CN114999991B - Ultra-precision motion table claws - Google Patents
Ultra-precision motion table claws Download PDFInfo
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- CN114999991B CN114999991B CN202210770321.4A CN202210770321A CN114999991B CN 114999991 B CN114999991 B CN 114999991B CN 202210770321 A CN202210770321 A CN 202210770321A CN 114999991 B CN114999991 B CN 114999991B
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- 230000033001 locomotion Effects 0.000 title claims abstract description 56
- 210000000078 claw Anatomy 0.000 title claims abstract description 47
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 8
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000002265 prevention Effects 0.000 claims description 5
- 239000013013 elastic material Substances 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明涉及一种半导体装置，特别是涉及一种超精密运动台的片爪。本发明的目的是提供一种能够提高移动晶片的运动精度的超精密运动台的片爪，具体包括底板、第一组件、第一屏蔽板、第二组件及至少三个PIN组件，各所述PIN组件间隔设置，各所述PIN组件均包括PIN底座及PIN杆，所述PIN杆连接于所述PIN底座上，所述PIN底座连接于所述第二组件上，所述第二组件连接于所述底板上，所述第二组件通过所述PIN底座带动所述PIN杆移动，所述第一组件设置于所述PIN底座上，所述第一屏蔽板设置于所述底板与所述第一组件之间。
The present invention relates to a semiconductor device, and more particularly to a chip claw of an ultra-precision motion stage. The purpose of the present invention is to provide a chip claw of an ultra-precision motion stage capable of improving the motion accuracy of a moving wafer, specifically comprising a bottom plate, a first component, a first shielding plate, a second component and at least three PIN components, each of the PIN components being arranged at intervals, each of the PIN components comprising a PIN base and a PIN rod, the PIN rod being connected to the PIN base, the PIN base being connected to the second component, the second component being connected to the bottom plate, the second component driving the PIN rod to move through the PIN base, the first component being arranged on the PIN base, and the first shielding plate being arranged between the bottom plate and the first component.
Description
Technical Field
The present invention relates to a semiconductor device, and more particularly, to a gripper for an ultraprecise motion stage.
Background
For the claw of the motion platform, the basic function which is usually required to be met is the grabbing and placing of materials, while the claw of the ultra-precise motion platform is required to meet the basic function, and meanwhile, high-precision motion positioning and ultra-high information accuracy and structural reliability are achieved. Therefore, in the sheet claw structure of the ultra-precise movement table, a design for ensuring accurate operation of the electronic component and preventing structural change is required. In the existing workpiece table product, the wafer claw is arranged on the rough movement module substrate, is connected with the rough movement module and the micro movement module stator through the mechanical interface and bears the silicon wafer transmission function of the workpiece table, when the silicon wafer is loaded, the wafer claw receives the silicon wafer from the fork wafer mechanical arm and transmits the silicon wafer to the suction cup, and when the silicon wafer is unloaded, the wafer claw lifts and transmits the silicon wafer from the suction cup to the fork wafer mechanical arm.
The existing sheet claw structure has inaccurate positioning precision and larger error of moving wafers due to limited structure.
Disclosure of Invention
The invention aims to solve the technical problem of providing a claw of an ultra-precise motion table, which improves the motion precision of a moving wafer.
In order to solve the technical problems, the application provides the following technical scheme:
The invention discloses a sheet claw of an ultra-precise movement table, which comprises a bottom plate, a first component, a first shielding plate, a second component and at least three PIN components, wherein the first shielding plate is a magnetic shielding plate, the three PIN components are arranged at intervals, each PIN component comprises a PIN base and a PIN rod, the PIN rods are connected to the PIN bases, the PIN bases are connected to the second component, the second component is connected to the bottom plate, the second component drives the PIN rods to move up and down through the PIN bases, the first component comprises an electronic device subjected to magnetic field interference, the first component is used for limiting the up and down positions of the second component through the electronic device, and the first shielding plate is arranged between the bottom plate and the first component.
The invention discloses a claw of an ultra-precise movement table, wherein a first shielding plate is a magnetic shielding plate and is connected to the upper surface of a bottom plate.
The invention relates to a claw of an ultra-precise movement table, wherein a first shielding plate is made of silicon steel material subjected to rust prevention treatment.
The invention relates to a claw of an ultra-precise movement table, wherein a first shielding plate is trapezoidal.
The invention discloses a sheet claw of an ultra-precise motion platform, which further comprises a measuring assembly, wherein the measuring assembly comprises a grating ruler and a grating ruler mounting plate, a groove is formed in the mounting plane of the grating ruler mounting plate, the shape and the size of the groove are matched with those of the grating ruler, the grating ruler is arranged in the groove, the grating ruler and the grating ruler mounting plate are mutually adhered, and the grating ruler mounting plate is connected to a bottom plate.
