CN115043586A - Laser cutting method for improving quality of cut surface of glass carrier plate - Google Patents
Laser cutting method for improving quality of cut surface of glass carrier plate Download PDFInfo
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- CN115043586A CN115043586A CN202210893667.3A CN202210893667A CN115043586A CN 115043586 A CN115043586 A CN 115043586A CN 202210893667 A CN202210893667 A CN 202210893667A CN 115043586 A CN115043586 A CN 115043586A
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- 239000011521 glass Substances 0.000 title claims abstract description 58
- 238000003698 laser cutting Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 105
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000010924 continuous production Methods 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 239000000498 cooling water Substances 0.000 claims description 9
- 230000010355 oscillation Effects 0.000 claims description 9
- 239000002344 surface layer Substances 0.000 claims description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 3
- 239000001569 carbon dioxide Substances 0.000 claims description 3
- 238000003776 cleavage reaction Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000012790 confirmation Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000007017 scission Effects 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000005357 flat glass Substances 0.000 abstract description 3
- 239000006063 cullet Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a laser cutting method for improving the quality of a cut surface of a glass carrier plate, which relates to the technical field of carrier plate glass production and comprises the following specific cutting steps: confirming and adjusting the laser cutting device; taking the edge of the glass as a cutting starting point, cutting by using a cutter wheel to manufacture the cutting starting point, and marking 1-2 mm as an initial crack; applying laser with relative speed on the glass, irradiating the laser on the surface of the glass, heating, and rapidly cooling the rear end vicinity of the laser; heating and rapidly cooling by laser, and gradually extending the glass from the initial crack of the edge to form cutting action; and searching the optimal cutting condition, determining the optimal mass production condition, and acquiring the cutting section with a better state so as to carry out continuous production. Compared with a cutter wheel cutting mode, the method can effectively improve the quality of the ground section of the carrier plate after glass cutting, and reduce poor quality of the section; it produces less glass cullet; the laser cutting generates less micro-cracks, and the strength of the cut glass section can be better maintained.
Description
Technical Field
The invention relates to the technical field of carrier plate glass production, in particular to a laser cutting method for improving the quality of a cut surface of a glass carrier plate.
Background
The carrier plate glass is one of key basic materials of display equipment such as televisions, mobile phones and the like, and with the change of times, the potential possibility of the glass is developed to various fields endlessly, so that the living environment of people is beautified abundantly, and a lot of warmth and comfort are brought to the life of people. The glass semi-finished product needs to be subjected to fine cutting, and the glass is cut into finished products with the specifications specified by customers. In order to complete the glass cutting operation, the glass must be subjected to a certain technical condition to damage the glass to some extent, for example, a cutting wheel (a cutter with a sharp head) is used to apply a load (pressure) to the glass through the cutting wheel, a scratch mark having a shape proportional to the angle of the sharp head is generated on the glass, and a vertical crack is generated, so that the glass shows a state of being cut and cracked.
In the prior art, a cutter wheel is used for cutting, so that more glass chips are generated; in the cutting process, besides vertical cracks, certain horizontal cracks can also be generated, the quality of a cut surface is relatively uncontrollable, and the probability of chipping and edge breakage is high.
Disclosure of Invention
The present invention is directed to solve the above problems in the prior art, and a laser cutting method for improving the quality of the cut surface of a glass carrier is provided.
In order to realize the purpose, the invention provides the following technical scheme:
a laser cutting method for improving the quality of a cut surface of a glass carrier plate comprises the following specific cutting steps:
s1, confirming and adjusting a laser cutting device; coating a red mark pen on the glass, using laser to beat out light spots, and confirming the output of the laser; determining that the center of the laser spot is aligned to the center of the cross by using a cross jig, and otherwise, adjusting;
s2, taking the edge of the glass as a cutting starting point, cutting by using a cutter wheel to manufacture the cutting starting point, and marking 1-2 mm as an initial crack;
s3, giving laser with relative speed on the glass, irradiating the laser on the surface of the glass, heating, and rapidly cooling the vicinity of the rear end of the laser;
s4, heating and rapidly cooling by using laser, and gradually extending the glass from the initial crack of the edge to form a cutting action;
s5, searching for the optimal cutting condition, determining the optimal mass production condition, and obtaining the cutting section with a better state, thereby carrying out continuous production.
