CN115056579B - Corrosion-resistant thermal printing head - Google Patents
Corrosion-resistant thermal printing head Download PDFInfo
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- CN115056579B CN115056579B CN202210747869.7A CN202210747869A CN115056579B CN 115056579 B CN115056579 B CN 115056579B CN 202210747869 A CN202210747869 A CN 202210747869A CN 115056579 B CN115056579 B CN 115056579B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
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Abstract
The application provides a corrosion-resistant thermal printing head, which solves the technical problem that an electrode is easy to be corroded and damaged in a high-temperature and high-humidity environment of a heating substrate for the conventional thermal printing head; the heat-generating substrate comprises an insulating substrate, a heat-accumulating glaze layer is formed on the surface of the insulating substrate at least partially, electrodes are arranged on the surfaces of the insulating substrate and the heat-accumulating glaze layer, paper-outlet side edges and two connected side edges of the upper surface of the insulating substrate are provided with metal protection layers which are more active than electrode materials, are not easy to react with the electrodes and are not easy to oxidize on the surfaces to generate protection layers, and the metal protection layers are at least partially exposed outside; the metal protection layer potential is higher than the electrode potential in at least a partially non-printed state. The application can be widely applied to the technical field of thermal printing.
Description
Technical Field
The present application relates to thermal printheads and, more particularly, to a corrosion resistant thermal printhead.
Background
As is well known, a heat generating substrate for a thermal head of the related art is generally formed by coating a protective layer such as glass enamel on the surface of an electrode, and Au and/or Ag is generally used as a material of the electrode. However, there are often pores in materials such as glass glaze as a protective layer, and generally, a printing medium (thermal paper, ink ribbon, etc.) contains alkali metal and halogen ions in a certain concentration, and electrochemical reaction of an electrode occurs in a high-temperature and high-humidity environment, so that the electrode is corroded and damaged, and the service life is affected.
Japanese patent JPWO2016104479A1 discloses a thermal head and a thermal printer which improve sealability by changing a substrate structure to avoid electrode corrosion.
Chinese patent CN206826188U discloses a heating substrate for thermal print head suitable for humid environment, which is provided with a conductive glass glaze protective layer, the conductive glass glaze protective layer is connected with a printing power supply, so that the potential difference between the conductive glass glaze protective layer and the printing power supply is smaller than the hydrolysis potential difference, and the electrode is prevented from being corroded, thereby improving the electric corrosion resistance of the thermal print head.
Japanese patent JP1994218972A, which changes the electrode material, forms an electrode from a nitride containing Ti, zr, hf, V, nb, ta, cr, mo, W as a main component, and improves heat resistance, adhesion, and corrosion resistance.
The prior documents above either relate to structural improvement, or adopt a conductive glass glaze protective layer or adopt a corrosion-resistant material for the electrode, but do not describe active metal materials and related voltage application methods, and cannot achieve good protection effect against corrosion in a more severe environment.
Disclosure of Invention
In order to solve the problems, the application adopts the following technical scheme: the heat-storage glaze layer is formed on the surface of the insulating substrate at least partially, electrodes are arranged on the surfaces of the insulating substrate and the heat-storage glaze layer, the paper outlet side edge and the two connected side edges of the upper surface of the insulating substrate are provided with metal protection layers which are more active than electrode materials, are not easy to react with the electrodes and are not easy to oxidize to generate protection layers on the surfaces, and the metal protection layers are at least partially exposed outside; in at least a partially non-printed state, the metal protection layer potential is higher than the electrode potential.
Preferably, the printing head further comprises an isolation protection power supply for applying voltage to the metal protection layer, wherein the positive electrode of the isolation protection power supply is connected with the metal protection layer, and the negative electrode of the isolation protection power supply is connected with the printing head power supply VH.
Preferably, the printer control power supply is switched, the printer power supply VDD is connected with the metal protection layer, and the printer power supply VH is disconnected in the standby state and each line printing interval; during printing, the printer power supply VDD turns off the metal protective layer, and the printhead power supply VH turns on the printer power supply VH.
