CN115079524A - Preparation method of driving substrate - Google Patents

Abstract

The embodiment of the present application discloses a method for preparing a driving substrate. In the method for preparing a driving substrate according to the embodiment of the present application, during the splicing exposure process, a first exposure layer and a second exposure layer disposed on the same layer overlap to form a first splicing area, The first reference scale, the second reference scale and the third reference scale are all arranged outside the first splicing area, and the first reference scale, the second reference scale and the third reference scale are all formed by a single exposure, In order to effectively avoid the influence of errors in the reference scale itself caused by multiple exposures. The third exposure layer and the fourth exposure layer set in the same layer will use the second reference scale for alignment during exposure alignment, so by using the same set of reference scales when exposing the same layer, this effectively avoids the use of The influence of positional deviation caused by different datum scales. Furthermore, in the exposure process, the alignment performance of the overlapping exposure areas of the second layer is improved, and the splicing accuracy of the overlapping exposure areas is improved.

Description

Preparation method of driving substrate

technical field

The present application relates to the field of splicing exposure alignment methods, in particular to a method for preparing a driving substrate.

Background technique

With the continuous development of semiconductor display manufacturing technology, people have higher and higher requirements for display size, and larger-sized TVs have gradually entered ordinary households. In order to enhance their competitiveness, panel makers must develop technologies to produce large-size panels in low-generation production lines. Limited by the size of the reticle resolution guarantee area of the low-generation production line exposure machine, to make large-size panels without replacing the exposure equipment, only the method of splicing exposure can be used, that is, a panel needs to be exposed multiple times.

During the research and practice of the prior art, the inventors of the present application found that, in the prior exposure process, the first layer of circuit patterns are exposed on a blank substrate, and the positional accuracy of the circuit patterns is determined by the exposure equipment itself accuracy is determined. At the same time, the exposure of the first layer will also form an alignment scale pattern, which is used as the benchmark for the alignment of subsequent layers of exposure. The absolute position accuracy of the alignment scale is the primary factor affecting the position accuracy of the circuit pattern of the subsequent layers. For the stitching exposure process, the positional accuracy of the stitching exposure is required to be higher, so the alignment of the stitching area is more important. At present, the alignment schemes of the splicing exposure process are mainly divided into two types. The first is to use the ruler of the non-splicing area AA for the alignment of the subsequent layers, as shown in FIG. 1 . The second is to use the ruler of the first layer splicing area for alignment of the subsequent layer splicing area, as shown in Figure 2. Among them, the technical defect of the first alignment scheme is that for the exposure area aa of the second layer of circuit splicing, since the alignment scales are made by two exposures respectively, the position and size of the alignment scales themselves are deviated. This kind of deviation cannot be eliminated, which directly affects the splicing exposure accuracy of the second-layer circuit. The second alignment scheme has technical defects because the shared reference scale A1 is formed by overlapping exposure of the first circuit layer, and its position and size accuracy will be affected by the overlapping exposure. The splicing accuracy has a certain impact. Therefore, in the existing preparation methods, the splicing accuracy of the second layer and subsequent overlapping exposure areas of the spliced product is affected due to the difference in the position and size of the reference scale.

SUMMARY OF THE INVENTION

The embodiment of the present application provides a method for preparing a driving substrate, which can improve the alignment performance of the overlapping exposure area of the second layer and improve the splicing accuracy of the overlapping exposure area during the exposure process of the splicing exposure product.