Preferably, the parameters of the laser cutting device are as follows: maximum power of 250W, medium carbon dioxide and wavelength of 10.6 microns; since 2 to 3% of the laser output is used as a monitor, in order to obtain a set value of the laser output, the laser output from the oscillator is oscillated at a slightly higher value so that a value obtained by subtracting 2 to 3% becomes a set value; the power monitor is provided with a thermistor, and 1mV is output every 1W;
confirming the laser cutting device before laser oscillation:
firstly, confirming that each valve of a cooling water path is in an opening state;
ensuring the power supply of the cooler to be in an ON state;
thirdly, confirming and adjusting a bypass valve, and adjusting the flow of the cooling water to a required size;
fourthly, confirming whether the cooling water path leaks or not, particularly, a joint part is used;
fifthly, confirming the irradiation position of the laser, and paying special attention due to danger;
sixthly, confirming the programmed linkage protection of the laser oscillation output;
seventhly, confirming to set a laser output permission switch, and when the switch is in an ON state, changing laser output into a standby state;
eighthly, confirming whether the laser output switch is clicked or not and confirming whether oscillation sound exists near the laser emission tube or not;
ninthly, equipment precision confirmation item: the flatness of the table top, the straightness of a laser moving shaft, the straightness of the table top movement, and the precision and angle of a PITCH;
confirming and adjusting the laser cutting device:
confirming the position of the laser tube, confirming the power supply monitor, confirming the laser output, adjusting the optical axis, confirming and adjusting the prism position, confirming the facula, confirming the polygon prism, confirming the nozzle, confirming the cutter head position, and adjusting the judging system.
Preferably, when the laser is irradiated on the surface of the glass and heated, the laser is absorbed by the surface of the glass, and the heat is transferred to the inside; in the section a-a, the temperature rises and becomes a compressive stress state; in the section b-b, only the surface layer is rapidly cooled, tensile stress is generated in the surface layer, high temperature remains in the interior, the surface layer becomes a compressive stress state, the internal compressive stress field becomes a fulcrum, large tensile stress is generated at the cooling point, and cracks are formed.
Preferably, the method for finding the cleavage conditions comprises:
confirming a cutting field, performing trial cutting by using combination conditions of various powers and speeds, and finding out an optimal cutting condition;
and secondly, changing the height of the lens, and performing trial cutting by using various power and speed combination conditions to find out the optimal cutting condition.
Preferably, the conditions affecting the cutting field include cutting speed and laser power, and the method for finding the cutting field includes:
firstly, the power is unchanged, and the field range of the cutting speed is searched;
and secondly, selecting power and speed from the speed field to confirm cutting.
Preferably, whether the cutting field is OK or not is judged, and when a cutting white line is seen in the judgment picture, the cutting field is judged to be OK; and judging that the cutting is NG when the cutting white line cannot be seen in the judgment picture.
Preferably, when it is determined that the cut white line is not visible in the screen, the reason for this is as follows:
firstly, under the condition that the position is wrong, the position of the camera is judged to be adjusted; under the condition that the focal position of the camera is not correct, adjusting the focal position;
second, the judgment screen may not see the cutting line, and actually the cutting condition is set improperly, and the cutting area needs to be confirmed again.
Preferably, if the power is too high and the cutting speed is too slow, the fracture surface quality NG is likely to occur, wherein the fracture surface quality indicates the situation of cracking caused by cutting;
the cutting melting can be caused by the overhigh power, the heat damage state of the carrier plate is caused by overhigh heat, and a corresponding method when melting is carried out is as follows: setting a fast point for the cutting speed; setting the laser power to a low point; and (4) changing the mechanical position.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a laser cutting method for improving the quality of a cut surface of a glass carrier plate, which can effectively improve the quality of the ground section of the glass carrier plate after cutting and reduce the poor quality of the section relative to a cutter wheel cutting mode; it produces less glass cullet; the laser cutting generates less micro cracks, and the strength of the cut glass section can be better maintained.