Preferably, a delay time of 10us to 20us is provided between the signal switching and the printing state transition.
Preferably, the power switching is controlled by the printhead, which includes logic gates for detecting print start and stop, analog switching circuitry for signal switching.
Preferably, a delay buffer circuit for delaying between signal switches is also included.
Preferably, the logic gate circuit comprises a NAND gate, and the analog switch circuit comprises a first analog switch and a second analog switch;
the input end of the NAND gate is used for being connected with a plurality of strobe signal lines STB of the printer, and the output end of the NAND gate is connected with the control ends of the first analog switch and the second analog switch;
The input end of the first analog switch is used for being connected with the printer power supply VH, and the output end of the first analog switch is connected with the printer power supply VH; the input end of the second analog switch is used for being connected with a printer power supply VDD, and the output end of the second analog switch is connected with a metal protective layer of the printing head; a current limiting resistor is connected between the printhead power supply VH and the ground GND.
Preferably, the delay buffer circuit includes a plurality of delay buffers, and input terminals of the plurality of delay buffers are used for being correspondingly connected with a plurality of strobe signal lines STB of the printer, and output terminals of the plurality of delay buffers are correspondingly connected with a plurality of strobe signal lines STB of the printhead.
Preferably, the metal protective layer is not directly connected to the electrode and there is a gap of at least 0.1mm.
Preferably, the voltage difference between the metal protection layer and the electrode is not less than 1V, and the metal protection layer is at positive potential.
The invention has the beneficial effects that the metal protection layer which is more active than the electrode material, is not easy to react with the electrode and is not easy to oxidize the surface to generate the protection layer is additionally arranged on the insulating substrate, the metal protection layer is corroded earlier than the electrode, and meanwhile, the metal protection layer is ensured to be corroded normally, and the reaction with the electrode is avoided, so that the protection effect on the electrode is realized. Meanwhile, the potential of the metal protection layer is higher than that of the electrode, so that the electrode is protected.
And provides three different pressing methods: (1) An isolation protection power supply is added outside the original power supplies (VDD and VH) of the printing head, the anode of the isolation protection power supply is connected with a metal protection layer, and the cathode of the isolation protection power supply is connected with the power supply VH of the printing head; (2) Under the condition that an isolation protection power supply is not added and the printer is controlled to switch, the printer keeps the printer power supply VDD to be connected with a metal protection layer in a standby state and each line of printing interval, and the printer power supply VH to be connected with a disconnected printer power supply VH; in the printing process, the printer power supply VDD is kept to be disconnected with the metal protective layer, the printer power supply VH is connected with the printer power supply VH, and a certain delay time (10 us-20 us) is set between signal switching and printing; (3) Under the condition that an isolation protection power supply is not added and the power supply is controlled to be switched by the printing head, a delay buffer is adopted on the printing head to carry out delay between switching, and a logic gate circuit is adopted on the printing head to realize detection of start and stop of printing. In the printing stop state, the printer power supply VDD is kept connected with the metal protection layer, and the printer power supply VH is disconnected; in the printing process, the printer power supply VDD is kept off the metal protective layer, the printer power supply VH is turned on, and a certain delay time (10 us to 20 us) is set between signal switching and printing. The delay time is set to ensure the reliable switching of VDD, VH, GND signals and avoid influencing printing; the delay of 10 us-20 us ensures reliable switching of the circuit and does not affect the total printing time.
The three methods can apply positive potential relative to the electrode to the metal protective layer, and the metal protective layer with stronger activity is easier to lose electrons by utilizing an electrochemical principle, so that the electrode corrosion is well protected, and the service life of the thermal printing head is effectively prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic top view of a thermal print head heating substrate of the present invention;
FIG. 2 is a schematic cross-sectional view of a thermal head heating substrate according to the present invention;
FIG. 3 is a flow chart of a control method of the second embodiment;
Fig. 4 is a circuit diagram of the third embodiment;
fig. 5 is a control timing chart of the third embodiment.
