CN115061030B

CN115061030B - Thermal insulation carrying mechanism, detection equipment and thermal insulation method

Info

Publication number: CN115061030B
Application number: CN202210485773.8A
Authority: CN
Inventors: 林宜龙; 吴海裕; 唐召来; 刘飞
Original assignee: Shenzhen Gexin Integrated Circuit Equipment Co ltd
Current assignee: Shenzhen Gexin Integrated Circuit Equipment Co ltd
Priority date: 2022-05-06
Filing date: 2022-05-06
Publication date: 2025-07-22
Anticipated expiration: 2042-05-06
Also published as: CN115061030A

Abstract

The invention provides a heat preservation carrying mechanism, detection equipment and a heat preservation method, wherein the heat preservation carrying mechanism comprises a transmission assembly and a first carrying platform assembly, the first carrying platform assembly comprises a first carrying platform, a heating piece and a heat dissipation preventing structure, the first carrying platform is connected with the transmission assembly, the heating piece is arranged on the first carrying platform and is used for heating the first carrying platform, the heat dissipation preventing structure is arranged on the first carrying platform and is used for reducing or preventing heat dissipation of the first carrying platform. By using the heat preservation carrying mechanism provided by the technical scheme, the technical problem that the temperature of the chip can be lost in the conveying process so as to influence the test effect in the prior art is effectively solved.

Description

Thermal insulation carrying mechanism, detection equipment and thermal insulation method

Technical Field

The invention relates to the technical field of chip testing, in particular to a heat preservation carrying mechanism, detection equipment and a heat preservation method.

Background

When testing a chip, the chip needs to be heated to a specified temperature and then transported to a testing mechanism for testing. However, during the transportation process, the chip temperature is lost, and the test effect is further affected.

Disclosure of Invention

The invention aims to provide a heat-insulating carrying mechanism so as to solve the technical problem that the temperature of a chip can be lost in the conveying process in the prior art, and the testing effect is further affected.

In a first aspect, the present invention provides a thermal insulation carrier comprising:

a transmission assembly;

The first carrier assembly comprises a first carrier, a heating piece and a heat dissipation preventing structure, wherein the first carrier is connected with the transmission assembly, the heating piece is arranged on the first carrier and is used for heating the first carrier, the heat dissipation preventing structure is arranged on the first carrier and is used for reducing or preventing heat dissipation of the first carrier.

As one embodiment of the present invention, the first stage includes a stage body formed with a mounting groove, and a stage body connected to the stage body to cover the mounting groove, the heating member being disposed in the mounting groove.

In one embodiment of the invention, the heating element is provided with a first positioning hole, the table top body is provided with a second positioning hole, the bottom of the mounting groove is protruded to form a positioning column, and the positioning column sequentially penetrates through the first positioning hole and the second positioning hole.

As one embodiment of the invention, the heat dissipation preventing structure comprises a heat insulation plate, wherein the heat insulation plate is arranged on one side of the rack body, which is away from the table body, and the heat insulation plate and the rack body form a heat insulation cavity together.

As one embodiment of the invention, the heat insulating board is convexly formed with a side blocking part, and the side blocking part is arranged at the side of the first carrying platform.

As one embodiment of the invention, the rack body is provided with a connecting part which is connected with the transmission component, and the two heat insulation boards are respectively arranged at two sides of the connecting part;

the heat dissipation preventing structure further comprises a heat insulation column, and the heat insulation column is arranged between the connecting part and the transmission assembly.

As an embodiment of the present invention, the heat dissipation preventing structure further includes a wind guard, and the wind guard is disposed at two ends of the first carrier opposite to each other along the transmission direction of the transmission assembly.

As one embodiment of the invention, the heat-insulating carrying mechanism further comprises a guide assembly, wherein the guide assembly comprises a guide rail, a sliding block and a connecting beam, the guide rail is in sliding connection with the sliding block, the connecting beam is arranged on the sliding block, the connecting beam is connected with the transmission assembly, and a wiring groove is formed in the connecting beam;

The first carrier assembly is arranged on the connecting beam, and the connecting wires of the heating element are arranged in the wiring groove.

As one embodiment of the invention, the transmission assembly comprises a driving motor, a first transmission wheel, a second transmission wheel, a transmission belt and a transmission connecting rod;

The power output end of the driving motor is connected with the first driving wheel, the second driving wheel is arranged opposite to the first driving wheel, one end of the driving belt is sleeved on the first driving wheel, the other end of the driving belt is sleeved on the second driving wheel, one end of the driving connecting rod is connected with the driving belt, the other end of the driving connecting rod is connected with the connecting beam, the driving connecting rod is provided with a wiring channel communicated with the wiring groove and an outgoing port communicated with the wiring channel, and a connecting wire of the heating element sequentially passes through the wiring groove and the wiring channel and is led out from the outgoing port.

The heat-insulating carrying mechanism further comprises a second carrying platform assembly and a cover plate, wherein the second carrying platform assembly is arranged on the connecting beam, the second carrying platform assembly and the first carrying platform assembly are arranged at intervals, the cover plate is clamped between the first carrying platform assembly and the second carrying platform assembly, and the cover plate and the second carrying platform assembly jointly cover the wiring groove.

As an embodiment of the present invention, the first stage assembly further includes a temperature sensor disposed on the heating member, the temperature sensor being configured to detect a temperature of the heating member.

In a second aspect, the invention also provides a detection device comprising a thermally insulated carrier as described in the first aspect.

In a third aspect, the present invention further provides a heat insulation method of the heat insulation carrying mechanism, where the heat insulation carrying mechanism is the heat insulation carrying mechanism in the first aspect, and the heat insulation method includes:

Heating the heating element in a first heating mode;

judging whether the temperature real-time detection value of the heating piece reaches a preset standard temperature value, if so, adopting a second heating mode to heat the heating piece, wherein the heating voltage of the first heating mode is larger than that of the second heating mode.

As an embodiment of the present invention, after the heating member is heated in the second heating mode, the heat preservation method further includes:

Judging whether the temperature real-time detection value of the heating element is increased to be larger than a standard temperature upper limit value or whether the temperature real-time detection value of the heating element is reduced to be smaller than a standard temperature lower limit value, wherein the standard temperature upper limit value is the sum of the standard temperature value and a temperature floating value, and the standard temperature lower limit value is the difference between the standard temperature value and the temperature floating value;

If the temperature real-time detection value of the heating element is reduced to be smaller than the standard temperature lower limit value, adopting the first heating mode to heat the heating element;

judging whether the real-time temperature detection value of the heating element reaches the standard temperature value, if so, executing the step of adopting the second heating mode to heat the heating element.