Drawings
FIG. 1 is a schematic view of the laser cutting principle of the present invention;
FIG. 2 is a laser cutting pattern embodied in the present invention;
FIG. 3 is a schematic illustration of the heating and cooling positions of the present invention;
FIG. 4 is a schematic view of the state at section a-a of FIG. 3;
FIG. 5 is a schematic view of the state at section b-b of FIG. 3;
FIG. 6 is a schematic diagram illustrating the determination of the quality of the cut according to the present invention;
FIG. 7 is a schematic diagram of the present invention for finding a cutting field;
FIG. 8 is a schematic view of the cross-sectional quality OK of the present invention;
FIG. 9 is a schematic view of the section quality NG of the present invention;
FIG. 10 is a photograph of a glass coated red marker in accordance with the present invention;
fig. 11 is a photograph of the cross jig of the present invention after adjustment.
FIG. 12 is a schematic view of a laser cutting apparatus according to the present invention with a laser output as a monitor;
FIG. 13 is a schematic view of a laser cutting apparatus according to the present invention;
FIG. 14 is a schematic diagram of a laser cutting process of the present invention to be adjusted.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-14, the present invention provides a technical solution:
a laser cutting method for improving the quality of a cut surface of a glass carrier plate comprises the following specific cutting steps:
s1, confirming and adjusting a laser cutting device; coating a red mark pen on the glass, using laser to beat out light spots, and confirming the output of the laser; determining that the center of the laser spot is aligned to the center of the cross by using a cross jig, and otherwise, adjusting;
s2, taking the edge of the glass as a cutting starting point, cutting by using a cutter wheel to manufacture the cutting starting point, and marking 1-2 mm as an initial crack;
s3, giving laser with relative speed on the glass, irradiating the laser on the surface of the glass, heating, and rapidly cooling the vicinity of the rear end of the laser;
s4, heating and rapidly cooling by using laser, and gradually extending the glass from the initial crack of the edge to form a cutting action;
s5, searching for the optimal cutting condition, determining the optimal mass production condition, and obtaining the cutting section with a better state, thereby carrying out continuous production.
In the above, the parameters of the laser cutting device are: maximum power of 250W, medium carbon dioxide and wavelength of 10.6 microns; since 2 to 3% of the laser output is used as a monitor, in order to obtain a set value of the laser output, the laser output from the oscillator is oscillated at a slightly higher value so that a value obtained by subtracting 2 to 3% becomes a set value; the power monitor is provided with a thermistor, and 1mV is output every 1W;
confirming the laser cutting device before laser oscillation:
firstly, confirming that each valve of a cooling water path is in an opening state;
ensuring the power supply of the cooler to be in an ON state;
thirdly, confirming and adjusting a bypass valve, and adjusting the flow of the cooling water to the required size, wherein the specific flow is 6L/Min;
fourthly, confirming whether the cooling water path leaks or not, particularly, a joint part is used;
fifthly, confirming the irradiation position of the laser, and paying special attention due to danger;
sixthly, confirming the programmed linkage protection of the laser oscillation output;
confirming to set a laser output permission switch, wherein when the switch is in an ON state, the laser output is changed into a standby state;
eighthly, confirming whether the laser output switch is clicked or not and confirming whether oscillation sound exists near the laser emission tube or not;
ninthly, equipment precision confirmation item: the flatness of the table top, the straightness of a laser moving shaft, the straightness of the table top movement, and the precision and angle of a PITCH;
confirming and adjusting the laser cutting device:
confirming the position of the laser tube, confirming the power supply monitor, confirming the laser output, adjusting the optical axis, confirming and adjusting the prism position, confirming the facula, confirming the polygon prism, confirming the nozzle, confirming the cutter head position, and adjusting the judging system.