An embodiment of the present application provides a method for preparing a driving substrate, including:

S1: Provide a glass substrate, which is aligned with the glass substrate through a first mask, so as to define a first exposure area on the glass substrate, and form a first exposure layer in the first exposure area of the glass substrate. the first exposure layer includes a first reference scale;

S2: Aligning the glass substrate with a second mask to define a second exposure area on the glass substrate, and the second exposure area and the first exposure area are partially overlapped to form a first splicing In the second exposure area of the glass substrate, a second exposure layer disposed in the same layer as the first exposure layer is formed, the second exposure layer includes a second reference scale and a third reference scale, the The first reference scale, the second reference scale and the third reference scale are located outside the first splicing area at the same time, and the second reference scale is located between the first reference scale and the third reference scale. between;

S3: define a third exposure area on the glass substrate after the third mask plate is aligned with the first reference scale and the second reference scale at the same time;

S4: After aligning with the second reference scale and the third reference scale at the same time through a fourth mask, a fourth exposure area is defined on the glass substrate, and the fourth exposure area is aligned with the first reference scale. The three exposure areas are partially overlapped to form a second splicing area;

S5: Expose the third exposure region of the glass substrate through the third mask to form a third exposure layer, the third exposure layer is located above the first exposure layer, and the fourth exposure layer is passed through the fourth mask. The template exposes the fourth exposure area of the glass substrate to form a fourth exposure layer disposed in the same layer as the third exposure layer.

Optionally, in some embodiments of the present application, the second reference scale is located in the second splicing area.

Optionally, in some embodiments of the present application, the second reference scale is located in the middle of the glass substrate.

Optionally, in some embodiments of the present application, a plurality of the second reference scales are provided, and the plurality of the second reference scales are arranged at intervals along the extending direction of the length of the second splicing region.

Optionally, in some embodiments of the present application, both ends of the second splicing region in the length extension direction are provided with the second reference scale.

Optionally, in some embodiments of the present application, a plurality of the first reference scale and the third reference scale are provided, and the plurality of the first reference scales extend along the length of the second splicing area. The directions are arranged at intervals, and a plurality of the third reference scales are arranged at intervals along the length extension direction of the second splicing area.

Optionally, in some embodiments of the present application, the first reference scale is respectively flush with the second reference scale and the third reference scale along the width extension direction of the second splicing area. set up.

Optionally, in some embodiments of the present application, the first reference scale is located on a side of the third exposure area away from the fourth exposure area.

Optionally, in some embodiments of the present application, the third reference scale is located on a side of the fourth exposure area away from the third exposure area.

Optionally, in some embodiments of the present application, after the step S5, the method for preparing the driving substrate further includes:

S6: define a fifth exposure area on the glass substrate after aligning with the first reference scale and the second reference scale at the same time through a fifth mask;

S7: After aligning with the second reference scale and the third reference scale at the same time through the sixth mask, a sixth exposure area is defined on the glass substrate, and the sixth exposure area is aligned with the first reference scale. The five exposure areas are partially overlapped to form a third splicing area, and the third splicing area and the second splicing area are overlapped and arranged;

S8: Expose the fifth exposure area of the glass substrate through the fifth mask to form a fifth exposure layer, the fifth exposure layer is located above the third exposure layer, and the sixth exposure layer is passed through the sixth mask. The template exposes the sixth exposure area of the glass substrate to form a sixth exposure layer disposed in the same layer as the fifth exposure layer.

During the splicing exposure process in the embodiment of the present application, the first exposure layer and the second exposure layer provided on the same layer overlap to form a first splicing area, and the first reference scale, the second reference scale and the third reference scale are all set on the Outside the first splicing area, the first reference scale, the second reference scale, and the third reference scale are all formed by a single exposure, so as to effectively avoid the influence of errors in the reference scale itself caused by multiple exposures. The third exposure layer and the fourth exposure layer set in the same layer will use the second reference scale for alignment during exposure alignment. In this way, by using the same set of reference scales when exposing the same layer, this effectively avoids the use of The influence of positional deviation caused by different datum scales. The preparation method of the driving substrate of the present application can effectively solve the influence caused by the difference in the position and size of the reference scale, and further in the exposure process, the alignment performance of the overlapping exposure area of the second layer is improved, and the splicing accuracy of the overlapping exposure area is improved.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic diagram of an existing exposure alignment mode of a glass substrate;