The symbols in the drawings illustrate:
1. An insulating substrate; 2. a heat storage glazing layer; 3. an electrode; 3a, individual electrodes; 3b, a common electrode; 3c, sharing COM;4. a heating resistor; 5. a metal protective layer; 6. an insulating protective layer; 7. a bonding pad; 8. a socket; 9. windowing; u1. a first delay buffer; u2. a second delay buffer; u3. a third delay buffer; u4. AND gates; u5. NOT gates; K1. a first analog switch; K2. a second analog switch; z, protecting the signal; t1, printing intermittence; t2, actual printing time; t, printing period; td. signal delay times.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the description of the present application, the meaning of "plural" means two or more, unless specifically defined otherwise.
The heat generating substrate for a thermal head according to the embodiment of the present application will now be described.
Example 1
Referring to fig. 1 and 2, a schematic structural diagram of a heat-generating substrate for a corrosion-resistant thermal printhead is shown, the heat-generating substrate for a corrosion-resistant thermal printhead includes an insulating substrate 1, a heat-accumulating glaze layer 2 is formed on at least a portion of a surface of the insulating substrate 1, electrodes 3 are disposed on the surfaces of the insulating substrate 1 and the heat-accumulating glaze layer 2, and a metal protection layer 5 which is more reactive than the material of the electrodes 3, is less reactive with the electrodes 3, and is less susceptible to oxidation to form a protection layer on the surface is disposed on a paper-out side edge (upper edge in fig. 1) and two connected side edges of the upper surface of the insulating substrate 1. The metal protection layer 5 is prone to lose electrons, thereby playing a better role in protecting the electrode 3.
The surface of the metal protection layer 5 is partially covered with an insulating protection layer 6, part of the metal protection layer is exposed outside, and the surface of the electrode 3 is also covered with the insulating protection layer 6. Thereby not only ensuring that the metal protection layer 5 can be oxidized normally, but also preventing the metal protection layer 5 from falling off due to abrasion.
In one embodiment, to avoid the situation that the metal protection layer 5 is too close to the electrode 3, metal migration is caused to short. There is a gap between the metal protection layer 5 and the electrode 3. Specifically, the gap is at least 0.1mm.
In one embodiment, the thickness of the metal protection layer 5 is 0.1 to 5um in order to keep the thickness of the metal protection layer 5 appropriate while ensuring that the electrode 3 is protected.
Further, a voltage is applied between the metal cap layer 5 and the electrode 3 so that the metal cap layer 5 is at a positive potential and a voltage difference from the electrode 3 is not less than 1V. The metal protective layer 5 is easier to lose electrons, thereby playing a better role in protecting the electrode 3 and prolonging the service life of the thermal printing head.
Specifically, according to the metal activity sequence table: K. ba, ca, na, mg, al, mn, zn, cr, fe, ni, sn, pb, (H), cu, hg, ag, pt, au, when Au and/or Ag are generally used as the material of the electrode 3, the metal protective layer 5 may be one or more of Zn, cr, ni, cu and the like, a metal material having activity stronger than Au and/or Ag. In addition, al is not recommended, because Al is easy to generate an oxide layer due to oxidation, thereby being isolated from the environment and not capable of generating reaction; sn is not recommended because Sn reacts readily with Au electrodes to form alloys at high temperatures.
Further, the active metal protective layer 5 may be realized by a process such as print sintering, PVD, CVD, electroplating, or electroless plating.
The electrode 3 includes an individual electrode 3a, a common electrode 3b, and a common COM3c, the common electrode 3b and the common COM3c are connected, and a heat generating resistor 4 is provided between the individual electrode 3a and the common electrode 3 b; one end of the individual electrode 3a is connected to the heat generating resistor 4, the other end is connected to the pad 7, one end of the common electrode 3b is connected to the heat generating resistor 4, the other end is connected to a printing power source through the common COM3c, and the surfaces of the heat generating resistor 4, the individual electrode 3a, the common electrode 3b, and the common COM3c are covered with the insulating protective layer 6.
