CN114724980A - Ball paving device based on BGA ball planting technology - Google Patents

Abstract

The application discloses a ball paving device based on a BGA (ball grid array) ball planting technology, which relates to the technical field of BGA ball planting, and comprises a base and a mounting rack rotationally arranged on the base, wherein the rotating axis of the mounting rack is horizontally arranged, and a rotating assembly for driving the mounting rack to rotate is arranged on the base; the mounting frame is provided with a ball paving table, and a plurality of ball paving holes are regularly distributed on the upper side of the ball paving table; a hollow cavity is formed inside the ball paving table, any ball paving hole is communicated with the hollow cavity, and the hollow cavity is communicated with an external vacuum generating device; a feeding box is arranged on the upper side of the ball paving table in a sliding manner, a material containing cavity is arranged in the feeding box in a penetrating manner along the thickness direction of the ball paving table, and the bottom surface of the material containing cavity is matched with the upper side surface of the ball paving table in a sliding manner; the ball paving table is provided with a sliding assembly for driving the feeding box to slide. This application has the stability that promotes feed box feed operation, promotes the effect of off-the-shelf qualification rate.

Description

A ball-laying device based on BGA ball-planting technology

technical field

The present application relates to the technical field of BGA ball placement, and in particular to a ball placement device based on the BGA ball placement technology.

Background technique

With the continuous improvement of silicon single-chip integration, the number of I/O pins has increased significantly, and the requirements for integrated circuit packaging have also increased; in order to meet the needs of development, ball grid array packaging, that is, BGA packaging technology came into being . The BGA packaging method uses solder balls as pins, which not only improves the packaging density, but also greatly improves the packaging performance.

In the related art, the BGA ball placement machine is the key equipment in the IC manufacturing and packaging process; among them, the choice of the ball placement method has a significant impact on the quality of the final product. At present, the traditional ball-laying equipment usually includes an operation table. The operation table has a ball-laying area with regularly distributed ball-laying holes. A cavity is opened inside the operation table. Any ball-laying hole is connected to the cavity, and the cavity is connected to the cavity. The vacuum generating device is connected; the upper side of the operating table slides with a ball laying box, the ball laying box has a box cavity with an opening at the bottom, and the operating table is provided with a driving mechanism for driving the ball laying box to move along the plane of the operating table, and the driving mechanism drives the ball laying The box slides along the upper side of the operating table, and the box cavity of the ball laying box completely sweeps the ball laying area.

In view of the above-mentioned related technologies, the inventor believes that, because the solder balls have a certain viscosity, when the driving mechanism drives the ball-laying box to move, there is a situation that the solder balls in the ball-laying box are accumulated in one place in the box cavity of the ball-laying box, so that part of the ball-laying box is stacked. There is no tin ball entering the ball hole, which makes the corresponding ball suction fixture unable to absorb the tin ball, which in turn affects the normal operation of the BGA substrate ball planting operation, and affects the qualified rate of the finished product. There is room for improvement.

SUMMARY OF THE INVENTION

In order to improve the stability of the ball-mounting operation of the BGA substrate and improve the qualified rate of finished products, the present application provides a ball-laying device based on the BGA ball-mounting technology.

A kind of ball-laying device based on BGA ball-planting technology provided by the application adopts the following technical scheme:

A ball-laying device based on BGA ball-planting technology, comprising a base and a mounting frame rotatably arranged on the base, the rotation axis of the mounting frame is arranged horizontally, and a rotating component for driving the rotation of the mounting frame is arranged on the base; A ball laying table is installed on the mounting frame, and a plurality of ball laying holes are regularly arranged on the upper side of the ball laying table; a hollow cavity is formed inside the ball laying table, and any of the ball laying holes is connected with the hollow cavity. The hollow chamber is communicated with the external vacuum generating device; the upper side of the ball-laying table is slidably provided with a feeding box, and a material-receiving cavity is opened in the feeding box along the thickness direction of the ball-laying table, and the feeding box is provided. The bottom surface of the material cavity is slidingly matched with the upper side of the ball-laying table; the ball-laying table is provided with a sliding component for driving the sliding of the feeding box; when in use, the sliding component drives the feeding box to slide along the upper surface of the ball-laying table Move and sweep all the ball holes.

