CN115020265B - Wafer chip detection method and device, electronic equipment and storage medium - Google Patents
Wafer chip detection method and device, electronic equipment and storage medium Download PDFInfo
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Abstract
The application provides a wafer chip detection method and device, electronic equipment and a storage medium. The detection method of the wafer chip comprises the following steps: determining an upper limit value and a lower limit value corresponding to a target parameter based on a first quartile and a third quartile in a target sequence formed by corresponding measurement values of a preset number of wafer chips under the target parameter; and filtering the measured values corresponding to the preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain the target measured values corresponding to the filtered target parameters. According to the method and the device, the corresponding measured values under the target parameters are filtered by adopting the first quartile and the third quartile to obtain the target measured values, and the data with the larger dispersion degree of the measured values and without reference significance are screened out based on the target measured values, so that the accuracy of the statistical control chart is improved, and the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Description
Technical Field
The present disclosure relates to the field of device inspection technologies, and in particular, to a method and an apparatus for inspecting a wafer chip, an electronic device, and a storage medium.
Background
After each section of the processing procedure of the wafer chip is completed, the measurement of relevant parameters is required to determine the quality status of the processing completed in the processing procedure, for example, the thickness of the wafer before crystal growth and the thickness of the wafer after crystal growth are respectively measured in the procedures before and after the crystal growth procedure to determine whether the crystal growth meets the process requirements, for example, the width of a circuit line in the surface of the chip is required to be measured by an electron microscope after the etching procedure to determine whether the processing quality of the etching procedure is qualified, in the commonly used measuring procedure, the parameter values, such as the thickness and the width, of the wafer chip are collected by measurement, and the collected original parameter data is made into a statistical chart for statistics and quality monitoring. However, under specific conditions such as occasional voltage instability, equipment instability, and unstable operation, the metrology equipment may collect extremely large or extremely small absolute abnormal parameter values, so that when the collected data is used in the wafer chip quality monitoring process, not all the data has a referential meaning, and therefore, using all the original parameter data in the fabrication of the statistical control chart may result in inaccurate quality analysis of the corresponding wafer chip reflected by the chart.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method and an apparatus for detecting a wafer chip, an electronic device and a storage medium, which can improve the accuracy of quality analysis of the wafer chip.
The embodiment of the application provides a method for detecting a wafer chip, which comprises the following steps:
acquiring the corresponding measured values of a preset number of wafer chips under the target parameters in the test process;
determining an upper limit value and a lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by corresponding measurement values of the preset number of wafer chips under the target parameter;
filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain filtered target measured values corresponding to the target parameters;
generating a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of time variation of a statistical value corresponding to the target measured value in a preset statistical mode;
and determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
Further, the determining an upper limit value and a lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by measurement values corresponding to the preset number of wafer chips under the target parameter includes:
determining a quartile range corresponding to a target parameter in a target sequence based on a first quartile and a third quartile in the target sequence formed by corresponding measured values of a preset number of wafer chips under the target parameter;
determining a lower limit value corresponding to the target parameter according to a first preset relational expression between the quartile range and the first quartile, and determining an upper limit value corresponding to the target parameter according to a second preset relational expression between the quartile range and the third quartile.
Further, the determining a quartile range corresponding to the target parameter in the target sequence based on a first quartile and a third quartile in the target sequence formed by the measurement values corresponding to the preset number of wafer chips under the target parameter includes:
calculating a one-division position and a three-division position corresponding to a target parameter in a target sequence based on the target sequence consisting of the corresponding measured values of a preset number of wafer chips under the target parameter;
calculating a first quartile at the dividing position and a third quartile at the trisection position in the target sequence based on the dividing position and the trisection position corresponding to the target parameter in the target sequence;
and determining the difference between the third quartile and the first quartile as a quartile distance corresponding to the target parameter in the target sequence.
Further, the generating a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter includes:
determining a statistical value of the target measurement value in a preset statistical mode according to a target measurement value corresponding to the target parameter of the preset number of wafer chips and the preset statistical mode corresponding to the target measurement value;
and performing curve drawing on the statistic value of the target measurement value in a preset statistic mode according to a time node to generate a statistic control chart of the target parameter.