Specifically, in order to form the effect of partial coverage and partial exposure, the surface of the metal protection layer 5 may be provided with insulating protection layers 6 at intervals, or after the surface of the metal protection layer 5 is covered with the insulating protection layers 6, windows 9 may be provided at intervals.
Further, the embodiment also provides a corrosion-resistant thermal print head, which comprises the heating substrate for the thermal print head.
Further, regarding the voltage applied between the metal protection layer 5 and the electrode 3, in this embodiment, an isolation protection power supply (which is not commonly grounded with the original power supplies of the printhead) is added, the positive electrode of the isolation protection power supply is connected to the metal protection layer 5, the negative electrode is connected to the printhead power supply VH, and the voltage applied is maintained no matter whether printing is performed, the isolation protection power supply has a withstand voltage exceeding the printhead power supply VH, the current capacity is less than 1A, and the isolation protection power supply has overvoltage and overcurrent protection functions. The voltage applied to the electrodes in the printing state is more prone to corrosion, so that the positive potential applied to the metal protection layer 5 can play a role in protecting the electrodes better.
In this embodiment, the isolation protection power supply is connected to the print head through the socket 8, wherein the power supplies VH and VDD on the socket 8 are correspondingly connected to the print head power supplies VH and VDD, and the protection signal line Z of the socket 8 is correspondingly connected to the metal protection layer 5.
Example two
A first difference from the embodiment is that the method of applying the voltage is different.
In the embodiment, the isolation protection power supply is not added and is switched by the printer control power supply, the printer is in a standby state and print intervals of each row, the printer power supply VDD is kept connected with the protection signal Z, namely connected with the metal protection layer 5, and the printer power supply VH is disconnected from the printer power supply VH; during printing, the printer power supply VDD is kept off by the protection signal Z, that is, the metal protective layer 5 is turned off, the printer power supply VH is turned on, and a certain delay time (10 us to 20 us) is set between signal switching and printing. For specific control steps, please refer to fig. 3:
Step1: in a standby state, the printer power supply VDD is connected with the protection signal Z, and the printer power supply VH is disconnected;
Step2: if the printing is judged to be started, the VH is powered on and delayed by more than 10ms (specifically determined according to the charging time of the power supply capacitor);
Step3: the printer power supply VDD turns off the protection signal Z, and the printhead power supply VH turns on the printer power supply VH;
Step4: delaying the strobe signal STB of the printer by 10-20 us through a delay circuit, ending Ton and closing the STB;
Step5: the printer power supply VDD is connected with the protection signal Z through delay of 10-20 us by a delay circuit, and the printer power supply VH is disconnected;
Step6: if the next printing period is entered, repeating Step3 to Step5;
Step7: if the next printing period does not exist, printing is finished, the printer power supply VDD is connected with the protection signal Z, and the printer power supply VH is disconnected;
Step8: VH is turned off and printing is ended.
Delay time is set in Step4 and Step5 to ensure reliable switching of VDD, VH, GND signals and avoid influencing printing; the delay of 10 us-20 us ensures reliable switching of the circuit and does not affect the total printing time.
Example III
A first difference from the embodiment is that the method of applying the voltage is different.
In the embodiment, the isolation protection power supply is not added, the printing head is used for controlling the power supply to switch, a delay buffer is adopted on the printing head for carrying out delay between switching, the delay buffer can adopt RC delay and shaping circuits or microsecond delay chips, the printing head adopts a logic gate circuit for realizing detection of start and stop of printing, the printing power supply VDD is kept to be connected with a protection signal Z, namely, is connected with a metal protection layer 5, and the printing head power supply VH is disconnected with the printing power supply VH; during printing, the printer power supply VDD is kept off by the protection signal Z, that is, the metal protective layer 5 is turned off, the printer power supply VH is turned on, and a certain delay time (10 us to 20 us) is set between signal switching and printing.