By adopting the above technical solution, in actual use, the staff first puts enough tin balls to cover the bottom surface of the material holding cavity into the material holding cavity of the feeding box, and turns on the external vacuum generating device; then, the sliding component drives the feeding The box slides relative to the upper surface of the ball laying table; at the same time, the rotating assembly drives the mounting frame and its upper ball laying table to rotate around the horizontal axis of the mounting frame; when the bottom of the feeding box sweeps through the ball laying hole, due to the driving of the rotating assembly As a result, the tin balls in the feeding box roll from the higher side to the lower side in the material holding cavity; due to the external vacuum generating device, a negative pressure environment is formed in the hollow cavity, so that the tin balls fall into the corresponding ball-laying holes one by one. inside, and is fixed and adsorbed in the corresponding ball-laying holes; the feeding box gradually moves along the surface of the ball-laying table until a tin ball falls in any ball-laying hole, so as to complete the ball-laying operation; in this way, Effectively improve the accuracy of the ball suction fixture to absorb the solder balls at the corresponding position on the ball placement table, thereby helping to ensure the normal operation of the BGA substrate ball planting operation, and improve the qualified rate of finished products.

Preferably, a scraper is installed on one end of the feeding box close to the ball laying hole along its own feeding direction, and the lower end surface of the scraper is slidingly matched with the upper surface of the ball laying table.

By adopting the above technical solution, since the solder balls have a certain viscosity, in the actual operation process, when the sliding component drives the feeding box to slide on the side of the ball-laying table, the scraper and the upper surface of the ball-laying table slide relative to each other. Move the tin balls on the upper surface of the ball table, so that the tin balls fall into the corresponding ball laying holes, so as to ensure that the solder balls in the ball laying area are located in the tin ball holes, and effectively improve the suction jig to absorb the tin in the ball laying area on the ball laying table. The accuracy of the ball improves the accuracy of the BGA substrate ball mounting operation, thereby improving the qualified rate of finished products.

Preferably, the detachable fixed cover of the feeding box is located at the upper end opening of the material holding cavity and is provided with a cover plate, and the cover plate is provided with a feeding port communicating with the material holding cavity.

By adopting the above technical solution, the cover plate is used to cover the upper end opening of the feeding box, which helps to reduce the occurrence of tin balls in the feeding box being thrown out from the upper end opening of the material holding cavity when the ball-laying table rotates, so as to ensure the paving normal operation of the ball.

Preferably, the ball-laying table is located on the upper side of the hollow chamber and is detachably and fixedly connected with a ball-laying plate, the surface of the ball-laying plate is flush with the upper side of the ball-laying table, and the ball-laying hole is opened on the ball-laying table; A residual material collection box is detachably provided on the ball-laying table at the end of the feeding box that is away from the ball-spreading hole in the feeding direction. The upper surface of the box is a slip fit.

By adopting the above technical solution, when the type of solder balls to be soldered on the BGA substrate is changed, the sliding component drives the feeding box to slide to the side of the residual material collecting box; after the feeding box moves to the top of the residual material collecting box, the The material cavity is communicated with the opening at the upper end of the residual material collection box, and the remaining solder balls in the material storage cavity fall into the residual material collection box from the material holding cavity for collection; after that, the staff removes the residual material collection box containing the remaining solder balls from the Remove from the ball table and replace the remaining material collection box above; at the same time, replace the original ball laying board on the ball laying table, so that the size of the ball laying hole on the ball laying table can be adapted to the laying requirements of the new tin balls, and then the new type of tin is carried out. The ball laying operation effectively expands the application scope of the ball laying device.

Preferably, both ends of the residual material collection box in the feeding direction of the feeding box are provided with clipping ears, and any of the clipping ears is fixed on the side of the residual material collection box close to the ball-laying table. The middle position of the clamping lug is provided with a clamping groove; the corresponding clamping lug is provided with a lock on the ball-laying table, and the hanging rings of the lock are embedded in the clamping groove and are engaged with the clamping groove.