The invention discloses a sheet claw of an ultra-precise movement table, wherein a groove is arranged close to two adjacent sides of a grating ruler mounting plate, and a right positioning table and a lower positioning table are formed between the groove and a mounting plane of the grating ruler mounting plate.
The invention discloses a claw of an ultraprecise motion table, wherein a second component comprises a motor rotor component and a framework, the PIN component further comprises an upper connecting sheet and a lower connecting sheet, the motor rotor component is suitable for up-and-down motion, the framework is an annular body, the framework is connected with the motor rotor component and is synchronous with the motor rotor component, the framework is suitable for moving up and down in a non-contact manner relative to a bottom plate, one ends of the upper connecting sheet and the lower connecting sheet are connected with a PIN base, and the other ends of the upper connecting sheet and the lower connecting sheet are connected with the framework.
The invention relates to a claw of an ultra-precise movement table, wherein an upper connecting sheet and a lower connecting sheet are both made of elastic materials.
The second assembly further comprises an upper pressing plate and a lower pressing plate, the upper pressing plate and the lower pressing plate are annular bodies, the upper pressing plate and the lower pressing plate are connected with the framework, the upper pressing plate is located above the framework, the lower pressing plate is located below the framework, one end, connected with the framework, of the upper connecting sheet is clamped between the upper pressing plate and the framework, and one end, connected with the framework, of the lower connecting sheet is clamped between the lower pressing plate and the framework.
The invention discloses a claw of an ultra-precise movement table, wherein each PIN rod is a hollow rod, and a hollow cavity of the hollow rod is connected with a vacuumizing device.
Compared with the prior art, the sheet claw of the ultra-precise movement table has at least the following beneficial effects:
The first shielding plate is arranged between the bottom plate and the first component, and shields the magnetic field from the lower part of the bottom plate, so that the sensor and other electronic elements in the first component are not interfered by the magnetic field from the lower part, the transmitted signals are more accurate, and the movement precision of the wafer moved by the sheet claw of the ultra-precise movement table is improved.
The sheet claw of the ultra-precise movement table of the present invention will be further described with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic perspective view of a sheet claw of an ultraprecise motion stage of the present invention;
FIG. 2 is a schematic view of the mounting structure of a first shielding plate in the sheet claw of the ultra-precise movement table of the invention;
FIG. 3 is a schematic view of the structure of a first shielding plate in the claw of the ultra-precise movement table of the invention;
FIG. 4 is a schematic view of the mounting structure of the grating ruler in the sheet claw of the ultra-precise movement table of the invention;
FIG. 5 is a schematic perspective view of a mounting plate for a grating ruler in a claw of an ultra-precise motion platform;
Fig. 6 is a schematic diagram of the bonding structure of the grating ruler in the sheet claw of the ultra-precise movement table.
Detailed Description
As shown in fig. 1, fig. 2 and fig. 3, the sheet claw of the ultra-precise motion platform comprises a bottom plate 1, a first component 5, a first shielding plate 14, a second component and three PIN components (vacuum adsorption components), wherein each PIN component is arranged at intervals and comprises a PIN base (vacuum adsorption base) 13 and a PIN rod (vacuum adsorption rod) 10, the PIN rod 10 is connected to the PIN base 13, the PIN base 13 is connected to the second component, the second component is connected to the bottom plate 1, the second component is driven by a motor stator magnetic steel component on the micro-motion platform to move along the Z direction through electromagnetic acting force, the second component drives the PIN rod 10 to move along the Z direction through the PIN base 13, the first component 5 is arranged on any one PIN base 13, the first component 5 comprises an approach switch sensor, an approach switch mounting seat and an in-place switch detection stop block, the in-place switch detection block is connected with the second component and moves synchronously with the second component, when the second component reaches a certain height, triggering of the approach switch sensor is completed, the second component is transmitted to an up-position machine, the second component reaches to the lower position of the second component, the second component stops to stop signal, the second component is driven by the second component to move along the Z direction, the Z direction is driven by the Z direction, the first component is driven by the second component to move along the Z direction, the Z direction is arranged on the first component and the first component 5 is arranged on the bottom plate, the second component is opposite to the first PIN component, the second component is opposite to the second PIN component, the second component and the other 1 has a stop to the other air-position component, and the other air-precision component, and the other air component can move, and the other 1, and the other component can move and 3 can and 3, and 3 can move and 3 through and 3. The base plate 1 is a CDA interface of 2 air floatation assemblies and an air passage carrier thereof, and the PIN assembly can be provided with more than three. The wafer is adsorbed on each PIN pole 10, and the motor on the micro-gap bench drives the second subassembly to remove, and the second subassembly passes through PIN base 13 and drives PIN pole 10 and remove, reaches the purpose of removal wafer. Because the first shielding plate 14 is arranged between the bottom plate 1 and the first component 5, the first shielding plate 14 shields the magnetic field from the lower part of the bottom plate 1, so that the sensor and other electronic elements in the first component 5 are not interfered by the magnetic field from the lower part, the transmitted signals are more accurate, and the movement precision of the wafer moved by the wafer claw of the ultra-precise movement table is improved.
