CN114709202B - Luminous panel and manufacturing method thereof - Google Patents
Luminous panel and manufacturing method thereofInfo
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- CN114709202B CN114709202B CN202210456717.1A CN202210456717A CN114709202B CN 114709202 B CN114709202 B CN 114709202B CN 202210456717 A CN202210456717 A CN 202210456717A CN 114709202 B CN114709202 B CN 114709202B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a light-emitting panel and a manufacturing method thereof. The LED display device comprises a substrate, a plurality of electrodes, a plurality of connecting pieces and a plurality of luminous pieces, wherein the plurality of electrodes are arranged on one side of the substrate, the plurality of connecting pieces are arranged on one side of the substrate, on which the plurality of electrodes are arranged, and one connecting piece is correspondingly connected with one electrode, the plurality of luminous pieces are arranged on one side of the substrate, on which the plurality of connecting pieces are arranged, and one connecting piece is correspondingly connected between the luminous piece and one electrode, each connecting piece comprises a bonding part and a switching support part, one end of the switching support part is connected with the corresponding electrode, the other end of the switching support part is connected with the bonding part, and one end of the bonding part is connected with the switching support part, and the other end of the bonding part is connected with the corresponding luminous piece. The invention can reduce the manufacturing difficulty of the bonding part, improve the yield of the luminous panel and realize the luminous panel with luminous elements with small spacing.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light-emitting panel and a manufacturing method thereof.
Background
LEDs (LIGHT EMITTING diode) have an irreplaceable role in the display field. Compared with the traditional display technology, the Micro-display technology based on the Micro-LED Micro-display array technology has the advantages of high response speed, active light emission, high contrast, long service life and the like.
In the process of manufacturing an LED lamp panel, a plurality of LED lamp pieces need to be transferred onto the lamp panel, please refer to fig. 1A to 1E, a plurality of electrode pieces 2 are formed on a substrate 1, then a photoresist layer is formed on the substrate 1, a photoresist 3 which is located between adjacent electrode pieces 2 and is inverted trapezoid is obtained through a photolithography process, then a metal layer is deposited on the substrate 1, the metal layer is separated at the photoresist 3, so as to obtain a bonding metal 4 located on the electrode pieces 2 and a separating metal 5 located on the photoresist 3, then the photoresist 3 and the separating metal 5 are removed together by a solvent method, so as to obtain a plurality of bonding metals 4 located on the substrate 1 and located on each electrode piece 2, and then the anode and the cathode of the LED lamp piece 6 are welded corresponding to the plurality of bonding metals 4, so as to obtain the LED lamp panel.
In the preparation process of bonding metal, because the lamp panel may have certain warp deformation, the bonding metal needs to have a larger thickness, generally about 10 micrometers, and further in the preparation process of bonding metal, the photoresist is required to reach a certain thickness, generally 30 micrometers, but the larger the thickness of the photoresist is, the larger the difficulty of the photoetching process is, the worse the stability is, the yield of the bonding metal is easy to reduce, and when the number of LED lamps is increased, the distance between the bonding metal is reduced, because the difficulty of the photoetching process is larger, the selectivity of the negative photoresist with small spacing and high depth-to-width ratio is less, and the technological requirements that the number of the LED lamps is increased and the spacing is reduced are difficult to meet.
Disclosure of Invention
The embodiment of the invention provides a light-emitting panel and a manufacturing method thereof, which can improve the bonding yield of light-emitting parts in the light-emitting panel.
An embodiment of the present invention provides a light emitting panel, including:
A substrate;
A plurality of electrodes disposed on one side of the substrate;
the connecting pieces are arranged on one side of the substrate, provided with a plurality of electrodes, and one connecting piece is correspondingly connected with one electrode;
The light-emitting parts are arranged on one side of the substrate, provided with the connecting parts, and one connecting part is correspondingly connected between one light-emitting part and one electrode;
Each connecting piece comprises a bonding part and a transfer supporting part, one end of one transfer supporting part is connected with a corresponding electrode, the other end of the one transfer supporting part is connected with the bonding part, one end of the bonding part is connected with the transfer supporting part, and the other end of the bonding part is connected with a corresponding light-emitting piece.
In an embodiment of the present invention, the transfer support portion includes a conductive sub-portion and an insulator portion, the conductive sub-portion is connected between a corresponding one of the electrodes and a corresponding one of the bonding portions, and the insulator portion is disposed between a corresponding one of the electrodes and a corresponding one of the bonding portions and around the conductive sub-portion.