Further, the determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip based on the statistical control chart of the target parameter includes:
judging whether each target measurement value under the target parameter is located in a parameter threshold interval based on the parameter threshold interval in the statistical control chart of the target parameter;
and if any target measurement value is outside the parameter threshold interval, determining that the target measurement value corresponding to the parameter value outside the parameter threshold interval is a deviation measurement value, and determining that the wafer chip corresponding to the deviation measurement value is an unqualified wafer chip, wherein the deviation measurement value is used for representing that the quality of the wafer chip corresponding to the target measurement value does not meet the quality of the standard wafer chip corresponding to the parameter threshold interval under the quality monitoring of the wafer chip of the target parameter.
Further, after determining that the wafer chip corresponding to the deviation measurement value is an unqualified wafer chip, the method for detecting the wafer chip further includes:
and performing secondary measurement under the target parameters aiming at the unqualified wafer chip, and if the wafer chip corresponding to the secondary measurement value is not qualified, performing scrapping treatment on the wafer chip.
The embodiment of the present application further provides a detection apparatus for a wafer chip, the detection apparatus for a wafer chip includes:
the acquisition module is used for acquiring the corresponding measured values of the preset number of wafer chips under the target parameters in the test process;
the first determining module is used for determining an upper limit value and a lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by corresponding measured values of the preset number of wafer chips under the target parameter;
the filtering module is used for filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain the filtered target measured values corresponding to the target parameters;
the generation module is used for generating a statistical control chart of the target parameter based on the corresponding target measured values of the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a statistical value corresponding to the target measurement value in a preset statistical mode along with time;
and the second determining module is used for determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
Further, the first determining module is specifically configured to:
determining a quartile range corresponding to a target parameter in a target sequence based on a first quartile and a third quartile in the target sequence formed by corresponding measured values of a preset number of wafer chips under the target parameter;
determining a lower limit value corresponding to the target parameter according to a first preset relational expression between the quartile range and the first quartile, and determining an upper limit value corresponding to the target parameter according to a second preset relational expression between the quartile range and the third quartile.
An embodiment of the present application further provides an electronic device, including: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating via the bus when the electronic device is running, the machine-readable instructions when executed by the processor performing the steps of the detection method as described above.
Embodiments of the present application further provide a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the computer program performs the steps of the detection method as described above.
The wafer chip detection method and device and the electronic equipment storage medium provided by the embodiment of the application are compared with the prior art, the application filters the corresponding measured values under the target parameters by adopting the first quartile and the third quartile to obtain the target measured values, and generates the statistical control chart of the target parameters based on the target measured values, so that the data with larger dispersion degree of the measured values and without reference significance are screened, the accuracy of the statistical control chart is further improved, and the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a flowchart illustrating a method for detecting a wafer chip according to an embodiment of the present disclosure;
fig. 2 is a flowchart illustrating another wafer chip inspection method according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram illustrating an apparatus for inspecting a wafer chip according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram illustrating another wafer chip inspection apparatus according to an embodiment of the present disclosure;
fig. 5 shows a schematic structural diagram of an electronic device provided in an embodiment of the present application.
In the figure:
300-a detection device for wafer chips; 310-an acquisition module; 320-a first determination module; 330-a filtration module; 340-a generation module; 350-a second determination module; 360-an adjustment module; 500-an electronic device; 510-a processor; 520-a memory; 530-bus.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. Every other embodiment that can be obtained by a person skilled in the art without making creative efforts based on the embodiments of the present application falls within the protection scope of the present application.
