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CN115046414A - Production process of vapor chamber - Google Patents

Production process of vapor chamber Download PDF

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Publication number
CN115046414A
CN115046414A CN202210793175.7A CN202210793175A CN115046414A CN 115046414 A CN115046414 A CN 115046414A CN 202210793175 A CN202210793175 A CN 202210793175A CN 115046414 A CN115046414 A CN 115046414A
Authority
CN
China
Prior art keywords
cover plate
plate
cavity
frame
liquid inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202210793175.7A
Other languages
Chinese (zh)
Inventor
王奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Leishi Thermal Management Technology Co ltd
Original Assignee
Shenzhen Leishi Thermal Management Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Leishi Thermal Management Technology Co ltd filed Critical Shenzhen Leishi Thermal Management Technology Co ltd
Priority to CN202210793175.7A priority Critical patent/CN115046414A/en
Publication of CN115046414A publication Critical patent/CN115046414A/en
Withdrawn legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The invention discloses a production process of a temperature-uniforming plate, which comprises the steps of selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet requirements; processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching; etching the first cover plate and the second cover plate; connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate; carrying out vacuum treatment on the cavity of the vacuum pump through the liquid inlet; filling liquid through a liquid inlet; and sealing the liquid inlet to obtain the temperature-uniforming plate. The invention has the advantages of improved heat dissipation effect, high stability, difficult deformation, long service life, simple process, lower cost and the like.