In the above, when the laser is irradiated on the surface of the glass and heated, the laser is absorbed by the surface of the glass and the heat is transmitted to the inside; in the section a-a, the temperature rises and becomes a compressive stress state; in the section b-b, only the surface layer is rapidly cooled, tensile stress is generated in the surface layer, high temperature remains in the interior, the surface layer becomes a compressive stress state, the internal compressive stress field becomes a fulcrum, large tensile stress is generated at the cooling point, and cracks are formed.
In the above, the method of searching for cleavage conditions:
confirming a cutting field, performing trial cutting by using combination conditions of various powers and speeds, and finding out an optimal cutting condition;
and secondly, changing the height of the lens, and performing trial cutting by using various power and speed combination conditions to find out the optimal cutting condition.
In the above, the conditions affecting the cutting field include cutting speed and laser power, and the method for finding out the cutting field includes:
firstly, the power is unchanged, and the field range of the cutting speed is searched;
and secondly, selecting power and speed from the speed field to confirm cutting.
Judging whether the cutting field is OK or not, and judging that the cutting is OK when a cutting white line is seen in the judgment picture; and judging that the cutting is NG when the cutting white line cannot be seen in the judgment picture.
In the above, when it is determined that the cut white line is not visible in the screen, the reason is as follows:
firstly, under the condition that the position is wrong, the position of the camera is judged to be adjusted; under the condition that the focal position of the camera is not correct, adjusting the focal position;
second, the judgment screen may not see the cutting line, and actually the cutting condition is set improperly, and the cutting area needs to be confirmed again.
Among the above, if the power is too high and the cutting speed is too slow, the fracture surface quality NG is likely to occur, wherein the fracture surface quality indicates the situation of cracking caused by cutting;
the cutting and melting can be caused by overhigh power, the heat damage state of the carrier plate is caused by overhigh heat, and a corresponding method when melting is carried out is as follows: setting a fast point for the cutting speed; setting the laser power to a low point; and (4) changing the mechanical position.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. A laser cutting method for improving quality of a cut surface of a glass carrier plate is characterized by comprising the following steps: the specific cutting steps are as follows:
s1, confirming and adjusting a laser cutting device; coating a red mark pen on the glass, using laser to beat out light spots, and confirming the output of the laser; determining that the center of the laser spot is aligned to the center of the cross by using a cross jig, and otherwise, adjusting;
s2, taking the edge of the glass as a cutting starting point, cutting by using a cutter wheel to manufacture the cutting starting point, and marking 1-2 mm as an initial crack;
s3, giving laser with relative speed on the glass, irradiating the laser on the surface of the glass, heating, and rapidly cooling the vicinity of the rear end of the laser;
s4, heating and rapidly cooling by using laser, and gradually extending the glass from the initial crack of the edge to form a cutting action;
s5, searching for the optimal cutting condition, determining the optimal mass production condition, and obtaining the cutting section with a better state, thereby carrying out continuous production.
2. The laser cutting method for improving the quality of the cut surface of the glass carrier plate according to claim 1, wherein the laser cutting method comprises the following steps: the parameters of the laser cutting device are as follows: maximum power of 250W, medium carbon dioxide and wavelength of 10.6 microns; since 2 to 3% of the laser output is used as a monitor, in order to obtain a set value of the laser output, the laser output from the oscillator is oscillated at a slightly higher value so that a value obtained by subtracting 2 to 3% becomes a set value; the power monitor is provided with a thermistor, and 1mV is output every 1W;
confirming the laser cutting device before laser oscillation:
firstly, confirming that each valve of a cooling water path is in an opening state;
ensuring the power supply of the cooler to be in an ON state;
thirdly, confirming and adjusting a bypass valve, and adjusting the flow of the cooling water to the required size;
fourthly, confirming whether the cooling water path leaks or not, particularly, a joint part is used;
fifthly, confirming the irradiation position of the laser, and paying special attention due to danger;
sixthly, confirming the programmed linkage protection of the laser oscillation output;
seventhly, confirming to set a laser output permission switch, and when the switch is in an ON state, changing laser output into a standby state;
eighthly, confirming whether the laser output switch is clicked or not and confirming whether oscillation sound exists near the laser emission tube or not;
ninthly, equipment precision confirmation item: the flatness of the table top, the straightness of a laser moving shaft, the straightness of the table top movement, and the precision and angle of a PITCH;
confirming and adjusting the laser cutting device:
confirming the position of the laser tube, confirming the power supply monitor, confirming the laser output, adjusting the optical axis, confirming and adjusting the prism position, confirming the facula, confirming the polygon prism, confirming the nozzle, confirming the cutter head position, and adjusting the judging system.