First, an application scenario to which the present application is applicable will be described. It is found through research that after each section of processing procedure of a wafer chip is completed, measurement of relevant parameters is required to determine the quality status of the processing completed in the processing procedure, for example, the thickness of the wafer before crystal growth and the thickness of the wafer after crystal growth are respectively measured in the procedures before and after the crystal growth procedure to determine whether the crystal growth meets the process requirements, for example, the width of a circuit line in the surface of the chip needs to be measured by an electron microscope after the etching procedure to determine whether the processing quality of the etching procedure is qualified, in the commonly used measuring procedure, parameter values, such as the thickness and the width, of the wafer chip are collected through measurement, and the collected original parameter data are made into a statistical chart for statistics and quality monitoring. However, under specific conditions such as occasional voltage instability, equipment instability, and unstable operation, the metrology equipment may collect extremely large or extremely small absolute abnormal parameter values, so that when the collected data is used in the wafer chip quality monitoring process, not all the data has a referential meaning, and therefore, using all the original parameter data in the fabrication of the statistical control chart may result in inaccurate quality analysis of the corresponding wafer chip reflected by the chart.
Based on this, the embodiment of the application provides a method and an apparatus for detecting a wafer chip, an electronic device and a storage medium, wherein a first quartile and a third quartile are used to filter corresponding measured values under a target parameter to obtain a target measured value, a statistical control chart of the target parameter is generated based on the target measured value, and data with a large dispersion degree of the measured values and without reference significance are screened out, so that the accuracy of the statistical control chart is improved, and the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Referring to fig. 1, fig. 1 is a flowchart illustrating a method for inspecting a wafer chip according to an embodiment of the present disclosure. As shown in fig. 1, a method for detecting a wafer chip provided in an embodiment of the present application includes:
s101, obtaining corresponding measured values of a preset number of wafer chips under target parameters in the testing process.
In the step, after the wafer chips are produced and before the wafer chips are delivered from a factory, quality detection needs to be performed on the produced wafer chips, and in the testing process, firstly, engineering control of wafer chip testing needs to be performed, and at this time, measured values corresponding to target parameters of a preset number of wafer chips need to be obtained.
The preset quantity is set by an operator in a self-defining way according to actual operation requirements and requirements of an operation environment; the target parameters are key configuration parameters of the wafer chips selected by an operator according to actual operation requirements, wherein the target parameters viewed by each wafer chip include but are not limited to: the thickness of the wafer chip, the voltage across any wire in the circuit on the wafer chip, the current across any wire, and the resistance across any wire.
S102, determining an upper limit value and a lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by the measured values corresponding to the preset number of wafer chips under the target parameter.
In this step, according to a quartile method in statistics, a quartile ranking is performed on the measured values corresponding to the preset number of wafer chips under the target parameter, and a specific ranking table method includes, but is not limited to: the method comprises the steps of sorting measured values of a target parameter from big to small, separating the sorted measured values by quartiles, calculating a first quartile and a third quartile, determining a quartile distance of the measured value corresponding to the target parameter according to the determined first quartile and third quartile, and determining an upper limit value and a lower limit value corresponding to the target parameter according to the quartile distance, the first quartile and the third quartile.
Here, the upper limit value and the lower limit value corresponding to the target parameter are not necessarily one measurement value in the target sequence composed of the measurement values corresponding to the target parameter, the upper limit value and the lower limit value corresponding to the target parameter are one calculated fixed value section, and the measurement value falling within the fixed value section is the measurement value corresponding to the target parameter that matches the upper limit value and the lower limit value.
The quartile is also called a quartile point, and means that all numerical values are arranged from small to large in statistics and divided into four equal parts, the numerical values at the positions of three dividing points are values at 25% and 75% positions after a group of data is sequenced, the quartile is that all data are equally divided into 4 parts through 3 points, wherein each part contains 25% of data, obviously, the middle quartile is a median, and therefore, the quartile generally refers to the numerical value at the position of 25% (called a lower quartile) and the numerical value at the position of 75% (called an upper quartile).
S103, filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain the filtered target measured values corresponding to the target parameters.