As one embodiment of the present invention, before the determining whether the real-time temperature detection value of the heating element reaches the standard temperature value, if yes, heating the heating element in the second heating mode, further includes:

Judging whether the temperature real-time detection value of the heating piece is increased to be greater than the standard temperature upper limit value within the preset standard time, if so, reducing the heating voltage of the second heating mode to obtain a reduced second heating mode;

Updating the second heating mode by using the second heating mode after the value is reduced.

Judging whether the temperature real-time detection value of the heating piece is reduced to be smaller than the lower limit value of the standard temperature within the preset standard time, if so, increasing the heating voltage of the second heating mode to obtain a second heating mode after increasing the heating voltage;

and updating the added second heating mode to obtain a second heating mode.

As one embodiment of the invention, the heat preservation method further comprises the following steps

Receiving an actual temperature value obtained by detecting the heating element by an external detection device;

And compensating the real-time temperature detection value of the heating element based on the actual temperature value.

As an embodiment of the present invention, before the compensating the real-time temperature detection value of the heating element based on the actual temperature value, the method further includes:

And if so, executing the step of compensating the real-time temperature detection value of the heating element based on the real-time temperature value.

As one embodiment of the present invention, the compensating the real-time detection value of the temperature of the heating element based on the actual value of the temperature includes:

subtracting the actual temperature value from the real-time temperature detection value of the heating element to obtain a temperature compensation value;

subtracting the temperature compensation value from the temperature real-time detection value of the heating element to obtain a temperature real-time detection value after the temperature compensation value is changed;

Updating the temperature real-time detection value of the heating element by using the temperature real-time detection value after the value change;

And adjusting the heating voltage of the heating element to enable the change amplitude of the temperature real-time detection value of the heating element to be equal to the temperature compensation value.

As an embodiment of the present invention, after the compensating the real-time temperature detection value of the first stage based on the actual temperature value, the method further includes:

receiving the actual temperature value obtained by detecting the heating element by the external detection device again;

Judging whether the absolute value of the difference between the temperature real-time detection value of the heating piece and the re-received temperature actual value is larger than a standard difference value, if so, executing the step of compensating the temperature real-time detection value of the first carrier based on the temperature actual value, and if not, stopping receiving the temperature actual value.

As an embodiment of the present invention, the heat preservation method further includes:

Judging whether the temperature of the heating element is greater than a preset temperature safety value, and if so, stopping heating the heating element.

The implementation of the embodiment of the invention has the following beneficial effects:

In the invention, a chip heated to a specified temperature is placed on a first carrier, and then a transmission assembly drives the first carrier to move so as to convey the chip to a testing mechanism, in the conveying process, a heating piece heats the first carrier, so that the first carrier has a certain temperature, namely, the environment where the chip is located has a certain temperature, therefore, the first carrier can keep the temperature of the chip and even heat the chip, and the heat dissipation of the chip is prevented. By using the heat preservation carrying mechanism provided by the technical scheme, the technical problem that the temperature of the chip can be lost in the conveying process so as to influence the test effect in the prior art is effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic structural diagram of a detection device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a thermal insulation carrying mechanism;

FIG. 3 is a schematic diagram of an exploded construction of the insulated carrier;

FIG. 4 is an exploded view of the first stage assembly;

FIG. 5 is a schematic diagram of the structure of the transmission assembly;

FIG. 6 is a schematic view of a part of the structure of the detecting apparatus;

FIG. 7 is a schematic flow chart of the heat preservation method;

FIG. 8 is another schematic flow chart of the heat preservation method;

FIG. 9 is a logic diagram of the operation of the thermal insulation method;

FIG. 10 is another logic diagram of the operation of the thermal insulation method.

100, Detecting equipment; 10, a heat preservation carrying mechanism; 11, a transmission assembly; 111, driving motors, 112, first driving wheels, 113, second driving wheels, 114, driving belts, 115, driving links, 1151, a wiring channel, 1152, a leading-out port, 12, a first carrying platform assembly, 121, a first carrying platform, 1211, a rack body, 12111, a mounting groove, 12112, a positioning column, 12113, a connecting part, 1212, a table body, 12121, a second positioning hole, 122, a heating element, 1221, a first positioning hole, 123a, a heat insulation cavity, 1231, a heat insulation plate, 1231a, a side blocking part, 1232, a heat insulation column, 1233, a wind shield, 13, a guide assembly, 131, a guide rail, 132, a slider, 133, a connecting beam, 1331, a wiring platform assembly, 14, a second carrying platform assembly, 15, a cover plate, 16, a material shuttle, 17, a sheet metal rack, 18, a temperature sensor, 19, a temperature switch, 20, a main frame, 30, a material tray conveying mechanism, 40, a material tray conveying mechanism, 41, a third driving assembly, 42, a third mechanical arm, 50, a heating element, 1233, a wind shield, 13, a guide assembly, 131, a guide rail, 132, a slider, 133, a connecting beam, 1331, a travelling mechanism, 14, a travelling mechanism, a second carrying mechanism, a 14, a cover plate assembly, a cover plate, 16, a material shuttle, a temperature sensor, a 19, a temperature controller, a 60, a tray, a 60, a tray conveying mechanism, a 60, a control mechanism, a 60, a tray, a 60, a lifting mechanism, a.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-5, the present invention provides a test apparatus 100 that may be used to test a chip. The detection device 100 comprises a main frame 20, a tray conveying mechanism 30, a tray conveying mechanism 40, a heating mechanism 50, a testing mechanism 60, a heat-preserving carrying mechanism 10 and a blanking mechanism 70, wherein the tray conveying mechanism 30 is arranged on the main frame 20, the tray conveying mechanism 30 is provided with a plurality of conveying channels for conveying trays with non-tested chips or conveying empty trays or trays with tested chips, the tray conveying mechanism 40 spans over the tray conveying mechanism 30 to take the trays in the conveying channels or place the trays in the conveying channels, the heating mechanism 50 is arranged on the main frame 20 and used for heating the chips, the testing mechanism 60 is arranged on the main frame 20 and used for testing the chips, the blanking mechanism 70 is arranged on the main frame 20 and used for blanking the tested chips, the heat-preserving carrying mechanism 10 is arranged on the main frame 20, the heat-preserving carrying mechanism 10 is arranged below the testing mechanism 60, and one end of the heat-preserving carrying mechanism 10 extends to the other end of the heat-preserving carrying mechanism 10 to the heat-preserving carrying mechanism 50 and extends to the heat-preserving carrying mechanism 10.