In one embodiment of the present invention, each of the transfer support portions gradually increases in area taken in a direction parallel to the substrate in a direction away from the substrate.
In one embodiment of the present invention, the orthographic projection of the electrode on the substrate is located within the coverage area of the orthographic projection of the corresponding side of the transfer support portion, which is close to the substrate, on the substrate.
In an embodiment of the invention, a distance from one end of the conducting sub-portion far from the substrate to the substrate is greater than a distance from one end of the insulator portion far from the substrate to the substrate, and one end of the bonding portion near the transfer supporting portion covers the conducting sub-portion and the insulator portion, and the other end is electrically connected with a corresponding light emitting element.
In one embodiment of the present invention, the light emitting panel further includes a partition portion disposed on the substrate and surrounding each of the transfer support portions, the partition portion being spaced apart from the bonding portion;
The bonding part comprises a bonding metal layer and a functional metal layer which are arranged in a laminated mode, the functional metal layer is located between the bonding metal layer and the transfer supporting part, the partition part comprises a first sub-layer and a second sub-layer which are arranged in a laminated mode, the second sub-layer is located between the first sub-layer and the substrate, the bonding metal layer is at least partially identical to the first sub-layer in material, and the second sub-layer is identical to the functional metal layer in material.
In one embodiment of the present invention, the thickness of the bonding metal layer is less than the thickness of the first sub-layer, and the thickness of the functional metal layer is less than the thickness of the second sub-layer.
In an embodiment of the invention, the light-emitting panel further includes a light shielding layer disposed on a side of the partition portion away from the substrate, and the light shielding layer covers the partition portion and is disposed around each of the transfer support portions.
According to the above object of the present invention, there is also provided a method for manufacturing a light emitting panel, comprising the steps of:
providing a substrate;
Forming a plurality of electrodes on one side of the substrate;
forming a plurality of connecting pieces on one side of the substrate, on which a plurality of electrodes are arranged, wherein one connecting piece is correspondingly connected with one electrode, each connecting piece comprises a bonding part and a transfer supporting part, one end of one transfer supporting part is connected with one corresponding electrode, and the other end of the transfer supporting part is connected with the bonding part;
And a plurality of luminous pieces are formed on one side of the substrate, which is provided with a plurality of connecting pieces, and one connecting piece is correspondingly connected between one luminous piece and one electrode, wherein one end of the bonding part is connected with the switching support part, and the other end of the bonding part is connected with the corresponding one luminous piece.
In one embodiment of the present invention, the forming a plurality of connectors on the side of the substrate where the plurality of electrodes are provided includes the steps of:
Forming a plurality of conducting sub-parts on one side of the substrate provided with a plurality of electrodes, wherein one conducting sub-part is arranged on one electrode;
forming a plurality of insulator parts on one side of the substrate provided with a plurality of conducting sub-parts, wherein one insulator part is arranged around one conducting sub-part to form one switching support part;
And forming a metal layer on one side of the substrate, which is provided with the transfer support parts, wherein the metal layer is separated at each transfer support part to form a bonding part positioned on one side of the transfer support parts, which is far away from the substrate, and a separation part surrounding the transfer support parts, and the bonding parts and the separation parts are arranged at intervals.
The invention has the beneficial effects that the switching support part is arranged between the bonding part and the electrode, so that the distance from the bonding part to the electrode can be increased, the bonding between the bonding part and each luminous element can be ensured on the basis that the substrate possibly has certain deformation, the bonding part is not required to have larger thickness, the manufacturing difficulty of the bonding part is reduced, the yield of the bonding part is improved, and when the number of the luminous elements is increased and the distance between the bonding parts is reduced, the manufacturing difficulty of the bonding part is reduced, so that the luminous panel with luminous elements with small intervals is met, and the yield of the luminous panel is improved.
Drawings
The technical solution and other advantageous effects of the present invention will be made apparent by the following detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.
Fig. 1A to 1E are schematic structural diagrams illustrating a manufacturing process of an LED lamp panel in the prior art;
Fig. 2 is a schematic structural diagram of a light-emitting panel according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a light-emitting panel according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for manufacturing a light-emitting panel according to an embodiment of the present invention;
Fig. 5A to fig. 5F are schematic views illustrating a manufacturing process of a light emitting panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Referring to fig. 2, the light-emitting panel of the present invention includes a substrate 10, a plurality of electrodes 20, a plurality of connectors 30, and a plurality of light-emitting elements 60.
