greatly improving the heat dissipation effect of the light emitting component and the light receiving component.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, comprising:

The light receiving assembly is electrically connected with the circuit board and is used for receiving the light signals;

the optical fiber adapter is connected with the light emitting component and the light receiving component through optical fibers;

wherein the light emitting assembly comprises:

The second emission shell is provided with a clamping groove on the outer side wall, the clamping groove is inserted into the jack through the opening, the upper side of the clamping groove is positioned on the front side of the circuit board, and the lower side of the clamping groove is positioned on the back side of the circuit board; the optical fiber adapter comprises a mounting groove, wherein an opening is formed in the top surface of the mounting groove, a notch is formed in one end, facing away from the optical fiber adapter, of the mounting groove, a circuit board on one side of the jack extends into the notch, and the circuit board is connected with the notch in a sealing mode; an upper cover plate, wherein the sealing cover is closed at the opening side of the mounting groove; the mounting groove comprises a fourth mounting surface, a fifth mounting surface, a sixth mounting surface and a seventh mounting surface, wherein the fourth mounting surface is communicated with the notch, the fourth mounting surface, the seventh mounting surface, the fifth mounting surface and the sixth mounting surface are sequentially connected, the seventh mounting surface is recessed in the fourth mounting surface, the fourth mounting surface is recessed in the fifth mounting surface, and the fifth mounting surface is recessed in the sixth mounting surface;

The laser is arranged on the seventh mounting surface, is electrically connected with the circuit board extending into the notch and is used for generating laser beams;

the optical multiplexer is arranged on the fifth mounting surface and is used for compositing a plurality of laser beams emitted by the lasers into a composite beam;

one end of the second light path translation prism is arranged on the fourth mounting surface, and the other end of the second light path translation prism protrudes out of the sixth mounting surface and is used for upwards moving the laser beam positioned on the front surface of the circuit board;

an optical isolator disposed on the sixth mounting surface;

2. The optical module of claim 1, wherein the mounting slot is located on a back side of the circuit board at one end of the notch and the mounting slot is located on a front side of the circuit board at the other end of the notch.

3. The optical module of claim 2, further comprising a semiconductor refrigerator disposed in a mounting slot on a back side of the circuit board;

The laser is arranged on the refrigerating surface of the semiconductor refrigerator, and the height of the wire bonding surface of the laser is the same as that of the front surface of the circuit board.

4. The optical module according to claim 1, wherein a length dimension of a lower portion of the card slot in a left-right direction is smaller than a length dimension of an upper portion of the card slot in the left-right direction.

5. The optical module of claim 4, wherein a length dimension of the lower portion of the card slot in the left-right direction is greater than a length dimension of the insertion hole in the left-right direction.

6. The optical module of claim 1, wherein the thickness dimension of the clamping groove in the up-down direction is larger than the thickness dimension of the circuit board in the up-down direction, and the top surface of the clamping groove is in sealing connection with the front surface of the circuit board.

7. The optical module of claim 1, wherein a third bleed hole is provided in a side of the upper cover plate facing away from the circuit board, the third bleed hole being in communication with the mounting groove.

8. The optical module of claim 1, wherein the optical isolator is located between the second optical path translating prism and the optical collimator for directly transmitting the composite beam reflected by the second optical path translating prism to the optical collimator.

9. The optical module of claim 1, wherein the light receiving assembly comprises:

The receiving shell is covered on the front side of the circuit board and is connected with the front side of the circuit board in a sealing way; the circuit board comprises a mounting cavity, wherein an opening is formed in one end, facing the front surface of the circuit board, of the mounting cavity;

One end of the receiving collimator is inserted into the mounting cavity, and the other end of the receiving collimator is connected with the optical fiber adapter through an optical fiber; which is in sealing connection with the outer side wall of the receiving housing.

10. The optical module of claim 9, wherein a second bleed hole is provided in a surface of the receiving housing facing away from the front surface of the circuit board, the second bleed hole being in communication with the mounting cavity.