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CN114858731A - Correlation mode laser gas sensor packaging structure - Google Patents

Correlation mode laser gas sensor packaging structure Download PDF

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Publication number
CN114858731A
CN114858731A CN202210542169.4A CN202210542169A CN114858731A CN 114858731 A CN114858731 A CN 114858731A CN 202210542169 A CN202210542169 A CN 202210542169A CN 114858731 A CN114858731 A CN 114858731A
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base
laser gas
gas sensor
mode laser
beam mode
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钱闵阳
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Shouchuan Laser Technology Shanghai Co ltd
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Shouchuan Laser Technology Shanghai Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

本发明公开了一种对射模式激光气体传感器封装结构,包括基座,所述基座上嵌有两块绝缘体,两块所述绝缘体上安装有两列连接柱,两列所述连接柱之间设有底座,所述底座上固定安装有对射模式激光气体传感器,所述对射模式激光气体传感器的PIN脚通过金线连接连接柱上端,所述连接柱的下端穿过基座焊接在PCB板上,与PCB板线路连接。本结构中对射模式激光气体传感器固定安装在基座上,基座通过连接柱焊接在PCB板上,相比于对射模式激光气体传感器胶粘于PCB板上更加牢固;六个连接柱的上端高度不同,与其需要连接的对射模式激光气体传感器的PIN脚高度对应,在水平方向上距离大大缩短,且没有高度差,金线连接牢固不易断裂。

Figure 202210542169

The invention discloses a through-beam mode laser gas sensor packaging structure, comprising a base, on which two insulators are embedded, two rows of connection posts are mounted on the two insulators, and the two rows of the connection posts are There is a base between the bases, and the through-beam mode laser gas sensor is fixedly installed on the base. The PIN pin of the through-beam mode laser gas sensor is connected to the upper end of the connecting column through a gold wire, and the lower end of the connecting column passes through the base and is welded to On the PCB, it is connected with the PCB circuit. In this structure, the through-beam mode laser gas sensor is fixedly installed on the base, and the base is welded on the PCB board through the connecting column, which is more firmer than the through-beam mode laser gas sensor glued to the PCB board; The height of the upper end is different, corresponding to the height of the PIN pin of the through-beam laser gas sensor to be connected, the distance in the horizontal direction is greatly shortened, and there is no height difference, and the gold wire connection is firm and not easy to break.

Figure 202210542169

Description

一种对射模式激光气体传感器封装结构A kind of through-beam mode laser gas sensor package structure

技术领域technical field

本发明涉及气体传感器技术领域,具体涉及一种对射模式激光气体传感器封装结构。The invention relates to the technical field of gas sensors, in particular to a packaging structure of a laser gas sensor in a through-beam mode.