Specifically, a tray with non-tested chips and an empty tray are placed in a conveying channel of a tray conveying mechanism 30 for conveying, a tray conveying mechanism 40 conveys the tray with the tested chips to a heating mechanism 50, the empty tray is conveyed to a blanking mechanism 70, the heating mechanism 50 removes the chips in the tray and heats the chips, the empty tray conveyed by the tray conveying mechanism 40 is conveyed to the conveying channel for recycling or conveyed to the blanking mechanism 70 for blanking, after the heating mechanism 50 heats the chips, a heat-preserving conveying mechanism 10 conveys the chips to a testing mechanism 60, in the conveying process, the heat-preserving conveying mechanism 10 preserves the heat of the chips to ensure that the temperature of the chips is kept within a standard range, after the testing mechanism 60 tests the chips, the heat-preserving conveying mechanism 10 conveys the tested chips to the blanking mechanism 70, and the blanking mechanism 70 places the tested chips on the empty tray for blanking.

In one embodiment, referring to fig. 1, the heating mechanism 50 may include a high temperature tray 51 disposed on the main frame 20, a first driving assembly 52 disposed on the main frame 20, and a first manipulator 53 connected to a power output end of the first driving assembly 52, the first driving assembly 52 driving the first manipulator 53 to reciprocate among the high temperature tray 51, the tray handling mechanism 40, and the thermal insulation carrying mechanism 10 to take out chips on the tray handled by the tray handling mechanism 40 and place the chips on the high temperature tray 51 for heating, or take out heated chips on the high temperature tray 51 and place the chips on the thermal insulation carrying mechanism 10.

In one embodiment, the blanking mechanism 70 includes a blanking storage table 71 disposed on the main frame 20, a second driving assembly 72 disposed on the main frame 20, and a second manipulator 73 connected to a power output end of the second driving assembly 72, where an empty tray is placed on the blanking storage table 71, and the second driving assembly 72 drives the second manipulator 73 to reciprocate between the blanking storage tray and the thermal insulation carrying mechanism 10, so as to take out the tested chips carried by the thermal insulation carrying mechanism 10 and place the chips on the empty tray on the blanking storage tray table.

In one embodiment, referring to fig. 1, the tray handling mechanism 40 includes a third driving assembly 41 and a third manipulator 42, the third driving assembly 41 is disposed on the main frame 20, and a power output end of the third driving assembly 41 is connected to the third manipulator 42 to drive the third manipulator 42 to reciprocate between several conveying channels.

Referring to fig. 2-5, the heat preservation carrying mechanism 10 comprises a transmission assembly 11 and a first carrying platform assembly 12, wherein the first carrying platform assembly 12 comprises a first carrying platform 121, a heating piece 122 and a heat dissipation preventing structure, the first carrying platform 121 is connected with the transmission assembly 11, the heating piece 122 is arranged on the first carrying platform 121 and used for heating the first carrying platform 121, and the heat dissipation preventing structure is arranged on the first carrying platform 121 and used for reducing or preventing heat dissipation of the first carrying platform 121.

In the invention, the transmission component 11 is fixed on the main frame 20, so that the heat-preserving carrying mechanism 10 is arranged on the main frame 20, specifically, a chip heated to a specified temperature is placed on the first carrying platform 121, then the transmission component 11 drives the first carrying platform 121 to move so as to convey the chip to the testing mechanism 60, in the conveying process, the heating piece 122 heats the first carrying platform 121, so that the first carrying platform 121 has a certain temperature, namely, the environment where the chip is located has a certain temperature, therefore, the first carrying platform 121 can preserve heat of the chip, even heat of the chip is prevented from being dissipated, meanwhile, the heat dissipation preventing structure is further arranged on the first carrying platform 121, so that the heat dissipation of the first carrying platform 121 can be reduced, even prevented, the temperature of the first carrying platform 121 is ensured, the heat transferred to the chip by the first carrying platform 121 is ensured, and the heat preserving effect of the first carrying platform 121 on the chip is ensured. By using the heat-insulation carrying mechanism 10 provided by the technical scheme, the technical problem that the temperature of the chip is lost in the conveying process and the testing effect is further affected in the prior art is effectively solved.

In one embodiment, referring to fig. 4, the first stage 121 includes a stage body 1211 and a stage body 1212, the stage body 1211 is formed with a mounting groove 12111, the heating element 122 is disposed in the mounting groove 12111, and the stage body 1212 is connected to the stage body 1211 to cover the mounting groove 12111.

Specifically, the chip is placed on the table body 1212, the heating element 122 is assembled into the mounting groove 12111 of the table body 1211, the mounting groove 12111 is covered by the table body 1212, the heating element 122 is pressed in the mounting groove 12111, so that the heating element 122 is located in a closed space, the heat of the heating element 122 is uniformly and effectively transferred to the table body 1212, and the table body 1212 carries out heat preservation and heating on the chip thereon, thereby avoiding heat loss of the heating element 122 and improving heating area and uniformity of the heating element 122 relative to the chip.

In some embodiments, the heating element 122 is flat to uniformly heat the mesa 1212, so that the mesa 1212 uniformly heats the chip.

In some specific embodiments, referring to fig. 4, the heating element 122 is formed with a first positioning hole 1221, the table body 1212 is formed with a second positioning hole 12121, the bottom of the mounting groove 12111 is protruded to form a positioning post 12112, and the positioning post 12112 is sequentially inserted into the first positioning hole 1221 and the second positioning hole 12121. By the cooperation of the positioning posts 12112 and the first positioning holes 1221, the heating element 122 is quickly and accurately assembled relative to the table body 1211, and by the cooperation of the positioning posts 12112 and the second holes, the table body 1212 is quickly and accurately assembled relative to the table body 1211.

In one embodiment, referring to fig. 3, the thermal insulation carrying mechanism 10 may further include a material shuttle 16, the material shuttle 16 is disposed on the first carrier 121, the material shuttle 16 is installed on the first carrier 121 through a positioning post 12112, and positioning and placement of the chip are achieved through the material shuttle 16.