In particular, please refer to fig. 4, which is a circuit diagram of the print head. The multiple strobe signal lines STB of the printer are respectively connected with the multiple strobe signal lines STB of the printer head TPH through multiple delay buffers, the multiple strobe signal lines STB of the printer are respectively connected with the input ends of a serial circuit (or a NAND gate) of the AND gate U4 and the NOT gate U5, the output ends of the serial circuit (or the NAND gate) of the AND gate U4 and the NOT gate U5 are respectively connected with the control ends of the first analog switch K1 and the second analog switch K2, the input end of the first analog switch K1 is connected with the VH of the printer, and the output end of the first analog switch K1 is connected with the VH of the printer head; the input end of the second analog switch K2 is connected with a printer power supply VDD, the output end of the second analog switch K2 is connected with a protection signal Z of the printing head, and the protection signal Z of the printing head is connected with a metal protection layer 5. The printer power supply VDD is connected with the power supply VDD of the printing head TPH, the GND of the printer is connected with the GND of the printing head TPH, a current-limiting resistor R is connected between the printing head power supply VH and the GND, and the R resistance value is set to be more than 1MΩ.
Specifically, the gate signal lines STB of this embodiment have three corresponding delay buffers, namely, the first delay buffer U1, the second delay buffer U2, and the third delay buffer U3. The first analog switch K1 and the second analog switch K2 can be implemented by using analog switch chips such as CD 4066.
The multi-channel STB strobe signal sent by the printer is divided into two parts, one part is connected with the STB signal of the printing head TPH through the delay buffer, and after the delay buffer delays 10 us-20 us, the signal is output to the printing head, so that the reliable switching of VDD, VH, GND signals is ensured, the printing is prevented from being influenced, the reliable switching of a circuit is ensured, and the total printing time is not influenced; the other part is used as a switching control signal of a printing head power supply VH and a protection signal Z through an AND gate U4 and a NOT gate U5, so that the printing head power supply VH is disconnected by the protection signal Z which is used for keeping the printing head power supply VDD connected with the printing head in a printing stop state, namely the printing head power supply VH is connected with a metal protection layer 5; during printing, the printer power supply VDD is kept off the print head protection signal Z, i.e. the metallic protection layer 5.
Referring to fig. 5, in order to show a timing chart corresponding to the present embodiment, a plurality of STB strobe signals of the printer are output, delayed by Td, and then input to corresponding STB strobe signal receiving terminals of the printhead, and a printing cycle T includes two printing intervals T1 and an actual printing time T2. When the printing interval T1 is ended and the actual printing time T2 is started, the printer power supply VDD is disconnected with the protection signal Z, and the printer power supply VH is connected with the printer power supply VH for powering on; when the actual printing time T2 is over and the printing interval T1 is started, the printer power supply VDD is connected to the protection signal Z, and the printer power supply VH is disconnected from the printer power supply VH.
According to the invention, the metal protection layer 5 which is more active than the material of the electrode 3, is not easy to react with the electrode 3 and is not easy to oxidize to generate the protection layer is additionally arranged on the insulating substrate 1, the metal protection layer 5 is corroded earlier than the electrode 3, and meanwhile, the metal protection layer 5 is ensured to be corroded normally, and the reaction with the electrode 3 is avoided, so that the protection effect on the electrode 3 is realized. Meanwhile, the potential of the metal protection layer 5 is higher than that of the electrode, so that the electrode is protected.