By adopting the above technical solution, the detachable and fixed connection between the residual material collecting box and the ball-laying table is realized by using the snap-fit of the locking ring and the snap-fit slot, and the connection structure is simple and convenient for the staff to operate.

Preferably, the rotating assembly includes a bottom plate and a supporting lug, the bottom plate is arranged horizontally, and two supporting lugs are arranged on the upper side of the bottom plate in parallel and spaced apart; a rotating shaft is horizontally fixed on the support frame, and the rotating shaft The two ends of the rotating shaft are arranged horizontally, and the two ends of the rotating shaft respectively penetrate the corresponding supporting ears and are rotatably connected with the supporting ears; the rotating assembly includes a servo motor mounted on the base, and the output shaft of the servo motor is the same as the rotating shaft. Shaft drive connection.

By adopting the above technical scheme, the servo motor is used to drive the mounting frame to rotate, and the driving structure is simple, which helps to improve the convenience of manufacturing the ball laying device and saves the production cost of the enterprise.

Preferably, a counterweight is provided on the mounting frame on the lower side of the rotating shaft.

By adopting the above technical solution, the counterweight is used to balance the weight difference between the two ends of the mounting frame, thereby reducing the situation that the driving motor is blocked due to the excessive mass of the ball-laying table at the upper end of the mounting frame, which helps to prolong the service life of the servo motor. .

Preferably, the sliding assembly includes a sliding rail arranged on the ball-laying table, the length direction of the sliding rail is parallel to the feeding direction of the feeding box, and the corresponding sliding rail on the feeding box is matched with a sliding seat; The ball-laying table is also provided with a driving member for driving the sliding seat to slide along the length direction of the sliding rail.

By adopting the above technical solution, in actual operation, the driving element drives the sliding seat to reciprocate and slide along the length direction of the sliding rail, so as to realize the sliding movement of the feeding box on the surface of the ball-laying table, and the sliding component has a simple structure, which is conducive to further saving Enterprise production costs.

To sum up, the present application includes at least one of the following beneficial technical effects:

The ball-laying table is driven by the rotating component to rotate, so that the tin balls in the feeding box roll from the higher side to the lower side in the feeding cavity, which can effectively reduce the accumulation of tin balls in one place in the feeding box cavity, causing some problems. The situation that no tin balls enter in the ball-laying hole, thus improving the stability of the ball-supplying operation of the ball-laying table, thereby effectively improving the accuracy of the ball suction fixture to absorb the solder balls at the corresponding position on the ball-laying table, thereby improving the qualified rate of finished products;

The ball-laying board and the residual material collection box are detachably arranged on the ball-laying table, so that the ball-planting device can meet the laying requirements of tin balls of different sizes, which is helpful to expand the application range of the ball-planting device and increase its practicability;

By setting the counterweight block, it can effectively reduce the occurrence of damage when the motor drives the mounting frame to rotate, thereby effectively prolonging the service life of the motor.

Description of drawings

FIG. 1 is a schematic axonometric view mainly embodying the overall structure of the ball placement device based on the BGA ball placement technology according to an embodiment of the present application.

FIG. 2 is a schematic diagram of an explosion structure mainly embodying the opening position of the hollow chamber according to the embodiment of the present application.

FIG. 3 is a schematic axonometric view mainly embodying the overall structure of the sliding assembly according to the embodiment of the present application.

FIG. 4 is an enlarged view of part A in FIG. 2 , which is mainly used to illustrate the connection structure between the residual material collection box and the ball-laying table.

Reference numerals: 1, base; 11, bottom plate; 12, support ear; 13, bracket; 2, mounting frame; 21, support arm; 22, rotating shaft; 3, rotating assembly; 31, servo motor; 4, shop Table; 41. Ball-laying plate; 411. Ball-laying hole; 42. Hollow chamber; 43. Ventilation port; 5. Feeding box; plate; 55, feed nozzle; 6, slide assembly; 61, slide rail; 62, slide seat; 7, residual material collection box; 8, connection structure; 81, snap-on ear; 811, snap-on slot; 82, Lock; 9. Scraper; 10. Counterweight.