In the step, according to a fixed value interval composed of an upper limit value and a lower limit value corresponding to a target parameter, filtering the corresponding measured values under a preset number of target parameters through the fixed value interval, and filtering abnormal data with a large dispersion degree, wherein the abnormal data can be substantially understood as error data, and obtaining the target measured value with a small dispersion degree corresponding to the filtered target parameter, and here, data with a large deviation exceeding the fixed value interval have no reference to the measured value in a data acquisition and measurement stage, so the fixed value interval composed of the upper limit value and the lower limit value is used for filtering the data with the large deviation, and the determination of the fixed value interval is determined by a mathematical statistics method such as a quartile.
The reason for filtering out the data with an excessively large dispersion degree is to improve the accuracy of the subsequent statistical control chart, so that the quality analysis of the wafer chip corresponding to each target measurement value in the statistical control chart is more accurate.
S104, generating a statistical control chart of the target parameter based on the corresponding target measured values of the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a corresponding statistical value of the target measurement value along with time under a preset statistical mode.
In the step, a statistical control chart of the target parameter is generated based on the target measured value, and before the statistical control chart of the target parameter is generated, a plurality of statistical values corresponding to a plurality of preset statistical modes of a plurality of types of statistical control charts needing to be manufactured are determined according to the target measured value; the Statistical Control chart of the target parameter is generated by a Statistical Process Control (SPC) based system.
SPC is a process control tool by means of mathematical statistical method, it analyzes and evaluates the production process, finds the sign of systematic factors in time according to the feedback information, and takes measures to eliminate its influence, and makes the process maintain the controlled state only influenced by random factors, so as to achieve the purpose of controlling quality, and it is mainly used in the embodiment provided by this application: the wafer chip in the testing process is monitored in real time by applying a statistical analysis technology, and random fluctuation and abnormal fluctuation of the quality of the wafer chip in the production testing process are scientifically distinguished, so that early warning is provided for the wafer chip corresponding to an abnormal target measurement value generated in the testing process, an operator can conveniently take measures to adjust and eliminate the abnormality in time, and the purpose of improving and controlling the quality of the wafer chip is achieved.
Thus, the statistical control chart of the target parameter generated by the SPC system is mainly a graph with control limits used for analyzing and judging whether the target measurement value corresponding to the target parameter is in a stable state during the test, and the basic form of the control chart is that the ordinate is the target measurement value, the abscissa is time, and the graph has three lines, including: the monitoring system comprises an upper control line VCL, a central line CL and a lower control line LCL, wherein all graphs enabling monitoring information to be clearer in a graphic picture + data mode can be called control graphs.
Here, the plurality of preset statistical means includes, but is not limited to, a process capability index (CP), a modified process capability index (CPK), a process performance index (PP), a modified process performance index (PPK), and an offset coefficient (K) at the calculation target parameter.
Wherein the types of the plurality of statistical values include, but are not limited to: maximum, minimum, average, range, and moving range, etc.
Thus, the range of variation is the difference between the maximum and minimum values, and the range of variation may reflect the range of variation used to characterize and statistically vary the trend.
Further, the generating a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter includes:
and determining a statistical value of the target measurement value in a preset statistical mode according to the target measurement value corresponding to the target parameters of the preset number of wafer chips and the preset statistical mode corresponding to the target measurement value.
Here, according to a plurality of preset statistical modes corresponding to the target measurement value, a corresponding statistical value of the target measurement value corresponding to a preset number of wafer chips under the target parameter in each preset statistical mode is calculated.
Wherein calculating the statistical value includes, but is not limited to: calculating a maximum value, calculating a minimum value, calculating an average value, calculating a variance value, calculating a moving variance value, and the like.
And performing curve drawing on the statistic value of the target measurement value in a preset statistic mode according to a time node to generate a statistic control chart of the target parameter.
Here, a control map of the target parameter is determined by plotting statistical values of a plurality of types under the target measurement values using the SPC, and the quality of the wafer chip corresponding to each target measurement value is determined from the data of the statistical values at the respective points in the control map and the data of the target measurement value.