The light emitting device comprises a substrate 10, a plurality of electrodes 20, a plurality of connecting pieces 30, a plurality of luminous pieces 60 and a connecting piece 30, wherein the plurality of electrodes 20 are arranged on one side of the substrate 10, the plurality of connecting pieces 30 are arranged on one side of the substrate 10, on which the plurality of electrodes 20 are arranged, and the connecting piece 30 is correspondingly connected with one electrode, and the plurality of luminous pieces 60 are arranged on one side of the substrate 10, on which the plurality of connecting pieces 30 are arranged.
Each connecting piece 30 includes a bonding portion 32 and a transfer supporting portion 31, one end of the transfer supporting portion 31 is connected to a corresponding electrode 20, the other end is connected to the bonding portion 32, one end of the bonding portion 32 is connected to the transfer supporting portion 31, and the other end is connected to a corresponding light emitting piece 60.
In the application process, the transfer support part 31 is formed between the bonding part 32 and the electrode 20, so that the distance between the bonding part 32 and the substrate 10 can be increased, the bonding of the bonding part 32 and each luminous element 60 can be ensured on the basis that the substrate 10 possibly has certain deformation, and compared with the prior art, the bonding part 32 does not need to have larger thickness, the manufacturing difficulty of the bonding part 32 is reduced, the yield of the bonding part 32 is improved, and when the number of the luminous elements 60 is increased and the distance between the bonding parts 32 is reduced, the manufacturing difficulty of the bonding part 32 is reduced, and the yield of the luminous panel is improved.
Specifically, referring to fig. 2, the light-emitting panel provided in the embodiment of the invention includes a substrate 10, a plurality of electrodes 20 disposed on one side of the substrate 10, a plurality of connectors 30 disposed on the substrate 10 and connected to the plurality of electrodes 20, a partition portion 40 and a light shielding layer 50 disposed on the substrate 10 and surrounding each connector 30, and a plurality of light-emitting members 60 disposed on the substrate 10 and connected to the plurality of connectors 30.
The plurality of electrodes 20 are distributed on the substrate 10, and structures such as a driving circuit and a signal line (not shown in the drawings) are also distributed on the substrate 10, and the plurality of electrodes 20 are electrically connected with the signal line and the driving circuit to realize transmission of the electrical signal, which can be realized by referring to the prior art and will not be described herein.
Alternatively, the material of the electrode 20 may be Al.
The plurality of connecting pieces 30 are disposed on the substrate 10 and can be connected with the plurality of electrodes in a one-to-one correspondence manner, and one connecting piece 30 is disposed on one electrode 20 in a correspondence manner. Each connecting piece 30 includes a transfer support portion 31 and a bonding portion 32, the transfer support portion 31 is located between the bonding portion 32 and the electrode 20, and two ends of the transfer support portion 31 are connected to the bonding portion 32 and the electrode 20 respectively.
Further, each transfer support portion 31 includes a conductive sub portion 311 and an insulator portion 312, the conductive sub portion 311 is correspondingly connected between the bonding portion 32 and the electrode 20, and the insulator portion 312 is disposed between the bonding portion 32 and the electrode 20 and around each conductive sub portion 311.
In the embodiment of the present invention, in the direction away from the substrate 10, the area of each transfer support portion 31 cut parallel to the substrate 10 is gradually increased, i.e. the cross-sectional shape of the transfer support portion 31 may be in an inverted trapezoid structure, so as to facilitate the separation of the subsequent metal layer.
Alternatively, the area of the via portion 311 cut parallel to the substrate 10 is constant in a direction away from the substrate 10, and the area of the insulator portion 312 cut parallel to the substrate 10 is gradually increased.
Preferably, the orthographic projection of each electrode 20 on the substrate 10 is located within the coverage area of the orthographic projection of the corresponding side of the transfer support portion 31, which is close to the substrate 10, on the substrate 10, so that the adjacent conductive sub-portions 311 and the adjacent electrodes 20 can be effectively prevented from being shorted, and the yield and stability of the light-emitting panel are improved.
Alternatively, the height of the conductive sub-portion 311 may be equal to or unequal to the height of the insulator portion 312.