Detailed ways

The present application will be further described in detail below with reference to the accompanying drawings 1-4.

The embodiment of the present application discloses a ball placement device based on the BGA ball placement technology.

Referring to FIGS. 1 and 2 , a ball-laying device based on BGA ball-planting technology includes a horizontally arranged base 1 and a mounting frame 2 that is rotatably arranged on the base 1 . In the length direction, the base 1 is provided with a rotating assembly 3 for driving the mounting frame 2 to rotate; the mounting frame 2 is provided with a ball-laying table 4 on the upper side; in the initial state, the ball-laying table 4 is arranged horizontally, and the upper side of the ball-laying table 4 is opened in an array form There are a plurality of ball laying holes 411; the ball laying table 4 is provided with a hollow chamber 42, any ball laying hole 411 is communicated with the hollow chamber 42, and the hollow chamber 42 is communicated with an external vacuum generating device; the ball laying table 4 slides sideways There is a feeding box 5, the middle of the feeding box 5 is provided with a material holding cavity 51 along the thickness direction of the ball laying table 4, and the bottom surface of the feeding box 5 is slidingly matched with the upper surface of the ball laying table 4; The sliding assembly 6 that drives the feeding box 5 to slide; when in use, the sliding assembly 6 drives the feeding box 5 to slide along the upper surface of the ball laying table 4 and sweep all the ball laying holes 411 .

During the actual operation, the staff first loads a certain number of tin balls into the feeding box 5 from the upper opening of the material holding cavity 51, and turns on the external vacuum generating device; then, the sliding assembly 6 is activated, and the sliding assembly 6 drives the supply. The material box 5 slides relative to the upper surface of the ball-laying table 4 to the side of the ball-laying hole 411; at the same time, the rotating assembly 3 drives the mounting frame 2 and its upper ball-laying table 4 to rotate, and the ball-laying table 4 drives the feeding box 5 to rotate, so that the supply The solder balls in the material box 5 roll from the higher side to the lower side in the material holding cavity 51; when the supply cavity sweeps over the ball-laying area and the solder balls move to the ball-laying hole 411, the external vacuum generating device makes the solder balls roll. A negative pressure environment is formed in the hollow chamber 42, so that the solder balls are adsorbed in the corresponding ball-laying holes 411, and the cycle is repeated until all the material-laying holes are filled with solder balls; after that, the rotating assembly 3 drives the mounting frame 2 to rotate, so that the The ball-laying table 4 is restored to a horizontal state; then, the sliding assembly 6 drives the feeding box 5 to withdraw from the ball-laying area, thereby completing the ball-laying operation.

Specifically, referring to FIG. 2 , the ball-laying table 4 has a rectangular plate-like structure, and the length direction of the ball-laying table 4 is parallel to the length direction of the base 1; A vent 43 is provided on the side, and the external vacuum generating device communicates with the hollow chamber 42 through the vent 43 . The ball-laying table 4 is provided with a ball-laying plate 41 on the sealing cover at the opening of the hollow chamber 42, and the ball-laying plate 41 is detachably and fixedly connected with the ball-laying table 4 through fixing bolts. The ball-laying hole 411 is opened on the ball-laying plate 41, and The lower side of the feeding box 5 is slidingly matched with the ball-laying board 41 . In addition, in order to ensure that only one solder ball is contained in a ball-laying hole 411, any ball-laying hole 411 has a structure with a large opening and a small bottom, and the size of the large mouth end of any ball-laying hole 411 is slightly larger than the diameter of the solder ball. , the size of the small mouth of any ball-laying hole 411 is smaller than the diameter of the solder ball, and the depth of any ball-laying hole 411 is equal to the diameter of the solder ball.