Alternatively, the first shield plate 14 is attached to the upper surface of the base plate 1, specifically, the first shield plate 14 is a magnetic shield plate, and the first shield plate 14 is attached to the base plate 1 by a plurality of screws.
Optionally, the first shielding plate 14 is made of silicon steel material subjected to rust prevention treatment, the silicon steel has stronger magnetism, and the magnetic induction lines of the magnetic field are absorbed by utilizing the characteristic that the silicon steel is attracted by the magnetic field, so that the sensor and the electronic device above are not interfered by the magnetic field, the magnetic field from the lower part of the bottom plate 1 is better shielded, and the movement precision of the sheet claw of the precision movement table is improved. Specifically, the silicon steel material is subjected to rust prevention treatment in a nickel plating mode, and as the silicon steel is easy to rust, the service life of the silicon steel is prolonged after the rust prevention treatment, and the cleanliness of the sheet claws is ensured.
Optionally, the first shielding plate 14 is trapezoidal, and is matched with the structure of the bottom plate 1, so that the first shielding plate is more convenient to install on the bottom plate 1.
Optionally, as shown in fig. 1, 4, 5 and 6, the claw of the ultra-precise motion platform further comprises a measuring component 12, the measuring component 12 comprises a grating ruler 121 and a grating ruler mounting plate 122, a groove 123 is formed in the mounting plane of the grating ruler mounting plate 122, the shape and the size of the groove 123 are matched with those of the grating ruler 121, the grating ruler 121 is arranged in the groove 123, the grating ruler 121 and the grating ruler mounting plate 122 are mutually adhered, the grating ruler mounting plate 122 is connected to the bottom plate 1 through a plurality of screws, the grating ruler 121 and the reading head form a grating system, high-precision position measurement and feedback of the claw mover are completed, and therefore high-precision closed-loop control of the mover position is completed. Since the groove 123 is formed in the grating ruler mounting plate 122, the grating ruler 121 is arranged in the groove 123, the edge of the grating ruler 121 is clamped on the positioning table at the edge of the groove 123, and the grating ruler 121 and the grating ruler mounting plate 122 are mutually adhered, so that the mounting position of the grating ruler 121 is more standard, the grating ruler 121 and the grating ruler mounting plate 122 are prevented from sliding or deflecting relatively due to vibration or impact in the use process, the reliability of a measuring assembly is greatly improved, and the movement accuracy and stability of the sheet claw of the precision movement table are improved.
Alternatively, the groove 123 is disposed near two adjacent sides of the grating ruler mounting plate 122, and a right positioning table and a lower positioning table are formed between the groove 123 and the mounting plane of the grating ruler mounting plate 122, so that the grating ruler 121 is more convenient to mount.
Optionally, the second subassembly includes motor rotor subassembly 9, skeleton 11, the PIN subassembly still includes connection piece 4, lower connection piece 3, motor rotor subassembly 9 accomplishes the up-and-down motion through the electromagnetic effort of coil and magnet steel subassembly, skeleton 11 is the cyclic annular body, skeleton 11 cover is on the air supporting bearing on bottom plate 1, make skeleton 11 can be with the air supporting axle on the bottom plate 1 contactless up-and-down motion through the air supporting principle, skeleton 11 is connected with motor rotor subassembly 9 and with motor rotor subassembly 9 is synchronous, the one end of connection piece 4, lower connection piece 3 is all connected with PIN base 13, the other end of connection piece 4, lower connection piece 3 is all connected with skeleton 11, go up connection piece 4, lower connection piece 3 is made by elastic material, motor rotor subassembly 9 drives skeleton 11 and removes, skeleton 11 drives PIN pole 10 and removes, reach the purpose of removal wafer. Because PIN base 13 is connected with skeleton 11 through last connection piece 4, lower connection piece 3, goes up connection piece 4, lower connection piece 3 and is made by elastic material, consequently the PIN subassembly has certain elasticity, and a plurality of PIN poles can be simultaneously with the wafer contact, reduces the coplanarity requirement of PIN pole, reduces the damage to the wafer, increases the adsorption affinity and the reliability of PIN pole. The in-place switch detection stop block of the first component 5 is connected with the framework 11 and moves synchronously with the framework 11, the framework 11 reaches a certain height to trigger the proximity switch sensor, and a signal that the movement of the motor rotor component 9 reaches the upper limit and the lower limit is transmitted to the upper computer, so that the motor rotor component 9 stops moving in time.