3. The laser cutting method for improving the quality of the cut surface of the glass carrier plate according to claim 1, wherein the laser cutting method comprises the following steps: when laser irradiates the surface of the glass and is heated, the laser is absorbed by the surface of the glass, and the heat is transferred to the inside; in the section a-a, the temperature rises and becomes a compression stress state; in the section b-b, only the surface layer is rapidly cooled, tensile stress is generated in the surface layer, high temperature remains in the interior, the surface layer becomes a compressive stress state, the internal compressive stress field becomes a fulcrum, large tensile stress is generated at the cooling point, and cracks are formed.
4. The laser cutting method for improving the quality of the cut surface of the glass carrier plate according to claim 1, wherein the laser cutting method comprises the following steps: method for finding cleavage conditions:
confirming a cutting field, performing trial cutting by using combination conditions of various powers and speeds, and finding out an optimal cutting condition;
and secondly, changing the height of the lens, and performing trial cutting by using various power and speed combination conditions to find out the optimal cutting condition.
5. The laser cutting method for improving the quality of the cut surface of the glass carrier plate according to claim 4, wherein: the conditions affecting the cutting field include cutting speed and laser power, and the method for finding out the cutting field includes:
firstly, the power is unchanged, and the field range of the cutting speed is searched;
and secondly, selecting power and speed from the speed field to confirm cutting.
6. The laser cutting method for improving the quality of the cut surface of the glass carrier according to claim 5, wherein: judging whether the cutting field is OK or not, and judging that the cutting is OK when a cutting white line is seen in the judgment picture; and judging that the cutting is NG when the cutting white line cannot be seen in the judgment picture.
7. The laser cutting method for improving the quality of the cut surface of the glass carrier according to claim 6, wherein: when it is determined that the cut white line cannot be seen in the picture, the reason for this is as follows:
firstly, under the condition that the position is wrong, the position of the camera is judged to be adjusted; under the condition that the focal position of the camera is not correct, adjusting the focal position;
second, the judgment screen may not see the cutting line, and actually the cutting condition is set improperly, and it is necessary to confirm the cutting area again.
8. The laser cutting method for improving the quality of the cut surface of the glass carrier according to claim 5, wherein: if the power is too high and the cutting speed is too slow, the fracture quality is prone to NG, wherein the fracture quality is used for representing the situation that the cutting causes cracks;
the cutting melting can be caused by the overhigh power, the heat damage state of the carrier plate is caused by overhigh heat, and a corresponding method when melting is carried out is as follows: setting a fast point for the cutting speed; setting the laser power to a low point; and (4) changing the mechanical position.
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| CN202210893667.3A CN115043586A (en) | 2022-07-27 | 2022-07-27 | Laser cutting method for improving quality of cut surface of glass carrier plate |
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| CN202210893667.3A CN115043586A (en) | 2022-07-27 | 2022-07-27 | Laser cutting method for improving quality of cut surface of glass carrier plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115846908A (en) * | 2022-12-28 | 2023-03-28 | 深圳市汇川技术股份有限公司 | Laser cutting control method, device and equipment and storage medium |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102249527A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Apparatus for cutting glass, and method thereof |
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- 2022-07-27 CN CN202210893667.3A patent/CN115043586A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102249527A (en) * | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | Apparatus for cutting glass, and method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115846908A (en) * | 2022-12-28 | 2023-03-28 | 深圳市汇川技术股份有限公司 | Laser cutting control method, device and equipment and storage medium |
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Application publication date: 20220913 |
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| RJ01 | Rejection of invention patent application after publication |