Description

Production process of vapor chamber
Technical Field
The invention relates to a production process, in particular to a production process of a uniform temperature plate.
Background
Can be effectively quick through the temperature-uniforming plate take away the heat to the realization is to the heat dissipation of electronic product, current temperature-uniforming plate passes through upper cover and lower cover and constitutes, forms the cavity simultaneously between upper cover and lower cover, though can play the effect to a certain extent, but along with growing power heat dissipation demand, current structure has can't be satisfied, the temperature-uniforming plate of coming out through present technology simultaneously, stability is not high, the volatility, the technology is loaded down with trivial details and the cost is higher simultaneously.
Therefore, those skilled in the art have endeavored to provide a process for producing a vapor chamber plate that can effectively solve the above-mentioned technical problems.
Disclosure of Invention
In view of the above-mentioned defects in the prior art, the technical problem to be solved by the present invention is to provide a manufacturing process of a vapor chamber, which can effectively solve the above-mentioned technical problems.
In order to achieve the purpose, the invention provides a production process of a uniform temperature plate, which comprises the following steps:
s1, selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet the requirements;
s2, processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching;
s3, etching the first cover plate and the second cover plate;
s4, connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate;
s5, carrying out vacuum treatment on the cavity through the liquid inlet;
s6, filling liquid through the liquid inlet;
and S7, sealing the liquid inlet to obtain the temperature-equalizing plate.
As preferred, first apron with the second apron is the copper, packs into the wire net in the cavity, be provided with the first fin of a plurality of in the cavity, each first fin is located the middle part of cavity, and the interval sets up between per two adjacent first fins, each the both ends of first fin respectively with the inner wall laminating of first apron and second apron, the outer wall of second apron is provided with the mounting groove, be provided with a plurality of second fin in the mounting groove, each the one end of second fin with be located the mounting groove, each the other end of second fin with the outer wall of second apron flushes.
Preferably, the thickness of the first cover plate and the second cover plate is 0.3-0.6mm, and the wall thickness of the first cover plate and the second cover plate is 0.1-0.3 mm.
Preferably, the first cover plate and the second cover plate both have a groove formed by etching.
Preferably, before the first cover plate and the second cover plate form the cavity, a plurality of support columns are arranged on the inner wall of the first cover plate, a plurality of positioning discs are arranged on the inner wall of the second cover plate, the length of each support column is greater than that of each positioning disc, each positioning disc is arranged in one-to-one correspondence with each support column, and each positioning disc is provided with a positioning hole for the support column to penetrate through; through the cooperation of each support column and each positioning disk, can make first apron and second apron non-deformable.
Preferably, the middle part of each supporting column is of a hollow structure.
Preferably, before the cavity is formed, a circle of first frame is arranged along the edge of the first cover plate, a circle of second frame is arranged along the edge of the second cover plate, a plurality of protruding parts are arranged on the first frame, a plurality of limiting grooves matched with the protruding parts are arranged on the second frame, the second frame is attached to the first frame and matched with the first cover plate and the second cover plate to form the cavity, and the liquid inlet is formed in the first frame and the second frame simultaneously.
Preferably, a ring of annular iron sheets is avoided being arranged outside the second cover plate, and each first fin and each second fin are located between the annular iron sheets.
Preferably, after the liquid is filled for sealing treatment, a new performance test is carried out on the liquid, code spraying is carried out on the temperature equalization plate which is qualified in the test, and then shipment inspection is carried out.
Preferably, the heat dissipation device further comprises a shell which is made of a heat conduction material and is matched with the first cover plate and the second cover plate for use, the first cover plate and the second cover plate are located in the shell, an extension part used for extending out of the shell is arranged on the second cover plate, the upper end of the extension part is flush with the upper end of the second cover plate, the connection part of the extension part and the second cover plate is connected through a variable material, a heat dissipation unit is further involved between the shell and the temperature equalization plate, and heat on the temperature equalization plate is discharged out of the shell through the heat dissipation unit.
The invention has the beneficial effects that: the invention has the advantages of improved heat dissipation effect, high stability, difficult deformation, long service life, simple process, lower cost and the like.
Detailed Description
The invention is further illustrated by the following examples:
in the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
A production process of a vapor chamber comprises the following steps:
s1, selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet the requirements;
s2, processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching;
s3, etching the first cover plate and the second cover plate;
s4, connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate;
s5, carrying out vacuum treatment on the cavity through the liquid inlet;
s6, filling liquid through the liquid inlet;
s7, sealing the liquid inlet to obtain the uniform temperature plate
Example 2
A production process of a vapor chamber comprises the following steps:
s1, selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet the requirements;
s2, processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching; in this embodiment, first apron with the second apron is the copper, packs into the wire net in the cavity, be provided with the first fin of a plurality of in the cavity, each first fin is located the middle part of cavity, and the interval sets up between per two adjacent first fins, each the both ends of first fin respectively with the inner wall laminating of first apron and second apron, the outer wall of second apron is provided with the mounting groove, be provided with a plurality of second fin in the mounting groove, each the one end of second fin with be located the mounting groove, each the other end of second fin with the outer wall of second apron flushes. A circle of annular iron sheets is avoided being arranged outside the second cover plate, and each first fin and each second fin are located between the annular iron sheets. When the heat exchanger is actually used, the number of the second fins and the first fins and the distance between every two adjacent second fins can be selected according to actual needs.