Referring to FIG. 3 , the feeding box 5 has a rectangular plate-like structure, and the length direction of the feeding box 5 is parallel to the length direction of the ball-laying table 4; 52 are arranged vertically, and a support plate 53 is installed at one end of any connecting plate 52 facing away from the table 4 , and one end of any supporting plate 53 facing away from the connecting plate 52 extends into the lower side of the table 4 . The sliding assembly 6 includes a sliding rail 61 arranged on the lower side of the ball-laying table 4 . The sliding rails 61 are provided with one at both ends of the length direction of the ball-laying table 4 , and the length direction of any sliding rail 61 is parallel to the width of the ball-laying table 4 . The sliding assembly 6 also includes a sliding seat 62 arranged on the upper side of the support plate 53, the sliding seat 62 and the sliding rail 61 are arranged correspondingly, and any sliding seat 62 is matched with the corresponding sliding rail 61; A driving member for driving the sliding seat 62 to slide along the length direction of the sliding rail 61 is provided. When in use, the driving element drives the sliding seat 62 to reciprocate sliding along the length direction of the slide rail 61 , so that the sliding seat 62 drives the feeding box 5 to reciprocate sliding along the width direction of the table 4 , so as to realize the driving operation of the feeding box 5 .

2 and 4 , the opening of the feeding box 5 located on the side of the feeding cavity 51 away from the ball-laying table 4 is covered with a cover plate 54, and the cover plate 54 is detachably and fixedly connected to the feeding box 5 through bolts. The plate 54 is used to reduce the occurrence of solder balls coming out from the upper opening of the material holding cavity 51 when the ball placement table 4 is rotated; meanwhile, the cover plate 54 is provided with a feeding nozzle 55 that matches the size of the solder balls.

The end of the ball laying table 4 away from the hollow chamber 42 in the width direction is provided with a residual material collection box 7, and the residual material collection box 7 and the ball laying table 4 are provided with a connecting structure 8, and the residual material collecting box 7 and the ball laying table 4 are detachable and fixed through the connecting structure 8 Connection; the opening of the residual material collection box 7 is set upward, the lower surface of the residual material collection box 7 is in contact with the ball-laying plate 41 , and the upper end surface of the residual material collection box 7 is slidingly matched with the lower surface of the feeding box 5 .

The connection structure 8 includes snap-fit ears 81 arranged at both ends of the residual material collection box 7 in the length direction, and a snap-fit slot 811 is opened in the middle of the upper side of any snap-fit ear 81; Buckle 82 , the lock buckle 82 is arranged corresponding to the engaging ear 81 , and the hanging ring of the locking buckle 82 is embedded in the engaging groove 811 and is in fixed contact with the bottom surface of the engaging groove 811 .

When the type of the solder balls to be soldered needs to be replaced, the feeding box 5 slides to the side of the residual material collecting box 7 along the width direction of the ball laying table 4. After the feeding box 5 moves to the top of the residual material collecting box 7, the material holding cavity 51 It is communicated with the upper end opening of the residual material collection box 7, and the remaining tin balls in the material holding cavity 51 fall into the residual material collection box 7 from the material holding cavity 51 for collection; The hanging ring of 82 is taken out from the snap groove 811, so that the residual material collection box 7 containing the remaining solder balls is removed from the ball-laying table 4; after that, the empty residual material collection box 7 is replaced; The original ball-laying plate 41 on the table 4 matches the size of the ball-laying hole 411 on the ball-laying plate 41 with the size of the solder balls to be soldered, so as to meet the laying requirements of different types of solder balls.

In addition, referring to FIG. 1 , a scraper 9 is installed on the side of the supply box 5 away from the residual material collection box 7 , the length direction of the scraper 9 is parallel to the length direction of the ball-laying table 4 , and the lower end surface of the hanging plate is connected to the ball-laying board 41 . , The upper end surface of the ball-laying table 4 and the residual material collecting box 7 are slidingly matched. Since the solder balls have a certain viscosity, while the feeding box 5 drives the solder balls in the container 51 to move, the scraper 9 and the upper surface of the ball laying plate 41 slide relative to each other, thereby pushing the solder balls, thereby further reducing the amount of solder balls in the storage chamber 51. The situation of pushing in the material cavity 51 occurs; the scraper 9 pushes the solder balls on the edge of the ball-laying holes 411 into the corresponding ball-laying holes 411 at the same time, which helps to reduce the sticking of the solder balls on the upper side of the ball-laying plate 41. .