In one embodiment, referring to fig. 4, the heat dissipation preventing structure includes a heat insulating plate 1231, the heat insulating plate 1231 is disposed on a side of the stage body 1211 facing away from the stage body 1212, and the heat insulating plate 1231 and the stage body 1211 together form a heat insulating cavity 123a.

In this embodiment, the heat insulating cavity 123a formed by the heat insulating plate 1231 and the stage body 1211 is located at one side of the stage body 1211 away from the stage body 1212, so that the heat insulating cavity 123a breaks the path of the heat of the first carrier 121 emitted to the side away from the stage body 1212, on the one hand, the heat dissipation amount of the first carrier 121 is reduced, and on the other hand, the heat of the first carrier 121 is basically transferred out through the stage body 1212, so that the heat transfer between the stage body 1212 and the chip is improved.

In some specific embodiments, referring to fig. 4, the heat insulation plate 1231 is formed with a protrusion of a side stopper 1231a, and the side stopper 1231a is disposed at a side of the first stage 121. The side stoppers 1231a further reduce the heat loss of the first carrier 121, and prevent the first carrier 121 from scalding the worker.

Note that the heat insulating board 1231 is made of a heat insulating material, so that the heat insulating board 1231 has a heat insulating function.

In some specific embodiments, referring to fig. 4, the rack body 1211 is formed with a connecting portion 12113, and the connecting portion 12113 is connected to the transmission assembly 11, and the number of the heat insulation boards 1231 is two, and the two heat insulation boards 1231 are respectively arranged at two sides of the connecting portion 12113;

therefore, the transmission assembly 11 is connected with the middle part of the rack body 1211, so that the rack body 1211 and the transmission assembly 11 are connected in a balanced and stable manner, and the two heat insulation plates 1231 are arranged on two sides of the connecting plate respectively, so that the balance of the heat insulation plates 1231 is further improved.

In one embodiment, in conjunction with fig. 3, the heat dissipation preventing structure may further include a heat insulating column 1232, the heat insulating column 1232 being disposed between the connecting portion 12113 and the transmission assembly 11.

The heat insulation column 1232 is arranged between the connecting part 12113 and the transmission assembly 11, so that the temperature of the first carrying platform 121 is prevented from being transmitted to the transmission assembly 11, the temperature loss of the first carrying platform 121 is avoided, and the transmission assembly 11 is prevented from being heated, so that the service life of the transmission assembly 11 is prevented from being influenced.

It should be noted that the connection between the connection portion 12113 and the transmission assembly 11 may be achieved by the heat insulating columns 1232.

In one embodiment, referring to fig. 4, the heat dissipation preventing structure further includes a wind guard 1233, and both ends of the first stage 121 opposite to each other along the transmission direction of the transmission assembly 11 are provided with the wind guard 1233.

The wind shields 1233 are arranged at two ends of the first carrying platform 121, which are oppositely arranged along the transmission direction of the transmission assembly 11, and when the transmission assembly 11 drives the first carrying platform assembly 12 to move, the wind shields 1233 can play a role in wind shielding to block air flow for the table top 1212 and the chip, so that the temperatures of the table top 1212 and the chip are prevented from being carried away by wind.

In one embodiment, referring to fig. 2 and 3, the thermal insulation carrying mechanism 10 may further include a guide assembly 13, the guide assembly 13 includes a guide rail 131, a slider 132, and a connection beam 133, the guide rail 131 and the slider 132 are slidably connected, the connection beam 133 is disposed on the slider 132, the connection beam 133 is connected to the transmission assembly 11, and the first stage assembly 12 is disposed on the connection beam 133.

Specifically, the guide rail 131 is fixed on the main frame 20, and the connection beam 133 is slidably connected with the guide rail 131 through the slider 132, so that when the transmission assembly 11 drives the connection beam 133 to drive the first carrier 121 to move, the relative limitation between the slider 132 and the guide rail 131 can guide the first carrier 121 fixed on the connection beam 133, so as to determine the moving path of the first carrier 121 and prevent the first carrier 121 from swinging. It should be noted that, at this time, the heat insulation columns 1232 are disposed between the connecting portion 12113 and the connecting beam 133, and when the heat insulation carrier 10 further includes the guide assembly 13, the heat insulation columns 1232 can prevent the guide assembly 13 from being heated, so as to ensure the service life of the guide assembly 13.

Referring to fig. 3, the connection beam 133 is formed with a wire groove 1331, and the connection wire of the heating member 122 is disposed in the wire groove 1331. By forming the wiring grooves 1331 in the connection beams 133 to limit the trend of the connection wires, the connection wires are beautiful, and interference of the connection wires to the movement of the first carrier 121 is avoided.

In one embodiment, referring to fig. 2 and 3, the transmission assembly 11 includes a driving motor 111, a first driving wheel 112, a second driving wheel 113, a driving belt 114, and a driving link 115, where a power output end of the driving motor 111 is connected to the first driving wheel 112, the second driving wheel 113 is opposite to the first driving wheel 112, one end of the driving belt 114 is sleeved on the first driving wheel 112, the other end of the driving belt 114 is sleeved on the second driving wheel 113, one end of the driving link 115 is connected to the driving belt 114, and the other end of the driving link 115 is connected to the connecting beam 133.

The connection between the driving belt 114 and the connecting beam 133 is realized through the driving connecting rod 115, that is, the driving motor 111 drives the first driving wheel 112 to rotate so as to drive the driving belt 114 sleeved on the first driving wheel 112 and the second driving wheel 113 to drive, and the driving rod connected with the driving belt 114 can drive the connecting beam 133 to move, so that the first carrier assembly 12 is driven to move by the driving assembly 11.

Referring to fig. 3 and 5, the transmission link 115 is formed with a wire channel 1151 communicating with the wire slot 1331 and a lead-out port 1152 communicating with the wire channel 1151, and the connection wires of the heating member 122 sequentially pass through the wire slot 1331 and the wire channel 1151 and are led out from the lead-out port 1152. On the one hand, the connecting wires are hidden through the wiring grooves 1331 and the wiring channels 1151, so that the connecting wires are prevented from being exposed, the wiring attractiveness of the connecting wires is improved, and on the other hand, the connecting wires are led out from the wiring outlets 1152 of the transmission connecting rod 115, so that the leading-out ends of the connecting wires are far away from the first guide rail 131, namely, the connecting wires are led out from the moving range of the first carrying platform 121, and the interference of the connecting wires is further reduced.