FIG. 2 is a schematic diagram of an exposure alignment method of another existing glass substrate;

3 is a schematic flowchart of a method for preparing a driving substrate provided by an embodiment of the present application;

FIG. 4 is a schematic structural diagram of step S1 of the method for preparing a driving substrate provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of step S2 of the method for preparing a driving substrate provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of the third exposure layer after exposure of the method for preparing a driving substrate provided in an embodiment of the present application;

FIG. 7 is a schematic structural diagram of the fourth exposure layer after exposure of the method for preparing a driving substrate provided by an embodiment of the present application;

FIG. 8 is a schematic flowchart of steps S6 , S7 and S8 of the manufacturing method of the driving substrate provided by the embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, but not to limit the present application. In this application, unless otherwise stated, the directional words used such as "upper" and "lower" generally refer to the upper and lower sides of the device in actual use or working state, specifically the drawing direction in the accompanying drawings ; while "inside" and "outside" refer to the outline of the device.

At present, the alignment schemes of the splicing exposure process are mainly divided into two types. The first one is to use the ruler of the non-splicing area AA for the subsequent layer alignment. Referring to Figure 1, the specific process is as follows: the exposure of the first layer of circuit patterns is divided into two left and right , the narrow strip area filled with the middle twill is the splicing exposure area aa. The reference scale required for the exposure alignment of the subsequent circuit layers is at the non-splicing area AA, which is formed by two exposures respectively. The exposure of the circuit pattern of the second layer is also divided into two left and right, and the splicing area of the two exposures is consistent with the splicing area of the first layer of circuit exposure. The datum scale A1 used for exposure alignment on the left side of the second layer circuit is made by the left side exposure of the first layer circuit, and the datum scale A2 used for the exposure alignment on the right side of the second layer circuit is made by the right side exposure of the first layer circuit. The technical defect of this solution is that for the second-layer circuit splicing exposure area, since the alignment scales are made by two exposures respectively, there is a deviation between the position and size of the scale itself. This deviation cannot be eliminated and directly affects the second layer. The stitching exposure accuracy of the layer circuit.

Referring to FIG. 2 , the second existing alignment scheme is: the exposure of the circuit pattern of the first layer is divided into left and right two times, and the narrow strip area filled with twill in the middle is the splicing exposure area aa. The datum scale required in the subsequent circuit layer exposure alignment, the datum scale for left and right measurement is formed by left and right single exposures, and the middle position datum scale A1 is located in the splicing exposure area, which is formed by two overlapping exposures on the left and right. The exposure of the circuit pattern of the second layer is also divided into two left and right, and the overlapping area of the two exposures is consistent with the overlapping area of the first layer circuit exposure; when the second layer circuit is exposed twice, the overlapping area shares the reference scale A1. The technical defects of this scheme: Although this scheme can avoid the problem of the position difference of different reference scales, since the common reference scale position is formed by the overlapping exposure of the first layer circuit, its own position and size accuracy will be affected by the overlapping exposure. The splicing accuracy of the overlapping exposure area of the second layer circuit has a certain influence.

Therefore, a preparation method needs to be designed to effectively improve the splicing accuracy of overlapping exposure areas.

Embodiments of the present application provide a method for manufacturing a driving substrate. Each of them will be described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

Referring to FIG. 3, the present application provides a method for preparing a driving substrate, including:

S1: Provide a glass substrate, align with the glass substrate through a first mask, so as to define a first exposure area on the glass substrate, and form a first exposure layer on the first exposure area of the glass substrate, and the first exposure layer includes a first exposure layer. datum ruler;