Preferably, the height of the conductive sub-portion 311 is greater than the height of the insulator portion 312. Referring to fig. 3, the distance from the end of the conductive sub-portion 311 away from the substrate 10 to the substrate 10 is greater than the distance from the end of the insulator portion 312 away from the substrate 10 to the substrate 10, and the end of the bonding portion 32 close to the transfer supporting portion 31 covers the conductive sub-portion 311 and the insulator portion 312, and the other end is electrically connected with the corresponding light emitting device 60, in this embodiment, the height of the conductive sub-portion 311 is set to be greater than the height of the insulator portion 312, so that the side of the conductive sub-portion 311 away from the substrate 10 protrudes relative to the insulator portion 312, and when the bonding portion 32 covers the side of the transfer supporting portion 31 away from the substrate 10, the contact area between the bonding portion 32 and the conductive sub-portion 311 can be increased, so as to improve the electrical transmission effect.
Further alternatively, the via portion 311 may be a Ti-Al-Ti laminated structure, and the material of the insulator portion 312 may be a high-elasticity photoresist.
With continued reference to fig. 2, the light-emitting panel further includes a partition portion 40 disposed on the substrate 10 and surrounding each of the transfer support portions 31, and the partition portion 40 is spaced from the bonding portion 32.
Specifically, the bonding portion 32 may include a bonding metal layer 321 and a functional metal layer 322 that are stacked, and the functional metal layer 322 is located between the bonding metal layer 321 and the transfer supporting portion 31, and the partition portion 40 includes a first sub-layer 41 and a second sub-layer 42 that are stacked, where the second sub-layer 42 is located between the first sub-layer 41 and the substrate 10, in this embodiment of the present invention, a material of the bonding metal layer 321 is at least partially the same as a material of the first sub-layer 41, and a material of the functional metal layer 322 is the same as a material of the second sub-layer 42.
It is understood that the bonding portion 32 and the partition portion 40 may be integrally formed in the process and partitioned at the inverted trapezoid-shaped transfer support portion 31 to be divided into the bonding portion 32 located on the transfer support portion 31 and the partition portion 40 located on the substrate 10, and since the bonding portion 32 is mainly in eutectic process in the bonding process with the light emitting element 60, byproducts may be generated, and thus the material of the bonding metal layer 321 is at least partially the same as that of the first sub-layer 41, and the material of the functional metal layer 322 is the same as that of the second sub-layer 42. In addition, during the bonding process of the bonding portion 32 and the light emitting member 60, the light emitting member 60 may generate a certain extrusion on the bonding portion 32, so that the thickness of the bonding metal layer 321 is smaller than that of the first sub-layer 41, and the thickness of the functional metal layer 322 is smaller than that of the second sub-layer 42.
Optionally, the material of the bonding metal layer 321 and the material of the first sub-layer 41 both include indium, and the material of the functional metal layer 322 and the material of the second sub-layer 42 both include gold, wherein the functional metal layer 322 is located between the bonding metal layer 321 and the via portion 311, so that the interfacial adhesion can be increased and the bonding stability can be improved.
In addition, the light-emitting panel provided by the embodiment of the invention further comprises a light-shielding layer 50 which is arranged on the substrate 10 and covers the partition parts 40, and the light-shielding layer 50 is arranged around each switching support part 31, and because the partition parts 40 are made of metal materials, light reflection is easy to generate to form stray light, and the light-shielding layer 50 provided by the embodiment of the invention can play a role of shielding light, so that the light-emitting effect of the light-emitting panel is improved.
Optionally, the material of the light shielding layer 50 includes black ink.
The light emitting elements 60 are disposed on a side of the substrate 10 provided with the plurality of connecting elements 30, and each light emitting element 60 may include a light emitting body 61, a first electrode 62 and a second electrode 63 disposed on a side of the light emitting body 61 near the substrate 10, wherein each first electrode 62 is correspondingly bonded to the bonding portion 32 of one connecting element 30, and each second electrode 63 is correspondingly bonded to the bonding portion 32 of one connecting element 30. It can be understood that one of the first electrode 62 and the second electrode 63 is an anode of the light emitting element 60, and the other is a cathode, so that the anode and the cathode of the light emitting element 60 are respectively connected with the electrodes 20 through the connecting elements 30 in a telecommunication manner, so as to realize the transmission of electric signals, and realize the light emission of the light emitting elements 60.