And S105, determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
In this step, according to the statistical control chart of the target parameter, it is determined that the target measurement value not in the parameter threshold interval is an abnormal measurement value, it is determined that the target measurement value in the parameter threshold interval is a normal measurement value, and according to the abnormal measurement value and the normal measurement value, the qualification degree of the wafer chips in the preset number is determined, that is, it is determined whether the wafer chips in the preset number are qualified wafer chips.
Here, the determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip based on the statistical control chart of the target parameter includes:
and judging whether each target measurement value under the target parameter is positioned in the parameter threshold interval or not based on the parameter threshold interval in the statistical control chart of the target parameter.
Here, the parameter threshold interval is a parameter threshold interval predicted by combining the SPC system with the corresponding target value under the input target parameter, and the target measurement values under different target parameters correspond to different parameter threshold intervals, where the target measurement values that are not within the parameter threshold interval are selected.
And if any target measurement value is outside the parameter threshold interval, determining that the target measurement value corresponding to the parameter value outside the parameter threshold interval is a deviation measurement value, and determining that the wafer chip corresponding to the deviation measurement value is an unqualified wafer chip, wherein the deviation measurement value is used for representing that the quality of the wafer chip corresponding to the target measurement value does not meet the quality of the standard wafer chip corresponding to the parameter threshold interval under the quality monitoring of the wafer chip of the target parameter.
The target measurement value in the parameter threshold interval is determined as a measurement value required to perform quality monitoring on the wafer chip under the target parameter, wherein the deviation measurement value is a target measurement value corresponding to a parameter value deviating from the parameter threshold interval in the statistical control chart under the target parameter in the process of performing quality monitoring on the wafer chip, the parameter threshold interval is a standard parameter value interval of the target parameter, the parameter value interval is a parameter value interval set according to the target parameter, and the deviation measurement value is a measurement value of which the parameter value corresponding to the target measurement value in the fixed value interval is not in the parameter value interval.
Further, after determining that the wafer chip corresponding to the measurement value is an unqualified wafer chip, the detection method further includes:
and performing secondary measurement under the target parameters aiming at the unqualified wafer chip, and if the wafer chip corresponding to the secondary value is not qualified, performing scrapping treatment on the wafer chip.
Here, the unqualified wafer chips are subjected to secondary measurement under target parameters or are adjusted and remedied according to a self-defined adjustment rule, such as: and sequentially adjusting according to the loop numbers in the circuits on the wafer chips to form remedial measures, and if the wafer chips corresponding to the secondary values are still unqualified after secondary measurement or remedial measures are carried out, scrapping the wafer chips.
Compared with the prior art, the wafer chip detection method provided by the embodiment of the application has the advantages that the first quartile and the third quartile are adopted to filter the corresponding measured values under the target parameters to obtain the target measured values, the statistical control chart of the target parameters is generated based on the target measured values, the data with large dispersion degree of the measured values and without reference significance are screened, the accuracy of the statistical control chart is further improved, and the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Referring to fig. 2, fig. 2 is a flowchart illustrating a method for inspecting a wafer chip according to another embodiment of the present application. As shown in fig. 2, a method for detecting a wafer chip provided in an embodiment of the present application includes:
s201, obtaining corresponding measured values of a preset number of wafer chips under target parameters in the testing process.
S202, determining a quartile distance corresponding to the target parameter in a target sequence based on a first quartile and a third quartile in the target sequence formed by corresponding measured values of a preset number of wafer chips under the target parameter.
In the step, a target sequence composed of measurement values corresponding to a preset number of wafer chips under a target parameter is subjected to quartile sorting, a first quartile and a third quartile in a target sequence test value are calculated in the sorted measurement values of the preset number, and a quartile distance corresponding to the target parameter in the target sequence is determined according to the first quartile and the third quartile in the target sequence.
Here, the determining a quartile range corresponding to a target parameter in a target sequence based on a first quartile and a third quartile in the target sequence composed of measurement values corresponding to the preset number of wafer chips under the target parameter includes:
and calculating a one-division position and a three-division position corresponding to the target parameter in the target sequence based on the target sequence consisting of the measured values of the preset number of wafer chips under the target parameter.