Optionally, the second component further includes an upper pressing plate 6 and a lower pressing plate 2, the upper pressing plate 6 and the lower pressing plate 2 are annular bodies, the upper pressing plate 6 and the lower pressing plate 2 are connected with the framework 11, the upper pressing plate 6 is located above the framework 11, the lower pressing plate 2 is located below the framework 11, one end of the upper connecting sheet 4 connected with the framework 11 is clamped between the upper pressing plate 6 and the framework 11, and one end of the lower connecting sheet 3 connected with the framework 11 is clamped between the lower pressing plate 2 and the framework 11.
Optionally, each PIN rod 10 is a hollow rod, and the hollow cavity of the hollow rod is connected with a vacuum pumping device. Specifically, each PIN base 13 is connected with a hose respectively, and three hoses are mutually communicated, and a hose interface on one PIN base 13 is connected with a vacuumizing device to provide silicon wafer adsorption vacuum for each PIN rod 10, so that the gripper grips the silicon wafer.
The above examples are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solution of the present invention should fall within the scope of protection defined by the claims of the present invention without departing from the spirit of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770321.4A CN114999991B (en) | 2022-06-30 | 2022-06-30 | Ultra-precision motion table claws |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210770321.4A CN114999991B (en) | 2022-06-30 | 2022-06-30 | Ultra-precision motion table claws |
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| Publication Number | Publication Date |
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| CN114999991A CN114999991A (en) | 2022-09-02 |
| CN114999991B true CN114999991B (en) | 2025-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210770321.4A Active CN114999991B (en) | 2022-06-30 | 2022-06-30 | Ultra-precision motion table claws |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119620549A (en) * | 2023-09-12 | 2025-03-14 | 北京华卓精科科技股份有限公司 | Sheet claw using flexible hinge |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290476A (en) * | 2008-05-20 | 2008-10-22 | 上海微电子装备有限公司 | Six freedom degree jiggle station |
| CN103309176A (en) * | 2013-06-17 | 2013-09-18 | 清华大学 | Six-freedom-degree micropositioner with lifting vacuum claw |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100461365C (en) * | 2006-06-12 | 2009-02-11 | 上海微电子装备有限公司 | High-precision silicon wafer stage and its positioning method |
| CN203365914U (en) * | 2013-06-17 | 2013-12-25 | 清华大学 | Six-DOF (degree of freedom) micropositioner with automatic grabbing and lifting mechanism |
| JP2016207756A (en) * | 2015-04-17 | 2016-12-08 | 株式会社ニコン | Stage apparatus and exposure apparatus |
| CN205725226U (en) * | 2016-04-27 | 2016-11-23 | 广东工业大学 | A high-speed and high-precision two-dimensional motion platform |
| CN207675916U (en) * | 2017-05-31 | 2018-07-31 | 西门子(深圳)磁共振有限公司 | Radio frequency choke resonator assembly, coil cable and MR imaging apparatus |
| WO2021034968A1 (en) * | 2019-08-19 | 2021-02-25 | Oem Group, Llc | Systems and methods for a lift and rotate wafer handling process |
| JP7531333B2 (en) * | 2020-06-30 | 2024-08-09 | キヤノン株式会社 | Stage apparatus, exposure apparatus, and method for manufacturing an article |
| CN212783403U (en) * | 2020-09-16 | 2021-03-23 | 北京华卓精科科技股份有限公司 | Silicon chip adsorption unit and silicon chip transmission device |
| CN112051715B (en) * | 2020-09-28 | 2025-01-03 | 清华大学 | Controllable lifting device with precision measurement and lithography equipment containing the same |
| CN112596350B (en) * | 2021-03-08 | 2021-06-01 | 上海隐冠半导体技术有限公司 | Six-degree-of-freedom micro-motion device and electron beam equipment |
| CN112701075B (en) * | 2021-03-24 | 2021-06-04 | 上海隐冠半导体技术有限公司 | Micro-motion platform, handover method and sports equipment |
| CN216144640U (en) * | 2021-05-31 | 2022-03-29 | 华东理工大学 | Contact reliability fretting wear experimental device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290476A (en) * | 2008-05-20 | 2008-10-22 | 上海微电子装备有限公司 | Six freedom degree jiggle station |
| CN103309176A (en) * | 2013-06-17 | 2013-09-18 | 清华大学 | Six-freedom-degree micropositioner with lifting vacuum claw |
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| Publication number | Publication date |
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| CN114999991A (en) | 2022-09-02 |
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