Alternatively, in embodiments of the present invention, the distance between two adjacent connectors 30 may be less than or equal to 10 microns.
In the embodiment of the invention, the transfer support portion 31 is arranged between the bonding portion 32 and the electrode 20 to increase the distance between the bonding portion 32 and the electrode 20, so that the bonding of the bonding portion 32 and each light emitting element 60 can be ensured on the basis that the substrate 10 may have certain deformation, and further, compared with the prior art, the bonding portion 32 does not need to have a larger thickness, the manufacturing difficulty of the bonding portion 32 is reduced, the yield of the bonding portion 32 is improved, and further, when the number of the light emitting elements 60 is increased and the distance between the bonding portions 32 is reduced, the manufacturing difficulty of the bonding portion 32 is reduced, and the yield of the light emitting panel is improved.
In addition, an embodiment of the present invention further provides a method for manufacturing a light-emitting panel according to the above embodiment, referring to fig. 2, fig. 4, and fig. 5A to fig. 5F, the method for manufacturing a light-emitting panel includes the following steps:
S10, providing a substrate 10.
S20, a plurality of electrodes 20 are formed on one side of the substrate 10.
A driving circuit, a signal line, and other structures (not shown) are formed on the substrate 10, and then a plurality of electrodes 20 are formed on the substrate 10, and each electrode 20 is electrically connected to the signal line and the driving circuit, so as to realize transmission of an electrical signal.
Optionally, the material of electrode 20 comprises Al.
S30, a plurality of connectors 30 are formed on the side of the substrate 10 provided with the plurality of electrodes 20, one connector 30 is correspondingly connected to one electrode 20, each connector 30 comprises a bonding portion 32 and a transfer support portion 31, one end of the transfer support portion 31 is connected to the corresponding electrode 20, and the other end is connected to the bonding portion 32.
A physical vapor deposition method is adopted to form a connection metal layer on the substrate 10, and dry etching is adopted to pattern the connection metal layer, so as to obtain a plurality of conductive sub-portions 311 distributed on the substrate 10, wherein one conductive sub-portion 311 is correspondingly positioned on one electrode 20.
Alternatively, the connection metal layer may be a laminated ti—al—ti metal film, or other metals, which are not limited herein. And the height of the formed via portion 311 may be about 3 μm.
The substrate 10 is coated with a high-elasticity photoresist, and an insulator 312 surrounding each conductive sub-portion 311 is formed by photolithography, and the insulator 312 is disposed around one conductive sub-portion 311 to form one transfer support portion 31, and the cross-sectional area of the transfer support portion 31 is gradually increased along the direction away from the substrate 10, i.e. the cross-sectional shape of the transfer support portion 31 is inverted trapezoid.
In the embodiment of the invention, the insulator 312 has elasticity, and can be deformed by shrinkage to a certain extent during the subsequent bonding process with the light emitting element 60, so as to increase the tolerance of deformation caused by the substrate 10.
The metal layer is formed on the side of the substrate 10 provided with the transfer support portion 31, and may include a laminated gold layer and an indium layer, and the gold layer is located between the indium layer and the substrate 10, and since the transfer support portion 31 has a certain height in the embodiment of the present invention, the thickness of the metal layer may be made thinner, and further the metal layer is separated at the transfer support portion 31 having an inverted trapezoid shape, so as to form a bonding portion 32 located on the side of the transfer support portion 31 away from the substrate 10 and a separation portion 40 located between adjacent transfer support portions 31, wherein the bonding portion 32 and the separation portion 40 are disposed at intervals, and the transfer support portion 31 and the bonding portion 32 form the connecting member 30.
Alternatively, the gold layer may be 500 angstroms thick, while the indium layer may be 3000 angstroms thick. In the prior art, the thickness of the bonding metal generally needs to be about 10 micrometers, so that the thickness of the bonding metal layer 321 can be effectively reduced, the bonding metal layer 321 is made of indium, the price of the indium is high, the use of the indium can be reduced, and the production cost can be effectively reduced.
The bonding portion 32 includes a bonding metal layer 321 made of indium and a functional metal layer 322 made of gold, and the partition portion 40 includes a first sub-layer 41 made of indium and a second sub-layer 42 made of gold, and the functional metal layer 322 is made of gold, so that the adhesion between the bonding metal layer 321 and the conductive sub-portion 311 can be increased, and the yield and stability of the light-emitting panel can be improved.