Here, in the embodiments provided in the present application, the one-quarter position is a numerical point at one-quarter position in the target sequence, and the three-third position is a numerical point at three-quarter position in the target sequence.
Calculating a first quartile at the dividing position and a third quartile at the trisection position in the target sequence based on the dividing position and the trisection position corresponding to the target parameter in the target sequence.
And determining the difference value between the third quartile and the first quartile as a quartile distance corresponding to the target parameter in the target sequence.
Here, the quartile range corresponding to the target parameter in the target sequence is determined by the following example:
assume that the measured values of the preset number of wafer chips in the test process under the target parameters are N1, N2, N3 … N12, and the corresponding values are 1,4, 23, 24, 25, 28, 34, 35, 36, 37, 67, 85, respectively.
Sorting the measured values according to the numerical values from small to large, and calculating a minute position and a third minute position:
the first division position is as follows: (n + 3)/4 = (12 + 3)/4 =3.75;
the trisection positions are as follows: (3 + n + 1)/4 = (3 + 12+ 1)/4 =9.25;
and calculating a first quartile at the dividing position and a third quartile at the dividing position in the target sequence according to the dividing position and the trisection position corresponding to the target parameter in the target sequence.
The first quartile is:
N3 +(N4 – N3)&0.75 = 23 + (23 –22)*0.75 = 23.75；
the third quartile is:
N9 + (N10 – N9)*0.25 = 36 + (37 –36)*0.25 = 36.25；
the four-bit distance is: 36.25-23.5 = 12.5;
the upper limit value is as follows: 36.25 +3 × 12.5 = 73.75;
the lower limit value is as follows: 23.75-3 by 12.5 = -13.75;
s203, determining a lower limit value corresponding to the target parameter according to a first preset relation between the quartile range and the first quartile, and determining an upper limit value corresponding to the target parameter according to a second preset relation between the quartile range and the third quartile.
Here, the first preset relational expression and the second preset relational expression are set according to the requirement in a self-defined manner, and it is assumed that the first preset relational expression provided by the present application is the sum of the third quartile and the triple quartile distance, and the second preset relational expression is the difference between the first quartile and the triple quartile distance.
Wherein, the upper limit value provided by the embodiment is 3.75; the lower limit value is-13.75.
Thus, if the average of the data in the sequence is calculated, the original average is 33.25; and the target sequence after the upper limit value and the lower limit value are determined is as follows: n1, N2, N3, N4, N5, N6, N7, N8, N9, N10, N11, when the target average is 28.55.
Here, the target average value is a statistical value from which abnormal measurement values are filtered out.
S204, filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain the filtered target measured values corresponding to the target parameters.
S205, generating a statistical control chart of the target parameter based on the corresponding target measurement values of the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a corresponding statistical value of the target measurement value along with time under a preset statistical mode.
S206, determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
The descriptions of S201 and S204 to S206 may refer to the descriptions of S101 and S103 to S105, and the same technical effects can be achieved, which are not described in detail.
Compared with the prior art, the wafer chip detection method provided by the embodiment of the application filters the corresponding measured values under the target parameters by adopting the first quartile and the third quartile to obtain the target measured values, generates the statistical control chart of the target parameters based on the target measured values, screens out data with large dispersion degree of the measured values and without reference significance, and further improves the accuracy of the statistical control chart, so that the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of an inspection apparatus for wafer chips according to an embodiment of the present disclosure, and fig. 4 is a schematic structural diagram of another inspection apparatus for wafer chips according to an embodiment of the present disclosure. As shown in fig. 3, the wafer chip inspection apparatus 300 includes:
the obtaining module 310 is configured to obtain a measurement value corresponding to a target parameter of a preset number of wafer chips in a testing process.
The first determining module 320 is configured to determine an upper limit value and a lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by measurement values corresponding to the preset number of wafer chips under the target parameter.
The filtering module 330 is configured to filter the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters, so as to obtain filtered target measured values corresponding to the target parameters.
A generating module 340, configured to generate a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a corresponding statistical value of the target measurement value along with time under a preset statistical mode.