背景技术Background technique

对射模式激光气体传感器可利用目标气体对特定波长的激光具有吸收作用的原理而设计,发射器发射激光,并接受反射镜反射的激光,在固定的光程内,通过接收器接受功率,监测目标气体浓度。对射模式激光气体传感器常用于检测甲烷、一氧化碳等易燃易爆、有毒的危险性气体的浓度。但现有的对射模式激光气体传感器在安装时,通常直接采用胶粘工艺封装于PCB板上,容易发生脱落,如图3所示。另外胶粘封装使传感器的PIN脚(目前市场上的传感器共有8个PIN脚设计,其中两个空置,实际只用到其中6个PIN脚)与PCB板线路之间高度差较大、距离较远,当传感器的PIN脚通过金线和焊接点连接PCB板线路后,容易造成运输过程中金线断裂。The through-beam mode laser gas sensor can be designed using the principle that the target gas absorbs laser light of a specific wavelength. The transmitter emits laser light and receives the laser reflected by the mirror. Within a fixed optical path, the receiver receives power and monitors target gas concentration. Through-beam laser gas sensors are often used to detect the concentration of flammable, explosive, and toxic dangerous gases such as methane and carbon monoxide. However, when the existing through-beam mode laser gas sensor is installed, it is usually directly packaged on the PCB by an adhesive process, which is prone to fall off, as shown in Figure 3. In addition, the adhesive encapsulation makes the PIN pin of the sensor (currently there are 8 PIN pins in the sensor design, two of which are vacant, and only 6 PIN pins are actually used) and the PCB circuit. When the PIN pin of the sensor is connected to the PCB board circuit through the gold wire and the solder joint, it is easy to cause the gold wire to break during transportation.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种对射模式激光气体传感器封装结构,以解决背景技术中提到的问题。为实现上述目的,本发明提供如下技术方案:一种对射模式激光气体传感器封装结构,包括基座,所述基座上嵌有两块绝缘体,两块所述绝缘体上安装有两列连接柱,两列所述连接柱之间设有底座,所述底座上固定安装有对射模式激光气体传感器,所述对射模式激光气体传感器的PIN脚通过金线连接连接柱上端,所述连接柱的下端穿过基座焊接在PCB板上,与PCB板线路连接。The purpose of the present invention is to provide a through-beam mode laser gas sensor packaging structure to solve the problems mentioned in the background art. In order to achieve the above purpose, the present invention provides the following technical solution: a through-beam mode laser gas sensor packaging structure, comprising a base, two insulators are embedded on the base, and two columns of connecting posts are installed on the two insulators , a base is arranged between the two columns of the connecting columns, and the through-beam mode laser gas sensor is fixedly installed on the base, and the PIN pin of the through-beam mode laser gas sensor is connected to the upper end of the connecting column through a gold wire. The lower end is welded on the PCB board through the base, and is connected with the circuit of the PCB board.

优选地,每列所述连接柱均设有三个,六个所述连接柱的上端高度不同,所述连接柱的高度与其需要连接的对射模式激光气体传感器的PIN脚高度对应。Preferably, there are three connection posts in each row, and the upper ends of the six connection posts have different heights, and the heights of the connection posts correspond to the heights of the PIN pins of the through-beam mode laser gas sensor to be connected.

优选地,所述基座为圆饼状金属基座,所述底座与基座为一体结构。Preferably, the base is a pie-shaped metal base, and the base and the base are integral structures.

优选地,所述对射模式激光气体传感器焊接在底座上。Preferably, the through beam mode laser gas sensor is welded on the base.

本发明的技术效果和优点:本结构中对射模式激光气体传感器固定安装在基座上,基座通过连接柱焊接在PCB板上,相比于对射模式激光气体传感器胶粘于PCB板上更加牢固;六个连接柱的上端高度不同,与其需要连接的对射模式激光气体传感器的PIN脚高度对应,在水平方向上距离大大缩短,且没有高度差,金线连接牢固不易断裂。The technical effects and advantages of the present invention: in this structure, the through-beam mode laser gas sensor is fixedly installed on the base, and the base is welded on the PCB board through the connecting column, compared with the through-beam mode laser gas sensor glued on the PCB board More firm; the upper ends of the six connecting columns have different heights, which correspond to the heights of the PIN pins of the through-beam laser gas sensor to be connected. The distance in the horizontal direction is greatly shortened, and there is no height difference. The gold wire is firmly connected and not easy to break.

附图说明Description of drawings

图1为本发明的俯视图;Fig. 1 is the top view of the present invention;

图2为图1中沿A-A方向的剖面图;Fig. 2 is a sectional view along the A-A direction in Fig. 1;

图3为对射模式激光气体传感器胶粘于PCB板上示意图。Figure 3 is a schematic diagram of the through-beam mode laser gas sensor being glued to a PCB.

图中:1-基座,2-连接柱,4-对射模式激光气体传感器,5-金线,6-绝缘体,7-焊接点。In the picture: 1-base, 2-connecting column, 4-through beam mode laser gas sensor, 5-gold wire, 6-insulator, 7-welding point.