The thickness of the first cover plate and the thickness of the second cover plate are both 0.3-0.6mm, and the wall thickness of the first cover plate and the wall thickness of the second cover plate are 0.1-0.3 mm. In this embodiment, the thicknesses of the first cover plate and the second cover plate are both 0.45mm, and the wall thicknesses of the first cover plate and the second cover plate are 0.2 mm.
S3, etching the first cover plate and the second cover plate; the first cover plate and the second cover plate are both provided with grooves formed by etching.
S4, connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate;
s5, carrying out vacuum treatment on the cavity through the liquid inlet; in this embodiment, before the first cover plate and the second cover plate form the cavity, a plurality of support pillars are disposed on an inner wall of the first cover plate, a plurality of positioning discs are disposed on an inner wall of the second cover plate, a length of each support pillar is greater than that of each positioning disc, each positioning disc is disposed in one-to-one correspondence with each support pillar, and each positioning disc is provided with a positioning hole through which the support pillar penetrates; through the cooperation of each support column and each positioning disk, can make first apron and second apron non-deformable. The middle part of each supporting column is of a hollow structure, and the stability of the supporting column is further improved through the arrangement, so that the supporting column is not easy to deform and has a longer service life.
S6, filling liquid through a liquid inlet; before the cavity is formed, a circle of first frame is arranged along the edge of the first cover plate, a circle of second frame is arranged along the edge of the second cover plate, a plurality of bulges are arranged on the first frame, a plurality of limiting grooves matched with the bulges are arranged on the second frame, the second frame is attached to the first frame and matched with the first cover plate and the second cover plate to form the cavity, and the liquid inlet is formed in the first frame and the second frame simultaneously. In order to improve the structural strength and simplify the manufacturing process, in the embodiment, the first frame and the second frame are integrally formed with the first cover plate and the second cover plate.
And S7, sealing the liquid inlet to obtain the temperature-equalizing plate. After the injected liquid is subjected to sealing treatment, new performance test is carried out on the injected liquid, code spraying is carried out on the temperature equalization plate qualified in the test, and then shipment inspection is carried out. When the performance test is carried out, the same batch of sampling test is adopted.
Example 3
A production process of a vapor chamber comprises the following steps:
s1, selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet the requirements;
s2, processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching; the sizes of the first cover plate and the second cover plate can be changed correspondingly according to actual needs, and the sizes of the first cover plate and the second cover plate are not specifically limited.
S3, etching the first cover plate and the second cover plate;
s4, connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate;
before the first cover plate and the second cover plate form a cavity, arranging a plurality of support columns on the inner wall of the first cover plate, arranging a plurality of positioning discs on the inner wall of the second cover plate, wherein the length of each support column is greater than that of each positioning disc, each positioning disc is arranged in one-to-one correspondence with each support column, and each positioning disc is provided with a positioning hole for the support column to penetrate through; through the cooperation of each support column and each positioning disk, can make first apron and second apron non-deformable. The middle part of each support column is of a hollow structure.
S5, carrying out vacuum treatment on the cavity through the liquid inlet;
s6, filling liquid through the liquid inlet;
and S7, sealing the liquid inlet to obtain the temperature-equalizing plate.
The first cover plate and the second cover plate are copper plates, a steel wire mesh is arranged in the cavity, a plurality of first fins are arranged in the cavity and located in the middle of the cavity, every two adjacent first fins are arranged at intervals, and each of the two ends of each first fin is respectively attached to the inner walls of the first cover plate and the second cover plate, a mounting groove is formed in the outer wall of the second cover plate, a plurality of second fins are arranged in the mounting groove and located in the mounting groove, and each of the two ends of each first fin is flush with the outer wall of the second cover plate.
The thickness of the first cover plate and the thickness of the second cover plate are both 0.3-0.6mm, and the wall thickness of the first cover plate and the wall thickness of the second cover plate are 0.1-0.3 mm.
The first cover plate and the second cover plate are both provided with grooves formed by etching. A circle of annular iron sheets is avoided being arranged outside the second cover plate, and each first fin and each second fin are located between the annular iron sheets.
Before the cavity is formed, a circle of first frame is arranged along the edge of the first cover plate, a circle of second frame is arranged along the edge of the second cover plate, a plurality of bulges are arranged on the first frame, a plurality of limiting grooves matched with the bulges are arranged on the second frame, the second frame is attached to the first frame and matched with the first cover plate and the second cover plate to form the cavity, and the liquid inlet is formed in the first frame and the second frame simultaneously. After the injected liquid is subjected to sealing treatment, new performance test is carried out on the injected liquid, code spraying is carried out on the temperature equalization plate qualified in the test, and then shipment inspection is carried out.
Wherein, this embodiment still include make through the heat conduction material and with first apron with the casing that the cooperation of second apron was used, first apron with the second apron is located in the casing, be provided with on the second apron and be used for extending the extension of casing, the upper end of extension with the upper end of second apron flushes, the extension with the junction of second apron adopts the variability material to connect, still involve the case and also radiating element between casing and the temperature-uniforming plate, through radiating element will heat discharge on the temperature-uniforming plate outside the casing. Through above structure, can effectually avoid local temperature difference and influence whole effect.
The foregoing detailed description of the preferred embodiments of the invention has been presented. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the present teachings without departing from the inventive concepts. Therefore, the technical solutions available to those skilled in the art through logic analysis, reasoning and limited experiments based on the prior art according to the concept of the present invention should be within the scope of protection defined by the claims.