S2: Aligning the glass substrate with the second mask plate to define a second exposure area on the glass substrate, the second exposure area and the first exposure area are partially overlapped to form a first splicing area, and a second exposure area on the glass substrate The exposure area forms a second exposure layer disposed in the same layer as the first exposure layer, the second exposure layer includes a second reference scale and a third reference scale, and the first reference scale, the second reference scale, and the third reference scale are simultaneously located on the first reference scale. An outer side of the splicing area, and the second reference scale is located between the first reference scale and the third reference scale;

S3: After the third mask plate is aligned with the first reference scale and the second reference scale at the same time, the third exposure area is defined on the glass substrate;

S4: After the fourth mask is aligned with the second reference scale and the third reference scale at the same time, a fourth exposure area is defined on the glass substrate, and the fourth exposure area and the third exposure area are partially overlapped to form a second splicing area;

S5: exposing the third exposure area of the glass substrate through a third mask to form a third exposure layer, the third exposure layer is located above the first exposure layer, and exposing the fourth exposure area of the glass substrate through a fourth mask Exposure to form a fourth exposure layer disposed in the same layer as the third exposure layer.

It can be understood that, during the splicing exposure process in the embodiment of the present application, the overlapping of the first exposure layer and the second exposure layer provided in the same layer forms the first splicing area, and the first reference scale, the second reference scale and the The third datum scale is set outside the first splicing area, and the first datum scale, the second datum scale and the third datum scale are all formed by a single exposure, so as to effectively avoid the existence of the datum scale itself due to multiple exposures effect of errors. The third exposure layer and the fourth exposure layer set in the same layer will use the second reference scale for alignment during exposure alignment. In this way, by using the same set of reference scales when exposing the same layer, this effectively avoids the use of The influence of positional deviation caused by different datum scales. Furthermore, the preparation method of the driving substrate of the present application can effectively solve the influence caused by the difference in the position and size of the reference scale, and further in the exposure process of the splicing exposure product, the alignment performance of the second layer and subsequent overlapping exposure areas can be improved, and the overlapping can be improved. The stitching accuracy of the exposure area.

The preparation method of the driving substrate 100 will be described in detail below:

Please refer to FIG. 4 and FIG. 5 , in step S1 , a glass substrate 10 is provided and aligned with the glass substrate 10 through a first mask to define a first exposure area 11 on the glass substrate 10 . An exposure area 11 forms a first exposure layer 20 , and the first exposure layer 20 includes a first reference scale 21 .

It can be understood that the first exposure layer 20 and the subsequent second exposure layer 30 , the third exposure layer 40 and the fourth exposure layer 50 can be either the metal layer of the driving substrate 100 or the pixels of the driving substrate 100 . layer etc. The first reference scale 21 , the second reference scale 31 , and the third reference scale 32 are all made of metal, so as to facilitate subsequent identification and alignment with each mask. The first reference scale 21 , the second reference scale 31 and the third reference scale 32 are of the same pattern, so as to facilitate the preparation of patterns on the first mask plate and the second mask plate.

In step S2, the second mask plate is aligned with the glass substrate 10 to define a second exposure area 12 on the glass substrate 10, and the second exposure area 12 and the first exposure area 11 are partially overlapped to form a first splicing area 15. In the second exposure region 12 of the glass substrate 10 , a second exposure layer 30 is formed on the same layer as the first exposure layer 20 , and the second exposure layer 30 includes a second reference scale 31 and a third reference scale 32 . The first reference scale 21 , the second reference scale 31 and the third reference scale 32 are simultaneously located outside the first splicing area 15 , and the second reference scale 31 is located between the first reference scale 21 and the third reference scale 32 .

It can be understood that, the first mask plate and the second mask plate can be provided as two independent plates so as to be used independently. Of course, the first mask plate and the second mask plate can also be set as a whole plate body. During the exposure process, the positions of the first mask plate are adjusted so that when the first exposure layer 20 and the second exposure layer 30 are prepared, the first mask plate is made respectively. And the second mask plate may correspond to the exposure machine respectively. The area of the second exposure area 12 is larger than the area of the first exposure area 11, so in the preparation process, so that the entire first splicing area 15 in the first exposure layer 20 and the second exposure layer 30 disposed on the same layer The positions are offset from the center of the two, closer to the edge, so as to be staggered from the second reference scale 31 located in the middle.