1 and 2 , the base 1 includes a bottom plate 11 and support ears 12 , the bottom plate 11 is arranged horizontally, and two support ears 12 are arranged in parallel and spaced apart along the length direction of the bottom plate 11 ; the mounting frame 2 is arranged between the two support ears 12 , the mounting frame 2 includes two support arms 21 arranged in parallel and spaced along the length direction of the base plate 11 , the two support arms 21 are provided with a rotating shaft 22 along the length direction of the base plate 11 , and any support arm 21 is fixedly connected with the rotating shaft 22 , and the two ends of the rotating shaft 22 respectively penetrate through the corresponding support ears 12 and are rotatably connected with the corresponding support ears 12 . A bracket 13 is installed on the side of one support ear 12 away from the support arm 21; in this embodiment of the present application, the rotating assembly 3 includes a servo motor 31, and the housing of the servo motor 31 is fixed on the bracket 13, and the servo motor 31 is fixed on the bracket 13. The output shaft of the motor 31 is coaxially connected to the rotating shaft 22 for transmission. When in use, the output shaft of the servo motor 31 rotates to drive the rotating shaft 22 to rotate synchronously, and the rotating shaft 22 drives the mounting frame 2 to rotate around the axis of the rotating shaft 22 , so as to drive the mounting frame 2 .

At the same time, in order to prolong the service life of the servo motor 31, a counterweight 10 is installed on the mounting frame 2 at the end of the rotating shaft 22 away from the table 4, and any support arm 21 is fixedly connected to the counterweight 10; the counterweight 10 It is used to balance the weight difference between the two ends of the mounting frame 2 and reduce the situation of stalling when the servo motor 31 drives the mounting frame 2 to rotate.

The implementation principle of a ball-laying device based on the BGA ball-planting technology in the embodiment of the present application is as follows: during actual operation, the staff loads a certain number of tin balls into the material-receiving cavity 51 from the feeding port, and turns on the external vacuum generating device; Then, the driving element drives the feeding box 5 to slide to the side of the ball laying hole 411 along the width direction of the ball laying table 4; at the same time, the servo motor 31 drives the mounting frame 2 and the ball laying table 4 to rotate, so that the tin in the holding cavity 51 The ball rolls from the higher side to the lower side of the ball-laying table 4; when the solder ball rolls to the corresponding ball-laying hole 411, a negative pressure environment is formed in the hollow chamber 42 due to the external vacuum generating device, so that the solder ball The solder balls are fixed and adsorbed in the corresponding ball laying holes 411 , so as to realize the stable laying of the solder balls on the ball laying table 4 .

When the model of the solder balls to be soldered is changed, the feeding box 5 slides to the side of the residual material collecting box 7 along the width direction of the ball-laying table 4 . The remaining tin balls fall into the remaining material collection box 7 from the material holding cavity 51 for collection; then, the staff removes the remaining material collection box 7 containing the remaining tin balls from the ball-laying table 4, and replaces the empty surplus material Collection box 7; then, the staff replaces the original ball-laying board 41 on the ball-laying table 4, so that the size of the ball-laying hole 411 on the ball-laying board 41 matches the size of the solder balls to be soldered, so as to meet the laying requirements of different types of solder balls.

By rotating the ball-laying table 4, the accumulation of solder balls in one place in the material-receiving cavity 51 is reduced, and the stability of the feeding operation of the feeding box 5 is effectively improved, thereby effectively ensuring the normal operation of the BGA substrate ball-planting operation, and improving the finished product. pass rate.

The above are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore: all equivalent changes made according to the structure, shape and principle of the present application should be covered within the scope of the present application. Inside.