具体实施方式Detailed ways

为了使本发明的实现技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体图示,进一步阐述本发明,在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接或是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以两个元件内部的连通。In order to make the technical means, creative features, goals and effects of the present invention easy to understand, the present invention will be further described below in conjunction with the specific drawings. In the description of the present invention, it should be noted that unless otherwise specified and Definition, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, an integral connection or a mechanical connection, or an electrical connection; Direct connection, indirect connection through intermediate media, internal communication between two components.

实施例1Example 1

如图1-图2所示的一种对射模式激光气体传感器封装结构,包括基座1,基座1上嵌有两块绝缘体6,两块绝缘体6上安装有两列连接柱2,两列连接柱2之间设有底座,底座上焊接有对射模式激光气体传感器4,对射模式激光气体传感器4的PIN脚通过金线5连接连接柱2上端,连接柱2的下端穿过基座1焊接在PCB板上,与PCB板线路连接。本封装结构中对射模式激光气体传感器4固定安装在基座1上,基座1通过连接柱2焊接在PCB板上,相比于对射模式激光气体传感器4胶粘于PCB板上更加牢固。As shown in Figures 1-2, a through-beam laser gas sensor package structure includes a base 1, two insulators 6 are embedded on the base 1, two columns of connecting posts 2 are installed on the two insulators 6, and two A base is arranged between the column connecting columns 2, on which is welded a through-beam mode laser gas sensor 4, the PIN pin of the through-beam mode laser gas sensor 4 is connected to the upper end of the connection column 2 through a gold wire 5, and the lower end of the connection column 2 passes through the base. The seat 1 is soldered on the PCB board and is connected with the PCB board circuit. In this package structure, the through-beam mode laser gas sensor 4 is fixedly installed on the base 1, and the base 1 is welded to the PCB board through the connecting column 2, which is more firm than the through-beam mode laser gas sensor 4 glued to the PCB board. .

实施例2Example 2

如图1-图2所示的一种对射模式激光气体传感器封装结构,包括基座1,基座1为圆饼状金属基座,基座1上嵌有两块绝缘体6,两块绝缘体6上安装有两列连接柱2,绝缘体6使基座1与连接柱2之间电性绝缘,避免了对射模式激光气体传感器4与基座1之间产生电性连接。两列连接柱2之间设有底座,底座与基座1为一体结构,底座上焊接有对射模式激光气体传感器4,对射模式激光气体传感器4的PIN脚通过金线5连接连接柱2上端,连接柱2的下端穿过基座1焊接在PCB板上,与PCB板线路连接,从而使对射模式激光气体传感器4与PCB板线路实现电性连接。本封装结构中对射模式激光气体传感器4固定安装在基座1上,基座1通过连接柱2焊接在PCB板上,相比于对射模式激光气体传感器4胶粘于PCB板上更加牢固;As shown in Figures 1-2, a through-beam laser gas sensor packaging structure includes a base 1, the base 1 is a round pan-shaped metal base, and two insulators 6 are embedded on the base 1, and the two insulators Two rows of connection posts 2 are installed on the 6 , and the insulator 6 electrically insulates the base 1 from the connection posts 2 , avoiding electrical connection between the through-beam mode laser gas sensor 4 and the base 1 . A base is arranged between the two columns of connecting columns 2 , the base and the base 1 are integrated into one structure, and the through-beam mode laser gas sensor 4 is welded on the base, and the PIN pin of the through-beam mode laser gas sensor 4 is connected to the connection column 2 through a gold wire 5 On the upper end, the lower end of the connecting column 2 is welded on the PCB board through the base 1, and is connected with the circuit of the PCB board, so that the through-beam mode laser gas sensor 4 is electrically connected to the circuit of the PCB board. In this package structure, the through-beam mode laser gas sensor 4 is fixedly installed on the base 1, and the base 1 is welded to the PCB board through the connecting column 2, which is more firm than the through-beam mode laser gas sensor 4 glued to the PCB board. ;