In one embodiment, referring to fig. 2 and 3, the insulated carrier 10 further includes a second carrier assembly 14, and the second carrier assembly 14 is disposed on the connection beam 133. Therefore, the transmission assembly 11 can drive the first stage assembly 12 and the second stage assembly 14 to move simultaneously, the transmission assembly 11 works to enable the first stage assembly 12 to move to the heating structure to bear the heated chips, the transmission assembly 11 continues to transmit to enable the first stage assembly 12 to move to the testing mechanism 60, the testing mechanism 60 takes away the chips on the first stage assembly 12 and tests the chips, the transmission assembly 11 continues to transmit to enable the first stage assembly 12 to move away from the testing mechanism 60 to enable the second stage assembly 14 to move to the testing mechanism 60, the testing mechanism 60 places the tested chips on the second stage assembly 14, and the transmission assembly 11 further drives the second stage assembly 14 to move to place the tested chips on the discharging mechanism 70. In this embodiment, the second carrier assembly 14 is disposed on the connecting beam 133 to carry the tested chip away from the testing mechanism 60, i.e. the first carrier assembly 12 is not required to carry away the tested chip, so as to avoid low cooling efficiency of the tested chip caused by the temperature of the first carrier assembly 12.

In some embodiments, a shuttle 16 is also provided on the second stage assembly 14 to position the tested chips.

In one embodiment, referring to fig. 2, the second stage assembly 14 is spaced from the first stage assembly 12, so as to avoid the temperature of the first stage assembly 12 from being transferred to the second stage assembly 14, reduce the heat loss of the first stage assembly 12, and avoid the temperature of the second stage assembly 14 from rising, which is unfavorable for carrying away the tested chip, the heat-insulating carrier mechanism 10 further comprises a cover plate 15, the cover plate 15 is sandwiched between the first stage assembly 12 and the second stage assembly 14, and the cover plate 15 and the second stage assembly 14 jointly cover the wiring groove 1331, so as to avoid the exposure of part of the wiring groove 1331 due to the spaced arrangement of the second stage assembly 14 and the first stage 121.

In one embodiment, referring to fig. 2 and 3, the thermal insulation carrying mechanism 10 further includes a sheet metal frame 17 provided on the main frame 20, and the connection wire is fixed to the sheet metal frame 17 after being led out from the outlet 1152 so as to communicate the connection wire to the outside.

In one embodiment, referring to fig. 6, the first stage assembly 12 further includes a temperature sensor 18 disposed on the heating member 122, the temperature sensor 18 being configured to detect a temperature of the heating member 122. The temperature sensor 18 detects the temperature of the heating element 122 in real time to control the heating voltage of the heating element 122, so as to avoid the excessive or insufficient temperature of the heating element 122.

In one embodiment, referring to fig. 6, the first stage assembly 12 further includes a temperature switch 19 electrically connected to the heating element 122, it being understood that the temperature switch 19 is connected in series in the heating circuit of the heating element 122. For switching off the heating circuit of the heating member 122 to protect the first stage assembly 12 when the heating member 122 is overheated.

In order to control the heating temperature of the heating element 122, referring to fig. 6, the detecting apparatus 100 may further include a control module 80 and a temperature controller 90, the control module 80 is electrically connected to the temperature controller 90, the temperature controller 90 is electrically connected to the heating element 122, the temperature controller 90 regulates the heating power of the heating element 122 by adjusting the input current or the input voltage of the heating element 122, the control module 80 is electrically connected to the temperature controller 90 and the temperature sensor 18, and the temperature controller 90 is instructed by receiving the detection value of the temperature sensor 18, thereby controlling the heating temperature of the heating element 122.

The invention also provides a heat preservation method of the heat preservation carrying mechanism 10, referring to fig. 7, comprising:

S1, heating the heating piece 122 in a first heating mode;

s2, judging whether the real-time temperature detection value of the heating element 122 reaches a preset standard temperature value, and if so, adopting a second heating mode to heat the heating element 122, wherein the heating voltage of the first heating mode is larger than that of the second heating mode.

It can be understood that the first heating mode is a high-speed heating mode, the second heating mode is a low-speed heating mode, after the chip is placed on the first carrier 121, the first heating mode is firstly adopted to heat the heating element 122 at a high speed, so that the temperature of the heating element 122 can reach a preset standard temperature value, that is, the temperature of the first carrier 121 can reach the standard temperature value quickly, the heat preservation and heating of the chip can be realized quickly, the chip is prevented from being quickly lost when the chip is just placed on the first carrier 121, the temperature real-time detection value of the heating element 122 is detected by the temperature sensor 18 arranged on the heating element 122, then whether the temperature real-time detection value of the heating element 122 is larger than or equal to the standard temperature value is judged, that is, whether the temperature of the heating element 122 reaches the standard temperature value is judged, when the temperature of the heating element 122 reaches the standard temperature value, the second heating mode is adopted to heat the heating element 122, that is quickly heated to the heating element 122, so that the temperature of the first carrier 121 can be maintained at the standard temperature value, the effect of the chip 121 is realized, and the heat preservation and the waste of the chip is avoided.

In some specific embodiments, the heating voltage of the second heating mode is 20V, the heating voltage of the first heating mode is 220V, and the heating voltage of the first heating mode and the heating voltage of the second heating mode can be adjusted according to actual heating requirements.

In one embodiment, referring to fig. 8, after the heating member 122 is heated in the second heating mode, the heat preservation method further includes:

S3, judging whether the temperature real-time detection value of the heating element 122 is increased to be greater than a standard temperature upper limit value or whether the temperature real-time detection value of the heating element 122 is reduced to be less than a standard temperature lower limit value, wherein the standard temperature upper limit value is the sum of the standard temperature value and a temperature floating value, and the standard temperature lower limit value is the difference between the standard temperature value and the temperature floating value;

S4, if the real-time temperature detection value of the heating element 122 is increased to be greater than the upper limit value of the standard temperature, stopping heating the heating element 122, and if the real-time temperature detection value of the heating element 122 is reduced to be less than the lower limit value of the standard temperature, adopting the first heating mode to heat the heating element 122;

and S5, judging whether the real-time temperature detection value of the heating element 122 reaches the standard temperature value, and if so, executing the step of adopting the second heating mode to heat the heating element 122.