Claims (10)

1. A production process of a vapor chamber is characterized by comprising the following steps:
s1, selecting a metal plate, inspecting the metal plate, and screening out unqualified metal plates which cannot meet the requirements;
s2, processing the selected qualified metal plate to form a first cover plate and a second cover plate in required shapes, wherein the formed first cover plate or the second cover plate is provided with a groove formed by etching;
s3, etching the first cover plate and the second cover plate;
s4, connecting the first cover plate with the second cover plate, forming a cavity for liquid to flow through a groove on the first cover plate or the second cover plate, and reserving a liquid inlet communicated with the cavity between the first cover plate and the second cover plate;
s5, carrying out vacuum treatment on the cavity through the liquid inlet;
s6, filling liquid through the liquid inlet;
and S7, sealing the liquid inlet to obtain the temperature-equalizing plate.
2. The production process of the temperature-equalizing plate as claimed in claim 1, wherein the first cover plate and the second cover plate are copper plates, a steel wire mesh is arranged in the cavity, a plurality of first fins are arranged in the cavity, each first fin is located in the middle of the cavity, every two adjacent first fins are arranged at intervals, two ends of each first fin are respectively attached to the inner walls of the first cover plate and the second cover plate, an installation groove is formed in the outer wall of the second cover plate, a plurality of second fins are arranged in the installation groove, one end of each second fin is located in the installation groove, and the other end of each second fin is flush with the outer wall of the second cover plate.
3. The process for producing a vapor chamber according to claim 1, wherein the first cover plate and the second cover plate each have a thickness of 0.3 to 0.6mm, and the first cover plate and the second cover plate each have a wall thickness of 0.1 to 0.3 mm.
4. The process for producing a vapor chamber plate according to claim 1, wherein the first cover plate and the second cover plate each have a groove formed by etching.
5. The production process of the temperature-equalizing plate as claimed in claim 1, wherein before the first cover plate and the second cover plate form the chamber, a plurality of support columns are arranged on the inner wall of the first cover plate, a plurality of positioning plates are arranged on the inner wall of the second cover plate, the length of each support column is greater than that of each positioning plate, each positioning plate is arranged corresponding to each support column, and each positioning plate is provided with a positioning hole for the support column to penetrate through; through the cooperation of each support column and each positioning disk, can make first apron and second apron non-deformable.
6. The process for producing a vapor chamber as claimed in claim 5, wherein the central portion of each of the support columns has a hollow structure.
7. The production process of the temperature-equalizing plate as claimed in claim 5, wherein before the cavity is formed, a circle of first frame is arranged along the edge of the first cover plate, a circle of second frame is arranged along the edge of the second cover plate, a plurality of protrusions are arranged on the first frame, a plurality of limiting grooves matched with the protrusions are arranged on the second frame, the second frame is attached to the first frame and matched with the first cover plate and the second cover plate to form the cavity, and the liquid inlet is simultaneously formed in the first frame and the second frame.
8. The process for producing a vapor chamber plate according to claim 2, wherein a ring of annular iron pieces is avoided from being provided outside the second cover plate, and each of the first fins and each of the second fins are located between the annular iron pieces.
9. The process for producing the vapor chamber as claimed in claim 1, wherein the filling liquid is subjected to a new performance test after being subjected to the sealing treatment, and the vapor chamber which is qualified in the test is subjected to code spraying and then subjected to shipment inspection.
10. The production process of the temperature equalization plate as claimed in claim 1, further comprising a housing made of a heat conductive material and used in cooperation with the first cover plate and the second cover plate, wherein the first cover plate and the second cover plate are located in the housing, an extension part for extending out of the housing is arranged on the second cover plate, the upper end of the extension part is flush with the upper end of the second cover plate, the connection part of the extension part and the second cover plate is connected by a variable material, a heat dissipation unit is further involved between the housing and the temperature equalization plate, and heat on the temperature equalization plate is discharged out of the housing through the heat dissipation unit.
CN202210793175.7A 2022-07-05 2022-07-05 Production process of vapor chamber Withdrawn CN115046414A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210793175.7A CN115046414A (en) 2022-07-05 2022-07-05 Production process of vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210793175.7A CN115046414A (en) 2022-07-05 2022-07-05 Production process of vapor chamber

Publications (1)

Publication Number Publication Date
CN115046414A true CN115046414A (en) 2022-09-13

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Application Number Title Priority Date Filing Date
CN202210793175.7A Withdrawn CN115046414A (en) 2022-07-05 2022-07-05 Production process of vapor chamber

Country Status (1)

Country Link
CN (1) CN115046414A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10185468A (en) * 1996-12-20 1998-07-14 Akutoronikusu Kk Plate heat pipe for inter-plane thermal diffusion coupling with maximal area ration
JP3063081U (en) * 1999-04-14 1999-10-19 咸台永 Note PC heat dissipating unit
US20130025829A1 (en) * 2011-07-26 2013-01-31 Kunshan Jue-Chung Electronics Co., Vapor chamber having heated protrusion
WO2018198353A1 (en) * 2017-04-28 2018-11-01 株式会社村田製作所 Vapor chamber
CN211373312U (en) * 2019-10-31 2020-08-28 建准电机工业股份有限公司 Vapor chamber and its capillary sheet
WO2021104463A1 (en) * 2019-11-28 2021-06-03 华为技术有限公司 Foldable vapor chamber and foldable electronic device
CN113446884A (en) * 2021-06-28 2021-09-28 东莞领益精密制造科技有限公司 Method for manufacturing vapor chamber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10185468A (en) * 1996-12-20 1998-07-14 Akutoronikusu Kk Plate heat pipe for inter-plane thermal diffusion coupling with maximal area ration
JP3063081U (en) * 1999-04-14 1999-10-19 咸台永 Note PC heat dissipating unit
US20130025829A1 (en) * 2011-07-26 2013-01-31 Kunshan Jue-Chung Electronics Co., Vapor chamber having heated protrusion
WO2018198353A1 (en) * 2017-04-28 2018-11-01 株式会社村田製作所 Vapor chamber
CN211373312U (en) * 2019-10-31 2020-08-28 建准电机工业股份有限公司 Vapor chamber and its capillary sheet
WO2021104463A1 (en) * 2019-11-28 2021-06-03 华为技术有限公司 Foldable vapor chamber and foldable electronic device
CN113446884A (en) * 2021-06-28 2021-09-28 东莞领益精密制造科技有限公司 Method for manufacturing vapor chamber

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Application publication date: 20220913