And provides three different pressing methods: (1) An isolation protection power supply is added outside the original power supplies (VDD and VH) of the printing head, the anode of the isolation protection power supply is connected with the metal protection layer 5, and the cathode of the isolation protection power supply is connected with the power supply VH of the printing head; (2) Under the condition that an isolation protection power supply is not added and the printer is controlled to switch power supply, the printer keeps the printer power supply VDD connected with the metal protection layer 5 in a standby state and every line of printing intermittence, and the printer power supply VH is disconnected; in the printing process, the printer power supply VDD is kept to be disconnected from the metal protective layer 5, the printer power supply VH is connected with the printer power supply VH, and a certain delay time (10 us-20 us) is set between signal switching and printing; (3) Under the condition that an isolation protection power supply is not added and the power supply is controlled to be switched by a printing head, a delay buffer is adopted on the printing head to carry out delay between switching, a logic gate circuit is adopted on the printing head to realize detection of start and stop of printing, and in a printing stop state, the power supply VDD of the printing head is kept to be connected with a metal protection layer 5, and the power supply VH of the printing head is disconnected; during printing, the printer power supply VDD is kept off the metal protective layer 5, the printer power supply VH is turned on, and a certain delay time (10 us to 20 us) is set between signal switching and printing. The delay time is set to ensure the reliable switching of VDD, VH, GND signals and avoid influencing printing; the delay of 10 us-20 us ensures reliable switching of the circuit and does not affect the total printing time.
The three methods can apply positive potential to the metal protection layer 5 relative to the electrode, and the metal protection layer 5 with stronger activity is easier to lose electrons by utilizing an electrochemical principle, so that the electrode corrosion is well protected, and the service life of the thermal printing head is effectively prolonged.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. The utility model provides a corrosion-resistant thermal print head, includes the base plate that generates heat, the base plate that generates heat includes the insulating substrate, at least partly forms heat accumulation glaze layer at the insulating substrate surface insulating substrate and heat accumulation glaze layer surface are equipped with electrode, its characterized in that: the paper outlet side edges and the two connected side edges of the upper surface of the insulating substrate are provided with metal protection layers which are more active than electrode materials, are not easy to react with the electrodes and are not easy to oxidize to generate protection layers on the surfaces, and the metal protection layers are at least partially exposed outside; at least in a partially non-printed state, the metal protection layer potential is higher than the electrode potential; applying a voltage between the metal protection layer and the electrode to make the metal protection layer positive;
an insulating protective layer is arranged on the surface of the metal protective layer at intervals, or after the insulating protective layer is covered on the surface of the metal protective layer, windows are arranged at intervals;
a gap exists between the metal protection layer and the electrode.
2. The corrosion resistant thermal printhead of claim 1, wherein: the printing head comprises a printing head power supply, a metal protective layer, an insulation protective power supply and a printing head power supply, wherein the insulation protective power supply is used for applying voltage to the metal protective layer, the anode of the insulation protective power supply is connected with the metal protective layer, and the cathode of the insulation protective power supply is connected with the printing head power supply VH.
3. The corrosion resistant thermal printhead of claim 1, wherein: the printer is controlled to switch power supply, the printer power supply VDD is connected with the metal protection layer, and the printer power supply VH is disconnected in standby state and each row of printing interval; during printing, the printer power supply VDD turns off the metal protective layer, and the printhead power supply VH turns on the printer power supply VH.
4. A corrosion resistant thermal printhead as recited in claim 3, wherein: and a delay time of 10 us-20 us is arranged between signal switching and printing state conversion.
5. The corrosion resistant thermal printhead of claim 1, wherein: the power supply is controlled to switch by the printing head, and the printing head comprises a logic gate circuit for detecting the start and stop of printing and an analog switch circuit for switching signals.
6. The corrosion resistant thermal printhead of claim 5, wherein: a delay buffer circuit for delaying between signal switches is also included.