If the standard temperature value of the heating element 122 is 130 ℃, the temperature floating value is 2 ℃, the standard temperature upper limit value is 132 ℃, the standard temperature lower limit value is 128 ℃, after the heating element 122 is heated at a low speed by adopting the second heating mode, the temperature sensor 18 detects the temperature of the heating element 122 in real time, when the temperature real-time detection value of the heating element 122 is increased to be greater than the standard temperature upper limit value, the temperature of the heating element 122 is higher than 132 ℃, at this time, the heating of the heating element 122 needs to be stopped, the temperature real-time detection value of the heating element 122 can be reduced to the standard temperature value, when the temperature real-time detection value of the heating element 122 is reduced to be less than the standard temperature lower limit value, the temperature of the heating element 122 is lower than 128 ℃, the temperature of the heating element 122 is excessively scattered, at this time, the heating voltage of the heating element 122 needs to be increased, namely, the heating element 122 is heated by adopting the first heating mode, the temperature real-time detection value of the heating element 122 can be increased to the standard temperature value, when the temperature of the heating element 122 is higher than the standard temperature value, the heating element 122 is required to be maintained within the first heating mode, the first heating element 121-130 ℃ and the heating element is required to be kept in the normal heating mode, the heating element 122 temperature is only needs to be maintained according to the first heating mode, the heating condition is required to be kept in the heating mode, and the heating condition is required to be kept in the normal temperature, and the heating condition is required to be kept at the temperature.

In one embodiment, before the determining whether the real-time temperature detection value of the heating element 122 reaches the standard temperature value, if yes, the heating element 122 is heated in the second heating mode, further comprising

Judging whether the temperature real-time detection value of the heating element 122 rises to be greater than the standard temperature upper limit value within a preset standard time, if so, reducing the heating voltage of the second heating mode to obtain a reduced second heating mode;

If the temperature real-time detection value of the heating element 122 is detected to rise to be greater than the standard temperature upper limit value within 300s, the temperature of the heating element 122 is indicated to rise too fast, and the heating voltage of the second heating mode is indicated to be too large, so that the heating voltage of the second heating mode needs to be reduced, for example, the heating voltage of the second heating mode is reduced by 1V, the heating voltage of the second heating mode is changed to 19V, that is, the heating voltage of the second heating mode after the reduction is 19V, after the heating is stopped to enable the temperature real-time detection value of the heating element 122 to reach the standard temperature value, the second heating mode is updated by using the reduced second heating mode, that is, the heating element 122 is heated by using the second heating mode with the heating voltage of 19V, otherwise, the heating voltage of the second heating mode does not need to be changed, that is, after the heating is stopped to enable the temperature real-time detection value of the heating element 122 to reach the standard temperature value, the heating element 122 is heated by using the second heating mode with the heating voltage of 20V.

In one embodiment, when the temperature real-time detection value of the heating element 122 is detected to be lower than the lower temperature limit value within 300s, the method further includes, before determining whether the temperature real-time detection value of the heating element 122 reaches the standard temperature value, if yes, heating the heating element 122 in the second heating mode:

Judging whether the temperature real-time detection value of the heating element 122 is reduced to be smaller than the standard temperature lower limit value within a preset standard time, if so, increasing the heating voltage of the second heating mode to obtain a second heating mode after increasing the heating voltage;

and updating the added second heating mode to obtain a second heating mode.

When the real-time detected temperature value of the heating element 122 is detected to be lower than the standard temperature upper limit value within 300s, the temperature of the heating element 122 is indicated to be reduced too fast, and the heating voltage of the second heating mode is indicated to be too small, so that the heating voltage of the second heating mode needs to be increased, for example, the heating voltage of the second heating mode is increased by 1V, the heating voltage of the second heating mode is changed to 21V, namely, the heating voltage of the increased second heating mode is 21V, after the real-time detected temperature value of the heating element 122 is reached to the standard temperature value by adopting the first heating mode, the second heating mode is updated by adopting the increased second heating mode, namely, the heating element 122 is heated by adopting the second heating mode with the heating voltage of 21V, and if the heating voltage of the second heating mode is not required to be changed, namely, the heating element 122 is heated by adopting the second heating mode with the heating voltage of 21V after the real-time detected temperature value of the heating element 122 is reached to the standard temperature value by adopting the second heating mode.

Referring to fig. 9, a real-time temperature detection value of the heating element 122 is defined as T, a standard temperature value is T1, a temperature floating value is T2, a preset standard time is T1, a time period taken for the real-time temperature detection value of the heating element 122 to rise to be greater than a standard temperature upper limit value and a time period taken for the real-time temperature detection value to fall to be less than a standard temperature lower limit value are both T, a heating voltage of the second heating mode is U, and a decreasing amplitude and a increasing amplitude of the second heating voltage are U1; specifically, a first heating mode is adopted to heat the heating element 122 at a high speed, T is greater than or equal to T1, the heating element 122 is judged whether the real-time temperature detection value of the heating element 122 reaches a standard temperature value, if not, the heating element 122 is continuously heated by adopting the first heating mode until the real-time temperature detection value of the heating element 122 reaches the standard temperature value, if yes, the heating element 122 is heated at a low speed by adopting a second heating mode, T is greater than T1+ T2, the heating element 122 is judged whether the real-time temperature detection value of the heating element 122 is increased to be greater than the standard temperature upper limit value, T is greater than or equal to T1, the heating element 122 is firstly stopped from heating, T is less than or equal to T1, the real-time temperature detection of the heating element 122 is judged whether the standard temperature value is reached, when the real-time temperature detection value of the heating element 122 is increased to be greater than the standard temperature upper limit value within a preset standard time, the heating voltage U of the second heating mode is required to be subtracted by the amplitude U1, the second heating mode after the reduced value is obtained, U=U-U is required to be greater than the preset temperature upper limit value of the preset heating element 122 when the preset temperature detection value is not increased to be greater than the standard upper limit value within a preset time, the heating voltage of the second heating mode does not need to be changed, i.e., u=u, so that the step of heating the heating member 122 in the second heating mode can be performed. T < T1-T2 is used for judging whether the real-time temperature detection value of the heating element 122 is reduced to be smaller than the standard temperature upper limit value, T is larger than or equal to T1, and is used for judging whether the real-time temperature detection value of the heating element 122 is reduced to be smaller than the standard temperature upper limit value within a preset standard time, the heating element 122 is heated by adopting a first heating mode so as to enable the real-time temperature detection of the heating element 122 to reach the standard temperature value, when the real-time temperature detection value of the heating element 122 is reduced to be smaller than the standard temperature upper limit value within the preset standard time, the heating voltage U of the second heating mode needs to be added with the amplitude U1 to obtain a reduced second heating mode, U=U+U1 indicates that the second heating mode is updated by using the increased second heating mode, and when the real-time temperature detection value of the heating element 122 is not reduced to be smaller than the standard temperature upper limit value within the preset standard time, the heating voltage of the second heating mode does not need to be changed, namely U=U, and therefore the step of heating the heating element 122 by adopting the second heating mode can be executed.