Referring to FIG. 6 , in step S3 , the third mask plate is used to define the third exposure area 13 on the glass substrate 10 after aligning with the first reference scale 21 and the second reference scale 31 at the same time.

It can be understood that, the third mask plate is provided with marks corresponding to the first reference scale 21 and the second reference scale 31 , so that the position of the third mask plate is defined by the corresponding marks to define on the glass substrate 10 The third exposure area 13 is obtained.

Please refer to FIG. 7 , in step S4 , after the fourth mask plate is used to align the second reference scale 31 and the third reference scale 32 at the same time, the fourth exposure area 14 is defined on the glass substrate 10 , and the fourth exposure area is 14 is partially overlapped with the third exposure area 13 to form a second splicing area 16 .

It can be understood that, the fourth mask plate is provided with marks corresponding to the second reference scale 31 and the third reference scale 32 , so that the position of the fourth mask plate is defined by the corresponding marks to define on the glass substrate 10 . Fourth exposure area 14 . The third mask plate and the fourth mask plate can be set as two independent plates, so as to be used independently. Of course, the third mask plate and the fourth mask plate can also be provided as a whole plate body. During the exposure process, the positions of the third mask plate are adjusted so that when the third exposure layer 40 and the fourth exposure layer 50 are prepared, the third mask plate is respectively And the fourth mask plate may correspond to the exposure machine respectively.

Referring to FIGS. 6 and 7 , in some embodiments, the second reference scale 31 is located within the second stitching area 16 . Among them, it should be noted that exposure is a process of spot scanning. The horizontal spot is scanned vertically. The essence of alignment is to identify the position of the reference layer. One of the data obtained by alignment is to reflect the horizontal spot. The ratio of enlargement or reduction (absolute value of horizontal enlargement or reduction/horizontal span), the larger the horizontal span of the alignment scale, the smaller the error of alignment data (alignment accuracy or random error, etc.). Since the second splicing area 16 is located at the laterally outermost side of the third exposure area 13 and the fourth exposure area 14 , the second reference scale 31 is located in the second splicing area 16 , so that the alignment accuracy is higher.

In some embodiments, the second reference scale 31 is located in the middle of the glass substrate 10 . This facilitates the alignment and placement of the third mask plate and the fourth mask plate.

6 and 7 , in some embodiments, a plurality of second reference scales 31 are provided, and the plurality of second reference scales 31 are arranged at intervals along the lengthwise extending direction of the second splicing area 16 . Wherein, by setting a plurality of second reference scales 31 to further increase the alignment position, the alignment accuracy of the third mask plate and the fourth mask plate is further improved.

Further, both ends of the lengthwise extending direction of the second splicing area 16 are provided with a second reference scale 31 . In this way, the alignment accuracy of the subsequent mask and mask plate can be better improved by the alignment of the two ends in the vertical direction.

Further, a plurality of first reference scales 21 and a plurality of third reference scales 32 are provided. The lengthwise extending directions of the two splicing regions 16 are arranged at intervals. Wherein, by setting a plurality of first reference scales 21 and a plurality of third reference scales 32 to further increase the alignment position, thereby improving the alignment accuracy of the third mask plate and the fourth mask plate.

Further, a first reference scale 21 is respectively disposed flush with a second reference scale 31 and a third reference scale 32 along the width extension direction of the second splicing area 16 . In this way, the lateral directions of the third exposure area 13 and the fourth exposure area 14 are guaranteed to be flush, so as to further improve the alignment accuracy.