A second determining module 350, configured to determine whether the wafer chip corresponding to each target measurement value is a qualified wafer chip based on the statistical control chart of the target parameter.
Compared with the prior art, the wafer chip detection device provided by the embodiment of the application filters the corresponding measured values under the target parameters by adopting the first quartile and the third quartile to obtain the target measured values, generates the statistical control chart of the target parameters based on the target measured values, screens out the data with larger dispersion degree of the measured values and without reference significance, and further improves the accuracy of the statistical control chart, so that the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Further, as shown in fig. 4, the wafer chip inspection apparatus 300 includes:
the obtaining module 310 is configured to obtain a measurement value corresponding to a target parameter of a preset number of wafer chips in a testing process.
The first determining module 320 is configured to determine an upper limit value and a lower limit value corresponding to a target parameter based on a first quartile and a third quartile in a target sequence formed by measurement values corresponding to the preset number of wafer chips under the target parameter.
The filtering module 330 is configured to filter the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters, so as to obtain filtered target measured values corresponding to the target parameters.
A generating module 340, configured to generate a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a corresponding statistical value of the target measurement value along with time under a preset statistical mode.
A second determining module 350, configured to determine whether the wafer chip corresponding to each target measurement value is a qualified wafer chip based on the statistical control chart of the target parameter.
And an adjusting module 360, configured to adjust the corresponding target parameter based on the unqualified wafer chip.
Compared with the prior art, the wafer chip detection device provided by the embodiment of the application filters the corresponding measured values under the target parameters by adopting the first quartile and the third quartile to obtain the target measured values, generates the statistical control chart of the target parameters based on the target measured values, screens out the data with larger dispersion degree of the measured values and without reference significance, and further improves the accuracy of the statistical control chart, so that the quality analysis of the wafer chip corresponding to each target measured value in the statistical control chart is more accurate.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. As shown in fig. 5, the electronic device 500 includes a processor 510, a memory 520, and a bus 530.
The memory 520 stores machine-readable instructions executable by the processor 510, when the electronic device 500 runs, the processor 510 communicates with the memory 520 through the bus 530, and when the machine-readable instructions are executed by the processor 510, the steps of the detection method in the method embodiments shown in fig. 1 and fig. 2 may be performed.
An embodiment of the present application further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the detection method in the method embodiments shown in fig. 1 and fig. 2 may be executed.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present application, and are used for illustrating the technical solutions of the present application, but not limiting the same, and the scope of the present application is not limited thereto, and although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope disclosed in the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the exemplary embodiments of the present application, and are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A method for detecting a wafer chip is characterized by comprising the following steps:
acquiring the corresponding measured values of a preset number of wafer chips under the target parameters in the test process;
determining an upper limit value and a lower limit value corresponding to a target parameter based on a first quartile and a third quartile in a target sequence formed by corresponding measurement values of the preset number of wafer chips under the target parameter;
filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain filtered target measured values corresponding to the target parameters;
generating a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a statistical value corresponding to the target measurement value in a preset statistical mode along with time;
and determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
2. The method as claimed in claim 1, wherein the determining the upper limit value and the lower limit value corresponding to the target parameter based on a first quartile and a third quartile in a target sequence formed by measurement values corresponding to the preset number of wafer chips under the target parameter comprises:
determining a quartile range corresponding to a target parameter in a target sequence based on a first quartile and a third quartile in the target sequence formed by corresponding measured values of a preset number of wafer chips under the target parameter;
determining a lower limit value corresponding to the target parameter according to a first preset relation between the quartile range and the first quartile, and determining an upper limit value corresponding to the target parameter according to a second preset relation between the quartile range and the third quartile.