In one embodiment, the method of maintaining temperature further comprises:

receiving an actual temperature value detected by an external detection device on the heating element 122;

the real-time detection value of the temperature of the heating member 122 is compensated based on the actual value of the temperature.

It should be noted that, the real-time temperature detection value of the heating element 122 is detected by the temperature sensor 18 disposed on the heating element 122, the real-time temperature value of the heating element 122 is detected by the external detection device, and the temperature detection accuracy of the external detection device is higher than that of the temperature sensor 18, but the external detection device cannot be mounted on the first material ship assembly due to the limited volume, that is, the external detection device cannot detect the temperature of the heating element 122 in real time, and the temperature sensor 18 on the heating element 122 can detect the temperature of the heating element 122 in real time, but there may be an error in the real-time temperature detection value. Therefore, in the present embodiment, the real-time temperature detection value of the heating element 122 is compensated by receiving the real-time temperature value detected by the external detection device on the heating element 122, so that the real-time temperature detection value of the heating element 122 can accurately reflect the temperature of the heating element 122.

It should be noted that the above-mentioned compensation step may be performed during the whole heat preservation process, and preferably, the above-mentioned compensation method improves the accuracy of judging whether the temperature real-time detection is raised to be greater than the standard temperature upper limit value or lowered to be less than the standard temperature lower limit value by compensating the temperature real-time detection value before the step of judging whether the temperature real-time detection value of the heating element 122 is raised to be greater than the standard temperature upper limit value or lowered to be less than the standard temperature lower limit value.

In one embodiment, before said compensating said temperature real-time detection value based on said temperature actual value, further comprising:

And judging whether the absolute value of the difference between the real-time temperature detection value of the heating element 122 and the real-time temperature detection value is larger than a standard difference value, and if so, executing the step of compensating the real-time temperature detection value of the first stage 121 based on the real-time temperature detection value.

When the absolute value of the difference value of the temperature real-time detection value and the temperature actual value is larger than the standard difference value, the accuracy of the temperature real-time detection value is poor, at the moment, the temperature real-time detection value needs to be compensated, and when the absolute value of the difference value of the temperature real-time detection value is not larger than the standard difference value, the accuracy of the temperature real-time detection value is good, and the compensation is not needed.

In one embodiment, the compensating the real-time detection value of the temperature of the heating element 122 based on the actual value of the temperature includes:

subtracting the actual temperature value from the real-time temperature detection value of the heating element 122 to obtain a temperature compensation value;

Subtracting the temperature compensation value from the temperature real-time detection value of the heating element 122 to obtain a temperature real-time detection value after the temperature compensation value is changed;

updating the temperature real-time detection value of the heating element 122 by using the temperature real-time detection value after the change;

And adjusting the heating voltage of the heating element 122 to enable the variation amplitude of the temperature real-time detection value of the heating element 122 to be equal to the temperature compensation value.

In this embodiment, the control module 80 firstly subtracts the temperature actual value from the temperature real-time detection value to obtain a temperature compensation value, then subtracts the temperature compensation value from the temperature real-time detection value to obtain a temperature real-time detection value after the temperature compensation value, and updates the temperature real-time detection value of the heating element 122 by using the temperature real-time detection value after the temperature real-time detection value is changed, that is, the control module 80 displays that the temperature real-time detection value of the temperature sensor 18 is the temperature real-time detection value after the temperature real-time detection value is changed, and then the control module 80 controls the temperature controller 90 to adjust the heating voltage of the heating element 122, so that the change amplitude of the temperature real-time detection value of the heating element 122 is equal to the temperature compensation value, and the temperature real-time detection value accurately reflects the temperature of the heating element 122.

In one embodiment, after the compensating the real-time temperature detection value of the first stage 121 based on the actual temperature value, the method further includes:

Receiving the actual temperature value obtained by detecting the heating element 122 again by the external detection device;

Judging whether the absolute value of the difference between the real-time temperature detection value of the heating element 122 and the re-received real-time temperature value is larger than a standard difference, if so, executing the step of compensating the real-time temperature detection value of the first stage 121 based on the real-time temperature value, and if not, stopping receiving the real-time temperature value.

Specifically, whether the absolute value of the difference between the temperature real-time detection value and the re-received temperature real-time value is larger than the standard difference value is determined, if not, the temperature real-time detection value is compensated in place, the compensation is not needed, and the receiving of the temperature real-time value can be stopped, if so, the temperature real-time detection value is not compensated in place, the temperature real-time detection value cannot accurately reflect the temperature of the heating element 122, and the step of compensating the temperature real-time detection value of the first stage 121 based on the temperature real-time value needs to be executed again.

Referring to fig. 10, the actual temperature value is set to be T4, the standard deviation value is set to be T5, the compensation temperature is set to be T3, after the heating element 122 is heated by adopting the second heating mode, the actual temperature value T4 detected by the external detection device on the heating element 122 is received, when the actual temperature value T4 is not equal to the real-time temperature detection value T, two situations exist, namely, the actual temperature value T4 is greater than the real-time temperature detection value T, and the real-time temperature detection value T is greater than the real-time temperature value T4; in the following, two compensation cases are specifically described, T < T4 is used to determine whether the temperature real-time detection value T of the heating element 122 is smaller than the temperature real-time detection value T4, if yes, it is further determined whether the difference obtained by subtracting the temperature real-time detection value T from the temperature real-time value T4 is larger than the standard difference value T5, if no, it is indicated that the temperature real-time detection value T is better in accuracy and does not need to be compensated, if yes, it is indicated that the temperature real-time detection value T is worse in accuracy and needs to be compensated, t3=t4 is used to calculate a compensation temperature, if the temperature real-time detection value is 120 ℃, the temperature real-time detection value is 126 ℃, t3=120-126= -6;T =t3 is used to obtain a temperature real-time detection value after the temperature real-time detection value is changed, if 120- (-6) =126 ℃, that is 126 ℃, then after stopping heating, the temperature real-time detection value of the heating element 122 is changed to be equal to the temperature compensation value, that is the amplitude is reduced to the temperature real-time detection value is equal to the temperature compensation value, if the temperature real-time detection value T is 120 ℃ is larger than the temperature real-time detection value T4, further judging whether the difference value obtained by subtracting the temperature actual value T4 from the temperature real-time detection value T is larger than a standard difference value T5, if not, indicating that the temperature real-time detection value T is good in accuracy and does not need to be compensated, if so, indicating that the temperature real-time detection value T is poor in accuracy and needs to be compensated, wherein T3=T-T4 is used for calculating a compensation temperature, such as the temperature real-time detection value is 130 ℃, the temperature actual value is 125 ℃, T3=130-125= 5;T =T-T3 is used for obtaining a temperature real-time detection value after the change, such as 130-5=125, namely the temperature real-time detection value after the change is 125 ℃, and then stopping heating, and enabling the change amplitude of the temperature real-time detection value of the heating element 122 to be equal to the temperature compensation value, namely, enabling the temperature real-time detection value of 125 ℃ to be increased to 130 ℃.