Then, the light shielding layer 50 is formed on the side of the substrate 10 where the connection member 30 is provided, and the material of the light shielding layer 50 including black ink may be formed by an inkjet printing method or a photolithography method.
The light shielding layer 50 covers the partition portion 40 and is disposed around each connecting member 30, and since the partition portion 40 is made of metal material, light reflection is easy to generate to form stray light, and the light shielding layer 50 provided by the embodiment of the invention can play a role of shielding light, so that the light emitting effect of the light emitting panel is improved.
S40, a plurality of luminous elements 60 are formed on one side of the substrate 10 provided with the plurality of connecting elements 30, and one connecting element 30 is correspondingly connected between the luminous element 60 and one electrode 20, wherein one end of the bonding part 32 is connected with the switching support part 31, and the other end is connected with the corresponding luminous element 60.
The side of the carrying substrate 70 provided with the plurality of light emitting elements 60 and the side of the substrate 10 provided with the plurality of connecting elements 30 are aligned, and each light emitting element 60 comprises a light emitting body 61, and a first electrode 62 and a second electrode 63 arranged on the side of the light emitting body 61 away from the carrying substrate 70. And the first electrode 62 and the second electrode 63 of each light emitting element 60 are respectively in contact connection with the corresponding connecting element 30 in a counterpoint manner, and the first electrode 62 and the second electrode 63 of each light emitting element 60 can be connected with the corresponding connecting element 30 in a bonding manner by adopting a hot pressing or laser welding manner, and each bonding metal layer 321 is connected with the corresponding first electrode 62 or the corresponding second electrode 63 in a eutectic manner so as to realize bonding connection, so that the light emitting panel provided by the embodiment of the invention is obtained.
It will be appreciated that during the bonding connection between the light emitting element 60 and the bonding portion 32, the bonding portion 32 and the transfer supporting portion 31 may be pressed, so that the thickness of the bonding metal layer 321 is smaller than that of the first sub-layer 41, the thickness of the functional metal layer 322 is smaller than that of the second sub-layer 42, and the height of the transfer supporting portion 31 is correspondingly reduced.
In summary, in the embodiment of the invention, the plurality of conductive sub-portions 311 are formed on the electrode 20 by dry etching to form the plurality of transfer supporting portions 31, compared with the prior art that the photoresist with high thickness is subjected to the photolithography process, the conductive sub-portions 311 are formed by dry etching, the appearance is easy to control, the precision is higher, the arrangement is more regular, the distance between two adjacent connecting pieces 30 is smaller than or equal to 10 micrometers, the conductive sub-portions 311 are covered by the insulator portions 312, the short circuit between the adjacent conductive sub-portions 311 and the adjacent electrode 20 is avoided, the bonding portions 32 are formed on the transfer supporting portions 31, the distance between the bonding portions 32 and the electrode 20 is further increased, the thickness of the bonding metal layer 321 in the bonding portions 32 can be set to be very thin, the bonding metal layer 321 can be naturally cut off at the transfer supporting portions 31, the production cost is reduced, the cut-off portions 40 on the substrate 10 do not need to be removed by a solvent method, the photoresist stripping is not needed, the chemical solution is avoided from damaging the electrode 20, the driving circuit 321 and the signal wire 321 on the substrate 10 and the signal wire, the bonding metal layer 321 and the light-shielding layer Cheng Chengmo are also reduced, the bonding process of the light-shielding layer can be reduced, and the light-shielding layer Cheng Chengmo can be reduced, and the light-reflecting process is reduced, and the bonding process is improved.