7. The corrosion resistant thermal printhead of claim 5, wherein: the logic gate circuit comprises a NAND gate, and the analog switch circuit comprises a first analog switch and a second analog switch;
The input end of the NAND gate is used for being connected with a plurality of strobe signal lines STB of the printer, and the output ends of the NAND gate are connected with the control ends of the first analog switch and the second analog switch;
The input end of the first analog switch is used for being connected with a printer power supply VH, and the output end of the first analog switch is connected with the printer power supply VH; the input end of the second analog switch is used for being connected with a printer power supply VDD, and the output end of the second analog switch is connected with the metal protection layer of the printing head; a current limiting resistor is connected between the printhead power supply VH and the ground GND.
8. The corrosion resistant thermal printhead of claim 6, wherein: the delay buffer circuit comprises a plurality of delay buffers, the input ends of the delay buffers are used for being correspondingly connected with a plurality of strobe signal lines STB of the printer, and the output ends of the delay buffers are correspondingly connected with a plurality of strobe signal lines STB of the printing head.
9. The corrosion resistant thermal printhead of claim 1, wherein: the metal protective layer is not directly connected to the electrode and there is a gap of at least 0.1mm.
10. The corrosion resistant thermal printhead of any one of claims 1-9, wherein: the voltage difference between the metal protection layer and the electrode is not lower than 1V, and the metal protection layer is at positive potential.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210747869.7A CN115056579B (en) | 2022-06-29 | 2022-06-29 | Corrosion-resistant thermal printing head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210747869.7A CN115056579B (en) | 2022-06-29 | 2022-06-29 | Corrosion-resistant thermal printing head |
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| CN115056579A CN115056579A (en) | 2022-09-16 |
| CN115056579B true CN115056579B (en) | 2024-06-04 |
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| JP2018192694A (en) * | 2017-05-17 | 2018-12-06 | ローム株式会社 | Thermal print head and method for manufacturing thermal print head |
| JP2020019164A (en) * | 2018-07-30 | 2020-02-06 | アオイ電子株式会社 | Thermal print head |
| CN111137023A (en) * | 2020-02-26 | 2020-05-12 | 山东华菱电子股份有限公司 | Spliced thermosensitive printing head |
| CN112297646A (en) * | 2020-11-17 | 2021-02-02 | 山东华菱电子股份有限公司 | Method for manufacturing heating substrate for thin-film thermal printing head |
| CN214449561U (en) * | 2020-11-17 | 2021-10-22 | 山东华菱电子股份有限公司 | High-weather-resistance heating substrate for thin-film thermal sensitive printing head |
| CN217476895U (en) * | 2022-06-29 | 2022-09-23 | 山东华菱电子股份有限公司 | Corrosion-resistant heating substrate for thermal printing head |
| CN217476894U (en) * | 2022-06-29 | 2022-09-23 | 山东华菱电子股份有限公司 | Corrosion-resistant thermal printing head is with base plate and printer head that generates heat |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7538785B2 (en) * | 2004-05-25 | 2009-05-26 | Rohm Co., Ltd. | Thermal print head and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018192694A (en) * | 2017-05-17 | 2018-12-06 | ローム株式会社 | Thermal print head and method for manufacturing thermal print head |
| JP2020019164A (en) * | 2018-07-30 | 2020-02-06 | アオイ電子株式会社 | Thermal print head |
| CN111137023A (en) * | 2020-02-26 | 2020-05-12 | 山东华菱电子股份有限公司 | Spliced thermosensitive printing head |
| CN112297646A (en) * | 2020-11-17 | 2021-02-02 | 山东华菱电子股份有限公司 | Method for manufacturing heating substrate for thin-film thermal printing head |
| CN214449561U (en) * | 2020-11-17 | 2021-10-22 | 山东华菱电子股份有限公司 | High-weather-resistance heating substrate for thin-film thermal sensitive printing head |
| CN217476895U (en) * | 2022-06-29 | 2022-09-23 | 山东华菱电子股份有限公司 | Corrosion-resistant heating substrate for thermal printing head |
| CN217476894U (en) * | 2022-06-29 | 2022-09-23 | 山东华菱电子股份有限公司 | Corrosion-resistant thermal printing head is with base plate and printer head that generates heat |
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