Referring to FIGS. 6 and 7 , in step S5 , the third exposure region 13 of the glass substrate 10 is exposed through a third mask to form a third exposure layer 40 located above the first exposure layer 20 and exposing the fourth exposure region 14 of the glass substrate 10 through a fourth mask to form a fourth exposure layer 50 disposed at the same layer as the third exposure layer 40 .

Among them, when the third exposure layer 40 and the fourth exposure layer 50 are used, the third mask plate and the fourth mask plate are firstly aligned, which can keep the third mask plate and the fourth mask plate still, and then Positioning is performed by moving the glass substrate 10 . Alternatively, the glass substrate 10 may be fixed to perform alignment by placing the third mask plate and the fourth mask plate in sequence. The method of moving the glass substrate 10 is as follows: firstly, align the first reference scale 21 and the second reference scale 31 on the glass substrate 10 through the third mask, record the alignment data, adjust the error, and then move the first reference scale 21 and the second reference scale 31 on the glass substrate 10. The second reference scale 31 and the third reference scale 32 are aligned with the fourth mask, the alignment data is recorded, the error is adjusted, and then the glass substrate 10 is moved back to the recorded position for alignment with the third mask to start exposure. , after exposure to form the third exposure layer 40 , the glass substrate 10 is then moved to align the position recorded with the fourth mask to perform alignment exposure. In this way, in the third exposure layer 40 and the fourth exposure layer 50 arranged in the same layer, the splicing accuracy of the exposure layers formed on the same layer is improved by adjusting the error of position and then performing exposure one by one.

6 and 7 , in some embodiments, the first reference scale 21 is located on a side of the third exposure area 13 away from the fourth exposure area 14 . It should be noted that exposure is a process of spot scanning. The horizontal spot is scanned vertically. The essence of alignment is to identify the position of the reference layer. One of the data obtained by alignment reflects the horizontal spot, which needs to be enlarged or The reduced ratio, the larger the horizontal span of the alignment scale, the smaller the error of alignment data, so that the first reference scale 21 is located on the side of the third exposure area 13 away from the fourth exposure area 14, that is, the A reference scale 21 is located at the outermost lateral side of the exposure area, so that the alignment accuracy is higher.

In some embodiments, the third reference scale 32 is located on a side of the fourth exposure area 14 away from the third exposure area 13 . Similarly, the third reference scale 32 is located on the side of the third exposure area 13 away from the fourth exposure area 14 , that is, the third reference scale 32 is located at the outermost laterally of the exposure area, so that the alignment accuracy is higher.

Referring to FIG. 8 , in some embodiments of the present application, the manufacturing method of the driving substrate 100 further includes the following steps:

S6: After the fifth mask plate is aligned with the first reference scale 21 and the second reference scale 31 at the same time, the fifth exposure area is defined on the glass substrate 10;

S7: After the sixth mask plate is simultaneously aligned with the second reference scale 31 and the third reference scale 32, a sixth exposure area is defined on the glass substrate 10, and the sixth exposure area and the fifth exposure area are partially overlapped and set to A third splicing area is formed, and the third splicing area and the second splicing area 16 are overlapped and arranged;

S8 : exposing the fifth exposure area of the glass substrate 10 through the fifth mask to form a fifth exposure layer, the fifth exposure layer is located above the third exposure layer 40 , and the sixth exposure area of the glass substrate 10 is exposed through the sixth mask The exposure area is exposed to form a sixth exposure layer disposed in the same layer as the fifth exposure layer.

Wherein, when other exposure layers are prepared on the third exposure layer 40 and the fourth exposure layer 50, by making the fifth mask plate and the sixth mask plate continue to communicate with the first reference scale 21, the second reference scale 31 and the third reference The scale 32 is aligned, so as to ensure the alignment performance of the subsequent overlapping exposure areas and improve the splicing accuracy of the overlapping exposure areas.

The method for preparing a driving substrate provided by the embodiments of the present application has been described in detail above, and the principles and implementations of the present application are described with specific examples. The descriptions of the above embodiments are only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of the application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as a Application restrictions.