In one embodiment, the method of maintaining temperature further comprises:

judging whether the temperature of the heating element 122 is greater than a preset temperature safety value, if so, stopping heating the heating element 122.

It can be understood that when the temperature sensor 18 detects that the temperature of the heating element 122 is greater than the preset temperature safety value, the control module 80 controls the temperature controller 90 to stop heating the heating element 122, or when the temperature sensor 18 fails, the temperature of the heating element 122 continuously rises, and when the temperature of the heating element 122 exceeds the temperature safety value set at the temperature switch 19, the temperature switch 19 is turned off to stop heating the heating element 122, and the control module 80 sends an alarm signal to prompt abnormal temperature sensing function of the temperature sensor 18 and needs manual processing.

The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention. It will be apparent that the described embodiments are merely some, but not all, embodiments of the invention. Based on these embodiments, all other embodiments that may be obtained by one of ordinary skill in the art without inventive effort are within the scope of the invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art may still combine, add or delete features of the embodiments of the present invention or make other adjustments according to circumstances without any conflict, so as to obtain different technical solutions without substantially departing from the spirit of the present invention, which also falls within the scope of the present invention.

Claims

1. The heat preservation method of the heat preservation carrying mechanism is characterized in that the heat preservation carrying mechanism comprises a first carrying platform assembly, the first carrying platform assembly comprises a first carrying platform, a heating piece and a temperature sensor arranged on the heating piece, the heating piece is used for heating the first carrying platform, and the heat preservation method comprises the following steps of:

Heating the heating element in a first heating mode;

judging whether the real-time temperature detection value of the heating piece reaches a preset standard temperature value, if so, adopting a second heating mode to heat the heating piece, wherein the heating voltage of the first heating mode is larger than that of the second heating mode;

2. The method according to claim 1, wherein before the determining whether the real-time temperature detection value of the heating element reaches the standard temperature value, if so, heating the heating element in the second heating mode, further comprises:

3. The method according to claim 1, wherein before the determining whether the real-time temperature detection value of the heating element reaches the standard temperature value, if so, heating the heating element in the second heating mode, further comprises:

and updating the added second heating mode to obtain a second heating mode.

4. A method of preserving heat according to claim 1, the method is characterized in that the heat preservation method also comprises the following steps

5. The method according to claim 4, further comprising, before the compensating the real-time detection value of the temperature of the heating element based on the actual value of the temperature:

6. The method according to claim 5, wherein compensating the real-time detection value of the temperature of the heating element based on the actual value of the temperature comprises:

7. The method according to claim 4, further comprising, after the compensating the real-time detection value of the temperature of the first stage based on the actual value of the temperature:

8. A method of preserving heat according to claim 1, the heat preservation method is characterized by further comprising the following steps:

9. A heat preservation carrying mechanism, which is characterized by adopting a heat preservation method of the heat preservation carrying mechanism according to any one of claims 1-8, wherein the heat preservation carrying mechanism further comprises a transmission assembly, the first carrying platform assembly further comprises a heat dissipation prevention structure, the first carrying platform is connected with the transmission assembly, the heating element is arranged on the first carrying platform, the heat dissipation prevention structure is arranged on the first carrying platform, and the heat dissipation prevention structure is used for reducing or preventing heat dissipation of the first carrying platform.

10. The thermal insulation carrying mechanism as recited in claim 9, wherein the first carrier comprises a table body and a table top body, the table body being formed with a mounting slot, the heating element being disposed in the mounting slot, the table top body being connected to the table body to cover the mounting slot.

11. The heat preservation carrying mechanism according to claim 10, wherein the heating piece is provided with a first positioning hole, the table top body is provided with a second positioning hole, the bottom of the mounting groove is protruded to form a positioning column, and the positioning column sequentially penetrates through the first positioning hole and the second positioning hole.

12. The insulated carrier of claim 10, wherein the heat rejection structure comprises an insulated panel disposed on a side of the gantry body facing away from the table body, the insulated panel and the gantry body collectively forming an insulated cavity.

13. The insulated carrier of claim 12, wherein the heat shield is formed with a ledge protruding therefrom, the ledge being disposed laterally of the first carrier.

14. The heat preservation carrying mechanism according to claim 12, wherein the rack body is provided with a connecting part, and the connecting part is connected with the transmission assembly;

15. The thermal insulation carrying mechanism as claimed in claim 12, wherein the heat dissipation preventing structure further comprises a wind shield, and the wind shields are arranged at two ends of the first carrier opposite to each other along the transmission direction of the transmission assembly.

16. The insulated carrier of claim 9, further comprising a guide assembly including a rail, a slider, and a connecting beam, the rail and the slider being slidably connected, the connecting beam being disposed on the slider, the connecting beam being connected to the transmission assembly, and the connecting beam forming a wiring channel;

17. The insulated carrier of claim 16, wherein the drive assembly includes a drive motor, a first drive wheel, a second drive wheel, a drive belt, and a drive link;

18. The insulated carrier of claim 16, further comprising a second carrier assembly disposed on the connection beam, the second carrier assembly spaced apart from the first carrier assembly, and a cover sandwiched between the first carrier assembly and the second carrier assembly, the cover and the second carrier assembly collectively covering the raceway.

19. A detection apparatus, characterized in that it comprises an insulated carrier according to any one of claims 9-18.