每列连接柱2均设有三个,六个连接柱2的上端高度不同,连接柱2的高度与其需要连接的对射模式激光气体传感器4的PIN脚高度对应,使对射模式激光气体传感器4的PIN脚与连接柱2的上端在水平方向上距离大大缩短,且没有高度差,相对于图3现有技术中的传感器的PIN脚通过金线5和焊接点7连接PCB板线路的连接方式,本封装结构中的金线5连接更加牢固不易断裂。There are three connecting columns 2 in each column, and the upper ends of the six connecting columns 2 have different heights. The distance between the PIN pin and the upper end of the connection post 2 is greatly shortened in the horizontal direction, and there is no height difference, compared with the connection method of the PIN pin of the sensor in the prior art of FIG. , the gold wires 5 in the package structure are more firmly connected and not easily broken.

最后应说明的是:以上所述仅为本发明的优选实施例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。Finally, it should be noted that the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the The technical solutions described in the foregoing embodiments can be modified, or some technical features thereof can be equivalently replaced, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included. within the protection scope of the present invention.

Claims (4)

1. The utility model provides a correlation mode laser gas sensor packaging structure, includes the base, it has two insulators, two to inlay on the base install two spliced poles on the insulator, two be equipped with the base between the spliced pole, fixed mounting has correlation mode laser gas sensor on the base, correlation mode laser gas sensor's PIN foot passes through gold thread spliced pole upper end, the lower extreme of spliced pole passes the base welding on the PCB board, with PCB board line connection.
2. The package structure of claim 1, wherein: each row of the connecting columns are three, the heights of the upper ends of the six connecting columns are different, and the heights of the connecting columns correspond to the heights of the PIN feet of the correlation mode laser gas sensors which need to be connected.
3. The package structure of claim 1, wherein: the base is a round cake-shaped metal base, and the base are of an integrated structure.
4. The package structure of claim 1, wherein: the opposite-emission mode laser gas sensor is welded on the base.
CN202210542169.4A 2022-05-17 2022-05-17 Correlation mode laser gas sensor packaging structure Pending CN114858731A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050047732A1 (en) * 2003-07-09 2005-03-03 Kiyoshi Kato Optical transmitting module having a de-coupling inductor therein
JP2006080358A (en) * 2004-09-10 2006-03-23 Yamaha Corp Physical quantity sensor and method of manufacturing physical quantity sensor
CN205845948U (en) * 2016-07-29 2016-12-28 合肥微纳传感技术有限公司 A kind of based on the chip-stacked and gas sensor of flip chip bonding and encapsulating structure thereof
KR101898052B1 (en) * 2017-06-23 2018-10-04 (주)파트론 Optical sensor package and method of manufacturing thereof
CN214780742U (en) * 2021-05-12 2021-11-19 罗定市英格半导体科技有限公司 A package structure of a MEMS gas sensor chip
CN218067639U (en) * 2022-05-17 2022-12-16 首传激光科技(上海)有限公司 Correlation mode laser gas sensor packaging structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050047732A1 (en) * 2003-07-09 2005-03-03 Kiyoshi Kato Optical transmitting module having a de-coupling inductor therein
JP2006080358A (en) * 2004-09-10 2006-03-23 Yamaha Corp Physical quantity sensor and method of manufacturing physical quantity sensor
CN205845948U (en) * 2016-07-29 2016-12-28 合肥微纳传感技术有限公司 A kind of based on the chip-stacked and gas sensor of flip chip bonding and encapsulating structure thereof
KR101898052B1 (en) * 2017-06-23 2018-10-04 (주)파트론 Optical sensor package and method of manufacturing thereof
CN214780742U (en) * 2021-05-12 2021-11-19 罗定市英格半导体科技有限公司 A package structure of a MEMS gas sensor chip
CN218067639U (en) * 2022-05-17 2022-12-16 首传激光科技(上海)有限公司 Correlation mode laser gas sensor packaging structure

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