Claims (8)

1. A ball-laying device based on BGA ball-planting technology, characterized in that it comprises a base (1) and a mounting frame (2) that is rotatably arranged on the base (1), and the rotating shaft ( 22) The lines are arranged horizontally, and the base (1) is provided with a rotating assembly (3) for driving the mounting frame (2) to rotate; A plurality of ball-laying holes (411) are regularly arranged on the upper side of the ball table (4); a hollow chamber (42) is formed inside the ball-laying table (4), and any of the ball-laying holes (411) is connected with the ball table (411). The hollow chamber (42) is communicated, and the hollow chamber (42) is communicated with an external vacuum generating device; the upper side of the ball laying table (4) is slidably provided with a feeding box (5), and the feeding box (5) ) along the thickness direction of the ball laying table (4) is provided with a material holding cavity (51), and the bottom surface of the material holding cavity (51) is slidingly matched with the upper side of the ball laying table (4); A sliding component (6) for driving the feeding box (5) to slide is provided; when in use, the sliding component (6) drives the feeding box (5) to slide and sweep along the upper surface of the ball-laying table (4). Pass all the ball holes (411). 2. A ball-laying device based on BGA ball-planting technology according to claim 1, characterized in that: one end of the feeding box (5) close to the ball-laying hole (411) along its own feeding direction is installed with A scraper (9), the lower end surface of the scraper (9) is slidingly matched with the upper surface of the ball-laying table (4). 3. A ball-laying device based on BGA ball-planting technology according to claim 1, characterized in that: the feeding box (5) is located at the upper end opening of the material-receiving cavity (51), and a detachable fixed cover is provided with a detachable fixed cover. A cover plate (54) is provided on the cover plate (54) with a feed port communicating with the material holding cavity (51). 4. A ball-laying device based on BGA ball-planting technology according to claim 1, characterized in that: the ball-laying table (4) is located on the upper side of the hollow chamber (42) and is detachably and fixedly connected with a ball-laying plate (41), the upper surface of the ball-laying board (41) is flush with the upper side of the ball-laying table (4), and the ball-laying hole (411) is opened on the ball-laying table (4); on the ball-laying table (4) A residual material collecting box (7) is detachably provided at one end of the feeding box (5) away from the ball laying hole (411) in the feeding direction, the opening of the residual material collecting box (7) is set upward, and the feeding The lower surface of the box (5) is slidingly matched with the upper surface of the residual material collecting box (7). 5. A ball-laying device based on BGA ball-planting technology according to claim 4, characterized in that: both ends of the residual material collecting box (7) located in the feeding direction of the feeding box (5) are provided with There are clipping ears (81), any of the clipping ears (81) are fixed on the side of the residual material collection box (7) close to the ball-laying table (4), and the middle position of the clipping ears (81) is opened There is a snap groove (811); a lock (82) is provided on the ball-laying table (4) corresponding to the snap ear (81), and the hanging ring of the lock (82) is hung in the snap groove (811) inside, and is in fixed contact with the bottom surface of the snap groove (811). 6. A ball laying device based on BGA ball planting technology according to claim 1, characterized in that: the base (1) comprises a bottom plate (11) and support ears (12), and the bottom plate (11) is arranged horizontally , the support ears (12) are provided with two parallel intervals on the upper side of the bottom plate (11); a rotating shaft (22) is fixed horizontally on the mounting frame (2), and the rotating shaft (22) is arranged horizontally, Both ends of the rotating shaft (22) respectively penetrate the corresponding support ears (12) and are rotatably connected with the support ears (12); the rotating assembly (3) includes a servo motor ( 31), the output shaft of the servo motor (31) is coaxially connected to the rotating shaft (22). 7. A ball-laying device based on BGA ball-planting technology according to claim 1, characterized in that: a counterweight (10) is provided on the mounting frame (2) on the lower side of the rotating shaft (22) . 8. A ball-laying device based on BGA ball-planting technology according to claim 1, characterized in that: the sliding assembly (6) comprises a sliding rail (61) arranged on the ball-laying table (4), so The length direction of the sliding rail (61) is parallel to the feeding direction of the feeding box (5), and a sliding seat (62) is matched with the sliding rail (61) on the feeding box (5); 4) A driving member for driving the sliding seat (62) to slide along the length direction of the sliding rail (61) is also provided on it.

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