Claims (10)

1. A preparation method of a driving substrate, characterized in that, comprising: S1: Provide a glass substrate, which is aligned with the glass substrate through a first mask, so as to define a first exposure area on the glass substrate, and form a first exposure layer in the first exposure area of the glass substrate. the first exposure layer includes a first reference scale; S2: Aligning the glass substrate with a second mask to define a second exposure area on the glass substrate, and the second exposure area and the first exposure area are partially overlapped to form a first splicing In the second exposure area of the glass substrate, a second exposure layer disposed in the same layer as the first exposure layer is formed, the second exposure layer includes a second reference scale and a third reference scale, the The first reference scale, the second reference scale and the third reference scale are simultaneously located outside the first splicing area, and the second reference scale is located between the first reference scale and the third reference scale ; S3: define a third exposure area on the glass substrate after the third mask plate is aligned with the first reference scale and the second reference scale at the same time; S4: After aligning with the second reference scale and the third reference scale at the same time through a fourth mask, a fourth exposure area is defined on the glass substrate, and the fourth exposure area is aligned with the first reference scale. The three exposure areas are partially overlapped to form a second splicing area; S5: Expose the third exposure region of the glass substrate through the third mask to form a third exposure layer, the third exposure layer is located above the first exposure layer, and the fourth exposure layer is passed through the fourth mask. The template exposes the fourth exposure area of the glass substrate to form a fourth exposure layer disposed in the same layer as the third exposure layer. 2 . The manufacturing method of a driving substrate according to claim 1 , wherein the second reference scale is located in the second splicing area. 3 . 3 . The manufacturing method of the driving substrate according to claim 1 , wherein the second reference scale is located in the middle of the glass substrate. 4 . 4 . The manufacturing method of the driving substrate according to claim 2 , wherein a plurality of the second reference scales are provided, and the plurality of the second reference scales are spaced along the length extension direction of the second splicing area. 5 . arrangement. 5 . The manufacturing method of the driving substrate according to claim 4 , wherein the second reference scale is provided at both ends of the second splicing region in the lengthwise extending direction. 6 . 6 . The manufacturing method of the driving substrate according to claim 4 , wherein a plurality of the first reference scales and the third reference scales are provided, and a plurality of the first reference scales are arranged along the first reference scales. 7 . The length extension directions of the two splicing regions are arranged at intervals, and a plurality of the third reference scales are arranged at intervals along the length extension directions of the second splicing regions. 7 . The manufacturing method of a driving substrate according to claim 6 , wherein, one of the first reference scales, one of the second reference scales and one of the third reference scales are respectively along the second splicing area. 8 . The width of the extension direction is set flush. 8 . The method for manufacturing a driving substrate according to claim 1 , wherein the first reference scale is located on a side of the third exposure area away from the fourth exposure area. 9 . 9 . The method for manufacturing a driving substrate according to claim 1 , wherein the third reference scale is located on a side of the fourth exposure area away from the third exposure area. 10 . 10 . The method for manufacturing a driving substrate according to claim 1 , wherein after the step S5 , the method for preparing a driving substrate further comprises: 10 . S6: define a fifth exposure area on the glass substrate after aligning with the first reference scale and the second reference scale at the same time through a fifth mask; S7: After aligning with the second reference scale and the third reference scale at the same time through the sixth mask, a sixth exposure area is defined on the glass substrate, and the sixth exposure area is aligned with the first reference scale. The five exposure areas are partially overlapped to form a third splicing area, and the third splicing area and the second splicing area are overlapped and arranged; S8: Expose the fifth exposure area of the glass substrate through the fifth mask to form a fifth exposure layer, the fifth exposure layer is located above the third exposure layer, and the sixth exposure layer is passed through the sixth mask. The template exposes the sixth exposure area of the glass substrate to form a sixth exposure layer disposed in the same layer as the fifth exposure layer.

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