3. The method as claimed in claim 2, wherein the determining the interquartile range corresponding to the target parameter in the target sequence based on the first interquartile and the third interquartile in the target sequence composed of the measured values corresponding to the preset number of wafer chips under the target parameter comprises:
calculating a one-division position and a three-division position corresponding to a target parameter in a target sequence based on the target sequence consisting of the corresponding measured values of a preset number of wafer chips under the target parameter;
calculating a first quartile at the dividing position and a third quartile at the dividing position in the target sequence based on the dividing position and the trisection position corresponding to the target parameter in the target sequence;
and determining the difference value between the third quartile and the first quartile as a quartile distance corresponding to the target parameter in the target sequence.
4. The method as claimed in claim 1, wherein the generating the statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter comprises:
determining a statistical value of the target measurement value in a preset statistical mode according to a target measurement value corresponding to the target parameter of the preset number of wafer chips and the preset statistical mode corresponding to the target measurement value;
and performing curve drawing on the statistic value of the target measurement value in a preset statistic mode according to a time node to generate a statistic control chart of the target parameter.
5. The method as claimed in claim 1, wherein the determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip based on the statistical control chart of the target parameter comprises:
judging whether each target measurement value under the target parameter is located in a parameter threshold interval based on the parameter threshold interval in the statistical control chart of the target parameter;
if any target measurement value is outside the parameter threshold interval, determining that the target measurement value corresponding to the parameter value outside the parameter threshold interval is a deviation measurement value, and determining that the wafer chip corresponding to the deviation measurement value is an unqualified wafer chip: and the deviation measurement value is used for representing that the quality of the wafer chip corresponding to the target measurement value does not accord with the quality of the standard wafer chip corresponding to the parameter threshold interval under the quality monitoring of the wafer chip of the target parameter.
6. The method as claimed in claim 5, wherein after determining that the wafer chip corresponding to the deviation measurement value is an unqualified wafer chip, the method further comprises:
and performing secondary measurement under the target parameters aiming at the unqualified wafer chip, and if the wafer chip corresponding to the secondary value is not qualified, performing scrapping treatment on the wafer chip.
7. The utility model provides a detection device of wafer chip which characterized in that, detection device of wafer chip includes:
the acquisition module is used for acquiring the corresponding measured values of the preset number of wafer chips under the target parameters in the test process;
the first determining module is used for determining an upper limit value and a lower limit value corresponding to a target parameter based on a first quartile and a third quartile in a target sequence formed by corresponding measured values of the preset number of wafer chips under the target parameter;
the filtering module is used for filtering the measured values corresponding to a preset number of target parameters according to the upper limit value and the lower limit value corresponding to the target parameters to obtain the filtered target measured values corresponding to the target parameters;
the generation module is used for generating a statistical control chart of the target parameter based on the target measurement values corresponding to the preset number of wafer chips under the target parameter; the statistical control chart is used for representing a curve graph of the change of a statistical value corresponding to the target measurement value in a preset statistical mode along with time;
and the second determining module is used for determining whether the wafer chip corresponding to each target measurement value is a qualified wafer chip or not based on the statistical control chart of the target parameter.
8. The apparatus of claim 7, wherein the first determining module is specifically configured to:
determining a quartile range corresponding to a target parameter in a target sequence based on a first quartile and a third quartile in the target sequence formed by corresponding measured values of a preset number of wafer chips under the target parameter;
determining a lower limit value corresponding to the target parameter according to a first preset relation between the quartile range and the first quartile, and determining an upper limit value corresponding to the target parameter according to a second preset relation between the quartile range and the third quartile.
9. An electronic device, comprising: a processor, a memory and a bus, the memory storing machine-readable instructions executable by the processor, the processor and the memory communicating via the bus when the electronic device is operated, the machine-readable instructions being executed by the processor to perform the steps of the wafer chip inspection method according to any one of claims 1 to 6.
10. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the wafer chip inspection method according to any one of claims 1 to 6 are performed.
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| CN118819990B (en) * | 2024-09-20 | 2025-01-24 | 山东云海国创云计算装备产业创新中心有限公司 | Memory termination resistor configuration method, electronic device and storage medium |
| CN119396010B (en) * | 2024-12-31 | 2025-04-25 | 合肥晶合集成电路股份有限公司 | Parameter control limit audit method, device, and computer equipment |
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