In addition, the embodiment of the invention further provides a display device, and the display device includes the light-emitting panel described in the above embodiment, where the light-emitting panel may be directly used for displaying in the display device, or the light-emitting panel is used as a backlight source in the display device, and the display device further includes a display panel disposed on a light-emitting side of the light-emitting panel.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing describes in detail a light-emitting panel and a method for manufacturing the same according to embodiments of the present invention, wherein specific examples are used to illustrate the principles and embodiments of the present invention, and the foregoing examples are provided for the purpose of helping to understand the technical solutions and core ideas of the present invention, and those skilled in the art should understand that the technical solutions described in the foregoing embodiments may be modified or some of the technical features may be equivalently replaced, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A light-emitting panel, comprising:
A substrate;
A plurality of electrodes disposed on one side of the substrate;
the connecting pieces are arranged on one side of the substrate, provided with a plurality of electrodes, and one connecting piece is correspondingly connected with one electrode;
The light-emitting parts are arranged on one side of the substrate, provided with the connecting parts, and one connecting part is correspondingly connected between one light-emitting part and one electrode;
Each connecting piece comprises a bonding part and a transfer supporting part, one end of one transfer supporting part is connected with a corresponding electrode, the other end of the transfer supporting part is connected with the bonding part, one end of the bonding part is connected with the transfer supporting part, and the other end of the bonding part is connected with a corresponding light-emitting piece;
The transfer support part comprises a conduction sub-part and an insulator part, the conduction sub-part is connected between a corresponding electrode and a corresponding bonding part, and the insulator part is arranged between a corresponding electrode and a corresponding bonding part and surrounds the conduction sub-part;
The light-emitting panel further comprises partition parts arranged on the substrate and surrounding each transfer supporting part, the partition parts are arranged at intervals with the bonding parts, the bonding parts comprise bonding metal layers and functional metal layers, the bonding metal layers are arranged in a stacked mode, the functional metal layers are located between the bonding metal layers and the transfer supporting parts, the partition parts comprise first sub-layers and second sub-layers, the first sub-layers and the substrate are arranged in a stacked mode, the second sub-layers are located between the first sub-layers, the bonding metal layers are at least partially identical to the first sub-layers, and the second sub-layers are identical to the functional metal layers.
2. The light-emitting panel according to claim 1, wherein each of the transfer support portions gradually increases in area taken in a direction parallel to the substrate in a direction away from the substrate.
3. The light-emitting panel according to claim 2, wherein the orthographic projection of the electrode on the substrate is located within a coverage range of the orthographic projection of the corresponding one side of the transfer support portion near the substrate on the substrate.
4. The light-emitting panel according to claim 1, wherein a distance from an end of the conductive sub-portion away from the substrate to the substrate is greater than a distance from an end of the insulator portion away from the substrate to the substrate, and an end of the bonding portion close to the transfer supporting portion covers the conductive sub-portion and the insulator portion, and the other end is electrically connected to a corresponding one of the light-emitting elements.
5. The light-emitting panel according to claim 1, wherein a thickness of the bonding metal layer is smaller than a thickness of the first sub-layer, and a thickness of the functional metal layer is smaller than a thickness of the second sub-layer.
6. The light-emitting panel according to claim 1, further comprising a light shielding layer provided on a side of the partition portion remote from the substrate, and the light shielding layer covers the partition portion and is provided around each of the transfer support portions.
7. The manufacturing method of the light-emitting panel is characterized by comprising the following steps of:
providing a substrate;
Forming a plurality of electrodes on one side of the substrate;
forming a plurality of connecting pieces on one side of the substrate, on which a plurality of electrodes are arranged, wherein one connecting piece is correspondingly connected with one electrode, each connecting piece comprises a bonding part and a transfer supporting part, one end of one transfer supporting part is connected with one corresponding electrode, and the other end of the transfer supporting part is connected with the bonding part;
Forming a plurality of luminous elements on one side of the substrate, on which a plurality of connecting elements are arranged, and connecting one connecting element between one luminous element and one electrode correspondingly, wherein one end of the bonding part is connected with the switching support part, and the other end of the bonding part is connected with one corresponding luminous element;
The step of forming a plurality of connectors on one side of the substrate provided with a plurality of electrodes comprises the following steps:
Forming a plurality of conducting sub-parts on one side of the substrate provided with a plurality of electrodes, wherein one conducting sub-part is arranged on one electrode;
forming a plurality of insulator parts on one side of the substrate provided with a plurality of conducting sub-parts, wherein one insulator part is arranged around one conducting sub-part to form one switching support part;
And forming a metal layer on one side of the substrate, which is provided with the transfer support parts, wherein the metal layer is separated at each transfer support part to form a bonding part positioned on one side of the transfer support parts, which is far away from the substrate, and a separation part surrounding the transfer support parts, and the bonding parts and the separation parts are arranged at intervals.
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| CN112018044B (en) * | 2019-05-30 | 2023-01-24 | 成都辰显光电有限公司 | Receiving substrate and display panel |
| CN114864838A (en) * | 2020-01-06 | 2022-08-05 | 京东方科技集团股份有限公司 | Organic electroluminescence structure and display device |
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